Abstract: A floated-type shielding mechanism including a cover, a shielding sheet, and a flexible conductor is provided. The cover is adapted to be fixed to a circuit board and covers a plurality of input/output (IO) ports of the circuit board. The shielding sheet is movably disposed at the cover and a back plate, and has a plurality of openings respectively corresponding to the IO ports. The flexible conductor deformably protrudes from an inner surface of the shielding sheet and is adapted to contact the IO ports. When the circuit board, the back plate, and the floated-type shielding mechanism are assembled into a case, the IO ports are exposed from a case opening and the flexible conductor is adapted to be deformed by pressing so that the shielding sheet presses against an inner wall surface around the case opening.

Abstract: The disclosed interference-fit frame includes (1) a border dimensioned for installation around an electrical component coupled to a circuit board, wherein (A) the border forms an opening in which the electrical component resides when the border is installed and (B) at least a portion of the border constitutes a retention dam that rises beyond the electrical component when the border is installed, and (2) at least one protuberance that extends from the border into the opening. Various other apparatuses, systems, and methods are also disclosed.

Abstract: A mobile terminal includes a circuit board, a heat emitting element disposed on the circuit board, a shielding can, and a middle frame, where the shielding can is connected to the circuit board, and forms a shielding space together with the circuit board; the heat emitting element is accommodated in the shielding space; the circuit board is disposed on one side of the middle frame; the middle frame is provided with an accommodating space; and the shielding can includes a top and a bottom that are disposed opposite to each other, where the bottom is configured to be connected to the circuit board, and the top is located above the heat emitting element and extends to the accommodating space. The present disclosure further provides a heat dissipation and shielding structure. The present disclosure helps make a mobile terminal and a heat dissipation and shielding structure lighter and thinner.

Abstract: A wireless power receiver according to an embodiment wirelessly receives power from a wireless power transmitter. The wireless power receiver includes a printed circuit board having a reception space in a predetermined area, a receiving coil disposed in the reception space of the printed circuit board for receiving power from the wireless power transmitter, and a short-range communication antenna disposed on the printed circuit board while surrounding the receiving coil.

Abstract: A server apparatus is movably disposed on a rack. The server apparatus includes a base and a plurality of detachable carriers. The base has a baffle, and an accommodating space of the base is divided into several loading regions by the baffle. Each detachable carrier can include a substrate, a first supporter and a second supporter. The substrate has a first region and a second region adjacent to each other. The first supporter is detachably disposed on the first region. The second supporter is disposed adjacent to the first supporter and detachably disposed on the second region. The first supporter and the second supporter are utilized to support several electronic devices.

Abstract: A chassis structure including a box body and a plurality of assembling components is provided. The box body includes a main plate and a plurality of side plates, wherein the side plates surround a periphery of the main plate and define an accommodating space. The assembling components are bonded to the main plate and are located in the accommodating space.

Abstract: In one embodiment, an apparatus includes an optical module comprising a first end for insertion into a network device and a second end extending from the network device when the optical module is inserted into the network device, and a thermal protective layer extending over a portion of the second end of the optical module, the thermal protective layer preventing direct contact with an external surface of the optical module during removal of the optical module from the network device. The thermal protective layer exposes a portion of the external surface of the second end of the optical module to allow heat to be released from the external surface of the optical module.

Abstract: Examples are disclosed that relate to PCB-based connectors and connector frames for a PCB. In one example, a connector frame comprises a cavity configured to house the PCB, the cavity defined at least partially by a first sidewall, a second sidewall opposite to the first sidewall, and an end wall extending between the first sidewall and the second sidewall. A support surface is adjacent to the cavity on a top side of the connector frame and extends between the first sidewall and the second sidewall. An aperture on the top side of the connector frame is formed at least partially by an edge of the support surface, with the aperture exposing a portion of the cavity through the top side.

Abstract: A modular EMF/RF shielded enclosure having interconnected walls, floor and ceiling panel members such that passage of EMF/RF form or into the enclosure is blocked or attenuated. Quick-connect, quick-release compressive connector members composed of electrically conductive material are used to join adjacent panel members, such that the connector members carry the common ground between adjacent panels and a continuous shielding envelope in the nature of a Faraday cage is formed.

