Abstract: A structure of via hole of electrical circuit board includes an adhesive layer and a conductor layer that are formed after wiring is formed on a carrier board. At least one through hole extends in a vertical direction through the carrier board, the wiring, the adhesive layer, and the conductor layer and forms a hole wall surface. The conductor layer shows a height difference with respect to an exposed zone of the circuit trace in the vertical direction. A conductive cover section covers the conductor layer and the hole wall surface of the through hole. The carrier board is a single-sided board, a double-sided board, a multi-layered board, or a combination thereof, and the single-sided board, the double-sided board, and multi-layered board can be flexible boards, rigid boards, or composite boards combining flexible and rigid boards.

Abstract: An article includes a flexible polymeric dielectric layer having first and second major surfaces. The first major surface has a conductive layer thereon and at least one cavity therein. The at least one cavity contains a conductive material including electrically separated first and second portions supporting and electrically connecting a light emitting semiconductor device to the conductive layer on the first major surface.

Abstract: In order to limit the stress and strain applied to a printed circuit board while still maintaining flexibility, multiple small rigid mesas are formed on a flexible printed circuit, where the rigid mesas are physically isolated by trenches formed around their perimeters. Individual electronic components are attached to the multiple rigid mesas. These trenches form openings at which the printed circuit board is enabled to flex, bend or twist, thereby minimizing, if not eliminating, resulting stress applied to the interconnection between the electronic components and the rigid mesas.

Abstract: A circuit board includes a main portion obtained by stacking a plurality of base sheets made of a flexible material in a predetermined direction and bonding the base sheets under pressure, and at least one planar conductor pattern provided in the main portion and including a concave portion and a convex portion. The concave portion and the convex portion extend in a direction perpendicular or substantially perpendicular to the predetermined direction. The concave portion is sunken in a direction parallel or substantially parallel to the predetermined direction. The convex portion protrudes in an opposite direction to the direction in which the concave portion is sunken. The at least one planar conductor pattern includes a first planar conductor pattern with a concave portion and a convex portion extending in a first direction.

Abstract: An electronic device includes an electronic connector, a flexible printed circuit and a structure having a stationary printed circuit board. The electronic connector rotates according to a first pivot axis and a second pivot axis with respect to the structure. The flexible printed circuit is fixed to the electronic connector and the stationary printed circuit board, and transfers an electronic current between the electronic connector and the stationary printed circuit board. The flexible printed circuit board comprises a first partly circular bend moving in response to the rotation of the electronic connector according to the first pivot axis and a second partly circular bend moving in response to the rotation of the electronic connector according to the second pivot axis.

Abstract: An object of the invention is to provide a printed wiring board which is less likely to cause foaming even after a reflow step and in which a metal reinforcing plate is less likely to be peeled off, a manufacturing method thereof, and an electronic device. A printed wiring board (1) according to the present invention includes a wiring circuit board (6), a conductive adhesive layer (3), and a metal reinforcing plate (2). The conductive adhesive layer (3) is bonded to each of the wiring circuit board (6) and the metal reinforcing plate (2). The metal reinforcing plate (2) includes a nickel layer (2b) formed on a surface of a metal plate (2a). A ratio of a surface area of nickel hydroxide to nickel present in a surface of the nickel layer (2b) is more than 3 and equal to or less than 20.

Abstract: A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.

Abstract: Embodiments of the present disclosure include a semiconductor device, a package and methods of forming a semiconductor device and a package. An embodiment is a semiconductor device including a molding material over a first substrate with a first opening having a first width in the molding material. The semiconductor device further includes a second opening having a second width in the molding material with the second width being greater than the first width. A first connector is in the first opening and a second connector is in the second opening.

Abstract: Disclosed are a foldable and spreadable electronic device and a method of manufacturing the electronic device. The electronic device may include a flexible chip, a protection film and a flexible substrate. The flexible chip may include a first wiring on a first face thereof. The flexible chip may have a foldable and spreadable structure by reducing a thickness from a second face thereof. The protection film may be disposed on the second face of the flexible chip for protecting the flexible chip. The flexible substrate may include a second wiring on one face thereof. The protection film on disposed on the second face of the flexible chip may make contact with the flexible substrate. The first wiring of the flexible chip may be electrically connected to the second wiring of the flexible substrate using a wire.

