Abstract: Provided is an electrode assembly manufacturing method including a process of cutting a separator included in an electrode assembly to have a margin protruding from an electrode plate. The method includes a first process of manufacturing one type of basic unit sheets having a structure in which electrode materials and separator materials, which are the same in number, are alternately stacked, or two or more types of basic unit sheets having a structure in which electrode materials and separator materials, which are the same in number, are alternately stacked, and a second-A process of cutting a portion of a margin area of the separator materials, which are not covered with the electrode materials, such that the separator materials of the basic unit sheets protrude over a specific distance from edges of the electrode materials.

Abstract: A push-button arrangement includes an electronic plate. The push-button is of the type surface mounted on a flexible printed circuit sheet that is itself partially fixed to the electronic plate. A portion of the flexible printed circuit sheet that carries the push-button remains free and is folded around a peripheral edge of the electronic plate, such that the push-button extends substantially perpendicularly to the electronic plate and bears against a lateral surface of the electronic plate.

Abstract: Disclosed herein are stretchable, foldable and optionally printable, processes for making devices and devices such as semiconductors, electronic circuits and components thereof that are capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Strain isolation layers provide good strain isolation to functional device layers. Multilayer devices are constructed to position a neutral mechanical surface coincident or proximate to a functional layer having a material that is susceptible to strain-induced failure. Neutral mechanical surfaces are positioned by one or more layers having a property that is spatially inhomogeneous, such as by patterning any of the layers of the multilayer device.

Abstract: A 3D electronic module comprises: two electrically tested electronic packages, each comprising at least one encapsulated chip and output balls on a single face of the package, referred to as the main face; two flexible circuits that are mechanically connected to one another, each being associated with a package, and which are positioned between the two packages, each flexible circuit comprising: on one face, first electrical interconnect pads facing the output balls of the associated package; at its end, a portion that is folded over a lateral face of the associated package; second electrical interconnect pads on the opposite face of this folded portion.

Abstract: A flexible printed circuit film connects a substrate with a printed circuit board. The flexible printed circuit film includes a first area configured to be attached to the substrate; a second area configured to be connected with the printed circuit board; and a third area between the first area and the second area. Each of the first area and the third area has a trapezoid shape with a width that gradually decreases in a direction toward the second area, and the second area has a rectangular shape.

Abstract: A gas barrier sheet improved in a gas barrier property and a manufacturing method thereof are provided. A gas barrier sheet includes at least a base material and a gas barrier film provided on the base material which allows a ferromagnetic element to be present at the boundary of the gas barrier film on the side at which the gas barrier film 3 faces the base material. The ferromagnetic element is preferably present in a scattered form, an island form or a thin film form at a boundary.

Abstract: Embodiments of the disclosure relate to an apparatus and method for mitigation of warping of assembly components when subject to a thermal event. An interface unit with a complementary coefficient of thermal expansion is embodied in the assembly. The interface unit is configured to be received by a connector joined to the assembly substrate. The interface unit has a coefficient of thermal expansion (CTE) that complements the CTE of the assembly components in order to maintain the connector in alignment with the substrate and enable the connector to expand or contract with the substrate when subject to the thermal event.

Abstract: A subassembly for a video endoscope with a picture-recording sensor (9) which is electrically conductively arranged on a flexible circuit board (8) which next to the sensor (9) is bent at least at one side and is conductively connected to at least one electrical cable proximally of the sensor (9).

Abstract: The present disclosure provides a flexible printed circuit board, a method for manufacturing the same and a display device. The flexible printed circuit board includes a first component and a second component, wherein the first component includes a main body and a first connection portion, wherein at least one first signal line is arranged in the main body and the first connection portion; the second component includes a connector and a second connection portion, wherein a second signal line corresponding to the first signal line is arranged in the connector and the second connection portion; the first connection portion and the second connection portion are connectable to each other, so as to electrically connect the first signal line to the corresponding second signal line.

