Abstract: A conduit attachment component with a box shape in an indoor unit of an air-conditioning apparatus includes a first component, a second component, and a third component. The second component and the third component are removably attached to the first component. The second component includes a first plate portion to which a conduit is connected. The third component includes a second plate portion. Any one of a plurality of side portions of the conduit attachment component is a first side portion, and a side portion of the plurality of side portions, adjacent to the first side portion, is a second side portion. In a first state, the first plate portion is the first side portion, and the second plate portion is the second side portion. In a second state, the first plate portion is the second side portion, and the second plate portion is the first side portion.

Abstract: The present disclosure enables a cost reduction for a circuit assembly including electronic components. A circuit assembly includes: an electronic component; a conductive plate to which the electronic component is connected; and a holding member that holds the conductive plate. The conductive plate includes a mounting portion on which the electronic component is mounted, and a fiducial mark for positioning and mounting the electronic component. The fiducial mark is constituted by a hole formed in the conductive plate.

Abstract: A middle frame includes an inner frame, a blocking member, and a covering member. The inner frame includes an outer surface and an inner surface opposite the outer surface. The inner frame further comprises at least one mounting hole penetrating the outer surface and the inner surface, the at least one mounting hole comprises an opening at the outer surface. The covering member covers the outer surface, and the blocking member is disposed between the covering member and the outer surface so as to cover the opening of the at least one mounting hole at the outer surface. An electronic device including the middle frame and a method for manufacturing the middle frame are also provided.

Abstract: Embodiments of this application disclose an electronic component package body, an electronic component assembly structure, and an electronic device. The electronic component assembly structure includes: an electronic component package body, where the electronic component package body includes a substrate, an electronic component, and a pin; the electronic component is packaged inside the substrate, and the pin is electrically connected to the electronic component; the pin includes a first part embedded in the substrate, and a second part protruding from the substrate; the second part includes a bottom surface and a side surface, the bottom surface is an outer surface that is of the pin and that is away from the substrate, and the side surface is connected between the bottom surface and the substrate. In this application, reliability of soldering between the electronic component package body and the circuit board is relatively high.

Abstract: Embodiments that allow multi-chip interconnect using organic bridges are described. In some embodiments an organic package substrate has an embedded organic bridge. The organic bridge can have interconnect structures that allow attachment of die to be interconnected by the organic bridge. In some embodiments, the organic bridge comprises a metal routing layer, a metal pad layer and interleaved organic polymer dielectric layers but without a substrate layer. Embodiments having only a few layers may be embedded into the top layer or top few layers of the organic package substrate. Methods of manufacture are also described.

Abstract: A covering lid includes a first plate portion provided with plural insertion portions into which a screw portion of a fastener having the screw portion and a head portion having a diameter larger than the screw portion is inserted and having a first surface facing an inside of a device and a second surface facing an outside of the device, the first plate portion being fixed by the plural fasteners of which the screw portion is inserted into each of the plural insertion portions so as to cover an opening of a device housing extending upward, downward, and rightward, and leftward; and a second plate portion extending apart from the first plate portion to a second surface side of the first plate portion so as to face at least some insertion portions on the same upper, lower, left, or right side of the opening among the plural insertion portions, being removed from the device housing, and being provided with a hook portion hooked to the fastener attached to the device housing in a state where the first surface fa

Abstract: A semiconductor device includes: an inner frame that surrounds an outer circumference of a semiconductor chip; and an outer frame that surrounds an outer circumference of the inner frame; wherein the outer frame is configured with an exterior wall that surrounds the outer circumference of the inner frame, and a fibrous reinforcing member that is wound on an outer circumference of the exterior wall. This prevents the broken pieces of a component that constitutes the semiconductor device from being scattered outside the semiconductor device, thereby not only to achieve improvement in the reliability of the entire system, but also to achieve downsizing of the semiconductor device.

Abstract: An electronic solid-state switch assembly includes a base plate and a heat exchanger; an electrically insulating layer and a direct bonded substrate affixed to the base plate; a first terminal and a second terminal; a plurality of power transistors; a plurality of gate drivers; a communication interface, a current sensor, and a snubber circuit; and a controller. The plurality of gate drivers are operatively coupled to the plurality of power transistors. The plurality of power transistors are arranged in parallel on the direct bonded substrate between the first terminal and the second terminal. The plurality of power transistors are electrically connected to the first terminal and to the second terminal. The controller is in communication with the plurality of gate drivers, the current sensor, and the communication interface. The controller is configured to control, via the plurality of gate drivers, the plurality of power transistors.

