Composite Patents (Class 174/126.2)
  • Patent number: 10431918
    Abstract: Contact pins are provided to a socket main body for accommodating an IC package so as to be in contact with connection terminals of the IC package accommodated in the socket main body. Each contact pin includes a conductive substrate and multiple layers laminated on the surface of the substrate, including: an underlying layer formed on the substrate by Ni plating; a first surface layer formed on the underlying layer by Pd—Ni alloy plating; a second surface layer formed on the first surface layer by Ni plating, thus allowing Sn from the corresponding connection terminal to diffuse into the second surface layer at a rate lower than into a conventional plated Ag layer; and an outermost surface layer formed on the second surface layer by Au plating to serve as an electrical contact layer.
    Type: Grant
    Filed: August 16, 2016
    Date of Patent: October 1, 2019
    Assignee: ENPLAS CORPORATION
    Inventor: Takahiro Oda
  • Patent number: 10280580
    Abstract: A process for manufacturing corrosion resistant metal components is disclosed. The process comprises abrasive blasting of a silicon-containing steel substrate followed by hot dip galvanizing, a second abrasive blasting process, treating with a mineral acid, and coating with a polymeric coating. The resulting corrosion resistance is enhanced.
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: May 7, 2019
    Assignee: USA INTELLECTUAL PROPERTY HOLDING, INC.
    Inventors: James Earl Goff, Luke John Drazek, John Curtis Thompson, Jr., Anthony Lane Eldridge
  • Patent number: 10195697
    Abstract: A palladium coated copper wire for ball bonding includes a core formed of pure copper or copper alloy having a purity of 98% by mass or more, and a palladium draw coated layer coated on the core. The copper wire has a diameter of 10 to 25 ?m, and the palladium drawn layer contains sulfur, phosphorus, boron or carbon.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: February 5, 2019
    Assignee: TANAKA DENSHI KOGYO K.K.
    Inventors: Hiroyuki Amano, Somei Yarita, Yusuke Sakita, Yuki Antoku, Wei Chen
  • Patent number: 10192689
    Abstract: Provided is a continuous material pattern, the pattern is selected to have a plurality of material-free voids, the material including at least one perovskite material.
    Type: Grant
    Filed: January 7, 2016
    Date of Patent: January 29, 2019
    Assignee: YISSUM RESEARCH DEVELOPMENT COMPANY OF THE HEBREW UNIVERSITY OF JERUSALEM LTD.
    Inventors: Lioz Etgar, Shlomo Magdassi, Sigalit Aharon, Michael Layani
  • Patent number: 10005217
    Abstract: According to an embodiment, a method includes receiving a magnetic device design comprising a magnetic structure to be formed, at least in part, from a magnetic material matrix, wherein the magnetic material matrix is configured to be used in at least one of a magnetic materials additive manufacturing system (MMAMS) and a magnetic materials bulk extrusion system (MMBES); receiving the magnetic material matrix by at least one of the MMAMS and the MMBES; and dispensing the magnetic material matrix using at least one of the MMAMS and the MMBES to form the magnetic structure.
    Type: Grant
    Filed: August 20, 2015
    Date of Patent: June 26, 2018
    Assignee: The Boeing Company
    Inventors: John D. Willams, Andrew George Laquer
  • Patent number: 9972595
    Abstract: A bonding wire for a high-speed signal line for connecting a pad electrode of a semiconductor device and a lead electrode on a circuit board contains palladium (Pd), platinum (Pt), silver (Ag), and a trace additive element.
    Type: Grant
    Filed: December 27, 2013
    Date of Patent: May 15, 2018
    Assignee: TANAKA DENSHI KOGYO K.K.
    Inventors: Yuki Antoku, Kazuhiko Yasuhara, Jun Chiba, Wei Chen, Junichi Okazaki, Nanako Maeda
  • Patent number: 9899121
    Abstract: An alternating electric field responsive biomedical composite is disclosed that provides capacitive coupling through the composite. The biomedical composite includes a binder material, a polar material that is substantially dispersed within the binder material, and electrically conductive particles within the binder material. The polar material is responsive to the presence of an alternating electric field, and the electrically conductive particles are not of sufficient concentration to form a conductive network through the composite unless and until the composite becomes overcharged.
    Type: Grant
    Filed: December 3, 2013
    Date of Patent: February 20, 2018
    Assignee: FLEXcon Company, Inc.
