Abstract: A multi-fluid cooling system and methods of fabrication thereof are provided for removing heat from one or more electronic devices. The cooling system includes a multi-fluid manifold structure with at least one first fluid inlet orifice and at least one second fluid inlet orifice for concurrently, separately injecting a first fluid and a second fluid onto a surface to be cooled when the cooling system is employed to cool one or more electronic devices, wherein the first fluid and the second fluid are immiscible, and the first fluid has a lower boiling point temperature than the second fluid. When the cooling system is employed to cool the one or more electronic devices and the first fluid boils, evolving first fluid vapor condenses in situ by direct contact with the second fluid of higher boiling point temperature.

Abstract: In a heat exchanging apparatus for a vapor compression refrigerant cycle, an internal heat exchanger is attached to an end of a radiator. The internal heat exchanger is arranged such that high-pressure refrigerant passages are closer to the radiator than low-pressure refrigerant passages. The heat exchanging apparatus can be mounted on a vehicle such that the radiator receives cooling air more than the internal heat exchanger. Because the internal heat exchanger performs heat exchange between high-pressure refrigerant and low-pressure refrigerant, performance of the internal heat exchanger is not degraded even if it is located at a part receiving less cooling air. Thus, the heat exchanging apparatus is easily mounted on a vehicle by integrating the internal heat exchanger with the radiator, without reducing a cooling capacity of the radiator.

Abstract: Systems and methods for cooling electronic devices via enhanced thermal conduction in the gap separating an electronic device from a heat sink are provided. In one embodiment, a system for cooling an electronic device comprises: a heat sink spaced from the integrated circuit by a gap; and a bubbler and an atomizer configured to feed a mixture comprising an atomized liquid and a carrier gas to the gap.

Abstract: A heat exchanger which has a base plate and several carrier plates projecting from the base plate. At least one cooling element is located on each carrier plate. The cooling elements have a substrate with an underside and an upper side. Webs project from the upper side of the substrate and lie one behind the other, the height of which is less than the distance between adjacent webs. The substrate has a plurality of regularly arranged channels that extend through the substrate.

Abstract: Low-pressure drop thermal assemblies, systems and methods of making low-pressure drop thermal assemblies for use in high power flux situations. A manifold body is attached to a distributor to form a subassembly. This subassembly is in communication with a substrate surface, which has a semiconductor device in need of thermal management thereon. An enclosed cavity is formed between the target substrate surface and the subassembly, and a seal of the cavity protects critical components residing on the active surface of the semiconductor device. The distributor includes a distributed liquid impingement microjet inlet array isolated from and parallel with a distributed microjet drain array for impinging cooling fluid and removing spent heated fluid in a direction orthogonal to a target surface for maximizing the heat transfer rate, and thereby providing high cooling flux capabilities while enabling low-pressure drops.

Abstract: A cooled electronic module and method of fabrication are provided employing a cooling apparatus for removing heat from one or more electronic devices disposed on a substrate. The cooling apparatus includes a supply manifold structure having a plurality of inlet orifices for injecting coolant onto a surface to be cooled, and a return manifold structure. The return manifold structure, which is fabricated of a thermally conductive material, has a base surface sealed to the surface to be cooled along a periphery thereof employing a thermally conductive, coolant-tight seal. The return manifold structure provides at least one return passageway for exhausting coolant after impinging on the surface to be cooled, wherein coolant exhausting through the at least one passageway cools the return manifold structure, thereby facilitating further cooling of the surface to be cooled in a region where the base surface is sealed to the surface to be cooled.

Abstract: A slot impingement cooler is formed of a plurality of sets of foils in a stacked and registered array. In each set of foils, a first foil has supply slots that direct a flow of coolant, a second foil has a plurality of effective light-trap cavities, a third foil has return slots that return the flow of coolant, and an optional fourth foil has a plurality of effective light-trap cavities. The foils have registered supply manifold openings and registered return manifold openings therethrough.

