Flexible Patents (Class 174/525)
  • Patent number: 10667418
    Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
    Type: Grant
    Filed: April 20, 2018
    Date of Patent: May 26, 2020
    Assignee: APPLE INC.
    Inventors: Bryan P. Kiple, Charles B. Woodhull, David A. Pakula, Tang Y. Tan, Michael P. Coleman, Thomas Johannessen, Richard W. Heley
  • Patent number: 10168191
    Abstract: Apparatus and Methods for fabricating apparatus having a hermetic seal to seal a portion of an apparatus, for example and without limitation, a portion having a MEMS sensor. One such method uses crimping devices to compress a seal in a cavity formed in a housing that includes a MEMS sensor attached to a stress isolator. Under such compression, the seal deforms to hermetically seal surfaces around the inside, outside and bottom of the stress isolator.
    Type: Grant
    Filed: August 7, 2015
    Date of Patent: January 1, 2019
    Inventor: Tom T. Nguyen
  • Patent number: 10094686
    Abstract: Apparatus and Methods for fabricating apparatus having a hermetic seal to seal a portion of an apparatus, for example and without limitation, a portion having a MEMS sensor. One such method uses crimping devices to compress a seal in a cavity formed in a housing that includes a MEMS sensor attached to a stress isolator. Under such compression, the seal deforms to hermetically seal surfaces around the inside, outside and bottom of the stress isolator.
    Type: Grant
    Filed: August 7, 2015
    Date of Patent: October 9, 2018
    Inventor: Tom T. Nguyen
  • Patent number: 10007343
    Abstract: An input device can be integrated within an electronic device and/or operably connected to an electronic device through a wired or wireless connection. The input device can include one or more force sensors positioned below a cover element of the input device or an input surface of the electronic device. The input device can include other components and/or functionality, such as a biometric sensor and/or a switch element.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: June 26, 2018
    Assignee: Apple Inc.
    Inventors: Sora Kim, Martin P. Grunthaner, Rui Jin, Michael B. Wittenberg, MIchael K. McCord, Henric Larsson, Giovanni Gozzini, Lucy Browning, Scott A. Myers
  • Patent number: 9851604
    Abstract: Embodiments of the invention provide a display substrate and a manufacturing method thereof, and a display device. The display substrate includes a display region and a sealant coating region provided outside the display region, and the sealant coating region is provided with a groove to limit a sealant.
    Type: Grant
    Filed: November 28, 2013
    Date of Patent: December 26, 2017
    Inventors: Hongyan Xing, Hao Wu, Yanyan Yin
  • Patent number: 9575347
    Abstract: A base material for a display device, a display device and a method for fabricating the display device are disclosed. One or more grooves are disposed on a bonding surface of the base material, the grooves are configured for accommodating at least a portion of adhesive coated to the bonding surface. The grooves on the base material can accommodate redundant adhesive, thereby effectively preventing the adhesive overflow and air bubble defects during the bonding process, and increasing the yield ratio of bonding.
    Type: Grant
    Filed: June 19, 2015
    Date of Patent: February 21, 2017
    Inventors: Qing Zhang, Hongqiang Luo
  • Patent number: 8749986
    Abstract: A flexible midplane comprises: a printed circuit board including: a middle section and at least one side section; and a flexible region disposed between the middle section and each side section; wherein each flexible region permits the corresponding side section to be bent in relation to the middle section.
    Type: Grant
    Filed: December 21, 2005
    Date of Patent: June 10, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Eric C. Peterson, Christian L. Belady
  • Patent number: 8259455
    Abstract: The invention relates to a protective device for an electronic component including at least one pin to be electrically connected to an electronic system. The device includes at least one flexible printed circuit including first and second opposite surfaces, a central portion including a through opening for receiving the pin, and flaps connected to the central portion. The printed circuit is made of two insulation layers and includes at least one first conducting track between the two insulating layers, connecting the pin to the electronic system, a second conducting track extending on the first surface, and a third conducting track extending on the second surface. The flaps are folded back at least partially onto each other in order to encapsulate the pin and to electrically connect the second and third conducting tracks.
    Type: Grant
    Filed: November 14, 2008
    Date of Patent: September 4, 2012
    Assignee: Ingenico France
    Inventor: Eric Dubois
  • Patent number: 8201778
    Abstract: An installing structure of a wire harness on a link includes a link which pivotally connects a movable structural body to a fixed structural body, a wire harness which is installed along the link so as to extend from the fixed structural body to the movable structural body, a singular first flexible protective tube through which the wire harness is slidably passed, and a fixing member which fixes the flexible protective tube to the link.
