Abstract: A direct-contact liquid-cooled (DL) Rack Information Handling System (RIHS) includes liquid cooled (LC) nodes having a chassis received in a respective chassis-receiving bay of the rack and containing heat-generating functional components. The LC node configured with a system of conduits to receive direct contact of cooling liquid to regulate the ambient temperature of the node and provide cooling to the functional components inside the node by removing heat generated by the heat-generating functional components. The chassis has a leak containment barrier configured with a trough that underlays a portion of the system of conduits of the LC node and that forms a drain path to a drain port of the chassis. In one or more embodiments, the storage drive carrier has vibration absorbing material that mitigates vibrations of a storage drive placed in the storage drive carrier.

Abstract: A system includes a support member and a hard disk drive interface connector, where a first side of the hard disk drive interface connector is disposed on a first side of the support member and a second side of the hard disk drive interface connector disposed on a second side of the support member. A conduit is coupled to the support member and to a fluid inlet disposed on the first side of the support member. A fluid outlet is disposed on the first side of the support member, and a housing is coupled to the first side of the support member and defines a volume with the support member, where an interface between the housing and the first side of the support member is leak-resistant, and where the fluid inlet and fluid outlet are in fluid communication with the volume.

Abstract: In order to prevent the formation of condensation in a cooling device for a current converter module, the cooling device has a cooling liquid channel, which conducts a liquid coolant and which is connected to a cooling circuit, a heat exchanger, which is connected in the cooling circuit and to which a power component is coupled in a thermally conductive manner, and a cooler for cooling the liquid coolant, which cooler is connected in the cooling circuit, wherein there is a heater in the cooling circuit such that the heat exchanger can be heated upon demand by heating the coolant.

Abstract: Embodiments of the invention include package substrates that include microchannels and methods of making such package substrates. In an embodiment, the package substrate may include a first package layer. In some embodiments, a bottom channel wall may be formed over the first package layer. Embodiments may also include a channel sidewall that is formed in contact with the bottom channel wall. An organic dielectric layer may be formed over the first package layer. However, embodiments include a package substrate where the dielectric layer is not present within a perimeter of the channel sidewall. Additionally, a top channel wall may be supported by the channel sidewall. According to an embodiment, the top channel wall, the channel sidewall, and the bottom channel wall define a microchannel.

Abstract: A device-frame for telecommunication devices includes a body-section that includes plug-in unit places for the telecommunication devices. The device-frame further includes an air-guide element movably supported to the body-section so that a flow area of an air-intake of the device-frame is increasable by changing the position of the air-guide element with respect to the body-section so that the height of the device-frame increases and the flow area is decreasable by changing the position of the air-guide element so that the height of the device-frame decreases. The height of the device-frame can be adjusted to be smaller in cases where the circumstances are not the most demanding from the viewpoint of the cooling and therefore, in less demanding circumstances, it is possible to have more device-frames in a rack.

Abstract: The metallic case of a power conversion apparatus includes a casing having a side wall, as well as an upper case and a lower case, a first area being formed between a cooling jacket provided at the inner periphery of the side wall and the lower case, the metal base plate dividing the first area between the cooling jacket and the upper case into a lower side second area and an upper side third area, first and second power modules being fastened to a top surface and a capacitor module being provided in the first area, driving circuits that drive inverter circuits of the power modules respectively being provided in the second area, and a control circuit that controls the driver circuits being provided in the third area.

Abstract: A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink.

Abstract: An apparatus for providing immersion cooling in a compact-format circuit card environment comprises a plurality of circuit cards. A plurality of thermal energy transfer devices is provided, each thermal energy transfer device at least partially inducing a respective one of first and second operating temperatures to a corresponding circuit card subassembly. At least one first temperature cooling manifold is in selective fluid communication with at least one first operating temperature thermal energy transfer device. At least one second temperature cooling manifold is in selective fluid communication with at least one second operating temperature thermal energy transfer device. A plurality of manifold interfaces is provided, each manifold interface being in fluid communication with a corresponding thermal energy transfer device. A housing includes first and second operating fluid inlets in fluid communication with first and second operating fluid outlets, respectively.

