Seal Patents (Class 174/564)
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Patent number: 11600447Abstract: A film capacitor includes a main body portion shaped in a rectangular prism, and a pair of external electrodes. The main body portion includes dielectric films and metallic films which are laminated, and includes a pair of first faces opposed to each other, a pair of first side faces opposed to each other, and a pair of second side faces opposed to each other, the pair of first side faces connecting the pair of first faces, the pair of second side faces connecting the pair of first faces. The pair of external electrodes is located on the pair of first side faces. The second side faces are covered with an insulating cover layer. The film capacitor includes a grease-containing portion between the second side face and the insulating cover layer, the grease-containing portion including an insulating grease.Type: GrantFiled: March 20, 2019Date of Patent: March 7, 2023Assignee: KYOCERA CORPORATIONInventor: Tatsuya Tateishi
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Patent number: 11485670Abstract: A glass wafer has an internal surface and an opposing external surface separated by a wafer thickness. A hermetic, electrically conductive feedthrough extends through the wafer from the internal surface to the opposing external surface. The feedthrough includes a feedthrough member having an inner face exposed along the internal surface for electrically coupling to an electrical circuit. The feedthrough member extends from the inner face partially through the wafer thickness to an exteriorly-facing outer face hermetically embedded within the wafer.Type: GrantFiled: November 4, 2019Date of Patent: November 1, 2022Assignee: Medtronic, Inc.Inventors: David A. Ruben, Michael S. Sandlin
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Patent number: 11257799Abstract: An optical sensor module includes: (1) a lid defining a first chamber and a second chamber isolated from the first chamber; (2) a light emitting component disposed within the first chamber; and (3) a light sensing component disposed within the second chamber; wherein the lid includes a capping substrate and a top of the first chamber and a top of the second chamber are demarcated by the capping substrate, wherein the capping substrate defines a first penetrating hole at the top of the first chamber and a first runner connecting a side wall of the first penetrating hole, and wherein a first lens or a first transmissive panel is formed or disposed in the first penetrating hole and has an extension formed or disposed in the first runner connecting the side wall of the first penetrating hole.Type: GrantFiled: May 6, 2019Date of Patent: February 22, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventor: Hsin-Ying Ho
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Patent number: 11049777Abstract: A frame lid for use with a semiconductor package is disclosed. First, a mask is applied to a top surface of the lid and over a central area of the top surface to define a peripheral area. Next, a seal ring is formed by metallizing the peripheral area and the sidewall of the plate. The mask can then be removed obtain the frame lid. Next, a solder preform can be attached to the seal ring. This reduces pullback and shrinkage of the metallized layer, while lowering the manufacturing cost and process times.Type: GrantFiled: April 28, 2017Date of Patent: June 29, 2021Assignee: MATERION CORPORATIONInventor: Ramesh Kothandapani
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Patent number: 11044550Abstract: A speaker device including a first speaker cover, a second speaker cover, a speaker housed by the first speaker cover and the second speaker cover, and a monolithic, one-piece vibration damping structure disposed between the first speaker cover and the second speaker cover. The first speaker cover and the second speaker cover are made of a first material, and the monolithic, one-piece vibration damping structure is made of a second material that is different from the first material.Type: GrantFiled: August 27, 2019Date of Patent: June 22, 2021Assignee: Vanson Electronics (Nanhai) Co., Ltd.Inventors: Ching-Shan Hsu, Hao-Chien Hsu
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Patent number: 11031309Abstract: A cover lid for use with a semiconductor package is disclosed. First, a polyamide mask is applied to one surface of the lid plate. Next, the exposed areas of the surface, as well as the sides of the lid plate, are metallized. The polyamide mask can then be removed. This reduces pullback and shrinkage of the metallized layer, while lowering the manufacturing cost and process times.Type: GrantFiled: May 21, 2015Date of Patent: June 8, 2021Assignee: MATERION CORPORATIONInventor: Ramesh Kothandapani
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Patent number: 10667425Abstract: An air containment structure includes walls and an aisle between the walls. Computing devices are mounted to the walls of the air containment structure and the air containment structure separates air within the aisle of the air containment structure from other air in a facility. The walls of the air containment structure are configured to support respective weights of the computing devices mounted to the air containment structure. In some embodiments, infrastructure systems, such as power bus bars, cable trays, and cooling ducts are mounted to and supported by the air containment structure.Type: GrantFiled: September 26, 2016Date of Patent: May 26, 2020Assignee: Amazon Technologies, Inc.Inventors: Brock Robert Gardner, Michael P. Czamara
