Composite Patents (Class 174/126.2)
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ELECTRODE ASSEMBLY WITH ELECTRO-CONDUCTIVE POLYMER ENCAPSULATING METALLIC INSERT, AND METHOD THEREOF
Publication number: 20130264096Abstract: An electrode assembly including a shell made of electro-conductive polymeric material in which is embedded a metallic insert such as a thin plate or wire mesh. The insert has a number of surface irregularities such as holes, indentations, or protuberances. The polymeric material shrinks after the insert is encapsulated within the shell resulting in contact pressure being exerted by the material on the irregularities and surrounding surface areas. One method of making the assembly includes coating the insert with a slurry including heat-curable polymeric material, which shrinks when cured. Another method includes encapsulating the insert within molten or liquidized polymeric material, which shrinks when cooled. Contact pressure is permanent because the high temperatures reached during thermosetting or overmolding are never reached while the assembly is being used in applications such as heating or sterilizing water, electrolysis, or oil well drilling.Type: ApplicationFiled: April 5, 2012Publication date: October 10, 2013Inventor: IVANHOE E. CHAPUT -
Patent number: 8533944Abstract: In one embodiment, a method of fabricating a stimulation lead for stimulation of tissue of a patient, the method comprises: providing a plurality of cables, wherein each of the cables comprises a plurality of wires twisted about a core support and disposed within an outer sheath, wherein each of the plurality of wires comprises a coating of insulative material to electrically isolate each wire from each other wire within the respective cable, each of the plurality of wires being disposed in a single layer circumferentially about a central axis of the respective cable; wrapping the plurality of cables about a central core in a helical manner to form a cable assembly.Type: GrantFiled: December 7, 2010Date of Patent: September 17, 2013Assignee: Advanced Neuromodulation Systems, Inc.Inventor: John Swanson
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Publication number: 20130233593Abstract: The invention provides a composite wire for electronic package, the composite wire including an alloy core member and a plating layer forming on a surface of the alloy core member. The alloy core member is silver-palladium alloy. The plating layer is at least one layer of thin film of pure gold, pure palladium or gold-palladium alloy. The invention also provides a method for manufacturing the composite wire. The method includes steps of: (a) providing a wire rod, (b) forming a wire having a predetermined diameter from the wire rod by a plurality of processes including cold working and annealing and (c) forming a plating layer on a surface of the wire rod before step (b) or forming a plating layer on a surface of the wire after step (b) by electroplating, sputtering or vacuum evaporation.Type: ApplicationFiled: February 22, 2013Publication date: September 12, 2013Applicants: WIRE TECHNOLOGY CO., LTD.Inventors: Jun-Der LEE, Hsing-Hua TSAI, Tung-Han CHUANG
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Publication number: 20130233594Abstract: The invention provides a composite wire for electronic package, the composite wire including an alloy core member and a plating layer forming on a surface of the alloy core member. The alloy core member is silver-gold-palladium alloy. The plating layer is at least one layer of thin film of pure gold, pure palladium or gold-palladium alloy. The invention also provides a method for manufacturing the composite wire. The method includes steps of: (a) providing a wire rod, (b) forming a wire having a predetermined diameter from the wire rod by a plurality of processes including cold working and annealing and (c) forming a plating layer on a surface of the wire rod before step (b) or forming a plating layer on a surface of the wire after step (b) by electroplating, sputtering or vacuum evaporation.Type: ApplicationFiled: February 22, 2013Publication date: September 12, 2013Applicants: WIRE TECHNOLOGY CO., LTD.Inventors: Jun-Der LEE, Hsing-Hua Tsai, Tung-Han Chuang
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Publication number: 20130233595Abstract: Disclosed herein is an electrode comprising, a capacitive carbon material located on at least one surface of a thin. The capacitive carbon material typically comprises functionalized ultra-long carbon nanotubes and optionally another carbon allotrope or mixture of carbon allotropes with sufficiently high active surface area. . Methods of forming such electrodes are also disclosed.Type: ApplicationFiled: February 22, 2013Publication date: September 12, 2013Applicant: SELDON TECHNOLOGIES, INC.Inventors: Christopher H. COOPER, Daniel Iliescu, Vardhan Bajpai
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Publication number: 20130224591Abstract: The electrode for a lithium-ion secondary battery of the present invention includes an electrode mixture layer including metal oxide particles having a scaly shape and a new Mohs hardness of 9.0 or more, active material particles capable of intercalating and deintercalating Li, and a resin binder. Further, the lithium-ion secondary battery of the present invention includes a positive electrode, a negative electrode, a nonaqueous electrolyte, and a separator. The positive electrode and/or the negative electrode is the electrode for a lithium-secondary battery of the present invention.Type: ApplicationFiled: February 24, 2012Publication date: August 29, 2013Applicant: HITACHI, LTD.Inventors: Yuko Kishimi, Mitsuhiro Kishimi, Toshiyuki Watanabe
