Connection Patents (Class 174/541)
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Patent number: 12154839Abstract: An integrated circuit device assembly including a graphene-coated heat spreader, including: a substrate; a die coupled to the substrate; and a heat spreader thermally coupled to the die, the heat spreader comprising: a body of thermally conductive metal defining a cavity at least partially surrounding the die; and a graphene layer contacting a surface of the body.Type: GrantFiled: March 18, 2022Date of Patent: November 26, 2024Assignee: ADVANCED MICRO DEVICES, INC.Inventors: Xiaoyang Ji, Li An, Soo Pin Chow
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Patent number: 12126370Abstract: In a high-frequency module, a plurality of filters are connected to a first switch. A plurality of amplifiers are connected to a second switch. A first inductor is disposed on a common path between a second common terminal of the second switch and a first common terminal of the first switch. A plurality of second inductors are disposed, on a one-to-one correspondence, in sections different from the common path, the sections being included in the plurality of respective signal paths. The first inductor is a surface mount inductor located on a first main surface of a mounting substrate. The plurality of second inductors are each an inductor disposed within an IC chip including the plurality of amplifiers or an inductor including a conductive pattern formed in or on the mounting substrate.Type: GrantFiled: June 17, 2022Date of Patent: October 22, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Isao Takenaka
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Patent number: 12113336Abstract: A busbar adapter including a housing being adapted to be attached to a busbar, a printed circuit board, and at least one electric current sensor electrically connected with the printed circuit board, wherein the printed circuit board and the at least one electric current sensor are arranged inside the housing, wherein the housing comprises an upper housing part being adapted for the attachment of one or more devices to be connected through the busbar adapter to a busbar and a lower housing part being adapted for holding the printed circuit board and the at least one electric current sensor, and wherein the lower housing part comprises a first part being adapted for holding the printed circuit board and the at least one electric current sensor and a second part being adapted to be attached to the busbar.Type: GrantFiled: December 15, 2020Date of Patent: October 8, 2024Assignee: EATON INTELLIGENT POWER LIMITEDInventors: Bruno Fuentes, Steffen Pluskotta, Robin Küppers, Stephan Stanke, Ingo Schaar, Wolfgang Meid
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Patent number: 12106917Abstract: A socket includes a housing including a connection surface to which an electronic device is connected, and a lever attached to the housing to be rotatable. The lever includes an operation portion that is rotatable between a first position and a second position and a contact portion that extends from the operation portion in a direction approaching the connection surface and rotates about the rotation axis together with the operation portion. The housing includes a restriction protrusion that comes into contact with a protruding portion protruding from the side portion of the electronic device toward the operation portion at the second position to restrict a movement of the electronic device in the first direction and in a direction away from the connection surface when the operation portion is rotated from the first position to the second position in a state where the electronic device is connected to the connection surface.Type: GrantFiled: August 10, 2022Date of Patent: October 1, 2024Assignee: OMRON CORPORATIONInventors: Shinya Matsuo, Kenichiro Masaki, Shinya Tsuji
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Patent number: 12062675Abstract: A device in which the influence of ?-ray is reduced, and a composition for forming an organic layer. The device includes an ?-ray source, an electronic circuit influenced by ?-ray, and an organic layer including an ?-ray shielding agent, in which an ?-ray shielding ability X of the ?-ray shielding agent is 0.50 or less.Type: GrantFiled: April 27, 2020Date of Patent: August 13, 2024Assignee: FUJIFILM CorporationInventors: Tetsushi Miyata, Hirotaka Takishita, Hidekazu Ohashi, Mitsuru Sawano
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Patent number: 11970392Abstract: The present disclosure discloses a self-packing three-arm thermal scanning probe for micro-nano manufacturing, comprising: a three-arm cantilever beam, metal contact pads, a nichrome heating electrode for printing, a nichrome heating electrode for transportation, and a polymer storage area. The present disclosure is manufactured by conventional micro-nano machining processes such as lithography and wet etching. In the present disclosure, a gradient density design of heating electrodes is used to generated continuous change of temperature gradients, thus realizing continuous transportation of a printing material from a storage area to a tip area, which realizes self-packing.Type: GrantFiled: June 18, 2021Date of Patent: April 30, 2024Assignee: ZHEJIANG UNIVERSITYInventors: Huan Hu, Renwei Mao
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Patent number: 11972887Abstract: An inductor component that includes a core that includes a substantially column-shaped shaft part and a pair of support parts at both ends of the shaft part; terminal electrodes that are respectively provided on the pair of support parts; and a wire that is wound around the shaft part and has end portions that are respectively connected to the terminal electrodes on the pair of support parts. The inductor component exhibits an impedance value of 2100? or higher for an input signal having a frequency of 500 MHz.Type: GrantFiled: June 3, 2020Date of Patent: April 30, 2024Assignee: Murata Manufacturing Co., Ltd.Inventors: Sunao Noya, Akira Tanaka, Koji Okuda, Tomotaka Gotohda
