Abstract: Gel polymer electrolytes comprising molybdate(VI) salts dispersed in a hydrogel matrix. The hydrogel matrix contains reacted units of an acrylamide (e.g. 2-acrylamido-2-methyl-1-propanesulfonic acid) and optionally an additional monomer. A supercapacitor including the gel polymer electrolyte and electrodes arranged between the electrolyte is also specified. This supercapacitor is evaluated on its specific capacitance, energy density, power density, resistance, as well as cycling stability.

Abstract: A strip-shaped electrode sheet includes an electrode foil including a strip-shaped foil exposed portion in which the electrode foil is exposed, a strip-shaped active material layer extending in a longitudinal direction, and a strip-shaped insulator layer containing insulating resin and formed on an insulator-layer support portion along a one-side layer edge portion of the active material layer and between the foil exposed portion of the electrode foil and an active-material-layer support portion. The insulator layer is located lower than a top face of the active material layer toward the electrode foil and includes a slant coating portion covering at least a lower portion of a one-side slant portion of the active material layer and a foil coating portion extending from the slant coating portion in a width-direction one side and covering the insulator-layer support portion of the electrode foil.

Abstract: A semiconductor device package is disclosed. The package according to one example includes a base having a main surface made of a metal, a dielectric side wall having a bottom surface facing the main surface, a joining material containing silver (Ag) and joining the main surface of the base and the bottom surface of the side wall to each other, a lead made of a metal joined to an upper surface of the side wall on a side opposite to the bottom surface, and a conductive layer not containing silver (Ag). The conductive layer is provided between the bottom surface and the upper surface of the side wall at a position overlapping the lead when viewed from a normal direction of the main surface. The conductive layer is electrically connected to the joining material, extends along the bottom surface, and is exposed from a lateral surface of the side wall.

Abstract: Provided is a battery module that prevents a new current path that may be formed due to molten metal resulting from a molten and cut fuse, and has better safety than conventional battery modules. A battery module includes: module terminals; a battery cell group including a plurality of battery cells; and a plurality of bus bars connecting the plurality of battery cells of this battery cell group and connecting this battery cell group with the module terminals. At least one of the plurality of bus bars has a fuse. The battery module has a space that is located below the fuse and that allows the molten fuse to fall.

Abstract: Articles comprising a substrate having a first major surface; an electrical conductor pattern on the first major surface of the substrate, the electrical conductor pattern comprising a plurality of separated pairs of separated first and second electrically conductive metallic traces. Optionally the articles further comprise a first electrically conductive layer. Embodiments of articles described herein are useful in, for example, displays, touch sensors, lighting elements, photovoltaic cells, electrochromic windows and displays, and electroluminescent lamps and displays.

Abstract: A semiconductor structure includes a substrate, a plurality of micro semiconductor devices and a fixing structure. The micro semiconductor devices are disposed on the substrate. The fixing structure is disposed between the substrate and the micro semiconductor devices. The fixing structure includes a plurality of conductive layers and a plurality of supporting layers. The conductive layers are disposed on the lower surfaces of the micro semiconductor devices. The supporting layers are connected to the conductive layers and the substrate. The material of each of the conductive layers is different from the material of each of the supporting layers.

Abstract: A noble metal-coated silver bonding wire for ball bonding wire includes a noble metal coating layer on a core material made of pure silver or a silver alloy, wherein the wire contains at least one sulfur group element, the noble metal coating layer includes at least one palladium layer, the total palladium content relative to the entire wire is not less than 0.01 mass % and not more than 5.0 mass %, and the total sulfur group element content relative to the entire wire is not less than 0.1 mass ppm and not more than 100 mass ppm.

Abstract: The present invention provides a bonding wire for a semiconductor device, where the bonding wire can inhibit wear of capillary. In a Cu alloy bonding wire for a semiconductor device, a total of abundance ratios of a crystal orientations <110> and <111> having an angular difference of 15 degrees or less from a direction perpendicular to one plane including a wire center axis is to crystal orientations on a wire surface 40% or more and 90% or less, in average area percentage.

