Abstract: A surface-mounted integrated circuit (IC) package is disclosed that has unwanted flux removed from surface-mounted IC. A bottom termination component (BTC) includes lands and a thermal pad. The lands provide an electrical connection from the BTC and the thermal pad provides heat transfer from the BTC. The thermal pad includes vias that are configured to remove flux generated from solder applied to the surface-mounted IC as the surface-mounted IC is assembled. A printed circuit board (PCB) is mourned to the BTC and is electrically connected to the BTC via the lands and receives heat transfer from the BTC via the thermal pad and includes a reservoir. The reservoir is configured to pull flux positioned between the lands into the reservoir as the flux is generated from the solder applied to the surface-mounted IC as the BTC is mounted to the PCB and as the surface-mounted IC is assembled.

Abstract: An electronic component includes: a substrate; a device chip, in which a functional element is located on a lower surface thereof, that is mounted on an upper surface of the substrate so that the functional element and the upper surface of the substrate are opposite to each other via an air gap; a ring-shaped metal layer that is located on the upper surface of the substrate, surrounds the device chip in a plan view, and has a protruding part located along an outer periphery thereof, an outer side surface of the ring-shaped metal layer being higher than an inner side surface thereof; a metal sealer that surrounds the device chip in the plan view, and is bonded on an upper surface of the ring-shaped metal layer; and a metal film that is located on side surfaces of the metal sealer and the ring-shaped metal layer.

Abstract: A case of a semiconductor device has sidewall portions which surround sides of a metal substrate along the sides and a coating portion which covers the front surface of the metal substrate surrounded by the sidewall portions and which has through ring holes corresponding to fixing holes. Protrusions are formed on inner surfaces of the sidewall portions opposed to one another in plan view with the ring holes therebetween. The metal substrate is inserted in this way into an area surrounded by the sidewall portions of the case and is reliably fixed. Furthermore, alignment is performed with accuracy between each fixing hole of the metal substrate inserted in this way and its corresponding ring hole of the case.

Abstract: A housing 10 comprises connector-side transmission-permitting portions 10A that permit the transmission of wave signals in the connector-height direction, a circuit board B comprises board-side transmission-permitting portions B1 that permit the transmission of wave signals in the connector-height direction at locations corresponding to the above-mentioned connector-side transmission-permitting portions 10A when the electrical connector 1 is mounted, and, when a counterpart connector component C is inserted all the way to a normal position, the transmission of wave signals permitted in the process of insertion of the above-mentioned counterpart connector component C becomes blocked by the above-mentioned counterpart connector component C, or alternatively, the transmission of wave signals blocked by the above-mentioned counterpart connector component C in the process of insertion of said counterpart connector component C becomes permissible at the locations of the above-mentioned connector-side transmission-p

Abstract: An inspection circuit for inspecting a connection state between a semiconductor storage element including a storage section, and a semiconductor element connected to the semiconductor storage element, the inspection circuit includes: an input terminal that is input with a test signal to be sent to a first controller; an input/output terminal that is input and output with data to be written to or read from the storage section; a first inspection section that is input with an inspection signal; a second inspection section, disposed between the input terminal and the first controller, that converts the test signal to a control signal at a predetermined logic level under control of the first inspection section; and a third inspection section, disposed between the input/output terminal and a second controller, that sends the test signal to the second controller under control of the first inspection section.

Abstract: The disclosure relates to a sensor module for a modular plug connector, wherein the sensor module comprises a core segment and at least two outer segments arranged around the latter, wherein the segments enclose a cavity with one another when assembled. In the cavity, conductor tracks are fitted, preferably with the aid of MID technology, wherein all the conductor tracks in the connected state together form the shape of an annular coil. In a sensor circuit, the annular coil can measure the current flow of a contact element in accordance with the Rogowski principle, which contact element is likewise integrated in the sensor module.

Abstract: Embodiments relate generally to systems and methods for retaining a sensor package within a carrier. A sensor package assembly may comprise a sensor package comprising at least one sensor element located within a sensing face of the sensor package; and a carrier comprising retention features configured to retain the sensor package while completely exposing the sensing face of the sensor package. A method for retaining a sensor package within a carrier may comprise inserting a sensor package into a carrier, wherein inserting the sensor package displaces one or more retaining clips of the carrier; retaining the sensor package within the carrier via the retaining clips interfacing with one or more notches of the sensor package; and exposing a sensing face of the sensor package via an opening in the carrier, wherein the sensor package comprises one or more sensor elements located in the sensing face of the sensor package.