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Patent number: 11869860Abstract: A storage device includes a controller including first and second pins and configured to output a multi-level chip enable signal through the second pin, and a memory device. The memory device includes third and fourth pins respectively connected to the first and second pins, and a plurality of memory chips commonly connected to the fourth pin. The plurality of memory chips respectively include a plurality of resistors connected to one another in a daisy-chain structure between the third pin and a first voltage terminal. The plurality of memory chips are configured to respectively generate a plurality of reference voltage periods that divide between a voltage level of the third pin and a voltage level of the first voltage terminal based on the plurality of resistors.Type: GrantFiled: September 20, 2021Date of Patent: January 9, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hyunsuk Kang, Daehoon Na, Chiweon Yoon
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Patent number: 11837555Abstract: A module includes a substrate including a first main surface, a first component mounted on the first main surface, a first sealing resin including a first upper surface, the first component being sealed with the first sealing resin, a first shield film that covers at least a part of the first upper surface of the first sealing resin, and a second shield film that covers a side surface of the first sealing resin and a side surface of the substrate. A step portion lower than the first upper surface of the first sealing resin is provided on an outer periphery of the first sealing resin. The first shield film and the second shield film are electrically connected to each other on a side surface below the step portion.Type: GrantFiled: December 28, 2021Date of Patent: December 5, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Toru Komatsu, Tadashi Nomura
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Patent number: 11811170Abstract: A connector assembly comprising a male connector, and a female connector mateable to the male connector. Each of the male and female connectors include a shielding shell having two identical shielding half shells each comprising a bottom wall and a pair of side walls, a protrusion formed on one of the pair of side walls, and a latch formed on the other of the pair of side walls. The latch of one of the two shielding half shells engages with the protrusion of the other of the two shielding half shells for locking the two shielding half shells together. A terminal module is installed in each of the shielding shells. The terminal module and shielding shell of the male connector is adapted to be received within and electrically connected to the female connector.Type: GrantFiled: November 3, 2021Date of Patent: November 7, 2023Assignees: Tyco Electronics (Shanghai) Co., Ltd., Tyco Electronics Japan G.K.Inventors: Yingchun (David) Wang, Yusuke Okada, Yong (Chris) Wang, Liqiang (Gino) Yao, Daokuan (Jeremy) Zhang, Hua He, Haibo (Robert) Gan
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Patent number: 11798891Abstract: A flexible circuitry layer may comprise a conductive mesh including a circuitry trace; and an interfacing component, comprising: a flexible substrate; a terminal electrically connected to the circuitry trace; and a connector configured to be detachably connected to an external device.Type: GrantFiled: May 18, 2022Date of Patent: October 24, 2023Assignee: LOOMIA Technologies, Inc.Inventors: Madison Thea Maxey, Ezgi Uçar, Janett Martinez
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Patent number: 11749979Abstract: An electrical connection assembly includes an electrical box including a housing having an internal surface defining an internal volume of the housing. An electrical connector is positioned outside the internal volume of the housing and fixed to the housing with a fastener. The housing includes an aperture having an opening defining an insertion path extending from a location external to the housing along a frame of the electrical connector to a location within the internal volume of the housing. The assembly includes a disc mechanically secured to the housing relative to the opening to obstruct the insertion path. A retainer and a bushing including a membrane for the electrical connector as well as methods of making an electrical connector are also provided.Type: GrantFiled: February 11, 2022Date of Patent: September 5, 2023Assignee: EATON INTELLIGENT POWER LIMITEDInventors: Shane Semple, Ronald Conroy, Joseph Platt, Prince Kumar Pandey, Himanshu G. Khokle, Gangadhar Mestri
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Patent number: 11699866Abstract: A method for coupling a coaxial cable to a coaxial cable connector assembly includes inserting a coaxial cable into a cable channel of a rear body of a coaxial cable connector assembly, where the coaxial cable connector assembly includes an adhesive reservoir positioned at least partially within the cable channel of the rear body, the adhesive reservoir comprising an adhesive and an adhesive reservoir seal material that at least partially encapsulates the adhesive, inserting at least a portion of the coaxial cable into the adhesive reservoir, and exposing the adhesive to electromagnetic energy thereby curing the adhesive, by at least one of directing electromagnetic energy from an energy source on the adhesive, and removing an outer jacket from an outer wall of the rear body.Type: GrantFiled: July 12, 2021Date of Patent: July 11, 2023Assignee: Corning Optical Communications RF LLCInventors: Donald Andrew Burris, David Jeffrey Malouf
