Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

Abstract: Apparatus and Methods for fabricating apparatus having a hermetic seal to seal a portion of an apparatus, for example and without limitation, a portion having a MEMS sensor. One such method uses crimping devices to compress a seal in a cavity formed in a housing that includes a MEMS sensor attached to a stress isolator. Under such compression, the seal deforms to hermetically seal surfaces around the inside, outside and bottom of the stress isolator.

Abstract: Apparatus and Methods for fabricating apparatus having a hermetic seal to seal a portion of an apparatus, for example and without limitation, a portion having a MEMS sensor. One such method uses crimping devices to compress a seal in a cavity formed in a housing that includes a MEMS sensor attached to a stress isolator. Under such compression, the seal deforms to hermetically seal surfaces around the inside, outside and bottom of the stress isolator.

Abstract: An input device can be integrated within an electronic device and/or operably connected to an electronic device through a wired or wireless connection. The input device can include one or more force sensors positioned below a cover element of the input device or an input surface of the electronic device. The input device can include other components and/or functionality, such as a biometric sensor and/or a switch element.

Abstract: Embodiments of the invention provide a display substrate and a manufacturing method thereof, and a display device. The display substrate includes a display region and a sealant coating region provided outside the display region, and the sealant coating region is provided with a groove to limit a sealant.

Abstract: A base material for a display device, a display device and a method for fabricating the display device are disclosed. One or more grooves are disposed on a bonding surface of the base material, the grooves are configured for accommodating at least a portion of adhesive coated to the bonding surface. The grooves on the base material can accommodate redundant adhesive, thereby effectively preventing the adhesive overflow and air bubble defects during the bonding process, and increasing the yield ratio of bonding.

Abstract: A flexible midplane comprises: a printed circuit board including: a middle section and at least one side section; and a flexible region disposed between the middle section and each side section; wherein each flexible region permits the corresponding side section to be bent in relation to the middle section.

Abstract: The invention relates to a protective device for an electronic component including at least one pin to be electrically connected to an electronic system. The device includes at least one flexible printed circuit including first and second opposite surfaces, a central portion including a through opening for receiving the pin, and flaps connected to the central portion. The printed circuit is made of two insulation layers and includes at least one first conducting track between the two insulating layers, connecting the pin to the electronic system, a second conducting track extending on the first surface, and a third conducting track extending on the second surface. The flaps are folded back at least partially onto each other in order to encapsulate the pin and to electrically connect the second and third conducting tracks.

Abstract: An installing structure of a wire harness on a link includes a link which pivotally connects a movable structural body to a fixed structural body, a wire harness which is installed along the link so as to extend from the fixed structural body to the movable structural body, a singular first flexible protective tube through which the wire harness is slidably passed, and a fixing member which fixes the flexible protective tube to the link.

Abstract: A joint board is arranged between an upper package and a lower package. The arrangement of the joint board makes it possible to reduce the size of solder balls and to arrange them with narrower pitch. The joint board has slightly greater dimensions those of the upper package and the lower package. This makes it possible to prevent underfill from leaking and spreading.

Abstract: A mounting structure comprises at least one semiconductor device having solder bumps on a lower surface thereof as outer terminals and a flexible wiring board with wiring formed thereon. The semiconductor device is wrapped in a flexible wiring board; the mounting structure is provided with outer electrodes on both of a side on which the outer terminals of the semiconductor device are formed and an opposite side thereto; at least one wiring layer is formed on the flexible wiring board; and a supporting member is affixed between a lower surface of the semiconductor device on which the outer terminals are formed and the flexible wiring board.

Abstract: A microelectronic device including a microelectronic circuit and at least one planar flexible lead. These planar flexible leads are adapted to bend and flex during mechanical stress allow direct mounting of the device to a member, and withstand extreme thermal cycling, such as ?197° C. to +150° C. such as encountered in space.

Abstract: An electronic component mounting structure includes a flexible circuit board having terminal connection patterns formed thereon and a light-emitting component provided with electrodes. The light-emitting component is placed on the flexible circuit board, and a synthetic resin casing is injection-molded to cover the light-emitting component and a portion of the flexible circuit board surrounding the light-emitting component placed thereon, whereby the electrodes of the light-emitting component and the terminal connection patterns of the flexible circuit board are connected in abutting contact with each other.

Abstract: A microelectronic device including a microelectronic circuit and at least one planar flexible lead. These planar flexible leads are adapted to bend and flex during mechanical stress, allowing direct mounting of the device to a member and able withstand extreme thermal cycling between ?20° C. to +80° C. encountered in terrestrial applications. Advantageously, the microelectronic device is adapted to be both weldable and solderable. The invention may comprise a solar cell diode, which is flexible and so thin that it can be affixed directly to the solar panel proximate the solar cell.

