Abstract: An impingement cooling structure is provided. The impingement cooling structure includes a flow channel formed between a first wall and a second wall facing the first wall, a plurality of impingement cooling holes disposed in the first wall such that the plurality of impingement cooling holes are spaced apart from each other along the flow channel, and a flow diverter convexly protruding from a surface of the second wall in each space between injection axes of the plurality of impingement cooling holes.

Abstract: A combustion chamber (15) comprising a wall at least partially defining a combustion zone and having a first surface (41) facing away from the combustion zone and a second surface (43) facing the combustion zone, the wall having at least one effusion cooling aperture (69, 73) extending there-through from the first surface to the second surface, the effusion cooling aperture having an inlet in the first surface and an outlet in the second surface, the first surface having a particle separator (84) at least partially located upstream of the inlet of the effusion cooling aperture, the particle separator projecting away from the first surface and away from the combustion zone.

Abstract: A solid state drive (SSD) apparatus includes a case including an air tunnel disposed between an inner plate and an upper wall and an accommodation space between the inner plate and a lower wall. The air tunnel extends in a first direction, and both end parts of the air tunnel are exposed to the outside. A substrate is disposed in the accommodation space. At least one semiconductor chip is disposed on the substrate.

Abstract: A combustor includes an inner liner forming a combustion chamber; an outer liner surrounding the inner liner to form a cooling passage in which compressed air flows; and a plurality of cooling guides installed around an inner circumferential surface of the outer liner to surround the combustion chamber, each of the cooling guides protruding from the inner circumferential surface to create an impinging jet from the compressed air flowing in the cooling passage. The plurality of cooling guides surrounding the combustion chamber are installed at regular intervals in a flow direction of the compressed air, and are arranged in staggered axial rows. Each cooling guide includes an air guiding surface facing the flow of the compressed air to guide the compressed air toward the inner liner. Accordingly, liner cooling efficiency can be enhanced by more effectively guiding the impinging jet toward the inner liner.

Abstract: A cooling system is provided which includes, for instance, a coolant supply manifold, a multifunction coolant manifold structure, and multiple cooling structures. The multifunction coolant manifold structure includes a coolant-commoning manifold and an auxiliary coolant reservoir above and in fluid communication with the coolant-commoning manifold. The multiple cooling structures are coupled in parallel fluid communication between the coolant supply and coolant-commoning manifolds to receive coolant from the supply, and exhaust coolant to the coolant-commoning manifold. The coolant-commoning manifold is sized to slow therein a flow rate of coolant exhausting from the multiple cooling structures to allow gas within the exhausting coolant to escape the coolant within the coolant-commoning manifold. The escaping gas rises to the auxiliary coolant reservoir and is replaced within the coolant-commoning manifold by coolant from the auxiliary coolant reservoir.

Abstract: An evaporator includes: a first surface which conducts heat; a heat medium in the evaporator, which vaporizes as a result of the heat absorbed; a condenser which liquefies the heat medium in a vaporized state; a vapour pipe which guides the heat medium in the vaporized state from the evaporator to the condenser; and a liquid pipe which guides the heat medium in a liquefied state from the condenser to the evaporator. A first opening of the vapour pipe and a second opening of the liquid pipe are disposed in different positions from each other in a first direction, and are disposed so as to open into a heat medium accommodation space inside the evaporator at different positions from each other in a second direction, and which is different to the first direction, and also at different positions from each other in a third direction which intersects the first surface.

Abstract: A cooling system is provided which includes, for instance, a coolant supply manifold, a multifunction coolant manifold structure, and multiple cooling structures. The multifunction coolant manifold structure includes a coolant-commoning manifold and an auxiliary coolant reservoir above and in fluid communication with the coolant-commoning manifold. The multiple cooling structures are coupled in parallel fluid communication between the coolant supply and coolant-commoning manifolds to receive coolant from the supply, and exhaust coolant to the coolant-commoning manifold. The coolant-commoning manifold is sized to slow therein a flow rate of coolant exhausting from the multiple cooling structures to allow gas within the exhausting coolant to escape the coolant within the coolant-commoning manifold. The escaping gas rises to the auxiliary coolant reservoir and is replaced within the coolant-commoning manifold by coolant from the auxiliary coolant reservoir.