    Type: Grant
    Filed: August 14, 2007
    Date of Patent: June 19, 2012
    Assignee: Yazaki Corporation
    Inventor: Masataka Yamamoto
  • Patent number: 8203849
    Abstract: A joint board is arranged between an upper package and a lower package. The arrangement of the joint board makes it possible to reduce the size of solder balls and to arrange them with narrower pitch. The joint board has slightly greater dimensions those of the upper package and the lower package. This makes it possible to prevent underfill from leaking and spreading.
    Type: Grant
    Filed: March 12, 2007
    Date of Patent: June 19, 2012
    Assignee: Elpida Memory, Inc.
    Inventor: Masanori Shibamoto
  • Patent number: 8130503
    Abstract: A mounting structure comprises at least one semiconductor device having solder bumps on a lower surface thereof as outer terminals and a flexible wiring board with wiring formed thereon. The semiconductor device is wrapped in a flexible wiring board; the mounting structure is provided with outer electrodes on both of a side on which the outer terminals of the semiconductor device are formed and an opposite side thereto; at least one wiring layer is formed on the flexible wiring board; and a supporting member is affixed between a lower surface of the semiconductor device on which the outer terminals are formed and the flexible wiring board.
    Type: Grant
    Filed: March 26, 2009
    Date of Patent: March 6, 2012
    Assignee: NEC Corporation
    Inventors: Shinji Watanabe, Takao Yamazaki
  • Patent number: 8058719
    Abstract: A microelectronic device including a microelectronic circuit and at least one planar flexible lead. These planar flexible leads are adapted to bend and flex during mechanical stress allow direct mounting of the device to a member, and withstand extreme thermal cycling, such as ?197° C. to +150° C. such as encountered in space.
    Type: Grant
    Filed: March 27, 2007
    Date of Patent: November 15, 2011
    Inventor: Tracy Autry
  • Patent number: 8053684
    Abstract: An electronic component mounting structure includes a flexible circuit board having terminal connection patterns formed thereon and a light-emitting component provided with electrodes. The light-emitting component is placed on the flexible circuit board, and a synthetic resin casing is injection-molded to cover the light-emitting component and a portion of the flexible circuit board surrounding the light-emitting component placed thereon, whereby the electrodes of the light-emitting component and the terminal connection patterns of the flexible circuit board are connected in abutting contact with each other.
    Type: Grant
    Filed: December 19, 2006
    Date of Patent: November 8, 2011
    Assignee: Teikoku Tsushin Kogyo Co., Ltd.
    Inventors: Shigemasa Takahashi, Takashi Yamada, Shinji Mizuno, Masahiro Kitahara, Daisuke Makino
  • Patent number: 8018042
    Abstract: A microelectronic device including a microelectronic circuit and at least one planar flexible lead. These planar flexible leads are adapted to bend and flex during mechanical stress, allowing direct mounting of the device to a member and able withstand extreme thermal cycling between ?20° C. to +80° C. encountered in terrestrial applications. Advantageously, the microelectronic device is adapted to be both weldable and solderable. The invention may comprise a solar cell diode, which is flexible and so thin that it can be affixed directly to the solar panel proximate the solar cell.
    Type: Grant
    Filed: December 5, 2008
    Date of Patent: September 13, 2011
    Assignee: Microsemi Corporation
    Inventor: Tracy Autry
  • Patent number: 7980518
    Abstract: A feeding structure for a sliding structural body includes: a protector base arranged in one of the sliding structural body and a stationary structural body; a link arm pivotally supported by a shaft portion of the protector base; a harness holder pivotally connected to an end portion of the link arm; and a wire harness which is laid from one end of the protector base to the harness holder so as to be bent in a substantial S-shape, and laid from the harness holder to the other of the sliding structural body and the stationary structural body so as to be moved therebetween.
