Attaching Clip Or Finger Patents (Class 174/354)
  • Patent number: 11064636
    Abstract: Exemplary embodiments are disclosed of EMI shields including electrically-conductive foam (broadly, electrically-conductive resiliently compressible porous material). An exemplary embodiment includes an electromagnetic interference (EMI) shield for an optical transceiver including transmitter and receiver optical sub-assemblies. The EMI shield includes a portion having openings configured for receiving the transmitter and receiver optical sub-assemblies therethrough to thereby allow the EMI shield to be fit over the transmitter and receiver optical sub-assemblies for installation along a portion of the optical transceiver. The EMI shield also includes sidewalls depending from the portion that includes the openings. Electrically-conductive resiliently compressible porous material (e.g., electrically-conductive foam, etc.) is along at least a portion of an outer perimeter defined by the sidewalls.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: July 13, 2021
    Assignee: Laird Technologies, Inc.
    Inventors: Yongxue He, Waleed Alam
  • Patent number: 11033982
    Abstract: A laser processing system is disclosed, which includes a system frame, a process frame movably supported by the system frame, an optics wall coupled to the process frame, a process shroud coupled to the system frame and extending over and alongside upper and lateral peripheral regions of the optics wall and an optics shroud coupled to the process shroud. The process frame is configured to support a laser source, a workpiece positioning system and a beam delivery system. The process frame is moveable relative to the process shroud and the process frame is moveable relative to the optics shroud. The process shroud, the optics wall and the process frame enclose a first space for laser processing of a workpiece. The optics shroud, the optics wall and the process frame enclose a second space for accommodating the laser source.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: June 15, 2021
    Assignee: Electro Scientific Industries, Inc.
    Inventor: Mark Kosmowski
  • Patent number: 11032954
    Abstract: A shield can assembly is described. In one or more implementations, a frame is installed on a printed circuit board (PCB) by using a cross-bar connected to opposing sides of the frame to place the frame on the PCB. Subsequent to installation of the frame on the PCB, the cross-bar is removed from the frame. Once the cross-bar is removed, one or more flexible printed circuits (FPCs) are installed on the PCB. Then, a lid is connected to the frame to from a shield can over the FPCs.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: June 8, 2021
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Stephen C. Klein, Todd David Pleake, Daniel M. Galel, Ivan Andrew McCracken, Mark Mitchell Gloster, Duane Martin Evans, Tony N. Kfoury
  • Patent number: 11003220
    Abstract: An electronic apparatus includes a housing having conductivity, an electronic component includes an outer shell having conductivity, and an electrically conductive elastic member. The electrically conductive elastic member has conductivity and elasticity and is disposed between the outer shell of the electronic component and a predetermined inner surface of the housing. A pair of ribs stand on the predetermined inner surface. The electrically conductive elastic member is disposed between the pair of the ribs. The ribs have facing side surfaces facing each other, each of the facing side surfaces has an inclined surface in such a way that each of the facing side surfaces and the predetermined inner surface is in continuous contact with a corresponding part of an outer surface of the electrically conductive elastic member that is compressed, each of the facing side surfaces and the predetermined inner surface facing the corresponding part of the outer surface.
    Type: Grant
    Filed: October 3, 2019
    Date of Patent: May 11, 2021
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventor: Masato Tobinaga
  • Patent number: 10905037
    Abstract: An electronic device including an electromagnetic shielding structure is provided. The electronic device includes a printed circuit board, an antenna module, and an electromagnetic wave shielding structure. The antenna module includes a radio frequency integrated circuit mounted on the printed circuit board, and an array antenna coupled to an upper portion of the radio frequency integrated circuit. The electromagnetic wave shielding structure surrounds a side portion of the antenna module.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: January 26, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Eunbong Han, Hyeonhyang Kim, Ohyun Beak
  • Patent number: 10653048
    Abstract: According to various aspects, exemplary embodiments are disclosed of frames for shielding assemblies. Exemplary embodiments are also disclosed of shielding assemblies including such frames. In exemplary embodiments, a frame for a board level shield (BLS) may include at least one finger or tab (broadly, a portion or contact) configured to fill, cover, or close off a gap or void defined by a cover's sidewalls to thereby inhibit or prevent EMI leakage through the gap or void.
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: May 12, 2020
    Assignee: Laird Technologies, Inc.
