Abstract: A backside initiated uniform heat sink loading system includes a system board assembly, a heat sink assembly, a loading plate, and a fastener. The system board assembly includes at least one processing unit. The heat sink assembly is mounted upon the processing unit from a topside of the system board assembly and includes a plurality of tension members that extend through the system board assembly. The loading plate is mounted to the plurality of tension members from a backside of the system board assembly. The fastener engages with the loading plate from the backside and forces the loading plate away from the system board assembly. As a result, the tension members uniformly force the heat sink assembly upon the processing unit to seat the processing unit with the system board assembly and to thermally contact the heat sink assembly with the processing unit.

Abstract: Packaging devices and methods for semiconductor devices are disclosed. In some embodiments, a packaging device for a semiconductor device includes a packaging substrate including a semiconductor device mounting region. The packaging device includes a stress isolation structure (SIS) disposed on the packaging substrate proximate a portion of a perimeter of the semiconductor device mounting region.

Abstract: An FPC of a capacitive touchscreen and a method for mounting the FPC. The FPC comprises a sensing circuit and a driving circuit which respectively matches with a sensing circuit layer and a driving circuit layer of a capacitive touchscreen panel and have several contacts for matching the sensing circuit layer and the driving circuit layer for corresponding connection; an IC driving chip, disposed between the sensing circuit and the driving circuit. The sensing circuit and the driving circuit are disposed in parallel or on the same line. The sensing circuit or the driving circuit is provided with a bending area, and the sensing circuit or the driving circuit is able to be turned towards the driving circuit or the sensing circuit, so as to allow the sensing circuit to match the sensing circuit layer and allow the driving circuit to match the driving circuit layer.

Abstract: An electronic assembly group comprising a printed circuit board structure in a multilayer configuration that has at least two electrically conductive layers. The electronic assembly group also comprises an additional passive component that is connected to the two electrically conductive layers, each of which has at least one segment that extends beyond the multilayer structure to form connection regions, the passive component making contact directly at the connection regions.

Abstract: Apparatus for connecting a motor controller to an electrical motor, said apparatus comprising: a motor interface board; a mounting mechanism for mechanically connecting said motor interface board to the electrical motor; at least one input lead for electrically connecting said motor interface board to at least one of an electrical power source and an electrical signal source; at least one output lead for electrically connecting said motor interface board to the electrical motor; and at least one connector for mechanically and electrically connecting said motor interface board to the motor controller.

Abstract: Methods, apparatuses, and systems are disclosed for multi-station sensor strings. One example apparatus includes a sensor string. The sensor string includes a connector and a common data transmission channel configured to be in communication with a data acquisition unit through the connector. The sensor string also includes a first seismic sensor configured to provide sensed seismic data to the common data transmission channel, and a second seismic sensor also configured to provide sensed seismic data to the common data transmission channel.

Abstract: Methods of fabricating a semiconductor device package may involve providing a fan out wafer including semiconductor-device-package locations at a base level. Laterally offset semiconductor dice may be stacked at least some semiconductor-device-package locations of the fan out wafer to expose bond pads at a lateral periphery of each of the laterally offset semiconductor dice. The laterally offset semiconductor dice may be electrically connected to one another and associated electrically conductive traces of the at least some semiconductor-device-package locations. The semiconductor-device-package locations having stacks of semiconductor dice thereon may be singulated from the fan out wafer.

Abstract: A stretchable circuit board includes plural stretchable bases, and plural stretchable wiring portions, at least one of which is provided on each of main surfaces, facing each other, of the plural stretchable bases, in which the stretchable wiring portions provided on the main surfaces are electrically continuous with each other through a connecting portion.

Abstract: A method and apparatus for heat-dissipation in an avionics chassis can include a housing having an outer surface, defining an exterior of the housing, an inner surface, defining an interior of the housing, and a set of walls at least partially separating the exterior of the housing from the interior of the housing, a heat generating component located within the interior of the housing, and a thermal plane thermally coupled to the heat generating component and configured to direct heat away from the heat generating component.

