Abstract: Joint formations that, in joining together joining members employed in a variety of electrical and electronic components, yield sufficiently high joint strength in the direction perpendicular to the plane in which two joining members join, and meanwhile in the direction parallel to the joint plane. Two joining members 11 and 12, each with a plurality of continuous faces as joint faces, are joined to each other by interposing a bonding agent 3 between the joint faces. The difference in coefficient of thermal expansion between the two joining members 11 and 12, and between the joining members 11 and 12 and the bonding agent 3, is 5.0×10−6/° C. or less. The joining members are a metal such as tungsten or Cu—W, or a ceramic such as AlN or Si3N4; and glass or a solder material is utilized for the bonding agent.

Abstract: Advanced implanted medical devices require long-lived, reliable power supplies. Lithium-ion batteries can be used to meet this need if they can be assured of maintaining a hermetic seal while implanted. The invention is a hermetic seal for a lithium-ion battery where the battery header is made of aluminum and the pin is a conventional metal, such as platinum. The glass-to-metal seal utilizes low-temperature processable ALSG-32 glass, which has been demonstrated to bond to aluminum at temperature below the melting point of aluminum and which has been demonstrated to exhibit excellent resistance to lithium battery electrolyte. ALSG-32 is a high phosphate glass having about 6.0% B2O3, 40.0% P2O5, 15.0% Na2O, 18.0% K2O, 9.0% PbO, and 12.0% Al2O3, expressed in mole percent.

Abstract: In order to be able to produce an electrically conductive, positive connection between an end electrode of a gas-filled discharge path and a lead more simply in fabrication-oriented terms, the raised terminal region, which is provided at the end electrode, is provided with a blind hole into which the one end of the lead is introduced and joined thereat to the terminal region with a laser welding.

Abstract: A microcircuit package feedthrough that relates to glass-to-metal seals, and more particularly, to feedthroughs for use in surfacemount microcircuit packages. The present invention can be used with surface mount technology such that it is a microcircuit package feedthrough that requires fewer manufacturing steps to install than conventional feedthroughs.

Abstract: A reverse mismatched compression glass-to-metal seal is described. In this seal, the coefficient of thermal expansion of the insulating glass is lower than that of the terminal lead and, the ferrule or casing body has a similar or higher coefficient of thermal expansion than that of the terminal lead.

Abstract: A hermetic glass-to-metal seal between a conductive pin and an outer body, wherein a corrosion-resistant noble metal (e.g., gold) coating is applied to the conductive pin before the hermetic seal is formed. The noble metal-coated conductive pin is located in glass having a softening point less than about 650° C. and disposed in a cavity of the outer body. This is accomplished by inserting the coated conductive pin into a bore in a glass preform, heating the assembly to a temperature in excess of the softening point of the glass but less than about 700° C., and cooling the assembly. The coefficients of thermal expansion of the components of the assembly are preferably selected such that the resulting assembly is a hermetic compression seal.

Abstract: An electrical line penetration through a housing wall made of plastic has electrical traces embedded in a flexible conductor. The electrical traces of the flexible conductor have electrical contact points on both sides of the housing wall. The flexible circuit is injection-molded into the housing wall. In the production of the sealed electrical line penetration, a flexible film with an electrical trace is clamped in, on the outer side of the housing to be injection-molded and the inner side of the housing to be injection-molded respectively, between two halves of an injection mold.

Abstract: An electronic enclosure having a cover and a base member reduced in height by providing the necessary height on the decoupling area around and generally in the same vertical space as is occupied by the thickness of glass provided to hermetically seal the enclosure. The glass is formed inside and kept away from the decoupling area by an inner ring fixed to the base member, or by a tool which is removed after the glass has been applied to seal the enclosure.