    Inventors: Kenneth Burnham, Richard Skov, Stephen Tomas
  • Patent number: 9859690
    Abstract: An ignition system comprises an ignition coil assembly (100) that supplies a high voltage electric current to a resistor-type spark plug (20). The ignition coil assembly (100) includes an ignition coil (140), a high voltage coil terminal (120), a terminals connecting insert (30) and an insulator (40). The terminals connecting insert (30) conducts the high voltage current from the ignition coil (140) to the resistor-type spark plug (20) by connecting the high voltage coil terminal (120) of the ignition coil (140) to the electrode terminal (22) of the resistor-type spark plug (20). The conductor core (32) of the terminals connecting insert (30) is formed of electrically conducting elongated fibers of carbon fiber or graphite fiber. A conductor supporting body stem (34) of the terminals connecting insert (30) forms an insulating and protecting layer around the outside of the fiber conductor core (32).
    Type: Grant
    Filed: February 18, 2013
    Date of Patent: January 2, 2018
    Inventor: Joe Luk Mui Lam
  • Patent number: 9748868
    Abstract: Composite material comprising a matrix of elastic and electrically insulating material, and a filler of electrically conducting material embedded within the matrix. The filler forms a conductive path defining an active electrode adapted to be associated with a reference electrode for forming an electrical signal output. A deformable gap is formed between an outer surface of the conductive path and an inner surface of the matrix, in such a way that the application of a mechanical load to the composite material causes the surface of the conductive path and the surface of the matrix to be brought closer together, and the removal of the mechanical load causes the surface of the conductive path and the surface of the matrix to be moved away from one another as a result of the elastic force of the material of the matrix.
    Type: Grant
    Filed: March 17, 2015
    Date of Patent: August 29, 2017
    Assignee: FONDAZIONE ISTITUTO ITALIANO DI TECNOLOGIA
    Inventors: Majid Taghavi, Virgilio Mattoli, Lucia Beccai, Barbara Mazzolai
  • Patent number: 9667043
    Abstract: A device for damping of high frequency currents is provided. The device includes a conductor extending along a main axis, a first damping path including a first damping element extending along a first axis and a second damping path including a second damping element extending along a second axis. The first and second damping elements are arranged on opposite sides of the conductor. The main axis, the first axis and the second axis are different and separate from each other. The first damping element and the second damping element are spaced apart from the conductor and electrically connected in parallel with the conductor between a first position and a second position along the conductor. Further, from the first position to the second position, a resistance of the conductor is lower than a resistance of either one of the first and second damping paths.
    Type: Grant
    Filed: March 10, 2014
    Date of Patent: May 30, 2017
    Assignee: ABB SCHWEIZ AG
    Inventor: Lars-Erik Juhlin
  • Patent number: 9557311
    Abstract: A plastic packaging component is provided that is formed of a resin containing an electromagnetic spectrally detectable additive mixed with the resin. The resin formed into a plastic packaging component of an aerosol package lid, an aerosol spray button, an aerosol spray tube, a trigger sprayer, an integrated lid-sprayer, a grease cartridge, a grease cap, plastic fiber toweling, a packaging strap, a pail lid, a jar cap, or a brush. A process for detecting a displaced packaging component in an organic production stream is provided that includes adding to a resin an electromagnetically detectable additive intermixed with the resin and forming the additive loaded resin into the plastic packaging component. The production stream is then scanned for the detectable signal of the additive. Upon detecting the additive, an alarm signal is provided that the production stream contains the displaced packaging component.
    Type: Grant
    Filed: March 12, 2015
    Date of Patent: January 31, 2017
    Assignee: ILLINOIS TOOL WORKS, INC.
    Inventors: Robert H. Martin, John Gregory Bruce, Darylnn Phillips Jordan, Craig Martin Stearns
  • Patent number: 9443635
    Abstract: The present invention discloses electrical cables containing a cable core and a plurality of conductive elements surrounding the cable core. The cable core contains at least one composite core, and each composite core contains a rod which contains a plurality of unidirectionally aligned fiber rovings embedded within a thermoplastic polymer matrix, and surrounded by a capping layer.