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Publication number: 20130213689Abstract: A bonding wire is provided containing a wire core made of a first material containing a metal and a wire jacket that envelopes the wire core and is made of a second material containing a metal. The wire core and the wire jacket are made of different metals and the bonding wire has an aspect ratio of no more than 0.8. The bonding wire efficiently prevents damage to bonding surfaces during the bonding process and short-circuiting during the use of corresponding sub-assemblies.Type: ApplicationFiled: July 18, 2011Publication date: August 22, 2013Applicant: HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KGInventor: Poh Yoong Kong
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Publication number: 20130206227Abstract: [Object] To provide a transparent conductive film that has sufficiently low sheet resistance and a sufficiently high visible light transmittance, is capable of securing high conductivity on an entire surface thereof, and has excellent corrosion resistance to an electrolyte solution, a method of producing the transparent conductive film, and a photoelectric conversion apparatus and an electronic apparatus using the transparent conductive film. [Solving Means] A transparent conductive film includes a metal fine line network layer 12 and one or more layers of graphene layers 13 provided on at least one surface of the metal fine line network layer 12. The metal fine line network layer 12 includes at least one metal selected from a group consisting of copper, silver, aluminum, gold, iron, nickel, titanium, and platinum. The metal fine line network layer 12 is provided on a transparent substrate 11.Type: ApplicationFiled: October 7, 2011Publication date: August 15, 2013Applicant: Sony CorporationInventors: Keisuke Shimizu, Toshiyuki Kobayashi
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Publication number: 20130209875Abstract: An electrode binder composition is used to produce an electrode used for an electrical storage device, and includes (A) a polymer, (B) a compound represented by the following general formula (1), and (C) a liquid medium, the polymer (A) being fluorine-containing polymer particles or diene polymer particles, and a concentration of the compound (B) in the electrode binder composition being 5 to 500 ppm. wherein R1 and R2 independently represent a hydrogen atom, a halogen atom, or a monovalent alkyl group, and n is an integer from 0 to 5.Type: ApplicationFiled: February 13, 2013Publication date: August 15, 2013Applicant: JSR CORPORATIONInventor: JSR CORPORATION
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Patent number: 8503189Abstract: Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in process of time, an enough strength and resistance to occurrence of whiskers while keeping good wettability of the solder. In the bonded structure, a lead-free Sn—Ag—Bi alloy solder is applied to an electrode through an Sn—Bi alloy layer. The Sn—Bi alloy, preferably, comprises 1 to 20 wt % Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn—Bi alloy layer thereby obtaining an enough bonding strength.Type: GrantFiled: May 4, 2010Date of Patent: August 6, 2013Assignee: Renesas Electronics CorporationInventors: Hanae Shimokawa, Tasao Soga, Hiroaki Okudaira, Toshiharu Ishida, Tetsuya Nakatsuka, Yoshiharu Inaba, Asao Nishimura
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Publication number: 20130192874Abstract: A connecting contact for SM D-components includes a metal material and the metal material at least partially comprises a coating with a different metal material. The connecting contact has a substantially laminar contact area for solderable contact to a board and comprises edge regions. At least one segment of the edge region is at a distance from the laminar contact area, so that a soldered fillet is formed for a soldered contact to a board. Also, a method for producing connecting contacts for SM D-components for solderably contacting a board includes the steps of punching metal strips, bending the metal strips so that a conducting region and a laminar contact area are produced, and forming the edge areas at the laminar contact area. At least one segment of the edge area is at a distance from the laminar contact area.Type: ApplicationFiled: June 29, 2011Publication date: August 1, 2013Applicant: PHOENIX CONTACT GMBH & CO. KGInventors: Dieter Holste, Ulrich Rosemeyer
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Publication number: 20130192873Abstract: This structure body includes a conductor comprising Cu as a main component, an intermediate layer formed on the conductor, and a protective layer formed on the intermediate layer, the intermediate layer includes at least Cu, Sn, Ni, and P, and the protective layer includes at least Ni and P.Type: ApplicationFiled: November 15, 2012Publication date: August 1, 2013Applicant: TDK CORPORATIONInventor: TDK CORPORATION
