Abstract: An annular turbine shroud separates a hot gas path from a cooling plenum containing a cooling medium. Bumps are cast in the surface on the cooling side of the shroud. A surface coating overlies the cooling side surface of the shroud, including the bumps, and contains cooling enhancement material. The surface area ratio of the cooling side of the shroud with the bumps and coating is in excess of a surface area ratio of the cooling side surface with bumps without the coating to afford increased heat transfer across the element relative to the heat transfer across the element without the coating.

Abstract: An assembly comprising an integrated cooling system/liquid containment system/EMI shield/pump housing/heat sink is built atop a multi-chip module. The attached devices are cooled by a spray of fluid, effecting a phase change from liquid to gas at the point of evaporation. Condensing liquid accumulates at the base of the fins and is collected by a pump for redistribution. The pump is coupled to a fan blade, which in turn is operated by a motor. A seal is formed between the multi-chip module and the integrated housing. The assembly is designed such that this seal need not be broken to service the motor, thus minimizing the amount of vapors from the working fluid lost into the atmosphere. Case fins and fan blades are arranged for improved efficiency.

Abstract: An electronic module is provided having an integrated refrigerant evaporator assembly coupled to a closed-cycle cooling system, as well as a method for controlling the system. The module and integrated assembly includes a plurality of integrated circuit chips arrayed on a substrate. The evaporator assembly is disposed over the chips and substrate such that a chamber is formed between the assembly and the substrate within which the chips reside. A lower plate of the assembly has a plurality of jet orifices which direct coolant onto individual chips of the plurality of chips arrayed on the substrate. In addition, the lower plate includes a plurality of channels formed between at least some of the jet orifices. The plurality of channels remove coolant from the chamber after the coolant has been heated by impinging upon the integrated circuit chips. A control system is provided to prevent excessive pressure from building up within the assembly at startup and shutdown of the closed-cycle cooling system.

Abstract: A system for cooling an electronic device comprising a heat sink including a channel having an inlet and an outlet, with the channel coupled to an airflow generation system that generates airflow between the inlet and outlet. Heat is removed from an electronic device by decreasing the cross-sectional area of the channel to provide a throttle at a location adjacent to where the channel traverses the electronic device. A plurality of throttles may be formed in the channel, each for cooling a separate electronic device. An airflow control valve is operably connected to the heat sink for controlling the amount of airflow through the heat sink. A device controller connected to the airflow control valve and the air generation system adjusts the airflow control valve according to temperature measurements collected from the electronic device and controls the operation of the air generation system.

Abstract: A radar system and method of cooling same. In the illustrative embodiment, the inventive system includes a radar array comprising a circuit board; a plurality of radiating elements printed on the circuit board; and a plurality of transmit and receive modules disposed on the circuit board in communication with the radiating elements. In a specific implementation, the invention further includes means for cooling the T/R modules. In the preferred embodiment, the modules are spray cooled. A particularly novel aspect of the invention is the provision of a mechanism for physically, electrically and hydraulically interconnecting the T/R modules or modules. The physical interconnect is achieved by rails mounted on the top bottom covers and sides of the circuit boards. The rails allow for the modules to be dovetailed together and thereby secured against vertical and lateral stresses.

Abstract: In cooling electrical devices (205) a Laval nozzle, is used for obtaining a cooling effect. The nozzle can be located close to the electrical device (205), which it is intended to cool, whereas the unit (209) supplying the nozzle with air, for example a fan or a compressor, can be located at another location. This is very advantageous when the electrical devices (205) to be cooled are located at locations hard to reach or access, such as in the top of antenna (201). The supplying unit (209) can then be located at the foot of the antenna where repair and service is easy to carry out.

Abstract: An impingement baffle in the form of a plate includes spaced apart impingement holes for directing cooling air in corresponding jets against a hot wall. Dimples are integrally formed in the plate adjacent corresponding ones of the impingement holes for shielding thereof.