Abstract: An electronic device may have control circuitry coupled to input-output devices such as a display. A flexible input-output device may be formed from an elastomeric substrate layer. The substrate layer may have signal paths to which components are mounted. Openings may be formed in the elastomeric substrate layer between the signal paths to create a stretchable mesh-shaped substrate. The electrical components may each include an interposer having solder pads soldered to the elastomeric substrate. Electrical devices such as micro-light-emitting diodes may be soldered to the interposers. The electrical components may also include electrical devices such as sensors and actuators. A stretchable lighting unit may have a stretchable light guide illuminated by a stretchable light source.

Abstract: A thin circuit board such as a flexure has a metal support layer forming a substrate, a base insulating layer provided on the metal support layer, a wiring layer being wiring traces provided on the base insulating layer, a cover insulating layer covering the wiring layer, internal terminals provided to the respective wiring traces and sequentially arranged side by side, each one internal terminal of said internal terminals used to be solder-bonded to a corresponding external terminal through solder material, and a wall provided for the solder material on at least any one of adjacent internal terminals of said internal terminals.

Abstract: A wired circuit board includes an insulating layer and a conductive layer. The insulating layer continuously has a first insulating portion, a second insulating portion having a thickness smaller than that of the first insulating portion, and a third insulating portion disposed between the first insulating portion and the second insulating portion and having a thickness that gradually becomes smaller from the first insulating portion toward the second insulating portion. The conductive layer continuously has a first conductive portion disposed at one-side surface of the first insulating portion and a second conductive portion disposed at one-side surface of the second insulating portion and having a thickness smaller than that of the first conductive portion. The first conductive portion is disposed at one-side surface of the second insulating portion and the third insulating portion or is disposed at one-side surface of the first insulating portion and the third insulating portion.

Abstract: Electronic apparatus includes a laminated multi-layer circuit substrate, including first and second rigid cards and a flexible section between the first and second rigid cards. First and second sets of electrical terminals are disposed respectively on the first and second rigid cards and arranged to mate with respective bus connectors configured in accordance with a predefined bus standard. At least one bus interface circuit is configured to communicate over a bus in accordance with the predefined bus standard and disposed on the first rigid card. Printed conductors run continuously from the first rigid card, over the flexible section of the substrate, to the second rigid card and connect the at least one bus interface circuit on the first rigid card to the second set of electrical terminals on the second rigid card.

Abstract: A printed circuit board including an electronic component and a method of producing the same are provided. The printed circuit board includes a multilayered substrate including an insulation layer and an inner circuit layer laminated therein, a cavity disposed in the multilayered substrate, a via disposed in the insulation layer and configured to electrically connect the inner circuit layer with another inner circuit layer, a first electronic component inserted in the cavity, and a bump pad disposed on a surface of the cavity facing the first electronic component, and the bump pad is formed by having the insulation layer and the via exposed to a lateral side of the cavity.

Abstract: A display device is disclosed. In one aspect, the display device includes a panel including a plurality of wiring patterns and a flexible printed circuit board formed over and at least partially overlapping an edge of the panel. The flexible printed circuit board includes a connection portion electrically connected to the panel and the connection portion includes first and second surfaces opposing each other. The wiring patterns include a plurality of first wiring patterns connected to the first surface of the connection portion and a plurality of second wiring patterns connected to the second surface of the connection portion.

Abstract: A circuit board includes a dielectric layer, a first circuit layer, a second circuit layer and at least an electrically conductive pole. The dielectric layer includes a first side and a second side opposite to the first side. The first circuit layer is located at the first side of the dielectric layer, and includes a plurality of spaced first circuit patterns embedded into the dielectric layer. The second circuit layer is located at the second side of the dielectric layer, and includes a plurality of spaced second circuit patterns located outsides the dielectric layer. The electrically conductive pole electrically couples the first circuit layer to the second circuit layer. Each of the first circuit patterns has an extension direction from the first side toward the second side, and has widths thereof gradually decreasing along the extension direction. A method for manufacturing the circuit board is also provided.

