Abstract: A gasketed collar for reducing EMI emission from a communication module is presented. The gasketed collar includes a conductive metal collar designed to fit at least partway around the communication module, and a gasket. The gasket is electrically conductive and compressible. The gasket fits at least partway around the communication module and overlaps the conductive metal collar. A communication module including such gasketed collar and a method of making such communication module are also presented.

Abstract: A housing structure for pluggable transceiver module includes a case being internally provided with a plurality of vertical partitioning plates, and having first protrusions provided on an upper and a lower side of a free edge at an open end of the case, and second protrusions provided on two opposite sides of a free end of each of the partitioning plates at the open end of the case; a plurality of first elastic-leaf members being clamped to the free edge of the case and having retaining holes engaged with the first protrusions; and a plurality of second elastic-leaf members being clamped to the free ends of the partitioning plates and having retaining holes engaged with the second protrusions. Therefore, the first and second elastic-leaf members are easily and securely assembled to the case and the partitioning plates via the first and second protrusions, respectively, without the need of spot welding.

Abstract: Systems and methods for simple, efficient and/or cost effective manufacturing and assembly of electronic devices are provided. The various systems and methods of the invention may include various ways of coupling, attaching, and/or connecting the various components of the system to one another, for improved cost and ease of assembly. A number of clips may be used to attach together various parts of an electronic system and housing including circuit devices, enclosure lid and housing, and/or cabling. These clips may be screw-less, may be made of a resilient or spring material, designed so that they quickly snap into place so as to provide good mechanical strength and electrical connection. Various circuit elements may include planar circuits, and may include filters made of a high temperature superconductor material. A planar cable may be used for electrical connecting of components. These systems and devices may be used in, for example, wireless communication systems.

Abstract: Disclosed are apparatus and methods that provide for electrical contacts in a substrate. For example, the apparatus may comprise a trench formed in a substrate, with an electrical contact pad formed on interior walls of the trench that comprises a narrowed opening. A conductive wire is squeezed into the trench that is secured by mechanical stress resulting from material deformation. One exemplary method comprises depositing metal on walls of the trench such that a narrowed opening is provided, and disposing a conductive wire in the trench so that it contacts the deposited metal and is secured by mechanical stress resulting from material deformation. Another exemplary method comprises providing a substrate having a trench formed therein, placing a conductive wire in the trench, and depositing metal atoms into the trench to bury the wire and provide exposed metal on a surface of the substrate.

Abstract: An electromagnetic interference (EMI) shielding and/or grounding gasket generally includes one or more sides and slots along the one or more sides. Finger elements are defined by the slots. The finger elements include contact portions for electrically contacting at least one electrically conductive surface adjacent to a mounting surface when the gasket is mounted thereto with its one or more sides disposed about and in electrical contact with the mounting surface. The gasket may thus be operable for establishing an electrically conductive pathway between the electrically-conductive surface and the mounting surface.

Abstract: A semiconductor module (A1) comprises a semiconductor device (10) provided with a semiconductor chip, and a conductive cover (6) for electromagnetic shielding bonded to the semiconductor device (10) via an adhesive coat (8). The conductive cover (6) includes a surface facing the adhesive coat (8), and the surface is formed with a convex portion (6a) protruding toward the adhesive coat (8). Around the convex portion (6a), a space (7) is formed for filling in adhesive to form the adhesive coat (8).

Abstract: Included are embodiments of a gasket system. At least one embodiment of the gasket system includes a circuit enclosure and a 1-piece gasket, the 1-piece gasket including a plurality of tabs for the 1-piece gasket, the plurality of tabs configured for securing the 1-piece gasket with an aperture, the 1-piece gasket formed from a single piece of material.

Abstract: The devices and methods herein provide ground for computer cards inserted into a computer card chassis (e.g., VME chassis, CompactPCI chassis, ATCA chassis, etc.). A resilient clip may be configured with a chassis member of the computer card chassis. The clip is affixed to the computer card chassis and maintains contact with a ground plane, such as an ESD shield. The clip may have a self locking mechanism which insurers that the clip resides at a fixed position with the chassis member. A computer card may then be inserted into the computer card chassis and thereby make contact with the resilient clip. The computer card may include a ground pin which inserts through an aperture within the chassis member to make contact with the resilient clip. Accordingly, the inserted computer card may be provided with ESD protection as well as a ground reference potential from the computer card chassis.

Abstract: A gasket and gasket system for diminishing electromagnetic radiation from an enclosure having two edges remote from one another. The gasket has tangs on one edge for gripping one enclosure edge, and tangs on the other edge for gripping the other enclosure edge. The gasket system includes the combination of an enclosure member having two edges remote from one another with a two-sided gasket having tangs on one side engaged in gripping one enclosure edge, and tangs on the other edge engaged in gripping the other enclosure edge.