Abstract: An apparatus and method of the disclosure provides a cooling mechanism for a handheld electronic device. The cooling mechanism includes a heat sink and an evaporative cooling mechanism. The evaporative cooling mechanism includes liquid retaining structures. The liquid retaining structures are located in proximity to the at least one IC of the handheld electronic device. Each liquid retaining structure is coated with a temperature sensitive polymer that act as hydrophilic when the temperature of the surface of the handheld electronic device is below a threshold temperature. To maintain the temperature of the surface of the handheld electronic device below the threshold temperature, the temperature sensitive polymer act as hydrophobic and evaporates the liquid stored in the liquid retaining structures to the atmosphere surrounding the handheld electronic device when the temperature of the surface of the electronic device is above the threshold temperature.

Abstract: A flow sensor package comprises a chip comprising a sensitive structure for sensing the flow of a fluid and an encapsulation at least partly encapsulating the chip. A recess in the encapsulation contributes to a flow channel for guiding the fluid, which recess exposes at least the sensitive structure of the chip from the encapsulation, and which recess extends beyond an edge of the chip.

Abstract: This disclosure relates to techniques for implementing a cooling system for a vehicle heat-generating component wherein a two-phase coolant flows between a heat sink module and a heat radiator module. The heat radiator module can be mounted at a higher elevation within the vehicle than the heat sink module. High and low temperature fluid paths can fluidly couple the heat sink module and the heat radiator module. The heat sink module can be coupled to a heat-generating component. As the coolant is heated at the heat sink module by heat from the heat-generating component, it can change to a substantially gaseous phase and move, primarily by force of buoyancy, to the heat radiator module via the high temperature fluid path. As the coolant is cooled by the heat radiator module, it can change to a substantially liquid phase and move, primarily by force of gravity, to the heat sink module.

Abstract: An integrated thermal management assembly, device or system for a power conversion device having a driver board and a power board. The integrated thermal management assembly includes a double-sided cooler. The double-sided cooler has a first layer that includes a first surface that is positioned below an inner surface of the power board. The double-sided cooler has a second surface positioned above an inner surface of the driver board. The double-sided cooler includes a first coolant channel in between the first surface and the second surface. The thermal integrated assembly includes a coolant that flows within the first coolant channel and that is configured to dissipate heat projected through the double-sided cooler.

Abstract: A vehicle power module assembly is provided. The assembly many include an array of stacked frames, a power stage housed within each of the frames, and busbars. Each of the power stages may include a pair of opposite polarity terminals extending therefrom. The busbars may be dispersed along the array to electrically connect like polarity terminals. The power stages may be arranged with one another such that like polarity terminals are adjacent one another and the busbars define an alternating sequence corresponding to the polarity of the terminals. The terminals may be located on the respective power stages such that the busbars are alternately dispersed in a linear sequence along a side face defined by portions of the frames.

Abstract: Embodiments of the present disclosure generally relate to the thermal management and regulation of electronic equipment. Microfluidic channels are utilized to actively change the aerodynamics of a surface, which may allow for the ability to change a surface texture from flat to raised, or dimpled, or from open to closed. The changing of the surface texture influences the fluid flow over or through the surface, thus allowing for thermal regulation of the surface. The thermal regulation system further controls fluid flow through an electronic device via a coating, or layer, having a plurality of active perforations thereon. The active perforations may open and close to increase and decrease the inlet of air to the system in order to help balance the back pressure in the system and redirect airflow to more sensitive system components. Active perforations may be individually opened and/or closed depending on location and system component utilization.

Abstract: The present invention is provided with a suspended external tube (101) and an inner tube (103) installed therein, wherein the diameter differentiation between the inner diameter of the external tube and the outer diameter of the inner tube is served to constitute a partitioned space as the fluid path, the front tube of the external tube is served to be installed with an electric energy application device assembly (108), and through the fluid pump (105) serially installed to the heat transfer fluid path pumping the heat transfer fluid to form a closed recycling fluid path, and through the exposed portion of the outer surface of the suspended external tube (101), temperature equalizing operation is enabled to perform with the external gaseous environment or the liquid or solid environment manually installed but not disposed in the stratum or liquid of the shallow ground natural thermal energy body.

