Abstract: The present invention provides a bonding wire improved in formability of a ball part, improved in bondability, good in loop controllability, improved in bonding strength of a wedge connection, securing industrial production ability as well, and mainly comprised of copper which is more inexpensive than gold wire, that is, provides a bonding wire for a semiconductor device comprised of a bonding wire having a core material having copper as its main ingredient and a surface covering layer over the core material and of a conductive metal of a composition different from the core material, characterized in that the surface covering layer has as its main ingredients two or more types of metals selected from gold, palladium, platinum, rhodium, silver, and nickel and the surface covering layer has a concentration gradient of one or both of a main ingredient metal or copper in the wire radial direction.

Abstract: The provided is a technology for forming a circuit for wiring, which can show a lower resistance, and particularly proposes a laminated film for wiring, which can surely decrease wiring resistance even in a large-sized liquid crystal display. The laminated film for wiring according to the present invention is characterized in that the laminated film for wiring comprises a metal layer with low resistance and an Al—Ni-based alloy layer containing 0.5 at % to 10.0 at % Ni laminated thereon. The metal layer with low resistance contains at least one or more elements among Au, Ag, Cu and Al, and has a specific resistance of 3 ??·cm or less.

Abstract: Methods of forming transparent conducting oxides and devices formed by these methods are shown. Monolayers that contain indium and monolayers that contain molybdenum are deposited onto a substrate and subsequently processed to form molybdenum-doped indium oxide. The resulting transparent conducing oxide includes properties such as an amorphous or nanocrystalline microstructure. Devices that include transparent conducing oxides formed with these methods have better step coverage over substrate topography and more robust film mechanical properties.

Abstract: A conductor of an electric cable for wiring, containing a copper alloy material containing 1.0 to 4.5 mass % of Ni, 0.2 to 1.1 mass % of Si, and the balance of Cu and unavoidable impurities, in which the copper alloy material has an average grain diameter of 0.2 to 5.0 ?m.

Abstract: A solder construction carrier device for connecting electrical components including a carrier with a plurality of compartments and a solder construction disposed in each of the plurality of compartments. Each solder construction includes a conductive wire and a solder component disposed adjacent to the conductive wire.

Abstract: An electrical cable with a section diameter at most equal to 2 mm includes a plurality of strands extending in the longitudinal direction of the cable. The strands are twisted to form a stranded conductor. Only certain strands of the stranded conductor are of electrically conductive material, for example copper, the remaining strands are of non-conductive material, such as polyamide, high strength polyester or a polyetherimide.

Abstract: Electrical connectivity devices for railway systems are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.

Abstract: A metal-ceramic composite substrate having excellent heat dissipation and a method of manufacturing such a metal-ceramic composite substrate at low cost are disclosed. A metal-ceramic composite substrate (10) comprises a metal substrate (11), a ceramic layer (12) formed on the metal substrate (11), an electrode layer (13) formed on the ceramic layer (12) and a solder layer (14) formed on the electrode layer (13) wherein the ceramic layer (12) is in the form of a thin film of a ceramic. Forming the ceramic layer (12) in the form of a thin film of aluminum nitride provides a metal-ceramic composite substrate (10) of excellent heat dissipating property for an electronic circuit.

Abstract: The present invention provides a conductive resin composition that comprises a complex of poly(3,4-dialkoxythiophene) and a polyanion, wherein the complex has a conductivity of 0.30 S/cm or more. This composition is preferably used for production of a conductive film having a conducting layer made of the composition, and the resulting conductive film is preferably used in a resistive-type film switch.

Abstract: A core for an electrical conductor. The core includes an inner core component, an intermediate cladding component and an outer cladding component. The inner core component comprises a plurality of glass based stranded members in a first resin matrix. The intermediate cladding component surrounds the inner core component and comprises a plurality of carbon stranded members in a second resin matrix. The outer cladding component surrounds the intermediate cladding component and comprises a plurality of glass based stranded members in a third resin matrix. The first resin matrix and the second resin matrix are substantially independent of each other, meeting at a boundary. An electrical conductor as well as a manufacturing method is likewise disclosed.