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Patent number: 10547060Abstract: Methods, systems, and devices for powering downhole tools with an electrochemical device are provided. A downhole power system includes an electrochemical device having an anode and a cathode. The power system includes a downhole tool electrically communicating with the electrochemical device to provide electrical power to the downhole tool. The electrochemical device is activated when immersed in a downhole fluid and inactive when not immersed in the downhole fluid, the downhole fluid functioning as an electrolyte.Type: GrantFiled: January 29, 2016Date of Patent: January 28, 2020Assignee: SCHLUMBERGER TECHNOLOGY CORPORATIONInventor: Vladimir Shitikov
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Patent number: 10439358Abstract: A method of manufacturing a light-emitting device includes providing a base body including a base section; fixing a plurality of semiconductor laser elements on an upper surface of the base section; and fixing an optical member to the base body, the optical member including a plurality of lens sections, and a non-lens section disposed at a periphery of the plurality of lens sections in a top view. In the step of fixing the optical member: the optical member is arranged above the base body; (i) an inclination and a height of the optical member are adjusted after interposing an adhesive between the base body and the non-lens section, or (ii) an adhesive is interposed between the base body and the non-lens section after adjusting the inclination and the height of the optical member; and subsequently, the adhesive is cured to fix the optical member to the base body.Type: GrantFiled: April 25, 2017Date of Patent: October 8, 2019Assignee: NICHIA CORPORATIONInventors: Soichiro Miura, Seiji Kiyota, Eiichiro Okahisa
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Patent number: 10356917Abstract: Provided is a display device. A display device according to the present invention comprises a display panel; a module cover disposed on the rear surface of the display panel and having at least one or more fastening holes; and a cushion covering the vicinity of the fastening hole disposed on the front surface of the module cover, wherein the vicinity of the fastening hole includes a plurality of layers and the cushion is disposed on top of the plurality of layers. According to the present invention, a module cover cannot be easily bent as a cushion is disposed in the vicinity of a fastening hole.Type: GrantFiled: April 17, 2017Date of Patent: July 16, 2019Assignee: LG ELECTRONICS INC.Inventors: Hayun Lee, Cheolsoo Kim, Bumgi Min
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Patent number: 10335603Abstract: Medical devices include stimulation and/or sensing circuitry that is interconnected to electrical components by a flexible circuit body having exposed portions of circuit traces that are attached to electrical contacts of the electrical components. Each circuit trace may span a separate window formed in an insulative body of the flexible circuit body, or a plurality of circuit traces may span a single window or may be freely extending from the insulative body. The exposed portion of the circuit trace may be plated with a conductive metal and then attached to the electrical contact of the electrical component. The flexible circuit body may be an extension from a flexible electrical circuit board containing the circuit. The circuit may be present on a circuit board that includes electrical contacts and where the flexible circuit body has exposed portions of circuit traces attached to the electrical contacts of the circuit board.Type: GrantFiled: July 23, 2016Date of Patent: July 2, 2019Assignee: MEDTRONIC, INC.Inventors: Gerald G. Lindner, William C. Phillips, Dominique Piguet, Daniel T. Pyne, Micah A. Litow, James Strom, Mark G. Wosmek
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Patent number: 10297408Abstract: An enclosure for the operating mechanism of a circuit breaker, this mechanism including a main shaft and secondary shafts, and a spring to actuate the mechanism. This enclosure includes a parallelepiped base having an open face and including a bottom wall opposite to its open face, this bottom wall having holes to receive bearings carrying the shafts; a supporting part including a main wall to be mounted at the open face of the base, the main wall including holes to receive bearings carrying the other extremities of the shafts; a cover to close the supporting part.Type: GrantFiled: April 18, 2016Date of Patent: May 21, 2019Assignee: GENERAL ELECTRIC TECHNOLOGY GMBHInventors: Daniel Kalin, Peter Von Allmen
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Patent number: 10254635Abstract: There is provided a light source unit comprising a sealing member, a holding member on which an abutment surface is formed, which has an engaging portion and which holds a part, a case on which an abutted surface is formed which is brought into abutment with the abutment surface via the sealing member, which has an engaged portion which is brought into engagement with the engaging portion and which holds the holding member, wherein the abutment surface of the holding member and the abutted surface of the case face each other and are inclined relative to a holding surface which holds the part, and the abutted surface of the case is inclined so as to face a side where the holding member is inserted.Type: GrantFiled: October 19, 2017Date of Patent: April 9, 2019Assignee: CASIO COMPUTER CO., LTD.Inventors: Toshifumi Kase, Hirofumi Fujikura
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Patent number: 10250186Abstract: A detachable split solar power optimization junction box module has split junction boxes (1A, 1B, 1C) each having a base part and an upper cover part. String ports (11) are provided in a base (10) of the base part for electrically connecting a string of a photovoltaic module (40). The upper cover part has an upper cover (20) with a circuit board (21) provided therein. The circuit board (21) has a power optimization module connected with electrical connection pieces (22). The electrical connection pieces (22) are detachably inserted into the string ports (11) so that the power optimization module performs power optimization on the string of the photovoltaic module. The split junction boxes (1A, 1B, 1C) are used for power optimization at the string level. The power optimization module is integrated in the upper cover part that detachably connects with the base part for convenience of installation and maintenance.Type: GrantFiled: December 11, 2017Date of Patent: April 2, 2019Assignee: Jiangsu Enmagic Energy Co., Ltd.Inventors: Zheng Fang, Jian Zuo, Jian-Bin Tong, Ke Wang