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Patent number: 11550277Abstract: A ruggedized edge computing assembly is provided, which includes an edge computing device having a processor configured to control a controlled device. The ruggedized edge computing assembly includes a field connector configured to connect to the edge computing device via a plurality of pins and to the controlled device via a coupling. The ruggedized edge computing assembly further includes a housing overmolded around each of the field connector and the edge computing device. The housing includes two portions which are a field connector portion configured to accommodate the field connector and an edge computing device portion configured to accommodate the edge computing device. The two portions are configured to interlockingly engage together at an interface.Type: GrantFiled: December 30, 2020Date of Patent: January 10, 2023Assignee: MORPHIX, INC.Inventor: Jonathan Lovegrove
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Patent number: 11510311Abstract: An electronic component module (100) includes a module board (10) having electronic components (40) mounted on at least one of a first surface (front surface) (12) and a second surface (back surface) (14), mold portions (22 and 23), and a shield (32). The mold portions (22 and 23) cover the mounted electronic components (40). The shield (32) covers at least a part of the mold portions (22 and 23) and the side surfaces of the module board (10). Protrusions (15) protruding from the side surfaces are formed on the module board (10). The shield (32) is separated by the protrusions (15).Type: GrantFiled: March 11, 2021Date of Patent: November 22, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Issei Yamamoto, Akio Katsube
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Patent number: 11489274Abstract: A quick release connecting device includes an actuating retainer and a fixing member movably assembled to the actuating retainer. The fixing member includes a pivot portion and a pivot member movably mounted to the pivot portion; and the pivot member is coupled with a second object. The fixing member includes a limiting section and the pivot member includes a corresponding limiting section, such that the limiting section and the corresponding limiting section limit or stop each other at a specific location when the fixing member is moved or rotated. With these arrangements, the quick release connecting device can be applied to conveniently and repeatedly connect and separate a circuit board, a drawer, or a window to and from a corresponding rack, chassis, cabinet or window frame.Type: GrantFiled: December 7, 2020Date of Patent: November 1, 2022Inventor: Ting-Jui Wang
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Patent number: 11432448Abstract: A method of forming an electronic device is described which comprises a stack of electronic components wherein each electronic component comprises a face and external terminations. A component stability structure is attached to at least one face. A circuit board is provided wherein the circuit board comprises circuit traces arranged for electrical engagement with the external terminations. The component stability structure mechanically engages with the circuit board and inhibits the electronic device from moving relative to the circuit board.Type: GrantFiled: June 17, 2020Date of Patent: August 30, 2022Assignee: KEMET Electronics CorporationInventors: John E. McConnell, John Bultitude
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Patent number: 11394345Abstract: An apparatus and system for mechanically coupling a power conditioning unit (PCU) to a photovoltaic (PV) module. In one embodiment, the apparatus comprises a base member, adapted for mounting a power conditioning unit (PCU) on a PV module backsheet, comprising a plurality of PCU retention members for retaining the PCU; and at least one compression spring, coupled to the base member, for maintaining the PCU in a position, with respect to the PV module backsheet, that can be dynamically changed between a first position and a second position.Type: GrantFiled: May 13, 2019Date of Patent: July 19, 2022Assignee: Enphase Energy, Inc.Inventor: Ryan Linderman
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Patent number: 11357081Abstract: A heat conductive strip having a power terminal and a method for packaging the same, wherein the heating conductive strip having a power terminal packaged by the packaging method includes: a carbon fiber unit composed of a plurality of carbon fibers and having a carbon fiber portion; a plastic sleeve covering the carbon fiber unit and having a clamping end portion that covers the carbon fiber portion; a power terminal inserted into the carbon fiber unit and including: a first metal end in electrical contact with the carbon fiber portion, and a second metal end opposite to the first metal end and exposed out of the plastic sleeve; and a fixing member sleeved on the clamping end portion of the plastic sleeve to enable the clamping end portion, the carbon fiber portion and the first metal end to be integrated into one body.Type: GrantFiled: May 9, 2019Date of Patent: June 7, 2022Assignee: TAIWAN TECH CO., LTD.Inventor: Chen-San Cheng
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Patent number: 11269791Abstract: A universal assembly for mass interconnect connection are shown and described. In one embodiment, an assembly includes an upper tier, a first APEX lower tier, and a second APEX lower tier. Typically, the upper tier is independent of the first and second APEX lower tiers. The upper tier may have a pair of spatially separated rails defining a vertical interconnect pull-through platform. The APEX lower tiers may have spatially separated lower rails to secure a APEX socket to mate with a corresponding APEX plug in a connected position. The result is an interconnect system and assemblies for enhancing organizational and interchangeable electrical engagement.Type: GrantFiled: July 16, 2020Date of Patent: March 8, 2022Assignee: MAC Panel CompanyInventor: Philip Anthony Sedberry, Jr.