    Inventor: Daniel C. Green
  • Patent number: 10631419
    Abstract: A mounting bracket comprising a first (top) surface with a slot, second (bottom) surface, and a shield (front) surface extending between the top and bottom surfaces, and two side (right and left) surfaces coupled with the top, bottom, and front surfaces. A cavity is formed by the top, bottom, front, left, and right surfaces. Mounts on the top surface enable a housing to be mounted on the top surface. Mounts coupled with the left and right edge surfaces enable the bracket to mounted on an external surface. Optionally, the top surface may further comprise a hidden mount on the distal edge of the top surface, the hidden mount is hidden when a housing is mounted on the top surface and/or a security pin. When the bracket is mounted to an external surface, the slot in the top surface allows a connector to extend from the cavity to the housing.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: April 21, 2020
    Assignee: Diebold Nixdorf, Incorporated
    Inventor: Robert Michael Cole
  • Patent number: 10595451
    Abstract: A shielding structure of a circuit board and an electronic device having the structure are disclosed. The electronic device includes a casing, a circuit board and a shielding structure. The shielding structure includes a shielding film and a ground guide member electrically configured on the circuit board. The shielding film includes two insulation layers and a metal layer placed between the two insulation layers, hence forming a sandwich structure. One of the insulation layers is adhered to the circuit board and is provided with an opening. The metal layer is exposed via the opening to form a guide portion, such that the shielding film can be electrically connected to the ground guide member through the exposed guide portion to further be grounded. Thus, complete noise shielding effects and efficient noise grounding effects are achieved.
    Type: Grant
    Filed: December 5, 2018
    Date of Patent: March 17, 2020
    Assignee: GETAC TECHNOLOGY CORPORATION
    Inventors: Min-Yu Wang, Chi-Jung Wu
  • Patent number: 10548248
    Abstract: A cooling assembly for an IOT wireless gateway device that includes a motherboard structure operatively coupled to one side of a first motherboard component, which is operatively coupled on the other side to one side of a first gap pad for conducting heat, an EMI shield operatively coupled to the other side of the first gap pad and surrounding the sides of the first motherboard component, the EMI shield also operatively coupled to the motherboard structure, the outside of the EMI shield operatively coupled to one side of a second gap pad for conducting heat, and a first heat sink operatively coupled to the other side of the second gap pad for conducting heat.
    Type: Grant
    Filed: February 10, 2016
    Date of Patent: January 28, 2020
    Assignee: Dell Products, LP
    Inventors: Christopher M. Helberg, Travis C. North, Tifenn M. Boisard, Deeder M. Aurongzeb
  • Patent number: 10537048
    Abstract: Systems and methods for preventing leakage of electromagnetic waves from electronic devices, or for preventing unwanted RF fields from entering an electronic device. According to an aspect, a system includes a body and a cover positioned to define an enclosed interior space for placement of an electronic device. The system also includes a gasket attached to or integrated one of the body and cover to seal the interior space from outside the electronic device enclosure. Further, the system includes an electromagnetic wave absorptive material attached to a portion of the gasket for absorbing electromagnetic waves generated within or outside of the electronic device enclosure.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: January 14, 2020
    Assignee: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
    Inventors: Edward James Bodette, Michael Harley Crowder, Kevin Perveiler
  • Patent number: 10462943
    Abstract: A shield is provided, including a frame and a cover. The frame includes a plurality of frame side walls and a frame top structure. Each frame side wall includes at least one frame side wall wedge. The frame side walls are connected to the frame top structure, and the frame top structure includes at least one cantilever beam. The cover includes a plurality of cover side walls and a cover top structure. Each cover side wall includes at least one cover side wall opening. The frame side wall wedge is adapted to be wedged into the cover side wall opening to restrict the movement of the cover in a first direction. The cover side walls are connected to the cover top structure. The cover top structure includes at least one cover top opening. The cantilever beam is wedged into and abuts the cover top opening.
    Type: Grant
    Filed: September 15, 2017
    Date of Patent: October 29, 2019
    Assignee: WISTRON NEWEB CORP.
    Inventors: Jen-Yung Chang, Tiao-Ming Hsu
  • Patent number: 10412866
    Abstract: The present disclosure provides a cover film, including a conductive adhesive layer, an electromagnetic shielding layer formed on the conductive adhesive layer, and an insulating layer formed on the electromagnetic shielding layer. The electromagnetic shielding layer has a thickness of from 0.01 to 25 micrometers, such that the cover film can shield electromagnetic interference through the thinner interposed electromagnetic shielding layer.
    Type: Grant
    Filed: May 4, 2018
    Date of Patent: September 10, 2019
    Assignee: ASIA ELECTRONIC MATERIAL CO., LTD.