Abstract: A thermal insulation system can include a body of heated material at an elevated temperature. A layer of porous insulating material can be placed adjacent to and in fluid communication with the body of heated material. The insulating layer can contain distributed liquid water in an amount sufficient to cool the insulating layer through evaporative vapor flow toward the body of heated material. The amount of water can be sufficient to provide water vapor for inhibiting the diffusion and adsorption of hydrocarbons from the heated material. The insulating layer can include a continuous vapor phase. A heat sink material at a lower temperature can be placed adjacent to the insulating layer and opposite from the body of heated material.

Abstract: A flow path member includes a flow path which has an inlet and an outlet in a base made of ceramics, and a low resistance portion whose surface resistance is less than 1×107 ?/sq in at least a part of the flow path.

Abstract: An assembly includes a drive housing and a first printed circuit board (PCB) with at least one solid-state memory component, the first PCB having a first surface, where the first PCB is located within the drive housing. The assembly also includes a second PCB with at least one solid-state memory component, where the second PCB is operatively electronically coupled to the first PCB, the second PCB having a second surface, and where the second PCB is located within the drive housing. The assembly also includes a first thermal transfer element configured for partial thermal communication between the first PCB and the second PCB through the first and second surfaces, where the first thermal transfer element is shaped to include a partially thermally insulating air gap located between the first and the second PCB, and where the first thermal transfer element is in thermal communication with the drive housing.

Abstract: An electrostatic chuck is described with independent zone cooling that leads to reduced crosstalk. In one example, the chuck includes a puck to carry a substrate for fabrication processes, and a cooling plate fastened to and thermally coupled to the ceramic puck, the cooling plate having a plurality of different independent cooling channels to carry a heat transfer fluid to transfer heat from the cooling plate.

Abstract: A cooling system for a computer system comprises at least one unit such as a central processing unit (CPU) generating thermal energy and a reservoir having an amount of cooling liquid, said cooling liquid intended for accumulating and transferring of thermal energy dissipated from the processing unit to the cooling liquid. The cooling system has a heat exchanging interface for providing thermal contact between the processing unit and the cooling liquid for dissipating heat from the processing unit to the cooling liquid. Different embodiments of the heat exchanging system as well as means for establishing and controlling a flow of cooling liquid and a cooling strategy constitutes the invention of the cooling system.

Abstract: The invention relates to a cooling system for a computer system, said computer system comprising at least one unit such as a central processing unit (CPU) generating thermal energy and said cooling system intended for cooling the at least one processing unit and comprising a reservoir having an amount of cooling liquid, said cooling liquid intended for accumulating and transferring of thermal energy dissipated from the processing unit to the cooling liquid. The cooling system has a heat exchanging interface for providing thermal contact between the processing unit and the cooling liquid for dissipating heat from the processing unit to the cooling liquid. Different embodiments of the heat exchanging system as well as means for establishing and controlling a flow of cooling liquid and a cooling strategy constitutes the invention of the cooling system.

Abstract: Cooling apparatuses and methods of fabrication are provided which facilitate immersion-cooling of an electronic component(s). The cooling apparatus includes a drawer-level enclosure sized to reside within an electronics rack. The drawer-level enclosure includes a compartment which accommodates one or more electronic components to be cooled. A dielectric fluid is disposed within the compartment. The dielectric fluid includes a liquid dielectric which at least partially immerses the electronic component(s) within the compartment(s). A hinged, liquid-cooled heat sink is also disposed within the compartment of the enclosure. The heat sink operatively facilitates cooling the one or more electronic components via the dielectric fluid within the compartment, and is rotatable between an operational position overlying the electronic component(s), and a service position which allows access to the electronic component(s).

Abstract: An immersion cooled electronics arrangement includes a sealed housing, a coolant contained within the sealed housing, and an electronic device disposed within the sealed housing. The sealed housing has a variable-volume alterable between at least a first volume and a second volume in response to changes in pressure within the sealed housing to reduce the rate of pressure change in the sealed housing over time from heating of the coolant.