Abstract: A chip attach frame is used to align pins of an integrated circuit chip with pads on a chip carrier. A frame block has a socket defining two alignment edges that form a reference corner. The chip is lowered into the socket, and the chip carrier is inclined while it supports the frame block and chip until the chip moves under force of gravity to the reference corner. Once located at the reference corner, the chip position is carefully adjusted by moving the frame block in the x- and y-directions until the pins are aligned with the pads. The frame block is spring biased against movement in the x- and y-directions, and the position of the frame block is adjusted using thumbscrews. A plunger mechanism can be used to secure the integrated circuit chip in forcible engagement with the chip carrier once the pins are aligned with the pads.

Abstract: A Dummy LRU installed on a LRU tray in an equipment tray, the Dummy LRU including a base plate with ventilation openings and a wedge biased against the LRU tray or a connector associated with the LRU tray by hold-down fasteners of the LRU tray, a support member, and may include a seal element disposed on the support member to seal a electrical connector adjacent the LRU tray.

Abstract: A cable connector is provided which includes an insulating body including a frame which defines a region therein; a plurality of electrical terminals fixed to the insulating body and extended into the region; and a plurality of cables electrically connected to the electrical terminals respectively in the region. The region is filled with an insulator to embed the electrical terminals and the cables. The cable connector has a relatively high reliability.

Abstract: A magnetic assembly packaging process is described. The magnetic assembly packaging process comprises the steps of setting a first substrate and a second substrate in a jig; performing electrical connection of the magnetic component to the first substrate and the second substrate; overlaying the enclosure over the first substrate and the second substrate; overturning the preformed magnetic assembly; and injecting an insulation paste layer between the first substrate and the second substrate. Accordingly, the magnetic assembly packaging process can effectively minimize the manufacturing cost and the volume of the magnetic element through reducing the overall volume of the substrate.

Abstract: Disclosed is an electronic component case which includes a case body in which a rotationally engaging boss and a rotation prevention protrusion are disposed; and a bracket having a bracket body and an engaging portion formed at an end portion of the bracket body, wherein the engaging portion includes a rotationally engaging hole aligned with the rotationally engaging boss and a rotation prevention portion formed to be spaced apart from the rotationally engaging hole to form a contacting surface that is caught by the rotation prevention protrusion, and provides an advantageous effect of preventing the bracket from rotating in a process of tightening a screw to the bracket.

Abstract: Embodiments include a protective cover for a control module mounted to a vehicle surface using attachment mechanisms that extend perpendicularly from the vehicle surface. The protective cover comprises a rigid top portion having a top surface and four sidewalls configured to cover the control module and engage the vehicle surface. The protective cover also comprises a plurality of insets molded into at least two of the sidewalls, each inset configured to receive a respective attachment mechanism. Embodiments also include an apparatus for protecting a control module mounted to a vehicular surface using a plurality of attachment mechanisms. The apparatus comprises a rigid top structure configured to completely cover the control module and a flexible gasket coupled to a bottom edge of the top structure and configured to removably engage the vehicular surface surrounding the control module in a fluid-tight seal.

Abstract: An anti-seismic apparatus for control element drive mechanisms of a nuclear reactor includes: an anti-seismic support plate including a plurality of insertion holes in which the control element drive mechanisms are respectively inserted; and bushings inserted between outer surfaces of the control element drive mechanisms and inner surfaces of the insertion holes. The support plate includes an upper support plate comprising a plurality of first insertion holes, a lower support plate comprising a plurality of second insertion holes at positions corresponding to the first insertion holes, and a connection part connecting the upper support plate and the lower support plate. The connection part includes a support beam vertically extending from an end portion of the lower support plate, an inner flange extending inward from an upper end portion of the support beam, and an outer flange extending outward from the upper end portion of the support beam.

Abstract: A three-phase current sensor for measuring currents running in three conductors of a three-phase conductor system includes at least a first magnetic measuring device. The magnetic measuring device includes a magnetic circuit provided with at least two gaps and a magnetic field sensor arranged in each gap of the magnetic circuit. The magnetic field sensors are positioned on both sides of a cavity sized to receive one of the three conductors. The gaps and thus the magnetic field sensors are positioned such that stray magnetic flux from an adjacent conductor has substantially equal amplitude passing through each of the sensors.