Abstract: An electrical enclosure for a lighting fixture. The enclosure includes an access door with a closure element that latches closed on or against the enclosure without a tool but requires a tool for unlatching the closure element to open the access door. The closure element includes a bias member or spring that is depressed and/or released by the tool.

Abstract: A downhole sensor tool includes a sensor outsert coupled into an exterior pocket of the tool body. The sensor outsert is a pressure vessel with an exterior electrical connector coupled to the interior sensor. The sensor outsert contains a sensor, and is pressure-sealed about the sensor. The outsert includes an electrical connector coupled to the sensor. The electrical connector maintains the pressure seal of the outsert. The electrical connector may be a hermetic connector. The electrical connector can be coupled to an electrical connector or a hermetic connector of the tool body while maintaining the sealing of the pressure vessel.

Abstract: An electronic device includes: an electronic component including an external connection terminal; and a lead frame (metal member) connected to the external connection terminal. The lead frame is disposed with a pad. The pad overlaps the external connection terminal in plan view, and at least a portion of the pad is located outside the external shape of the electronic component in plan view. The pad and the external connection terminal are connected by means of a conductive bonding member. The pad and the electronic component are bonded together with a resin. The resin extends to a region of the pad located outside the external shape of the electronic component in plan view.

Abstract: A cartridge heater assembly and method or assembly. The cartridge heater assembly includes a cartridge heater. A first electrical contact member is provided in electrical and mechanical engagement with the cartridge heater. The first electrical contact member has first mounting legs which are dimensioned to be press fit into first openings of a circuit board. A second electrical contact member is provided in electrical and mechanical engagement with the cartridge heater. The second electrical contact member has second mounting legs which are dimensioned to be press fit into second openings of the circuit board. An insulating member is provided between the first electrical contact member and the second electrical contact member.

Abstract: A power storage apparatus includes an electrode assembly and a case for accommodating the electrode assembly. The power storage apparatus has a covering member that is arranged between the case and the electrode assembly to cover at least part of the electrode assembly. The covering member has an extending portion that extends in the protruding direction of the electrode terminals from one of the edges of the electrode assembly that is opposed to the electrode terminals. The coefficient of friction between the covering member and the electrode assembly is greater than the coefficient of friction between the case and the covering member.

Abstract: A coupling element for providing external coupling to a semiconductor die within an integrated circuit package. The coupling element comprises a flexible laminate structure comprising a flexible, electrically insulating substrate layer, a first conductive layer bonded to a first surface of the substrate layer, and a second conductive layer bonded to a second surface of the substrate layer. The coupling element is arranged to be coupled to the semiconductor die such that the first and second conductive layers are electrically coupled to electrical contacts of the semiconductor die. The coupling element is further arranged to extend through the integrated circuit package when electrically coupled to the semiconductor die, and for the first and second conductive layers to be further electrically coupled to at least one external component.

Abstract: A microwave semiconductor device of an embodiment includes a package, a semiconductor amplifying element, an output matching circuit, and a smoothing circuit. The package includes a metal base plate, a frame body bonded to a surface of the metal base plate, an input feedthrough part, and an output feedthrough part. The semiconductor amplifying element has an output electrode. The output matching circuit includes an output matching capacitor, and a first bonding wire connected to the output matching capacitor and the output electrode. The smoothing circuit includes a smoothing capacitor, and a second bonding wire. The smoothing capacitor is connected by the second bonding wire to a position in the output matching circuit at which capacitive reactance component of a load impedance seen from the output matching capacitor is smaller than inductive reactance component of the load impedance seen from the output electrode of the semiconductor amplifying element.

Abstract: A system and method for placing an inductor on a circuit board. This method includes providing a circuit board, a pedestal, and an inductor, the pedestal has a top surface and a bottom surface and the circuit board has one or more electrical conductors, the inductor having a first inductor terminal and a second inductor terminal. Adhesive is placed on the circuit board and the bottom surface of the pedestal is placed on the adhesive located on the circuit board to secure the pedestal to the circuit board. Next, adhesive is placed on the top surface of the pedestal and the inductor is placed on the adhesive located on the top surface of the pedestal to secure the inductor to the pedestal. The inductor is electrically connected to the circuit board.