Abstract: A composite structure is provided. The structure is formed of rigid composite material in which non-metallic continuous fibers reinforce a polymer matrix. The continuous fibers are electrically conductive. The structure has electrodes electrically connected to the continuous fibers. The composite material contains one or more insulating barriers which electrically divide the structure so that a first portion of the material in electrical contact with one of the electrodes can be held at a different electrical potential to a second portion of the material in electrical contact with the other electrode. In use, an electrical unit can be provided to electrically bridge the first and second portions of the material such that electrical signals can be transmitted between the electrodes and the electrical unit via the continuous fibers.

Abstract: A bonding structure of a touch panel and a flexible circuit board includes a touch panel, a flexible circuit board and a conductive adhesive film. The touch panel includes a shielding layer and multiple transmission wires disposed on the shielding layer. The flexible circuit board is under the touch panel and includes a substrate and multiple connection wires on the substrate. Each the connection wire includes a first connection portion and a second connection portion, and the two connection portions are separated from each other by an interval and electrically insulated from each other. The conductive adhesive film is between the transmission wires of the touch panel and the connection wires of the flexible circuit board, in which the first connection portions and the second connection portions of the connection wires are electrically connected to the transmission wires via the conductive adhesive film so as to form an electric loop.

Abstract: A secondary battery module includes a plurality of secondary batteries each including an electrode assembly, a case accommodating the electrode assembly, and electrode terminals electrically connected to the electrode assembly and extending outward from the case, and a bus bar that electrically connects neighboring electrode terminals of the plurality of secondary batteries. The bus bar includes a first part including penetration holes through which the electrode terminals penetrate such that the bus bar is fastenable to the electrode terminals and a second part extending from the first part, the second part being bent to face the first part.

Abstract: According to one embodiment, a suspension assembly includes a support plate, a trace member on the support plate and a drive element mounted on the trace member. The trace member includes a metal plate, and a multilayered member on the metal plate. The multilayered member includes a first insulating layer, a conductive layer stacked on the first insulating layer, a second insulating layer stacked on the conductive layer. The multilayered member includes a mount portion on which the drive element is mounted, and a branching portion arranged along the mount portion with a gap therebetween. At least one portion of the branching portion is formed into a thin portion having a thickness less than other portions of the multilayered member.

Abstract: An electronic assembly is disclosed that includes a flexible insulating film, a semiconductor component that has a thickness of less than 50 micrometers, a conductive interconnect extending through the flexible insulating film, a second patterned metal wiring film adjacent, and a third patterned metal wiring film. The second patterned metal wiring film is electrically coupled with the third patterned metal wiring film through the conductive interconnect. The semiconductor component is coupled to the first patterned metal wiring film and at least one of the second patterned metal wiring film or the third patterned metal wiring film.

Abstract: Mechanical measures strengthen a flexible circuit board or deformable electronic by manipulating the location and/or intensity of the stress concentration or to limit bending, torsion, and stretching. A material layer is patterned onto the flexible circuit board with a specific pattern and place of deposition in order to modify the stress concentration and profile of the circuit board and increase its overall strength. The material layer may be configured to modify the stress concentrations during bending away from the weak points in the assembly or to spread the stress during bending by increasing the radius of the bend curvature and therefore decreasing the chance of mechanical failure.

Abstract: A rigid flexible printed circuit board, having a rigid region and a flexible region, includes, in one embodiment: a base substrate including a portion in the rigid region and a portion in the flexible region; a coverlay formed on the base substrate; a first insulating layer formed on the coverlay and formed in the rigid region; a second insulating layer formed on the first insulating layer; and an outer layer circuit layer formed on the second insulating layer. Also described is a method of manufacturing a rigid flexible printed circuit board having a rigid region and a flexible region.

Abstract: The present invention relates to an inductor. An inductor in accordance with an embodiment of the present invention includes: an insulating layer having a hole; a conductive pattern disposed on both surfaces of the insulating layer and having a structure in which portions disposed on the both surfaces are electrically connected to each other through the hole; and a magnetic layer disposed on the insulating layer to cover the conductive pattern, wherein the conductive pattern has a plating pattern formed by performing a plating process.