    Type: Grant
    Filed: October 1, 2008
    Date of Patent: July 19, 2011
    Assignees: Yazaki Corporation, Aisin Seiki Kabushiki Kaisha
    Inventors: Mitsunobu Katou, Tohru Aoki, Tomoaki Nishimura, Motonari Inagaki
  • Publication number: 20100300746
    Abstract: Electronic devices, such as photovoltaic, transistor or doped light-emitting devices, can be manufactured with an air-based manufacturing process and device structure that encapsulates the device with air-stable electrodes and active layers that are reasonably stable in their unexcited state. A sheet of flexible material may act as a substrate and a second sheet of material acts as a cover. Getter materials are included in the encapsulated device, with the getter latent or unreactive during the manufacturing process.
    Type: Application
    Filed: June 1, 2010
    Publication date: December 2, 2010
    Applicant: ADD-VISION, INC.
  • Patent number: 7692288
    Abstract: A MEMS package and methods for its embodiment are described. The MEMS package has at least one MEMS device mounted on a flexible and foldable substrate. A metal cap structure surrounds the at least one MEMS device wherein an edge surface of the metal cap structure is attached to the flexible substrate and wherein a portion of the flexible substrate is folded under itself thereby forming the MEMS package. A meshed metal environmental hole underlying the at least one MEMS device provides enhanced EMI immunity.
    Type: Grant
    Filed: January 17, 2006
    Date of Patent: April 6, 2010
    Assignee: Silicon Matrix Pte Ltd.
    Inventors: Wang Zhe, Miao Yubo
  • Patent number: 7566836
    Abstract: A potting shell, for an electronic circuit on a circuit board, comprises a wall arrangement, which defines a shell volume at least in one spatial direction and in the directions perpendicular thereto; wherein the circuit board is positionable in the shell volume, and can be potted in the shell volume with a potting compound. The volume between the circuit board and a main wall of the potting shell, running essentially parallel, at least sectionally, to the circuit board, can be filled with a potting compound, characterized in that the main wall has at least one flexible section, which, based on a thermal expansion of the potting compound, can be deformed perpendicular to the plane of the flexible section.
    Type: Grant
    Filed: July 30, 2004
    Date of Patent: July 28, 2009
    Assignee: Endress + Hauser GmbH +Co. KG
    Inventor: Juergen Tanner
  • Patent number: 7189929
    Abstract: Embodiments of the present invention provide a flexible circuit at least partially encapsulated by a cover layer. The flexible circuit includes a substrate having one or more openings. One or more electrical conductors are bonded to the top surface of the substrate. A first cover layer is bonded to the top surface of the substrate and to the electrical conductors. A second cover layer is bonded to the bottom surface of the substrate and to the first cover layer through the openings.
    Type: Grant
    Filed: January 16, 2004
    Date of Patent: March 13, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Brad Benson
  • Patent number: 7161092
    Abstract: The present invention provides in one embodiment, a system for encapsulating a substrate on a vehicle structure. The system includes the substrate, the vehicle structure and a package substrate. The substrate has a top portion and a bottom portion. The vehicle structure is operatively connected to the bottom portion of the substrate. The package substrate has a plurality of layers, where the package substrate is operatively connected to the top portion of the substrate. The package substrate conforms to a periphery area of the top portion of the substrate.
    Type: Grant
    Filed: April 15, 2002
    Date of Patent: January 9, 2007
    Assignee: Visteon Global Technologies, Inc.
    Inventor: Andrew Glovatsky
  • Patent number: 6295205
    Abstract: A high-power semiconductor module having a casing which encloses at least one semiconductor element has an explosion protection element. This explosion protection element is a protective sheath which surrounds at least a portion of the casing and traps fragments which are projected outward in the event of an explosion of the semiconductor element. This prevents people from being injured or adjacent modules from being damaged by such fragments.
    Type: Grant
    Filed: August 20, 1999
    Date of Patent: September 25, 2001
    Assignee: Asea Brown Boveri AG
    Inventors: Thomas Lang, Hans-Rudolf Zeller
  • Patent number: 6118072
    Abstract: A device including a flexible circuit disposed within a conductive tube. The circuit may include a flexible substrate and one or more circuit elements. The circuit may have circuit elements on one or both sides, and the substrate may be multi-layered. The tube may have any one of many cross-sectional shapes, including circular, oval, square, and rectangular.
    Type: Grant
    Filed: December 3, 1997
    Date of Patent: September 12, 2000
    Assignee: Teledyne Technologies Incorp.