Abstract: The invention relates to a method for creating a multi-component device, including the following steps, creating a module having a multilayer structure comprising electrical/electronic components arranged on at least one substrate in stacked layers, the components each having a main surface exposed to the outside, wherein the components are arranged such that the respective main surfaces thereof are oriented in mutually opposite directions. The invention also relates to the corresponding device.

Abstract: Embodiments of the present disclosure provide a method that includes forming a wireless module on a first region of a circuit board and forming a host controller module on a second region of the circuit board. The method also includes forming, on the circuit board, a perforation along a boundary that separates the first region from the second region. The method further includes forming a plurality of first trace structures in the first region and forming a plurality of second trace structures in the second region, wherein each second trace structure of the plurality of second trace structures is electrically coupled to a corresponding first trace structure of the plurality of first trace structures. The method also includes disposing a tri-state contact in the second region.

Abstract: A charging system may include a charging apparatus having a controller and a power transmitter. The controller may be configured to determine a device position relative to the controller based on at least one signal received from the device. The controller may also be configured to determine whether the device position is at an optimal position, and provide feedback indicative of the device position.

Abstract: An assembly comprising a first article, a second article adjacent the first article, and an electrically conductive adhesive in electrical communication with the first article and the second article. The electrically conductive adhesive comprises nickel nanostrands dispersed in a matrix comprising a reaction product of bisphenol-F epoxy resin, resorcinol diglycidyl ether epoxy monomer, and at least one amine-containing curing agent. The electrically conductive adhesive exhibits a tensile adhesion strength greater than about 5,000 psi and a volume resistivity less than about 0.01 ?·cm. Electrically conductive adhesives including nickel nanostrands, precursor packages of the electrically conductive adhesive, related methods of forming the electrically conductive adhesive and an assembly including the electrically conductive adhesive are also disclosed.

Abstract: An electrode arrangement which is based on elastomer and has elasticity and flexibility may include: an elastomer substrate; first and second pads arranged over the substrate; and a conductive wire connecting the first and second pads. One or more regions of the conductive wire may be bent in a vertical or horizontal direction with respect to the substrate.

Abstract: A stretchable circuit board includes a stretchable base, a stretchable wiring portion, a reinforcement base having in-plane rigidity higher than that of the stretchable base, and a draw-out wiring portion. The stretchable wiring portion having stretchability is formed on a main surface located on at least one side of the stretchable base. The draw-out wiring portion is formed at least on a main surface that is one side of the reinforcement base. The main surface of the reinforcement base is overlaid with a part of an area where the stretchable wiring portion is formed, in which the main surface faces the main surface of the stretchable base. A part of the stretchable wiring portion and a part of the draw-out wiring portion are joined together, and they are electrically continuous.

Abstract: A method of manufacturing a rigid-flexible printed circuit board, which including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.

Abstract: An electronic device with COF package is provided. The electronic device includes a flexible substrate, a core circuit unit, multiple output pads and multiple switching elements. First terminals of the switching elements are respectively and electrically connected to output pads of the core circuit unit, and second terminals of the switching elements are respectively and electrically connected to the output pads. In a test stage of the electronic device, the switching elements are sequentially turned on such that one of multiple output signals of the core circuit unit is transmitted to a common test pad outside of the electronic device through corresponding one of the output pads.

Abstract: A resin substrate includes an insulating substrate, and first and second signal conductors that partially extend in parallel or substantially in parallel with each other along a signal transmission direction. The first signal conductor includes a parallel portion that extends in parallel or substantially in parallel with the second signal conductor along the signal transmission direction, and a first connection portion. In a portion where the first signal conductor and the second signal conductor extend in parallel or substantially in parallel with each other, the first signal conductor and the second signal conductor are disposed at a same position in the thickness direction of the insulating substrate, and the first connection portion is disposed at a different position from the second signal conductor in the thickness direction and a width direction of the insulating substrate.