Abstract: A feeding structure for a sliding structural body includes: a protector base arranged in one of the sliding structural body and a stationary structural body; a link arm pivotally supported by a shaft portion of the protector base; a harness holder pivotally connected to an end portion of the link arm; and a wire harness which is laid from one end of the protector base to the harness holder so as to be bent in a substantial S-shape, and laid from the harness holder to the other of the sliding structural body and the stationary structural body so as to be moved therebetween.

Abstract: Electronic devices, such as photovoltaic, transistor or doped light-emitting devices, can be manufactured with an air-based manufacturing process and device structure that encapsulates the device with air-stable electrodes and active layers that are reasonably stable in their unexcited state. A sheet of flexible material may act as a substrate and a second sheet of material acts as a cover. Getter materials are included in the encapsulated device, with the getter latent or unreactive during the manufacturing process.

Abstract: A MEMS package and methods for its embodiment are described. The MEMS package has at least one MEMS device mounted on a flexible and foldable substrate. A metal cap structure surrounds the at least one MEMS device wherein an edge surface of the metal cap structure is attached to the flexible substrate and wherein a portion of the flexible substrate is folded under itself thereby forming the MEMS package. A meshed metal environmental hole underlying the at least one MEMS device provides enhanced EMI immunity.

Abstract: A potting shell, for an electronic circuit on a circuit board, comprises a wall arrangement, which defines a shell volume at least in one spatial direction and in the directions perpendicular thereto; wherein the circuit board is positionable in the shell volume, and can be potted in the shell volume with a potting compound. The volume between the circuit board and a main wall of the potting shell, running essentially parallel, at least sectionally, to the circuit board, can be filled with a potting compound, characterized in that the main wall has at least one flexible section, which, based on a thermal expansion of the potting compound, can be deformed perpendicular to the plane of the flexible section.

Abstract: Embodiments of the present invention provide a flexible circuit at least partially encapsulated by a cover layer. The flexible circuit includes a substrate having one or more openings. One or more electrical conductors are bonded to the top surface of the substrate. A first cover layer is bonded to the top surface of the substrate and to the electrical conductors. A second cover layer is bonded to the bottom surface of the substrate and to the first cover layer through the openings.

Abstract: The present invention provides in one embodiment, a system for encapsulating a substrate on a vehicle structure. The system includes the substrate, the vehicle structure and a package substrate. The substrate has a top portion and a bottom portion. The vehicle structure is operatively connected to the bottom portion of the substrate. The package substrate has a plurality of layers, where the package substrate is operatively connected to the top portion of the substrate. The package substrate conforms to a periphery area of the top portion of the substrate.

Abstract: A high-power semiconductor module having a casing which encloses at least one semiconductor element has an explosion protection element. This explosion protection element is a protective sheath which surrounds at least a portion of the casing and traps fragments which are projected outward in the event of an explosion of the semiconductor element. This prevents people from being injured or adjacent modules from being damaged by such fragments.

Abstract: A device including a flexible circuit disposed within a conductive tube. The circuit may include a flexible substrate and one or more circuit elements. The circuit may have circuit elements on one or both sides, and the substrate may be multi-layered. The tube may have any one of many cross-sectional shapes, including circular, oval, square, and rectangular.

Abstract: A capacitor structure including a housing and two copper plates disposed on two sides of an interior of the housing. A capacitor element is installed in the housing. The opposite inner sides of each copper plate are disposed with multiple longitudinally arranged small resilient plates which inward extend to engage with the capacitor element in the housing. An outer side of each copper plate is disposed with an upper and a lower engaging plates which are longitudinally inclinedly arranged. The upper and lower engaging plates serve to engage with or attach to a conductive wire inserted into the housing. The upper and lower engaging plates of the copper plate can at the same time contact with the conductive wire so that it can enhance the electricity conduction effect. The capacitor structure enables a user to replace the capacitor element and copper plates by himself.

Abstract: A header structure for a semiconductor pressure transducer includes a cylindrical glass member located within a tubular housing having a closed end. A tubular core member extends through a central axial hole in the glass member. The core member has a sealed end proximate the closed end of the housing and an opposite end. A plurality of electrically conductive terminal pins extend through the glass member in surrounding relation to the core member and exit the housing through a plurality of holes in the closed end. A semiconductor die is mounted adjacent the opposite end of the core member and is electrically connected to the surrounding terminal pins by wire leads.