    Inventor: Richard Scott
  • Patent number: 6118646
    Abstract: A capacitor structure including a housing and two copper plates disposed on two sides of an interior of the housing. A capacitor element is installed in the housing. The opposite inner sides of each copper plate are disposed with multiple longitudinally arranged small resilient plates which inward extend to engage with the capacitor element in the housing. An outer side of each copper plate is disposed with an upper and a lower engaging plates which are longitudinally inclinedly arranged. The upper and lower engaging plates serve to engage with or attach to a conductive wire inserted into the housing. The upper and lower engaging plates of the copper plate can at the same time contact with the conductive wire so that it can enhance the electricity conduction effect. The capacitor structure enables a user to replace the capacitor element and copper plates by himself.
    Type: Grant
    Filed: December 29, 1998
    Date of Patent: September 12, 2000
    Inventors: Akira Yang, Jiing H. Wang
  • Patent number: 6091022
    Abstract: A header structure for a semiconductor pressure transducer includes a cylindrical glass member located within a tubular housing having a closed end. A tubular core member extends through a central axial hole in the glass member. The core member has a sealed end proximate the closed end of the housing and an opposite end. A plurality of electrically conductive terminal pins extend through the glass member in surrounding relation to the core member and exit the housing through a plurality of holes in the closed end. A semiconductor die is mounted adjacent the opposite end of the core member and is electrically connected to the surrounding terminal pins by wire leads.
    Type: Grant
    Filed: December 17, 1998
    Date of Patent: July 18, 2000
    Assignee: Honeywell Inc.
    Inventor: Joel J. Bodin
  • Patent number: 6087006
    Abstract: A surface-protecting film is formed on the surface of the semiconductor element of a resin-sealed semiconductor device to prevent the peeling and cracking of the sealing member used in said device, by coating on said surface a polyimide precursor composition containing a polyimide precursor having a recurring unit constitution represented by the following general formula (1) and heat-curing the coated polyimide precursor composition: ##STR1## wherein R.sup.1 is a trivalent or tetravalent aromatic group; R.sup.2 and R.sup.3 are each a tetravalent organic group having 4 or more carbon atoms; R.sup.4 is a bivalent organic group having 4 or more carbon atoms; X is a bivalent organic group containing at least one member selected from the group consisting of oxygen and nitrogen: Y is a monovalent organic group having 15 or less carbon atoms; n=5-100 and m=0-95 with a proviso that n+m=100; and p is 1 or 2).
    Type: Grant
    Filed: August 22, 1995
    Date of Patent: July 11, 2000
    Assignee: Hitachi, Ltd.
    Inventors: Jun Tanaka, Fumio Kataoka, Haruhiko Kikkawa, Isao Obara, Keiko Isoda
  • Patent number: 5922989
    Abstract: An electronic part capable of preventing a flux from intruding thereinto without using a sealing material can be provided. In the electronic part 1, terminals 3 to be inserted through electrode holes of a circuit board are projected from a casing 1a. In the terminals 3, there are provided cut-in portions 8 extending to a space formed between the casing 1a and the circuit board when the terminals 3 are inserted through the electrode holes.
    Type: Grant
    Filed: September 6, 1996
    Date of Patent: July 13, 1999
    Assignee: Mitsuba Electric Manufacturing Co., Ltd.
    Inventors: Akimasa Tsunoda, Yuichi Nagase, Seiichi Katagiri, Shigeo Suzuki, Kiyohumi Nakayama, Kenji Hirota, Noboru Sato, Tatsuya Tsukagoshi
  • Patent number: 5909915
    Abstract: A resin-molded electronic circuit device is provided with a protection resin molded with covering electronic components and an electronic circuit substrate and having almost the same coefficient of thermal expansion as that of a metal forming the electronic components and the electronic circuit substrate, and a connector mounted at an end of the protection resin and functioning as an external connecting terminal of the electronic circuit substrate. Since a case for housing the protection resin is unnecessary, it is possible to decrease the number of components and man-hours, and enhance the outside appearance of the electronic circuit device.
    Type: Grant
    Filed: May 16, 1996
    Date of Patent: June 8, 1999
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Hiroshi Okuda
  • Patent number: 5901046
    Abstract: A package body holding an acceleration sensor circuit therein has signal electrodes and four dummy electrodes insulated from the signal electrode on a mounted surface thereof. The signal electrodes are electrically connected to the sensor circuit element. The mounted surface of the package body has chamfered portions on verge portions thereof, and auxiliary electrodes are formed on the chamfered portions to be integrally connected to the signal electrodes. The thus constructed package body is mounted on a circuit board by a reflow method using a solder paste so that the signal, dummy, and auxiliary electrodes are connected to a wiring pattern on the circuit board through solder portions. In this process, the solder paste on the dummy electrodes in a fused state generate an internal pressure to retain a clearance between the package body and the circuit board.
