Outside Of Housing Patents (Class 174/556)
  • Patent number: 11415624
    Abstract: An IC socket (2) includes a first contact terminal (15a) that contacts a gull wing type lead terminal (1b) of an IC device (1), a second contact terminal that contacts a J-type lead terminal, a cam portion (3d) and a sliding portion (15c5) for bringing the first contact terminal (15a) into contact with the gull wing type lead terminal (1b), and a latch (6) for bringing the second contact terminal into contact with the J-type lead terminal. An asynchronous operation in which a contact operation by the cam portion (3d) and the sliding portion (15c5) is performed after a contact operation by the latch (6) is performed.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: August 16, 2022
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventor: Junichi Miyaaki
  • Patent number: 10406672
    Abstract: A drill press includes a main housing, a base coupled to the main housing, and a drill unit supported by the main housing for relative movement therewith. The base includes a bore formed in a top surface and a magnet to create a magnetic field for magnetically latching the base to a workpiece. The drill press further includes a holding force detection assembly having a plug and a sensor coupled to the plug to detect the magnetic field within the base. The holding force detection assembly is received within the bore formed in the top surface of the base.
    Type: Grant
    Filed: January 31, 2017
    Date of Patent: September 10, 2019
    Assignee: MILWAUKEE ELECTRIC TOOL CORPORATION
    Inventor: John Stanley Dey, IV
  • Patent number: 10361022
    Abstract: A low profile, small size and high performance electronic device for use in, e.g., electronic circuits which provides maximum creepage and/or clearance distances. In one embodiment, the device is configured for a small footprint and utilizes two or more windings that require isolation. The exemplary device includes a self-leaded header made from a unitary construction which comprises a generally a box-like support body having a cavity for mounting a circuit element with primary and secondary windings, the support body having a base and a plurality of leads extending generally horizontally outward from the support body adjacent the base, the support body having one side opening on a side with leads permitting the loading of the inductive device in the cavity, and a routing channel residing on the top of the base, so as to maximize the creepage and clearance distance of the electronic device. Shaped-core and other embodiments are also disclosed.
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: July 23, 2019
    Assignee: Pulse Electronics, Inc.
    Inventor: James Douglas Lint
  • Patent number: 9646755
    Abstract: A low profile and small size electronic device for use in, e.g., electronic circuits which provides maximum creepage and/or clearance distances. In one embodiment, the device is configured for a small footprint and utilizes two or more windings that require isolation. The exemplary device includes a self-leaded header made from a unitary construction which comprises a box-like support body having a cavity for mounting a circuit element, the support body having a base and leads extending generally horizontally outward from the support body adjacent the base, the support body having one side opening on a side with leads permitting the loading of the inductive device in the cavity, and a routing channel residing on the top of the base, so as to maximize the creepage and clearance distance of the electronic device. Shaped-core and other embodiments are also disclosed.
    Type: Grant
    Filed: November 8, 2011
    Date of Patent: May 9, 2017
    Assignee: PULSE ELECTRONICS, INC.
    Inventor: James Douglas Lint
  • Patent number: 9634214
    Abstract: Substrates and packages for LED based light devices can incorporate a material with high thermal conductivity in at least the lateral direction (e.g., graphite or graphene) to spread heat across the surface of the substrate. A substrate or layer in a multi-layer substrate can have a graphite core disposed between ceramic sublayers that provide electrical insulation and thermal conductivity in the transverse direction. Another substrate or layer in a multi-layer substrate can be fabricated using a composite of graphite and ceramic materials.
    Type: Grant
    Filed: November 5, 2013
    Date of Patent: April 25, 2017
    Assignee: LedEngin, Inc.
    Inventor: Xiantao Yan
  • Patent number: 8975539
    Abstract: A lead frame package structure with low EMI includes at least a die holder each for supporting a die, and at least a lead frame each including a first terminal for connecting a printed circuit board, a second terminal for connecting the die, and a lead for connecting the first terminal and the second terminal, wherein the height of the lead is lower than the height of the first terminal and the second terminal.
    Type: Grant
    Filed: March 8, 2012
    Date of Patent: March 10, 2015
    Assignee: NOVATEK Microelectronics Corp.