Abstract: A surface-protecting film is formed on the surface of the semiconductor element of a resin-sealed semiconductor device to prevent the peeling and cracking of the sealing member used in said device, by coating on said surface a polyimide precursor composition containing a polyimide precursor having a recurring unit constitution represented by the following general formula (1) and heat-curing the coated polyimide precursor composition: ##STR1## wherein R.sup.1 is a trivalent or tetravalent aromatic group; R.sup.2 and R.sup.3 are each a tetravalent organic group having 4 or more carbon atoms; R.sup.4 is a bivalent organic group having 4 or more carbon atoms; X is a bivalent organic group containing at least one member selected from the group consisting of oxygen and nitrogen: Y is a monovalent organic group having 15 or less carbon atoms; n=5-100 and m=0-95 with a proviso that n+m=100; and p is 1 or 2).

Abstract: An electronic part capable of preventing a flux from intruding thereinto without using a sealing material can be provided. In the electronic part 1, terminals 3 to be inserted through electrode holes of a circuit board are projected from a casing 1a. In the terminals 3, there are provided cut-in portions 8 extending to a space formed between the casing 1a and the circuit board when the terminals 3 are inserted through the electrode holes.

Abstract: A resin-molded electronic circuit device is provided with a protection resin molded with covering electronic components and an electronic circuit substrate and having almost the same coefficient of thermal expansion as that of a metal forming the electronic components and the electronic circuit substrate, and a connector mounted at an end of the protection resin and functioning as an external connecting terminal of the electronic circuit substrate. Since a case for housing the protection resin is unnecessary, it is possible to decrease the number of components and man-hours, and enhance the outside appearance of the electronic circuit device.

Abstract: A package body holding an acceleration sensor circuit therein has signal electrodes and four dummy electrodes insulated from the signal electrode on a mounted surface thereof. The signal electrodes are electrically connected to the sensor circuit element. The mounted surface of the package body has chamfered portions on verge portions thereof, and auxiliary electrodes are formed on the chamfered portions to be integrally connected to the signal electrodes. The thus constructed package body is mounted on a circuit board by a reflow method using a solder paste so that the signal, dummy, and auxiliary electrodes are connected to a wiring pattern on the circuit board through solder portions. In this process, the solder paste on the dummy electrodes in a fused state generate an internal pressure to retain a clearance between the package body and the circuit board.

Abstract: A terminal for an electronic component having a connecting section with a rectangular shaped cross sectional for connection to the casing of the electronic component, and a taping section also with a rectangular shaped cross sectional for attachment to a tape carrying a plurality of such terminals. In between the connecting section and the taping section are a lower rod section and an upper rod section. The lower rod section facilitates the separation of the taping section from the tape. The upper section facilitates the separation of the connecting section from the remaining portion of the terminal.

Abstract: A semiconductor package is described which is constructed from a rectangular tape film, a wiring pattern formed on the tape film constituted by wiring composed of a conductive material, a semiconductor chip electrically connected to one end of the wiring pattern, and holes formed on the other end of the wiring pattern for connection by insertion of lead-pins. A method is then described for stacking and mounting a plurality of semiconductor packages on a wiring substrate by first vertically positioning lead-pins on a wiring substrate and then passing these lead-pins through the holes in the semiconductor packages.

Abstract: A portable peripheral card for an electrical device is disclosed that has an injected molded housing package. In one aspect of the invention, the peripheral card has a printed circuit board, a female electrical connector, and a solid one-piece injected molded package. The printed circuit board has electrical components mounted thereon and the female electrical connector is attached to the printed circuit board to permit communications between the electrical components on the printed circuit board and the electrical device. The solid one-piece package encapsulates the printed circuit board and the electrical components yet exposes a portion of the electrical connector to facilitate electrical connections between the printed circuit board and the electrical device. In one preferred embodiment, the portable peripheral card is a PCMCIA card. Methods of manufacturing such peripheral cards are also disclosed.

Abstract: The invention relates to a method of manufacturing a copper-nickel-silicon alloy with a composition Cu (balance), Ni 1.5-5.5%, Si 0.2-1.05, Fe 0-0.5% and Mg 0-0.1% (all in percent by weight), and use of the alloy for pressure-englazable casings. The method permits an alloy with a very high elastic limit with very good conductivity and good cold reformability and differs from the conventional method of manufacturing such alloys by heating to about 950.degree. C. and fairly rapid cooling after a preceding cold rolling operation. An improvement in the properties can be achieved by ageing of the alloy at 300.degree. C. to 600.degree. C. for several hours.