    Inventors: Chih-Ming Lin, Hui-Feng Lin, Chien-Hui Lee
  • Patent number: 10349567
    Abstract: The invention relates to an EMI gasket for mounting on a wall of a housing of an electrical appliance. The gasket includes a plurality of elements arranged in a row wherein two adjacent elements are interconnected by connection pieces. At least one of the elements includes a clamping section for clamping the device onto the housing and a shielding section to perform the shielding function. According to the invention, at least one element further includes a snapping member which serves as a barb for latching into a recess within the wall of the housing where the gasket is to be installed such that the gasket is locked on the wall thereby preventing unintentional movement of the gasket or even that the gasket is slipping off of the housing.
    Type: Grant
    Filed: April 6, 2017
    Date of Patent: July 9, 2019
    Assignee: DELTA ELECTRONICS (THAILAND) PUBLIC CO., LTD.
    Inventor: Sven Allenberg
  • Patent number: 10306794
    Abstract: An electrical circuit arrangement has at least one capacitor (1) and at least one other circuit part (4) electrically cooperating with the first capacitor (1). The first capacitor (1) is part of a first capacitor arrangement (2) which annularly surrounds the cavity (3). The other circuit part (4) is provided at least partially within the cavity (3) and is electrically connected to the first capacitor (1). The first capacitor arrangement (2) has fastening elements (7) by means of which the circuit arrangement can be mechanically fastened to a holding element (8).
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: May 28, 2019
    Assignee: Siemens Aktiengesellschaft
    Inventors: Thomas Bigl, Alexander Hensler, Stephan Neugebauer, Stefan Pfefferlein
  • Patent number: 10265900
    Abstract: Methods for manufacturing fabric-reinforced weatherstrip include incorporating a fabric application step into a process for making coated substrates. In one embodiment, a strip of the fabric from a roll of material may be applied directly onto a coating after it has been applied in a coat die to a foam profile, while the coating is still in the molten state. Alternatively, a fabric application plate may be attached to an upstream side of coating die with a fabric feed channel cut into the plate. The fabric follows the channel to contact and mate with the foam profile. The fabric applicator plate may be configured so as to exert pressure on only the part of the product where the fabric is being applied. Ultrasonic welding techniques may also be employed.
    Type: Grant
    Filed: May 4, 2016
    Date of Patent: April 23, 2019
    Assignee: Amesbury Group, Inc.
    Inventors: John E. Huntress, Peter Mertinooke
  • Patent number: 10156870
    Abstract: An electronic device may include a printed circuit board (PCB) including at least one electronic component, and an electrically conductive enclosure surrounding the at least one electronic component to provide electromagnetic interference (EMI) shielding for the at least one component. The electrically conductive enclosure may include a frame, made of a resilient, electrically conductive material, on a mounting surface of the PCB, surrounding the at least one component, and an electrically conductive shielding cover extending across an open top area defined by the frame. The frame may be attached to the PCB and the cover by an electrically conductive material to provide for electrical continuity. The frame may be made of a resilient, electrically conductive material so that the frame may compress in response to an externally applied force, and may return to an original, non-compressed form upon removal of the externally applied force.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: December 18, 2018
    Assignee: GOOGLE LLC
    Inventors: James Cooper, Joshua Norman Lilje
  • Patent number: 10128584
    Abstract: Disclosed is an elastic electric contact terminal comprising: an elastic core; a polymer film which is bonded while covering the core, with an adhesive layer being interposed therebetween; and a copper foil capable of being soldered, which is bonded while covering the polymer film. A metal plating layer is formed on every surface exposed outwardly from the copper foil.
    Type: Grant
    Filed: March 20, 2017
    Date of Patent: November 13, 2018
    Assignee: JOINSET CO., LTD. & SUN-KI KIM
    Inventor: Sun-Ki Kim
  • Patent number: 10051766
    Abstract: An electromagnetic wave shielding structure includes a conductive cover, a circuit board disposed on the conductive cover, a gasket mounted on the circuit board to contact the circuit board and having an opening, and a conductive holder protruding from the conductive cover so as to be inserted through the opening in the gasket and contacting the gasket, wherein the gasket includes an elastic member an internal space communicating with the opening, and a conductive member applied to the elastic member, wherein the conductive members applied to the outer and inner surfaces of the elastic member are connected to each other, and wherein the conductive member applied to the outer surface contacts the circuit board, and the conductive member applied to the inner surface contacts the conductive holder.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: August 14, 2018
    Assignee: LG Display Co., Ltd.