Abstract: Structure with elements includes a main body of the element used in gas stream and a plurality of fluid passage. Each outlet of the fluid passage is opened on surface of the main body. Coolant fluid flows from each outlet through the passage to cover the surface as a film-like fluid. The plurality of fluid passages include first fluid passages and second fluid passages. The coolant fluid flows from the outlet of the first fluid passage along the direction of the gas stream on the surface. On the other hand, the coolant fluid also flows from the outlet of the second fluid passage toward the gas stream neighbored on each outlet of the first fluid passage.

Abstract: An improved cooling apparatus and related method are disclosed for air-cooling an array of electronic components mounted on a substrate. The cooling apparatus directs high-speed jets of cooling air directly at special heat sinks bonded to the particular electronic components that generate the most heat (e.g., microprocessors), with the air thereafter being directed to flow tangentially across the remaining components, to air-cool those components, as well. This configuration enables the requisite component cooling to be achieved with substantially reduced air flow rates and with heat sinks of substantially reduced size, as compared to prior cooling apparatus.

Abstract: A heat transfer structure for the efficient cooling of a heated surface such as the combustor wall of a gas turbine has a high heat transfer coefficient and can therefore operate at a relatively low pressure loss. A cooling jacket is formed around the heated surface by means of an apertured wall parallel to and spaced from the heated surface. Cooling fluid such as air flows into the cooling jacket through the apertures and impinges as air jets on the heated surface. The heat transfer coefficient is greatly increased by flow diversion features associated with the apertures which act as Coanda surfaces to divert the air jets so that they impinge obliquely and turbulently on the heated surface and establish subsequent turbulent sinuous cross-flows of the cooling air on the heated surface.

Abstract: A cooling apparatus having a simple structure is provided in which the temperature distribution of an object being cooled can be kept even and no whistle sound is generated at a duct. The apparatus comprises a duct including a nozzle plate through which a nozzle is bored so that a coolant is jetted through the nozzle, colliding as a cooling stream against an object. An inclined opposite plate is disposed opposite the nozzle plate so as to make the current of the coolant tend to the nozzle plate. A resonance-preventing plate is attached to an area of the inside surface of the opposite plate including the point at which a horizontal extension of the nozzle intersects the inside surface of the opposite plate so that the horizontal distance l of the nozzle from the inside surface of the resonance-preventing plate is not equal to a resonance distance l.sub.0. Because the horizontal distance l of any nozzle from the opposite plate or the resonance-preventing plate. does not coincide with the resonance distance l.

Abstract: Structure with elements includes a main body of the element used in gas stream and a plurality of fluid passage. Each outlet of the fluid passage is opened on surface of the main body. Coolant fluid flows from each outlet through the passage to cover the surface as a film-like fluid. The plurality of fluid passages include first fluid passages and second fluid passages. The coolant fluid flows from the outlet of the first fluid passage along the direction of the gas stream on the surface. On the other hand, the coolant fluid also flows from the outlet of the second fluid passage toward the gas stream neighbored on each outlet of the first fluid passage.

Abstract: A heat-shield component with a cooling-fluid return, a hot-gas wall to be cooled, an inlet duct for conducting a cooling fluid and an outlet duct for returning the cooling fluid. The inlet duct is directed towards the hot-gas wall and widens in a direction of the hot-gas wall. Furthermore, the invention relates to a heat-shield configuration which lines a component directing a hot gas, in particular a combustion chamber of a gas-turbine plant. The heat-shield configuration and has a plurality of the heat-shield components.

Abstract: A coolable double walled structure, for use and exposure in a hot gas flow environment, includes a jet issuing wall, a target wall spaced from the jet issuing wall defining at least one cavity therebetween. The jet issuing wall includes at least one impingement rail having a greater thickness than the jet issuing wall such that a bottom portion of the impingement rail extends within the cavity formed between the jet issuing wall and the target wall. A number of impingement ports are disposed within each impingement rail to provide flow communication through the jet issuing wall to the target wall. Due to the relatively thick dimensions of the impingement rail, the impingement ports disposed within respective impingement rails can be directionalized so as to provide for local cooling needs. In one embodiment, the entry areas of the impingement ports are bell shaped so as to lower inlet pressure loss.