Abstract: Through positioning between a first mark portion of a first substrate body and a second mark portion of a second substrate body, a first connection terminal portion and a second connection terminal portion are superimposed on each other simultaneously with the superimposition of the second substrate body on the first substrate body. In addition, a first substrate cut-off portion and a second substrate cut-off portion are also superimposed on each other. The first connection terminal portion of a first row and the second connection terminal portion of the first row are electrically bonded to each other by thermo-compression bonding or the like.

Abstract: Electronic devices may include displays. A display may include backlight structures that generate light and display layers that generate images using the generated light. An electronic device may include an opaque flexible printed circuit that is wrapped around one or more edges of the backlight structures. The opaque flexible printed circuit may prevent light from the backlight structures from reaching other electronic components or escaping from the device. The opaque flexible printed circuit may include signal lines that communicate signals between a printed circuit board and the display. The opaque flexible printed circuit may be a layer of the printed circuit board that extends from an edge of the printed circuit board. The printed circuit board may include an additional flexible extended printed circuit layer that wraps around a surface of the printed circuit board and forms a portion of a conductive shield over that surface.

Abstract: Some forms relate to a method of making a stretchable computing system. The method includes attaching a first set of conductive traces to a stretchable member; attaching a first electronic component to the first set of conductive traces; adding a first set of flexible conductors to the stretchable member such that the first set of flexible conductors is electrically connected to the first set of conductive traces; adding stretchable material to the stretchable member such that the first set of conductive traces is surrounded by the stretchable member; forming an opening in the stretchable member that exposes the first set of conductive traces; and attaching a second set of conductive traces to the stretchable member such that the second set of conductive traces fills the opening to form a via in the stretchable member that electrically connects the first set of conductive traces with the second set of conductive traces.

Abstract: An optical module structure includes a light source, a light receiver, a dielectric layer, a circuit layer, an encapsulant and a light shielding structure. The light source is embedded in the encapsulant, and a first surface of the light source is exposed from a first surface of the encapsulant. The light receiver is embedded in the encapsulant, and a first surface of the light receiver is exposed from the first surface of the encapsulant. The dielectric layer is disposed on the first surface of the encapsulant. The circuit layer is disposed on the dielectric layer and electrically connected to the light source and the light receiver. The light shielding structure is disposed in the dielectric layer corresponding to a location between the light source and the light receiver.

Abstract: Embodiments of the present disclosure are directed towards a mold chase for integrated circuit package assembly and associated techniques and configurations. In one embodiment, a method includes receiving a package substrate, the package substrate including a first die mounted on the package substrate by a plurality of first interconnect structures, and a plurality of second interconnect structures disposed on the package substrate and to route electrical signals of a second die, protecting a top surface of individual interconnect structures of the plurality of second interconnect structures from deposition of a mold material, and depositing the mold material on the package substrate between the individual interconnect structures of the plurality of second interconnect structures. Other embodiments may be described and/or claimed.

Abstract: A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.

Abstract: A method for manufacturing a circuit redistribution structure includes the following steps. A first dielectric is formed on a carrier. Conductive blind vias are formed in the first dielectric. A first circuit redistribution layer is formed on the first dielectric. A second dielectric is formed on the first dielectric. First and second holes are formed on the second dielectric. A trench is formed in the second dielectric to divide the second dielectric into first and second portions. A first portion of the first circuit redistribution layer and the first hole are disposed in the first portion of the second dielectric, and a second portion of the first circuit redistribution layer and the second hole are disposed in the second portion of the second dielectric. Conductive blind vias are formed in the first and second holes, and a second circuit redistribution layer is formed on the second dielectric.

Abstract: [Problem to be Solved] A multilayer flexible printed circuit board having a strip line advantageous to folding is provided. [Solution] A multilayer flexible printed circuit board 100 of an embodiment is a multilayer flexible printed circuit board having a strip line foldable at a folding part F1, the board including: a flexible insulative substrate 30; an inner layer circuit pattern 5 provided inside the flexible insulative substrate 30 and including a signal line 6 extending in a predetermined direction; a ground thin film 14a constituting a ground layer at least in the folding part F1 out of a ground layer of the strip line and constituted of a nonelectrolytic plating coat 14 formed on the flexible insulative substrate 30; and a protective layer 20 that covers the ground thin film 14a and is in close contact with an exposed part 19 from which the flexible insulative substrate 30 is exposed.