Abstract: A heat exchanger comprising a substrate that comprises a bottom side and a top side; a unit for generating a directed fluid stream with a flow direction that is tangential to the bottom side and to the top side of substrate; webs projecting from the top side of substrate and perpendicular to the flow direction, lying one after the other in the flow direction, wherein a height of the webs is less than a spacing of adjacent webs in the flow direction; and a plurality of regularly arranged channels extending through the substrate.

Abstract: A cooling apparatus and method of fabrication are provided for facilitating removal of heat from an electronic device. The cooling apparatus includes a manifold structure having a plurality of inlet and outlet passageways for injecting coolant onto, and exhausting coolant after impinging on, a surface to be cooled. The coolant inlet and outlet passageways are interleaved in the manifold structure, and coolant is injected and exhausted through a common edge of the manifold. The manifold structure further includes coolant inlet and outlet plenums, with coolant passing through the inlet passageways from the inlet plenum in a first direction and coolant passing through the outlet passageways to the outlet plenum in a second direction, the first and second directions being perpendicular to the surface to be cooled and being opposite directions, and wherein the manifold structure is contained within a rectangular volume defined by a projection of the common edge.

Abstract: A circuit board assembly, for example, a computer motherboard, for use in a liquid submersion cooled electronic device, for example, a computer, is configured to facilitate movement of the cooling liquid when the circuit board is submerged in the cooling liquid, thereby improving the heat transfer from heat-generating components on the circuit board. For a computer, a plurality of heat-generating components are mounted on the motherboard, including a plurality of processors, a plurality of memory cards, a plurality of graphics cards, and a plurality of power supplies. A pump for the cooling liquid can also be mounted on the motherboard.

Abstract: A service tray for a thermal management system for providing convenient access to components within a liquid thermal management system. The service tray for a thermal management system includes a chassis with an opening and a support unit slidably positioned within the opening. The support unit receives various thermal management devices such as a coolant pump, a filter, a heater and the like. A first rail and a second rail are attached within the interior of the chassis that movably receive a first guide and a second guide of the support unit respectively. Electrical and fluid connectors attached to the chassis and the support unit allow for the connection of the thermal management devices on the support unit to the chassis.

Abstract: A cooling apparatus and a direct cooling impingement module are provided, along with a method of fabrication thereof. The cooling apparatus and direct impingement cooling module include a manifold structure and a jet orifice plate for injecting coolant onto a surface to be cooled. The jet orifice plate, which includes a plurality of jet orifices for directing coolant at the surface to be cooled, is a unitary plate configured with a plurality of jet orifice structures. Each jet orifice structure projects from a lower surface of the jet orifice plate towards the surface to be cooled, and includes a respective jet orifice. The jet orifice structures are spaced to define coolant effluent removal regions therebetween which facilitate removal of coolant effluent from over a center region of the electronic component being cooled to a peripheral region thereof, thereby reducing pressure drop across the jet orifice plate.

Abstract: A thermal distribution detecting unit detects a thermal distribution state on a surface of an electronic device. An emission control unit identifies a position to be cooled in accordance with the thermal distribution state detected. A nozzle selecting unit selects a cooling nozzle corresponding to the position. An emission time computing unit computes a coolant emission time and timing for the cooling nozzle. Upon reception of an instruction from the emission control unit, a drive unit drives a nozzle unit, thereby allowing a jet of coolant to impinge upon the electronic device.

Abstract: A cooling apparatus and a direct cooling impingement module are provided, along with a method of fabrication thereof. The cooling apparatus and direct impingement cooling module include a manifold structure and a jet orifice plate for injecting coolant onto a surface to be cooled. The jet orifice plate, which includes a plurality of jet orifices for directing coolant at the surface to be cooled, is a unitary plate configured with a plurality of jet orifice structures. Each jet orifice structure projects from a lower surface of the jet orifice plate towards the surface to be cooled, and includes a respective jet orifice. The jet orifice structures are spaced to define coolant effluent removal regions therebetween which facilitate removal of coolant effluent from over a center region of the electronic component being cooled to a peripheral region thereof, thereby reducing pressure drop across the jet orifice plate.