    Type: Grant
    Filed: March 18, 2015
    Date of Patent: September 13, 2016
    Assignee: Southwire Company, LLC
    Inventors: Allan Daniel, Paul Springer, Yuhsin Hawig, Mark Lancaster, David W. Eastep, Sherri M. Nelson, Tim Tibor, Tim Regan, Michael L. Wesley
  • Patent number: 9380736
    Abstract: According to the present invention, there are provided an electromagnetic interference suppression material capable of exhibiting a good low-pass filter characteristic in an extensive frequency band ranging from a low frequency to a high frequency, and an electromagnetic interference suppression sheet using the electromagnetic interference suppression material. When laminating a conductive layer having a surface electrical resistance of 100 to 5000?/? in which 5 to 25% by volume of a conductive carbon is mixed, and a magnetic layer having a magnetic permeability with an actual number portion of 3 to 45 in which a magnetic material is mixed, to each other, it is possible to obtain an electromagnetic interference suppression sheet suitable for high-density packaging of electronic equipments which is excellent in low-pass filter characteristic in a near electromagnetic field.
    Type: Grant
    Filed: June 14, 2012
    Date of Patent: June 28, 2016
    Assignee: TODA KOGYO CORPORATION
    Inventor: Kazumi Yamamoto
  • Patent number: 9362249
    Abstract: The silver-gold alloy bonding wire of the present invention includes an alloy composed of not lower than 10% and not higher than 30% of gold (Au) and not lower than 30 ppm and not higher than 90 ppm of calcium (Ca) with the remainder of silver (Ag) at purity relative to a metallic element except for elements Au and Ca of 99.99% or higher, in mass percentage; a layer enriched with oxygen (O) and calcium (Ca) formed as a surface layer on the surface of the alloy; and a gold-enriched layer formed immediately below the surface layer.
    Type: Grant
    Filed: February 11, 2015
    Date of Patent: June 7, 2016
    Assignee: TANAKA DENSHI KOGYO K.K.
    Inventors: Kazuhiko Yasuhara, Nanako Maeda, Junichi Okazaki, Jun Chiba, Wei Chen, Yuki Antoku
  • Patent number: 9316768
    Abstract: A substrate for an optical device includes an optical device substrate including a plurality of conductive plates elongated along a length direction, wherein side surfaces of the conductive plates are bonded to each other with insulators interposed therebetween, the insulators being respectively formed on the side surfaces. A groove having a predetermined depth for preventing burrs is formed in a lower surface of the optical device substrate at each point where a cutting line is crossed with one of the insulators when the optical device substrate is cut in a length direction and in a vertical direction, the groove being formed in such a way that said one of the insulators is exposed to an inside of the groove.
    Type: Grant
    Filed: November 18, 2014
    Date of Patent: April 19, 2016
    Assignee: Point Engineering Co., Ltd.
    Inventors: Bum Mo Ahn, Ki Myung Nam, Kyung Soo Yoo
  • Patent number: 9295154
    Abstract: A wiring board according to the present invention is provided with an insulating board and a connection pad, wherein the connection pad includes a main conductor layer formed of a low resistance material, a thin film resistor layer formed of a high resistance material and having a low soldering wettability, and a covering layer having a high soldering wettability, the main conductor layer, the thin film resistor layer, and the covering layer being sequentially laminated at the surface of the insulating layer in such a manner as to be electrically connected in series to each other, and the thin film resistor layer covers a main surface and a side surface of the main conductor layer, and further, a side surface of the thin film resistor layer is exposed from the covering layer.
    Type: Grant
    Filed: June 27, 2014
    Date of Patent: March 22, 2016
    Assignee: KYOCERA CIRCUIT SOLUTIONS, INC.
    Inventor: Makoto Shiroshita
  • Patent number: 9035188
    Abstract: An electro-conductive multifilament yarn for an electro-conductive brush that includes an electro-conductive fiber containing a synthetic fiber and a carbon nanotube covering a surface of the fiber. The synthetic fiber may have a single-filament fineness of not more than 30 dtex. The synthetic fiber may have 3 to 6 elongated recesses or grooves extending in a longitudinal direction thereof and have a multi-leaves or cross-section.
    Type: Grant
    Filed: March 3, 2011
    Date of Patent: May 19, 2015
    Assignees: Kuraray Co., Ltd., Chakyu Dyeing Co., Ltd., Tsuchiya TSCO Co., Ltd., NATIONAL UNIVERSITY CORPORATION HOKKAIDO UNIVERSITY
    Inventors: Eiji Akiba, Masaaki Hachiya, Hidetaka Yamauchi, Bunshi Fugetsu
  • Publication number: 20150129280
    Abstract: A structure including a graphene electrode and a molecular monolayer, a flexible electronic device, and a method of production thereof are provided. The structure includes a first graphene electrode and a molecular monolayer disposed on the first graphene electrode and chemically or physically bound to the first graphene electrode.