Abstract: The invention relates to an architectural assembly consisting of wall elements made of concrete containing conductive particles with a conductive mesh forming an electromagnetic radiation shielding. Said wall elements consist of a panel 1 made of concrete containing conductive particles without a conductive mesh, at least one face of which is provided with a skin 2, 3 comprising a conductive mesh, with meshes being less than 30×30 mm in dimensions.

Abstract: In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive material is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.

Abstract: A system and method for packaging a semiconductor device that includes a wall to reduce electromagnetic coupling is presented. A semiconductor device has a substrate on which a first circuit and a second circuit are formed proximate to each other. An isolation wall of electrically conductive material is located between the first circuit and the second circuit, the isolation wall being configured to reduce inductive coupling between the first and second circuits during an operation of the semiconductor device. Several types of isolation walls are presented.

Abstract: A power conversion apparatus is provided, which comprises a housing, a mother board, an electromagnetic filter board, a signal board, and a heat-dissipation module. The housing includes a first heat-dissipation wall and a coolant passage. The mother board is disposed upon the housing, and comprises a first surface facing the housing and a first power device. The heat-dissipation module includes a first insulated heat-conducting sheet adhered to the corresponding first heat-dissipation wall and a first elastic clamp. When the first surface of the mother board approaches the housing to clamp the first power device within the accommodating space, the first power device is pressed against by the first elastic clamp and thus adhered to the first insulated heat-conducting sheet, so that the first power device is thermally coupled to the first heat-dissipation wall and the coolant passage via the first insulated heat-conducting sheet.

Abstract: A disk drive includes a metal base that has a rectangular bottom wall and side walls formed on each side of the rectangular bottom wall, the side walls including a first side wall on a shorter side, a metal cover that is fixed to the metal base with a plurality of metal screws, including two screws disposed at opposite ends of the side wall, a gap being formed between an upper end of the first side wall and the metal cover, a magnetic disk disposed on the metal base, at a position offset from a center of the metal base in a longitudinal direction towards the first side wall, and a head. The first side wall and the metal cover are electrically connected at an intermediate position of the first side wall between said opposite ends of the first side wall.

Abstract: A method, system and software product are provided such that a patient in an MRI suite can select and enjoy personalized lighting, music, images and video with a touch screen for a program that is displayed on a system interactive digital unit or device. A wide and advanced variety of pre-programmed themes can be provided with the system, as is the option of creating customized content by the healthcare provider. Image panels help to “transport” the patient “away” from the confining space in the magnet bore of the MRI scanner, moving the patient's focus from the scanner to his or her surroundings. A ceiling image panel displays images of the patient's choice. Patients can also “dock” their own electronic device to enjoy their own audio visual content. The lighting of the suite can be returned to normal lighting when required and then back to the patient's original selections.

Abstract: An electric power conversion device includes: an active circuit section emitting noises; an output-side filter circuit section; a chassis including a first space and a second space for housing the active circuit section and the filter circuit section respectively; and a base plate that is installed so as to cover at least the first space and is electrically connected to the chassis. Here, the chassis includes a first partition wall for partitioning the first space and the second space, the base plate is disposed so as to cover the first space, and includes a second partition wall along the first partition wall, and the second partition wall is disposed between the filter circuit section and the first partition wall in the first space.

Abstract: A test chamber for EMC measurement testing, a method for the validation and a method for performing EMC measurement tests in such a test chamber. In order to simplify the validation of an EMC test chamber and the performance of different EMC measurement test procedures in a single test chamber, the novel test chamber for the EMC measurement test is configured for performing different EMC measurement test procedures by providing a plurality of measurement arrangements with different measurement axes. A plurality of antennas are simultaneously arranged in the test chamber. Each of these antennas is assigned in each case to at least one of the measurement test procedures. In order to provide the measurement arrangement for the given measurement test procedure, each of these antennas can be moved from a rest position into a measurement position assigned to the measurement arrangement and back again.