Abstract: A waterproof structure for an electronic component housing unit provided with a connection unit on the upper side in the vertical direction of a vehicle, to which the terminal of an electric wire is connected, includes a top cover. The top cover is provided with a bottom opening portion opening to the lower end and covers the electronic component housing unit from the upper side in the vertical direction of the vehicle while forming a space between the top side of the electronic component housing unit in the vertical direction of the vehicle and the top cover, in which the terminal of the electric wire connected to the connection unit is housed. The electric wire led out from the terminal connected to the connection unit is led out from the bottom opening portion of the top cover.

Abstract: Various implementations disclosed herein include arrangements that reduce parasitic inductance associated with a discrete decoupling capacitor by using a three-terminal capacitor and a staggered array of power supply and ground connections. In some implementations, a capacitive decoupling arrangement includes a substrate, an array of electrical vias of first and second types, and a capacitive arrangement on one side of the substrate coupled to the array of electrical vias. The array of electrical vias includes a first type of vias and a second type of vias. The capacitive arrangement is coupled between two respective vias of the first type of vias and two respective vias of the second type of vias on the first planar surface of the substrate. The capacitive arrangement includes a plurality of capacitive elements electrically arranged in parallel between the two respective vias of the first type of vias and the two respective vias of the second type of vias.

Abstract: A method for redundantly measuring a magnetic field for a sensor arrangement including a carrier having a first side and a second side, a first sensor disposed on a first semiconductor substrate on the first side of the carrier, and a second sensor disposed on a second semiconductor substrate on the second side of the carrier, the method including: sensing a component of a magnetic field perpendicular to the carrier with the first sensor and sensing the same component of the magnetic field perpendicular to the carrier with the second sensor.

Abstract: The subject disclosure relates improved common mode choke (CMC) and integrated connector module (ICM) designs for Ethernet applications. Some aspects provide an improved CMC component, including an upper chassis element having a first plurality of comb structures vertically protruding from an edge of the upper chassis element, and a lower chassis element comprising a second plurality of comb structures vertically protruding from an edge of the lower chassis element, the second plurality of comb structures configured to interlock with the first plurality of comb structures to form an enclosure when the upper chassis element is mechanically coupled with the lower chassis element.

Abstract: The present invention provides a semiconductor package structure, including: a chip, wherein bonding pads and a passivation layer are arranged on the surface of the chip, the passivation layer is provided with first openings for exposing the bonding pads, and a seed layer connected with the bonding pads and columnar salient points stacked on the seed layer are arranged on the bonding pads; lead frames, wherein each lead frame is provided with a plurality of discrete pins, and internal pins and external pins are respectively arranged on two opposite surfaces of the pins; the chip being flipped on the lead frames, and the columnar salient points being connected with the internal pins; a plastic package layer, wherein the plastic package layer is used for sealing the chip, the columnar salient points and the lead frames and exposing the external pins.

Abstract: An apparatus for cooling electronic devices to be used in the vacuum of space is described. a window frame is provided as packaging for an electronic device having a substrate and a chip. The window frame includes an opening to allow a heat pipe to be in direct contact with a backside of the chip. The window frame is hermetically sealed to the backside of the chip. The window frame is also welded to a kovar ring located on the backside of the chip to provide a hermetic seal between the window frame and the substrate.

Abstract: Provided is a semiconductor package in which a cell array region and a peripheral circuit region are formed as different semiconductor chips, respectively. First semiconductor chips including memory cells and a second semiconductor chip including only peripheral circuitry common to the first semiconductor chips are electrically connected to each other. Thus, a loading capacitance of the semiconductor package may be reduced. As a result, an RC delay of the semiconductor package may be reduced, thereby improving an operating speed of the semiconductor package.

Abstract: Provided is a semiconductor device including a package having a hollow portion, which can meet the need of reduction in size and thickness. The semiconductor device includes: a resin molded member (1) including a hollow portion (10) having an inner bottom surface on which a semiconductor chip (6) is mounted, a surrounding portion (1b) that surrounds the hollow portion (10), and a bottom surface portion (1a); an inner lead (2e, 2f); and an outer lead (2a, 2b) exposed from the resin molded member (1). The inner lead buried in the molded member (1) includes an L-shaped lead extending portion having a through hole formed therethrough.