    Type: Application
    Filed: May 27, 2014
    Publication date: May 14, 2015
    Applicant: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Hyoyoung LEE, Sohyeon SEO
  • Patent number: 9023485
    Abstract: The invention relates to an electro-optical or electromechanical structural component, in particular, an LED, connector or stamped grid, or sliding element, made of a rolled metal substrate of a metal strip, or a sheet produced therefrom, made of Cu or a Cu alloy strip, Al or an Al alloy strip, Fe or a Fe alloy strip, Ti or a Ti alloy strip, Ni or a Ni alloy strip or a stainless steel strip, which has a specially structured surface. The structure of the surface allows joining using optical methods, even in the case of highly reflective surface coatings, and simultaneously improves the functional properties of the components used.
    Type: Grant
    Filed: February 8, 2011
    Date of Patent: May 5, 2015
    Assignee: Wieland-Werke AG
    Inventors: Isabell Buresch, Dieter Stock, Thorsten Weireter
  • Publication number: 20150098170
    Abstract: The invention relates to a wire, preferably a bonding wire for bonding in microelectronics, containing a copper core with a surface and a coating layer containing aluminum superimposed over the surface of the core. In any cross-sectional view of the wire, the area share of the coating layer is from 20 to 50% based on the total area of the cross-section of the wire, and the aspect ratio between longest and shortest paths through the wire is from larger than 0.8 to 1.0. The wire has a diameter of from 100 ?m to 600 ?m. The invention further relates to a process for making a wire, to a wire obtained by the process, to an electric device containing at least two elements and the wire, to a propelled device containing the electric device, and to a process of connecting two elements through the wire by wedge bonding.
    Type: Application
    Filed: May 7, 2013
    Publication date: April 9, 2015
    Applicant: HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
    Inventors: Eugen Milke, Peter Prenosil, Sven Thomas
  • Publication number: 20150083461
    Abstract: An electrical conductor includes an ultra-thin layer of aluminum-doped zinc-oxide and a nano-layer of alumina in contact and conformal with a surface of the ultra-thin aluminum-doped zinc-oxide layer.
    Type: Application
    Filed: September 26, 2013
    Publication date: March 26, 2015
    Inventors: Mitchell Stewart BURBERRY, Lee William TUTT
  • Publication number: 20150085424
    Abstract: The invention relates to three-dimensional crystalline foams with high surface areas, high lithium capacity, and high conductivity for use as electrode materials and methods for their fabrication. In additional embodiments, the invention also relates to the use of three-dimensional crystalline foams as supercapacitors for improved charge and energy storage.
    Type: Application
    Filed: June 3, 2013
    Publication date: March 26, 2015
    Applicant: National University of Singapore
    Inventors: Barbaros Ozyilmaz, Orhan Kahya, Jonghak Lee
  • Publication number: 20150083466
    Abstract: The invention relates to a method for the functionalisation of metal nanowires and the use of said nanowires. The functionalisation method of the invention includes a step comprising the formation of a self-assembled monolayer on at least part of the external surface of metal nanowires, using a compound of formula R1—Zn—R2, wherein Z is S or Se, and n is equal to 1 or 2, and R1 is a hydrogen atom or an acyl group or a hydrocarbon group comprising between 1 and 100 carbon atoms and R2 is an electron-attracting or -donating group. The method if the invention is particularly suitable for use in the field electrode production.
    Type: Application
    Filed: July 20, 2012
    Publication date: March 26, 2015
    Applicant: Commissariat A L'Energie Atomique Et Aux Energies Alternatives
    Inventors: Jean-Pierre Simonato, Alexandre Carella
  • Patent number: 8975747
    Abstract: There is provided a wiring material including a core layer made of metal and a clad layer made of metal and a fiber in which the core layer is copper or an alloy containing copper and the clad layer is formed of copper or the alloy containing copper and the fiber having a thermal expansion coefficient lower than that of copper, the wiring material having a stacked structure in which at least one surface of the core layer is closely adhered to the clad layer, and the fiber in the clad layer is arranged so as to be parallel to the surface of the core layer.
    Type: Grant
    Filed: August 13, 2012
    Date of Patent: March 10, 2015
    Assignee: Hitachi, Ltd.