Abstract: A storage device of the present invention is provided to store flexible circuit packages, each of the flexible circuit packages includes an electronic component and two circuit portions warped at both sides of the electronic component, respectively. The storage device includes a first carrier and a second carrier. The first carrier includes first accommodation elements provided for placement of the flexible circuit packages, and the second carrier includes a first press portion and a second press portion. As the second carrier is placed on the first carrier, the first and second press portions are provided to press the two circuit portions warped upwardly toward the second carrier so as to reduce the warpage of the two circuit portions.

Abstract: A custom outlet module is contained within a housing and has an electric current sensor configured to measure current passing through an electric outlet during a time period, a proximity sensor configured to detect a distance of an object relative to the electric outlet during the time period, a relay switch that can open or close to stop or conduct current through a circuit in the electric outlet in response to a command, and a wireless network interface in communication with the electric current sensor and the proximity sensor, the wireless network interface configured to transmit and receive data from the current sensor and the proximity sensor, to transmit commands to the relay switch, transmit the data to a computing device, and receive commands from the computing device.

Abstract: A prefabricated electrical module and system along with fabrication and installation methods are provided. The prefab electrical module includes a circuit breaker panel casing that houses multiple circuit breakers, and a chase extending upwardly from the panel casing that stows coiled lengths of homerun wiring attached to the circuit breakers. During transport, a temporary panel casing front cover protects the panel casing front, and a forwardly protruding guard cover with an upwardly projecting hoisting handle shields the front and top of the chase and wiring. During installation, a hoisting bracket is attached at the top of the stud bay into which the prefab electrical module will be installed. A drill-powered winch is then used to lift the module to the proper height in the bay. The panel casing, chase, wiring, and breakers remain in the wall. The hoisting bracket, temporary panel casing front cover, guard cover, drill, and winch are reusable.

Abstract: A sensor for a merchandise display security system for displaying and protecting an article of merchandise is provided. The security system includes a merchandise bracket configured to be secured to the article of merchandise and a sensor configured to releasably engage the merchandise bracket and to detect unauthorized removal of the merchandise bracket or the sensor from the article of merchandise. The sensor is configured to be releasably engaged with the merchandise bracket such that the sensor is removable from the merchandise bracket while the merchandise bracket remains secured to the article of merchandise.

Abstract: An integrated circuit film bulk acoustic resonator (FBAR) device having multiple resonator thicknesses is formed on a common substrate in a stacked configuration. In an embodiment, a seed layer is deposited on a substrate, and one or more multi-layer stacks are deposited on the seed layer, each multi-layer stack having a first metal layer deposited on a first sacrificial layer, and a second metal layer deposited on a second sacrificial layer. The second sacrificial layer can be removed and the resulting space is filled in with a piezoelectric material, and the first sacrificial layer can be removed to release the piezoelectric material from the substrate and suspend the piezoelectric material above the substrate. More than one multi-layer stack can be added, each having a unique resonant frequency. Thus, multiple resonator thicknesses can be achieved on a common substrate, and hence, multiple resonant frequencies on that same substrate.

Abstract: A novel busbar, suitable for low-power applications, features a u-shaped extension having a male terminal that fits into and establishes electrical connection with a standard female terminal. The housing of an electrical box including the busbar is modified to receive the female terminal in such a way that Ingress Protection ratings of IP67 and IP69K are maintained within the electrical box. The busbar is not riveted to a thicker busbar terminating with a stud and lug nut, as in legacy configurations, thus being simpler and cheaper to manufacture. The female terminal, once connected to the busbar, is removable by inserting a tool into a dedicated opening within the housing.

Abstract: A duct assembly for covering electrical connections between electrical equipment enclosures having a gap therebetween. The duct assembly includes a first frame configured to be mounted to one of the enclosures, where the first frame includes a flange mounted to the enclosure and a flange to which a gasket is secured that extends all of the way around the first frame. The duct assembly also includes a second frame configured to be mounted to the other enclosure, where the second frame includes a flange mounted to the enclosure and a flange to which a gasket is secured that extends all of the way around the second frame. The duct assembly further includes a duct that compresses and is coupled only to the gaskets that enclose each end of the gap.