Abstract: An apparatus, known as a refrigeration capacity control device, to continuously modulate the capacity of an air conditioning system, the apparatus comprising a liquid injection valve, a low pressure regulating valve, a pressure sensing line, a mixing chamber that contains thermodynamic catalyst fill material, and a mixing nozzle assembly.

Abstract: Various embodiments include a heat transfer device, while other embodiments include a turbine component. In some cases, the device can include: a body portion having an inner surface and an outer surface, the inner surface defining an inner region; at least one aperture in the body portion, the at least one aperture positioned to direct fluid from the inner region through the body portion; and at least one fluid receiving feature formed in the outer surface of the body portion, the at least one fluid receiving feature positioned to receive post-impingement fluid from the at least one aperture, wherein the at least one aperture does not define any portion of the at least one fluid receiving feature, and the at least one fluid receiving feature segregates relatively higher velocity post-impingement fluid from relatively lower velocity fluid within an impingement cross-flow region.

Abstract: Auxetic structures, low porosity auxetic sheets, systems and devices with auxetic structures, and methods of using and methods of making auxetic structures are disclosed. An auxetic structure is disclosed which includes an elastically rigid body with a plurality of apertures extending through the elastically rigid body and a plurality of protrusions projecting from the elastically rigid body. The apertures and protrusions are arranged in an engineered pattern, such as an array of rows and columns. The apertures are cooperatively configured with the protrusions to provide a predefined porosity while exhibiting stress reduction through negative Poisson's Ratio (NPR) behavior under macroscopic planar loading conditions. In some embodiments, the protrusions, which are elliptical or semispherical dimples, are interposed in square or hexagonal patterns with the apertures, which are S-shaped through slots or circular boreholes.

Abstract: A lean burn combustor includes a first wall and a second wall spaced from the first annular wall. Angularly spaced axially extending coolant collection manifolds collect coolant from the space between the first and second walls. A plurality of rows of axially spaced apertures extend through the first wall to supply coolant into the space between the first and second walls and one row of aperture is positioned between each pair of adjacent manifolds. The second wall extends the full length of the combustor. The second wall has a circumferentially extending wall extending towards and contacting the first wall and the wall is spaced from the downstream end of the second wall. An annular supply manifold supplies coolant to the space between the first and second walls downstream of the circumferentially extending wall and the manifolds supply coolant to the manifold. A film of coolant is discharged from the space.

Abstract: Semiconductor module testing equipment includes a test board, a plurality of pipe structures extending from an upper surface of the test board in a first direction and spaced apart from one another in a second direction that intersects the first direction, wherein the first and second directions are substantially parallel to a plane of the test board, at least one semiconductor module socket disposed between a pair of neighboring pipe structures of the plurality of pipe structures, and a plurality of nozzles disposed on each pipe structure of the plurality of pipe structures, wherein the plurality of nozzles is configured to discharge a fluid laterally.

Abstract: A computing system includes a chassis, one or more backplanes coupled to the chassis. Computing devices are coupled to the one or more backplanes. The one or more backplanes include backplane openings that allow air to pass from one side of the backplane to the other side of the backplane. Air channels are formed by adjacent circuit board assemblies of the computing devices and the one or more backplanes. Channel capping elements at least partially close the air channels.

Abstract: The invention relates to a transition piece assembly for a gas turbine. A transition piece having one end adapted for connection to a gas combustor and an opposite end adapted for connection to a first turbine stage. The transition piece having at least one external liner and at least one internal liner. The internal liner forms the hot gas flow channel. A first section of the transition piece assembly upstream of a first turbine stage has a plurality of cooling apertures. Cooling medium through the cooling apertures enters the plenum, which is created between external and internal liners and a cooling medium flows along at least the first section of the transition piece assembly. At least one second section upstream of the first section with respect to the hot gas flow has at least one additional air inlet system.