Abstract: A multi-mode, two-phase cooling module (10) comprises a first housing portion (20), a second housing portion (30), and a third housing portion (40). Cooling liquid (22) is held in first housing portion (20), and one or more electronic components (24) are mounted onto an external surface of first housing portion (20) for being pool cooled. The second housing portion (30) has one or more spray nozzles (32) secured to one of the internal surfaces, and one or more electronic components (34) mounted onto one of the external surfaces in a position opposite spray nozzles (32). The third housing portion (40) has one or more condensers (42) on the internal surfaces, and one or more heat sinks (44) on the external surfaces. One or more electric fans (46), piezo-electronic fans, or spray nozzles (48) may be provided adjacent to internal surfaces of the condensers (42). The cooling module (10) is made of a thermally conductive material.

Abstract: A supply pipe for supplying air to the peripheral surface of a circuit board container unit is provided in a test head. Nozzles are connected to the supply pipe. Each nozzle has at least one hole opposing a circuit board and corresponding to one IC on the circuit board. The circuit board has a parts mounted portion that generates a small amount of heat. The circuit board is covered with a case. A vent hole is formed on the microscope column side. A discharge pipe is connected to the vent hole and communicates with the outside of the test head. With this arrangement, each circuit board can be uniformly and efficiently cooled.

Abstract: A spray cooled circuit card cage includes opposed card guides separated by opposed card cage side panels. Each card guide carries a top rail and lower manifold. The manifold provides coolant fluid to a plurality of spray plate assemblies, which direct a spray of coolant over the top surface of the electronic cards carried between the card guides. A VME or other type of electronic back plane is typically attached to the manifolds and a back plane support, and is in electronic communication with the circuit cards.

Abstract: The apparatus includes a flexible printed wiring device (18) having a region sized to receive the electronic component (10) and a channel (28) disposed within the flexible printed wiring device. The channel has an inlet end (32) and an outlet end (34) and has an orifice (36) disposed therein. The inlet end receives a fluid, the fluid is distributed to the orifice via the channel and the orifice directs the fluid toward the region, so that the fluid is in direct contact with the electronic component when the electronic component is disposed in the region.

Abstract: First and second communicating holes are formed in a first formed plate 11, and first and second communicating holes are also formed in a second formed plate 12. The first and second formed plates 11 and 12 are joined to each other to form a joined body 8. When a plurality of joined bodies 8 are stacked, a heat exchanging section 7 is formed that is provided with a plurality of flow pipes 34 in which the first communicating holes are connected with each other in the stacking direction and the second communicating holes are also connected with each other. In the plurality of flow pipes 34 of the heat exchanging section 7, oil passage 35 in which engine oil flows in the stacking direction is formed, and further around the plurality of flow pipes 34, a plurality of cooling water passages 36 in which engine cooling water flows are formed.

Abstract: A power electronics package includes a heat exchanger having a plurality of faces, a plurality of semiconductor devices mounted on the plurality of faces and at least one bus structure for interconnecting electrodes of the semiconductor devices. The package is enclosed by a cover and structure is provided to connect other electrodes of the semiconductor devices to an external circuit. The heat exchanger is of the jet impingement type.

Abstract: A combustor liner (2) for convectively cooling a combustor chamber (16) in a gas turbine (4) comprises a chamber wall (30) with an array of coolant channels (60) formed therein. Supply manifolds (50) are coupled to the coolant channel inlets for directing bypass air through the channels, where the bypass air removes heat from the chamber wall, and discharge manifolds (52) are coupled to the coolant channel outlets for discharging the heated bypass air to the turbine (10). The coolant channels are spaced and distributed throughout the combustor liner so that the coolant flows through a substantial portion of the liner. The coolant channels are minute channels with relatively short flow paths to minimize both the pressure drop and the quantity of bypass air required to cool the wall. In addition, the channels are completely enclosed within the chamber wall to significantly improve the heat transfer characteristics of the combustor liner.