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Publication number: 20130183581Abstract: An improved substrate is disclosed for an electrode of an electrochemical cell. The improved substrate includes a core material surrounded by a coating. The coating is amorphous such that the coating includes substantially no grain boundaries. The core material may be one of lead, fiber glass, and titanium. The coating may be one of lead, lead-dioxide, titanium nitride, and titanium dioxide. Further, an intermediate adhesion promoter surrounds the core material to enhance adhesion between the coating and the core material.Type: ApplicationFiled: January 13, 2012Publication date: July 18, 2013Applicant: Energy Power Systems LLCInventors: Subhash Dhar, Fabio Albano, Srinivasan Venkatesan, William Koetting, Lin Higley
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Publication number: 20130180757Abstract: A bonding structure of a ball-bonded portion is obtained by bonding a ball portion formed on a front end of a multilayer copper bonding wire. The multilayer copper bonding wire includes a core member that is mainly composed of copper, and an outer layer that is formed on the core member and is mainly composed of at least one noble metal selected from a group of Pd, Au, Ag and Pt. Further, a first concentrated portion of such noble metal(s) is formed in a ball-root region located at a boundary with the copper bonding wire in a surface region of the ball-bonded portion.Type: ApplicationFiled: September 29, 2011Publication date: July 18, 2013Applicants: NIPPON MICROMETAL CORPORATION, NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.Inventors: Tomohiro Uno, Takashi Yamada, Atsuo Ikeda
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Patent number: 8487183Abstract: The invention relates to a contact unit and particularly a solder pin, and a method for producing a contact unit, comprising a body having a metal core and a tin layer surrounding the metal core. The tin layer is thereby designed as a duplex layer, and comprises a radially inner layer overlay of matte tin and a radially outer layer overlay of glossy tin.Type: GrantFiled: May 12, 2009Date of Patent: July 16, 2013Assignee: Phoenix Contact GmbH & Co. KGInventors: Hans-Hilmar Schulte, Christian Helmig, Ulrich Rosemeyer
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Publication number: 20130175071Abstract: A plate-like conductor for a busbar, which is a clad member consisting of two copper layers derived from respective two copper plates clad on respective opposite major surfaces of an aluminum plate, an aluminum layer derived from the aluminum plate and formed integrally with the copper layers, and two alloy layers consisting of aluminum and copper and formed between the aluminum layer and the two copper layers.Type: ApplicationFiled: December 12, 2012Publication date: July 11, 2013Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, SUMITOMO LIGHT METAL INDUSTRIES, LTD., SHINWA INDUSTRY CO., LTD.Inventors: TOYOTA JIDOSHA KABUSHIKI KAISHA, SHINWA INDUSTRY CO., LTD., SUMITOMO LIGHT METAL INDUSTRIES, LTD.
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Publication number: 20130162097Abstract: An electric wire includes a conductive portion 11 made of a material having a volume resistivity higher than that of copper, wherein the volume resistivity of the conductive portion is specified so that, in a frequency range in which the electric wire is used, a ratio of AC resistance of the conductive portion 11 to AC resistance of reference copper wire is less than 1.Type: ApplicationFiled: February 19, 2013Publication date: June 27, 2013Applicant: FUJIKURA LTD.Inventors: Takashi SHINMOTO, Shotaro YOSHIDA, Ning GUAN
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Publication number: 20130161087Abstract: A solder ball device has a contact surface and a solder ball that is connected electrically conductively to the contact surface. Between the solder ball and the contact surface, a conductive polymer is situated, which is connected to the solder ball and the contact surface.Type: ApplicationFiled: December 19, 2012Publication date: June 27, 2013Inventor: Robert ROJAHN
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Patent number: 8466366Abstract: A transparent conductor includes a film of a conductive ceramic. Additives are at least partially incorporated into the film. The additives are at least one of electrically conductive and semiconducting, and at least one of the additives has an aspect ratio of at least 3.Type: GrantFiled: June 28, 2012Date of Patent: June 18, 2013Assignee: Innova Dynamics, Inc.Inventors: Arjun Daniel Srinivas, Matthew R. Robinson, Michael Eugene Young
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Patent number: 8461455Abstract: An elastic electric contact terminal including an elastic foam core having a sheet form, a non-foam rubber coating layer adhered to upper and lower surfaces of the elastic foam core and continued along any one side surface of the elastic foam core, and a heat-resistant polymer film, one side of which is adhered to the non-foam rubber coating layer in an enclosing manner and the other side of which is integrally formed with a metal layer.Type: GrantFiled: July 19, 2010Date of Patent: June 11, 2013Assignee: Joinset Co., Ltd.Inventor: Sun-Ki Kim