Abstract: A liquid cooling apparatus includes a heat exchange module and a cooling module. The heat exchange module includes a liquid outlet and a liquid outlet. The cooling module includes a first body, a second body, a first cooling component and a cooling duct. The first body is connected to the liquid outlet. The second body is connected to the liquid outlet, and the first body is disposed above the second body. The first cooling component is disposed between the first body and the second body. The cooling duct is connected to the first body and the second body, and the cooling duct is in thermal contact with the first cooling component.

Abstract: A data center cooling system includes an outer container that defines a first volume; an inner container that defines a second volume and is positioned within the first volume, the inner container including an air outlet that includes an airflow path between the first and second volumes; a liquid seal to fluidly isolate a liquid phase of a non-conductive coolant that fills at least a portion of the first and second volumes from an ambient environment; and a plurality of electronic heat-generating devices at least partially immersed in the liquid phase of the non-conductive coolant to transfer a heat load to the non-conductive coolant.

Abstract: An embodiment of an electronic system includes a printed circuit board (PCB) including fluid flow channel extending through the PCB. In addition, the electronic system includes an electronic component including a bottom surface and positioned on the PCB over the fluid flow channel to thereby expose the bottom surface of the electronic component to fluid flow through the fluid flow channel.

Abstract: Power electronics modules having modular jet impingement assembly utilized to cool heat generating devices are disclosed. The modular jet impingement assemblies include a modular manifold having a distribution recess, one or more angled inlet connection tubes positioned at an inlet end of the modular manifold that fluidly couple the inlet tube to the distribution recess and one or more outlet connection tubes positioned at an outlet end of the modular manifold that fluidly coupling the outlet tube to the distribution recess. The modular jet impingement assemblies include a manifold insert removably positioned within the distribution recess and include one or more inlet branch channels each including an impinging slot and one or more outlet branch channels each including a collecting slot. Further a heat transfer plate coupled to the modular manifold, the heat transfer plate comprising an impingement surface including an array of fins that extend toward the manifold insert.

Abstract: A turbine vane includes a generally elongated hollow airfoil and a cooling system. The cooling system is positioned within the airfoil and includes a cooling chamber and an impingement insert positioned in the cooling chamber. The impingement insert and an inner surface of an outer wall of the airfoil define a cooling channel therebetween. The impingement insert includes a plurality of impingement nozzles extending toward the inner surface of the outer wall and a plurality of impingement orifices. At least one of the impingement orifices is arranged in a non-aligned pattern with respect to at least one adjacent impingement orifice such that cooling fluid passing out of the at least one impingement orifice does not directly flow into a centerline of a cooling fluid flowpath of cooling fluid passing out of the at least one adjacent impingement orifice.

Abstract: A system for cooling a wall (24) of a component having an outer surface with raised ribs (12) defining a structural pocket (10), including: an inner wall (26) within the structural pocket and separating the wall outer surface within the pocket into a first region (28) outside of the inner wall and a second region (40) enclosed by the inner wall; a plate (14) disposed atop the raised ribs and enclosing the structural pocket, the plate having a plate impingement hole (16) to direct cooling air onto an impingement cooled area (38) of the first region; a cap having a skirt (50) in contact with the inner wall, the cap having a cap impingement hole (20) configured to direct the cooling air onto an impingement cooled area (44) of the second region, and; a film cooling hole (22) formed through the wall in the second region.

Abstract: A thermal management device (401) is provided which comprises a synthetic jet actuator (403) and a heat sink (405) comprising a fin (407). The fin has at least one interior channel (409) defined therein which has first and second openings that are in fluidic communication with each other. The synthetic jet actuator is adapted to direct a synthetic jet into said channel.

Abstract: A cooling apparatus for a power electronics system includes a jet plate, a target plate, a plurality of fluid collection passageways, and a fluid outlet. The jet plate includes an array of impingement jets having a jet body and an impingement jet channel. The target plate includes an array of microchannel cells having a plurality of radially-extending wavy-fin microchannels. The coolant fluid is directed toward an impingement location through the array of impingement jets and travels through the wavy-fin microchannels. The plurality of fluid collection passageways are arranged in a grid pattern such that the coolant fluid exits the wavy-fin microchannels and flows into the plurality of fluid passageways. The coolant fluid exits the cooling apparatus through the fluid outlet. The cooling apparatus may be incorporated into a power electronics module having a power electronics device to cool the power electronics device.