Abstract: The present invention accurately distinguishes a soldering material less likely to oxidize. A Cu core ball has a Cu ball having a predetermined size, and a solder layer coating the Cu ball. The Cu ball provides a space between a semiconductor package and a printed circuit board. The Cu core ball has the soldering material having lightness greater than or equal to 62.5 in L*a*b* color space subsequent to a heating storage test performed for 72 hours in a temperature-controlled bath at 150° C. with a temperature of 25° C. and 40% humidity, and the soldering material, prior to the heating storage test, having lightness greater than or equal to 65 in the L*a*b* color space and yellowness less than or equal to 7.0 in the L*a*b* color space.

Abstract: Provided herein are ink compositions with improved conductivity. The improved conductivity is attributable to the addition of organohalogen compounds to the composition.

Abstract: The present invention provides a Cu alloy bonding wire for a semiconductor device, where the bonding wire can satisfy requirements of high-density LSI applications. In the Cu alloy bonding wire for a semiconductor device, the abundance ratio of a crystal orientation <110> having an angular difference of 15 degrees or less from a direction perpendicular to one plane including a wire center axis to crystal orientations on a wire surface is 25% or more and 70% or less in average area percentage.

Abstract: The present invention provides an oxide superconducting bulk magnet which can obtain a sufficient amount of total magnetic flux, by preventing the superconducting bulk body from being broken due to electromagnetic stress and quenching phenomenon to enable magnetization by a strong magnetic field. An oxide superconducting bulk magnet comprising an oxide superconducting bulk body wherein RE2BaCuO5 is dispersed in a monocrystalline RE1Ba2Cu3Oy; and an outer peripheral reinforcing ring fitted to the outer periphery of the oxide superconducting bulk body, wherein the outer peripheral reinforcing ring is made of a plurality of metal rings having a multiple ring structure in the radial direction, at least one of the plurality of metal rings has a thermal conductivity of 20 W/(m·K) or more at a temperature of 20 to 70 K and at least one of the plurality of metal rings has a higher strength than the metal ring having a thermal conductivity of 20 W/(m·K) or more.

Abstract: Disclosed is a display device having a pixel including a pixel electrode, an electroluminescence layer over the pixel electrode, and an opposing electrode over the electroluminescence layer. The pixel electrode possesses: a first conductive layer including a conductive oxide containing indium and zinc; a second conductive layer over the first conductive layer, the second conductive layer containing silver; and a third conductive layer over the second conductive layer, the third conductive layer including a conductive oxide containing indium and tin. A thickness of the first conductive layer is equal to or more than twice a thickness of the third conductive layer and equal to or less than five times the thickness of the third conductive layer.

Abstract: A method of manufacturing an electronic board includes: preparing a substrate in which substrate-side solder parts are provided on electrodes; preparing a mounting sheet having a resin layer in which a plurality of voids is formed in accordance with positions of the electrodes; attaching the resin layer to at least one of a first electronic component and the substrate so that interfaces of the first electronic component or the substrate-side solder parts are located inside the respective voids; causing the interfaces and the substrate-side solder parts to face each other at positions of the respective voids; and melting the substrate-side solder parts by heating to join the interfaces and the electrodes.

Abstract: The actuator includes a suspension plate, an outer frame, at least one bracket and a piezoelectric plate. The suspension plate includes a first surface and a second surface and is capable of bending and vibrating. The outer frame surrounds a periphery of the suspension plate. The at least one bracket is connected between the suspension plate and the outer frame for supporting the suspension plate. The piezoelectric plate includes a first electrode and a second electrode made of silver palladium alloy doped with graphene. The first electrode is coated with a conducting layer made of graphene-doped paint, and the second electrode is coated with an adhesive layer made of graphene-doped epoxy glue. The adhesive layer is configured to attach and in adhesion with the first surface of the suspension plate. A voltage is applied to the first electrode and the second electrode to make the suspension plate bend and vibrate.