Abstract: A flexible substrate is disclosed. The flexible substrate includes an insulating substrate having a first surface and a second surface opposite to the first surface, a first connection portion having a first conductor, a first ground pattern, and a second ground pattern on the first surface, the first ground pattern and the second ground pattern being spaced apart from the first conductor and respectively located at either side of the first conductor, a conductor pattern formed on the second surface, the conductor pattern being connected to the first conductor, and a third ground pattern formed on the second surface, the third ground pattern being connected to the first ground pattern, wherein a distance between the conductor pattern and the third ground pattern is smaller than a distance between the first conductor and the first ground pattern.

Abstract: A terminal connection structure includes a first connection and a second connection connected to each other through an anisotropic conductive film. At least one of the first and second connections comprises terminals arranged side by side at an end of a wiring pattern formed between base and cover insulating layers to expose outside the cover insulating layer, and a support portion protruding relative to a part of the base insulating layer in a surrounding area of a respective one of the terminals.

Abstract: The invention relates to a contact element for connecting to a circuit board. The circuit board has at least one substrate layer, particularly an electrically insulating substrate layer. The circuit board also has at least one electrically conductive layer. The contact element is designed for connecting to the electrically conductive layer. According to the invention, the contact element is designed to be pushed onto a circuit board edge of the circuit board. The contact element is designed to reach over the circuit board edge and has at least one cutting blade with a cutting edge, the cutting edge having a harder metal in the area of a severing section than in an adjoining contact section alongside the cutting edge. The cutting edge is designed to cut through the substrate layer with the severing section when pushed onto the circuit board edge and to contact the electrically conductive layer electrically with the contact section.

Abstract: In a flexible board including laminated resin layers containing the same thermoplastic resin as a principal material, a rigid portion includes a region in which a first resin layer is disposed between a second resin layer defining an upper principal surface and a third resin layer defining a lower principal surface so that the rigid portion has a large thickness, and a flexible portion includes a region in which the first resin layer is not disposed between the second and third resin layers so that the flexible portion has flexibility, a step portion at which a thickness changes is between the rigid and flexible portions, and the second and third resin layers extend in a region from the rigid portion beyond the step portion to the flexible portion.

Abstract: Provided is a printed circuit board, comprising: a supporting substrate including a first region and a second region extending to be bent from the first region; an insulating substrate above the supporting substrate; a bending portion bent between the first region and the second region; and an adhesive layer between the supporting substrate and the insulating substrate and except for the bending portion.

Abstract: A compact, high breaking capacity fuse that includes a top insulative layer, at least one intermediate insulative layer, and a bottom insulative layer arranged in a vertically stacked configuration. The at least one intermediate layer may have a hole formed therethrough that defines an air gap within the fuse. A first conductive terminal may be formed on a first end of the fuse and a second conductive terminal may be formed on a second end of the fuse. At least one fusible element may connect the first terminal to the second terminal, thus providing an electrically conductive pathway therebetween. A portion of the at least one fusible element may pass through the air gap defined by the hole in the at least one intermediate insulative layer.

Abstract: A pin arrangement adapted to a FPC connector is provided. The pin arrangement includes a pin lane. The pin lane includes a pair of ground pins, a pair of differential pins and at least one not-connected (NC) pin. The differential pins are located between the pair of ground pins. The at least one NC pin is located between the pair of differential pins or between one of the pair of ground pins and one of the pair of differential pins adjacent thereto. By adding the at least one NC pin between the pair of differential pins and/or between the differential pin and the ground pin adjacent thereto, a distance between each of the pair of the differential pins and/or between the differential pin and the ground pin is increased, and thus a differential characteristic impedance of the pair of differential pins is raised to reduce the impact of impedance mismatch.

Abstract: A signal line that is easily inflected includes a laminated body including at least insulator layers that include flexible material and are laminated from a positive direction side in a z axis direction to a negative direction side therein in this order. A ground conductor is securely fixed to a main surface on the positive direction side of the insulation sheet in the z axis direction. A signal line is securely fixed to a main surface on the positive direction side of the insulator layer in the z axis direction. A ground conductor is securely fixed to a main surface on the positive direction side of the insulator layer in the z axis direction. The ground conductors and the signal line define a stripline structure. The laminated body is inflected so that the insulator layer is located on an inner periphery side, compared with a location of the insulator layer.