    Inventors: Jong-Sik Ham, Dae-Sung Park
  • Patent number: 10028419
    Abstract: A gasket assembly structure including a frame which includes a front half and a back half joined together with a plurality of interlocking tabs located around a perimeter of the frame, defining a window, and an electromagnetic gasket, constrained between the front half and the back half of the frame; where the electromagnetic gasket lines an interior perimeter of the window and partially extends from the frame into the window, and a passageway through the window of the frame with boarders defined by the constrained electromagnetic gasket. A housing structure including a receptacle recessed within an opening on a front side of the housing, the receptacle is rigidly attached to the housing, and a gasket assembly recessed within the opening and located between the front side of the housing and the receptacle, where the gasket assembly is directly secured to the housing.
    Type: Grant
    Filed: February 6, 2017
    Date of Patent: July 17, 2018
    Assignee: International Business Machines Corporation
    Inventors: William L. Brodsky, Robert R. Genest, John J. Loparco, Michael T. Peets
  • Patent number: 10021817
    Abstract: Exemplary embodiments are disclosed of shielding apparatus or assemblies having a frame with drawn latching features or portions that are configured for removably attaching a cover to the frame. In an exemplary embodiment, there is a shielding apparatus suitable for use in providing electromagnetic interference shielding for one or more electrical components on a substrate. In this example, the shielding apparatus generally includes a cover and a frame. The cover includes one or more openings. The frame includes a top surface and sidewalls configured to be disposed generally about one or more electrical components on a substrate. The frame is partly drawn in construction such that the frame includes one or more drawn latching features or portions configured to be engaged within the one or more openings of the cover to thereby releasably attach the cover to the frame.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: July 10, 2018
    Assignee: Laird Technologies, Inc.
    Inventors: Kenneth M. Robinson, Mark Fucci, Paul W. Crotty, Jr.
  • Patent number: 9928933
    Abstract: The present disclosure relates to an electrical device, and a method for arranging a conductive member. A conductive member is arranged to contact the ground portion electrically grounded and the electric wire attached to the ground portion by a first attachment member and a second attachment member. The conductive member is arranged between the first attachment member and the second attachment member.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: March 27, 2018
    Assignee: Canon Kabushiki Kaisha
    Inventor: Junnosuke Yokoyama
  • Patent number: 9831589
    Abstract: A compressible contact pin. The contact pin includes a first contact element and a second contact element. A compressible member is coupled between the first contact element and the second contact element to compress when one or more external forces are applied between the first contact element and the second contact element. In addition, the compressible member maintains a separation distance between the first and second contact elements when no external forces are applied. A plurality of conductive particles is bounded by the compressible member to form an electrical connection between the first contact element and the second contact element. The conductive particles are configured to compress with one another when the compressible member is compressed.
    Type: Grant
    Filed: December 27, 2016
    Date of Patent: November 28, 2017
    Assignee: Corad Technology Inc.
    Inventor: Ka Ng Chui
  • Patent number: 9521741
    Abstract: A circuit board assembly includes a first shield positioned over a top surface of a printed circuit board and a second shield positioned over a bottom surface. The first and second shields include conductive tabs which are coupled to a first side surface of the circuit board, wherein the tabs of the first shield are generally interposed or staggered with the tabs of the second shield.
    Type: Grant
    Filed: June 4, 2014
    Date of Patent: December 13, 2016
    Assignee: Amazon Technologies, Inc.
    Inventors: Libo Wang, Jasmin B. Farshi, Andrew Frederick Skipor
  • Patent number: 9390045
    Abstract: A bus node for an electric coupling of a bus system to a functional module arrangement, having an electronic circuit for converting electrical signals between a bus protocol provided by the bus system and an internal communications protocol provided by the functional module arrangement, and having a first coupling means for electrically connecting the electronic circuit to the functional module arrangement, and having a second coupling means for electrically connecting the electronic circuit to the bus system, wherein the first coupling means comprises a first contact means that is configured for a direct electrical contact with a ground connection of the functional module arrangement.
    Type: Grant
    Filed: January 21, 2012
    Date of Patent: July 12, 2016
    Assignee: FESTO AG & CO. KG
    Inventors: Rolf Rohwer, Andreas Alois Siedler, Jürgen Eckert
  • Patent number: 9277652
    Abstract: A printed circuit board has a cavity formed in at least one side thereof and an electronic component disposed at least partially within that cavity. Electromagnetic interference (EMI)-shielding material is disposed between the electronic component and at least one of the side walls and bottom of this cavity. So configured, the overall height of the combined structure is reduced as compared to a surface-mounted component.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: March 1, 2016
    Assignee: BlackBerry Limited
    Inventors: Kevin Edward Booth, Xiaoping Jordge Qin
  • Patent number: 9247680
    Abstract: A gasket is formed by applying an adhesive on four sides of an elastic body of a closed cell polyurethane material, wrapping a copper film around the elastic body other than a bottom bonding surface, forming a coating layer by depositing or plating nickel on a surface exposing the copper film, and forming a resin coating layer on the nickel coating layer A conductive adhesive is applied on the bottom surface.