Abstract: A synthetic jet ejector is provided which comprises a first housing portion (131), and a second housing portion (133) which releasably attaches to the first housing portion, wherein the first and second housing portions form first and second portions, respectively, of at least one passageway (159) adapted to emit at least one synthetic jet.

Abstract: This invention relates to an internal jet impingement type shell and tube heat exchanger in which the jet cooling tubes and the heating tubes in shell and tube heat exchanger are formed either as a staggered tube bundle or as a square tube bundle, and the orifices on each jet cooling tube are provided according to the arrangement of tube bundle. Thus, the heat transfer performance of jet impingement type shell and tube heat exchanger is remarkably enhanced.

Abstract: Embodiments of silicon-based thermal energy transfer apparatus for gain medium crystal of a laser system are provided. For a disk-shaped crystal, the apparatus includes a silicon-based manifold and a silicon-based cover element. For a rectangular cuboid-shaped gain medium crystal, the apparatus includes a first silicon-based manifold, a second silicon-based manifold, and first and second conduit elements coupled between the first and second manifolds. For a right circular cylinder-shaped gain medium crystal, the apparatus includes a first silicon-based manifold, a second silicon-based manifold, and first and second conduit elements coupled between the first and second manifolds.

Abstract: A power electronics card assembly includes a printed circuit board assembly including a printed circuit board substrate, a power electronics device opening, a fluid inlet channel extending from a perimeter of the printed circuit board assembly to the power electronics device opening, a fluid outlet channel within the printed circuit board substrate extending from the perimeter of the printed circuit board assembly to the power electronics device opening, and electrically conductive power connections. A power electronics device is positioned within the power electronics device opening and includes a fluid inlet layer fluidly coupled to the fluid inlet channel, a fluid outlet layer fluidly coupled to the fluid outlet channel, a target heat transfer layer fluidly coupled to the fluid inlet layer, a second pass-heat transfer layer and a power device layer. The second-pass heat transfer layer is fluidly coupled to the target heat transfer layer and the fluid outlet layer.

Abstract: A method for constructing a thermal management system is provided herein. In accordance with the method, a fan (405) is provided which is adapted to provide a global flow of fluid through the device. A synthetic jet ejector (409) is also provided which is adapted to augment the global flow of fluid over the surfaces of a heat sink (403). The ratio of the flow per unit time of the synthetic jet ejector to the flow per unit time of the fan is selected so as to achieve a desired level of heat dissipation.

Abstract: A cooling device has a large number of closely spaced impinging jets, adjacent an impingement gap, with parallel return paths for supplying coolant flow for the impinging jets with the least possible pressure drop using an interdigitated, branched hierarchical manifold. Surface enhancement features spanning the impingement gap form U-shaped microchannels between single impinging jets and single outlets.

Abstract: A jet impingement heat exchanger includes an inlet jet, a target layer, a second layer, a transition channel, and a fluid outlet. The target layer includes an impingement region and a plurality of target layer microchannels that radially extend from the impingement region. The jet of coolant fluid impinges the target layer at the impingement region and flows through the radially-extending target layer microchannels toward a perimeter of the target layer. The second layer includes a plurality of radially-extending second layer microchannels. The transition channel is positioned between the target layer and the second layer to fluidly couple the second layer to the target layer. The coolant fluid flows through the transition channel and the plurality of radially-extending second layer microchannels. The fluid outlet fluidly is coupled to the second layer. Jet impingement exchangers may be incorporated into a power electronics module having a power electronics device.