Abstract: An electromagnetic shield comprising an electrically conductive frame for establishing electrical contact between a chassis wall and an expansion card mounting bracket. The frame has a plurality of spring fingers interconnected about a perimeter of a central opening in the frame, wherein each spring finger defines a central axis that extends outwardly away from the central opening. The frame may include a substantially planar portion adjacent the central opening in the frame, wherein the plurality of spring fingers incline along the central axis to extend out of the plane defined by the substantially planar portion. The incline of the spring fingers allows a mounting bracket to slide laterally without jamming against the side of a spring finger during installation, removal or side-to-side shifting of the mounting plate.

Abstract: The disclosed device is directed towards an electromagnetic compatibility clip comprising a body having a first side and a second side opposite the first side. The first side is configured to contact a top surface of a chassis separator and a bottom surface of the chassis separator. The second side of the body is configured to contact an upper module mounted on the upper surface of the chassis separator. The second side of the body is configured to contact a lower module mounted on the lower surface of the chassis separator. The body is configured to maintain electrical contact between the chassis separator, the upper module and the lower module. A locking portion is defined in the body. The locking portion is configured to interlock with the chassis separator. A compression force control element is defined in the body. At least one spring contact is defined in the body.

Abstract: An electromagnetic shield comprising an electrically conductive frame for establishing electrical contact between a chassis wall and an expansion card mounting bracket. The frame has a plurality of spring fingers interconnected about a perimeter of a central opening in the frame, wherein each spring finger defines a central axis that extends outwardly away from the central opening. The frame may include a substantially planar portion adjacent the central opening in the frame, wherein the plurality of spring fingers incline along the central axis to extend out of the plane defined by the substantially planar portion. The incline of the spring fingers allows a mounting bracket to slide laterally without jamming against the side of a spring finger during installation, removal or side-to-side shifting of the mounting plate.

Abstract: In one exemplary embodiment, an electromagnetic interference (EMI) shielding apparatus generally includes a shield and a gasket. The gasket includes at least one tab formed monolithically with the gasket and attached to a support or portion of the gasket. The at least one tab is movable relative to the support from a first, pre-installed configuration in which the at least one tab is generally co-planar with the support to a second, installed configuration in which the at least one tab extends generally outwardly relative to the support. Movement of the at least one tab from the first configuration to the second configuration may position the at least one tab at least partially within the at least one opening of the shield. Frictional engagement of the at least one tab within the at least one opening may help retain the relative positioning of the gasket to the shield.

Abstract: An exemplary embodiment of a gasket is configured for providing electromagnetic interference (EMI) shielding and/or grounding of one or more electrical components on a substrate disposed within a passageway of a member having a generally circular cross-section. The gasket may include inner and outer portions that cooperatively define a generally circular annular shape with a generally central opening. The outer portion may be configured to be disposed circumferentially along and in electrical contact with an electrically-conductive surface of the member in a first direction. The inner portion may be configured to be disposed circumferentially along an edge portion of the substrate and in electrical contact with at least one electrically-conductive portion on the substrate in a second direction generally perpendicular to the first direction. Accordingly, the gasket may establish electrical grounding contact from the at least one electrically-conductive portion on the substrate to the member.

Abstract: According to various aspects, exemplary embodiments are provided of clips that may be compatible with surface mount technology. The clips may be surface mountable to a substrate for allowing repeated releasable attachment and detachment of a shielding structure thereto. In one exemplary embodiment, a clip generally includes a base member having generally opposed first and second side edge portions. Two or more arms extend generally upwardly in a first direction from the base member. The clip also includes a generally flat pick-up surface configured to enable the clip to be picked up by a head associated with pick-and-place equipment.

Abstract: Enclosures and gasket assemblies for reducing EMI for computer systems and other electronic devices are disclosed. In an exemplary embodiment a gasket assembly for reducing EMI may comprise a soft core sizable to extend along at least the length of an opening in an EMI housing. The gasket assembly may also comprise a plurality of fingers positionable at spaced-apart positions along the entire length of the opening in the EMI housing, the plurality of fingers maintaining conductivity between mating surfaces of the EMI housing.

