Abstract: A heat exchanger includes a pair of opposed, spaced apart heat exchanger plates defining a heat exchanger volume therebetween having an inlet and opposed outlet. A plurality of heat exchanger ribs are included within the heat exchanger volume. Each rib defines a rib body spanning the heat exchanger volume. Each rib body includes a plurality of slits therethrough to define a flow path through the heat exchanger ribs from the inlet to the outlet of the heat exchanger volume. The ribs and slits can be formed using ultrasonic additive manufacturing (UAM), for example.

Abstract: Heat-rejecting media configured to thermally couple to a heat-generating component of an information handling resource may include a source, a sink, and a thermally-conductive strip coupled between the source and the sink. The source may include a first flexible and thermally-conductive skin surrounding a first cavity comprising a first solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the source to the heat-generating component. The sink may include a second flexible and thermally-conductive skin surrounding a second cavity comprising a second solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the sink to a component of the information handling resource exposed externally to the information handling resource.

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a printed circuit board, a heat source located on the printed circuit board, a cold plate over the heat source, and a pair of cold plate attachments with stabilizing arms. Each of the pair of cold plate attachments with stabilizing arms include a printed circuit board attachment portion secured to the printed circuit board using only a single through hole, a load portion that extends from the printed circuit board attachment portion towards the cold plate, a cold plate attachment portion that secures the cold plate attachment with stabilizing arm to the cold plate, and a stabilizing portion that extends from the cold plate attachment portion to the printed circuit board.

Abstract: Electronic equipment includes a plurality of heat generating elements, a single heat sink, and a single cover. The heat generating elements are arranged adjacent to one another in a one-dimensional array in a predetermined alignment direction. The faces of the heat generating elements on one side are fixed directly or indirectly to the heat sink. The faces of the heat generating elements on the other side are in direct or indirect contact with the cover. The cover is fixedly screwed to the heat sink at opposite ends in the alignment direction on the outer side of the heat generating elements. The heat generating elements are sandwiched and held between the heat sink and the cover. This allows heat generated by the heat generating elements to be efficiently radiated via the heat sink and allows the heat generating elements to be easily connected to the heat sink.

Abstract: A carrier for different electronic components for installation in an expansion card for a computing device is disclosed. The carrier conforms to M.2 standards such as an M.2 22110 form factor. The carrier has a top heat sink and a bottom heat sink. A circuit board includes the electronic device. The circuit board is seated between the top heat sink and the bottom heat sink. A side clip includes a top panel and a bottom panel. The side clip has an open position and a closed position. When the side clip is in the closed position, the top panel of the side clip contacts the top heat sink, and the bottom panel of the side clip contacts the bottom heat sink, to hold the top heat sink to the bottom heat sink.

Abstract: Enhanced thermal energy transfer systems for semiconductor packages are provided. A thermally conductive member is disposed in the interstitial space between an upper surface of a semiconductor package and a lower surface of a thermal member. The thermally conductive member is disposed above a first portion of the upper surface of the semiconductor package having a relatively higher thermal energy output when the semiconductor package is operating. A thermal interface material is disposed in the interstitial space and a force applied to the thermal member. The thermally conductive member forms a relatively higher pressure region above the first portion of the semiconductor package and a relatively lower pressure region in other portions of the semiconductor package remote from the thermally conductive member. The increased pressure region proximate the thermally conductive member beneficially enhances the flow of thermal energy from the first portion of the semiconductor package to the thermal member.

Abstract: According to one embodiment, a semiconductor storage device includes a housing, a first board, a heat generating component, an electronic component, and a thermal-conductive sheet. The housing has a first vent hole. The first board is accommodated in the housing. The heat generating component is mounted on the first board. The electronic component is disposed between the heat generating component and the first vent hole. The thermal-conductive sheet is provided to extend over the heat generating component and the electronic component, or provided to extend from a region positioned on a rear side of the heat generating component on the first board to the electronic component.