Abstract: The apparatus includes a plate (10) having a first layer (12) and a second layer (14) opposed to the first layer (12). A first fluid distributing conduit (28) is disposed in the first layer (12) and a second fluid distributing conduit (28) is disposed in the second layer (14). A first nozzle housing (30) having a first aperture (36) is disposed in the first fluid distributing conduit (28) and a second nozzle housing (30) having a second aperture (36) is disposed in the second fluid distributing conduit (28).

Abstract: A cryogenic cold shelf for use in a freeze drying system having a cryogen distributor for passing cryogenic fluid into the shelf volume of the cold shelf at differing rates so as to even refrigeration provided over the entire shelf resulting in a uniform temperature over the cold shelf.

Abstract: A power electronics package includes a heat exchanger having a plurality of faces, a plurality of semiconductor devices mounted on the plurality of faces and at least one bus structure for interconnecting electrodes of the semiconductor devices. The package is enclosed by a cover and structure is provided to connect other electrodes of the semiconductor devices to an external circuit.

Abstract: In a cooled wall part having a plurality of separate convectively cooled longitudinally cooling ducts (2) running near the inner wall (1) and parallel thereto, adjacent longitudinal cooling ducts (2) being connected to one another in each case via intermediate ribs (3), there is provided at the downstream end of the longitudinal cooling ducts (2) a deflecting device (4) which is connected to at least one backflow cooling duct (6) which is arranged near the outer wall (5) in the wall part and from which a plurality of tubelets (7) extending to the inner wall (1) of the cooled wall part and arranged in the intermediate ribs (3) branch off. By means of this wall part, the cooling medium can be put to multiple use for cooling (convective, effusion, film cooling).

Abstract: A printbar cooling device for cooling an array of print dies substantially eliminates thermal gradients along the length of the array of print dies through use of a parallel flow cooling configuration where each point along the array is in thermal contact with coolant at the same temperature. Coolant is directed away from the array of print dies to a common coolant outlet.

Abstract: An integrated coolant fluid supply and exhaust distribution pathdefining structure is employed to provide a substantially planar cooling system for an electronic assembly which includes a substrate having electronic modules or electronic chips disposed thereon. The pathdefining structure includes interleaved supply and exhaust channels with the supply channels including apertures disposed adjacent to heat sink shafts which are connected to planar heat sink structures in thermal contact with chips or modules being cooled. The pathdefining structure produces a fluid flow path which is initially aligned with the surface area enhancing heat sink shafts and which exits therefrom in a plurality of directions which ultimately lead to the exhaust channels provided in the path-defining structure. The assembly, which includes an exterior housing and the substrate, provides a compact cooling mechanism for electronic components.

Abstract: A thermal control system for use with a burn-in system, the thermal control system capable of delivering a thermally preconditioned liquid to a plurality of semiconductor devices during burn-in. The thermal control system comprises a liquid reservoir containing a liquid, a pump, and a plurality of spray nozzle arrays. The liquid contained in the liquid reservoir is thermally preconditioned through the use of a heating element and a cooling element and the temperature of the liquid provided to each spray nozzle array is individually controlled through the use of a pipe heating element. The liquid is collected and returned to the liquid reservoir after being sprayed on the semiconductor devices.

Abstract: A method of cooling a heat source, such as an integrated circuit device, includes the following steps (1) providing a base having a plurality of elongated fins on a first side thereof and a mating surface on a second side thereof, with the plurality of elongated fins defining a plurality of channels, (2) positioning the mating surface of the base in contact with the integrated circuit device, (3) advancing a first flow of fluid onto a top surface of each of the plurality of fins so as to form a quantity of spent fluid which continues to be advanced into the plurality of channels, and (4) advancing a second flow of fluid into the plurality of channels so as to exhaust the quantity of spent fluid from the plurality of channels. An apparatus for cooling a heat source is also disclosed.

Abstract: A thermal control system for use with a burn-in system, the thermal control system capable of delivering a thermally preconditioned liquid to a plurality of semiconductor devices during burn-in. The thermal control system comprises a liquid reservoir containing a liquid, a pump, and a plurality of spray nozzle arrays. The liquid contained in the liquid reservoir is thermally preconditioned through the use of a heating element and a cooling element and the temperature of the liquid provided to each spray nozzle array is individually controlled through the use of a pipe heating element. The liquid is collected and returned to the liquid reservoir after being sprayed on the semiconductor devices.