Abstract: Contact pins are provided to a socket main body for accommodating an IC package so as to be in contact with connection terminals of the IC package accommodated in the socket main body. Each contact pin includes a conductive substrate and multiple layers laminated on the surface of the substrate, including: an underlying layer formed on the substrate by Ni plating; a first surface layer formed on the underlying layer by Pd—Ni alloy plating; a second surface layer formed on the first surface layer by Ni plating, thus allowing Sn from the corresponding connection terminal to diffuse into the second surface layer at a rate lower than into a conventional plated Ag layer; and an outermost surface layer formed on the second surface layer by Au plating to serve as an electrical contact layer.

Abstract: A process for manufacturing corrosion resistant metal components is disclosed. The process comprises abrasive blasting of a silicon-containing steel substrate followed by hot dip galvanizing, a second abrasive blasting process, treating with a mineral acid, and coating with a polymeric coating. The resulting corrosion resistance is enhanced.

Abstract: A palladium coated copper wire for ball bonding includes a core formed of pure copper or copper alloy having a purity of 98% by mass or more, and a palladium draw coated layer coated on the core. The copper wire has a diameter of 10 to 25 ?m, and the palladium drawn layer contains sulfur, phosphorus, boron or carbon.

Abstract: Provided is a continuous material pattern, the pattern is selected to have a plurality of material-free voids, the material including at least one perovskite material.

Abstract: According to an embodiment, a method includes receiving a magnetic device design comprising a magnetic structure to be formed, at least in part, from a magnetic material matrix, wherein the magnetic material matrix is configured to be used in at least one of a magnetic materials additive manufacturing system (MMAMS) and a magnetic materials bulk extrusion system (MMBES); receiving the magnetic material matrix by at least one of the MMAMS and the MMBES; and dispensing the magnetic material matrix using at least one of the MMAMS and the MMBES to form the magnetic structure.

Abstract: A bonding wire for a high-speed signal line for connecting a pad electrode of a semiconductor device and a lead electrode on a circuit board contains palladium (Pd), platinum (Pt), silver (Ag), and a trace additive element.

Abstract: An alternating electric field responsive biomedical composite is disclosed that provides capacitive coupling through the composite. The biomedical composite includes a binder material, a polar material that is substantially dispersed within the binder material, and electrically conductive particles within the binder material. The polar material is responsive to the presence of an alternating electric field, and the electrically conductive particles are not of sufficient concentration to form a conductive network through the composite unless and until the composite becomes overcharged.

Abstract: An ignition system comprises an ignition coil assembly (100) that supplies a high voltage electric current to a resistor-type spark plug (20). The ignition coil assembly (100) includes an ignition coil (140), a high voltage coil terminal (120), a terminals connecting insert (30) and an insulator (40). The terminals connecting insert (30) conducts the high voltage current from the ignition coil (140) to the resistor-type spark plug (20) by connecting the high voltage coil terminal (120) of the ignition coil (140) to the electrode terminal (22) of the resistor-type spark plug (20). The conductor core (32) of the terminals connecting insert (30) is formed of electrically conducting elongated fibers of carbon fiber or graphite fiber. A conductor supporting body stem (34) of the terminals connecting insert (30) forms an insulating and protecting layer around the outside of the fiber conductor core (32).

Abstract: Composite material comprising a matrix of elastic and electrically insulating material, and a filler of electrically conducting material embedded within the matrix. The filler forms a conductive path defining an active electrode adapted to be associated with a reference electrode for forming an electrical signal output. A deformable gap is formed between an outer surface of the conductive path and an inner surface of the matrix, in such a way that the application of a mechanical load to the composite material causes the surface of the conductive path and the surface of the matrix to be brought closer together, and the removal of the mechanical load causes the surface of the conductive path and the surface of the matrix to be moved away from one another as a result of the elastic force of the material of the matrix.