Abstract: An optical module includes a circuit substrate and a terminal. The circuit substrate includes a first pattern, a second pattern, a first cover material, and a second cover material. The first pattern electrically is connected to the terminal and formed in a predetermined shape on a first surface of the circuit substrate. The second pattern is formed in a predetermined shape at a position corresponding to the first pattern on a surface opposite to the first surface. The first cover material covers at least a portion of the first pattern to be bent along with bending of the circuit substrate. The second cover material covers at least an end of the second pattern.

Abstract: A method includes providing a molded elastomeric mat having an input protrusion, an output device receiving surface including an output device contact, and a battery receiving indentation including a power supply contact. The method further includes insert molding an output conductive path into the elastomeric mat, the output conductive path electrically coupling a circuit carrier output contact to an output device contact, and insert molding a power supply conductive path into the elastomeric mat, the power supply conductive path electrically coupling a circuit carrier power contact to the power supply contact. The method includes interfacing the elastomeric mat with a circuit carrier, aligning the input protrusion with a circuit carrier input contact, interfacing a display device with the output device receiving surface, electrically connecting the display device with the output device contact, and positioning the elastomeric mat into a housing.

Abstract: The present disclosure relates to improved receiver connectors for hearing assistance devices. One aspect of the present subject matter relates to a hearing assistance system including a flex connector. A hearing assistance device housing includes hearing assistance electronics for a hearing assistance device. The system also includes a receiver configured to convert an electrical signal from the hearing assistance electronics to an acoustic signal. The receiver is configured to enable a quick connect and disconnect at various degrees on and off vertical axial alignment with repeatable reliability, according to various embodiments.

Abstract: An electronic device with COF package is provided. The electronic device includes a flexible substrate, a core circuit unit, multiple output pads, multiple switching elements, and a common test pad. The flexible substrate includes a non-cutting-out area and a cutting-out area. The core circuit unit and output pads are disposed in the non-cutting-out area. First terminals of the switching elements are respectively and electrically connected to output pads of the core circuit unit, and second terminals of the switching elements are respectively and electrically connected to the output pads. The common test pad is disposed in the cutting-out area and electrically connected to the output pads. In a test stage, the switching elements are sequentially turned on such that one of multiple output signals of the core circuit unit is transmitted to the common test pad.

Abstract: This is directed to several handheld device components to be placed in a handheld device, as well as methods or systems for mounting or retaining components within the device. In particular, this is directed to a rigid shield used in an SMT process and securing connected flex connectors by adhering the flexes together. This is also directed to using foam in combination with a hard material to create an acoustic seal, or several layers of foam to create an acoustic and mechanical seal. This is also directed to selectively folding a sheet of material placed around a battery cell.

Abstract: A printed circuit board includes an insulating layer; and a circuit pattern formed on the insulating layer. The circuit pattern includes a seed layer and a metal layer formed on the seed layer, and both sides of the seed layer are formed with an etched groove. Also, a method of manufacturing a printed circuit board includes: forming a seed layer on the insulating layer; forming a plating resist formed with an opening on the seed layer; forming a circuit pattern by performing plating processing on the opening; removing the plating resist; forming a passivation layer on the circuit pattern; performing dry etching on a remaining portion other than a side wall of the passivation layer; and performing wet etching the seed layer exposed on a surface by the dry etching.

Abstract: This is directed to several handheld device components to be placed in a handheld device, as well as methods or systems for mounting or retaining components within the device. In particular, this is directed to a rigid shield used in an SMT process and securing connected flex connectors by adhering the flexes together. This is also directed to using foam in combination with a hard material to create an acoustic seal, or several layers of foam to create an acoustic and mechanical seal. This is also directed to selectively folding a sheet of material placed around a battery cell.

Abstract: There is provided a flexible display having a plurality of innovations configured to allow bending of a portion or portions to reduce apparent border size and/or utilize the side surface of an assembled flexible display.