Abstract: The invention relates to a combined thermal protection and surface temperature control apparatus. In one embodiment, a combined thermal protection and surface temperature control apparatus comprises a porous member having an entrance side, a separate exit side, and a plurality of thermally conductive plugs disposed in the porous member. One or more coolant entrance channels extend through the entrance side, extend part-way through the porous member, and end within the porous member before reaching the exit side. Conversely, one or more coolant exit channels begin within the porous member, extend through a portion of the porous member, and extend through the exit side. The coolant entrance and exit channels may be parallel and may alternate. The channels may only extend across a portion of the thickness of the porous member.

Abstract: Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical circuitry disposed thereon, a second surface, and a plurality of physical features on the second surface. The physical features are configured to promote a turbulent boundary layer in a coolant impinged upon the second surface.

Abstract: A jet impingement array design and method are disclosed for efficiently cooling the liner of a gas turbine combustion chamber, while eliminating almost all effects of coolant gas crossflow. The design includes an array of extended jet ports for which the distance between the ends of the jet ports and the surface to be cooled progressively decreases from upstream to downstream. Spent air from upstream jets is directed away from downstream jets, thereby reducing the detrimental effects of crossflow, and optimizing heat transfer.

Abstract: A thermal management system for an embedded environment is described. The thermal management system includes a pleumo-jet that has at least one wall defining a chamber, at least one piezoelectric device on the at least one wall, and a compliant material within the at least one wall and encompassing the chamber. The compliant material has at least one opening providing fluid communication between said chamber and the embedded environment. A cooling system is also described. A method for making a pleumo-jet is also described.

Abstract: A boil cooling method forms, with a surface of an object to be cooled or a surface of a heating member in close contact with the surface of the object to be cooled made to serve as a cooling surface, a main flow channel and a sub-flow channel for a cooling liquid from the side of the cooling surface in the above-described order, arranges a plurality of nozzles penetrating a partition wall separating the sub-flow channel and the main flow channel and protruding into the main flow channel in a flow channel direction of the main flow channel, causes tip end parts of individual nozzles to be in the vicinity of or in contact with the cooling surface, causes a cooling liquid to circulate to the main flow channel and the sub-flow channel, and cools the cooling surface by boiling of the cooling liquid flowing through the main flow channel, and at the same time, supplies the cooling liquid from the side of the sub-flow channel through each of the nozzles to the vicinity of the cooling surface, and cools the cooling li

Abstract: In one embodiment, a cooling system is disclosed. The cooling system comprises: a cooling channel for receiving a cooling media, a substrate disposed near the cooling channel, and a fluidic jet disposed within the substrate and in fluid communication with the cooling channel. The cooling channel is for thermal communication with a component to be cooled. The cooling channel has a height of less than or equal to about 3 mm and a width of less than or equal to 2 mm. The fluidic jet comprises a cavity defined by a well and a membrane. In one embodiment, a method of cooling an electrical component comprises: passing a cooling media through a cooling channel, drawing the cooling media into one or more of the fluidic jets, expelling the cooling media from the one or more fluidic jets into the cooling channel, and removing thermal energy from the electrical component.

Abstract: In one embodiment, the invention is a method and apparatus for chip cooling. One embodiment of a system for cooling a heat-generating device, such as a semiconductor chip, includes a vaporization chamber for at least partially vaporizing a stream of liquid in a stream of a gas to produce a mixture of gas, vapor and liquid and a heat sink coupled to the vaporization chamber for transferring heat from the heat-generating device to the mixture.

Abstract: Vapor condensers and cooling apparatuses are provided which facilitate vapor condensation cooling of a coolant employed in cooling an electronic device. The vapor condenser includes a thermally conductive base structure with a plurality of condenser fins extending from the base structure. The condenser fins have a proximal end coupled to the base structure and a remote end remote from the base structure. At least one exposed cavity is provided within each condenser fin extending from the remote end towards the proximal end. The exposed cavities are sized to provide greater condenser fin surface area for facilitating vapor condensate formation, and thereby facilitate cooling of an electronic device using a two-phase coolant.