Abstract: A synthetic jet array in a computing device, such as a mobile computing device, to dissipate heat generated by a heat generating component of the mobile computer is described. In one embodiment, a microscale synthetic jet array is integrated within a heat generating component, either on the backside of the heat generating component itself or on a heat spreader coupled to the heat generating component. A method of fabricating a synthetic jet array as an integrated part of a computing device or as a heat spreader is described, as well as a method of use of the synthetic jet array, are described.

Abstract: In one embodiment, a cooling system is disclosed. The cooling system comprises: a cooling channel for receiving a cooling media, a substrate disposed near the cooling channel, and a fluidic jet disposed within the substrate and in fluid communication with the cooling channel. The cooling channel is for thermal communication with a component to be cooled. The cooling channel has a height of less than or equal to about 3 mm and a width of less than or equal to 2 mm. The fluidic jet comprises a cavity defined by a well and a membrane. In one embodiment, a method of cooling an electrical component comprises: passing a cooling media through a cooling channel, drawing the cooling media into one or more of the fluidic jets, expelling the cooling media from the one or more fluidic jets into the cooling channel, and removing thermal energy from the electrical component.

Abstract: A diamond foam spray cooling system for improving the thermal management of a heat producing device. The diamond foam spray cooling system includes a thermal management unit including a spray assembly, a chamber, a heat spreader and at least one diamond foam section thermally attached to a cooling surface of the heat spreader. The spray assembly sprays liquid coolant directly upon the engaging surface of the diamond foam section. A portion of the liquid coolant is evaporated from contacting the engaging surface and a portion of the liquid coolant passes into an immersion zone within the diamond foam section. Alternatively, the diamond foam section is thermally attached directly to the heat producing device. The diamond foam section may have varying thicknesses, cavities, raised portions and other configurations.

Abstract: A multi-fluid cooling system and methods of fabrication thereof are provided for removing heat from one or more electronic devices. The cooling system includes a multi-fluid manifold structure with at least one first fluid inlet orifice and at least one second fluid inlet orifice for concurrently, separately injecting a first fluid and a second fluid onto a surface to be cooled when the cooling system is employed to cool one or more electronic devices, wherein the first fluid and the second fluid are immiscible, and the first fluid has a lower boiling point temperature than the second fluid. When the cooling system is employed to cool the one or more electronic devices and the first fluid boils, evolving first fluid vapor condenses in situ by direct contact with the second fluid of higher boiling point temperature.

Abstract: Two embodiments of a heat exchanger assembly for cooling an electronic device are shown respectively in FIGS. 1 and 3 and each comprises a housing, a plurality of high fins, a plurality of low fins, a nozzle plate, an inlet, at least one outlet, a primary nozzle, and a plurality of secondary nozzles. In the first embodiment shown in FIG. 1, the housing and the nozzle plate are circular in shape. In the second embodiment shown in FIG. 3, the housing and the nozzle plate are rectangular in shape. Both embodiments include a plurality of secondary nozzles that are aligned outwardly of the primary nozzle and the center axis of the nozzle plate. The secondary nozzles direct the flow of the cooling liquid outwardly of the primary nozzle from the center thus creating an overall system pressure drop lower than that of other assemblies without a plurality of secondary nozzles.

Abstract: A cooled electronic module and method of fabrication are provided employing a cooling apparatus for removing heat from one or more electronic devices disposed on a substrate. The cooling apparatus includes a supply manifold structure having a plurality of inlet orifices for injecting coolant onto a surface to be cooled, and a return manifold structure. The return manifold structure, which is fabricated of a thermally conductive material, has a base surface sealed to the surface to be cooled along a periphery thereof employing a thermally conductive, coolant-tight seal. The return manifold structure provides at least one return passageway for exhausting coolant after impinging on the surface to be cooled, wherein coolant exhausting through the at least one passageway cools the return manifold structure, thereby facilitating further cooling of the surface to be cooled in a region where the base surface is sealed to the surface to be cooled.