Abstract: A method for forming a packaged electronic device includes providing a substrate having a first major surface and an opposing second major surface. The method includes attaching an electronic device to the first major surface of the substrate and providing a first conductive structure coupled to at least a first portion of the substrate. The method includes forming a dielectric layer overlying at least part of the first conductive structure. The method includes forming a conductive layer overlying the dielectric layer and connected to a second portion of the substrate. The first conductive structure, the dielectric layer, and conductive layer are configured as a capacitor structure and further configured as one or more of an enclosure structure or a stiffener structure for the packaged electronic device.

Abstract: A carrier includes first and second container portions that are assembled together to provide a structure the supports and retains a capacitor. The first container portion and the second container portion are assembled together in a configuration in which the edges of the first wall structures face corresponding ones of the edges of the second wall structures, and the edges of the first wall structures are overlapping with respect to the corresponding ones of the edges of the second wall structures when the carrier is viewed in side view.

Abstract: An assembly includes a transformer tank that is arranged in a nacelle of a wind turbine, wherein the transformer tank is configured to be filled with a gas or a liquid to cool the active part of the transformer and the active part is enclosed by the transformer tank in a liquid-tight or gas-tight manner, such that use of the transformer tank as a reinforcement or a bracing of the steel construction of the nacelle with as little additional material expenditure as possible for the transformer is facilitated by integrating the transformer tank into the mechanical support structure of the nacelle such that the transformer tank forms a part of the mechanical support structure of the nacelle and by providing at least one bracing in the interior of the transformer tank, where bracing connects mutually opposing wall regions of the transformer tank.

Abstract: This disclosure provides storage chassis including base storage sub-assemblies and partitions. Base includes bottom plate, top plate, first side plate and second side plate. Front side of bottom plate is opposite to back side of bottom plate. Bottom plate is located opposite to top plate. First side plate is located opposite to second side plate. First side plate and second side plate are connected to and located between bottom plate and top plate. Storage sub-assemblies are movably disposed between first side plate and second side plate. Partitions are disposed between first side plate and second side plate. Opposite ends of each partition are respectively connected to top plate and bottom plate. Partitions separate storage sub-assemblies from one another so that storage sub-assemblies are respectively located in airflow channels that are independent to one another.

Abstract: A magnetic detection module is provided so as to be selectively mountable in any of housings having a plurality of specifications having different shapes or sizes of mounting portions, and detects magnetic flux generated in the housing. The magnetic detection module includes one or more magnetic sensors that detect magnetic flux, a case in which the magnetic sensors are housed, and a cap that can be attached to an end of the case and is provided with a sealing member. The magnetic detection module can be attached to the housing of the first specification with the cap not attached to the case, and can be attached to the housing of the second specification through a sealing member with the cap attached to the case.

Abstract: Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.

Abstract: A waterproof communication port (2) and a terminal device equipped with the waterproof communication port (2) are provided and relate to the field of terminal device technologies. The waterproof communication port (2) includes a port body (21), a connecting groove (22) is provided on a connecting end of the communication port body (21), metal terminals (23) are provided inside the connecting groove, a liquid guiding groove (24) is provided between two adjacent metal terminals (23), the liquid guiding groove (24) is located at the bottom of the connecting groove (22), a liquid dissipation cavity (25) is further provided inside the communication port body (21), and the liquid guiding groove (24) is connected with the liquid dissipation cavity (25).

Abstract: An electrical power outlet is suitable for mounting face-up in locations that may be susceptible to liquid spills. The outlet includes a housing body defining an interior chamber, with an intermediate wall positioned therein. The intermediate wall defines contact openings that are open to contact passageways in which electrical contacts are mounted. A pair of drainage passageways extend through the housing body. A pair of drainage channels extend along the intermediate wall to the respective drainage passageways, so that liquid along the intermediate wall is directed along the drainage channels to the drainage passageways. Drain openings formed in a bottom wall of the housing body are in fluid communication with the respective drainage channels for draining liquid out of the housing body.