Abstract: A cabled midplane includes a first support plate along a plane between a first connector set and a second connector set that connect to line cards on either side of the cabled midplane. The first connector set and the second connector set include connector slices. A wiring sub-layer includes cable slices to provide a connection between the first connector slice of a connector of the first connector set to the first connector slice of a connector of the second connector set, such that the first wiring sub-layer connects each connector of the first connector set, through one cable slice, to a connector of the second connector set. Additional wiring sub-layers are added, and a second support plate, parallel to the first support plate, is provided to encase and support the wiring sub-layers between the first support plate and the second support plate. Other apparatuses and methods are described.

Abstract: Provided are an apparatus and a method for canceling magnetic fields. The apparatus includes a magnetic field canceling coil disposed adjacent to an inner wall of a magnetic shield room to surround the entire inner space or a portion of an inner space of the magnetic shield room; and a magnetic field canceling coil driver to supply current to the magnetic field canceling coil. The magnetic field canceling coil cancels a prepolarization magnetic field established on the wall of the magnetic shield room by a prepolarization coil disposed in the center of the magnetic shield room to minimize magnetic interference caused by the magnetic shield room.

Abstract: An electronic device assembly comprises an electronic device having a bottom and back side, wherein the bottom includes apertures and the back side includes a panel jack for connecting to cables; and a cable retainer having a base and a back upstanding wall extending from the base. The base is attached to the bottom of the electronic device. The back upstanding wall faces the back side, the back upstanding wall is spaced from the back side, and the back upstanding wall has slots for supporting the cable.

Abstract: A storage canister is provided. The storage canister in one example includes an enclosure, multiple Hard Disk Drives (HDDs) located within the enclosure, a plurality of mounting elements configured to receive the multiple HDDs, wherein each mounting element of the plurality of mounting elements is configured to receive a HDD, a plurality of suspension elements supporting the plurality of mounting elements, with each suspension element of the plurality of suspension elements supporting and providing vibration isolation to a corresponding HDD of the multiple HDDs, and an external connector configured to be externally accessible, with the external connector being electrically coupled to the plurality of mounting elements.

Abstract: An electronic device and related method that includes a metal member, a circuit board, and a shielding member. A through hole or slot is disposed on the metal member. The shielding member is fastened on the metal member. The shielding member includes a blocking portion and an enclosing portion. The blocking portion is made of an electrically conductive plastic material. The enclosing portion is made of a metal material or an electrically conductive plastic material. The blocking portion is configured to block the through hole or slot. The enclosing portion is disposed around the electronic component. One end of the enclosing portion is electrically connected to the metal member, and the other end of the enclosing portion is electrically connected to the circuit board. The metal member, the blocking portion, the enclosing portion, and the circuit board form a shielding space, and the electronic component is located in the shielding space.

Abstract: A method and system implementations thereof include receiving data from a passive optical network (PON) outside a building; wirelessly transmitting the received PON data to inside the building; and applying the received PON data to a network inside the building. The data received outside the building is from an optical line termination (OLT). The PON data wireless transmitted inside the building may be applied to an optical line terminal (ONT) inside the building. Alternatively, the wirelessly received PON data may be converted to Ethernet format and applied to a user interface and/or a gateway interface all inside the building. The wireless transmission of PON data may be via a first transceiver mounted on a surface outside the building and a second transceiver mounted on a surface inside the building. The surface may be a corridor, a window, a door, a walls and a façade.

Abstract: An integrated inductor includes a patterned ground shield, an inner rail, and an inductor. The patterned ground shield is disposed in a first direction. The inner rail is coupled to the patterned ground shield. The inner rail is disposed inside the integrated inductor and in a second direction. The first direction is perpendicular to the second direction. The inductor is disposed above the patterned ground shield.

Abstract: The modular electronic instrumentation platform chassis is for use with a plurality of instrumentation modules and includes a frame defining a module area and a non-module area. The module area includes a plurality of slots open to a front of the frame and configured to receive instrumentation modules therein. A front panel may be carried by the front of the frame adjacent the plurality of slots. A chassis power unit is configured to provide power to the plurality of instrumentation modules received in the slots. A reference clock unit carried by the frame in the non-module area and is configured to provide a low phase-noise reference clock for the plurality of instrumentation modules received in the slots.

