Abstract: Disclosed is an integrated data center that provides for efficient cooling as well as efficient wire routing. The data center houses electronic equipment stored in clusters of cabinets. The space inside the data center is shared, such as on a leased basis, between multiple different entities who operate their own electronic equipment. To achieve privacy, security, and cooling air flow, one or more layers of a security paneling surround one or more clusters of cabinets to create a secure interior space. This allows access to only authorized personal, prevents people from viewing into the secure interior space, and allows cooling air flow to pass into the secure interior space to cool the electronic equipment. The security paneling comprises sheets of metal with small apertures. Two or more security panels may be arranged with offset apertures to further prevent viewing of the electronic equipment in the secure interior space.

Abstract: An electronic device is provided. The electronic device comprises an interposer disposed between first circuit board and second circuit board, and including an opening area and for accommodating the at least one electronic component, and the interposer comprises a board including an inner surface that faces the opening area and an outer surface that faces an opposite direction to the inner surface, wherein the outer surface is formed in a convexo-concave form having a plurality of first concave areas and a plurality of first concave areas, and a side conductive member disposed on the first concave areas and the first concave areas of the outer surface, and formed along the convexo-concave form of the outer surface.

Abstract: A capacitively coupled plasma substrate processing apparatus includes: a process chamber which is exhausted to vacuum and provides a sealed internal space; a gas inflow pipe which is connected to the process chamber to provide a process gas into the process chamber; a gas distribution unit which is connected to the gas inflow pipe to inject the process gas flowing into the gas inflow pipe in the internal space; an impedance matching network which is disposed outside the process chamber and transfers an RF power of an RF power supply to the gas distribution unit; an RF connection line which connects an output of the impedance matching network to the gas inflow pipe or the gas distribution unit; and a shielding plate which is configured such that at least one of the RF connection line and the gas inflow pipe penetrates the shielding plate and includes a ferromagnetic material.

Abstract: A shielding system includes a plurality of transportable modules, wall panels, or pods that are connectable to form a containment area and to define a radiation barrier. Each of the plurality of transportable modules has a first radiation wall defining the containment area, a second radiation wall spaced apart from the second wall, and a radiation shielding fill material positioned between the first radiation shielding wall and the second radiation shielding wall. The radiation shielding fill material includes one of a superabsorbent polymer (SAP) filling a portion of a void between the first radiation wall and the second radiation wall, or a non-Newtonian fluid completely filling the void between the first radiation wall and the second radiation wall. A quantity of the radiation shielding fill material is sufficient to substantially reduce measurable radiation level outside the containment area.

Abstract: A device package includes a chip carrier having a cavity and one or more microwave waveguides configured to route signals. There is a chip including one or more pads and located within the cavity of the chip carrier. Each pad is aligned with a corresponding connector pad of a microwave waveguide of the one or more microwave waveguides of the chip carrier. At least one of the one or more pads is coupled to the connector pad of the corresponding microwave waveguide by way of an overlap capacitive coupling between the at least one pad and the aligned corresponding connector pad of the microwave waveguide.

Abstract: An electronic device according to various embodiments may include: a first communication module comprising communication circuitry configured to process a communication signal in a first frequency band among multiple frequency bands corresponding to a specified communication method; a second communication module comprising communication circuitry configured to process a communication signal in a second frequency band among the multiple frequency bands; a first circuit board on which the first communication module and a first connector electrically connected to the first communication module are mounted; a shield can including an upper face including at least one opening and the shield can further including a side face surrounding the upper face of the shield can, the shield can being disposed on the first circuit board to accommodate the first communication module in an inner space defined by the upper face and the side face, the side face being electrically connected to a first ground portion of the first ci

Abstract: A light driving apparatus which supplies power to a light source in accordance with an indication from a control apparatus includes: a housing which is box-shaped; a wireless communication module which is housed in the housing, and includes an antenna for wireless communication with the control apparatus; and a light driver which is housed in the housing, and supplies power to the light source in accordance with the indication received from the control apparatus via the wireless communication module, wherein the housing includes two opposite faces having slits through which an electromagnetic wave which the antenna emits when excited by the wireless communication module passes, the slits extending in a direction three-dimensionally crossing a direction in which the wireless communication module excites the antenna.

Abstract: A gas sensor package includes a substrate, a gas sensing element on the substrate, and a cover module including ventilation holes.

Abstract: A display device in the present invention includes a display panel (320) which is provided with a display screen, a T-substrate (350) which is arranged in a predetermined range narrower than the display panel (320) at the back side of the display panel (320), first flexible printed circuit substrates (450) which extend downward from the upper end of the display panel (320) and are connected to the T-substrate (350), and second flexible printed circuit substrates (460) which extend upward from the lower end of the display panel (320) and are connected to the T-substrate (350) in order to achieve more reduction in thickness when the display panel and the circuit substrate are arranged together.