Abstract: A circuit connection module include a board, an electronic component mounted on the board, and an electrically conductive member connected to the electronic component so as to be thermally conductive. The electronic component includes a heat dissipation portion exposed on an outer surface of the electronic component. The electrically conductive member includes a plate-shaped portion connected to the heat dissipation portion so as to be thermally conductive, and a terminal portion in which one end is connected to the plate-shaped portion so as to be thermally conductive and electrically conductive and the other end is in contact with a mating terminal.

Abstract: A problem to be solved by the present invention is to prevent smoke emission and ignition of a power semiconductor element that is installed inside a power conversion device connected to a battery in the field of power electronics, for example. A semiconductor holding device according to the present invention includes: a package which houses a power semiconductor element therein and dissipates heat to a cooler from a first surface of the package; a plate covering a second surface opposing the first surface of the package; and a pressing member pressing the plate against the package.

Abstract: An electrical connector has a row of signal contacts, and a ground shield disposed inwardly from the signal contacts. Each of the signal and ground contacts has a first segment and a second segment. Each first segment defines a mounting end that can mount to a first electrical component, and each second segment defines a mating end that can mate with a second electrical component. The first and second segments of each signal contact and the ground contact are angularly offset from one another so as to define an angle of between 75 degrees and 105 degrees between the first and second segments. The first and second segments of each signal contact and the ground contact can be coupled to one another to define the angle. Alternatively, the signal and ground contacts can be bent along a common bend line that intersects the signal contacts and the ground contact.

Abstract: An assembled circuit board has a topology that defines positions, dimensions and power dissipation of components mounted to the circuit board, including a high power component and one or more low power components. A cold plate makes thermal contact to the high power component through a thermal interface material. A thermally conductive sheet overlays the circuit board and is formed to match the topology of the low power component or components. The sheet has a first portion that makes thermal contact with the cold plate and a second portion that overlays the low power component or components. The cold plate removes heat directly from the high power component and indirectly through the thermally conductive sheet from the low power component or components. The thermally conductive sheet conforms to the topology of the low power components either by preforming or by flexibility.

Abstract: A transistor heat dissipation module is adapted for at least one transistor. The transistor heat dissipation module includes a heat dissipation member and an elastic member. The heat dissipation member includes a first wall and a second wall opposite to each other and a first connecting member connected to the first wall and the second wall. An accommodating space is formed between the first wall and the second wall. The transistor is disposed in the accommodating space. The elastic member is disposed in the accommodating space and is located between the at least one transistor and the first wall to press the at least one transistor against the second wall. An assembly method of a transistor heat dissipation module is further provided.

Abstract: A two-phase cold plate includes an outer enclosure having a fluid inlet and a fluid outlet each fluidly coupled to a fluid pathway, an inner enclosure having a vapor cavity and a vapor outlet, and one or more wicking structures disposed in the outer enclosure. The one or more wicking structures fluidly couple the fluid pathway of the outer enclosure with the vapor cavity of the inner enclosure and the one or more wicking structures comprise a plurality of nucleation sites configured to induce vaporization of a cooling fluid and facilitate vapor flow into the vapor cavity of the inner enclosure.

Abstract: A heat-sink base provided with heat-sink fin portions, a manufacturing method and a motor provided with the heat-sink base. The base is produced by pouring cast metal into a mold cavity to replace a pattern having a predetermined sublimation temperature. The base includes a preformed heat-sink member comprising a plurality of heat-sink fin portions and at least one anchor portion embedded at least partially in the pattern, and a base body comprising an enclosed base portion and a holder portion for receiving and holding the at least one anchor portion. By virtue of the invented method, the heat-sink member having an extremely thin thickness can be mounted on the base body and the overall surface area of the heat-sink base is increased considerably.

Abstract: According to various embodiments of the present invention, an electronic device can comprise: a circuit board; an electronic component arranged on one surface of the circuit board; a thermal conductive member arranged so as to correspond to the upper surface of the electronic component; and a thermal interface member arranged between the electronic component and the thermal conductive member and comprising a carbon fiber. The electronic device can be variously implemented according to embodiments.