Abstract: A thermosiphon device includes an evaporator section that is formed as a single integrated part including one or more evaporation channels and a liquid return path, and/or includes a condenser section that is formed as a single integrated part including one or more condensing channels and a vapor supply path. A single manifold may include vapor and liquid chambers that are separate from each other and that fluidly connect evaporation channels with the vapor supply path and fluidly connect condensing channels with the liquid return path, respectively. Portions of the evaporator or condenser section that define the liquid return path or vapor supply path, respectively, may be free of any fins or other thermal transfer structure.

Abstract: A system includes a front plate, a manifold cover, and bridge heat sinks. The manifold cover is secured to the front plate to define a fluid distribution chamber along a front side of the front plate. The manifold cover defines a port opening through which a cooling fluid is received from outside of the manifold cover. The bridge heat sinks extend rearward from a back side of the front plate. The bridge heat sinks define fluid channels that are fluidly connected with the fluid distribution chamber through corresponding slots in the front plate. The fluid distribution chamber is configured to distribute the cooling fluid received from outside of the manifold cover through the fluid channels of the bridge heat sinks in order to cool one or more electronics packages disposed along the bridge heat sinks without the cooling fluid engaging the one or more electronics packages.

Abstract: A cooling system for the electronic components of a computer rack, including a primary circuit of primary liquid; a primary exchanger intended to transfer heat from first electronic components to the primary liquid; a secondary circuit of refrigerant fluid; a primary-secondary exchanger; a tertiary circuit of tertiary liquid; a secondary-tertiary exchanger; and a tertiary-thermal source exchanger. The cooling system also includes a tertiary-secondary exchanger; and an air-tertiary exchanger intended to transfer, to the tertiary liquid, heat from the air of the computer rack heated by second electronic components, the air-tertiary exchanger being arranged, in the tertiary circuit, downstream of the tertiary-secondary exchanger and upstream of the secondary-tertiary exchanger.

Abstract: The present invention relates to a lightweight liquid-cooling-plate assembly having a plastic frame and a heat dissipation system using the same. The liquid-cooling-plate assembly includes a plastic frame and at least one coolant chamber unit. The plastic frame includes a plurality of lateral walls, at least one accommodation opening, and a plurality of fastening elements. The lateral walls are connected with each other to form and define the at least one accommodation opening. The fastening elements are disposed on a part of the lateral walls. The coolant chamber unit is connected with the plastic frame and embedded in the at least one accommodation opening, and includes at least one surface exposed.

Abstract: According to the present specification there is provided a rotatable heat sink device which comprises a heat sink configured to enclose a cooling fluid, and the heat sink is rotatable about a rotational axis. The heat sink, in turn, comprises a first portion configured to receive thermal energy from a source external to the heat sink, and a second portion configured to dissipate at least a portion of the thermal energy to surroundings external to the device. The device further comprises an optical wavelength conversion material disposed on an outside surface of the first portion of the heat sink, and an agitator disposed inside the heat sink. The agitator is rotationally independent of the heat sink and is configured to promote circulation of the cooling fluid between the first portion and the second portion.

Abstract: A motor drive device assembly capable of suppressing differences in temperatures of motor drive devices depending on operational conditions. The motor drive device assembly includes a first motor drive device including a first heatsink, a second motor drive device located adjacent to the first motor drive device and including a second heatsink formed separately from the first heatsink, and a connection part connecting the first heatsink and the second heatsink to each other, to allow thermal conduction between the first heatsink and the second heatsink.

Abstract: A rear-loaded electronics array, comprising a first circuit board assembly comprising a rail and at least one slat assembly. The at least one slat assembly can be operable to be removed from the rail and replaced on the rail from a rearward position. A second circuit board assembly can comprise a rail and at least one slat assembly. The at least one slat assembly can be operable to be removed from the rail and replaced on the rail from a rearward position. The first circuit board assembly can be positioned adjacent the second circuit board assembly, and the first circuit board assembly can be coupled to the second circuit board assembly, thus forming the rear-loaded electronics array. The first and second circuit board assemblies can be installed and removed independent of one another, as well as each of the individual slat assemblies from any circuit board assembly.

Abstract: A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser. The controller is coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices.

Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins.

Abstract: A device comprises a first layer of a die. The first layer comprises a microchannel. The microchannel is partially filled with a liquid and partially filled with air. The die also comprises a second layer. The second layer of the die seals a top of the microchannel of the first layer.