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Publication number: 20130140058Abstract: The present disclosure relates to a graphene electrical wire and a method for manufacturing thereof. In particular, the graphene electrical wire includes a metal core having a shape of fiber, and a graphene layer synthesized on the outer surface of the metal core. Also, the method includes the steps of providing a metal core having a shape of fiber, and synthesizing a graphene layer on the outer surface of the metal core.Type: ApplicationFiled: December 5, 2011Publication date: June 6, 2013Inventors: Ki II KIM, Young K. KIM, Sang-Woo KIM
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Publication number: 20130140059Abstract: The present invention introduces a method and a structure for effectively generating spin currents in a metallic electric conductor. When, for example, a conductor manufactured from copper is evenly coated with a thin carbon layer, the internal direction of the magnetic axis, i.e. the spin, of the electrons acting as charge carriers can be polarized in such a way that the spins of the set of electrons align in the area of the interface between carbon and copper. This results in intensive generation of the spin current in the coated conductor. The generation of the spin current enables reduction of losses, shortening of delays relating to signal transfer and improvement of the general immunity to interferences.Type: ApplicationFiled: August 9, 2011Publication date: June 6, 2013Applicant: SPINDECO OYInventors: Petteri Koljonen, Pekka Saastamoinen
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Publication number: 20130133923Abstract: The present invention concerns a high power density carbon composite electrode for electric double layer capacitors, and a method of manufacture of high density electrode consisting of mineral carbon with suitable nanostructures and morphology. The invention describes a statistical model, which makes possible to select and/or develop carbide carbon materials having a great energy and electrical capacity properties used in the manufacture of the carbon composite electrodes. The simultaneous compliance and achievement of all the statistical parameters of the model allows manufacture superior power density electrodes for super capacitor.Type: ApplicationFiled: April 29, 2011Publication date: May 30, 2013Applicant: OÛ SKELETON TECHNOLOGIESInventors: Jaan Leis, Mati Arulepp, Anti Perkson
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Publication number: 20130133924Abstract: To increase a ground contact area in comparison with the conventional jointing by the spot-welding or the conventional fastening by a bolt so that the resistance value at the contacting point is reduced and the voltage of the energy storage device can be effectively supplied without any drop of the voltage. Zn layer 21 or Zn alloy layer, Ni layer 22, and Sn layer 23 or Sn alloy layer are formed on a connecting terminal part 10a of a positive electrode composed of Al by plating. Accordingly, this can solder Cu negative electrode, which is composed of metal that is different species from Al, through Sn layer 23 or Sn alloy layer so that jointing strength of the Al positive electrode and the Cu negative electrode can be enhanced.Type: ApplicationFiled: June 14, 2011Publication date: May 30, 2013Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Katsuji Nakamura, Kaichi Tsuruta, Yuji Ozaki, Shigeaki Watarai, Hidenori Takagi, Yutaka Ohori
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Patent number: 8450612Abstract: A copper clad steel (CCS) wire is at least partially covered on its exterior to visibly distinguish the CCS wire from a pure/solid copper wire. A coating, such as tin, zinc or paint, covers at least portions of the CCS wire. The coating may be applied in strips, rings or a helix to identify the CCS wire as not be formed of solid copper. In the instance of a stranded CCS wire, one or more of the outer strands may be partially or entirely coated to give the overall stranded CCS wire a distinguishing outer structure.Type: GrantFiled: February 12, 2010Date of Patent: May 28, 2013Assignee: CommScope, Inc.Inventors: Robert McEllen, Paul Bedder, David Cady, James Lamb
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Patent number: 8450611Abstract: A connecting wire having an electrically conductive core, preferably provided by a wire or ribbon, with a coating provided on the surface of the core. The coating is composed of a nitrogen-containing tantalum alloy or tungsten alloy, and also optionally contains silicon as an additional alloy component. A manufacturing method for producing such a connecting wire involves passing a wire or ribbon core past a coating source to apply the coating.Type: GrantFiled: October 28, 2009Date of Patent: May 28, 2013Assignee: Heraeus Materials Technology GmbH & Co. KGInventors: Rainer Dohle, Frank Rudolf, Christian Wenzel