Abstract: The present invention provides a circuit board, a molded photosensitive assembly and manufacturing method therefor, a photographing module, and an electronic device. The circuit board comprises a substrate and at least one circuit portion formed on the substrate. A photosensitive element and the circuit portion are conductively connected. The circuit portion forms a ring circuit in an edge region of the substrate. The ring circuit surrounds the photosensitive element, so that in a molding process, the photosensitive element can be protected by the ring circuit.

Abstract: In one embodiment, an apparatus includes a module for installation in a modular electronic system. The module generally comprises a subassembly for insertion into a front opening in a chassis of the modular electronic system or removal from the front opening in the chassis and an adapter comprising a first interface for mating with the subassembly and a second interface for mating with the modular electronic system. The adapter remains in the chassis during removal of the subassembly from the front opening in the chassis and the module is configured for insertion into a rear opening in the chassis or removal from the rear opening in the chassis with the subassembly coupled to the adapter.

Abstract: A heat source unit of a refrigerating apparatus includes a heat exchanger, a blower, an electronic component controlling driving of an actuator, a casing having a vent, and first and second partitioning plates. The heat exchanger has first, second, third and fourth side face parts. The first partitioning plate is disposed between the first and fourth side face parts. An interior of the casing has a first space surrounded by the first to fourth side face parts and the first partitioning plate, and a second space partitioned from the first space by the first partitioning plate. The second space is divided by the second partitioning plate into a third space and a fourth space situated below the third space and exposed externally from the casing. The electrical component is disposed in the third space. The second partitioning plate has a first ventilation opening communicating between the third and fourth spaces.

Abstract: A high-frequency module includes a module substrate including an internal wiring pattern, and a SAW filter including a piezoelectric substrate, an electrode pattern on the piezoelectric substrate, a support surrounding the electrode pattern, and a cover on the support covering the electrode pattern to define a hollow space together with the support and the piezoelectric substrate. The module substrate, the cover, and the piezoelectric substrate are disposed in this order in a perpendicular or substantially perpendicular direction with respect to the module substrate, and a shield electrode is provided on a surface of the cover that faces the module substrate or on a surface of the cover that faces the piezoelectric substrate.

Abstract: A camera module and its molded circuit board assembly and manufacturing method are disclosed, wherein the molded circuit board assembly includes a circuit board and a molded base integrally formed with the circuit board through a molding process. The molded base forms a light window disposed corresponding to a photosensitive element of the camera module, wherein the light window is configured to have a trapezoidal or multi-stair trapezoidal shape cross section which has diameters increasing from bottom to top to facilitate demoulding, so as to prevent damage to the molded base, and to avoid stray light.

Abstract: Provided are systems and methods for supplying electric power to removable storage compartments. The system includes an alignment body and a removable storage compartment. The alignment body is configured to align the storage compartment at a certain position, and includes a first conductive strip configured to be connected to ground, and a second conductive strip having positive voltage. The storage compartment includes at least a first and a second contact means. The first contact means is configured to be in contact with the first conductive strip, and the second contact means is configured to be in contact with the second conductive strip.

Abstract: A housing, a method for manufacturing an antenna, and a mobile terminal having the housing are provided. The housing includes a substrate at least including a metal area, a slot defined in the metal area of the substrate and penetrating through the substrate, and a filling layer received in the slot and including an insulating layer and a paint layer on the insulating layer. The paint layer has a width which is 0.02-0.06 mm larger than that of the insulating layer. An outer surface of the paint layer and an outer surface of the substrate have a same color.

Abstract: A board unit includes a case accommodating a circuit board. A power terminal connects a lead-out part of a bus bar with a connection terminal of an electric wire. A cover covers the power terminal and has a lateral wall overlapping a peripheral wall part. The lateral surface of the peripheral wall part and the lateral wall includes an engagement protrusion and an engagement recess to be engaged with the engagement protrusion. The lateral wall of the cover includes a latch piece at a position offset from the engagement protrusion or the engagement recess in a longitudinal direction and a latch portion to be latched with the latch piece which restricts displacement of the lateral wall of the cover in a direction away from the lateral surface of the peripheral wall part of the case.