Abstract: Systems and methods including bonding two or more separately formed circuit layers are provided using, for example, cold welding techniques. Processing techniques may be provided for combining inorganic and/or organic semiconductor devices in apparatus including, for example, microchips, optoelectronic devices, such as solar cells, photodetectors and organic light emitting diodes (OLEDs), and other apparatus with multi-layer circuitry. Methods of bonding preformed circuit layers may include the use of stamping and pressure bonding contacts of two or more circuit layers together. Such methods may find applicability, for example, in bonding circuitry to shaped substrates, including various rounded and irregular shapes, and may be used to combine devices with different structural properties, e.g. from different materials systems.

Abstract: A flexible device for electrically connecting an electric component and a printed circuit board together includes a main extension direction, and the flexible electric-connection device includes a first contact region formed at one end of the flexible electric-connection device in the main extension direction, as well as a second contact region formed at the other end of the flexible electric-connection device in the main extension direction. The flexible electric-connection device includes a stiffener, or the flexible electric connection device is combined with a supporting element. The electric component is provided so as to be in direct electric contact with the flexible electric-connection device via the first contact region.

Abstract: A wiring board includes an insulated substrate, a wiring pattern and a folded part. The insulated substrate has an elongated shape with shorter sides extending along a width direction. The wiring pattern is provided on the substrate. The wiring pattern extends between both ends in the width direction of the substrate, and has an exposed part exposed at at least one of the ends of the substrate. In the folded part, the exposed part of the wiring pattern and the substrate are integrally folded up inwardly toward an upper face side of the substrate at each of the ends of the substrate.

Abstract: An electronic substrate connecting structure is used to electrically connect a pair of electronic substrates arranged to face each other. The electronic substrate connecting structure includes a plurality of pins erected on one of the electronic substrates to electrically connect the one of the electronic substrates and the other electronic substrate, and a pin guide that has a plurality of guide holes where the pins are inserted and defines positions of the pins such that the pins are connectable to the other electronic substrate while the pins are installed in the one of the electronic substrates.

Abstract: A electrical interconnect adapted to provide an interface between contact pads on an IC device and a PCB, including a multi-layered substrate with a first surface with a plurality of first openings having first cross-sections, a second surface with a plurality of second openings having second cross-sections, and center openings connecting the first and second openings. The contact members include first contact tips extending through the first opening and above the first surface, second contact tips extending through the second openings and above the second surface, and center portions located in the center openings. The center portions include a shape adapted to bias the first and second contact tips toward the IC device and PCB, respectively. A dielectric material different from the material of the substrate is located in at least one of the first opening, the second opening, or the center opening.

Abstract: On a predetermined mounting surface of a surface (22A) of a flexible wiring board (22), a flexible wiring board pressing plate (28) which presses the mounting surface against a lower cover (12) is provided at a position immediately below a first radiation block (24) and a pressing sheet (26). The flexible wiring board pressing plate (28) has five pairs of projections (28PA and 28PB) respectively arranged in lines. The projections (28PA and 28PB) are formed to intersect conductive patterns (22ACP) at predetermined intervals.

Abstract: A wiring board includes a substrate, a first conductor layer, a second conductor layer, and a through-via conductor. The substrate has a first surface, a second surface, and at least one through-via. The first conductor layer is formed on the first surface, and the second conductor layer is formed on the second surface. The through-via conductor is formed in the through-via for electrically connecting to the first conductor layer and the second conductor layer. The through-via has a first depressed portion exposed in the first surface, a second depressed portion exposed in the second surface, and a tunnel portion between the first depressed portion and the second depressed portion for connecting the first depressed portion and the second depressed portion. The first depressed portion and the second depressed, portion are non-coaxial.

Abstract: A socket (130) employs a substrate (310) including a conductive network. As array of first contacts (136) is on a top surface of the substrate (310) and arranged to engage an integrated circuit (110). An array of second contacts (138) is on a bottom surface of the substrate (310) and arranged to engage a circuit board (120). The conductive network electrically connects the first contacts (136) respectively to the second contacts (138), and the first contacts (136) include a roused first contact (136?) that the conductive network routes horizontally in or on the substrate (310).