Abstract: The black bus electrode of plasma display panel is formed from a conductive composition comprising a conductive powder, glass powder, organic binder, organic solvent, and black pigment, wherein the conductive powder is platinum particle or gold particle.

Abstract: A multi-layer pillar and method of fabricating the same is provided. The multi-layer pillar is used as an interconnect between a chip and substrate.

Abstract: A composite conductive film and a semiconductor package using such film are provided. The composite conductive film is formed of a polymer-matrix and a plurality of nano-sized conductive lines is provided. The composite conductive film has low resistance, to connect between a fine-pitch chip and a chip in a low temperature and low pressure condition. The conductive lines are parally arranged and spaced apart from each other, to provide anisotropic conductivity.

Abstract: A wiring structure includes a substrate, a copper oxide layer having 16˜39 at % oxygen on the substrate and a copper layer on the copper oxide layer. The copper oxide layer has a thickness of 10-1000 ? and the copper layer has a thickness of 300-8000 ?. The copper layer and the copper oxide layer further have an alloy element less than 10 wt % and the alloy element is selected from the group of Ag, Ni, Mg, Zr, N.

Abstract: A wire-harness use composite wire comprising a first element wire which comprises 0.01-0.25 mass % C, 0.01-0.25 mass % N, 0.5-4.0 mass % Mn, 16-20 mass % Cr,8.0-14.0 mass % Ni, and the balance of Fe and impurities and satisfies that a C+N content is in the range of 0.15 mass %?C+N?0.30 mass %, and a second element wire comprising at least one material selected from the group consisting of copper, copper alloy, aluminum, and aluminum alloy, the first element wire and the second element wire being twisted together.

Abstract: An EDM wire having an outer coating of gamma phase brass with an overlayer of continuous unalloyed zinc or ductile epsilon phase brass entrapping the gamma phase and a process for manufacturing the EDM wire is provided. A second process for synthesizing a ductile epsilon phase brass coating on the aforementioned and other substrates is also provided. The first process includes coating a copper bearing metallic core with zinc. The zinc coating is then converted to gamma phase brass via a diffusion anneal and subsequently re-coated with zinc prior to being cold drawn to its finish diameter. The process of converting a zinc coating to a ductile epsilon phase brass includes heat treating the wire at a temperature low enough to minimize or eliminate changes in the mechanical properties of the composite wire.

Abstract: A multilayer structure including a transparent conductive thin film and a molybdenum metal thin film, the transparent conductive thin film having a thickness of 35 nm or less.

Abstract: An electrode structure body of the present invention is composed of a metal electrode, and a solder alloy layer (a tin/nickel alloy layer) formed on a surface of the metal electrode. The solder alloy layer is obtained by reflow-heating the solder layer formed on the metal electrode and then removing the solder layer. This electrode structure body can be applied to an external connection electrode of an electronic component or a mounting substrate.

Abstract: A UBM pad has a first material layer which has a first material, and a second material layer which has a second material and represents an end layer or is arranged between an end layer and the first material layer. The first material and the second material exhibit properties with regard to a solder material that the presence of the second material prevents any metallurgical reactions of the first material with the solder material in the entire temperature range of connecting and of the operation of the structured electronic device which are detrimental to the reliability of the overall joint.

Abstract: A wave-powered water vehicle includes a surface float, a submerged swimmer, and a tether which connects the float and the swimmer, so that the swimmer moves up and down as a result of wave motion. The swimmer includes one or more fins which interact with the water as the swimmer moves up and down, and generate forces which propel the vehicle forward. The vehicle, which need not be manned, can carry communication and control equipment so that it can follow a course directed by signals sent to it, and so that it can record or transmit data from sensors on the vehicle.