    Inventors: Takashi Ando, Ryoichi Kajiwara, Hiroshi Hozoji
  • Publication number: 20150061161
    Abstract: According to example embodiments, a wire structure includes a first wire that includes a first wire core and a first carbon shell surrounding the first wire core, and a second wire that extends in a longitudinal direction from the first wire. The first wire core has a wire shape. The first carbon shell contains carbon.
    Type: Application
    Filed: August 25, 2014
    Publication date: March 5, 2015
    Applicant: Sungkyunkwan University Foundation for Corporate Collaboration
    Inventors: Eun-kyung LEE, Byoung-lyong CHOI, Won-Jae JOO, Byung-Sung KIM, Jae-Hyun LEE, Jong-Woon LEE, Dong-Mok WHANG
  • Publication number: 20150047879
    Abstract: The present invention provides a metallic material for electronic components having a low degree of whisker formation and a high durability, and connector terminals, connectors and electronic components using the metallic material. The metallic material for electronic components includes: a base material; on the base material, an lower layer constituted with one or two or more selected from the group consisting of Ni, Cr, Mn, Fe, Co and Cu; on the lower layer, an upper layer constituted with an alloy composed of one or both of Sn and In (constituent elements A) and one or two or more of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir (constituent elements B), wherein the thickness of the lower layer is 0.05 ?m or more; the thickness of the upper layer is 0.005 ?m or more and 0.
    Type: Application
    Filed: January 25, 2013
    Publication date: February 19, 2015
    Inventors: Yoshitaka Shibuya, Kazuhiko Fukamachi, Atsushi Kodama
  • Publication number: 20150047878
    Abstract: An electroconductive particle including an electroconductive layer made of copper or a copper alloy, or silver or a silver alloy, and a surface layer made of nickel or a nickel alloy and formed on the electroconductive layer is used. By use of the electroconductive particle obtained such that a surface is coated with hard nickel, and an inner side of a nickel layer is copper or silver having low specific resistance, low resistance and high reliability can be obtained. An electroconductive particle having low resistance and high reliability, a circuit connecting material containing electroconductive particles, a mounting body using a circuit connecting material, and a method for manufacturing a mounting body are provided.
    Type: Application
    Filed: March 22, 2013
    Publication date: February 19, 2015
    Inventors: Takeshi Tamaki, Yoshito Tanaka
  • Patent number: 8957313
    Abstract: A multilayer structure including a transparent conductive thin film and a molybdenum metal thin film, the transparent conductive thin film having a thickness of 35 nm or less.
    Type: Grant
    Filed: January 16, 2007
    Date of Patent: February 17, 2015
    Assignee: Idemitsu Kosan Co., Ltd.
    Inventors: Satoshi Umeno, Katsunori Honda, Kazuyoshi Inoue, Masato Matsubara
  • Patent number: 8957312
    Abstract: Embodiments of submersible composite cables include a non-composite electrically conductive core cable, a multiplicity of composite cables, including a multiplicity of composite wires, around the core cable, and an insulative sheath surrounding the composite cables. Other embodiments include an electrically conductive core cable; a multiplicity of elements selected from fluid transport, electrical power transmission, electrical signal transmission, light transmission, weight elements, buoyancy elements, filler elements, or armor elements, arranged around the core cable in at least one cylindrical layer defined about a center longitudinal axis of the core cable when viewed in a radial cross section; a multiplicity of composite wires surrounding the elements in at least one cylindrical layer about the center longitudinal axis; and an insulative sheath surrounding the composite wires. The composite wires may be metal matrix or polymer composite wires.
    Type: Grant
    Filed: June 30, 2010
    Date of Patent: February 17, 2015
    Assignee: 3M Innovative Properties Company
    Inventors: Colin McCullough, Douglas E. Johnson, Michael F. Grether
  • Publication number: 20150034141
    Abstract: A photovoltaic (PV) cell comprises a base substrate which comprises silicon and includes at least one doped region. The PV cell further comprises a collector disposed on the doped region of the base substrate and having a lower portion in physical contact with the doped region of the base substrate, and an upper portion opposite the lower portion. The PV cell further comprises an electrically conductive layer which is electrically isotropic or anisotropic and disposed adjacent the collector. The electrically conductive layer is in electrical communication with the base substrate via the collector. The electrically conductive layer comprises a binder and electrically conductive particles comprising at least one metal selected from the group consisting of Group 8 through Group 14 metals of the Periodic Table of Elements. The electrically conductive particles impart isotropic or anisotropic electrical conductivity to the electrically conductive layer.