Abstract: A device for damping of high frequency currents is provided. The device includes a conductor extending along a main axis, a first damping path including a first damping element extending along a first axis and a second damping path including a second damping element extending along a second axis. The first and second damping elements are arranged on opposite sides of the conductor. The main axis, the first axis and the second axis are different and separate from each other. The first damping element and the second damping element are spaced apart from the conductor and electrically connected in parallel with the conductor between a first position and a second position along the conductor. Further, from the first position to the second position, a resistance of the conductor is lower than a resistance of either one of the first and second damping paths.

Abstract: A plastic packaging component is provided that is formed of a resin containing an electromagnetic spectrally detectable additive mixed with the resin. The resin formed into a plastic packaging component of an aerosol package lid, an aerosol spray button, an aerosol spray tube, a trigger sprayer, an integrated lid-sprayer, a grease cartridge, a grease cap, plastic fiber toweling, a packaging strap, a pail lid, a jar cap, or a brush. A process for detecting a displaced packaging component in an organic production stream is provided that includes adding to a resin an electromagnetically detectable additive intermixed with the resin and forming the additive loaded resin into the plastic packaging component. The production stream is then scanned for the detectable signal of the additive. Upon detecting the additive, an alarm signal is provided that the production stream contains the displaced packaging component.

Abstract: The present invention discloses electrical cables containing a cable core and a plurality of conductive elements surrounding the cable core. The cable core contains at least one composite core, and each composite core contains a rod which contains a plurality of unidirectionally aligned fiber rovings embedded within a thermoplastic polymer matrix, and surrounded by a capping layer.

Abstract: According to the present invention, there are provided an electromagnetic interference suppression material capable of exhibiting a good low-pass filter characteristic in an extensive frequency band ranging from a low frequency to a high frequency, and an electromagnetic interference suppression sheet using the electromagnetic interference suppression material. When laminating a conductive layer having a surface electrical resistance of 100 to 5000?/? in which 5 to 25% by volume of a conductive carbon is mixed, and a magnetic layer having a magnetic permeability with an actual number portion of 3 to 45 in which a magnetic material is mixed, to each other, it is possible to obtain an electromagnetic interference suppression sheet suitable for high-density packaging of electronic equipments which is excellent in low-pass filter characteristic in a near electromagnetic field.

Abstract: The silver-gold alloy bonding wire of the present invention includes an alloy composed of not lower than 10% and not higher than 30% of gold (Au) and not lower than 30 ppm and not higher than 90 ppm of calcium (Ca) with the remainder of silver (Ag) at purity relative to a metallic element except for elements Au and Ca of 99.99% or higher, in mass percentage; a layer enriched with oxygen (O) and calcium (Ca) formed as a surface layer on the surface of the alloy; and a gold-enriched layer formed immediately below the surface layer.

Abstract: A substrate for an optical device includes an optical device substrate including a plurality of conductive plates elongated along a length direction, wherein side surfaces of the conductive plates are bonded to each other with insulators interposed therebetween, the insulators being respectively formed on the side surfaces. A groove having a predetermined depth for preventing burrs is formed in a lower surface of the optical device substrate at each point where a cutting line is crossed with one of the insulators when the optical device substrate is cut in a length direction and in a vertical direction, the groove being formed in such a way that said one of the insulators is exposed to an inside of the groove.

Abstract: A wiring board according to the present invention is provided with an insulating board and a connection pad, wherein the connection pad includes a main conductor layer formed of a low resistance material, a thin film resistor layer formed of a high resistance material and having a low soldering wettability, and a covering layer having a high soldering wettability, the main conductor layer, the thin film resistor layer, and the covering layer being sequentially laminated at the surface of the insulating layer in such a manner as to be electrically connected in series to each other, and the thin film resistor layer covers a main surface and a side surface of the main conductor layer, and further, a side surface of the thin film resistor layer is exposed from the covering layer.

Abstract: An electro-conductive multifilament yarn for an electro-conductive brush that includes an electro-conductive fiber containing a synthetic fiber and a carbon nanotube covering a surface of the fiber. The synthetic fiber may have a single-filament fineness of not more than 30 dtex. The synthetic fiber may have 3 to 6 elongated recesses or grooves extending in a longitudinal direction thereof and have a multi-leaves or cross-section.