    Type: Grant
    Filed: August 19, 2014
    Date of Patent: January 26, 2016
    Assignee: ICH CO., LTD.
    Inventor: Young Hun Kim
  • Patent number: 9089044
    Abstract: A molded connector gasket of indefinite length or circumference that provides electromagnetic interference shielding of electronic components is disclosed. The disclosed gasket may have a cross-sectional profile comprising three protruding members including a first member being generally vertical, a second member being generally forty-five degrees from the first member via a curve, and a third member protruding from the second member near the curve, the third member being at an angle generally less than vertical but more than forty five degrees with respect to the second member.
    Type: Grant
    Filed: April 4, 2014
    Date of Patent: July 21, 2015
    Assignee: Laird Technologies, Inc.
    Inventor: Kenneth M. Robinson
  • Patent number: 9055666
    Abstract: A clip terminal soldered to and mounted on a circuit board, includes a connection part bent at an angle corresponding to that of a corner of a case and at least a pair of clips connected to each other by the connection part. The connection part and the clips are integrated with each other. The connection part has a width less than or equal to that of a solder pattern of the circuit board on which the clip terminal is soldered. A lower end of the corner of a sidewall of the case is fitted into the clips.
    Type: Grant
    Filed: May 17, 2012
    Date of Patent: June 9, 2015
    Assignees: Joinset Co., Ltd.
    Inventor: Sun-Ki Kim
  • Patent number: 8933346
    Abstract: The present invention is directed to an electromagnetic interference (EMI) shielding device. The EMI shielding device may be formed of a material (ex.—Beryllium Copper) having a thickness which allows the shielding device to provide a desired range of compression. Further, the EMI shielding device may be constructed for accommodating tolerances and compression forces which may be encountered in various implementation environments. Further, the EMI shielding device may be sized and shaped for promoting compatibility of the EMI shielding device with Surface Mount Technology (SMT) processes.
    Type: Grant
    Filed: September 28, 2010
    Date of Patent: January 13, 2015
    Assignee: Rockwell Collins, Inc.
    Inventors: John F. Kramer, Joseph M. Strenecky, Nathaniel T. Gould
  • Publication number: 20140360771
    Abstract: An electromagnetic shielding device includes a conductive sheet that is a sheet-shaped flexible conductive member that can be deformed into a tube shape, and an outer edge portion coupling member that keeps the conductive sheet in a tube shape in a state in which a first outer edge portion and a second outer edge portion of the conductive sheet are joined together, the second outer edge portion being located on the side opposite to the first outer edge portion. For example, a parallel slit group is formed in the conductive sheet, the parallel slit group being constituted by a plurality of slits that extend in a direction that crosses a first direction from the first outer edge portion toward the second outer edge portion and that are lined up in the first direction.
    Type: Application
    Filed: December 19, 2012
    Publication date: December 11, 2014
    Inventors: Yasushi Itani, Fujio Sonoda, Naoki Aoyama, Yuichi Kimoto, Masanori Kuwahara, Yoshinori Sugimoto
  • Patent number: 8890004
    Abstract: An electrical connector assembly includes a cage having an upper wall, a lower wall, and side walls that extend from the upper wall to the lower wall. The side walls have exterior sides. The cage includes an interior cavity and a divider that extends between the side walls and divides the interior cavity into at least two internal compartments. The cage includes a front end that is open to the internal compartments. The side walls have front edges at the front end. The internal compartments are configured to receive pluggable modules therein through the front end. An electromagnetic interference (EMI) cover is mounted to the divider such that the EMI cover is engaged with and electrically connected to the divider. The EMI cover includes a flap that wraps around the front edge of a corresponding side wall. The flap overlaps and engages the exterior side of the corresponding side wall.