Abstract: A flexible printed circuit may include a flexible body portion and a flexible head end portion, where conductors and/or elongated cut outs may be formed in a pattern. The flexible body may include a proximal end and a distal end, wherein the proximal end is configured to be connected to a stationary object and the distal end is configured to be connected to a moving object that moves in relation to the stationary object. The head end of the flexible printed circuit may be located at the distal end of the flexible body. The head end may include a plurality of elongated cut-outs, and/or a plurality of electrical connection pads suspended from the flexible body by the plurality of elongated cutouts.

Abstract: Embodiments disclosed herein generally relate to hermetic electrical connectors used in hard disk drives. The hermetic electrical connector includes a barrier structure having a first plurality of connecting pads disposed on a first surface of the barrier structure and a second plurality of connecting pads disposed on a second surface of the barrier structure opposite the first surface. A plurality of conductors is disposed within the barrier structure, and each conductor is coupled to a connecting pad of the first plurality of connecting pads and a corresponding connecting pad of the second plurality of connecting pads. The barrier structure further includes a dielectric material between the first and second surfaces, and one or more layers embedded in the dielectric material. The addition of the layers helps choke the helium gas flow, thus improving sealing of the electrical connector while maintaining high-speed electrical transmission.

Abstract: This electronic circuit, includes a set of electronic boards intended to support components and linked together by joining elements. The joining elements include curved flexible printed circuits linking two opposing ends of two electronic boards running side by side, the said curved flexible printed circuits being foldable for erecting the electronic circuit into a volume so that the electronic circuit comprises electronic boards placed opposite one another.

Abstract: Provided is a sheet-type heat pipe that has a sufficient heat transport capability and can be effortlessly installed in a thin chassis. The sheet-type heat pipe is made of a sealed container formed by stacking and joining together at least two etched sheet bodies formed as metal foil sheets. Particularly, etching or pressing is performed on the surface of the sheet bodies to join at least two sheet bodies such that fine concavities and convexities can be formed on the inner surface of the container and the sheet-type heat pipe with a sufficient heat transport capability can thus be obtained even when the sealed container is thinly formed with its thickness not larger than, e.g. 0.5 mm. More particularly, since the thickness of the container is thinly formed, the sheet-type heat pipe of the present invention can be effortlessly installed in a thin chassis of a mobile terminal.

Abstract: A flexible printed circuit and printed circuit board soldered structure is provided. The structure includes signal transmission lines which dispense with any through hole, thereby enhancing integrity of high-frequency signals. The special design of the signal line structure of the flexible printed circuit and the printed circuit board together provides a satisfactory high-frequency signal transmission interface and enables a soldering technique which is highly practicable and compatible with the flexible printed circuit and printed circuit board soldered structure.

Abstract: According to an embodiment, an electronic device includes a housing, metal patches, and a first metal member. The housing includes a bottom, a lid, and a side unit. The side unit is disposed to enclose a space between the bottom and the lid. A circuit substrate is disposed on a bottom surface of the bottom. The side unit is conductive and connected to a ground potential. The metal patches are disposed on a lid surface of the lid. The metal patches are arranged periodically in a first direction and a second direction. The second direction intersects the first direction. The metal patches are connected to the ground potential. The first metal member is disposed on the lid surface. The first metal member is connected to the ground potential. The first metal member includes a first portion. The first portion contacts a first surface of the side unit.

Abstract: A three-dimensional (3D) display apparatus, display module, and a manufacturing method thereof, are provided. The 3D display apparatus includes a display module including a first display panel configured to display a two-dimensional (2D) image, a second display panel disposed in front of the first display panel and spaced apart from the first display panel, and configured to display another 2D image that when combined with the 2D image displayed by the first display panel generates a 3D image, and a spacing panel comprising a rear surface on which the first display panel is attached and a front surface on which the second display panel is attached, the spacing panel providing an amount of space between the first display panel and the second display panel.