Abstract: The invention is to a header for a power semiconductor device and a method for making the header. A ground pin is mounted or formed on the header mounting base and a header ground lead is placed over the ground pin and fused to the pin by a laser beam.

Abstract: An electronic package which includes a rigid support member, e.g., copper sheet, to which is bonded both the package's semiconductor chip and circuitized substrate members. The chip is bonded using a thermally conductive adhesive while the circuitized substrate, preferably a flexible circuit, is bonded using an electrically insulative adhesive. The chip is electrically coupled to designated parts of the circuitry of the substrate, preferably by wire, thermocompression or thermosonic bonding. An encapsulant may be used to cover and protect the connections between the chip and substrate. This package may in turn be electrically coupled to a separate, second substrate such as a PCB.

Abstract: A method of packaging a power semiconductor device is disclosed, comprising the steps of preparing a lead frame including a paddle for providing a semiconductor chip on a top surface thereof, tie bars for supporting said paddle, wherein said paddle being provided lower in horizontal surface than the leads; attaching a heat radiating plate on a bottom surface of the paddle by cladding; attaching a Kovar plate on the top surface of the paddle by soldering, said Kovar plate having similar heat expansion coefficient to that of the chip; providing the chip on the Kovar plate by soldering; wire-bonding terminals of said semiconductor chip to the corresponding leads of the lead frame, respectively; coating polyimide over the semiconductor chip by spin-coating; curing the polyimide coated thus; forming a metal cap above the said paddle by soldering, and injecting a molding material into a molder for enclosing the paddle and curing the molding material injected thus the method can be applied to produce a plastic packa

Abstract: A high-power RF feedback resistor assembly includes a flat film resistor or other flat device mounted in thermal communication onto a bushing which is, in turn, mounted directly onto a cooling flange of an associated power transistor. A bushing has a vertical bolt hole through it to receive a threaded screw. The bushing can have a cutout beneath the flat vertical surface on which the resistor is mounted to provide clearance for a printed circuit board.

Abstract: A flat package for semiconductor integrated circuit devices allows edge-mounting and surface-mount. The package may be molded plastic containing a semiconductor chip, and flat leads extend from one edge of the package. The leads are bent to provide an area to solder to conductors on a PC board. Mechanical positioning, mechanical support and spacing are provided by studs extending from the edge of the package adjacent the leads. The studs have stops formed at a position even with flat outer surfaces of the bent leads; the portion outward of the stops fits into holes in the PC board.

Abstract: A self leaded header for surface mounting of a circuit element to a PC board comprises a generally box-like support body having a cavity for mounting a circuit element, the support body having a base and a plurality of feet extending downward from the base for supporting the same on a PC board, a plurality of lead support members having a generally spool configuration extending generally horizontally outward from the support body adjacent the base, an inductance coil mounted in the cavity, and a lead extending from the coil to and wound multiple turns around each of the lead support members and disposed for surface bonding to a PC board.

Abstract: An oscillator package includes a header substrate with a number of through holes formed therein, a copper post passed through each through hole, a ceramic substrate securely mounted to and supported by the copper posts for mounting a die and a crystal thereon, a substantially L-shaped lead securely attached to an underside as well as a lateral side of the header substrate and contacting each copper post, and a ceramic cover housing the die and crystal. A metal film is applied to an inner periphery of the hole, and the copper posts are mounted in the holes after the metal-film is sintered. An outer periphery of the copper post is plated by nickel then gold. The lead is mountable to a circuit board by soldering, and the solder covers an overall area of the lead. The ceramic cover has at least a 90% weight of aluminum oxide.

Abstract: This semiconductor device has two leads (3) lying in the same axis, a prefabricated plastic can (1) which is filled with a plastic compound and has one of the leads passed through its bottom (1a), and a prefabricated die (4) attached between those sides of the inner ends (60, 70) of the leads (3) facing each other, the leads being inserted into, and having an offset within, the can. The manufacture of the leads starts with a wire (30) which unwinds from a spool (39), passes through a major part of the manufacturing stages unseparated, and is separated into the individual semiconductor devices only after the mounting of the cans (1).

Abstract: The invention encompasses plating to form leads to allow one step bonding of a chip to tape; one step bonding of leads on the tape to a special chip package wherein chip packages may be stacked and connected as well as surface mounted and formation of a very dense circuitry on one or both sides of a board by using a photo imagable dielectric to separate circuitry and allow plating thru to form integral connections and edge connectors to connect circuitry to allow use of both sides of a board.