Abstract: Board-to-board connectors that may provide durable and reliable connections, may save board space, and may be easy to manufacture. One example may provide board-to-board connectors that provide durable connections by providing a seal between board-to-board plugs and receptacles. The seal may be an O-ring, gasket, or other seal. The seal may protect contacts on the board-to-board connectors from exposure to fluids, such as water or other corrosive fluids. This seal may provide a level of redundancy with one or more seals protecting a device from external fluids, such as a seal at or in the device enclosure.

Abstract: Provided is a piezoelectric device capable of improving measurement precision of a temperature of a piezoelectric element. A piezoelectric device (1) includes a package (2) including a housing member (4) having a thermistor substrate (3) and a frame (7) provided to project from a first main surface (3a) of the thermistor substrate (3) and in which a housing part (6) is formed by the first main surface (3a) and the frame (7) and a lid (9) provided on the frame (7) to cover a space (5) of the housing part (6), and a piezoelectric vibration element (5) provided on the first main surface (3a) of the thermistor substrate (3) in the housing part (6), wherein the thermistor substrate (3) is a multilayer negative temperature coefficient (NTC) thermistor.

Abstract: A chip attach frame is used to align pins of an integrated circuit chip with pads on a chip carrier. A frame block has a socket defining two alignment edges that form a reference corner. The chip is lowered into the socket, and the chip carrier is inclined while it supports the frame block and chip until the chip moves under force of gravity to the reference corner. Once located at the reference corner, the chip position is carefully adjusted by moving the frame block in the x- and y-directions until the pins are aligned with the pads. The frame block is spring biased against movement in the x- and y-directions, and the position of the frame block is adjusted using thumbscrews. A plunger mechanism can be used to secure the integrated circuit chip in forcible engagement with the chip carrier once the pins are aligned with the pads.

Abstract: Methods of making semiconductor device packages may involve providing a fan out wafer including semiconductor-device-package locations. Each semiconductor-device-package location may include at least two mutually spaced semiconductor dice and a dielectric material laterally surrounding each of the dice and extending between adjacent semiconductor-device-package locations. Electrically conductive traces may extend over active surfaces of the dice and laterally beyond peripheries of the dice over the dielectric material to locations of electrically conductive vias extending from the electrically conductive traces through the dielectric molding material. Semiconductor dice may be stacked on a side of at least some semiconductor-device-package locations of the fan out wafer opposite the electrically conductive traces. The stacks of semiconductor dice may be electrically connected to electrically conductive vias of the at least some semiconductor-device-package locations.

Abstract: A connector includes: a connecting member including a plurality of tab sections and made of a conductive metal material; and a housing which is made of resin and in which the connecting member is insert-molded. Terminals of a counterpart connector are connectable to the tab sections by a connection of the counterpart connector. A part of the connecting member is used as a connection member holding section gripped by a mold. The connection member holding section is exposed to an outside at an opening section formed in the housing.

Abstract: A conductive elastic member is formed by having a columnar member having elasticity, and plural wire rods which extend from one end face to the other end face of the columnar member in an axial direction and are formed in a state inclined with respect to the axial direction and have conductivity. At least a part of the plural wire rods are cabled in a direction of intersection mutually.

Abstract: A liquid-tight and concrete-tight electrical fitting for securing PVC jacketed metal clad (PVC-MC) electrical cable to an electrical box or panel. The electrical fitting includes a tubular fitting body having a threaded inbound and outbound end, an MC ring, a grommet, a bushing, a sealing ring, a locknut, and a gland nut. The grommet includes an inbound end with a conical outer surface and an outbound end with a flat abutment surface. A conical inner surface is provided on the bushing for engaging the conical outer surface of the grommet. The MC ring is a continuous ring including an inbound end, an outbound end, a ring portion, and one or more fingers extending from the ring portion. The fitting facilitates liquid-tight and concrete-tight connection and proper electrical grounding of PVC-MC cable to an electrical box or panel.

Abstract: A magnetic field sensor has a reference magnetic field channel and an external magnetic field channel. The magnetic field sensor uses phase discrimination to isolate a reference-magnetic-field signal component from an external magnetic field signal component in the two channels.