Abstract: An apparatus includes a component bay having an operational height and an expanded height. The component bay is moveable between the operational height and the expanded height. A thermal element divides the component bay into one or more compartments, each compartment configured to receive a system component. The component bay at the operational height provides thermal contact between the received system component and the thermal element.

Abstract: A wickless heat pipe including a first tube and a second tube. The first tube may form a first shape extending longitudinally in a first direction. The second tube may form a second shape extending longitudinally in a second direction different from the first direction. The first tube and the second tube intersect at at least one location. The two tubes may intersect at a right angle or an oblique angle. The first and second tube may intersect at a plurality of locations. The tubes may be formed from a metal plate used as a thermal ground plane.

Abstract: A mounting arrangement for an electrical contactor includes a panel and a post. The post has a first end and a second end protruding from the panel. The first end of the post is arranged to electrically communicate with an electrical contactor. The second end of the post is arranged to connect to an electrical bus bar. A cold plate overlays the panel, extends about the post, and is in thermal communication with the post to transfer heat between the cold plate and post.

Abstract: A cooling assembly is provided which includes: one or more coolant-cooled heat sinks configured to couple to one or more electronic components to be cooled; one or more flexible coolant conduits; and one or more pivotable coolant manifolds. The flexible coolant conduit(s) couples in fluid communication the pivotable coolant manifold(s) and the coolant-cooled heat sink(s), and accommodates pivoting of the pivotable coolant manifold(s), while maintaining the coolant-cooled heat sink(s) in fluid communication with the pivotable coolant manifold(s). In one or more embodiments, the pivotable coolant manifold(s) pivots between a first position laterally offset from one or more of the coolant-cooled heat sink(s), and a second position above the one or more coolant-cooled heat sinks. First and second pivot arms may be provided at opposite ends of the pivotable coolant manifold(s) to facilitate pivotable movement of the manifold(s) between the first position and the second position.

Abstract: Jet impingement cooling apparatuses are disclosed. One cooling apparatus includes at least one fluid inlet channel, at least one fluid outlet channel, a target surface, and a jet orifice surface that is offset from the target surface. The jet orifice surface includes an array of jet orifices fluidly coupled to the at least one fluid inlet channel, wherein each individual jet orifice of the array of jet orifices has an area corresponding to a distance of the individual jet orifice to the at least one fluid outlet channel such that individual jet orifices closer to the at least one fluid outlet have an area that is smaller than individual jet orifices further from the at least one fluid outlet. The area of each individual jet orifice of the array of jet orifices increases radially from a central region of the array of jet orifices.

Abstract: A hydraulic pump is configured to mount within an internal receptacle defined by a housing of a hydraulically-powered component of a work vehicle. The pump has a housing defining one or more pump chambers. Each pump chamber communicates with a suction port and an outlet pressure port. Each pump chamber contains a pump assembly having a drive member at a fluid interface between the suction port and the outlet pressure port. The drive member is arranged for co-rotation with at least one power input component extending into the housing through each pump chamber. Rotation of each drive member displaces and pressurizes hydraulic fluid through the pump housing, and, when the pump is mounted within the internal receptacle, through internally ported passages routed through walls of the hydraulically-powered component housing.

Abstract: A heat dissipation unit manufacturing method is disclosed. The heat dissipation unit includes a heat pipe and a base seat. The base seat has a first side and a second side. The second side is formed with a channel and multiple perforations in communication with the first and second sides. The heat pipe has a heat absorption section and a conduction section. The conduction section extends from the heat absorption section in a direction to at least one end of the heat pipe distal from the heat absorption section. Several parts of the heat pipe corresponding to the perforations are received in the perforations and flush with the first side of the base seat. The heat dissipation unit manufacturing method improves the shortcoming of the conventional heat dissipation component that the coplanar precision between the heat pipe and the protruding platform of the base seat is hard to control.

