Abstract: The present invention relates to a circuit board mounting panel for electrical appliance, comprising: a base panel disposing a first printed circuit board and a second printed circuit board thereon; a first shield cover disposed on the base panel and mounting the first printed circuit board therein and formed with an opening part in a vertical direction to a surface of the first printed circuit board; and a second shield cover mounting the second printed circuit board therein and inserted into the first shield cover through the opening part and coupled to the base panel. Thus, the present invention provides an improved structure of a shield cover for a circuit board mounting panel for an electrical appliance, thereby minimizing a idle mold that may be produced while developing a circuitry or a PCB.

Abstract: According to one exemplary embodiment, a structure comprises an electronic device situated over a substrate of a semiconductor die. The structure further includes a metal cage comprising a number of contacts situated over the substrate and surrounding the electronic device. The contacts form a lateral EMI shield portion of the metal cage. The structure also includes a number of vias connecting a number of metal interconnect segments to the contacts. The metal interconnect segments form a top EMI shield portion of the metal cage.

Abstract: An EMI shield having at least one compartment for enclosing circuitry of an electronic device. The shield includes a first member formed of a thin metal sheet, and a second member formed of an electrically-conductive composite material comprising an admixture of a plastic or other polymeric component and an electrically-conductive particulate filler component. The second member is integrally joined to the first member, and has at least one wall which extends from the first member and which together with the first member defines at least a portion of the compartment.

Abstract: A handheld communication apparatus includes a metallic insert molding member, a circuit board and a shielding frame. The metallic insert molding member includes a metal plate. An electronic component is mounted on the circuit board. The shielding frame defines opposite first and second openings, wherein the shielding frame is bonded to the metal plate of the metallic insert molding member at the first opening, thereby forming a shielding case. The electronic component on the circuit board is inserted into the second opening of the shielding frame to be shielded by the shielding case.

Abstract: A shield frame (800) is provided that allows for narrow width tracks to be used in a radio frequency (RF) shielding apparatus (900). The shield frame (800) is formed of a sheet metal frame (700) overmolded with a conductive elastomer (802) to form narrow edges (808, 810) that provide compliance in a +/?z-axis (814) directions while thicker portions of the overmolded conductive elastomer prevent buckling of the elastomer. The shield frame (800) can be sandwiched between two substrates (902, 908) of a communication device (900) having components (904) requiring RF shielding. Narrowing of the conductive elastomer overmold (802) allows ground tracks/runners (906) to be used on a substrate (902) which are narrower in width (912) than the shield frame width (702) thereby providing increased area for component placement.

Abstract: The present invention is a metal shielding apparatus; it includes a cover shielding and a bottom shielding. The cover shielding has a number of holes while the bottom shielding has a number of jutted points. The holes and the jutted points can be used for alignment when combining these two covers. And there is at least one raised part among the jutted points for a better fitting of the cover and bottom shieldings and further prevents from the looseness. Furthermore, the holes, jutted points and raised parts can also be setup on the cover and the bottom shieldings interchangeably for the same effect.

Abstract: According to various aspects of the present disclosure, exemplary embodiments are provided of EMI shielding apparatus capable of providing board level EMI shielding for one or more electronic components while also providing dissipation of heat generated by the one or more electronic components. In one particular embodiment, an apparatus generally includes a board level shield having at least one resiliently compressible EMI gasket disposed along at least a portion of the board level shield. At least one thermally-conductive compliant material is disposed relative to an inner surface of the board level shield and to the one or more electrical components. The at least one thermally-conductive material can form a thermally-conducting heat path from the one or more electrical components to the board level shield.

Abstract: A spacer for use in a mobile device fills the space between a component assembly and a housing. The spacer includes a layer of compressible material for insertion between the component assembly and the housing. A plurality of compressible features are provided on a face of the layer. Upon insertion of the component assembly and assembly of the housing, the compressible features are compressed to fill a gap between the component assembly and the housing without over-compressing the main body of the spacer, allowing the body of the spacer to cushion any subsequent impact to the mobile device.

Abstract: A high-frequency module has an attached shield case. Barrier 36 of the shield case has wall 37 provided by being bent from ceiling section 32; wall 38 that is opposed to wall 37 and that is provided by being bent from ceiling section 32; and linkage section 39 for linking the tip end of wall 38 to the tip end of wall 37. The shield case further has: a crossing section at which wall 37 crosses ceiling section 32 and side plate 33; notches 43 respectively provided at the crossing sections at which wall 38, ceiling section 32 and side plate 33 cross one another; and division section 44 extending downward from notches 43 for segmentalizing side plate 33. A boundary between circuit block 4 and circuit block 5 is provided at a position corresponding to barrier 36. Connection section 34 is connected to the ground of circuit block 4 or circuit block 5. As a result, a module having a superior shielding performance can be provided to prevent leakage of a signal from a circuit provided on the printed circuit board.

Abstract: A scheme is provided for reducing the degree to which EMI from high voltage components of a fuel cell system or a fuel cell powered vehicle is induced in low voltage components of the system or vehicle. In accordance with one embodiment of the present invention, the electrical components of the system's high voltage region and the electrical components of the system's low voltage region are positioned such that, absent EMI shielding structure between the high and low voltage components, a substantial amount of EMI from the high voltage components would be induced in the low voltage components. EMI shielding structure is configured to define a conductive enclosure about the high voltage region and the low voltage region and a conductive EMI barrier between the high voltage region and the low voltage region.

Abstract: A compact radio equipment includes internal circuits on two or more printed circuit boards electrically connected to each other and securely mounted in structure. With this structure, a first metal shield frame is mounted on a first printed circuit board to cover components mounted on the first printed circuit board. A second printed circuit board is mounted on the first metal shield frame.