    Type: Application
    Filed: December 13, 2012
    Publication date: February 5, 2015
    Inventors: John D. Albaugh, Tiffany Menjoulet, Timothy Paul Mitchell, Nicholas E. Powell
  • Patent number: 8946560
    Abstract: A electric wire includes a central conductor 1 made of aluminum or an aluminum alloy, a cover layer 2 made of copper and covering the central conductor 1, and a ferromagnetic layer 3 covering the cover layer 2 and blocking the external magnetic field. The thickness of the ferromagnetic layer 3 is in a range from 0.04 ?m to 14 ?m, the total diameter of the central conductor 1 and the cover layer 2 is in a range from 0.05 mm to 0.4 mm, and the cross-sectional area of the central conductor 1 is in a range from 85% to 95% of the total cross-sectional area of the central conductor 1 and the cover layer 2.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: February 3, 2015
    Assignee: Fujikura Ltd.
    Inventors: Chihiro Kamidaki, Ning Guan, Takashi Shinmoto, Yasunobu Hori
  • Patent number: 8946559
    Abstract: A multilayer insulation-coated electric conductor for a coil constituting a circuit by forming a welded portion in the coil, wherein at least one layer of the multilayer insulation-coating layers of the coated metal conductor is composed of at least one resin selected from the group consisting of a polyimide resin, a polyesterimide resin, and an H-class polyester resin.
    Type: Grant
    Filed: August 28, 2009
    Date of Patent: February 3, 2015
    Assignee: The Furukawa Electric Co., Ltd.
    Inventor: Masakazu Mesaki
  • Publication number: 20150029689
    Abstract: A bump structure provided on an electrode pad includes a solder member, and a metal layer having a cylindrical portion covering a side surface of the solder member, the metal layer being made of a metal which is higher in melting point than the solder member. An upper part of the cylindrical portion of the metal layer is opened wide.
    Type: Application
    Filed: July 11, 2014
    Publication date: January 29, 2015
    Inventors: Kei IMAFUJI, Katsumi YAMAZAKI, Noritaka KATAGIRI, Teruaki CHINO
  • Patent number: 8933336
    Abstract: A coating having a layered structure including a palladium layer is provided to a conductor. The highly stable palladium layer is amorphous and contains phosphorus in a concentration ranging from 7.3% by mass to 11.0% by mass. An electronic component may include the conductor coated with the coating. The conductor coated with the coating has superior corrosion resistance and superior reliability in electrical connection with external apparatuses.
    Type: Grant
    Filed: November 15, 2012
    Date of Patent: January 13, 2015
    Assignee: TDK Corporation
    Inventors: Kenichi Yoshida, Yuhei Horikawa, Makoto Orikasa, Hideyuki Seike
  • Publication number: 20150000956
    Abstract: An apparatus and method for fastening dissimilar metals like steel and aluminum utilizes a spot welding machine. The metals are stacked with an aluminum body captured between steels. Heat from the welder's electric current softens the lower melting point aluminum allowing an indentation of the steel layer to penetrate the aluminum and weld to an opposing steel layer. The process may be used to join stacks with several layers of different materials and for joining different structural shapes.
    Type: Application
    Filed: June 26, 2014
    Publication date: January 1, 2015
    Inventor: Donald J. Spinella
  • Patent number: 8920683
    Abstract: A sputtering target which is composed of a sintered body of an oxide which contains at least indium, tin, and zinc and includes a spinel structure compound of Zn2SnO4 and a bixbyite structure compound of In2O3. A sputtering target includes indium, tin, zinc, and oxygen with only a peak ascribed to a bixbyite structure compound being substantially observed by X-ray diffraction (XRD).
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: December 30, 2014
    Assignee: Idemitsu Kosan Co., Ltd.
    Inventors: Koki Yano, Kazuyoshi Inoue, Nobuo Tanaka, Akira Kaijo, Satoshi Umeno
  • Publication number: 20140353002
    Abstract: An electrically conductive wire (D) is provided which is constructed on the basis of copper and which includes a core (1) as well as a layer (2) metallically connected to the layer (2), while the layer (2) has a proportion of the wire cross section which is between 20% and 50% of the cross section of the wire. The core (1) on the one nano and the layer (2) surrounding the core (1) consist of different materials on the basis of copper.