Abstract: According to an aspect, a power module package includes a plurality of power modules including a first power module and a second power module, a plurality of heat sinks including a first heat sink coupled to the first power module and a second heat sink coupled to the second power module, and a module carrier coupled to the plurality of power modules, where the module carrier includes a first region defining a first heat-sink slot and a second region defining a second heat-sink slot. The first heat sink extends at least partially through the first heat-sink slot and the second heat sink extends at least partially through the second heat-sink slot. The power module package includes a housing coupled to the module carrier and a ring member located between the module carrier and the housing.

Abstract: A method and latch for use with mounting a panel mount module to a panel. The latch includes a housing with a module receiving cavity. The module receiving cavity has cavity walls with projections extending from the cavity walls into the module receiving cavity. The projections are configured to be positioned in openings provided in side walls of the module when the latch is mounted on the module. Securing openings extend through the housing. Mounting hardware is positioned in the securing openings. The securing openings and mounting hardware are configured to be positioned in line with mounting openings in the panel. With the mounting hardware properly secured in the mounting openings of the panel and the projections properly secured in the openings of the module, the module is prevented from movement relative to the panel and any forces applied to the module will be transferred through the latch to the panel.

Abstract: Heatsink has a plurality of cross-connected pathways that create areas of turbulent airflow which is useful for quickly dissipating heat in the heatsink. The cross-connected pathways can include vertically extending pathways that extend from the baseplate to the top surface of the single piece of material with an increasing volume away from the baseplate toward the top surface of the single piece of material and horizontally extending pathways are oriented in a plurality of rows where a diameter of the horizontally extending pathways increases in each row of the plurality of rows from the baseplate.

Abstract: An active heat-radiating structure attached to a passive heat-radiating part comprises a fan, an outer frame, and two mounting members. The outer frame comprises two first connecting portions arranged at two opposite sides of the outer frame, the two mounting members are disposed on the passive heat-radiating part and connected with the outer frame. Each mounting member is provided with a first mounting portion connected with one first connecting portion. Further, each first connecting portion comprises a track provided with a plurality of positioning points and a guide groove disposed in parallel with the track, and each first mounting portion comprises at least one elastic sheet stressed to move on the track and limited by the positioning point, and a guide block stressed to slide in the guide groove. The position of the fan is adjusted by the two first connecting portions and the two first mounting portions.

Abstract: A heat exchanger comprising a body part and a cooling fin system having an inlet end and an outlet end. The cooling fin system has a plurality of cooling fins, and is adapted to provide a flow path for a coolant flow through the cooling fin system in a longitudinal direction. The coolant flow is adapted to enter the cooling fin system through an inlet surface of the cooling fin system. The inlet surface of the cooling fin system is a non-planar surface.

Abstract: A fan module including a blade mechanism, a switch component, and a fan is provided. The blade mechanism includes a frame having a through hole, a positioning bracket movably connected to the frame, and blades movably connected to the positioning bracket and the frame. The switch component is connected to the positioning bracket and located on an assembly path. The fan is detachably disposed at one side of the through hole, and the positioning bracket and the blades are located at another side. In a first mode, any two adjacent blades are stacked to close the through hole. In a second mode, the fan pushes the switch component to drive the positioning bracket to drive the blades, such that the blades have a rotational degree of freedom relative to the positioning bracket or rotate relative to the frame to open the through hole. An electronic device is also provided.

Abstract: A spring and damper system for a circuit board includes a spring arrangement having a plurality of compression springs. Each of the compression springs has a contact portion and two ends which are disposed away from their respective contact portion. Each of a plurality of dampers is disposed on a respective one of the ends of the compression springs and configured to contact a portion of the circuit board.

Abstract: A cooler includes an evaporator and a condenser. The evaporator includes a housing, a wick, and a groove member having a plurality of vapor flow channels through which working fluid changed in phase from a liquid phase to a gas phase flows, the groove member being coupled to the wick. The housing includes a heat receiver to which the heat is transferred from a cooling target. The groove member includes a plurality of plate-like members, arranged side by side along a predetermined direction, and constituting the plurality of vapor flow channels. Each of the plate-like members includes a bent part formed by bending a part of the plate-like member, the bent part being coupled to the heat receiver.