Abstract: A magnetic shield including a first layer and a second layer and shielding an environmental magnetic field is obtained by manufacturing the first layer that is configured by a first material and that includes a hollow portion on the inside and the second layer that is configured by a second material that is different from the first material and which is a hollow member and placing the second layer in the hollow portion of the first layer. With the magnetic shield, in regions between the first layer and the second layer, a material in which the relative magnetic permeability at the strength of the magnetic field at a region that is next to the second layer is high compared to the relative magnetic permeability of the first material at the strength of the magnetic field is selected as the second material that configures the second layer.

Abstract: A package includes a device die, a molding material molding the device die therein, and a through-via penetrating through the molding material. A redistribution line is on a side of the molding material. The redistribution line is electrically coupled to the through-via. A metal ring is close to edges of the package, wherein the metal ring is coplanar with the redistribution line.

Abstract: A high-frequency module includes a substrate, an integrated circuit mounted to the substrate, a cylindrical shield enclosing the integrated circuit to block radio waves, a casing provided on an opposite side of the substrate relative to the shield to block radio waves, and a choke portion provided in an inner wall of the casing, the inner wall being opposed to the shield, or provided in the substrate, with a predetermined gap being formed relative to the shield, to create an antiphase in radio waves having a predetermined frequency emitted from the integrated circuit into a space above the substrate.

Abstract: A package includes a die, and a molding material molding the die therein. A metal shield case includes a first metal mesh over and contacting the molding material and the die, a second metal mesh underlying the die, and a Through-Assembly Via (TAV) in the molding material and forming a ring encircling the die. The TAV is electrically connected to the first metal mesh and the second metal mesh.

Abstract: An electronic component includes a frame-shaped supporting body including a heat-curable resin and surrounding a functional unit on one main surface of a substrate and so as to be separated from a periphery of the substrate on an inner side and in which a lid member is fixed to the supporting body such that an opening of the frame-shaped supporting body is sealed. The frame-shaped supporting body includes a frame-shaped supporting body main body, a first protrusion that protrudes toward an inside from the supporting body main body and a second protrusion that protrudes toward an outside from the supporting body main body at a portion where the supporting body main body and the first protrusion are continuous with each other.

Abstract: A shield case includes a cabinet main body and a lid. The cabinet main body accommodates a board for mounting electronic components. The cabinet main body includes a main body side wall and a main body outer edge portion. The lid includes an opposed outer edge portion, a recessed portion and a plurality of contact points. The recessed portion includes opposed side wall portions that are disposed in an opposed configuration in relation to the main body side wall, and a lid bottom portion. A plurality of contact points is formed on the opposed side wall portions. The plurality of contact points is biased toward the main body side wall to form an electrical connection between the cabinet main body 401 and the lid.

Abstract: A flight deck aircraft window 10 has improved transparency from two layers of different types of glass and electromagnetic radiation shielding from a thin layer of indium tin oxide between the two layers of glass. The thin layer of indium tin oxide provides the required shielding without appreciably adding to the window weight or detracting from the enhanced transparency of the two layers of glass.

Abstract: An electronic module includes a first circuit board having a first surface, a second circuit board having a second surface, first electronic components on the first surface, second electronic components on the second surface, a first conductive fence, and a second conductive fence. The first conductive fence encloses the first electronic components and has a first opening exposing the first electronic components. The second conductive fence encloses the second electronic components and has a second opening exposing the second electronic components. The first opening of the first conductive fence joints the second opening of the second conductive fence, such that the first electronic components and the second electronic components are surrounded by the first circuit board, the second circuit board, the first conductive fence, and the second conductive fence. At least one of the first electronic components is higher than the first conductive fence.