    Type: Application
    Filed: May 23, 2014
    Publication date: December 4, 2014
    Inventors: Wolfgang Placke, Henning Tepe
  • Patent number: 8900659
    Abstract: The present invention relates to a method of forming copper nanowires with a metallic coating. In a preferred embodiment, the metallic coating is copper. Due to the metal coating, the nanowires become magnetically guidable and chemically stable. As such, the nanowires can be used to form nanomesh. Further, the nanowire and nanomesh of the present invention can be used as transparent electrodes that are used in TV, PC, touch-control, and solar industries.
    Type: Grant
    Filed: July 19, 2011
    Date of Patent: December 2, 2014
    Assignee: National University of Signapore
    Inventors: Hua Chun Zeng, Shengmao Zhang, Yu Chang, Mei Ling Lye
  • Patent number: 8896117
    Abstract: A semiconductor device bonded by an anisotropic conductive film, the anisotropic conductive film including a conductive adhesive layer and an insulating adhesive layer stacked thereon, an amount of reactive monomers in the conductive adhesive layer being higher than an amount of reactive monomers in the insulating adhesive layer.
    Type: Grant
    Filed: November 16, 2012
    Date of Patent: November 25, 2014
    Assignee: Cheil Industries, Inc.
    Inventors: Youn Jo Ko, Jin Kyu Kim, Dong Seon Uh, Kil Yong Lee, Jang Hyun Cho
  • Publication number: 20140326482
    Abstract: An iridium oxide coating for application on an external surface of an electrode of a medical lead is described. The iridium coating is applied using pulse DC sputtering. The coating provides the electrode with an increased double layer capacitance and a reduced electrical impedance. The iridium oxide coating is characterized as having a dense structure with a surface morphology having the general appearance of a fractal or cauliflower shape. The pulse DC sputtered iridium oxide coating is achieved through a mixture ratio of oxygen and argon gases, a sputtering power of between 75 to 125 W, a chamber pressure ranging from about 20-30 mTorr, and a frequency ranging from 50 kHz to 150 kHz. The coated electrode may be used to facilitate the injection of electrical charge stimulation and/or monitor biorhythms of cardiac and neurological tissue.
    Type: Application
    Filed: July 16, 2012
    Publication date: November 6, 2014
    Applicant: Greatbatch Ltd.
    Inventors: Sachin Thanawala, Cheng He
  • Patent number: 8878068
    Abstract: An electric wire contains a conductive wire having at least a groove structured on the surface of the conductive wire, and an additional wire to be filled into the groove. The groove is provided on an outer surface of the conductive wire along a longitudinal direction of the conductive wire. The additional wire is inserted in the groove.
    Type: Grant
    Filed: October 26, 2010
    Date of Patent: November 4, 2014
    Assignee: Goto Denshi Co., Ltd.
    Inventors: Yoshihide Goto, Taiki Goto, Youichi Miura
  • Patent number: 8878067
    Abstract: An electronic-component lead terminal includes a lead terminal one end of which is connectable to an electronic component and the other end of which is connectable to an electrode, and a solder-wicking prevention area formed on a surface of the lead terminal so as to intersect a solder-wicking direction oriented from the other end toward the one end, the solder-wicking prevention area including a plurality of portions projecting to a downstream side in the solder-wicking direction.
    Type: Grant
    Filed: January 12, 2012
    Date of Patent: November 4, 2014
    Assignee: Fujitsu Limited
    Inventors: Hiroaki Tamura, Fumihiko Tokura
  • Patent number: 8871119
    Abstract: A composite oxide sintered body includes In, Zn, and Sn, and has a relative density of 90% or more, an average crystal grain size of 10 ?m or less, and a bulk resistance of 30 m?cm or less, the number of tin oxide aggregate particles having a diameter of 10 ?m or more being 2.5 or less per mm2 of the composite oxide sintered body.
    Type: Grant
    Filed: December 28, 2012
    Date of Patent: October 28, 2014
    Assignee: Idemitsu Kosan Co., Ltd.
    Inventors: Koki Yano, Hirokazu Kawashima
  • Publication number: 20140311769
    Abstract: A composite conductor 10, including an internal layer 11 having a conductive material A, the conductive material A having fatigue strength of at least 150 MPa after being subjected to 106 cycles of cyclic loading in a fatigue test, and an external layer 12 having a conductive material B, the external layer coating the internal layer 11, the conductive material B having tensile strength higher than that of the conductive material A, the tensile strength being at least 250 MPa, in which the composite conductor 10 has fracture resistance to a sudden load and impact as well as bending durability.
