Abstract: A mounting clip for attaching a vehicle body to a frame using a tool includes a generally J-shaped body having a frame attaching portion configured to be attached to the vehicle body, and a hook portion extending from the frame attaching portion and configured to engage the frame. At least one fastener hole is disposed on the frame attaching portion. A positioning formation is disposed on the frame attaching portion, where the positioning formation is configured to receive a tool.

Abstract: A printed circuit board includes a board body having a routing-limited area. The routing-limited area is provided with at least one solder pad that is adapted for supporting a metal support thereon. Preferably, the printed circuit board further includes a protrusion block disposed on the solder pad, and having a height greater than that of a signal trace that passes the routing-limited area.

Abstract: An electric sub-assembly has an integrated circuit, which contains at least one power semi-conductor component and additional electronic components, the latter being interconnected and linked to connections by the conductors of a lead frame (1, 2, 3). The lead frame (1, 2, 3) has at least one cooling surface (3), which is connected in a thermally conductive manner to a thermal contact (4) of the integrated circuit or circuits. The cooling surface has a greater surface area than the thermal contact surface (4) of the integrated circuit or circuits and is wider than the parts (1) of the lead frame that are used as electric conductors.

Abstract: A light-emitting diode packaging structure, a packaging module and the assembling method thereof are disclosed. The assembling method comprises the steps of: providing a light-emitting diode, wherein the light-emitting diode has two electrode leads; providing two metal plates, wherein each of the metal plates has at least a clamping portion; holding the electrode leads against the metal plates respectively; and bending the clamping portion of each of the metal plates to fix the electrode leads on the metal plates. Further, a plurality of light-emitting diodes are allowed to be mounted on the metal plates to form the light-emitting diode packaging module.

Abstract: An integrated circuit includes a positive lead defining a first pocket and a negative lead spaced apart from the positive lead that defines a second pocket that is aligned with the first pocket. The first and second pockets are adapted to receive and hold an electrical device such as a capacitor therein.

Abstract: The present application discloses a casing and a corresponding mounting device, for protecting pins of an element from melting during a process flow in which the element is soldered on a circuit board, while saving an area required for soldering the element on the circuit board. The casing comprises a hollow body provided with at least one opening.

Abstract: An electrode assembly includes an electrode electrically connected to a capacitor with a wire. An assembly carrier may be used to hold and secure at least the wire and capacitor during assembly. A method of assembly for attaching a wire to a capacitor and an electrode may include an assembly carrier for housing and securing the wire, capacitor, and electrode during assembly.