    Type: Grant
    Filed: December 10, 1997
    Date of Patent: May 4, 1999
    Assignee: Denso Corporation
    Inventors: Tameharu Ohta, Takashi Yamasaki, Kenichi Gohara
  • Patent number: 5792985
    Abstract: A terminal for an electronic component having a connecting section with a rectangular shaped cross sectional for connection to the casing of the electronic component, and a taping section also with a rectangular shaped cross sectional for attachment to a tape carrying a plurality of such terminals. In between the connecting section and the taping section are a lower rod section and an upper rod section. The lower rod section facilitates the separation of the taping section from the tape. The upper section facilitates the separation of the connecting section from the remaining portion of the terminal.
    Type: Grant
    Filed: August 21, 1996
    Date of Patent: August 11, 1998
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hisashi Watanabe, Shoji Takeda, Hideki Notake
  • Patent number: 5781415
    Abstract: A semiconductor package is described which is constructed from a rectangular tape film, a wiring pattern formed on the tape film constituted by wiring composed of a conductive material, a semiconductor chip electrically connected to one end of the wiring pattern, and holes formed on the other end of the wiring pattern for connection by insertion of lead-pins. A method is then described for stacking and mounting a plurality of semiconductor packages on a wiring substrate by first vertically positioning lead-pins on a wiring substrate and then passing these lead-pins through the holes in the semiconductor packages.
    Type: Grant
    Filed: July 9, 1996
    Date of Patent: July 14, 1998
    Assignee: NEC Corporation
    Inventor: Nobuyuki Itoh
  • Patent number: 5715594
    Abstract: A portable peripheral card for an electrical device is disclosed that has an injected molded housing package. In one aspect of the invention, the peripheral card has a printed circuit board, a female electrical connector, and a solid one-piece injected molded package. The printed circuit board has electrical components mounted thereon and the female electrical connector is attached to the printed circuit board to permit communications between the electrical components on the printed circuit board and the electrical device. The solid one-piece package encapsulates the printed circuit board and the electrical components yet exposes a portion of the electrical connector to facilitate electrical connections between the printed circuit board and the electrical device. In one preferred embodiment, the portable peripheral card is a PCMCIA card. Methods of manufacturing such peripheral cards are also disclosed.
    Type: Grant
    Filed: June 14, 1996
    Date of Patent: February 10, 1998
    Assignee: National Semiconductor Corporation
    Inventors: Michael W. Patterson, Hem P. Takiar
  • Patent number: 5675883
    Abstract: The invention relates to a method of manufacturing a copper-nickel-silicon alloy with a composition Cu (balance), Ni 1.5-5.5%, Si 0.2-1.05, Fe 0-0.5% and Mg 0-0.1% (all in percent by weight), and use of the alloy for pressure-englazable casings. The method permits an alloy with a very high elastic limit with very good conductivity and good cold reformability and differs from the conventional method of manufacturing such alloys by heating to about 950.degree. C. and fairly rapid cooling after a preceding cold rolling operation. An improvement in the properties can be achieved by ageing of the alloy at 300.degree. C. to 600.degree. C. for several hours.
    Type: Grant
    Filed: April 26, 1995
    Date of Patent: October 14, 1997
    Assignee: Diehl GmbH & Co.
    Inventors: Norbert Gaag, Peter Ruchel
  • Patent number: 5545846
    Abstract: The invention is to a header for a power semiconductor device and a method for making the header. A ground pin is mounted or formed on the header mounting base and a header ground lead is placed over the ground pin and fused to the pin by a laser beam.
    Type: Grant
    Filed: September 30, 1993
    Date of Patent: August 13, 1996
    Assignee: Texas Instruments Incorporated
    Inventors: Charles E. Williams, Dennis D. Davis, David Kee
  • Patent number: 5519936
    Abstract: An electronic package which includes a rigid support member, e.g., copper sheet, to which is bonded both the package's semiconductor chip and circuitized substrate members. The chip is bonded using a thermally conductive adhesive while the circuitized substrate, preferably a flexible circuit, is bonded using an electrically insulative adhesive. The chip is electrically coupled to designated parts of the circuitry of the substrate, preferably by wire, thermocompression or thermosonic bonding. An encapsulant may be used to cover and protect the connections between the chip and substrate. This package may in turn be electrically coupled to a separate, second substrate such as a PCB.