    Type: Grant
    Filed: January 23, 2012
    Date of Patent: November 18, 2014
    Assignee: Tyco Electronics Corporation
    Inventors: Evan Charles Wickes, Michael Warren Fogg, Steven David Dunwoody, Richard James Long
  • Patent number: 8890003
    Abstract: An apparatus for electromagnetic compatibility (EMC) shielding, the apparatus comprising a first EMC shield with a plurality of substantially parallel interconnected finger elements spaced apart from one another. A second EMC shield with a plurality of substantially parallel interconnected finger elements spaced apart from one another. The first EMC shield coupled to the second EMC shield, wherein at least one finger element of the plurality of finger elements of the first EMC shield is situated between at least two finger elements of the plurality of finger elements of the second EMC shield and in parallel with the at least two finger elements such that a space is formed between the at least one finger element and at least one of the at least two finger elements.
    Type: Grant
    Filed: January 3, 2013
    Date of Patent: November 18, 2014
    Assignee: International Business Machines Corporation
    Inventors: James D. Gerken, David B. Johnson, David G. Lund, Timothy L. McMillan
  • Publication number: 20140305689
    Abstract: A plug for a shielding cage is disclosed and the plug has a unitary body that may be molded as a single piece. The plug has a plug body portion and a handle portion that projects away from the plug body portion. The plug body portion has a plurality of spring arms that extend away from a base member and the spring arms are arranged in pairs and each spring arm is biased outwardly to exert an outward force on the walls of the shielding cage into which it is inserted. The plug is formed from an EMI absorbing material so as to eliminate the need for a separate EMI gasket.
    Type: Application
    Filed: April 15, 2014
    Publication date: October 16, 2014
    Applicant: Molex Incorporated
    Inventor: Jeffrey A. Reeves
  • Patent number: 8816219
    Abstract: Provided is a metal strip for an electromagnetic interference shield case. The metal strip is uniform in width and thickness. A metal clip that is integrated with at least one pair of face-to-face elastic parts and is appropriate for soldering is fitted on an end of the metal strip along a width direction of the metal strip. The metal strip is bent and cut so as to have a shape corresponding to a ground pattern disposed on a printed circuit board, and then, a bottom surface of the metal clip is soldered to the ground pattern or a solder member disposed on the ground pattern.
    Type: Grant
    Filed: May 16, 2012
    Date of Patent: August 26, 2014
    Assignees: Joinset Co. Ltd.
    Inventor: Sun-Ki Kim
  • Patent number: 8792246
    Abstract: A device for protecting a circuit board from electromagnetic interference, and which includes shield to be attached to the circuit board. The device includes a metal plate and a plurality of tangs. The metal plate has a perimeter portion. The plurality of tangs are spaced about and extend transversely away from at least a portion of the perimeter portion of the metal plate. Each tang includes a bridge portion and a finger portion. The bridge portion has a first end attached to the perimeter portion and a second end spaced away from the perimeter portion and attached to the finger portion. The finger portion extends away from the second end of the bridge potion and is disposed at an obtuse angle relative to the bridge portion such that the plurality of tangs, in combination, are adapted to receive the circuit board.
    Type: Grant
    Filed: August 29, 2011
    Date of Patent: July 29, 2014
    Assignee: Fisher Controls International LLC
    Inventors: Scott R. Kratzer, Davin S. Nicholas, Barry L. Gaarder
  • Patent number: 8710376
    Abstract: Various systems of an electronic device and methods for manufacturing the same are provided. In some embodiments, a routing assembly is provided that may not only route a cable along a circuit board, but that may also shield an electronic component or secure an electronic component to the circuit board. In some other embodiments, there is provided a mechanism for electrically coupling two components of an electronic device that may also be visually appealing in the context of other portions of the electronic device.
    Type: Grant
    Filed: February 10, 2012
    Date of Patent: April 29, 2014
    Assignee: Apple Inc.
    Inventors: Shayan Malek, Benjamin John Pope, Daniel William Jarvis, Tang Tan, Richard Hung Minh Dinh, Robert Steinfeld, Ramachandran Chundru
  • Patent number: 8674237
    Abstract: A method and structures are provided for implementing press-lock electromagnetic compatibility (EMC) gaskets. A gasket includes a plurality of fasteners received through a plurality of corresponding mounting apertures in a perforated support surface for precise placement, and retention without adhesives. The corresponding mounting apertures have a diameter smaller than 1/20th of a wavelength of the highest frequency to be suppressed to remain independent of the shielding required. The gasket defines a cavity receiving compliant foam, and includes an absorber.
    Type: Grant
    Filed: August 23, 2012
    Date of Patent: March 18, 2014
    Assignee: International Business Machines Corporation
    Inventors: Don A. Gilliland, Rebeccah J. Vossberg
  • Patent number: 8629355
    Abstract: A shield can of a mobile terminal is provided. The shield can of the mobile terminal includes: at least one shield can installed in a main circuit board of the mobile terminal, and at least one separation wall formed between electronic elements in which electromagnetic interference occurs within the shield can. Hence, shield ability can be improved and simplified manufacturing process of the separation wall can reduce cost.