Abstract: A stacked electronic package includes a substrate and conductive straps each having sides, a top, and a bottom opposite the top. Each conductive strap is coupled along the bottom to an upper surface of the substrate and is separate from others of the conductive straps. A length of at least one of the sides is greater than a width of at least another one of the sides. An encapsulant extends over the upper surface and side surfaces of the substrate and the sides of the conductive straps. A passive electronic component is disposed over the conductive straps, and each conductive strap is coupled along the top to a terminal of the passive electronic component.

Abstract: A hermetically sealed module which comprises a central core housing including a perimeter side wall and a central core with opposed primary and secondary support surfaces. At least one coupling passageway is formed within the central core adjacent the perimeter side wall. The side wall has an sealed internal/external electrical connector which facilitates communication with the module. A multilayer substrate, with at least one flexible coupling tab, is supported by the primary support surface and at least one surface mounted component is supported by the secondary support surface. The flexible coupling tab passes through the at least one coupling passageway to facilitate coupling of a plurality of components of the multilayer substrate with a plurality of components of the at least one surface mounted component via a SMT connector. Primary and secondary lids are secured to opposed sides of the perimeter side wall and forming the hermetically sealed module.

Abstract: A method and a system for a mounting device are provided. The mounting device includes at least two shells, each shell having an inner surface and an outer surface wherein the outer surface includes a first banding zone, a second banding zone, and a clamping zone extending between the first banding zone and the second banding zone and a pair of shoulders bounding each of the first banding zone and second banding zone. The mounting device also includes an intermediary material circumscribing the wire bundle including at least one of a substantially non-porous material, a vulcanizing tape, and a silicone material. The mounting device further includes at least one fastener configured to engage the first banding zone or second banding zone to couple the first shell and the second shell to the wire bundle and the intermediary material.

Abstract: A frame is secured to a first circuit board by provisions and respective fasteners to form a first circuit board assembly. A second circuit board has a second connector portion for mating with the first connector portion of the first circuit board. A holder overlies the second circuit board. The holder has a recess with an opening for the second connector portion to extend through. A clearance gap between the interior perimeter of the recess and the outer perimeter of the circuit board assembly allows alignment or registration of the first connector portion and the second connector portion. A lid is connected to the holder via one or more fasteners to secure the first circuit board assembly with respect to the second circuit board.

Abstract: A memory module includes a signal tab and a power tab spaced apart from each other on a surface layer of a substrate, the signal tab and the power tab defining a module tab area, a reference plane layer below the surface layer, the reference plane layer being recessed below the signal tab and being non-recessed below the power tab, and an insulating layer between the surface layer and the reference plane layer.

Abstract: A frame member includes a first portion, a second portion, and a third portion located between the first portion and the second portion, and wherein the lengths of the first portion and the second portion in a circumferential direction are longer than the length of the third portion in the circumferential direction, and a Young's modulus of the third portion is lower than the Young's moduli of the first portion and the second portion.

Abstract: A method for producing a multi-pole cable connection includes disposing a plurality of contact elements in respective openings of a carrier element. A free end of each contact element protrudes from the respective openings and projects from a surface of the carrier element. The method also includes applying a flat sealing element to the carrier element so as to guide the sealing element over the free ends of the contact elements projecting from the surface of the carrier element, pressing the scaling element onto the surface of the carrier element. The method includes forming a contact of a plurality of conductors of a cable and the contact elements. The conductors are clamped onto the contact elements. The method also includes coating the contact with a potting material to form a component composite.

Abstract: A voltage controller has an electrically insulating supporting structure provided with a plurality of electrical connecting terminals. At least one of the terminals has a flexible blade of elongate shape which protrudes inside the structure where a distal end portion of the blade is connected to a circuit housed therein. The supporting structure has a protective formation with at least one strip which has a shape corresponding to that of the blade and which extends in superimposition on this blade.

Abstract: A refrigerator includes a storage chamber having an opening; a drawer type door to open or close the opening; a display positioned at the drawer type door; a first connector provided at a sidewall of the storage chamber; a second connector provided at the drawer type door and being electrically connected to the display; a first frame coupled to an inner wall of the storage chamber, the first frame to cover the first connector; a second frame coupled to the drawer type door, the second frame to support a storage box; and a wire electrically connected between the first connector and the second connector. The first frame has a first accommodating part to accommodate one portion of the wire and the second frame has a second accommodating part to accommodate another portion of the wire.