Abstract: A semiconductor package having a metal frame includes a frame-shaped conductive member which has an opening portion, mounted on a substrate, and a semiconductor element disposed within the opening. A ring-shaped wiring pattern is provided on a portion of the substrate outwards from the opening portion of the conductive member. The electrostatic coupling capacity of the ring-shaped wiring pattern and the conductive member is not less than the electrostatic coupling capacity of a semiconductor metal wiring layer and the conductive member. The ring-shaped wiring pattern and the ground wiring of the semiconductor metal wiring layer are electrically connected.

Abstract: A press fit passive component, such as a resistor or capacitor, adapted to fit within, or partially within, a via of a printed circuit board. In one example, the press fit passive component has a cylindrically shaped body with solderable terminals at either end of the body, and a dielectric collar disposed at least partially about the cylindrically shaped body. The component is placed in the via and soldered in order to provide a mechanical and electrical connection to the printed circuit board.

Abstract: A lead frame package structure with low EMI includes at least a die holder each for supporting a die, and at least a lead frame each including a first terminal for connecting a printed circuit board, a second terminal for connecting the die, and a lead for connecting the first terminal and the second terminal, wherein the height of the lead is lower than the height of the first terminal and the second terminal.

Abstract: A connection box for a photovoltaic module is provided and includes a housing, a diode, and a pair of connection terminals. The pair of connection terminals are electrically connected to each other through the diode, and each of the pair of connection terminals includes a base, first connection portion, and a second connection portion. The base is mounted on the housing. The first connection portion includes a first end integrally connected with the base and a first connection region connectable with the diode. The second connection portion includes a connection end electrically connected with the base and having a second connection region connectable with a bus bar.

Abstract: When a housing of a waterproof main terminal is fixed onto the outside surface of a case with a screw, a through hole is sealed with a seal surface of a packing pressed onto the outside surface of the case. Furthermore, the elastic force of the packing placed so as to be in tight contact with the whole circumference of the terminal ensures high waterproofing performance between the terminal and the housing, so the one packing can perform waterproofing both between the case and the housing and between the terminal and the housing.

Abstract: A mobile device case includes a reel assembly, including a reel, a supporting plate, and a hub between the reel and the supporting plate. The hub includes a first cavity between the hub and the supporting plate for housing a spring, and a second cavity between the hub and the reel for housing a flat flexible cable (FFC). The spring is wound in a first direction, while the FFC is wound in a second direction. The FFC includes a first end for electrically coupling to a female jack connector of a device. A female connector is electrically coupled to a second end of the FFC for engaging a male jack connector of user-provided headphones. When the reel rotates in the first direction, the spring tightens and the FFC loosens. When the reel rotates in the second direction, the spring loosens and the FFC tightens.

Abstract: A terminal block cover includes a rectangular top portion with an inner surface, an outer surface and overall length; retention portions connected to the top portion; and a plurality of barriers extending from the inner surface. The cover has a barrier spacing length between each of the plurality of barriers, and the ratio of overall length to barrier spacing of at least 5.124:1. The terminal block cover can cover a terminal block with terminals.

Abstract: In some examples, a semiconductor package can be configured to electrically couple to a printed circuit board. The semiconductor package can include: (a) a lid having one or more first electrically conductive leads; (b) a base having a top, a bottom and one or more sides between the top and the bottom, the base having one or more second electrically conductive leads electrically coupled to the one or more first electrically conductive leads; (c) one or more first semiconductor devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads; and (d) one or more first micro-electrical-mechanical system devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads. The lid can be coupled to the base and at least one of the lid or the base has at least one port hole.

Abstract: A semiconductor device includes a substrate, a first pad that is formed above the substrate, a second pad that is formed above the substrate, an external terminal that is connected with the second pad, and a circuit that judges whether or not the first pad is connected with the external terminal, wherein a distance between the first pad and a side of the substrate opposed to the external terminal is different from a distance between the second pad and the side.

Abstract: Electrical assemblies including various complementary electrical components and plurality of cables are provided. Components of the electrical assemblies are configured such that respective signal conductor ends of the plurality of electrical cables can be isolated from one another and placed in electrical communication with the complementary electrical components using a conductive material. In accordance with some embodiments, the electrical assemblies include organizers that define respective pluralities of cavities and are configured to be attached to the complementary electrical components. In accordance with another embodiment, a leadframe assembly can define a plurality of cavities.