Abstract: A heatsink shield with thermal-contact dimples can improve thermal-energy distribution in a radar assembly. The radar assembly includes a printed circuit board (PCB), the heatsink shield, a radome, and a housing. The PCB can include integrated circuits and other components, along with a thermally-conductive material that covers at least a portion of the PCB surfaces. The heatsink shield includes multiple dimples that thermally contact the thermally-conductive material. The heatsink shield is configured to distribute thermal energy produced at least in part by the PCB components to the housing. In this way, the described techniques and systems permit the radar assembly to better distribute thermal energy away from the PCB components to the rest of the PCB and through the housing.

Abstract: A three dimensional pulsating heat pipe includes a three dimensional pipe coil structure and a heat exchange chamber. The three dimensional pipe coil structure is formed by winding at least one metal pipe to surround repeatedly a central axis and stack by extending along the central axis. Two opposite sides of the three dimensional pipe coil structure are arranged as a heating section and a condensation section, respectively. The heat exchange chamber is disposed at the heating section. Two opposite ends of the at least one metal pipe are connected with an interior of the heat exchange chamber.

Abstract: A waveguide coupling system may include at least one waveguide member retention structure disposed on an exterior surface of a semiconductor package. The waveguide member retention structure may be disposed a defined distance or at a defined location with respect to an antenna carried by the semiconductor package. The waveguide member retention structure may engage and guide a waveguide member slidably inserted into the respective waveguide member retention structure. The waveguide member retention structure may position the waveguide member at a defined location with respect to the antenna to maximize the power transfer from the antenna to the waveguide member.

Abstract: A package structure and a manufacturing method thereof are provided. The package structure includes a substrate, a semiconductor package, a thermal conductive gel, a thermal conductive film, and a heat spreader. The semiconductor package has an uneven top surface. The thermal conductive gel covers the uneven top surface of the semiconductor package. The thermal conductive film is over the uneven top surface of the semiconductor package. A thermal conductivity of the thermal conductive film is higher than a thermal conductivity of the thermal conductive gel. The heat spreader is disposed over the thermal conductive film.

Abstract: A loading assembly includes a base plate configured to support a circuit board placed thereon, a pressing plate configured to press an electrical member on the circuit board, and a first connection assembly connecting the pressing plate to the base plate and pressing the electrical member on the circuit board through the pressing plate. The first connection assembly includes a first nut fixed on the base plate, a first bolt passing through the pressing plate and screwed to the first nut, and a first spring sleeved on the first bolt and compressed between a head of the first bolt and the pressing plate. A first locking part is formed on the first bolt. The first locking part is pressed against an end face of the first nut when the first bolt is screwed to an installation position to prevent the first bolt from being rotated relative to the first nut.

Abstract: A connector, comprises: a cage having a chamber having a top wall; a radiator mounted on the top wall of the chamber; an elastic clip fixing the radiator on the top wall of the chamber and having a first side and a second side opposite to the first side in a lateral direction of the chamber; a first latch on the cage and having a slot; a second latch on the cage and having a slot; a first hook on the first side of the elastic clip engaged into the slot of the first latch from an outer side of the first latch; and a second hook on the second side of the elastic clip engaged into the slot of the second latch from an inner side of the second latch far away from the first latch and facing the first latch.

Abstract: Disclosed herein is an enclosure including a housing for dissipating heat from first and second heat generating components located on first and second circuit boards, respectively. In the enclosure, a first heat sink plate and a second heat sink plate are spring biased apart from one another. A maximum spring biasing distance between the first heat sink plate and the second heat sink plate is greater than a distance between the interior side of the front wall and the interior side of the back wall of the housing.

Abstract: The present disclosure provides a semiconductor package. The semiconductor package includes a carrier member, a plurality of inductors and a memory chip. The carrier member includes a first surface, a second surface and a centrally-located opening. The carrier member also includes a plurality of conductive pads on the second surface proximal to the opening. The memory chip is attached to the carrier member in a face-down manner. The memory chip includes a plurality of bidirectional and unidirectional signal-transmission pins electrically coupled to the inductors. The memory chip also includes a plurality of bonding pads. A plurality of bonding wires, passing through the opening, electrically connect the bonding pads on the memory chip to the conductive pads on the carrier member. A first insulative structure substantially encapsulates the memory chip and the inductors. A plurality of solder balls are attached to the second surface of the carrier member.