Abstract: An electromagnetic gasket includes a conductive shell having a pair of side walls and end walls extending therefrom defining at least one opening. The pair of side walls and the end walls have at least one outward bias and at least one inward bias positioned thereon for each opening. The outward bias is configured to electrically connect to an inner tailstock of an electrical enclosure. The at least one opening is configured to receive a connector port housing of a corresponding module therein. The at least one inward bias electrically connects the connector port housing to the inner tailstock of the electrical enclosure. Each module is an electrical module or an optical module, and the at least one inward bias and outward bias provide EMC sealing for multiple connector port housings of a plurality of modules having variable dimensions with respect to at least one of the X, Y and Z axis of the connector port housings.

Abstract: Aspects of the present disclosure provide methods for mounting fingerstock EMI shielding gaskets on sheet metal structures. The fingerstock EMI shielding gasket may include a generally D-shaped cross section with at least one mounting tab forming at least part of an upright portion. In one particular exemplary embodiment, a mounting method generally includes providing a sheet metal structure with inner and outer tabs which protrude outwardly from a surface of the sheet metal structure. The inner tabs may be oriented generally toward the outer tabs and may be laterally separated from the outer tabs. The shielding gasket may be slidably inserted into position longitudinally between the inner and outer tabs.

Abstract: The present invention relates to a method of securing a reliable electrical contact between two adjacent surfaces by means of a contact spring (30) of a contact spring assembly (1). The secure and reliable contact is achieved by providing excellent conditions for maintaining the contact spring fully operable at all times and is accomplished by providing a shelter (12) for the contact spring (30) on a carrier (10) therefore, thereby protecting the contact spring by eliminating the possibility of the contact spring being overloaded and plastically deformed during installation.

Abstract: An adapter module used to convert optical signals to electrical signals or electrical signals to optical signals utilizing a “C” shaped retaining clip to secure the adapter module housing together. The retaining clips are used in place of screws, rivets or snap fits and provide an easy and simple way to assembled adapter modules. The retaining clips require no additional structure thereby minimizing the overall size of the adapter module.

Abstract: An electromagnetic gasket includes a conductive shell having a pair of side walls and end walls extending therefrom defining at least one opening. The pair of side walls and the end walls have at least one outward bias and at least one inward bias positioned thereon for each opening. The outward bias is configured to electrically connect to an inner tailstock of an electrical enclosure. The at least one opening is configured to receive a connector port housing of a corresponding module therein. The at least one inward bias electrically connects the connector port housing to the inner tailstock of the electrical enclosure. Each module is an electrical module or an optical module, and the at least one inward bias and outward bias provide EMC sealing for multiple connector port housings of a plurality of modules having variable dimensions with respect to at least one of the X, Y and Z axis of the connector port housings.

Abstract: An elongated EMI/RFI grounding and shielding structure is formed from a resiliently deflectable, electrically conductive material and has a longitudinally spaced series of specially configured finger sections interdigitated with spring sections. Each finger structure has a domed central body portion, a first end portion with an inwardly curved, generally hook-shaped configuration, and an opposite second end portion having a generally planar outer flange end portion extending outwardly from the body and being offset therefrom by a transverse jog section. The grounding structure is operatively attached to and captively retained on an electrically conductive wall, such as a wall of an electronic component housing, by inserting the first and second finger end portions respectively into spaced series of first and second cutout openings in the wall.

Abstract: Enclosures for at least partially shielding an at least partially enclosed volume from electromagnetic interference and various methods for producing such enclosures are described. Enclosures for at least partially shielding an at least partially enclosed volume from electromagnetic interference may be prepared by bonding at least two sections of carbon foam with a carbonizable binder to provide an enclosure, wherein said enclosure defines an at least partially enclosed volume, and carbonizing the carbonizable binder to provide an electrically conductive carbon char. An enclosure for at least partially shielding an at least partially enclosed volume from electromagnetic interference may include at least two sections of electrically conductive carbon foam interconnected by an electrically conductive carbon char. The electrically conductive carbon char is substantially electrically continuous with the sections of electrically conductive carbon foam.

Abstract: A method for mounting a fingerstock EMI shielding gasket on a sheet metal structure includes the steps of forming tabs which protrude from the surface of the sheet metal structure. The shielding gasket, which has a generally D-shaped cross section with at least one mounting tab forming at least part of an upright portion therefor, is inserted into position longitudinally between the tabs.

Abstract: In various embodiments, an electromagnetic shielding apparatus and method is provided. In one representative embodiment, an electromagnetic shielding apparatus is provided that comprises a plurality of spring fingers ganged together. At least one of the spring fingers includes an end extension adapted to facilitate a corner-to-corner contact with a mounting slot in a panel.

Abstract: An Electromagnetic Interference (EMI) gasket formed of a hollow, conductive material which is mechanically fastened to a metal support layer. The assembly can be installed using standard high speed SMT pick and place equipment.