    Inventor: Yu-Chang Pai
  • Publication number: 20140306785
    Abstract: The present invention relates to a housing (100) for receiving an electric component, comprising a hollow housing body (110) with an opening (OS) on one side, which is characterized by a bottom (B) underneath the opening (OS), a lid (D) above the opening (OS), and two side walls (AS1, AS2) adjacent to the opening (OS), and at least two electric contacts (120a to 120f) provided on the bottom (B) of the housing body (110) on opposite housing sides, wherein a first contact (120a) of the electric contacts (120a to 120f) is situated in the region of the opening (OS).
    Type: Application
    Filed: April 11, 2014
    Publication date: October 16, 2014
    Inventors: Herbert MAIER, Thomas Steininger
  • Patent number: 7351921
    Abstract: An electrode assembly includes an electrode electrically connected to a capacitor with a wire. An assembly carrier may be used to hold and secure at least the wire and capacitor during assembly. A method of assembly for attaching a wire to a capacitor and an electrode may include an assembly carrier for housing and securing the wire, capacitor, and electrode during assembly.
    Type: Grant
    Filed: September 7, 2006
    Date of Patent: April 1, 2008
    Assignee: Boston Scientific Corporation
    Inventors: Matthew I. Haller, Tom Xiaohai He, Jay Daulton
  • Patent number: 7265991
    Abstract: A housing cage (1) comprising walls (2) defining sides of the housing cage and having wall sections (3). A plurality of contact surfaces (4), each of which is connected to one of said wall sections, are arranged so as to support built-in modules which are held in the housing cage (1). Each of the wall sections (3) is connected only on one first side (5) to its associated wall (2) of the housing cage (1), and the other sides of the wall sections (3) are spaced from the associated wall (2) of the housing cage (1) by incisions (6) in said associated wall, so that each of the wall sections (3) can be bent along the first side (5) with respect to its associated wall (2) of the housing cage (1).
    Type: Grant
    Filed: January 25, 2006
    Date of Patent: September 4, 2007
    Assignee: Fujitsu Siemens Computers GmbH
    Inventors: Friedrich Köhler, Mario Bez, August Scherer
  • Patent number: 6657120
    Abstract: A shelter for individuals or groups of people caught in the open in inclement weather especially when there is a danger of lightning. The shelter includes an elongate electrically-conductive member for supporting a canopy, the elongate electrically-conductive member being configured as a lightning conductor; an electrically-conducting floor; and a coupling member for electrically connecting the elongate electrically-conductive member to the electrically-conducting floor. The coupling member includes a flange extending laterally away from the elongate electrically-conducting member, over the electrically-conductive flooring, to provide an enlarged footprint of engagement with the electrically-conducting floor.
    Type: Grant
    Filed: February 12, 2003
    Date of Patent: December 2, 2003
    Assignee: H. R. Smith (Technical Developments) Limited
    Inventor: Henry Roy Smith
  • Patent number: 6477027
    Abstract: A grounding mat for connection to a power source, having a sheet including an outer perimeter and a central area. The outer perimeter surrounds the central area. A single continuous conductive member is attached to the sheet, the continuous conductive member having two unitary portions. The one portion is disposed in the central area of the sheet in a grid pattern, and the other portion is disposed in the outer perimeter of the sheet in a border pattern surrounding the one portion. The continuous conductive member has a connection end portion for electrical connection to the power source.
    Type: Grant
    Filed: June 2, 2000
    Date of Patent: November 5, 2002
    Assignee: Hubbell Incorporated
    Inventor: Marvin D. McKelvy
  • Patent number: 4688863
    Abstract: Method and an apparatus for earthing a conductor (4) suspended in the air by a supporting construction (8) wherein an earth cable (10) first is connected with an earth contact (13) on the supporting construction (8) and subsequently is connected to the conductor (4) to be earthed by means of an earth clip (7). By supplying a spring mechanism for tightening the clip (7) onto the conductor (4) to be earthed and by using the weight of the parts of the clip (7) urging it through a lever system (15) in the opened position while lowering the clip (4), an automatic light clip is provided.
    Type: Grant
    Filed: February 15, 1985
    Date of Patent: August 25, 1987
    Assignee: Rovee B.V.
    Inventor: Arie P. Oostlander