    Type: Grant
    Filed: February 1, 1995
    Date of Patent: May 28, 1996
    Assignee: International Business Machines Corporation
    Inventors: Frank E. Andros, James R. Bupp, Michael DiPietro, Richard B. Hammer
  • Patent number: 5446959
    Abstract: A method of packaging a power semiconductor device is disclosed, comprising the steps of preparing a lead frame including a paddle for providing a semiconductor chip on a top surface thereof, tie bars for supporting said paddle, wherein said paddle being provided lower in horizontal surface than the leads; attaching a heat radiating plate on a bottom surface of the paddle by cladding; attaching a Kovar plate on the top surface of the paddle by soldering, said Kovar plate having similar heat expansion coefficient to that of the chip; providing the chip on the Kovar plate by soldering; wire-bonding terminals of said semiconductor chip to the corresponding leads of the lead frame, respectively; coating polyimide over the semiconductor chip by spin-coating; curing the polyimide coated thus; forming a metal cap above the said paddle by soldering, and injecting a molding material into a molder for enclosing the paddle and curing the molding material injected thus the method can be applied to produce a plastic packa
    Type: Grant
    Filed: July 6, 1994
    Date of Patent: September 5, 1995
    Assignee: Electronics and Telecommunication Research Institute
    Inventors: Dong-Goo Kim, Min-Kyu Song, Seong-Su Park, Seung-Goo Kang, Hyung-Jin Yoon, Hyung-Moo Park
  • Patent number: 5291063
    Abstract: A high-power RF feedback resistor assembly includes a flat film resistor or other flat device mounted in thermal communication onto a bushing which is, in turn, mounted directly onto a cooling flange of an associated power transistor. A bushing has a vertical bolt hole through it to receive a threaded screw. The bushing can have a cutout beneath the flat vertical surface on which the resistor is mounted to provide clearance for a printed circuit board.
    Type: Grant
    Filed: December 23, 1991
    Date of Patent: March 1, 1994
    Assignee: ENI Div. of Astec America, Inc.
    Inventor: Gary C. Adishian
  • Patent number: 5260601
    Abstract: A flat package for semiconductor integrated circuit devices allows edge-mounting and surface-mount. The package may be molded plastic containing a semiconductor chip, and flat leads extend from one edge of the package. The leads are bent to provide an area to solder to conductors on a PC board. Mechanical positioning, mechanical support and spacing are provided by studs extending from the edge of the package adjacent the leads. The studs have stops formed at a position even with flat outer surfaces of the bent leads; the portion outward of the stops fits into holes in the PC board.
    Type: Grant
    Filed: September 5, 1990
    Date of Patent: November 9, 1993
    Assignee: Texas Instruments Incorporated
    Inventors: Daniel A. Baudouin, Ernest J. Russell
  • Patent number: 5212345
    Abstract: A self leaded header for surface mounting of a circuit element to a PC board comprises a generally box-like support body having a cavity for mounting a circuit element, the support body having a base and a plurality of feet extending downward from the base for supporting the same on a PC board, a plurality of lead support members having a generally spool configuration extending generally horizontally outward from the support body adjacent the base, an inductance coil mounted in the cavity, and a lead extending from the coil to and wound multiple turns around each of the lead support members and disposed for surface bonding to a PC board.
    Type: Grant
    Filed: January 24, 1992
    Date of Patent: May 18, 1993
    Assignee: Pulse Engineering, Inc.
    Inventor: Aurelio J. Gutierrez
  • Patent number: 5206460
    Abstract: An oscillator package includes a header substrate with a number of through holes formed therein, a copper post passed through each through hole, a ceramic substrate securely mounted to and supported by the copper posts for mounting a die and a crystal thereon, a substantially L-shaped lead securely attached to an underside as well as a lateral side of the header substrate and contacting each copper post, and a ceramic cover housing the die and crystal. A metal film is applied to an inner periphery of the hole, and the copper posts are mounted in the holes after the metal-film is sintered. An outer periphery of the copper post is plated by nickel then gold. The lead is mountable to a circuit board by soldering, and the solder covers an overall area of the lead. The ceramic cover has at least a 90% weight of aluminum oxide.