Abstract: In an electronic part housing box 1 which includes a capacitor 2 having lead wires 2b protruded from the capacitor main body 2a, a base member 10 having a part housing chamber 11 for housing the capacitor main body 2a, a part housing cover 20 attached to the base member 10 to thereby cover the opening of the part housing chamber 11, and a bracket 40 attached to the base member 10 to thereby fix the lead wires 2b, the base member 10 is integrally provided with a first spring portion 14 for biasing the capacitor main body 2a toward the opening side of the part housing chamber 11 and the part housing cover 20 is integrally provided with a second spring portion 21 for biasing the capacitor main body 2a toward the bottom surface side of the part housing chamber 11.

Abstract: A capacitor holder comprising a body part formed in a shape into which a tip end of a capacitor can be fitted; and a lead part which is fixed to the body part and can be soldered to a predetermined fitting location. The body part has an opening through which the tip end of the capacitor is exposed, and an end surface abutment portion which abuts a tip end surface of the capacitor in a vicinity of a pressure valve, when the tip end of the capacitor is fitted into the body part. The lead part is fixed to the body part at a position opposite to the capacitor with respect to a reference plane, which is a plane includes the tip end surface of the capacitor abutting the end surface abutment portion.

Abstract: A bracket and open back junction box assembly allows simplified wiring at a construction site. An open back junction box including a detachable and reattachable rear cover plate is pre-assembled with a plaster ring, electrical device, and leads, at a prefab facility. A Metal Clad (MC) cable may be attached to the open back junction box and wires carried in the MC Cable may be connected to the leads. A mounting bracket is generally sandwiched between the open back junction box and the plaster ring for mounting to framing members at the construction site. Following assembly at the prefab facility, the prefab open back junction box is shipped to the construction site where the bracket and open back junction box assembly is mounted to framing members. Connections to wires carried by MC Cables are then facilitated by removing the rear cover plate to access the open back junction box interior.

Abstract: An electric junction box having a casing and a circuit structure accommodated in the casing. The circuit structure includes a plurality of first bus bars arranged at intervals and synthetic resin members disposed between the adjacent first bus bars and firmly attached to the first bus bars. The synthetic resin members have heat conductivity higher than that of air. Since the heat generated from the first bus bars during electrical connecting can be transmitted to the synthetic resin members, the electric junction box can be prevented from being locally heated to a high temperature.

Abstract: An electric junction box having a casing and a circuit structure accommodated in the casing. The circuit structure includes a plurality of first bus bars arranged at intervals and synthetic resin members disposed between the adjacent first bus bars and firmly attached to the first bus bars. The synthetic resin members have heat conductivity higher than that of air. Since the heat generated from the first bus bars during electrical connecting can be transmitted to the synthetic resin members, the electric junction box can be prevented from being locally heated to a high temperature.

Abstract: A package enclosing at least one microelectronic element (60) such as a sensor die and having electrically conductive connection pads (31) for electric connection of the package to another device is manufactured by providing a sacrificial carrier; applying an electrically conductive pattern (30) to one side of the carrier; bending the carrier in order to create a shape of the carrier in which the carrier has an elevated portion and recessed portions; forming a body member (45) on the carrier at the side where the electrically conductive pattern (30) is present; removing the sacrificial carrier; and placing a microelectronic element (60) in a recess (47) which has been created in the body member (45) at the position where the elevated portion of the carrier has been, and connecting the microelectronic element (60) to the electrically conductive pattern (30). Furthermore, a hole (41) is arranged in the package for providing access to a sensitive surface of the microelectronic element (60).

Abstract: A semiconductor device includes a substrate, a first pad, a second pad, and a third pad that are placed along one side of a perimeter of the substrate, a circuit that is formed above the substrate, and that is coupled to the first pad, a first external terminal that is coupled to the second pad, and a second external terminal that is coupled to the third pad, wherein the circuit generates a signal indicative of a connection configuration between the first pad and the first external terminal, wherein the third pad is placed adjacent to one of the first pad and the second pad, wherein, in a direction parallel to the one side of the perimeter of the substrate, the first pad, the second pad and the third pad have a first width, a second width and a third width, respectively, and wherein each of the first width of the first pad and the second width of the second pad is smaller than the third width of the third pad.