Abstract: An inverter case is provided on a transaxle of a vehicle so as to be inclined downward toward a vehicle front side, and the inverter case includes: a refrigerant passage connection portion provided on a front side surface of the inverter case in a longitudinal direction of the vehicle, the refrigerant passage connection portion having a shaft seal structure; a refrigerant passage member disposed on the front side surface of the inverter case and connected to the refrigerant passage connection portion by the shaft seal structure; and a projecting portion provided on an upper part of the front side surface of the inverter case, the projecting portion being configured such that a front side end of the projecting portion is placed at the vehicle front side relative to a front side end of the refrigerant passage member in the longitudinal direction of the vehicle.

Abstract: An electric power converter 10 includes a flow passage FP1 formed so that cooling water can pass through while exchanging heat with semiconductor modules 51, another flow passage FP2 formed so that the cooling water can pass through while exchanging heat with a capacitor 52 and a reactor 53, and a plate-like connecting plate 200 attached in a state where a major surface thereof is disposed along a side wall 110 of a case 100. A groove 211 and a groove 221 that communicate between the flow passage FP1 and the flow passage FP2 are formed in the connecting plate 200.

Abstract: An integrated circuit (IC) can be cooled by using a structure that includes two elements, such as integrated circuits (ICs) or electronic packages, in a stacked arrangement, with the elements having surfaces that face each other. The structure also includes a pair of fluidic channel boundaries, between the facing surfaces, where each fluidic channel boundary is formed by an arrangement of adjacent discrete connecting structures. The primary and secondary fluidic channel boundaries and the facing surfaces define a fluidic channel that is useful for promoting boiling of and directing the flow of a refrigerant between the two surfaces.

Abstract: A controller according to an exemplary aspect of the present disclosure includes, among other things, a cold plate and at least one electronic component mounted to the cold plate by an intermediate thermoelectric cooler.

Abstract: A bond head for a thermocompression bonder is provided. The bond head includes a tool configured to hold a workpiece to be bonded, a heater configured to heat the workpiece to be bonded, and a chamber proximate the heater. The chamber is configured to receive a cooling fluid for cooling the heater.

Abstract: A semiconductor die assembly having high efficiency thermal paths. In one embodiment, the semiconductor die assembly comprises a package support substrate, a first semiconductor die having a peripheral region and a stacking region, and a second semiconductor die attached to the stacking region of the first die such that the peripheral region is lateral of the second die. The assembly further includes a thermal transfer unit having a base attached to the peripheral region of the first die, a cover attached to the base by an adhesive, and a cavity defined by at least cover, wherein the second die is within the cavity. The assembly also includes an underfill in the cavity, wherein a fillet portion of the underfill extends a distance up along a portion of the footing and upward along at least a portion of the base.

Abstract: A power converter device includes first through third semiconductor modules provided for phases of a three-phase inverter circuit, and incorporating upper and lower arms series circuit, and a flow path forming cabinet in a rectangular prism shape having an electric equipment containing space and a coolant flow path formed to surround the electric equipment containing space, the coolant flow path includes a first flow path provided along a first side face of the flow path forming cabinet, a second flow path provided along a second side face contiguous to one side of the first side face and connected to one end of the first flow path, and a third flow path provided along a third side face contiguous to other side of the first side face and connected to other end of the first flow path.

Abstract: Provided are a heat exchanger for cooling an electric element and a heat exchanger assembly for cooling an electric element, and more particularly, a heat exchanger for cooling an electric element and a heat exchanger assembly for cooling an electric element capable of facilitating an insertion of the electric element and improving cooling performance by contacting both side surfaces of the electric element and a tube in which cooling water flows to each other.

Abstract: A motor controller, including: a box body, a capacitor module, and an inverse module. The box body includes a chamber, and a radiator is disposed in the chamber. The radiator divides the chamber to yield a first chamber and a second chamber. The inverse module is disposed on an upper surface of the radiator in the first chamber. The capacitor module is disposed on a lower surface of the radiator in the second chamber. The radiator includes a cooling waterway, and a water inlet and a water outlet that communicate with the cooling waterway. The cooling waterway is adapted to cool the capacitor module and the inverse module.

Abstract: The present disclosure relates to a mobile data center unit, which is adapted to house at least one rack being designed to provide storage space for electronic equipment. The mobile data center unit is equipped with passive cooling means in order to provide dissipation of heat being generated by the electronic equipment.