Abstract: The present invention is directed to a multipurpose adaptable work light, system, and method of use. The invention comprises a first housing member having an external connection port, a second housing member coupled to the first housing member, a lighting device coupled to the first housing member and disposed within the second housing member, a power source coupled to the lighting device, at least one magnet coupled to the first housing member, and an adaptor plate coupled to the first housing member. Each of the at least one magnet, the adaptor plate, the external connection port, and the second housing member may be utilized in various tandem and independent configurations in order to affix the work light to a suitable workplace environment surface, such as an overhead hook support, a tripod mount, a magnetically-active surface, a junction box, or to a wide variety of surfaces, including, without limitation, horizontal, vertical, angled, flat or curved surfaces.

Abstract: A housing, a method for manufacturing the housing, and a mobile terminal having the housing include a substrate including a metal area, a slot defined in the metal area of the substrate and penetrating through the substrate, and a filling layer received in the slot and including an insulating layer and a paint layer on the insulating layer.

Abstract: A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demolding and avoiding stray lights.

Abstract: A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demolding and avoiding stray lights.

Abstract: A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demolding and avoiding stray lights.

Abstract: A method for manufacturing a light emitting device includes: joining a light transmissive substrate and two or more light emitting elements; separating the light transmissive substrate into a plurality of light transmissive pieces such that one or more of the light emitting elements remains in a state joined to one of the light transmissive pieces; mounting the one or more of the light emitting elements joined to the one of the light transmissive pieces on a mounting unit; removing a portion of the one of the light transmissive pieces such that a top surface of the one of the light transmissive pieces becomes a predetermined shape; and after the removing of the portion of the one of the light transmissive pieces, separating the mounting unit into a plurality of board pieces such that one or more of the light transmissive pieces remain on one of the board pieces.

Abstract: A drawer for receiving components may include a caddy tray and at least one caddy. The caddy tray may include a substantially planar caddy tray bottom defining a caddy tray depth and a caddy tray width. The at least one caddy may be mechanically coupled to the caddy tray via a hinge mechanically coupled to the caddy tray bottom such that the caddy pivots relative to the caddy tray about the hinge, the hinge having an axis generally parallel to the caddy tray depth, the at least one caddy having a plurality of bays, each bay having one or more structural components for receiving a modular information handling resource and configured such that the bay is accessed for insertion or removal of the modular information handling resource when the at least one caddy is pivoted from a closed position to an open position.

Abstract: A method for manufacturing a light emitting device includes: joining a light transmissive substrate and light emitting elements with top surfaces of the light emitting elements facing a bottom surface of the light transmissive substrate; separating the light transmissive substrate into a plurality of light transmissive pieces such that one or more of the light emitting elements remains in a state joined to one of the light transmissive pieces after separation; mounting the light emitting element joined to the light transmissive piece on a mounting unit, with a bottom surface of the light emitting element facing a top surface of the mounting unit; removing a portion of the light transmissive piece such that a top surface of the light transmissive piece becomes a predetermined shape; and providing a light reflective member around the top surface of the light transmissive piece that remains after the portion of the light transmissive piece is removed.

Abstract: A camera module and its molded circuit board assembly and manufacturing method are disclosed, wherein the molded circuit board assembly includes a circuit board and a molded base integrally formed with the circuit board through a molding process. The molded base forms a light window disposed corresponding to a photosensitive element of the camera module, wherein the light window is configured to have a trapezoidal or to multi-stair trapezoidal shape cross section which has diameters increasing from bottom to top to facilitate demolding, so as to prevent damage to the molded base, and to avoid stray light.

Abstract: A camera module and its molded circuit board assembly and manufacturing method are disclosed, wherein the molded circuit board assembly includes a circuit board and a molded base integrally formed with the circuit board through a molding process. The molded base forms a light window disposed corresponding to a photosensitive element of the camera module, wherein the light window is configured to have a trapezoidal or to multi-stair trapezoidal shape cross section which has diameters increasing from bottom to top to facilitate demolding, so as to prevent damage to the molded base, and to avoid stray light.

Abstract: A terminal block assembly includes a block housing, a surge protection device, a plurality of cable-receiving seats, a plurality of connector sets and a first fuse. The block housing defines an accommodating space that confines the surge protection device. The cable-receiving seats and the connector sets are mounted on the block housing. Each of the connector sets includes at least one first connector that is electrically connected to a light-emitting module of an outdoor lamp, and a second connector that extends into the accommodating space and that is electrically connected to the surge protection device. The first fuse is mounted to the block housing, and is electrically connected to the surge protection device.