Abstract: The subject invention provides a heat sink for cooling electronic devices. The heat sink includes an upper chamber and a lower chamber separated by a baffle therebetween. The lower chamber includes a base having a central axis and a plurality of curvilinear fins disposed radially about the central axis of the base. The upper chamber includes a lid defining an inlet and an inlet tube interconnecting the upper chamber and the lower chamber for directing a fluid through the upper chamber and impinging the fluid on the base in the lower chamber. A sidewall extends between the base and the lid and is disposed about the fins. The sidewall includes a peripheral inlet for directing the fluid perpendicular to the central axis and at the fins.

Abstract: A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes an integrated coolant inlet and outlet manifold having a plurality of inlet orifices for injecting coolant onto a surface to be cooled, and a plurality of outlet openings for exhausting coolant after impinging on the surface to be cooled. The inlet orifices and the outlet openings are interspersed in a common surface of the integrated manifold. A plurality of exit openings are also provided on at least one edge surface of the manifold. These exit openings are in fluid communication through the manifold with the outlet openings to facilitate exhausting of coolant through the outlet openings and minimize pressure drop through the manifold. At least one surface plane projection of the at least one edge surface intersects a surface plane projection of the common surface.

Abstract: A heat sink assembly for removing heat from an electronic device and comprising a base, a lid in spaced relationship with and parallel to the base, and an outer wall spiraling radially outwardly about an inlet axis from an inner exit position to an outer exit position to define a tangential outlet between said exit positions. Each of a plurality of curved fins presents a concave surface and a convex surface and extends from an inner circle with radius concentric with the inlet axis to an outer circle with radius concentric with the inlet axis to define a plurality of curved channels between adjacent fins for directing the flow of cooling fluid radially from the inlet axis. Each of the curved channels is disposed at a constant distance between next adjacent fins for a major length there along from the inner circle with radius toward the outer circle with radius.

Abstract: A manifold apparatus, system and method for thermally controlling a substrate whereby a manifold body having a microjet array and a drain array traversing there-through in a direction orthogonal to a substrate surface and parallel to each other is attached to the substrate surface for heating or cooling thereof. A cavity of the manifold body resides over the substrate surface such that liquid is emitted from the liquid microjets into the cavity for contact with the substrate surface, while the drains orthogonally remove spent liquid from the cavity. The manifold body is designed and configured into a plurality of cooling cells, whereby each cooling cell has a liquid microjet surrounded by at least three drains for preventing interactions between adjacent liquid microjets within adjacent cooling cells. Gas microjets may also traverse through the manifold body to form an atomized liquid spray for contact with the substrate surface.

Abstract: One embodiment of the cooling module is implemented as a device having a heat sink and an integrated synthetic jet actuator. The heat sink is configured to have a channel and a jet distribution system associated with the synthetic jet actuator directs fluid flow into the channel of the heat sink. In operation, the fluid flow of this embodiment of the cooling module comprises a synthetic jet stream and ambient fluid entrained into the channel by the synthetic jet stream. The fluid flowing through the channel serves to a wall of the heat sink channel.

Abstract: A turbine shroud assembly asymmetrical cooling element such as a shroud segment or a baffle includes an arcuate panel. The panel has a plurality of cooling apertures extending through the panel and an axially extending midline of the panel parallel to an axis of rotation of the arcuate panel. A symmetric portion of the cooling apertures have a symmetrical density of aperture inlets that is symmetric with respect to the axially extending midline. An asymmetric portion of the cooling apertures have an asymmetrical density of aperture inlets that is asymmetric with respect to the axially extending midline. One exemplary cooling element includes a high density area of the cooling apertures in the asymmetric portion having a higher density of aperture inlets than in the symmetric portion. A low density area of the cooling apertures in the asymmetric portion has a lower density of aperture inlets than in the symmetric portion of the cooling apertures.