Abstract: An electronic circuit module includes a substrate with built-in component, a mount component mounted on the substrate with built-in component, a sealing portion covering the mount component, and a shield made of a conductive synthetic resin covering the sealing portion. The substrate with built-in component has a core layer made of a metal, an outer cover made of an insulating synthetic resin, and a first protrusion. The core layer has corners and side faces. The outer cover covers the corners and the side faces, and has a first surface. The first protrusion has a first end face exposed at the outer cover and a second surface adjacent to the first surface, and is formed away from the corners of the side faces to protrude outwardly. The sealing portion covers the mount component. The shield covers the sealing portion, and has a third surface bonded to the first surface and the second surface.

Abstract: An electronic device includes a base body, which has a top side and also an underside lying opposite the top side. The base body has connection locations at its underside. An electronic component is arranged at the base body at the top side of the base body. The base body has at least one side area having at least one point of inspection having a first region and second region. The second region is embodied as an indentation in the first region. The first and the second region contain different materials.

Abstract: An optical transceiver that reduces the EMI noise leaked therefrom is disclosed. The optical transceiver provides a metal housing, an optical subassembly, and an electronic circuit. The metal housing includes a first space to install the electronic circuit, and a second space to install the optical subassembly. At least the first space has inner surfaces having a corrugated shape to reduce the resonance of the electromagnetic waves.

Abstract: One embodiment of a molded shield can include a cavity to conform to and receive an electrical component, a slit to conform to and receive a metal frame and a metal layer coupled to the top and lateral sides of the molded shield. In one embodiment, the molded shield can be formed from silicon and can include material to enhance electrical conductivity. The molded shield can couple to the metal frame which in turn can be coupled to ground with the resulting configuration acting to reduce electrical emissions. The molded shield can transfer heat away from the electrical component through conduction.

Abstract: A carrying case having a first compartment and a second compartment for accommodating a plurality of objects; the first object which is embedded with integrated circuits that can process, store and communicate data on radio frequency identification microprocessors; said second object which is configured to process, store and communicate data on radio frequency identification microprocessors; said inner lining of said carrying case configured to include a radio frequency shielding; said shielding material including a layer of conductive material to attenuate interference fields and signals which are transmitted at varying frequencies and wavelengths; and wherein the shielding material is configured to block access to data which is stored on radio frequency identification microprocessors embedded in either the first object or second object.

Abstract: An electromagnetic shielding configuration comprising a first electrically conductive wall having a first surface and a second electrically conductive wall having a second surface. The first surface is oppositely disposed from the second surface, wherein interfacing of the first conductive wall and the second conductive wall forms an enclosure wall. The first surface comprises at least one stepped edge forming a plurality of surfaces of unequal lateral displacement, and a corrugated surface on at least one of the plurality of surfaces, the corrugated surface formed by a series of apices extending radially from the first surface. The second surface is substantially a conjugate of the first surface.

Abstract: This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.

Abstract: A receptacle for supporting a transponder on a support structure includes a housing having a first housing portion securable to the transponder and a second housing portion securable to the support structure. The first housing portion is pivotally secured to the second housing portion. The first housing portion and second housing portion include a shield for attenuating the transmission of electromagnetic signals. The first housing portion has a first position wherein the first housing portion and second housing portion form a chamber for enclosing the transponder and restricting the transmission of electromagnetic signals from the chamber. The first housing portion has a second position wherein the first housing portion and the transponder are displaced from the second housing portion thereby opening the chamber and exposing the transponder to permit the transmission of electromagnetic signals to and from the transponder.

Abstract: Provided is a metal strip for an electromagnetic interference shield case. The metal strip is uniform in width and thickness. A metal clip that is integrated with at least one pair of face-to-face elastic parts and is appropriate for soldering is fitted on an end of the metal strip along a width direction of the metal strip. The metal strip is bent and cut so as to have a shape corresponding to a ground pattern disposed on a printed circuit board, and then, a bottom surface of the metal clip is soldered to the ground pattern or a solder member disposed on the ground pattern.