Abstract: In a composite body, a frame body to be connected to a first major surface of a substrate body includes a frame member made of an insulating material and a plurality of connection members formed by bending thin metal plates. The frame member includes a through-hole at the approximate center thereof and extends along a peripheral portion of the first major surface of the substrate body so as to define a frame shape. Each of the plurality of connection members has a first strip and a second strip continuously connected to opposed ends of a middle strip. The connection members are disposed in the frame member so as to face each other with the through-hole therebetween. Each of the first strip and the second strip of the connection member is exposed on a corresponding one of the two major surfaces extending around the through-hole of the frame member.

Abstract: The present invention discloses a self-assembled monolayer with a general formula G1-R-G2, wherein G1 is SH. R of the mentioned general formula comprises one or any combination selected from the group consisting of the following: unsubstituted linear, branched, or cyclic alkyl moiety; single or multi-substituted linear, branched, or cyclic alkyl moiety with substituent selected from the group consisting of alkene and alkyne; aromatic group; multiple fused ring group; and multiple fused ring group with heteroatoms. G2 is an electron-withdrawing group.

Abstract: A piezo-ceramic device is attached to the power wire of an engine to facilitate cleaner burning of fuel and improve to improve fuel consumption. In the presence of an electrical field around the power wire, the device directs acoustical energy of a subsonic frequency towards the combustion chamber which acts to ionize the fuel and impart a thrust on the piston.

Abstract: A terminal for an engaging type connector includes a punched Cu alloy strip as a base material, a coating formed on the Cu alloy strip by postplating processes and including a Sn layer, and a Cu—Sn alloy layer sandwiched between the base material and the Sn layer. The Sn layer is smoothed by a reflowing process. The terminal has an engaging part and a solder-bonding part, and the surface of a part of the base material corresponding to the engaging part has a surface roughness higher than that of the surface of the base material corresponding to the solder-bonding part. The engaging part has a low frictional property and the solder-bonding part has improved solder wettability.

Abstract: Composite transparent conductors are described, which comprise a primary conductive medium based on metal nanowires and a secondary conductive medium based on a continuous conductive film.

Abstract: Aircraft structures and avionics are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.

Abstract: A method for manufacturing an electronic component includes: a step of temporarily bonding a substrate to a support plate with an adhesive sheet; a step of forming a cut groove for dividing the substrate into individual chips by providing the substrate with a cut extending in the thickness direction from a second surface side, located opposite the first surface side, to a certain part of the support plate; a step of forming a continuous electrode on the second surface and on a peripheral surface located inside the cut groove, of each of the chips by sputtering, for example; and a step of detaching the chips from the support plate. An electrode on the first surface of the substrate may be formed prior to the temporary bonding step, and the electrode formed on the peripheral surface may be connected to the electrode on the first surface.

Abstract: An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting composition including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components.

Abstract: Copper clad wire for ballast of fluorescent lamps is disclosed as having a core wire of a lower priced metal core than copper and a copper coating fixed on the core wire by means of a thin diffusion layer.

Abstract: The invention relates to a method for preventing siphoning effect in a terminal. The terminal of the invention comprises a conductive portion connected to an external component by a solder and a connecting portion extended to form the conductive portion. An exposed and easily oxidized copper is attached on the surface of the connecting portion, and the copper can be further oxidized to form oxide of copper. Since the copper is attached on the connecting portion of the terminal, and the copper can be oxidized to form oxide of copper, the oxide of copper, such as copper oxide, can prevent the siphoning of the solder from the conductive portion to the connecting portion during the soldering process. Accordingly, the solder can be saved, and the phenomenon of false welding can be avoided, such that the quality of soldering can be maintained well and the production cost can be reduced.

Abstract: A solar cell electrode wire includes a core material having a volume resistivity of not greater than about 2.3 ??·cm and a proof strength in the range of about 19.6 MPa to about 85 MPa, and a hot-dip solder plating layer disposed on a surface of the core material. The core material is preferably an annealed pure copper material having an oxygen content of not higher than about 20 ppm. The core material may be a clad material including an interlayer of aluminum and copper layers disposed on opposite surfaces of the interlayer.