Abstract: A liquid cooling device includes a casing (10) having a container (14) for accommodating liquid therein, and a liquid inlet port (18) in communication with the container (14). A funnel-shaped channel is defined in the liquid inlet port (18), and radiuses of the funnel-shaped channel are descended along a liquid flow direction.

Abstract: A cooling system for apparatus powered by electricity, that generates a substantial amount of heat during operation, and the heat must be dissipated to avoid failure of electrical and/or electronic components, such as semiconductor devices and integrated circuits, comprising the electrical apparatus. The cooling system employs water impinged on a heat sink thermally coupled with electrical apparatus, at subatmospheric pressure. The attendant phase change of the water to steam at a reduced temperature due to the subatmospheric pressure improves removal of waste heat to prevent failure of the electrical apparatus.

Abstract: A heat sink has a base plate and attached pin-fins with intake and discharge openings connected by a tubular channel. A pump moves cooling fluid across the exterior surface of the pin-fins, as well as the interior surface of the tubular channels, thereby increasing the surface area exposed to the cooling fluid. In one embodiment, the cooling fluid moves parallel to the base plate, and the discharge openings are oriented to discharge fluid in the same direction as the pump output, +/−90 degrees. Baffles may be added to duct the cooling fluid over the heat sink. In another embodiment, the cooling fluid moves perpendicular to the base plate and the discharge openings are oriented to vent the cooling fluid along lines that extend outward from a center point of the base plate, or along radial lines drawn from a central point through the pin-fins.

Abstract: A cooling system for apparatus powered by electricity, that generates a substantial amount of heat during operation, and the heat must be dissipated to avoid failure of electrical and/or electronic components, such as semiconductor devices and integrated circuits, comprising the electrical apparatus. The cooling system employs liquid ice impinged on a heat sink thermally coupled with electrical apparatus. The attendant phase changes of the liquid ice first to water and then to steam remove a substantial amount of waste heat to prevent failure of the electrical apparatus.

Abstract: A cooling device with an air shower is disclosed. The cooling device includes a heat mass with a plurality of spaced apart fins connected therewith. An air shower including an injector face with a plurality of disrupter orifices is positioned over the fins so that the disrupter orifices direct a second air flow into slots between adjacent fins. A first air flow flowing through the slots is impinged upon and is disrupted by the second air flow resulting in the generation of turbulence in the first air flow. Consequently, a thermal boundary layer in the first air flow is disrupted and a rate,of heat transfer from the fins and the heat mass are increased.

Abstract: A multiple impingement cooled structure is provided having two or more stages of impingement cooling wherein the stages are arranged so as to have substantially constant cooling effectiveness.

Abstract: A CPU cooler based on a flow field of impinging jet array includes a cooling base having an array of recesses on a top surface. The cooling base is disposed on a CPU. An orifice plate of a size substantially similar to the cooling base has an array of orifices with each orifice corresponding to a recess of the array of recesses. The orifice plate is spaced above the cooling base by a separation distance. A fan is secured to the CPU, with the cooling base and orifice plate being secured between the fan and the CPU. The fan when activated provides a coolant flow that produces vortical flow structures with enhanced turbulence on each recess by impinging air jets onto the recesses through the orifices corresponding to the recesses, thereby dissipating heat generated fly the running CPU.

Abstract: An apparatus for sinking heat away from a plurality of power switching devices where each power switching device includes a heat dissipating surface having a dissipating width dimension and having a device length dimension perpendicular to the dissipating width dimension, the apparatus comprising a heat sink member having a sink length dimension between inlet and outlet ends, forming an internal channel that extends substantially along the entire sink length dimension and also forming inlet and outlet ports that open into the channel at the inlet and outlet ends, respectively, the sink including first and second oppositely facing surfaces, the second surface for receiving the heat dissipating surfaces of the power switching devices, the second surface having a receiving width dimension that is substantially perpendicular to the sink length dimension and that is less than twice the device dissipating width dimension.