Abstract: A carrier rail housing (1) is described comprising a snap-in base (2) for setting on a carrier rail (3). The snap-in base (2) comprises a carrier rail receiving opening (5) for receiving a carrier rail (3), two snap-in latches (4, 12) movable relative to each other comprising respectively at least one snap-in lug (6, 13), which protrude in a snap-in position into the carrier rail receiving opening (5) for locking with a carrier rail (3) receivable in the carrier rail receiving opening (5), and a coupling element (10) which is in operative connection with the two snap-in latches (4, 12) and transfers a movement of one snap-in latch (4) into a movement of the other snap-in latch (12). The snap-in base (2) further comprises a locking arm (15) with a stop (18) protruding into the carrier rail receiving opening (5) in an open position, in which the snap-in lugs (6, 13) are unlocked from the carrier rail (3), for applying at a side edge of the carrier rail (3) receivable in the carrier rail receiving opening (5).

Abstract: An assembly for the frame of a switchboard is disclosed, which can include a hollow member which extends lengthwise along a reference axis and which has at least one slot. The assembly can include at least one connecting element for connecting the assembly to a corresponding corner joint element of the frame, and the connecting element can include an insulating body and a fixing metal plate which is associated to a carrying part of the insulating body. The carrying part can be at least partially inserted transversally with respect to the reference axis into the hollow member through the slot, so as to arrange at least a portion of the associated fixing metal plate into the hollow member transversally with respect to the reference axis.

Abstract: An electrical receptacle connector includes a metallic shell, an insulated housing, a plurality of first receptacle terminals, a plurality of second receptacle terminals, a recess structure, and a passage structure. The insulated housing is received in the receiving cavity. The first receptacle terminals and the second receptacle terminals are respectively disposed at an upper portion and a lower portion of the insulated housing. The recess structure and the passage structure are formed at the rear of the insulated housing, so that a sealing member can be filled in the recess structure and the passage structure to cover and shields the rear of the insulated housing.

Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The major components and subassemblies self-ground by establishing an interference fit with exposed, resilient, embossed portions of wire mesh.

Abstract: A solar power inverter having a sealing means includes: a main case having an opening on a front surface thereof, the opening open and closed by a main cover; an auxiliary case coupled to one side surface of the main case, and having a second opening on a front surface thereof, the second opening open and closed by an auxiliary cover; and a gasket interposed between the main case and the auxiliary case, wherein the main case and the auxiliary case are coupled to each other by coupling bolts which pass through the main case, the gasket and the auxiliary case.

Abstract: A printed circuit board laminate is provided of a novel structure that is not only capable of enhancing a degree of freedom in design and achieving a further size reduction, but also capable of enhancing heat releasing performance in a space sandwiched in between two printed circuit boards. A lattice-like portion formed of a plurality of connection walls crossed with one another is provided to an insulating plate interposed between two printed circuit boards, and the connection walls are positioned with clearances from the two printed circuit boards, respectively, by a plurality of supporting ribs protruding from the connection walls toward at least one of the two printed circuit boards.

Abstract: A case body portion accommodates an electronic circuit board. The case body portion has a rib projected from at least a part of a periphery of the opening. A lid has a flange, which is in contact with an outer periphery of the rib, when the lid is mounted on the case body portion to cover the opening. The rib has a raised portion raised outward from a part of an outer periphery of the rib.

Abstract: A capacitor body is laterally contained in a lower holder, to be then pressed by an upper holder. A lead wire is led from the capacitor body in an axial direction, and then, bent toward a wiring board, thereby forming a leg soldered to the wiring board. The lower holder includes a first holding portion extending outward and having a supporter disposed in a stationary state whereas the upper holder includes a second holding portion extending outward and having a bridge stretched between a pair of elastically deformable arms. The first and second holding portions are urged toward the capacitor body, and therefore, axially hold a part of the leg of the lead wire. This configuration can prevent any breakage of a soldered portion of the lead wire due to vibrations so as to enhance vibration resistance.