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Patent number: 11264871Abstract: An inverter drive assembly includes a first array of inverters, a second array of inverters spaced from the first array of inverters and defining a plenum therebetween, and a crossover bus bar spanning the plenum and electrically connecting the first array of inverters to the second array of inverters. The crossover bus bar includes a first laminated bus section electrically connected to the first array of inverters, a second laminated bus section electrically connected to the second array of inverters, and a solid bus connection interconnecting the first laminated bus section with the second laminated bus section.Type: GrantFiled: October 11, 2019Date of Patent: March 1, 2022Assignee: Transportation IP Holdings, LLCInventors: Sarit Ratadiya, Jacob Alan Hubbell, Ajith Kuttannair Kumar, Mark Murphy, Shreenath Shekar Perlaguri
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Patent number: 11129272Abstract: A relay arrangement includes at least two series-connected relays, which are mechanically and electrically connected to a main printed circuit board via first terminals and second terminals, and at least one flat conductor for conducting current between the at least two series connected relays. The flat conductor is mechanically connected to the main printed circuit board and electrically and thermally connected to the first terminals of the relays, and the at least one flat conductor is configured to dissipate heat produced during operation of the relays.Type: GrantFiled: July 23, 2019Date of Patent: September 21, 2021Assignee: SMA Solar Technology AGInventors: Frank Papenfuss, Lars Bethke, Thomas Kuehn, Christian Gehrke
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Patent number: 11063332Abstract: A subminiature circulator includes feed pin assemblies, a hollow base having an opening formed in the top, and a locating iron sheet, wherein a laminated assembly is arranged in the base, notches are formed in the peripheral wall of the base and are communicated with the bottom face of the base, the locating iron sheet is clamped in the laminated assembly and is provided with extension parts which stretch out of the base via the notches, and the feed pin assemblies are installed in installation holes formed in the extension parts. The feed pin assemblies are arranged in the installation holes formed in the extension parts of the locating iron sheet, and such installation manner is not limited to an integrally-formed structure, so that a sophisticated device is easy to machine in the fabrication process.Type: GrantFiled: August 30, 2018Date of Patent: July 13, 2021Assignee: Shenzhen Huayang Technology Development Co., Ltd.Inventors: Fei Xiong, Wei Zhang
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Patent number: 11030145Abstract: A server includes an adapter device, multiple storage modules and multiple controllers. The adapter device includes a base circuit board having opposite first and second surfaces, multiple first connectors disposed on the first surface along a first direction and connected to the base circuit board, and multiple second connectors disposed on the second surface along the first direction in pairs, each of which is arranged along a second direction, is connected to the base circuit board and is disposed between adjacent two of the first connectors. Each of the storage modules is connected to a corresponding first connector. Each of the controllers is connected to a corresponding second connector.Type: GrantFiled: May 6, 2019Date of Patent: June 8, 2021Assignee: Jabil Inc.Inventor: Fengquan Zheng
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Patent number: 10916878Abstract: A USB device, and methods of forming same, are disclosed. The USB device includes a semiconductor device such as a SIP module and a housing injection molded around the semiconductor device.Type: GrantFiled: June 22, 2018Date of Patent: February 9, 2021Assignee: Western Digital Technologies, Inc.Inventors: Tee Khoon Guan, Pradeep Kumar Rai
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Patent number: 10907988Abstract: The invention provides a rotation sensor enabling simplification of manufacturing process, such as an inspection step, while maintaining measurement accuracy of the rotation sensor. Lead frames of a rotation sensor have positioning sections which contact a side surface section of a case and, in this state of contact, keep the insertion depth dimension of a magnetism detection unit in the internal space of the case to a prescribed dimension; a flange lower flat surface of a flange section is provided further towards the case bottom surface side than a flange lower flat surface of a ring-shaped rib, a portion of the outer peripheral section of the case and the ring-shaped rib are exposed in a ring shape from an exterior molding section, and the case is provided with a plurality of projections along the inner side surface of the case which constitutes the internal space.Type: GrantFiled: September 29, 2016Date of Patent: February 2, 2021Assignee: Mitsubishi Electric CornorationInventors: Tomoki Kuwamura, Akira Takashima, Hiroshi Fujita, Hideki Shimauchi, Akira Koshimizu