Abstract: Where gas turbine engine structure eg combustion equipment, is to be air impingement cooled, the surface which receives the air jets is so shaped as to produce boundary layer separation zones 34, 38 and 44 in the cooling air, as it spreads across the surface. Mixing of the boundary layer with the remainder of the air flow results, followed by the re-establishment of the boundary layer. The new boundary layer is cooler than the original layer and so provides more effective cooling.

Abstract: A modular spray cooling system 10 for cooling electronic components in enclosures containing electronic components that dissipate heat and therefore require cooling. The modular system is mounted in a sealed enclosure 12 with an inside wall 14. A spray cooling module 26 is detachably mountable within the sealed enclosure 12. The coolant is distributed to a spray manifold card 48 that is provided with nozzles. Localized cooling is accomplished with the use of individual nozzles 17. The spray cooling module 26 atomizes the evaporative coolant through nozzles 22 so that liquid droplets of the coolant are delivered to the electronic components, and cooling of the components occurs upon evaporation.

Abstract: A computer cooling system including a cooling fluid source, and a cooling duct array adapted to distribute cooling fluid from the cooling fluid source over a plurality of high dissipation components on a circuit board.

Abstract: A low velocity, laminar jet of air is directly impinged on the surface of heat producing components such as a microprocessor chip. A laminar jet air flow has a very low mass flow rate and has a high convection heat transfer rate at the stagnation region of the flow. A fan or an actuator coupled to a tube can be used to provide laminar jet air on the heat producing component. For any apparatus that places a premium on conserving power, delivery of a low velocity, laminar jet provides an effective way to cool the components of the apparatus while only minimally draining its power source.

Abstract: A computer cooling system including a cooling fluid source, and a cooling duct array adapted to distribute cooling fluid from the cooling fluid source over a plurality of high dissipation components on a circuit board.

Abstract: A multiple impingement cooled structure is provided having two or more stages of impingement cooling wherein the stages are arranged so as to have substantially constant cooling effectiveness.

Abstract: One embodiment of a thermal management system comprises a heated body, where a heat energy is contained within this heated body. This first embodiment also comprises an ambient fluid adjacent to an exterior surface of the heated body. Walls forming a channel are disposed within an interior of the heated body. The heat contained in the heated body is moved into at least one of these channel walls. The first embodiment comprises a synthetic jet actuator adjacent to one of the channel walls. The synthetic jet actuator is positioned so as to direct a synthetic jet flow through the channel. The operation of the synthetic jet actuator creates a flow consisting of the ambient fluid though the channel. This flow of ambient fluid cools the walls of the channel and thereby also cools the heated body itself.

Abstract: An assembly comprising an integrated cooling system/liquid containment system/EMI shield/pump housing/heat sink is built atop a multi-chip module. The attached devices are cooled by a spray of fluid, effecting a phase change from liquid to gas at the point of evaporation. Condensing liquid accumulates at the base of the fins and is collected by a pump for redistribution. The pump is coupled to a fan blade, which in turn is operated by a motor. A seal is formed between the multi-chip module and the integrated housing. The assembly is designed such that this seal need not be broken to service the motor, thus minimizing the amount of vapors from the working fluid lost into the atmosphere. Case fins and fan blades are arranged for improved efficiency.

Abstract: A method for cooling bus bars 12,14 in order to increase their current-carrying capacity while saving space and weight. The method comprises the steps of providing a housing having an interior wall; locating a distribution manifold 20 within the housing, the distribution manifold comprising a hollow bus bar 12,14; communicating to the manifold a supply of an evaporative coolant 18, 18′; and delivering the coolant 18, 18′ outwardly under pressure so that upon exiting the manifold 20, the coolant 18, 18′ undergoes a phase change from the liquid to the vapor state. Heat is extracted from the manifold 20 at least as quickly as heat is generated by the flow of current. The extraction of heat by the flow of coolant 18, 18′ and evaporation maintains or lowers the temperature of the bus bar and enables a given size of bus bar to carry more current without a significant rise in temperature. The invention also includes an apparatus 10 for cooling bus bars 12,14 in an electrical circuit.