Abstract: A heat exchanger includes a long, thin-shelled heat transfer tube closed at one end and secured at the other end to a manifold collar which has an exhaust tube extending from the center thereof and a manifold housing extending from the collar side opposite that from which the heat transfer tube extends. A plurality of longitudinally extending distributor tubes extend from the heat transfer tube through the collar in fluid communication with a sealed manifold chamber and a plurality of orifices spaced at longitudinal increments along the length of each distributor tube permits the wind mass in the manifold chamber to exit the orifices as high speed, free-standing gas jets for impingement against the interior of the heat transfer tube so that the heat transfer tube acts either as a heat source or as a heat sink.

Abstract: In an apparatus for impingement cooling, in which a cooling surface and a cover surface are disposed parallel to one another, trapezoidal profiles that are open respectively on the narrow side and connected to one another at a constant distance from the cooling surface are disposed crosswise to the flow direction of the cooling air. A side of the trapezoid facing the cooling surface is provided with at least one row of perforations and forms a gap of a constant height with the cooling surface. Open sides of the trapezoid located opposite the cover surface form feed openings for the cooling air, and open sides of the trapezoids located opposite the cooling surface form overflow openings. The feed opening is much larger than the cross-section of a perforation. The cross-section of the return flow conduit is much larger than the overflow opening, and this opening is, in turn, much larger than the cross-section of the gap.

Abstract: A heatsink or cold plate is provided with which power electronic components mounted to a surface of the cold plate can be cooled with a cooling fluid flowing through the cold plate. The cold plate generally consists of a relatively planar structure through which one or more passages are formed for directing the cooling fluid through the cold plate. The passages direct the cooling fluid to recesses in the surface of the cold plate which are enclosed by the power electronic components. As such, cooling of the power electronic components is achieved by directly impinging the cooling fluid at their lower surfaces, preferably at an acute angle, such that enhanced heat transfer characteristics result.

Abstract: A heat exchange process and apparatus are especially suited for use in heat recovery applications, especially in a run-around heat exchanger. The run-around heat recovery system has two liquid to gas heat exchangers, one for heat transfer with stale air being exhausted and one for heat transfer with fresh air being taken in. The two heat exchangers are linked with a common coupling liquid so that heat may be extracted from one of the air flows and added to the other. To improve the heat transfer process, a gas is injected into the liquid just before it enters one or both of the heat exchangers. The resultant mixed phase flow produces a much higher heat transfer coefficient in the heat exchangers, yielding a significant improvement in the system performance.

Abstract: A compact, rugged and light weight condenser structure for a heat exchange system, preferably fabricated in layers and incorporating a jet fin structure for heat exchange with a single phase coolant fluid and tapered passages to maintain relatively constant vapor flow velocity and a consistent, high efficiency flow regime in a refrigerant fluid including vapor and liquid phases. Layered construction permits economical fabrication of the condenser in a plurality of configurations and heat exchange capacities. Tapered configuration of the refrigerant passages, together with the consistent distribution of jet fin heat exchange to the coolant allows a flow regime to be maintained which is highly tolerant of variation in the direction and force of acceleration forces on the condenser. Accordingly, a condenser capable of highly consistent heat exchange performance over a wide range of acceleration conditions is provided.

Abstract: A cooling apparatus for electronic equipment for improving the reliability of the equipment by making uniform the temperature distribution of heat generating devices mounted on the electronic equipment, more particularly on a computer and for reducing the working process required at the time of performing a maintenance of a printed circuit board in the electronic equipment by stacking, in a frame, the electronic printed circuit boards on which the heat generating devices, such as a CPU and memories, are mounted at predetermined intervals. The cooling apparatus has a fan fastened to one wall surface of a chamber and a plurality of jet cooling devices formed on the surface opposing the wall surface. The jet cooling devices are formed in parallel to the printed circuit boards. The jet cooling devices are slits, or nozzles or jet stream ducts extending among the printed circuit boards and are so formed as to supply cooling air in a jet stream state to each heat generating device.