Abstract: Cooled electronic modules and methods of fabrication are provided with pump-enhanced, dielectric fluid immersion-cooling of the electronic device. The cooled electronic module includes a substrate supporting an electronic device to be cooled. A cooling apparatus couples to the substrate, and includes a housing configured to at least partially surround and form a sealed compartment about the electronic device. Additionally, the cooling apparatus includes dielectric fluid and one or more pumps disposed within the sealed compartment. The dielectric fluid is in direct contact with the electronic device, and the pump is an impingement-cooling, immersed pump disposed to actively pump dielectric fluid within the sealed compartment towards the electronic device. Multiple condenser fins extend from the housing into the sealed compartment in an upper portion of the sealed compartment, and a liquid-cooled cold plate or an air-cooled heat sink is coupled to the top of the housing for cooling the condenser fins.

Abstract: A portable, self-contained liquid submersion cooling system that is suitable for cooling a number of electronic devices, including cooling heat-generating components in computer systems and other systems that use electronic, heat-generating components. The electronic device includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid, and a pump for pumping the liquid into and out of the space, to and from a heat exchanger that is fixed to the housing outside the interior space. The heat exchanger includes a cooling liquid inlet, a cooling liquid outlet, and a flow path for cooling liquid therethrough from the cooling liquid inlet to the cooling liquid outlet. An air-moving device such as a fan can be used to blow air across the heat exchanger to increase heat transfer.

Abstract: Disclosed herein is a data center having a plurality of liquid cooled computer systems. The computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of the processor. The cold plate is further arranged to provide adapted flow of coolant to different portions of the processor whereby higher temperature regions receive a larger flow rate of coolant. The flow is variably adjusted to reflect different levels of activity. By maximizing the coolant temperature exiting the computer systems, the system may utilize the free cooling temperature of the ambient air and eliminate the need for a chiller. A data center is further provided that is coupled with a district heating system and heat is extracted from the computer systems is used to offset carbon emissions and reduce the total cost of ownership of the data center.

Abstract: Low-pressure drop thermal assemblies, systems and methods of making low-pressure drop thermal assemblies for use in high power flux situations. A manifold body is attached to a distributor to form a subassembly. This subassembly is in communication with a substrate surface, which has a semiconductor device in need of thermal management thereon. An enclosed cavity is formed between the target substrate surface and the subassembly, and a seal of the cavity protects critical components residing on the active surface of the semiconductor device. The distributor includes a distributed liquid impingement microjet inlet array isolated from and parallel with a distributed microjet drain array for impinging cooling fluid and removing spent heated fluid in a direction orthogonal to a target surface for maximizing the heat transfer rate, and thereby providing high cooling flux capabilities while enabling low-pressure drops.

Abstract: Disclosed is a system for cooling an electronics package. The system includes a fluid pump and a microcooler assembly. The system utilizes one or more cooling layers interspersed with layers of electronics in the electronics package. Each cooling layer has an array of cooling channels formed in a substrate, an input manifold through which cooling fluid is provided for distribution through the array of cooling channels, and an output manifold which collects fluid from the array of cooling channels. The elements of the cooling system are integrated by conduits including a package conduit for passage of fluid from the fluid pump to the electronics package, a cooler conduit for passage of fluid from the electronics package to the microcooler assembly, and a pump conduit for passage of fluid from the microcooler assembly to the fluid pump. Also disclosed is a method for cooling the electronics package.

Abstract: A method of fabricating a multi-fluid cooling system is provided for removing heat from one or more electronic devices. The cooling system includes a multi-fluid manifold structure with at least one first fluid inlet orifice and at least one second fluid inlet orifice for concurrently, separately injecting a first fluid and a second fluid onto a surface to be cooled when the cooling system is employed to cool one or more electronic devices, wherein the first fluid and the second fluid are immiscible, and the first fluid has a lower boiling point temperature than the second fluid. When the cooling system is employed to cool one or more electronic devices and the first fluid boils, evolving first fluid vapor condenses in situ by direct contact with the second fluid of higher boiling point temperature.