Abstract: A structure including a graphene electrode and a molecular monolayer, a flexible electronic device, and a method of production thereof are provided. The structure includes a first graphene electrode and a molecular monolayer disposed on the first graphene electrode and chemically or physically bound to the first graphene electrode.

Abstract: The invention relates to an electro-optical or electromechanical structural component, in particular, an LED, connector or stamped grid, or sliding element, made of a rolled metal substrate of a metal strip, or a sheet produced therefrom, made of Cu or a Cu alloy strip, Al or an Al alloy strip, Fe or a Fe alloy strip, Ti or a Ti alloy strip, Ni or a Ni alloy strip or a stainless steel strip, which has a specially structured surface. The structure of the surface allows joining using optical methods, even in the case of highly reflective surface coatings, and simultaneously improves the functional properties of the components used.

Abstract: The invention relates to a wire, preferably a bonding wire for bonding in microelectronics, containing a copper core with a surface and a coating layer containing aluminum superimposed over the surface of the core. In any cross-sectional view of the wire, the area share of the coating layer is from 20 to 50% based on the total area of the cross-section of the wire, and the aspect ratio between longest and shortest paths through the wire is from larger than 0.8 to 1.0. The wire has a diameter of from 100 ?m to 600 ?m. The invention further relates to a process for making a wire, to a wire obtained by the process, to an electric device containing at least two elements and the wire, to a propelled device containing the electric device, and to a process of connecting two elements through the wire by wedge bonding.

Abstract: The invention relates to a method for the functionalisation of metal nanowires and the use of said nanowires. The functionalisation method of the invention includes a step comprising the formation of a self-assembled monolayer on at least part of the external surface of metal nanowires, using a compound of formula R1—Zn—R2, wherein Z is S or Se, and n is equal to 1 or 2, and R1 is a hydrogen atom or an acyl group or a hydrocarbon group comprising between 1 and 100 carbon atoms and R2 is an electron-attracting or -donating group. The method if the invention is particularly suitable for use in the field electrode production.

Abstract: An electrical conductor includes an ultra-thin layer of aluminum-doped zinc-oxide and a nano-layer of alumina in contact and conformal with a surface of the ultra-thin aluminum-doped zinc-oxide layer.

Abstract: The invention relates to three-dimensional crystalline foams with high surface areas, high lithium capacity, and high conductivity for use as electrode materials and methods for their fabrication. In additional embodiments, the invention also relates to the use of three-dimensional crystalline foams as supercapacitors for improved charge and energy storage.

Abstract: There is provided a wiring material including a core layer made of metal and a clad layer made of metal and a fiber in which the core layer is copper or an alloy containing copper and the clad layer is formed of copper or the alloy containing copper and the fiber having a thermal expansion coefficient lower than that of copper, the wiring material having a stacked structure in which at least one surface of the core layer is closely adhered to the clad layer, and the fiber in the clad layer is arranged so as to be parallel to the surface of the core layer.

Abstract: According to example embodiments, a wire structure includes a first wire that includes a first wire core and a first carbon shell surrounding the first wire core, and a second wire that extends in a longitudinal direction from the first wire. The first wire core has a wire shape. The first carbon shell contains carbon.

Abstract: The present invention provides a metallic material for electronic components having a low degree of whisker formation and a high durability, and connector terminals, connectors and electronic components using the metallic material. The metallic material for electronic components includes: a base material; on the base material, an lower layer constituted with one or two or more selected from the group consisting of Ni, Cr, Mn, Fe, Co and Cu; on the lower layer, an upper layer constituted with an alloy composed of one or both of Sn and In (constituent elements A) and one or two or more of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir (constituent elements B), wherein the thickness of the lower layer is 0.05 ?m or more; the thickness of the upper layer is 0.005 ?m or more and 0.