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Publication number: 20130126212Abstract: A conductive member includes a metal substrate and a carbon-based substrate (CBS) network applied to the metal substrate. The CBS network includes a framework of fibers and particulates embedded in the framework that provide cathodic protection for the metal substrate. The particulates may penetrate entirely through the framework. The particulates may be iron particulates. The particulates may be metal particulates having a higher corrosion potential than the metal substrate. The CBS network may be a yarn, a sheet, or a tape. The CBS network with the particulates may be applied by coating or plating the metal substrate with the CBS network.Type: ApplicationFiled: July 23, 2012Publication date: May 23, 2013Applicant: Tyco Electronica CorporationInventors: Rodney Ivan Martens, Andrew Nicholas Loyd, Jessica Henderson Brown Hemond, Zhengwei Liu
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Patent number: 8445788Abstract: A conductive wire includes a metallic wire substrate having a diameter and a surface, and a coating material having a plurality of carbon nanotubes dispersed therein. The coating material is operable to adhere a portion of the carbon nanotubes to the surface of the wire. The coating material has higher specific conductivity than the metallic wire substrate and also has a low contact resistance with the metallic wire substrate.Type: GrantFiled: May 10, 2010Date of Patent: May 21, 2013Assignee: The Boeing CompanyInventors: Thomas K. Tsotsis, James P. Huang, Namsoo P. Kim, Keith D. Humfeld, William L. Mitchael, Brad D. Mecham
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Publication number: 20130118775Abstract: The present invention relates to a method of forming copper nanowires with a metallic coating. In a preferred embodiment, the metallic coating is copper. Due to the metal coating, the nanowires become magnetically guidable and chemically stable. As such, the nanowires can be used to form nanomesh. Further, the nanowire and nanomesh of the present invention can be used as transparent electrodes that are used in TV, PC, touch-control, and solar industries.Type: ApplicationFiled: July 19, 2011Publication date: May 16, 2013Applicant: NATIONAL UNIVERSITY OF SINGAPOREInventors: Hua Chun Zeng, Shengmao Zhang, Yu Chang, Mei Ling Lye
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Publication number: 20130105198Abstract: A conductive rubber component (10) of the present invention includes a metal coating (2) formed on at least one surface located perpendicular to a compression direction of a conductive rubber single body (1) by atomic and/or molecular deposition, and can be surface mounted and soldered. In a method for mounting a conductive rubber component (10) of the present invention, the conductive rubber component (10) is surface mounted on a wiring layer (8) on a printed wiring board (9) and is fixed by a solder layer (7) thereto and thereby is incorporated to electrically connect the printed circuit board (9) and an electronic component (11) to each other.Type: ApplicationFiled: May 18, 2011Publication date: May 2, 2013Applicant: FUJI POLYMER INDUSTRIES CO., LTD.Inventors: Toshiki Ogawa, Masakazu Koizumi
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Publication number: 20130105195Abstract: A conductor for a communications cable includes an elongated metal wire and a metal sheet that includes a plurality of carbon nanotubes that at least partially surrounds the elongated metal wire. The metal wire may include copper, and the metal sheet may likewise include copper and may be welded to an outside surface of the metal wire to surround the metal wire. This conductor may be used in a variety of communications cables that carry high frequency signals.Type: ApplicationFiled: April 13, 2012Publication date: May 2, 2013Inventor: Luc Walter Adriaenssens
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Publication number: 20130098659Abstract: A pre-plated lead frame comprises a substrate comprising copper or a copper alloy which has a first side and a second side opposite to the first side. A first plating layer comprising nickel is plated on the first and second sides of the substrate and a second plating layer comprising palladium is plated onto the first plating layer on the first and second sides of the substrate. A third plating layer comprising gold is then plated onto the second plating layer on the second side of the substrate, the third plating layer on the second side of the substrate having a thickness of more than 3 nm. On the first side of the substrate, there is either no gold plated onto the second plating layer, or a third plating layer comprising gold plated onto the second plating layer which has a thickness of 1.5 nm or less.Type: ApplicationFiled: October 23, 2012Publication date: April 25, 2013Inventors: Yiu Fai KWAN, Ching Man TSUI, Say Teow CHAN, Yu Lung LAM, Tat Chi CHAN
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Patent number: 8426742Abstract: The connection reliability of connecting terminals with displacement gold plating films is improved by connecting terminals comprising a conductive layer, an electroless nickel plating film, a first palladium plating film which is a displacement or electroless palladium plating film with a purity of 99% by mass or greater, a second palladium plating film which is an electroless palladium plating film with a purity of at least 90% by mass and less than 99% by mass, and a displacement gold plating film, wherein the electroless nickel plating film, the first palladium plating film, the second palladium plating film and the displacement gold plating film are laminated in that order on one side of the conductive layer, and the displacement gold plating film is situated on the uppermost surface layer on the opposite side from the conductive layer.Type: GrantFiled: April 23, 2008Date of Patent: April 23, 2013Assignee: Hitachi Chemical Company, Ltd.Inventors: Yoshinori Ejiri, Shuichi Hatakeyama, Shigeharu Arike, Kiyoshi Hasegawa