Abstract: A connection structure of an electronic component and terminal metal fittings includes a relay including a relay body and a plurality of terminals, terminal metal fittings mating with the terminals, and a holding member. The terminals have end portions facing side surfaces of the relay body, and their leading ends are positioned closer to a top surface side than a bottom surface of the relay body. At a side surface, a first terminal and a second terminal that is more rigid than the first terminal are disposed. The holding member includes a component body accommodating portion, a first terminal accommodating portion, and a second terminal accommodating portion. A gap dimension between the first terminal and an insertion slot of the first terminal accommodating portion is larger than a gap dimension between the second terminal and an insertion slot of the second terminal accommodating portion.

Abstract: A draining member protrudes from both openings of a through-hole in a vehicle control device. It has a pair of spaced elastic members extending from a connection. The connection has a width smaller than a width of the through-hole. The width between the elastic members varies from the connection toward their ends, reaching a narrow portion smaller than the width of the through-hole via an increased width portion greater than the width of the through-hole. A leg portion beyond the narrow portion has a width greater than the width of the through-hole. A minimum distance between a location where the width between the increased width portion and the narrow portion matches the width of the through-hole, and another location where the width of the leg portion is equal to or greater than the width of the through-hole, is equal to or greater than a thickness of the housing.

Abstract: An electrical system includes an electrical module including a conductive plate, a casing having a bottom face mounted on a top face of the conductive plate while leaving at least a part of the top face revealed, a shielding including a body intended to at least partly cover the casing, and an electronic circuit board for controlling the components of the casing, intended to cover the shielding in order for the shielding to protect the electronic circuit board from the electromagnetic radiations emitted by the electrical components of the casing in their operation. The shielding further includes at least one tab made of a piece with the body of the shielding and extending downwards so as to come into contact with a respective revealed part.

Abstract: A recorder for a vehicle comprises a crash survivable memory unit, which includes a first antenna assembly including a first resonant element configured for near field data communications and to receive near field power transmissions, and a crash protected memory assembly that operatively communicates with the first antenna assembly. One or more protective layers surround the first antenna assembly and the memory assembly. A second antenna assembly is external to the crash survivable memory unit. The second antenna assembly includes a second resonant element, which is configured for near field data communications with the first resonant element and for near field power transmissions to the first resonant element. The second antenna assembly is adapted to receive information related to vehicle operations and to configure the information for wireless transmission to the first antenna assembly for recording in the memory assembly.

Abstract: A connector having a pin guide and method are disclosed. The connector includes a housing, terminals and a pin guide. The terminals include securing sections and substrate mating ends. The securing sections are positioned to maintain the terminals in the terminal receiving recesses. The substrate mating ends extend from the housing. The pin guide is removably attached to the housing, the pin guide having terminal receiving cavities for receiving the substrate mating ends of the terminals therein. The method of assembly and installing a connector includes: inserting terminals into housing; bending a portion of the terminals which extend outward from the housing; and positioning a pin guide over the bent ends of the terminals, whereby the bent ends are retained in cavities of the pin guide.

Abstract: A power receptacle assembly includes a first housing, a second housing, one or more receptacle units, one or more functional receptacles, and a decorative bordered frame. Two or more through holes are disposed at lower portions of two opposing sides of the first housing to admit a hook portion formed by extending downward two outer sides of the second housing engaged with the one or more receptacle units and admit a hook portion formed by extending downward two outer sides of the one or more functional receptacle. Not only does the power receptacle feature a flexible combination of a conventional receptacle unit and a functional receptacle in operation to meet user needs and application needs, but the assembly process also features simple engagement and precise positioning.

Abstract: A right angle conduit fitting for right angle wiring through a wall includes an offset split along a transverse axis defined by the edges of male and female body portions mated together. The offset split provides the male body portion and the female body portion independent rotation from each other and from internal wiring thus allowing the wiring to be disturbed as the male body portion and female body portion may be threaded onto respective conduits and into mating alignment with each other.