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Patent number: 10826249Abstract: A rotary connector apparatus includes: a ring-shaped fixed member; a ring-shaped rotating member rotatably fitted to the fixed member; a flexible flat cable housed in a housing space formed by the fixed member and the rotating member, the flexible flat cable having a plurality of wires, one end of the flexible flat cable being fixed to the fixed member and another end thereof being fixed to the rotating member, wherein a first connector housing attached to the fixed member accommodates a plurality of electrically conductive paths that respectively connect a plurality of first terminals to the plurality of wires at said one end of the flexible flat cable, and at least one of the plurality of electrically conductive paths is configured to removably receive a protection device so as to protect the path from overcurrent.Type: GrantFiled: December 19, 2018Date of Patent: November 3, 2020Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA AUTOMOTIVE SYSTEMS INC.Inventors: Hirofumi Utsunomiya, Kenji Hiroki, Masashi Kanazawa
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Patent number: 10748722Abstract: Provided is a novel dark-current-circuit interruption structure that can stably maintain the state of engagement of an engaging portion of a conductive component holder with an engaged portion of a case, while reducing the size of the case, and an electrical junction box including the same. A conductive component is formed by a plate metal fitting, a conductive component holder 48 includes elastic projecting pieces and engaging portions that are provided on each of a pair of side walls that are opposingly positioned with a gap between the plate metal fitting and each of the side walls, and the case includes engaged portions with which the engaging portions are to be engaged. When attaching the conductive component holder to the case, the engaging portions and the engaged portions are configured to come into contact with each other to cause the elastic projecting pieces 68 and 76 to elastically deform.Type: GrantFiled: February 1, 2019Date of Patent: August 18, 2020Assignee: SUMITOMO WIRING SYSTEMS, LTD.Inventors: Toshiyuki Horiuchi, Daisuke Matsuura
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Patent number: 10741951Abstract: A socket connector includes a socket assembly having a socket substrate and socket contacts. The socket substrate has first and second upper mating areas and a first lower mating area. The socket substrate has first and second socket substrate conductors at the first and second upper mating areas, respectively, and third socket substrate conductors at the first lower mating area electrically connected to corresponding first socket substrate conductors. The first socket substrate conductors are electrically connected to an electronic package, the second socket substrate conductors are electrically connected to an electrical component and the third socket substrate conductors are electrically connected to a host circuit board. The socket assembly is configured to electrically connect the electronic package with both the host circuit board and the electrical component.Type: GrantFiled: March 30, 2018Date of Patent: August 11, 2020Assignees: TE Connectivity Corporation, Tyco Electronics Japan G.K.Inventors: Jeffery Walter Mason, Takeshi Nakashima, Naoki Hashimoto
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Patent number: 10685146Abstract: Tamper-respondent assemblies, electronic assembly packages, and methods of fabrication are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about one or more electronic components to be protected, such as an electronic assembly. The tamper-respondent sensors include a first tamper-respondent sensor and a second tamper-respondent sensor, which may be similarly constructed or differently constructed. In certain embodiments, the tamper-respondent sensors wrap, at least in part, over an electronic enclosure, and in other embodiments, the tamper-respondent sensors cover, at least in part, an inner surface of an electronic enclosure to facilitate defining a secure volume in association with a multilayer circuit board to which the electronic enclosure is mounted.Type: GrantFiled: March 20, 2019Date of Patent: June 16, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: William L. Brodsky, John R. Dangler, Phillip Duane Isaacs, David C. Long, Michael T. Peets
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Patent number: 10622335Abstract: A semiconductor package includes a package substrate, a plurality of semiconductor devices stacked on the package substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the package substrate and the plurality of semiconductor devices, and a molding resin at least partially surrounding the plurality of semiconductor devices and the plurality of underfill fillets. The plurality of underfill fillets include a plurality of protrusions that protrude from spaces between each of tire plurality of semiconductor devices or between the package substrate and each of the plurality of semiconductor devices. At least two neighboring underfill fillet protrusions of the plurality of protrusions form one continuous structure without an interface therebetween.Type: GrantFiled: November 26, 2018Date of Patent: April 14, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ji-Hwan Hwang, Sang-Sick Park, Tae-Hong Min, Geol Nam