Abstract: Impingement plate and jet nozzle assemblies are presented for use in cooling an electronic module. The assemblies include a thermally conductive plate having a first main surface and a second main surface with a plurality of concave surface portions formed in the second main surface extending towards the first main surface. Each concave surface portion has a conic section profile. A plurality of jet nozzles are disposed above the thermally conductive plate with each jet nozzle being aligned over a respective concave surface portion, wherein fluid introduced into a concave surface portion through the respective jet it nozzle impinges upon a lower portion thereof and flows outward along the concave surface portion. Each conic section profile is one of an elliptical section, a circular section, or a parabolic section.

Abstract: A cooling effect is produced by collision of coolant (10) introduced into coolant introduction chamber (3) with the back face side of heat-generating elements (1) within a first coolant contact chamber (4) by injection from a central nozzle (7). Thereafter in the same way coolant (10) produces a cooling effect in a second coolant contact chamber (5) and third coolant contact chamber (6). Since peripheral nozzles (8) and (9) are formed so as to spread in radial fashion about central nozzle (7) as center, cooling is effected to practically the same level of temperature, so there is no possibility of large tensile heat stress being generated at heat-generating elements (1).

Abstract: An assembly comprising an integrated cooling system/liquid containment system/EMI shield/pump housing/heat sink is built atop a multi-chip module. The attached devices are cooled by a spray of fluid, effecting a phase change from liquid to gas at the point of evaporation. Condensing liquid accumulates at the base of the fins and is collected by a pump for redistribution. The pump is coupled to a fan blade, which in turn is operated by a motor. A seal is formed between the multi-chip module and the integrated housing. The assembly is designed such that this seal need not be broken to service the motor, thus minimizing the amount of vapors from the working fluid lost into the atmosphere. Case fins and fan blades are arranged for improved efficiency.

Abstract: A system and method for cooling electronic components. A liquid is heated to a temperature near its boiling point and directed against electronic components such that a portion of the heated liquid vaporizes, forming a mixed phase fluid. The mixed phase fluid is drawn away from the electronic components and the vapor is condensed back into a liquid.

Abstract: Cavity plate and jet nozzle assemblies are presented for use in cooling an electronic module. The assemblies include a cavity plate having one or more blind holes formed therein and one or more jet nozzles each configured to reside within a respective blind hole of the cavity plate. A lower surface of the blind hole and/or jet nozzle is curved to facilitate the flow of fluid from the blind hole after impinging upon the lower surface of the blind hole. Various jet nozzle configurations are also provided which employ pedestals or radially extending fins. Further, the radially extending fins may interdigitate with inwardly extending fins on the inner sidewall of a respective blind hole in the cavity plate. Methods of fabricating the cavity plate and jet nozzle assemblies are also presented.

Abstract: A system and method for cooling are disclosed. The system for cooling includes an opening out of which a jet of coolant can flow, a target element, and a forcing device which causes the jet of coolant to flow out of the opening. The target element is positioned in front of the opening so that the jet of coolant, when flowing out of the opening, is directed toward the target element. The jet of coolant oscillates so that the jet of coolant sweeps across the target element and cools a variety of different locations along the target element.

Abstract: An assembly comprising an integrated cooling system/liquid containment system/EMI shield/pump housing/heat sink is built atop a multi-chip module. The attached devices are cooled by a spray of fluid, effecting a phase change from liquid to gas at the point of evaporation. Condensing liquid accumulates at the base of the fins and is collected by a pump for redistribution. The pump is coupled to a fan blade, which in turn is operated by a motor. A seal is formed between the multi-chip module and the integrated housing. The assembly is designed such that this seal need not be broken to service the motor, thus minimizing the amount of vapors from the working fluid lost into the atmosphere. Case fins and fan blades are arranged for improved efficiency.