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Patent number: 8420941Abstract: An electrically conductive ribbon, which is soldered on an electrically conductive busbar of a photovoltaic panel, includes a cooper core and a tin based solder. The tin based solder fully wraps an outer surface of the cooper core, and has a convex solder surface, which has a first curvature to be fitted with a second curvature of a concave solder surface of the electrically conductive busbar.Type: GrantFiled: May 19, 2010Date of Patent: April 16, 2013Assignee: Gintech Energy CorporationInventors: Chen-Chan Wang, Kuei-Wu Huang, Nai-Tien O, Tien-Szu Chen, Ching-Tang Tsai, Kai-Sheng Chang, Hua-Hsuan Kuo, Chi-Cheng Lee, Yu-Chih Chan
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Publication number: 20130087364Abstract: A foil conductor for flat cells includes a contact zone for contact with further cells or busbars, an adhesion zone for adhesive bonding with a packaging foil of a cell, and a connection zone for connection to an electrode foil within the cell. At least two of the zones have a surface composition differing from each other.Type: ApplicationFiled: April 12, 2011Publication date: April 11, 2013Applicant: Daimler AGInventors: Frank Blome, Roland Weixler
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Publication number: 20130081855Abstract: A composite material includes a metal matrix of a metal and a reducing agent. The reducing agent is dispersed in the metal matrix and is capable of reducing an oxide of the metal at room temperature.Type: ApplicationFiled: September 28, 2012Publication date: April 4, 2013Applicant: DENSO CORPORATIONInventor: Denso Corporation
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Patent number: 8410367Abstract: Provided is an electric contact member which reduces, to the utmost, peel-off of a carbon film that is caused at the time of use of the electric contact member having at least an edge to keep stable electric contact over a long period of time. Disclosed is an electric contact member which repeatedly contacts with a device under test at a tip part of the electric contact member in which the tip part has an edge, the electric contact member comprising: a base material; an underlying layer comprising Au, Au alloy, Pd or Pd alloy, which is formed on a surface of the base material of the tip part; an intermediate layer which is formed on a surface of the underlying layer; and a carbon film comprising at least one of a metal and a carbide thereof which is formed on a surface of the intermediate layer, wherein the intermediate layer has a lamination structure comprising: an inner layer comprising Ni or Ni alloy; and an outer layer comprising at least one of Cr, Cr alloy, W and W alloy.Type: GrantFiled: September 30, 2010Date of Patent: April 2, 2013Assignees: Kobe Steel, Ltd., Kobelco Research Institute, Inc.Inventors: Takayuki Hirano, Akashi Yamaguchi, Takashi Miyamoto
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Publication number: 20130075778Abstract: According to one embodiment, a light-transmitting metal electrode includes a metal layer. The metal layer is provided on a major surface of a member and includes a metal nanowire and a plurality of openings formed with the metal nanowire. The thin layer includes a plurality of first straight line parts along a first direction and a plurality of second straight line parts along a direction different from the first direction. A maximum length of the first line parts along the first direction and a maximum length of the second line parts along the direction different from the first direction are not more than a wave length of visible light. A ratio of an area of the metal layer viewed in a normal direction of the surface to an area of the metal layer viewed in the normal direction is more than 20% and not more than 80%.Type: ApplicationFiled: February 28, 2012Publication date: March 28, 2013Inventors: Tsutomu NAKANISHI, Akira FUJIMOTO, Ryota KITAGAWA, Kumi MASUNAGA, Kenji NAKAMURA, Koji ASAKAWA, Shinji NUNOTANI, Takanobu KAMAKURA
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Publication number: 20130075381Abstract: A textile electrode material comprises an electrically conductive textile sheet material having a first sheet resistance. According to the invention the electrical properties of at least one specific region of said textile sheet material are modified with respect to the other regions so that in said specific region the textile electrode has a second sheet resistance, which is substantially lower than said first sheet resistance.Type: ApplicationFiled: March 28, 2011Publication date: March 28, 2013Applicant: IEE INTERNATIONAL ELECTRONICS & ENGINEERING S.A.Inventor: Thomas Wittkowski