    Type: Grant
    Filed: July 24, 1991
    Date of Patent: April 27, 1993
    Inventor: Mu K. Yang
  • Patent number: 5166098
    Abstract: This semiconductor device has two leads (3) lying in the same axis, a prefabricated plastic can (1) which is filled with a plastic compound and has one of the leads passed through its bottom (1a), and a prefabricated die (4) attached between those sides of the inner ends (60, 70) of the leads (3) facing each other, the leads being inserted into, and having an offset within, the can. The manufacture of the leads starts with a wire (30) which unwinds from a spool (39), passes through a major part of the manufacturing stages unseparated, and is separated into the individual semiconductor devices only after the mounting of the cans (1).
    Type: Grant
    Filed: March 11, 1991
    Date of Patent: November 24, 1992
    Assignee: Deutsche ITT Industries GmbH
    Inventors: Lyubomir Micic, Gunter Gartlein, Eberhard Schmitt, Axel Muller, Egon Seng, Siegfried Spindler
  • Patent number: 5113580
    Abstract: The invention encompasses plating to form leads to allow one step bonding of a chip to tape; one step bonding of leads on the tape to a special chip package wherein chip packages may be stacked and connected as well as surface mounted and formation of a very dense circuitry on one or both sides of a board by using a photo imagable dielectric to separate circuitry and allow plating thru to form integral connections and edge connectors to connect circuitry to allow use of both sides of a board.
    Type: Grant
    Filed: November 19, 1990
    Date of Patent: May 19, 1992
    Inventors: Jon M. Schroeder, Joseph F. Long, Randall J. Hartgrove
  • Patent number: 5107324
    Abstract: A two-terminal semiconductor device of surface installation type comprising: a semiconductor chip hermetically enclosed in a package; and lead pins protruded from both end faces of the package with the semiconductor chip held between the inner ends thereof, characterized in that the lead pins protruded from both end faces of the package have outer end portions which are each formed into a flat-plate-shaped soldering leg by pressing, and the lead pins are formed into a hairpin shape in such a manner that the soldering legs are flush with each other.
    Type: Grant
    Filed: April 26, 1990
    Date of Patent: April 21, 1992
    Assignee: Fuji Electric Co., Ltd.
    Inventors: Mitsumasa Iwahara, Misuo Tershima
  • Patent number: 5064782
    Abstract: A semiconductor device package is disclosed which includes (1) a carrier body which is to be mounted with a semiconductor device chip and which has an annular adhesion layer formed thereon, (2) a cap which is to be adhered to the carrier body to hermetically seal the carrier body, and (3) an adhesive which is applied between the adhesion layer of the carrier body and the cap and which becomes hardened after at least one of the carrier body and the cap is pivoted about an axis coaxial with the annular adhesion layer to eliminate voids in the adhesive and to improve the sealing properties of the package.
    Type: Grant
    Filed: April 6, 1990
    Date of Patent: November 12, 1991
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventor: Masanori Nishiguchi
  • Patent number: 5049526
    Abstract: A method for fabricating and especially for encapsulating a semiconductor device in a plastic package is disclosed. In accordance with one embodiment of the invention the method includes steps of providing an encapsulation mold having a first chamber and a second chamber, with the second chamber spaced outwardly from and substantially surrounding the first chamber. The first chamber is shaped to receive a removable insert. An insert is selected for the particular body type and style which is desired and that insert is secured in the first chamber. The insert has a cavity which is shaped to define the desired encapsulated device package body. A lead frame is provided including a bonding area and a plurality of leads, each lead having a inner portion near the bonding area and an outer portion extending outwardly from the bonding area.
    Type: Grant
    Filed: June 7, 1989
    Date of Patent: September 17, 1991
    Assignee: Motorola, Inc.
    Inventors: Michael B. McShane, Paul T. Lin
  • Patent number: 5031028
    Abstract: A heat sink/electromagnetic shield assembly for a circuit element disposed upon a circuit board. A spring clip containing at least one hooked projection forming the spring is positioned in a confronting relationship with the circuit element. A U-shaped housing is slidingly positioned over the circuit element and the spring clip to enclose the circuit element and to compress the hooked projection which forms the spring. Compression of the hooked projection causes the hooked projection to exert a spring force to retain the housing in position about the circuit element. The assembly may be constructed in-line during construction of the electrical circuit disposed upon the circuit board.