    Type: Grant
    Filed: December 23, 2010
    Date of Patent: January 14, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Oh Hyuck Kwon, Kyung Jin Oh
  • Patent number: 8558121
    Abstract: An electronic device includes an upper shield arranged on a front side of a circuit board, and a lower shield arranged on a back side thereof. The lower shield includes a contact portion at an edge thereof. The contact portion is in contact with a lower surface of the circuit board. A plate spring portion is formed in the contact portion. An end portion of the plate spring portion abuts on the upper shield.
    Type: Grant
    Filed: March 15, 2011
    Date of Patent: October 15, 2013
    Assignees: Sony Corporation, Sony Computer Entertainment, Inc.
    Inventors: Yuta Tamaki, Hiroaki Tsurumi, Keiichi Aoki
  • Patent number: 8445791
    Abstract: A method and structures are provided for implementing a latching gasket including an electrically conductive fabric, and a latching clip. The latching clip includes a support member carrying the electrically conductive fabric for radio frequency (RF) connection engagement with a first wall surface. The latching clip includes a first channel-defining member and a second channel-defining member extending downwardly from the support member. The first channel-defining member carries the electrically conductive fabric for radio frequency (RF) connection engagement with a second wall surface received in a channel defined by the first and second channel-defining members. The latching clip includes a latch arm extending outwardly and downwardly from an end of the support member near the second channel-defining member.
    Type: Grant
    Filed: December 1, 2010
    Date of Patent: May 21, 2013
    Assignee: International Business Machines Corporation
    Inventors: Edward C. Gillard, Don A. Gilliland, Thomas J. McPhee, III
  • Publication number: 20130048367
    Abstract: An EMI member for a cage assembly that comprises a first half that includes a plurality of spring contact fingers, a second half that includes a spring member that has a plurality of spaced slots therein, and a folded end joining the first and second halves. The folded end defines a receiving area. At least one engagement member extends from one of the first and second halves.
    Type: Application
    Filed: August 22, 2011
    Publication date: February 28, 2013
    Inventor: Zlatan LJUBIJANKIC
  • Publication number: 20130048368
    Abstract: Various systems of an electronic device and methods for manufacturing the same are provided. In some embodiments, a routing assembly is provided that may not only route a cable along a circuit board, but that may also shield an electronic component or secure an electronic component to the circuit board. In some other embodiments, there is provided a mechanism for electrically coupling two components of an electronic device that may also be visually appealing in the context of other portions of the electronic device.
    Type: Application
    Filed: February 10, 2012
    Publication date: February 28, 2013
    Applicant: Apple Inc.
    Inventors: Shayan Malek, Benjamin John Pope, Daniel William Jarvis, Tang Tan, Richard Hung Minh Dinh, Robert Steinfeld, Ramachandran Chundru
  • Patent number: 8362370
    Abstract: The present invention has the object of providing a technology that can facilitate inexpensive shields of individual electronic components with good heat exchange efficiency, the electronic circuit board according to the present invention being provided with: a plurality of conductor parts in a standing state that can extend and contract on a ground pattern that surrounds an electronic component on the electronic circuit board, a conductive plate, and securing members for holding the plate such that the plurality of conductor parts contact the plate in a state in which the conductor parts contract from their natural length.
    Type: Grant
    Filed: November 21, 2008
    Date of Patent: January 29, 2013
    Assignee: NEC Display Solutions, Ltd.
    Inventor: Kazuto Satou
  • Patent number: 8203083
    Abstract: Disclosed is an electromagnetic wave shielding heat-radiation sheet allowing electricity and heat to be transferred from one side surface to the other side surface of the sheet, in which conductive protrusions formed by partially cutting a conductive layer laminated on an elastic support layer are bent toward the rear surface of the elastic support layer to pass through the elastic support layer and come in contact with the rear surface of the elastic support layer.
    Type: Grant
    Filed: April 17, 2008
    Date of Patent: June 19, 2012
    Assignee: Nano Interface Technology
    Inventor: Jin-Ho Song
  • Publication number: 20120138353
    Abstract: A method and structures are provided for implementing a latching gasket including an electrically conductive fabric, and a latching clip. The latching clip includes a support member carrying the electrically conductive fabric for radio frequency (RF) connection engagement with a first wall surface. The latching clip includes a first channel-defining member and a second channel-defining member extending downwardly from the support member. The first channel-defining member carries the electrically conductive fabric for radio frequency (RF) connection engagement with a second wall surface received in a channel defined by the first and second channel-defining members. The latching clip includes a latch arm extending outwardly and downwardly from an end of the support member near the second channel-defining member.