Abstract: An electroconductive particle including an electroconductive layer made of copper or a copper alloy, or silver or a silver alloy, and a surface layer made of nickel or a nickel alloy and formed on the electroconductive layer is used. By use of the electroconductive particle obtained such that a surface is coated with hard nickel, and an inner side of a nickel layer is copper or silver having low specific resistance, low resistance and high reliability can be obtained. An electroconductive particle having low resistance and high reliability, a circuit connecting material containing electroconductive particles, a mounting body using a circuit connecting material, and a method for manufacturing a mounting body are provided.

Abstract: Embodiments of submersible composite cables include a non-composite electrically conductive core cable, a multiplicity of composite cables, including a multiplicity of composite wires, around the core cable, and an insulative sheath surrounding the composite cables. Other embodiments include an electrically conductive core cable; a multiplicity of elements selected from fluid transport, electrical power transmission, electrical signal transmission, light transmission, weight elements, buoyancy elements, filler elements, or armor elements, arranged around the core cable in at least one cylindrical layer defined about a center longitudinal axis of the core cable when viewed in a radial cross section; a multiplicity of composite wires surrounding the elements in at least one cylindrical layer about the center longitudinal axis; and an insulative sheath surrounding the composite wires. The composite wires may be metal matrix or polymer composite wires.

Abstract: A multilayer structure including a transparent conductive thin film and a molybdenum metal thin film, the transparent conductive thin film having a thickness of 35 nm or less.

Abstract: A photovoltaic (PV) cell comprises a base substrate which comprises silicon and includes at least one doped region. The PV cell further comprises a collector disposed on the doped region of the base substrate and having a lower portion in physical contact with the doped region of the base substrate, and an upper portion opposite the lower portion. The PV cell further comprises an electrically conductive layer which is electrically isotropic or anisotropic and disposed adjacent the collector. The electrically conductive layer is in electrical communication with the base substrate via the collector. The electrically conductive layer comprises a binder and electrically conductive particles comprising at least one metal selected from the group consisting of Group 8 through Group 14 metals of the Periodic Table of Elements. The electrically conductive particles impart isotropic or anisotropic electrical conductivity to the electrically conductive layer.

Abstract: A multilayer insulation-coated electric conductor for a coil constituting a circuit by forming a welded portion in the coil, wherein at least one layer of the multilayer insulation-coating layers of the coated metal conductor is composed of at least one resin selected from the group consisting of a polyimide resin, a polyesterimide resin, and an H-class polyester resin.

Abstract: A electric wire includes a central conductor 1 made of aluminum or an aluminum alloy, a cover layer 2 made of copper and covering the central conductor 1, and a ferromagnetic layer 3 covering the cover layer 2 and blocking the external magnetic field. The thickness of the ferromagnetic layer 3 is in a range from 0.04 ?m to 14 ?m, the total diameter of the central conductor 1 and the cover layer 2 is in a range from 0.05 mm to 0.4 mm, and the cross-sectional area of the central conductor 1 is in a range from 85% to 95% of the total cross-sectional area of the central conductor 1 and the cover layer 2.

Abstract: A bump structure provided on an electrode pad includes a solder member, and a metal layer having a cylindrical portion covering a side surface of the solder member, the metal layer being made of a metal which is higher in melting point than the solder member. An upper part of the cylindrical portion of the metal layer is opened wide.

Abstract: A coating having a layered structure including a palladium layer is provided to a conductor. The highly stable palladium layer is amorphous and contains phosphorus in a concentration ranging from 7.3% by mass to 11.0% by mass. An electronic component may include the conductor coated with the coating. The conductor coated with the coating has superior corrosion resistance and superior reliability in electrical connection with external apparatuses.

Abstract: An apparatus and method for fastening dissimilar metals like steel and aluminum utilizes a spot welding machine. The metals are stacked with an aluminum body captured between steels. Heat from the welder's electric current softens the lower melting point aluminum allowing an indentation of the steel layer to penetrate the aluminum and weld to an opposing steel layer. The process may be used to join stacks with several layers of different materials and for joining different structural shapes.