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Patent number: 10573478Abstract: The present disclosure relates to an electronic high-frequency component for accommodating micro-devices, having at least two housing parts which are joined together by a metal frame and which enclose a cavity, and at least one input signal line configured to introduce electrical high-frequency signals from outside of the component into the cavity. The input signal line is connected to a signal line via. Furthermore, the high-frequency component also has at least one short-circuit via which electrically connects the metal frame to at least one of the housing parts of the component.Type: GrantFiled: May 11, 2016Date of Patent: February 25, 2020Assignee: Airbus Defence and Space GmbHInventors: Bernhard Schoenlinner, Ulrich Prechtel
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Patent number: 10571638Abstract: The disclosed apparatus may include (1) a cage that (A) is coupled to a circuit board of a telecommunications device and (B) houses the optical module when the optical module is installed in the telecommunications device, (2) a heatsink that (A) makes physical contact with the optical module via an opening of the cage and (B) absorbs heat generated by the optical module during operation in the telecommunications device, and (3) a gasket that (A) resides between the heatsink and the cage and (B) reduces electromagnetic noise in connection with the operation of the optical module in the telecommunications device. Various other apparatuses, systems, and methods are also disclosed.Type: GrantFiled: January 31, 2018Date of Patent: February 25, 2020Assignee: Juniper Networks, Inc.Inventors: Atieh Talebzadeh, Philippe C. Sochoux, Jing Li, Qian Liu, Kaustav Ghosh
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Patent number: 10516085Abstract: Devices and methods including an LED and reflective die attach material are described herein. The devices can include a reflective substrate (e.g., a substrate that includes a silver layer) to which one or more LED die are attached using the die attach material. The die attach material extends beyond the periphery of the LED die to cover an area of the substrate surface.Type: GrantFiled: August 20, 2015Date of Patent: December 24, 2019Assignee: Luminus, Inc.Inventors: Qifeng Shan, Hongtao Ma, Tao Tong
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Patent number: 10483739Abstract: A temporary wiring portal assembly includes a wall stud that has a lateral surface and a front surface, and drywall is positioned on the front surface. A junction box is removably fastened to the wall stud prior to installing drywall. The junction box has an input port and an output port, and a conductor is routed into the input port and out of the output port. A tube is removably coupled to the output port and the tube has a length of at least 10.0 cm. Thus, the tube extends outwardly beyond the front surface of the wall stud when the junction box is removably fastened to the wall stud. The tube requires the drywall be installed around the tube when the drywall is fastened to the front surface of the wall stud thereby inhibiting the conductor from being covered by the drywall. Moreover, the tube is removed from the output port when the drywall is installed thereby facilitating the conductor to be accessible for trim installation.Type: GrantFiled: September 19, 2018Date of Patent: November 19, 2019Inventor: Matthew Dunlap
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Patent number: 10392033Abstract: An elastomeric pad is provided for use in a railway car truck that includes two sideframes and a bolster. Each sideframe has a pedestal opening at each end to receive a bearing adapter assembly. The bearing adapter assembly includes a cast steel bearing adapter that is formed to fit on top of an axle bearing assembly. An elastomeric pad, comprised of a selected hardness elastomer, is fit on top of the bearing adapter. Contact buttons extend from the top surface and bottom surface of the elastomeric pad and are received in openings in the elastomeric pad. A conductor provides an electrical connection between the contact buttons.Type: GrantFiled: July 12, 2016Date of Patent: August 27, 2019Assignee: AMSTED RAIL COMPANY, INC.Inventors: John Coseglia, Shawn Peetz
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Patent number: 10369315Abstract: A fastener arrangement for securing at least two components together may include a male fastener with a first screw thread and a female fastener with a second screw thread, wherein one of the first screw thread and the second screw thread is a straight screw thread and the other of the first screw thread and the second screw thread is a hybrid screw thread that includes a tapered screw thread portion and a straight screw thread portion.Type: GrantFiled: December 21, 2015Date of Patent: August 6, 2019Assignee: ResMed Pty LtdInventor: Michael Kassipillai Gunaratnam
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Patent number: 10368400Abstract: A thermal conductive strip with a power supply terminal includes: a carbon fiber unit including a carbon fiber connecting end; a plastic envelope which encapsulates the carbon fiber unit and has a length smaller than a length of the carbon fiber connecting end, and further includes a broken portion which covers a part of the carbon fiber connecting end; and the power supply terminal sleeved onto the broken portion and the carbon fiber connecting end, and including a clamping section for clamping the broken portion, and an electrically conductive section for contacting the carbon fiber connecting end. The power supply terminal is partially clamped on the plastic envelope and partially eclectically connected to the carbon fiber, which improves the yield rate and the bending durability of the thermal conductive strip of the present invention.Type: GrantFiled: July 11, 2016Date of Patent: July 30, 2019Assignee: TAIWAN TECH CO., LTD.Inventor: Chen-San Cheng