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Patent number: 8395052Abstract: The present invention aims to provide conductive particles which can reduce the stress while maintaining high hardness (hardly causing cracks even in a state of being crushed in connection process) by improving rolling properties and can ensure adequate conductive reliability not only with respect to ITO substrates, but also with respect to IZO substrates, an anisotropic conductive film provided with the conductive particles, a joined structure provided with the anisotropic conductive film, and a joining method using the anisotropic conductive film. The conductive particles of the present invention include polymer fine particles, and a conductive layer formed on surfaces of the polymer fine particles, wherein an outermost surface shell of the conductive layer is a nickel-palladium alloy layer.Type: GrantFiled: December 22, 2010Date of Patent: March 12, 2013Assignee: Dexerials CorporationInventors: Tomoyuki Ishimatsu, Hiroki Ozeki, Hiroshi Hamachi
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Publication number: 20130056851Abstract: A metal oxide bilayer second electrode for a MIM DRAM capacitor is formed wherein the layer of the electrode that is in contact with the dielectric layer (i.e. bottom layer) has a desired composition and crystal structure. An example is crystalline MoO2 if the dielectric layer is TiO2 in the rutile phase. The other component of the bilayer (i.e. top layer) is a sub-oxide of the same material as the bottom layer. The top layer serves to protect the bottom layer from oxidation during subsequent PMA or other DRAM fabrication steps by reacting with any oxygen species before they can reach the bottom layer of the bilayer second electrode.Type: ApplicationFiled: October 31, 2012Publication date: March 7, 2013Applicants: ELPIDA MEMORY, INC, INTERMOLECULAR, INC.Inventors: Intermolecular, Inc., Elpida Memory, Inc.
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Publication number: 20130056241Abstract: By selecting different materials for each layer, a multi-layered electrode structure can be made with superior performance characteristics. For example, a multilayered electrode can include a high tensile strength tungsten core, a conductive intermediate palladium, palladium-nickel, or other platinum group metal layer for generating a corona discharge, and a hardened layer comprising rhodium or other platinum group metal or alloy of the same to resist frictional abrasion during removal of silica dendrites that accumulate on the electrode surface during operation.Type: ApplicationFiled: November 22, 2011Publication date: March 7, 2013Applicant: TESSERA, INC.Inventors: Guilian Gao, Nels Jewell-Larsen, Giles Humpston
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Patent number: 8389860Abstract: A bonding wire for semiconductor devices includes a core member formed of an electrically-conductive metal, and a skin layer mainly composed of a face-centered cubic metal different from the core member and formed thereon. An orientation ratio of <100> orientations in crystalline orientations <hkl> in a wire lengthwise direction at a crystal face of a surface of the skin layer is greater than or equal to 50%, and the <100> orientations have an angular difference relative to the wire lengthwise direction. The angular difference is within 15 degrees.Type: GrantFiled: December 3, 2008Date of Patent: March 5, 2013Inventors: Tomohiro Uno, Keiichi Kimura, Takashi Yamada
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Publication number: 20130048340Abstract: An electrode includes: an electrode plate; a conductive layer formed on the electrode plate; and an active material layer formed continuously on the electrode plate and on the conductive layer, and the electrode plate includes an uncoated region where a surface of the electrode plate is exposed.Type: ApplicationFiled: August 2, 2012Publication date: February 28, 2013Applicant: GS Yuasa International Ltd.Inventors: Toshinori BANDO, Yoshikatsu OHTANI, Kazuya OKABE
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Publication number: 20130048337Abstract: A cable includes a jacket surrounding a core and a carbon-based substrate (CBS) conductor in the core. The CBS conductor includes a CBS network and an organometallic filler, wherein the organometallic filler combines with the CBS network to form a composite conductor having a higher conductivity than the CBS network. Optionally, the CBS network may include carbon nanotube (CNT) fibers with the organometallic fillers being disposed within the CNT fibers. The organometallic fillers may include at least one of palladium glycolate, glycolic acid, glyoxyllic acid or methanol. A method for manufacturing a carbon-based substrate (CBS) conductor, such as for a cable, includes providing a CBS network of CBS fibers forming a framework, introducing an organometallic compound, and reacting the CBS network with the organometallic compound to form a composite conductor. The method may include immersing the CBS network in an organometallic bath having organometallic particles in a solvent.Type: ApplicationFiled: August 24, 2011Publication date: February 28, 2013Applicant: TYCO ELECTRONICS CORPORATIONInventors: JESSICA HENDERSON BROWN HEMOND, ROBERT DANIEL HILTY