Abstract: A portable, self-contained liquid submersion cooling system that is suitable for cooling a number of electronic devices, including cooling heat-generating components in computer systems and other systems that use electronic, heat-generating components. The electronic device includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid, and a pump for pumping the liquid into and out of the space, to and from a heat exchanger that is fixed to the housing outside the interior space. The heat exchanger includes a cooling liquid inlet, a cooling liquid outlet, and a flow path for cooling liquid therethrough from the cooling liquid inlet to the cooling liquid outlet. An air-moving device such as a fan can be used to blow air across the heat exchanger to increase heat transfer.

Abstract: A loop type heat dissipating apparatus with a sprayer for transferring heat between a heat source and a heat sink includes an evaporator, a condenser, and a working fluid. The evaporator contacts the heat source and includes a first chamber, a second chamber, and a sprayer disposed between therebetween. The condenser contacts the heat sink and includes a third chamber communicating with the second chamber and a wick structure disposed on one side of the third chamber. The working fluid fills the loop type heat dissipating apparatus and is turned into microdroplets via a sprayer. The sprayer impinges the microdroplets into the second chamber where the microdroplets are then evaporated by the heat source before proceeding to the third chamber for condensation, liquefaction and adhering to the wick structure. Eventually, the working fluid flows back to the first chamber under a pumping force actuated by the sprayer and completes the cycle.

Abstract: Cooling apparatuses and methods are provided for facilitating cooling of an electronic device utilizing a cooling subassembly, a pump and a controller. The cooling subassembly includes a jet impingement structure, and a thermosyphon. The jet impingement structure directs coolant into a chamber of the subassembly onto a surface to be cooled when in a jet impingement mode, and the thermosyphon, which is associated with the chamber, facilitates convective cooling of the surface to be cooled via boiling of coolant within the chamber when in a thermosyphon mode. The controller, which is coupled to the pump to control activation and deactivation of the pump, also controls transitioning between the jet impingement mode and the thermosyphon mode based on a sensed temperature of the electronic device.

Abstract: A heat sink for cooling a component is disclosed. A medium flows around the heat sink by at least sectional guidance of a main flow and a secondary flow of the medium, the main flow being separated from the secondary flow up to a constriction. After the constriction the secondary flow merges with the main flow.

Abstract: A system (50) for cooling a target element (56) includes a structure (52) having an opening (62) extending through the layer (52), a pumping device (32) positioned behind the structure (52), and a target element (56) positioned in front of the structure (52). Transducers (58, 60) are positioned at opposing ends (74, 76) of the opening (62) between the structure (52) and the target element (56). The pumping device (32) drives a jet (70) of coolant through the opening (62) toward the target element (56). The transducers (58, 60) produce output signals (84, 86) that perturb the jet (70) to control oscillation of the jet (70) in order to stabilize the jet (70) for impingement with a predetermined location (96) on the target element (56). The jet (70) uniformly spreads from the location (96) to provide cooling over a surface (100) of the target element (56).

Abstract: Disclosed herein is a data center having a plurality of liquid cooled computer systems. The computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of the processor. The cold plate is further arranged to provide adapted flow of coolant to different portions of the processor whereby higher temperature regions receive a larger flow rate of coolant. The flow is variably adjusted to reflect different levels of activity. By maximizing the coolant temperature exiting the computer systems, the system may utilize the free cooling temperature of the ambient air and eliminate the need for a chiller. A data center is further provided that is coupled with a district heating system and heat is extracted from the computer systems is used to offset carbon emissions and reduce the total cost of ownership of the data center.

Abstract: In one embodiment, a cooling system is disclosed. The cooling system comprises: a cooling channel for receiving a cooling media, a substrate disposed near the cooling channel, and a fluidic jet disposed within the substrate and in fluid communication with the cooling channel. The cooling channel is for thermal communication with a component to be cooled. The cooling channel has a height of less than or equal to about 3 mm and a width of less than or equal to 2 mm. The fluidic jet comprises a cavity defined by a well and a membrane. In one embodiment, a method of cooling an electrical component comprises: passing a cooling media through a cooling channel, drawing the cooling media into one or more of the fluidic jets, expelling the cooling media from the one or more fluidic jets into the cooling channel, and removing thermal energy from the electrical component.