Abstract: A Z-directed variable value component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained with the PCB.

Abstract: An electronic component storing package which generates a large quantity of heat during operation and an electronic apparatus storing such an electronic component are provided. In the electronic component storing package and the electronic apparatus, a heat dissipating member (1) is used which comprising at least five layers including first metal layers (11) having good thermal conductivity and second metal layers (12) having a smaller coefficient of thermal expansion and less thickness compared with the first metal layers (11), the first metal layers (11) and second metal layers (12) being alternately stacked, the first metal layers uppermost and lowermost layers of the layers, a thickness of at least one internally-arranged first metal layer (11a) being thicker than that of the lowermost and uppermost layers.

Abstract: Disclosed is a surface mount device to be mounted on a base member, including plural lead units, each of the plural lead units including, a lead including a body portion and a foot formed at an end of the lead; a solder portion formed at the foot of the lead to protrude toward the direction of the base member to have a summit portion, and a diffusion prevention portion provided on the lead for preventing a diffusion of a solder along the body portion of the lead.

Abstract: There is provided an electric storage device in which an electrode assembly enclosed in an insulating cover can be smoothly inserted in a case and the electrode assembly is positioned in place inside the case when housed in the case. The electric storage device according to the present invention includes an electrode assembly, an insulating cover covering the electrode assembly, and a case including a case body having a rectangular box shape and having an opening, the case body being configured to house the electrode assembly and the insulating cover, wherein the insulating cover is formed into a rectangular box shape conforming to the case body, and a portion of each of edges at which adjacent side surfaces of the insulating cover meet each other is beveled into a beveled part, the portion being close to the bottom of the insulating cover.

Abstract: There is provided an electric storage device having a novel fastening structure of a plastic member which can reduce cost with a simple configuration. An electric storage device according to this invention includes an electrode assembly, a case housing the electrode assembly, a plastic member arranged at an outer surface of the case, the plastic member having a joining surface facing the outer surface of the case, and an external terminal supported by the plastic member and electrically connected to the electrode assembly. The plastic member is a synthetic resin containing an inorganic fiber and is bonded to the outer surface of the case with the inorganic fiber exposed at the joining surface.

Abstract: A weatherproof electrical box may include a housing having a first enclosure volume and an opening to the first enclosure volume. A cover may be connected with the housing to cover the opening. A cable configuration element may extend from the cover and into the first enclosure volume. The cable configuration element may retain a cable connected with a device mounted in the housing in a downwardly extending surface configuration when the cover covers the opening.

Abstract: A semiconductor device includes a substrate, a first internal terminal, a second internal terminal, a third internal terminal, and a fourth internal terminal which are placed along perimeter of the substrate, a circuit formed above the substrate and coupled to the first internal terminal, a first external terminal coupled to the second internal terminal, a second external terminal coupled to the third internal terminal, and a third external terminal coupled to the fourth internal terminal and placed beside one side of the substrate where the second external terminal is located, wherein the circuit generates a signal indicative of a connection state between the first internal terminal and the first external terminal, and wherein the first internal terminal and the second internal terminal are arranged to form two rows in a direction perpendicular to one side of the substrate beside which the first external terminal is placed.

Abstract: A network communication component includes a case, a plurality of channels and at least one shielding. The channels are formed in the case. The shielding is disposed between two adjacent channels. Through the shielding between the channels, mutual interferences between the channels are avoided to enhance the signal communication quality.

Abstract: An electronic device such as an AC/DC power adapter includes a conductive heat dissipation system. The device contains heat generating components and is powered via power supply leads by an external power supply circuit. The device further contains a thermally conductive mass that is thermally coupled to both the heat generating components and to the power supply leads. When the power supply leads are coupled to receive electricity from the external power supply circuit, heat generated by the device is thermally conducted into the external power supply circuit via the power supply leads.

Abstract: A package includes a body that encapsulates a semiconductor die, the body having a first pair of opposing lateral sides, a second pair of opposing lateral sides, a top, and a bottom. The bottom has a primary surface and a plurality of protrusions that extend outward from the primary surface. When the package is mounted to a printed circuit board (PCB) the protrusions contact the PCB and the primary surface is disposed a first distance away from the PCB. The package further includes a plurality of leads that extend outward from the first pair of opposing lateral sides.