Abstract: A battery pack is provided which includes a battery, a circuit board equipped with load feed lines, bus bars connecting with the battery and the circuit board, first and second switches, and third to sixth switches. The first and second switches are disposed in a housing which is higher in capacity of heat dissipation than the circuit board. The third to sixth switches are disposed on the circuit board. The first and second switches are larger in amount of electrical current flowing therethrough than the third to sixth switches on time average. This enables the size of the battery pack to be reduced without sacrificing the dissipation of heat from the switches.

Abstract: A system for mechanically indicating a power consumption level is provided. The system includes a solid-state drive (SSD) device and a circuit board contained in the SSD device. The circuit board contains a power consumption capacity selector accessible from outside the SSD device wherein the power consumption capacity selector is configurable to open and close a circuit. The system further includes a mechanical structure configured to insert into the SSD device from outside the SSD device. The mechanical structure is positioned to contact the power consumption capacity selector and to open and close the circuit using the power consumption capacity selector.

Abstract: Electronic device including a housing enclosing an electronic board and a heatsink having a first face applied against the electronic board and, opposite, a second face making contact with the housing, an antenna being electrically connected to the electronic board and extending flatly between the heatsink and the housing while making contact with the heatsink and the housing.

Abstract: Cryogenic integrated circuits are provided. A cryogenic integrated circuit includes a thermally conductive base, a data processor, a storage device, a buffer device, a thermally conductive shield and a cooling pipe. The data processor is located on the thermally conductive base. The storage device is located on the thermally conductive base and disposed aside and electrically connected to the data processor. The buffer device is disposed on the data processor. The thermally conductive shield covers the data processor, the storage device and the buffer device. The cooling pipe is located in physical contact with the thermally conductive base and disposed at least corresponding to the data processor.

Abstract: Systems, methods, and apparatuses for dissipating heat from an ultrasound transducer are disclosed. A passive thermal management system including thermally conductive materials is disclosed. The passive thermal management system may include thermally conductive layers in a flexible circuit coupled to the transducer stack. The flexible circuit may be coupled to a thermally conductive bolster plate. The bolster plate may be coupled to a handle heat spreader that may be coupled to the interior surface of an ultrasound probe housing.

Abstract: A device cooling system disclosed herein includes a ventilated shield can coupled to a printed circuit board assembly. The ventilated shield can includes a first side surface with input holes and a second side surface with output holes. The ventilated shield can is positioned related to a predefined airflow path such that the input holes and the output holes facilitate airflow along the predefined airflow path through the ventilated shield can in a direction substantially parallel to the PCBA while the shield can encases and shields at least one electrical component from RF radiation at a target shield frequency.

Abstract: An integrated circuit/printed circuit board (IC-PCB) assembly comprises a PCB and a heatsink plate. The PCB has a first side including a first patterned conductive layer with one or more thermal pads onto which one or more heat slugs of one or more ICs mount, and a second, opposing side including a second patterned conductive layer with a heatsink plate receiving pad onto which the heatsink plate mounts. The heatsink plate has one or more posts that project from a mounting surface of the heatsink plate, and when the heatsink plate is mounted to the heatsink plate receiving pad, each post extends from the second side of the PCB, through a matching hole in the PCB, and to an associated thermal pad located on the first side of the PCB.

Abstract: A thermal interface material system includes a thermally conductive porous matrix, the thermally conductive porous matrix having a plurality of interstitial voids, and a thermally conductive colloidal suspension disposed on each side of the thermally conductive porous matrix to inhibit thermal pump-out of the thermally conductive colloidal suspension so that the thermally conductive porous matrix and thermally conductive colloidal suspension collectively form a thermally conductive porous pad.