Abstract: A two-terminal semiconductor device of surface installation type comprising: a semiconductor chip hermetically enclosed in a package; and lead pins protruded from both end faces of the package with the semiconductor chip held between the inner ends thereof, characterized in that the lead pins protruded from both end faces of the package have outer end portions which are each formed into a flat-plate-shaped soldering leg by pressing, and the lead pins are formed into a hairpin shape in such a manner that the soldering legs are flush with each other.

Abstract: A semiconductor device package is disclosed which includes (1) a carrier body which is to be mounted with a semiconductor device chip and which has an annular adhesion layer formed thereon, (2) a cap which is to be adhered to the carrier body to hermetically seal the carrier body, and (3) an adhesive which is applied between the adhesion layer of the carrier body and the cap and which becomes hardened after at least one of the carrier body and the cap is pivoted about an axis coaxial with the annular adhesion layer to eliminate voids in the adhesive and to improve the sealing properties of the package.

Abstract: A method for fabricating and especially for encapsulating a semiconductor device in a plastic package is disclosed. In accordance with one embodiment of the invention the method includes steps of providing an encapsulation mold having a first chamber and a second chamber, with the second chamber spaced outwardly from and substantially surrounding the first chamber. The first chamber is shaped to receive a removable insert. An insert is selected for the particular body type and style which is desired and that insert is secured in the first chamber. The insert has a cavity which is shaped to define the desired encapsulated device package body. A lead frame is provided including a bonding area and a plurality of leads, each lead having a inner portion near the bonding area and an outer portion extending outwardly from the bonding area.

Abstract: A heat sink/electromagnetic shield assembly for a circuit element disposed upon a circuit board. A spring clip containing at least one hooked projection forming the spring is positioned in a confronting relationship with the circuit element. A U-shaped housing is slidingly positioned over the circuit element and the spring clip to enclose the circuit element and to compress the hooked projection which forms the spring. Compression of the hooked projection causes the hooked projection to exert a spring force to retain the housing in position about the circuit element. The assembly may be constructed in-line during construction of the electrical circuit disposed upon the circuit board.

Abstract: A hermetic, high current package for a semiconductor device includes wide flat leads which are bonded to the contact pads of the device and formed to extend through apertures in an insulating lid. The lid is sealed to a base and the apertures around the leads are sealed with solder to provide the hermetic package. This package limits lateral current flow in the contact pads of the semiconductor device to relatively low levels which ensure the integrity of the contact pads.

Abstract: A semiconductor device for detecting or emitting a magnetic line of force or light is so provided that the major surface of its built-in semiconductor chip has a predetermined inclination angle relative to a mount surface of a mount substrate. An active layer of element for detecting a magnetic line of force or light or an element for emitting a magnetic line of force or light is formed on the major surface of the semiconductor chip. It is, therefore, possible to achieve a smaller mount thickness as defined relative to a mount surface and to detect a magnetic line of force or light coming in a direction parallel to the mount surface or to emit a magnetic line of force or light in a direction vertical to the mount surface.

Abstract: An IC carrier has a continuous annular frame formed in a generally square shape, an IC accommodating portion formed with the frame and adapted to accommodate an IC package therein, a supporting portion formed on the frame and adapted to support contact pieces of the IC package, and engaging claws integrally formed on the frame and adapted to hold the IC package. The IC carrier further has a hinge portion formed in corner portions at the ends of a diagonal hinge line extending diametrically of the frame to permit the frame to bend around the hinge line.

Abstract: A TO-style plug-in package for MMICs and associated antenna structure is comprised of a microwave circuit component carrier having a generally cylindrically shaped conductive header upon which one or more MMICs are supported. An aperture through the header contains a conductor pin supported within a glass seal interface, so as to form a hermetically sealed matched impedance transmission line through the package. The conductor pin is connected to a bonding pad of a microwave circuit component on the header. A generally cylindrical conductive cover engages the header and encloses a cavity within which the microwave circuit components are supported. A microstrip antenna is supported on a dielectric layer overlying an outer surface of the conductive cover and is connected to a further conductor pin that extends through a glass-sealed aperture in the cover and forms a matched impedance transmission line from the antenna to the header.

Abstract: An improved molding process utilizes a thixotropic compound. The thixotropic compound is transferred from a feed pot to a manifold having at least one outlet. The manifold is held at a temperature in which the thixotropic compound is not cured. The manifold is engaged with a mold that has an inlet opening that runs to a mold cavity, such that the outlet of the manifold and the inlet of the mold communicate with each other. The thixotropic compound is transferred from the manifold into the mold cavity, which is held at a temperature at which the thixotropic compound is cured. The manifold and the mold are then separated, drawing the thixotropic compound near the exit of the feed runners into the manifold, thus making a clean separation.