    Type: Application
    Filed: December 1, 2010
    Publication date: June 7, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Edward C. Gillard, Don A. Gilliland, Thomas J. McPhee
  • Publication number: 20110272188
    Abstract: A module retention and electromagnetic interference (EMI) cage has a substantially flat, rectangular metal frame with retaining clip portions and EMI-shielding contact fingers. The frame has surface-mount legs to facilitate surface mounting the cage to the circuit board. An array connector is mounted on the circuit board within a central region of the cage. An electronic module can be inserted or plugged into the cage in conjunction with connecting the module to the array connector. As the module is inserted into the cage, the module resiliently deflects the EMI-shielding contact fingers. At approximately the same time as the connector of the electronic module mates with the array connector, the retaining clip portion mates with a portion of the housing to retain the module in this position.
    Type: Application
    Filed: May 6, 2010
    Publication date: November 10, 2011
    Applicant: AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD.
    Inventor: Seng-Kum Chan
  • Patent number: 7983058
    Abstract: Shielding structure for use in an electronic device comprising a housing and an electronic substrate which is arranged in the housing and which includes electronic parts, wherein the housing includes at least a surface facing the electronic parts, the surface being made of an electrically conductive substance. There is disposed a shielding member made of electrically conductive material comprising a frame-shaped section disposed on the printed board to surround a periphery of the electronic parts and a leaf spring section disposed to project from an upper-edge section of the frame-shaped section toward the inside of the frame-shaped section and upwardly in an inclined direction. The shielding member is disposed on the electronic substrate, and the surface made of an electrically conductive substance of the housing pushes the leaf spring section to be brought into contact therewith.
    Type: Grant
    Filed: January 22, 2008
    Date of Patent: July 19, 2011
    Assignee: NEC Corporation
    Inventor: Takeshi Ishihara
  • Patent number: 7928324
    Abstract: A gasketed collar for reducing EMI emission from a communication module is presented. The gasketed collar includes a conductive metal collar designed to fit at least partway around the communication module, and a gasket. The gasket is electrically conductive and compressible. The gasket fits at least partway around the communication module and overlaps the conductive metal collar. A communication module including such gasketed collar and a method of making such communication module are also presented.
    Type: Grant
    Filed: June 13, 2008
    Date of Patent: April 19, 2011
    Assignee: Finisar Corporation
    Inventor: Joshua Moore
  • Patent number: 7869224
    Abstract: A housing structure for pluggable transceiver module includes a case being internally provided with a plurality of vertical partitioning plates, and having first protrusions provided on an upper and a lower side of a free edge at an open end of the case, and second protrusions provided on two opposite sides of a free end of each of the partitioning plates at the open end of the case; a plurality of first elastic-leaf members being clamped to the free edge of the case and having retaining holes engaged with the first protrusions; and a plurality of second elastic-leaf members being clamped to the free ends of the partitioning plates and having retaining holes engaged with the second protrusions. Therefore, the first and second elastic-leaf members are easily and securely assembled to the case and the partitioning plates via the first and second protrusions, respectively, without the need of spot welding.
    Type: Grant
    Filed: September 18, 2009
    Date of Patent: January 11, 2011
    Assignee: All Best Precision Technology Co., Ltd.
    Inventor: Haven Yang
  • Patent number: 7838780
    Abstract: Systems and methods for simple, efficient and/or cost effective manufacturing and assembly of electronic devices are provided. The various systems and methods of the invention may include various ways of coupling, attaching, and/or connecting the various components of the system to one another, for improved cost and ease of assembly. A number of clips may be used to attach together various parts of an electronic system and housing including circuit devices, enclosure lid and housing, and/or cabling. These clips may be screw-less, may be made of a resilient or spring material, designed so that they quickly snap into place so as to provide good mechanical strength and electrical connection. Various circuit elements may include planar circuits, and may include filters made of a high temperature superconductor material. A planar cable may be used for electrical connecting of components. These systems and devices may be used in, for example, wireless communication systems.
    Type: Grant
    Filed: July 21, 2006
    Date of Patent: November 23, 2010
    Assignee: Superconductor Technologies, Inc.
    Inventors: Edward R. Soares, Stacey M. Bilski, James R. Costa, Ken S. Ono