    Type: Application
    Filed: December 6, 2012
    Publication date: October 23, 2014
    Applicants: DYDEN CORPORATION, FUKUOKA PREFECTURAL GOVERNMENT, NATIONAL UNIVERSITY CORPORATION KUMAMOTO UNIVERSITY
    Inventors: Hiroyuki In, Fumiyo Annou, Daisuke Matsunaga, Hiromoto Kitahara, Shinji Ando, Masayuki Tsushida, Toshifumi Ogawa
  • Patent number: 8866019
    Abstract: An electric wire includes a conductive portion 11 made of a material having a volume resistivity higher than that of copper, wherein the volume resistivity of the conductive portion is specified so that, in a frequency range in which the electric wire is used, a ratio of AC resistance of the conductive portion 11 to AC resistance of reference copper wire is less than 1.
    Type: Grant
    Filed: February 19, 2013
    Date of Patent: October 21, 2014
    Assignee: Fujikura Ltd.
    Inventors: Takashi Shinmoto, Shotaro Yoshida, Ning Guan
  • Patent number: 8853540
    Abstract: A conductor for a communications cable includes an elongated metal wire and a metal sheet that includes a plurality of carbon nanotubes that at least partially surrounds the elongated metal wire. The metal wire may include copper, and the metal sheet may likewise include copper and may be welded to an outside surface of the metal wire to surround the metal wire. This conductor may be used in a variety of communications cables that carry high frequency signals.
    Type: Grant
    Filed: April 13, 2012
    Date of Patent: October 7, 2014
    Assignee: CommScope, Inc. of North Carolina
    Inventor: Luc Walter Adriaenssens
  • Patent number: 8845931
    Abstract: A method for preparing a nanometal-polymer composite conductive film includes the steps of (1) mixing a metal oxide with a polymer solution; (2) coating a substrate with a solution resulting from step (1), followed by drying the resultant solution to form a film; (3) performing thermal treatment on the film formed in step (2); and (4) sintering the film thermally treated in step (3). The method dispenses with any reducing agent or dispersing agent but allows nanometallic particles to be formed in situ and thereby reduces surface resistance of the polymer film efficiently.
    Type: Grant
    Filed: October 24, 2011
    Date of Patent: September 30, 2014
    Assignee: National Taiwan University
    Inventors: Jiang-Jen Lin, Ying-Nan Chan, Wei-Li Lin
  • Publication number: 20140284077
    Abstract: According to one embodiment, a manufacturing method of an electronic component comprises laminating aluminum plates via a nickel member in at least a part thereof; forming a bus bar having welded portions and non-welded portions by welding part of the laminated aluminum plates and the nickel member at positions; and welding an electrode terminal of an electronic component to the aluminum plates and the nickel member.
    Type: Application
    Filed: September 27, 2013
    Publication date: September 25, 2014
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Tetsuo SAKAI, Naotada Okada
  • Publication number: 20140262499
    Abstract: In some embodiments, a system includes a first portion, a second portion, and a third portion of an electrical conductor. Each portion is electrically coupled to the other two portions. The first, second, and third portions are configured such that substantially no current induced in and/or supplied to the first portion is conducted to the third portion of the electrical conductor. The third portion of the electrical conductor is also thermally coupled to the first and second portions of the electrical conductor. The third portion of the electrical conductor is configured to transfer thermal energy from the first portion of the electrical conductor to an edge portion of the laminated composite assembly.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Applicant: Boulder Wind Power, Inc.
    Inventors: James S. Smith, James D. Duford, Stephane Eisen, James D. Jore, Brian Sullivan
  • Patent number: 8835771
    Abstract: The invention forms a Sn coating layer and a Cu—Sn alloy coating layer having a suitably controllable planar shape in a PCB terminal. A group of Sn coating layers being as a plurality of essentially parallel lines is formed as the surface coating layer, and a Cu—Sn alloy coating layer 2 is exposed on the outermost surface on both sides of Sn coating layers each constituting the group of Sn coating layers. The Sn coating layers have a width of 1 to 500 ?m, an interval between adjacent Sn coating layers is 1 to 20000 ?m, and an outermost maximum height roughness in a terminal insertion direction is at most 10 ?m.
    Type: Grant
    Filed: December 6, 2011
    Date of Patent: September 16, 2014
    Assignee: Kobe Steel, Ltd.
    Inventors: Yasushi Masago, Koichi Taira, Toshiyuki Mitsui, Junichi Kakumoto, Masayasu Nishimura