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Publication number: 20130043057Abstract: An electrode for a power storage device with good cycle characteristics and high charge/discharge capacity is provided. In addition, a power storage device including the electrode is provided. The electrode for the power storage device includes a conductive layer and an active material layer provided over the conductive layer, the active material layer includes graphene and an active material including a plurality of whiskers, and the graphene is provided to be attached to a surface portion of the active material including a plurality of whiskers and to have holes in part of the active material layer. Further, in the electrode for the power storage device, the graphene is provided to be attached to a surface portion of the active material including a plurality of whiskers and to cover the active material including a plurality of whiskers. Further, the power storage device including the electrode is manufactured.Type: ApplicationFiled: August 15, 2012Publication date: February 21, 2013Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.Inventors: Teppei Oguni, Takeshi Osada, Toshihiko Takeuchi
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Publication number: 20130037307Abstract: The present invention relates to a method for modifying a surface of a solid conducting material, which comprises a step (E), in which a potential difference is applied between this surface and a surface of another conducting solid material positioned facing it, and wherein, simultaneously, said surface (S) is put into contact with a liquid medium comprising in solution triarylamines (I): while subjecting these triarylamines (I) to electromagnetic radiation, least partly converting them at into triarylammonium radicals. The invention also relates to a conducting device comprising two conducting metal materials, the surfaces of which, (S) and (S?) respectively, are electrically interconnected through an organic material comprising conducting fibrillar organic supramolecular species comprising an association of triarylamines of formula (I).Type: ApplicationFiled: March 15, 2012Publication date: February 14, 2013Applicant: Universite de StrasbourgInventors: Nicolas GIUSEPPONE, Jean-François Dayden, Vina Faramarzi, Emilie Moulin, Frederic Niess, Bernard Doudin
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Publication number: 20130034803Abstract: Elongated noble-metal nanoparticles and methods for their manufacture are disclosed. The method involves the formation of a plurality of elongated noble-metal nanoparticles by electrochemical deposition of the noble metal on a high surface area carbon support, such as carbon nanoparticles. Prior to electrochemical deposition, the carbon support may be functionalized by oxidation, thus making the manufacturing process simple and cost-effective. The generated elongated nanoparticles are covalently bound to the carbon support and can be used directly in electrocatalysis. The process provides elongated noble-metal nanoparticles with high catalytic activities and improved durability in combination with high catalyst utilization since the nanoparticles are deposited and covalently bound to the carbon support in their final position and will not change in forming an electrode assembly.Type: ApplicationFiled: September 21, 2012Publication date: February 7, 2013Applicant: Brookhaven Science Associates, LLC/Brookhaven National LaboratoryInventor: Brookhaven Science Associates, LLC/Brookhaven
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Publication number: 20130025366Abstract: A method for producing a conductive segment, includes: a step of printing a metal conductive paste on a substrate, and drying the paste; a step of printing other metal conductive paste on the metal conductive paste after drying, and drying the paste; and a step of burning the metal conductive paste after drying and the other metal conductive paste after drying, wherein the conductive metal paste is an Ag—Pd conductive paste comprising silver (Ag) and palladium (Pd), and the other metal conductive paste is an Au conductive paste comprising gold (Au) as a main component; or the metal conductive paste is an Au conductive paste comprising gold (Au) as a main component, and the other metal conductive paste is an Ag—Pd conductive paste comprising silver (Ag) and palladium (Pd).Type: ApplicationFiled: July 23, 2012Publication date: January 31, 2013Applicant: YAZAKI CORPORATIONInventors: Toshio OIKE, Kenichi TANAKA, Ryo HIROSE, Takafumi SHIMIZU
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Publication number: 20130020877Abstract: At least one graphene layer is formed to laterally surround a tube so that the basal plane of each graphene layer is tangential to the local surface of the tube on which the graphene layer is formed. An electrically conductive path is provided around the tube for providing high conductivity electrical path provided by the basal plane of each graphene layer. The high conductivity path can be employed for high frequency applications such as coupling coils for wireless power transmission to overcome skin depth effects and proximity effects prevalent in high frequency alternating current paths.Type: ApplicationFiled: June 19, 2012Publication date: January 24, 2013Applicant: UT-BATTELLE, LLCInventor: John M. Miller