    Type: Grant
    Filed: December 21, 1990
    Date of Patent: July 9, 1991
    Assignee: Motorola, Inc.
    Inventors: Michael G. Galich, Dale G. Johnson
  • Patent number: 5028987
    Abstract: A hermetic, high current package for a semiconductor device includes wide flat leads which are bonded to the contact pads of the device and formed to extend through apertures in an insulating lid. The lid is sealed to a base and the apertures around the leads are sealed with solder to provide the hermetic package. This package limits lateral current flow in the contact pads of the semiconductor device to relatively low levels which ensure the integrity of the contact pads.
    Type: Grant
    Filed: July 3, 1989
    Date of Patent: July 2, 1991
    Assignee: General Electric Company
    Inventors: Constantine A. Neugebauer, Robert J. Satriano, James F. Burgess, Homer H. Glascock, II, Victor A. K. Temple, Donald L. Watrous
  • Patent number: 5025305
    Abstract: A semiconductor device for detecting or emitting a magnetic line of force or light is so provided that the major surface of its built-in semiconductor chip has a predetermined inclination angle relative to a mount surface of a mount substrate. An active layer of element for detecting a magnetic line of force or light or an element for emitting a magnetic line of force or light is formed on the major surface of the semiconductor chip. It is, therefore, possible to achieve a smaller mount thickness as defined relative to a mount surface and to detect a magnetic line of force or light coming in a direction parallel to the mount surface or to emit a magnetic line of force or light in a direction vertical to the mount surface.
    Type: Grant
    Filed: May 1, 1990
    Date of Patent: June 18, 1991
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yutaka Tomisawa, Toshikazu Fukuda, Kazuhiko Inoue
  • Patent number: 5021868
    Abstract: An IC carrier has a continuous annular frame formed in a generally square shape, an IC accommodating portion formed with the frame and adapted to accommodate an IC package therein, a supporting portion formed on the frame and adapted to support contact pieces of the IC package, and engaging claws integrally formed on the frame and adapted to hold the IC package. The IC carrier further has a hinge portion formed in corner portions at the ends of a diagonal hinge line extending diametrically of the frame to permit the frame to bend around the hinge line.
    Type: Grant
    Filed: March 29, 1990
    Date of Patent: June 4, 1991
    Assignee: Yamaichi Electric Mfg. Co., Ltd.
    Inventor: Noriyuki Matsuoka
  • Patent number: 5019829
    Abstract: A TO-style plug-in package for MMICs and associated antenna structure is comprised of a microwave circuit component carrier having a generally cylindrically shaped conductive header upon which one or more MMICs are supported. An aperture through the header contains a conductor pin supported within a glass seal interface, so as to form a hermetically sealed matched impedance transmission line through the package. The conductor pin is connected to a bonding pad of a microwave circuit component on the header. A generally cylindrical conductive cover engages the header and encloses a cavity within which the microwave circuit components are supported. A microstrip antenna is supported on a dielectric layer overlying an outer surface of the conductive cover and is connected to a further conductor pin that extends through a glass-sealed aperture in the cover and forms a matched impedance transmission line from the antenna to the header.
    Type: Grant
    Filed: February 8, 1989
    Date of Patent: May 28, 1991
    Inventors: Douglas E. Heckman, Dawn A. Larson, Jeffrey A. Frisco, David A. Haskins
  • Patent number: 4996170
    Abstract: An improved molding process utilizes a thixotropic compound. The thixotropic compound is transferred from a feed pot to a manifold having at least one outlet. The manifold is held at a temperature in which the thixotropic compound is not cured. The manifold is engaged with a mold that has an inlet opening that runs to a mold cavity, such that the outlet of the manifold and the inlet of the mold communicate with each other. The thixotropic compound is transferred from the manifold into the mold cavity, which is held at a temperature at which the thixotropic compound is cured. The manifold and the mold are then separated, drawing the thixotropic compound near the exit of the feed runners into the manifold, thus making a clean separation.
    Type: Grant
    Filed: July 30, 1990
    Date of Patent: February 26, 1991
    Assignee: Motorola, Inc.
    Inventor: John Baird