Abstract: A terminal casing includes an one upper cover and one lower cover making a housing that can be closed by a removable hatch having a curvilinear profile. The hatch includes grooves distributed longitudinally on two parallel faces following the curvilinear profile. The lower cover includes tabs distributed longitudinally on two parallel faces in following the curvilinear profile, each tab cooperating with an associated groove. The tabs and the grooves are shaped to enable: through a translational motion followed by a rotational motion of the hatch, an insertion and a guidance of the tabs in the grooves of the hatch, when the hatch is inserted into the lower cover; and through a rotational motion followed by a translational motion of the hatch, a guidance of the tabs in the grooves of the hatch and a withdrawal of the tabs from the grooves when the hatch is withdrawn from the cove.

Abstract: An electronic device (10,40) which is inductively powered or charged has a receiver coil (12) on which a metal object (24,42) can be placed without causing deterioration of the coil's magnetic field and without generating heat in the metal object. An ultra-thin, flexible, high magnetic permeability metal foil (14) having a thickness of 50 ?m or less is provided as a shielding layer between the coil and the object. Radial slits (22) are provided in the shielding layer, which suppress unwanted eddy currents in the layer to reduce power transfer losses and heat generation.

Abstract: A receptacle assembly includes a hollow conductive cage with a front end and an opening to an interior portion of the cage. The opening is configured to receive a module assembly therein. The cage has a bottom with a bottom opening communicating with the interior portion, and the bottom is configured to be joined to a circuit board. A layered EMI shield member is provided between the bottom of the cage and the circuit board and the shield member extends completely around the bottom opening of the cage. The EMI shield member is formed as a flexible, low-cost assembly that utilizes a pair or insulative layers that flank a conductive layer.

Abstract: An optical transceiver that reduces the EMI noise leaked therefrom is disclosed. The optical transceiver provides a metal housing, an optical subassembly, and an electronic circuit. The metal housing includes a first space to install the electronic circuit, and a second space to install the optical subassembly. At least the first space has inner surfaces having a corrugated shape to reduce the resonance of the electromagnetic waves.

Abstract: A port for inhibiting electromagnetic radiation, the port being arranged to seal an opening and to allow for the passage of one or more electrical cables through the opening, wherein the port comprises at least one slit arranged to engage the one or more cables.

Abstract: This is directed to connecting two or more elements using an intermediate element constructed from a material that changes between states. An electronic device can include one or more components constructed by connecting several elements. To provide a connection having a reduced or small size or cross-section and construct a component having high tolerances, a material can be provided in a first state in which it flows between the elements before changing to a second state in which it adheres to the elements and provides a structurally sound connection. For example, a plastic can be molded between the elements. As another example, a composite material can be brazed between the elements. In some cases, internal surfaces of the elements can include one or more features for enhancing a bond between the elements and the material providing the interface between the elements.

Abstract: An electronics enclosure is disclosed that provides passive cooling of electronic components while reducing electromagnetic interference (EMI) emissions. The electronics enclosure includes an electronics assembly with at least one electronic component and a heat sink coupled to the electronics assembly. The heat sink has a base portion configured to thermally couple to the at least one electronic component when the heat sink is coupled to the electronic assembly. The electronics enclosure also includes a conductive enclosure forming an enclosed volume around the electronics assembly. The enclosure has a first opening configured to fit around the heat sink and at least one second opening. All non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a determined maximum shielding frequency.

Abstract: A shielding structure includes a frame and a removable plate. The frame includes a peripheral wall, and the removable plate located in the opening may be fixed to the connecting board, the removable plate defining an access hole. A scored line is defined between the removable plate and the connecting board. The shielding structure further defines an arcuate gap between the removable plate and the connecting board and communicating with the scored line, and a mating hole, the arcuate gap is for increasing the shearing stresses on shielding structure the scored line when the removable plate must be removed.

Abstract: An electromagnetic interference (EMI) shielding apparatus generally includes a lid and a framework. The lid includes a top portion having at least one projection joining part thereon. The at least one projection joining part has a peripheral contour. The framework includes a top portion and a lateral side extending downward from the top portion. The top portion includes at least one joining opening having a peripheral contour coinciding with the peripheral contour of the at least one projection joining part of the lid. Accordingly, the at least one projection joining part of the lid is engagable with the at least one joining opening of the framework via an interference fit.

Abstract: A shielding assembly includes a frame including a catch protruding near one end thereof; and a cover including a main body. The main body is punched to form an opening and a latching portion protruding from the main body and aligned with the opening; the latching portion latches with the catch, the latching portion shields the opening to improve the shielding affect of the shielding assembly.

Abstract: A radiation level reducing device, including: a metal plate for covering surface of an electromagnetic wave generation source for radiating an electromagnetic wave; a cover region, set within a plane of the metal plate, for covering the surface; and a plurality of slits formed to a band-shape in the cover region, and spaced apart from each other, wherein each of the plurality of slits includes, a drawing slit extending towards a central part of the cover region from an intense electric field position where an electric field generated in between the electromagnetic wave generation source by the electromagnetic wave is stronger than other positions at an outer periphery of the cover region, and a coupling slit extending so as to line in parallel to another slit from an end in the central part direction of the cover region in the drawing slit.