Abstract: The present disclosure provides a manufacturing method of a touch panel that comprises of: simultaneously baking a sensing electrode layer and a protective layer that covers the sensing electrode layer. The present disclosure solves the issue of the sensing electrode layer being easily oxidized or corroded when baked alone. The present disclosure also simplifies the manufacturing process of the touch panel. The present disclosure also provides a touch panel on the basis of the manufacturing method.

Abstract: In some applications, it may be desirable to position multiple photodetectors at precise locations on a curved focal surface defined by an optical system. To achieve this positioning, the photodetectors may be mounted at desired locations on a flexible substrate that is in a flat configuration. The flexible substrate with mounted photodetectors can then be shaped to substantially conform to the shape of the curved focal surface. This shaping can be accomplished by clamping the flexible substrate between at least two clamping pieces. The curved flexible substrate clamped between the at least two clamping pieces can be positioned relative to the optical system such that the photodetectors are positioned at desired three-dimensional locations on the curved focal surface.

Abstract: A printed circuit substrate may be configured with at least one internal lead designed and shaped to reduce solder bridging. The printed circuit substrate can have a plurality of internal leads that each has a continuously curvilinear boundary that defines an isolation channel. The isolation channel may be configured with a uniform distance that separates a first internal lead from an adjacent second internal lead.

Abstract: A contact pad carrier strip includes a substrate having a lateral extent of or substantially of 35 mm or a multiple of or substantially of 35 mm, and at least three smart card contact pads formed along the lateral extent of the substrate. The contact pads are aligned widthwisely across the lateral extent of the substrate. Each smart card contact pad includes a plurality of contacts. A majority of contacts of the contact pads are oriented to extend widthwisely across the lateral extent of the carrier strip.

Abstract: An interconnection element is provided for conductive interconnection with another element having at least one of microelectronic devices or wiring thereon. The interconnection element includes a dielectric element having a major surface. A plated metal layer including a plurality of exposed metal posts can project outwardly beyond the major surface of the dielectric element. Some of the metal posts can be electrically insulated from each other by the dielectric element. The interconnection element typically includes a plurality of terminals in conductive communication with the metal posts. The terminals can be connected through the dielectric element to the metal posts. The posts may be defined by plating a metal onto exposed co-planar surfaces of a mandrel and interior surfaces of openings in a mandrel, after which the mandrel can be removed.

Abstract: A flexible printed circuit board includes a flexible printed circuit unit and an electromagnetic shielding structure. The flexible printed circuit unit includes a base layer and a first circuit layer formed on a surface of the base layer. The electromagnetic shielding structure includes a first insulating layer and a copper layer. The first insulating layer is adhered on a surface of the first circuit layer away from the base layer. At least one blind hole is defined in the electromagnetic shielding structure. The copper layer is electrically connected to the first circuit layer by a plating structure filled in the blind hole.

Abstract: The present invention has an object of providing a light-emitting device including an OLED formed on a plastic substrate, which prevents degradation due to penetration of moisture or oxygen. On a plastic substrate, a plurality of films for preventing oxygen or moisture from penetrating into an organic light-emitting layer in the OLED (“barrier films”) and a film having a smaller stress than the barrier films (“stress relaxing film”), the film being interposed between the barrier films, are provided. Owing to a laminate structure, if a crack occurs in one of the barrier films, the other barrier film(s) can prevent moisture or oxygen from penetrating into the organic light emitting layer. The stress relaxing film, which has a smaller stress than the barrier films, is interposed between the barrier films, making it possible to reduce stress of the entire sealing film. Therefore, a crack due to stress hardly occurs.

Abstract: There is provided a flexible display having a plurality of innovations configured to allow bending of a portion or portions to reduce apparent border size and/or utilize the side surface of an assembled flexible display.

Abstract: A display device includes a display panel, an electromagnetic touch panel, and a backlight module overlapping one another. The backlight module has a light guide plate and a light source module consisting of a flexible circuit board strip. The flexible circuit board strip includes a light source section and a signal transmission section extending along a light entrance edge and a side edge adjacent to the light entrance edge of the light guide plate, respectively. Two ends of a connection section are connected to the light source section and the signal transmission section, respectively. The connection section includes at least one first fold making the light source disposing plane of the light source section and the wiring disposing plane of the signal transmission section be non-coplanar and also makes the wiring disposing plane be parallel to the plane of the side edge of the light guide plate.