Abstract: An electronics enclosure is disclosed that provides passive cooling of electronic components while reducing electromagnetic interference (EMI) emissions. The electronics enclosure includes an electronics assembly with at least one electronic component and a heat sink coupled to the electronics assembly. The heat sink has a base portion configured to thermally couple to the at least one electronic component when the heat sink is coupled to the electronic assembly. The electronics enclosure also includes a conductive enclosure forming an enclosed volume around the electronics assembly. The enclosure has a first opening configured to fit around the heat sink and at least one second opening. All non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a determined maximum shielding frequency.

Abstract: Certain embodiments herein are described to protect electronic equipment from electromagnetic interference (EMI). A cabinet and one or more associated input/output panels may be configured to block EMI from entering the interior of the cabinet where electronic equipment may be stored. The input/output panel may include a printed circuit board, an input/output header, and an input/output connector that may be configured to pass electronic signals transmitted via cables, for example, from one side of the input/output panel to another without accompanying EMI. Certain materials and components included on the printed circuit board may assist in deflecting or absorbing EMI so that it does not enter the cabinet. For example, one or more filters may also be mounted onto the printed circuit board to further filter out unwanted EMI.

Abstract: A first metal sheet and a second metal sheet are arranged opposite a printed circuit board including a second connector that fits into a first connector that is arranged at one end of a cable. A hole section through which the first connector passes is arranged in each of the first metal sheet and the second metal sheet. The first connector fits into the second connector by passing through each of the hole sections of the first metal sheet and the second metal sheet. The first metal sheet and the second metal sheet support a connector case of the first connector, thus improving the load bearing characteristics of the cable connection.

Abstract: Apparatus and methods for providing a substantially surface independent tagging system are disclosed. A resonant dielectric cavity is defined between upper and lower conducting layers, and closed at one end by a conducting base portion. Incident radiation couples into the cavity and is resonantly enhanced. An electronic device or tag paced at the edge of the cavity experiences a high electric field strength on account of this enhancement and is driven into operation.

Abstract: An electromagnetic interference shielding assembly for use in an electronic device is disclosed. The electronic device includes a circuit board and an alternating current cable including one end connected to the circuit. The electromagnetic interference assembly includes an electromagnetic interference shielding plate. The circuit board is mounted on the electromagnetic interference shielding plate. The alternating current cable includes a segmental portion arranged adjacent to the electromagnetic interference shielding plate. The segmental portion extends substantially parallel to the electromagnetic interference shielding plate. The electromagnetic interference shielding plate defines a plurality of slots each extending in a direction perpendicular to an extending direction of the segmental portion of the alternating current cable. The parallel slots, as a whole, extend along the extending direction of the segmental portion and spatially corresponding to the segmental portion.

Abstract: Various systems of an electronic device and methods for manufacturing the same are provided. In some embodiments, a routing assembly is provided that may not only route a cable along a circuit board, but that may also shield an electronic component or secure an electronic component to the circuit board. In some other embodiments, there is provided a mechanism for electrically coupling two components of an electronic device that may also be visually appealing in the context of other portions of the electronic device.

Abstract: An electromagnetically shielded enclosure is disclosed. One such system includes a continuously welded shell having a top, a bottom, and a plurality of side walls cooperating to enclose an interior volume, the interior volume sized to receive electronic equipment and allow human entry. The enclosure is constructed from electromagnetically conductive materials and includes continuous welds along seams joining each material. The enclosure includes a sally port located within the enclosure. The sally port includes a first door in one of the plurality of side walls and constructed from electromagnetically conductive materials. The sally port also includes a second door constructed from electromagnetically conductive materials. The sally port defines a secondary interior volume within the enclosure sized to allow human entry through either the first or second door.

Abstract: Cover for electronic equipment including at least two movable metal panel elements. The panel elements are joined together along their respective edges, so they are joined together and in relation to each other immobile state form the cover. The invention is wherein the cover includes a respective connector for mechanical joining and good electric contacting along each one of the edges along which the panel elements are arranged to be joined together, in that each connector includes a respective resilient metal contacting device, which contacting device is arranged between the respectively joined together panel elements and in direct contact with both panel elements when the panel elements are in the joined together state, and thereby is compressed against the spring force of the contacting device, so that the spring force acts against the surfaces of both the respective joined together panel elements and connects them to each other electrically.