Abstract: A conductor cable includes an inner portion and a conductive coating. The inner portion is formed of a metal/ceramic composite. The conductive coating is coated on the inner portion.

Abstract: A protruding electrodes is formed on a lead electrode of an electronic component, and the protruding electrodes comprises a first conductor formed on the lead electrode of the electronic component, and a second conductor overlaid on the first conductor by using a transfer mold having a concavity. By virtue of this structure, protruding electrodes of any configuration can be formed in fine pitches.

Abstract: A contact pin includes a base material composed of a material having a conductive property and an outermost surface layer made of a material into which Sn is dissolved and diffused by applying heat.

Abstract: An electrical connector including a base pad formed of aluminum and having a bottom surface. An electrical contact can be connected to the base pad. A layer of copper can be on the bottom surface of the base pad.

Abstract: A lightweight composite electrical wire having a fusible core encased or enclosed by a conductive wall. In embodiments the core is sodium, and the wall is aluminum. In another embodiment the wall is a curved bimetallic wall having a first wall component having a high CTE and a second wall component having a low CTE such that changes in temperature will generate stresses that tend to change the shape of the wall, wherein a break in a heated wire will cause retraction of the core. Transverse bulkheads separate the core longitudinally, precluding or mitigating any loss of core material in accident scenarios, and providing locations for cutting and connecting the conductor. The bulkheads may include indentations. A insulative outer layer is provided. A novel outer layer construction utilizes fusible materials to provide insulation in accident scenarios.

Abstract: A lightweight insulated electric wire and an automobile wire harness using the same insulated electric wire where the insulated electric wire has a conductor portion including one or more first wires and one or more second wires, which are stranded together. The first wires are constituted by metal wires made from at least one type of metal selected from copper, copper alloy, aluminum and aluminum alloy. The second wires are constituted by metal wires different from the first wires and have a relative permeability of 4.0 or less.

Abstract: A conductor obtained by connecting a plurality of superconductors by normal conductivity or a conductor including superconductors and normal conductors, said low resistance conductor using superconductors characterized in that an apparent specific resistance of said conductor at below a superconducting transition temperature of said superconductors is lower than the specific resistance of copper at that superconducting transition temperature.

Abstract: A conductor obtained by connecting a plurality of superconductors by normal conductivity or a conductor comprised of superconductors and normal conductors, said low resistance conductor using superconductors characterized in that an apparent specific resistance of said conductor at below a superconducting transition temperature of said superconductors is lower than the specific resistance of copper at that superconducting transition temperature.

Abstract: An electrical cable and method of making, the method comprising: providing a litz cable having a plurality of electrical conductors; electrically coupling at a first end of the litz cable a subset of the electrical conductors to produce a first coupled subset leaving an uncoupled remainder of the electrical conductors; and electrically coupling at a second end of the litz cable the uncoupled remainder of the electrical conductors to produce a second coupled subset.

Abstract: Composites comprising porous polymeric membrane films meeting the following equation: 75 MPa<(longitudinal membrane tensile modulus+transverse membrane tensile modulus)/2, wherein at least a portion of the porosity of the membrane is imbibed with resin and methods for making the same. The composites have unusually high resistance to fracture and catastrophic failure.

Abstract: Composites comprising porous polymeric membrane films meeting the following equation: 75 MPa<(longitudinal membrane tensile modulus+transverse membrane tensile modulus)/2, wherein at least a portion of the porosity of the membrane is imbibed with resin and methods for making the same. The composites have unusually high resistance to fracture and catastrophic failure.