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Patent number: 10356923Abstract: A casing of an electronic device including a metallic housing and a first non-conductive spacer is provided. The metallic housing has an inner surface and an outer surface opposite to the inner surface, the outer surface of the metallic housing is dyed, the inner surface is substantially a recessed structure, and the metallic housing has a first gap communicating the inner surface and the outer surface, wherein the metallic housing further comprises at least one connecting terminal. The first non-conductive spacer, disposed in the first gap of the metallic housing.Type: GrantFiled: January 8, 2016Date of Patent: July 16, 2019Assignee: HTC CorporationInventors: Tim Chung-Ting Wu, Cheng-Chieh Chuang, Chi-Jen Lu, Chun-Lung Chu, Chien-Hung Lin
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Patent number: 10347415Abstract: A coil component has a core having a winding core portion and a flange portion disposed on each of both ends of the winding core portion, the flange portion including a foot portion; a wire wound around the winding core portion; an electrode portion disposed on a bottom surface of the foot portion of the flange portion and connected to the wire; a metal terminal to be connected via a mounting solder to a mounting substrate; and a joining member connecting the metal terminal to the electrode portion. The joining member has a heat resistance property retaining a connection state between the electrode portion and the metal terminal at least at the melting point of the mounting solder.Type: GrantFiled: February 4, 2016Date of Patent: July 9, 2019Assignee: Murata Manufacturing Co., Ltd.Inventor: Yuki Kanbe
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Patent number: 10331617Abstract: A server includes an adapter device, multiple storage modules and multiple controllers. The adapter device includes a base circuit board having opposite first and second surfaces, multiple first connectors disposed on the first surface along a first direction and connected to the base circuit board, and multiple second connectors disposed on the second surface along the first direction in pairs, each of which is arranged along a second direction, is connected to the base circuit board and is disposed between adjacent two of the first connectors. Each of the storage modules is connected to a corresponding first connector. Each of the controllers is connected to a corresponding second connector.Type: GrantFiled: May 31, 2018Date of Patent: June 25, 2019Assignee: Jabil Inc.Inventor: Fengquan Zheng
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Patent number: 10333233Abstract: The invention relates to an electrical connector element for contacting a conductive structure arranged on a flat carrier wherein the contacting is performed by a thermally bonded connecting material, wherein devices for fixing an advantageously flexible conductor are arranged on one side, wherein the connector element is configured as a soldering base or soldering bridge with a connector portion, characterized in that at least a portion of the soldering base or of the soldering bridge that is to be connected with the conductive structure is configured as a fanned area and includes at least two bars that are offset from each other by a slot.Type: GrantFiled: December 19, 2017Date of Patent: June 25, 2019Assignee: FEW Fahrzeugelektrikwerk GmbH & Co. KGInventors: Björn Schneider, Felix Tischer, David Roger
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Patent number: 10320135Abstract: An electrical interconnection device for coupling a firing module to a pyrotechnic electric match may generally comprise a circuit board comprising a first surface and a second surface, an input connector electrically connected to the first surface of the circuit board to couple the device to the firing module and at least one output connector electrically connected to the second surface of the circuit board to couple the device to the pyrotechnic match. The device may have a weight of less than about 200 grams, and a length of less than about 100 mm, a width of less than about 200 mm, and a height of less than about 100 mm. An electrical interconnection system for pyrotechnic displays comprising the electrical interconnection device is also described.Type: GrantFiled: December 3, 2015Date of Patent: June 11, 2019Inventor: Walter D. Barker
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Patent number: 10291177Abstract: An apparatus and system for mechanically coupling a power conditioning unit (PCU) to a photovoltaic (PV) module. In one embodiment, the apparatus comprises a base member, adapted for mounting a power conditioning unit (PCU) on a PV module backsheet, comprising a plurality of PCU retention members for retaining the PCU; and at least one compression spring, coupled to the base member, for maintaining the PCU in a position, with respect to the PV module backsheet, that can be dynamically changed between a first position and a second position.Type: GrantFiled: September 16, 2016Date of Patent: May 14, 2019Assignee: Enphase Energy, Inc.Inventor: Ryan Linderman