Abstract: A stretchable wire including a stretchable solid-phase conductive structure; a stretchable insulation layer which surrounds the solid-phase conductive structure; and a liquid-phase conductive material layer disposed between the solid-phase conductive structure and the stretchable insulation layer, and in contact with the solid-phase conductive structure, and a method of fabricating the same.

Abstract: A flexible substrate is provided with: a stretchable sheet; a member located on the sheet; and a stretchable strip connected to the member, and located on the sheet. When the amount of extension of the sheet is equal to or less than a predetermined value, the sheet has a first elastic modulus, and when the amount of extension of the sheet exceeds the predetermined value, the sheet has a second elastic modulus that is greater than the first elastic modulus and greater than the elastic modulus of the strip.

Abstract: Provided is a copper foil provided with a carrier in which the laser hole-opening properties of the ultrathin copper layer are good and which is suitable for producing a high-density integrated circuit substrate. A copper foil provided with a carrier having, in order, a carrier, an intermediate layer, and an ultrathin copper layer, wherein the specular gloss at 60° in an MD direction of the intermediate layer side surface of the ultrathin copper layer is 140 or less.

Abstract: A liquid ejection head includes a circuit board having a wire pattern divided into a plurality of portions in order to provide the circuit board with very reliable bonding.

Abstract: Some forms relate to a stretchable computing device that includes a stretchable body; a first electronic component embedded within the stretchable body; a second electronic component embedded within the stretchable body; and wherein the first electronic component and the second electronic component are connected by stretchable electrical connectors that include vias. The stretchable electrical connectors are non-planar and/or may have a partial zig-zag shape and/or a partial coil shape. In some forms, the stretchable computing device further includes a textile attached to the stretchable body.

Abstract: A multi-layer substrate structure to achieve multiple arrangements of power/ground domains is disclosed. The multi-layer substrate structure comprises a first layer for disposing an integrated circuit thereon and a second layer coupled to the first layer, wherein a connection structure is electrically connected to a plurality of power/ground domains on the second layer. With different combinations of the sawing lines and keep-out regions on the multi-layer substrate structure for cutting off some portions of the connection structure, the invention can achieve multiple arrangements of power/ground domains without impacting the customer's PCB or system board design so as to cut short the cycle time for engineering development phase.

Abstract: An electronic device including a stretchable/contractible base and a wiring formed on the base, the wiring being divided into a first region having a shape extending in a proceeding direction and a second region in which the proceeding direction is curved. The wiring includes a first conductive layer and a second conductive layer formed of a material that makes the second conductive layer easier to be curved than the first conductive layer. The first conductive layer is formed in the first region and the second conductive layer is formed in the second region.

Abstract: An exemplary embodiment provides a conductive connecting member, and a display device including the same, that includes a flexible elongated body and terminals formed at opposite ends of the body to be electrically connected to the body, wherein the body may include terminal areas in which the terminals are formed and a central area disposed between the terminal areas, and wherein two or more recess portions may be formed in edges of the body within the central area of the body.

Abstract: A printed circuit board assembly and method of assembly is provided for a printed circuit board having a top and bottom surface with at least one edge portion having a rounded surface extending from the top surface to a point below the top surface and at least one electrical contact pad located on the top surface and extending over the edge portion rounded surface to a point below the top surface.

Abstract: A cable-equipped connector, in which a composite connector comprises a conversion element that converts optical signals and electrical signals, a circuit board in which circuit components for transmitting electrical signals are provided to a plated-shaped substrate and to which the conversion element is electrically connected, and a housing that houses the conversion element, the circuit board and the ends of electrical cables; wherein in the housing, the ends of the electrical cables are isolated in a direction perpendicular to the direction of the connection with the mating electrical connector, from at least either one of the conversion element or the circuit components of the circuit board by a separator of the housing or the substrate of the circuit board.