Abstract: A device housing package includes a substrate in a form of a rectangle, having a mounting region of a device at an upper surface thereof; a frame body disposed on the substrate so as to extend along an outer periphery of the mounting region, the frame body having a cutout formed at a part thereof; and an input-output terminal disposed in the cutout. The input-output terminal includes a first insulating layer, a second insulating layer overlaid on the first insulating layer, and a third insulating layer overlaid on the second insulating layer. First terminals set at a predetermined potential are disposed on an upper surface of the first insulating layer. Second terminals set at a predetermined potential are disposed on a lower surface of the first insulating layer. Third terminals through which AC signals flow are disposed on an upper surface of the second insulating layer.

Abstract: A liquid adhesive sealant for bonding a connector case and a terminal holder is filled in a sealant filled chamber formed in a space surrounded by a first fitting peripheral wall and a bottom surface of a first groove of the connector case made of a primary molding resin, and a second fitting peripheral wall and a bottom surface of a second groove of the terminal holder made of the primary molding resin in an electrical connector.

Abstract: In various embodiments, a smart card module is provided. The smart card module includes a carrier having a first main surface and a second main surface opposite the first main surface. The carrier has at least one plated-through hole. The smart card module further includes a contact array arranged above the first main surface of the carrier and having a plurality of electrical contacts. At least one electrical contact of the plurality of electrical contacts is electrically connected to the plated-through hole. The smart card module further includes a chip arranged above the second main surface. The chip is electrically coupled to at least one electrical contact of the plurality of electrical contacts by the plated-through hole. The smart card module further includes at least one optoelectronic component arranged above the second main surface and electrically conductively connected to the chip.

Abstract: Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.

Abstract: An electronic unit of a fluid sensor or fluid valve has a substantially cylindrical housing with a longitudinal axis and an open end face, which can be closed by a lid, several spacers formed as separate parts, which can be introduced into the housing in direction of the longitudinal axis and are directly stacked on top of each other. At least one spacer at least one electronic component is attached, which together with the spacer forms a premounted unit to be introduced into the housing.

Abstract: In one embodiment, a method of fabricating a semiconductor package includes forming a first plurality of die openings on a laminate substrate. The laminate substrate has a front side and an opposite back side. A plurality of first dies is placed within the first plurality of die openings. An integrated spacer is formed around each die of the plurality of first dies. The integrated spacer is disposed in gaps between the laminate substrate and an outer sidewall of each die of the plurality of first dies. The integrated spacer holds the die within the laminate substrate by partially extending over a portion of a top surface of each die of the plurality of first dies. Front side contacts are formed over the front side of the laminate substrate.

Abstract: A circuit board system includes a circuit board (101), at least one electrical component (102), and a conductor part (103) in heat conducting relation with the electrical component. A surface of the circuit board includes a portion (104) that is uneven so as to increase the surface area of the portion. The portion is coated with a coating (105) made of conductor material so that a surface of the coating is uneven. The circuit board includes a heat conductive pathway (106) made of conductor material and extending from the conductor part to the coating. Thus, the coating operates as a cooling element for cooling the electrical component.

Abstract: A server case assembly includes a fixed component assembly further having a first connection component, a second connection component, and a penetration component. The first connection component has a first communication space, and includes a first withstanding portion and a first convex portion. The first withstanding to portion withstands an inner sidewall of a case body. The first convex portion is connected to the first withstanding portion, and passes through a sidewall of the case body. The second connection component has a second communication space, and includes a second withstanding portion and a second convex portion. The second withstanding portion withstands a handle, and is connected to the second convex portion. The second convex portion passes through the first communication space. The penetration component passes through the first and second communication spaces to fix the first and second connection components so as to fix the handle on the case body.

Abstract: An optical module has at least two optical elements mounted in parallel with each other. The module also has a first electrode pad which is formed between the paralleled optical elements and grounded to a ground potential and a second electrode pad which is arranged along a line that is intersected with a direction in which the optical elements are arranged, which faces the first electrode pad and is grounded to the ground potential. The module further has a conductive shield member which is connected to the first electrode pad and the second electrode pad and placed between electrical signal transmission paths each connected to the optical elements.