Abstract: The present invention relates to an apparatus for providing a cooling system for electrical components mounted to the opposite side of a backplane from that on which the cooling air is dispersed. The invention of the present application accomplishes this cooling by providing for siphoning a portion of the cool air from the air plenum, directing it up a duct, and delivering it through a series of apertures onto the component which requires cooling on the back side of the backplane. The apertures include one through the backplane which is homologously positioned with respect to the electrical component on the back side of the backplane.

Abstract: An apparatus for cooling semiconductor devices includes a module for cooling semiconductor devices; a refrigerant cooling device for receiving via an outlet pipe the refrigerant discharged through an outlet port of the module to cool the refrigerant; a refrigerant circulation pump for receiving, via a suction pipe, the refrigerant cooled by the refrigerant cooling device and sending the refrigerant to the module via an inlet pipe; and a refrigerant-flow stabilizing mechanism for stabilizing a refrigerant circulation flow discharged from the refrigerant circulation pump to be returned to the refrigerant circulation pump via the module and the refrigerant cooling device. Since the refrigerant-flow stabilizing mechanism stabilize the refrigerant flow, the refrigerant flow can be stably circulated so that the semiconductor devices in the module are stably cooled.

Abstract: A cooling structure for integrated circuits including a plurality of integrated circuits, and a wiring substrate for mounting these integrated circuits and forming connections to a power source and signals. A plurality of cylindrical pistons are provided, with each having an open upper portion, a pair of protruding portions on an outside surface of the open upper portion and a spherical lower surface. A housing is provided which has holes in positions corresponding to positions of the respective integrated circuits on the wiring substrate, each hole having an O-ring groove formed in an inner wall thereof for receiving an O-ring and receiving the piston therein.

Abstract: A cooling structure is used for forced cooling of an electronic circuit package. The cooling structure has a bottom heat radiation plate on which the electronic circuit package is mounted, a nozzle for jetting coolant toward the bottom heat radiation plate, a first vertical heat radiation plate mounted on the bottom heat radiation plate and disposed so as to surround the nozzle openings are formed in the first vertical heat radiation plate for again jetting coolant jetted from the nozzle. A second vertical heat radiation plate is mounted on the bottom heat radiation plate and is disposed so as to surround the first vertical heat radiation plate at least in an opposing relationship to the openings. The coolant jetted from the openings collides with and removes heat from the second vertical heat radiation plate.

Abstract: Impingement cooling of a jet engine subassembly, such as a combustor. Adjacent raised corrugation portions and intervening plate portions (having impingement cooling holes) of a corrugated plate define coolant channels in fluid communication with the engine compressor. Dividers positioned transverse to the corrugation portions have a top side attached to a bottom surface of the plate portions and have a bottom side attached to the combustor liner. Corrugation portions define therewithin return channels in fluid communication with post-impingement cooling air. The dividers prevent crossflow between the impingement cooling air and the post-impingement cooling air.

Abstract: In a cooling apparatus of an electronic equipment, a plurality each of integrated circuit devices and large-scale integrated circuit devices are mounted onto a plurality of substrates, respectively, and a cooling fan supplies cooling air from outside to each of these integrated circuit devices. A duct having a comb-tooth shape suitable for encompassing each substrate and defining flow paths along the substrates introduces the cooling air supplied by the cooling fan to each of the integrated circuit devices. The duct includes a plurality of small holes disposed at positions corresponding to the positions of the integrated circuit devices on the substrates and having open areas corresponding to the heating values of the integrated circuit devices. The small holes flow the cooling air supplied by the cooling fan as jet streams to the integrated circuit devices. This jet stream cooling improves cooling performance and can make uniform the temperature distribution of the integrated circuit devices.