Abstract: A fence tape, rope or wire for transmitting an electric current to an animal that touches the fence tape, rope or wire, having a support structure and an electrically conductive conduction structure (3). The conduction structure (3) has different electrically conductive materials having mutually distinctive electrical and mechanical properties. One of the materials has a better electrical conductivity. The other material has a greater resistance to tensile and bending loads. The conduction structure (3) contains at least one composite filament having, viewed in cross section, a conduction zone (4) from the electrically better conducting material and a self-supporting support zone (5) from the better material as to tensile and bending loadability. Mechanical loading of the electrically better conductive material is limited and an electrically conductive bridge is even maintained if an interruption of the electrically better conductive material occurs.

Abstract: A gold wire having a non-pure gold core member and a layer of pure gold coating covering the non-pure gold core member. The fabrication method of the gold wire includes the procedures of (1) selecting a non-pure gold wire rod, (2) gold-plating the non-pure gold wire rod with a layer of pure gold coating of thickness about 10˜100 &mgr;in, (3) drawing the pure gold-coated wire rod into a gold wire of thickness about 40˜4000 &mgr;in, (4) examining the material properties of the gold wire so as to obtained the desired finished product.

Abstract: The invention relates to electrodes for organic components, particularly for components such as field effect transistors (OFET's) and/or light-emitting diodes (OLED's), which have conductive and highly resolved finely structured electrode tracks. The electrode and/or conductor track are/is produced by treating a conductive or non-conductive layer comprised of an organic functional polymer with a chemical compound since, at the point of contact, the chemical compound deactivates or activates the layer comprised of an organic functional polymer, i.e. renders it conductive or non-conductive. The non-conductive regions of the layer can be removed.

Abstract: Earth conductor for earthing systems of electrostatic separator, consisting of an electrically conductive core with a plastic or rubber sheath. In order to prevent the passage of liquid, the earth conductor consists of two conductor parts, the conductor parts are connected via a liquid-tight graphite piece, to which sections of the conductor parts are fixed, and the graphite piece and the sections of the conductor parts are embedded in a plastic body.

Abstract: A conductor obtained by connecting a plurality of superconductors by normal conductivity or a conductor comprised of superconductors and normal conductors, said low resistance conductor using superconductors characterized in that an apparent specific resistance of said conductor at below a superconducting transition temperature of said superconductors is lower than the specific resistance of copper at that superconducting transition temperature.

Abstract: This invention provides a composite conductor having excellent strength, flexing resistance and corrosion resistance, a production method thereof and a cable employing the same composite conductor. A corrosion resistant layer is formed of Au, Ag, Sn, Ni, solder, Zn, Pd, Sn—Ni alloy, Ni—Co alloy, Ni—P alloy, Ni—Co—P alloy, Cu—Zn alloy, Sn—Bi alloy, Sn—Ag—cu alloy, Sn—Cu alloy or Sn—Zn alloy in the thickness of 0.5 &mgr;m or more on an external periphery of a core made of copper-metal fiber conductor. A wire material made of the copper-metal fiber conductor is subjected to area reduction processing. In the middle of the area reduction processing or after the area reduction processing is completed, corrosion resistant layer is formed on the periphery of the wire material in the thickness of 0.

Abstract: A conductor obtained by connecting a plurality of superconductors by normal conductivity or a conductor comprised of superconductors and normal conductors, said low resistance conductor using superconductors characterized in that an apparent specific resistance of said conductor at below a superconducting transition temperature of said superconductors is lower than the specific resistance of copper at that superconducting transition temperature.

Abstract: In a process for manufacturing a conductive wire that is suitable for use in semiconductor packages, a core wire of an extensible metal other than gold is first prepared to have a diameter ranging from 300 &mgr;m to 500 &mgr;m. Thereafter, a gold-containing outer layer having a thickness ranging from 2.5 &mgr;m to 25 &mgr;m is plated onto an outer surface of the core wire so as to form a gold-plated core wire. Subsequently, the gold-plated core wire is drawn to result in the conductive wire having a diameter ranging from 1 &mgr;m to 50 &mgr;m.