Abstract: An equipment container retention and bonding system including a dagger pin block assembly that includes a mounting dagger pin and a bonding member formed of a compressive electrically conductive material that is retained on a surface of the dagger pin block assembly wherein the bonding member is compressed between the contact surface on the equipment container and the dagger pin block assembly when the fastening mechanism secures the equipment container in the mounting tray to form an EMI/EMC bonding connection between the mounting tray and the equipment container having an electrical resistance of less than 2.5 milli-ohms under vibration and other loading conditions encountered during use of the system.

Abstract: An RF screen for microwave powered UV lamp systems is provided. The RF screen is formed of a single sheet of conductive material in which a mesh pattern has been formed. The screen includes a non-traditional mesh pattern including individual openings with 3 or more nodes. The RF screen is generally configured to optimize the balance between light transmission and RF energy leakage desired for the particular application. Generally, it is desired that the RF screen has an open area percentage greater than about 80% while limiting RF energy leakage from the microwave powered lamp system to acceptable levels.

Abstract: To provide a seal structure which has a seal member integrally formed on a flexible wiring board without peeling off an insulating layer (top coat) of the flexible wiring board, has excellent sealing performance and can be manufactured at a low cost, the seal structure is composed of a housing, to which the flexible wiring board is inserted, and the seal member, which is integrally formed with the flexible wiring board and seals a gap between the housing and the flexible wiring board, the flexible wiring board is composed of a base FPC composed of an elastic material, a patterned copper foil and an adhesive layer, conductive electromagnetic shielding layers formed on surfaces of the base FPC, and insulating layers covering surfaces of the electromagnetic shielding layers, and the seal member is integrally formed directly on the insulating layers by using a self-adhesive liquid rubber.

Abstract: A shield can includes a frame having a hole in the top wall thereof, and an enclosure attached to the frame and covering the hole. The frame and the enclosure are formed by punching a metallic piece, the enclosure corresponds to the hole in shape and size, the enclosure is fixed to the upper surface of the top wall. The invention also discloses the method for fabricating the shield can.

Abstract: A mounting assembly for shielding EMI, the mounting assembly includes a drive bracket (10) and a shielding apparatus (30). The drive bracket includes a bottom wall (11), a first retaining wall (16), a second retaining wall (18), and a dividing wall (15), the first retaining wall defines a first hole (161), the second retaining wall defines a second hole (181), the dividing wall defines an upper hole (153) and a lower hole (151). The shielding apparatus includes a shielding cover (31) and a bezel (33), the shielding cover has a first flange (36) and a second flange (38), the first flange has a protuberance (361) engaged in the first hole, the second flange has a protuberance (381) engaged in the lower hole, the second shielding apparatus (40) engaged in the upper hole of the dividing wall and the second hole of the second retaining wall.

Abstract: A module substrate defined by an aggregate substrate is prepared, and circuit components are mounted on the module substrate. An insulating resin layer is formed on substantially the entire top surface of the module substrate such that the circuit components are disposed in the insulating resin layer, and a top-surface-shielding layer is formed on the top surface of the insulating resin layer. First through holes are formed in the module substrate and the insulating resin layer at locations corresponding to portions of boundary lines of small substrates so as to extend in a thickness direction of the module substrate and the insulating resin layer. First electrode films are formed on the inner surfaces of the first through holes so as to be connected to the first shielding layer, and the first through holes are filled with a filling material.

Abstract: A method for providing a PCB (printed circuit board) with a shield can (1) comprising a metal shell with a free rim (5). The method prescribes that the rim (5) of the shield can (1) is provided with an extra amount of solder (8) before the shield can (1) is placed on the PCB. A shield can (1) is also described.

Abstract: A shielding device configured to provide EMI or ESD protection to an electronic component (80) comprises a cover (83), and a wall (10) of a resilient material. By molding the resilient material under the influence of a magnetic field provided by a number of separate magnets, a dispersed plurality of magnetically attractable particles in the material are concentrated in strings (11) extending between a lower (12) and upper (13) end of the wall. The cover is attached to connect to the strings affixed in the solidified wall at the upper end of the wall, and at the lower end of the wall the strings are placed in contact with a ground trace (82) formed around the component to be shielded, thereby forming a Faraday cage about the component.

Abstract: An electronic test system load board electromagnetic shield is presented. The load board electromagnetic shield may have a DUT docking plate having a periphery rim on a first side with an aperture extending through the docking plate that has a waveguide chimney through which a DUT may be inserted into a socket or contactor on the load board.

Abstract: The invention relates to an interference-shielded mobile station (10), which includes a circuit board (11), a shield (12), and electrically conductive securing members (13), separate from the shield (12), for attaching the shield (12). In the shield (12) there are openings (15) for the securing members (13). The mobile station further includes grounding elements (16) for connecting the shield (12) and the securing members (13) galvanically to the circuit board (11). Each grounding element (16) extends to the said opening (15) at the securing member (13). The grounding element (16) is at the same time in contact with the securing member (13). In addition, the grounding element (16) is part of the shield (12) for grounding both the shield (12) and the securing member (13) to the ground level of the circuit board (11). The invention also relates to a corresponding arrangement and method in the interference shielding of a mobile station (10).