Abstract: An improved heat transfer assembly includes a textured impingement surface and means for impinging cooling air directly upon the textured surface. A component includes a surface textured to increase convective heat transfer with minimal increase in resistance to conductive heat transfer through the component. The textured surface can comprise an array of closely spaced hemispherically shaped protuberances. A method is disclosed for texturing a surface with discrete laser welds.

Abstract: An apparatus for cooling heat generating members such as semiconductor devices on a multichip module. A discharge device discharges cooling liquid for contacting the heat generating members and cooling them. A mixing device mixes the now high temperature cooling liquid, which has cooled the heat generating members, with another portion of the aforesaid cooling liquid still at a lower temperature. As a result, the temperature of the high temperature cooling liquid, which has been heated because it had cooled the heat generating members, can be lowered because the high temperature cooling liquid is mixed with the low temperature cooling liquid. Furthermore, a cooling liquid discharge device is provided for each heat generating member and a mixing device is located between the cooling liquid discharge devices or between heat generating members. In addition, the mixing device has a guide member for guiding the flow.

Abstract: Cooling apparatus of a magnetron having a plurality of embossed cooling fins for radiating high temperature heat generated by an anode of the magnetron. Each of the cooling fins includes an anode support boss for tightly receiving and supporting the anode, a pair of erected walls being provided at both sides of the cooling fin, and a plurality of embossments for causing cooling airflow to be forced toward the rear surface of the anode and providing a cooling passage. These embossments are provided between the anode and the erected walls in order to symmetrical to each other with respect to the cooling airflow. The embossments comprise a plurality of protruded embossments provided at a side of the cooling fin and a plurality of depressed embossments provided at the other side of the cooling fin. The protruded and depressed embossments have an interval which is gradually shortened such that it is minimized at the rear of the anode.

Abstract: A steam coil apparatus for transferring heat between steam passing through the apparatus and air flowing past the apparatus, the apparatus including a plurality of spaced outlet tubes extending substantially parallel to one another in a direction generally transverse to the direction of flow of the second fluid, and a plurality of fins or other extended surface attached to the outlet tubes and extending generally transverse to the outlet tubes. A plurality of inlet tubes are provided, each being received within one of the outlet tubes and formed of a diameter smaller than the diameter of the outlet tube within which it is received. The inlet tubes are provided with axially spaced orifices through which the first fluid passes from the inlet tubes to the outlet tubes. An outlet header is provided in fluid communication with the outlet tubes, and first and second opposed inlet headers communicate with the inlet tubes.

Abstract: The cold plate is a multiple layer structure with an inlet manifold for pressurized coolant liquid. The manifold is covered by a nozzle plate which directs liquid coolant jets against the mounting plate. The mounting plate carries the device to be cooled. The high velocity liquid jets impinge directly on the mounting plate to minimize the boundary layer to enhance heat transfer from the mounting plate to the liquid coolant.

Abstract: A method for the efficient cooling of a cavity-bearing surface is disclosed. The method includes the provision of an extra-fine coolant mist to the surface to be cooled wherein the surface has at least two projections and at least one cavity therebetween. The mist is deposited so as to form an ultra-thin coolant film upon the surface and at least one coolant mist vortex within the cavity. The film is evaporated from its outside surface.

Abstract: A process for improving the efficiency of heat transfer to a flowing fluid in a tubular heat exchanger by placing an injector on the inlet of each heat exchanger tube, the injector designed to create tangential flow in the tube. The injector used to generate tangential flow comprises a tubular cap with multiple passageways therethrough so that fluid entering the passageways enters the heat exchanger tube along a line tangent to the circumference of the hole extending along the length of the heat exchanger tube. A significant increase in heat transfer at the same pumping power is obtained as a result of the cross sectional shape of the passageway and the dimensions thereof in relationship to the inner diameter of the heat exchanger tube.

Abstract: A miniature heat exchanger. A small housing provides a heat exchanger surface, contains a spray shower head. A cooling fluid enters through a base plate and is sprayed through holes in the shower head on to the underside of the cooling surface. The heated coolant exists through exit holes in the nozzle and out a coolant outlet in the base plate. The device may also be used as a heater to provide temperature control to localized areas or large surfaces.