Abstract: A cooling device includes a body formed into an elongate strip having upper and lower surfaces. The elongate strip is configured to contact the housing along the lower surface for conductive heat transfer from the housing to the body. Each of a plurality of cooling fins is attached to the strip and extends from one end attached to the upper surface of the strip another, free end. The device includes a first tab disposed at one end of the elongate strip, and a second tab disposed at another end of the elongate strip. The elongate strip is made from a compliant material such that the elongate strip conforms to a shape of the housing when the first and second tabs are connected to the housing and a majority of the lower surface contacts the housing. The fins are arranged to convectively dissipate heat from the body.

Abstract: An ultrasonic probe includes: an acoustic element that generates an ultrasonic wave and detects the ultrasonic wave; a support that supports the acoustic element on a side opposite to a test object side; and a heat dissipation material disposed on a side of the support opposite to the acoustic element, wherein an attenuation/thermal conduction material made of an attenuating material containing a thermally conductive material is disposed in contact with the heat dissipation material.

Abstract: The invention relates to a three-dimensional electronic module comprising an electronic device housed between a first substrate and a second substrate, said first and second substrates being electrically and/or thermally connected to one another by at least one and preferably two heat bridges added onto and rigidly connected to said first and second substrates. The invention also relates to an electronic system comprising at least two electronic modules mounted facing one another so as to sandwich a third substrate in contact with the second substrate thereof, respectively. The third substrate is configured to provide thermal and electrical coupling between the two electronic modules via the second substrate (140) thereof.

Abstract: A vehicle power module for converting power includes a lead frame configured to receive power from outside or to output power to the outside and a substrate configured to be bonded with the lead frame. The substrate includes a pattern layer disposed to be electrically connected to the lead frame, a conductive layer disposed apart from the pattern layer and configured to be electrically grounded, and an insulating layer disposed between the conductive layer and the pattern layer to insulate the pattern layer from the conductive layer. The pattern layer further protrudes toward the lead frame than the insulating layer.

Abstract: A thermal conductive device includes a first conductive plate, a second conductive plate, a plurality of wicks and a fluid. The first conductive plate has a first portion adjacent to edges of the first conductive plate and a second portion far away from the edges. The second conductive plate has a first portion adjacent to edges of the first conductive plate and a second portion far away from the edges. The first portion and the second portion of the first conductive plate are respectively connected to the first portion and the second portion of the second conductive plate to define a chamber. The plurality of wicks are disposed within the chamber. The fluid is disposed within the chamber.

Abstract: A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.

Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, a second encapsulant, and a plurality of conductive terminals. The first encapsulant is at least disposed between the first die and the second die, and on the second die. The second encapsulant is aside the first die and the second die. The conductive terminals are electrically connected to the first die and the second die through a redistribution layer (RDL) structure. An interface is existed between the first encapsulant and the second encapsulant.

Abstract: An electronic housing assembly includes a polymeric housing base and a metallic heat sink secured to the housing base with a snap-fit engagement. A printed circuit board is positioned within a cavity in the housing assembly and is protected within the housing by an environmental seal. The electronic housing assembly allows for expansion and contraction between the heat sink and the housing while maintaining the integrity of the seal.

Abstract: A heat sink assembly for a light fixture can include at least one heat sink fin disposed in thermal communication with at least one heat-generating component of the light fixture, where the at least one heat sink fin includes a thermoplastic material. The at least one heat sink fin can absorb and dissipate sufficient heat to comply with applicable industry standards for the light fixture.

Abstract: Systems, methods, and software are disclosed herein having enhanced modular carrier form factors. In an implementation, a network card apparatus comprises a network card assembly. The network card assembly comprises a network interface card and a connector card coupled to the network interface card and comprising a U.2 connector configured to mate with a U.2 connector of the modular bay of the rackmount chassis assembly.

Abstract: A circuit board includes a heatsink configured to be coupled to the circuit board via a first coupling mechanism, the first coupling mechanism providing an asymmetrical downward force for coupling the heatsink to the circuit board. The circuit board further includes a second coupling mechanism configured to provide a counter force to the asymmetrical downward force of the first coupling mechanism. The counter force can be configured on an overhang portion of the heatsink that does not cover a circuit on the circuit board.