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Patent number: 10278265Abstract: An improved signal light unit for heat trace cables includes an energy storage device that stores energy during normal operation of the heat trace cable. During the normal operation, the light source of the signal light unit has a first illumination status. When there is a fault or other type of interruption in the electrical power in the heat trace cable, the energy storage device can discharge to power the light source. The light source can be illuminated in a different manner when it is powered by the energy storage device than during normal operation. Keeping the light energized in this manner when there is a fault in the heat trace cable and, moreover, making the light illuminate differently when there is a fault compared to normal operation, will facilitate inspection of the facility in which the heat trace cable is installed.Type: GrantFiled: August 29, 2016Date of Patent: April 30, 2019Assignee: Chromalox, Inc.Inventor: Adam Heiligenstein
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Patent number: 10259407Abstract: A vehicular power control system for supplying electric power from a power source of a vehicle to respective ones of a plurality of loads or electronic control units is provided. The vehicular power control system includes a power distribution unit, a customized information storing unit and a power control unit. The power distribution unit receives the electric power and distributes the electric power to a plurality of systems. The customized information storing unit stores customized information in which operation specifications of the plurality of loads or electronic control units are determined. The power control unit controls distribution of electric power to the respective ones of the plurality of loads or electronic control units by the power distribution unit, on the basis of the operation specifications determined in the customized information.Type: GrantFiled: August 25, 2015Date of Patent: April 16, 2019Assignee: YAZAKI CORPORATIONInventors: Katsuyuki Iwasaki, Hideaki Masui
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Patent number: 10251308Abstract: A device used for cooling a component including a support to receive a component to be cooled, is provided. The support includes a fluid network in which a liquid will circulate. The network includes a first cavity, a second cavity, and a first channel connecting the first cavity to the second cavity, a first deformable membrane and a second deformable membrane forming a mobile wall of the first cavity and a mobile wall of the second cavity respectively. The device further an actuation device for actuating the first membrane and the second membrane, the actuating device including a fixed electrode located on one or several protuberances of the support.Type: GrantFiled: October 14, 2015Date of Patent: April 2, 2019Assignee: Commissariat à l'énergie atomique et aux énergies alternativesInventor: Xavier Baillin
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Patent number: 10237991Abstract: An electronic component is provided with a housing, a conductive terminal loaded on the housing, and an external conductive member loaded on the housing. A gap between the external conductive member and the conductive terminal is defined by a protrusion formed on the housing or the external conductive member.Type: GrantFiled: November 2, 2017Date of Patent: March 19, 2019Assignee: Molex, LLCInventors: Nobuyuki Kondo, Toshihiro Niitsu
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Patent number: 10199781Abstract: A Retractable Electrical Trailer Connection System comprising a retractable reel assembly removably mounted to a trailer; an electrical cable, further comprising a first end and a second end; an electrical connector electrically coupled to the electrical cable second end; a guide aperture extending outwardly from the retractable reel assembly, and a stop mechanism removably attached to the electrical cable between the guide aperture and the electrical connector. The electrical cable first end is electrically coupled to the trailer and is wound about a center spool of the retractable reel assembly where the electrical cable second end extends outwardly through the guide aperture. The electrical connector is configured to electrically couple the electrical cable to a standard receptacle located on a rear side of a tow vehicle. The stop mechanism is preferably structured to move along the electrical cable and lock into place.Type: GrantFiled: January 3, 2018Date of Patent: February 5, 2019Inventor: Broox Deatherage
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Patent number: 10170391Abstract: A backside initiated uniform heat sink loading system includes a system board assembly, a heat sink assembly, a loading plate, and a fastener. The system board assembly includes at least one processing unit. The heat sink assembly is mounted upon the processing unit from a topside of the system board assembly and includes a plurality of tension members that extend through the system board assembly. The loading plate is mounted to the plurality of tension members from a backside of the system board assembly. The fastener engages with the loading plate from the backside and forces the loading plate away from the system board assembly. As a result, the tension members uniformly force the heat sink assembly upon the processing unit to seat the processing unit with the system board assembly and to thermally contact the heat sink assembly with the processing unit.Type: GrantFiled: May 9, 2014Date of Patent: January 1, 2019Assignee: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.Inventors: Scott W. Dickover, Brian M. Kerrigan, Timothy A. Meserth