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Patent number: 10244649Abstract: In various implementations, an enclosure may be utilized to secure component(s) for a variety of applications, such as creating a communications network. For example, an enclosure may be utilized to secure electronic component(s). The enclosure may include shell(s) and a frame coupled to create a seal that inhibits the components in the enclosure from being exposed to fluids and/or particles. The shell(s) or portions thereof may not cause substantial signal loss.Type: GrantFiled: April 26, 2017Date of Patent: March 26, 2019Assignee: AmpThink, LLCInventor: William Carl Anderson, III
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Patent number: 10201106Abstract: An enclosure with a substantially continuous seal about its perimeter for protecting electronic components of a model vehicle, comprising a housing with one or more walls at least partially surrounding the electronic components, a cover having one or more walls surrounding the perimeter of the housing, and one or more seal members interposed between the housing perimeter walls and the cover perimeter walls, wherein the cover perimeter walls are configured to contact the seal members against the housing perimeter walls to create a watertight barrier configured to provide protection ranging from water-resistant to waterproof.Type: GrantFiled: June 30, 2014Date of Patent: February 5, 2019Assignee: TRAXXAS LPInventors: Jory Sprowl, Roy Perryman, Otto Karl Allmendinger
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Patent number: 10120407Abstract: This sealed joystick for a machine comprises a function block, an outer shell formed by joining two rigid half-shells, these half-shells tightly enclosing the function block, each half-shell comprising a joint surface for this purpose all along its perimeter following a three-dimensional path which terminates on itself and which extends in the three dimensions of space, a sealing element comprising a one-piece block of elastomer material combining a sealing cord and a ring seal of different transverse cross-section within this same block to ensure that the joint surfaces are watertight.Type: GrantFiled: July 21, 2016Date of Patent: November 6, 2018Assignee: Crouzet AutomatismesInventors: Ludovic Niguet, Thierry Vinard, Fabien Ville, Fabien Pelaez
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Patent number: 10039196Abstract: A portable device of the present invention includes an exterior member of which an inside is hollow, a plurality of support parts provided in the inside of the exterior member so as to stand up in a direction perpendicular to a front or back surface of the exterior member, a plurality of buffer members provided around each of the plurality of support parts, and an inner member kept in the inside of the exterior member in parallel with the front or back surface of the exterior member without being in contact with the exterior member by the plurality of buffer members.Type: GrantFiled: August 30, 2017Date of Patent: July 31, 2018Assignee: CASIO COMPUTER CO., LTD.Inventors: Hiromasu Meguro, Yasunori Chiba, Shinya Okumura
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Patent number: 9970785Abstract: An in-vehicle detection device includes a cable that includes a plurality of insulated electric wires that are formed by covering a central conductor with an insulator, and a sheath that collectively covers the insulated electric wires, a sensor that includes a sensor main body including a detection element, and a lead wire that is led from the sensor main body and connected to the central conductor, and a fixing member that includes a tubular portion to house the sensor and fixes the sensor and the cable to each other. The fixing member holds the insulated electric wires that are exposed from the sheath in a bent state thereof between an end of the sheath and the lead wire. A central axis of a part of the sheath that is held by the fixing member intersects with a central axis of the tubular portion at a predetermined angle.Type: GrantFiled: December 8, 2014Date of Patent: May 15, 2018Assignee: HITACHI METALS, LTD.Inventors: Yukio Ikeda, Shinya Oeda
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Patent number: 9933810Abstract: The present invention is directed to a housing unit, which allows an electronic device such as a portable digital audio player to be substantially hermetically sealed within an audio device. The electronic device is controllable by a user while housed with the housing unit. The audio device is able to be used in a vehicle such as a car, a camper, or a boat or in other common consumer products.Type: GrantFiled: October 1, 2013Date of Patent: April 3, 2018Assignee: AQUATIC AV, INC.Inventor: Robert Louis Fils
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Patent number: 9935416Abstract: A method of assembling a connector module is provided. The method of assembling includes abutting an engagement surface of a connector extending from a circuit board with corresponding engagement surfaces of first and second support members disposed within a housing. The method of assembling includes resisting movement of the connector towards a base of the housing at a first end of the connector through a substantially perpendicular extension from at least one of the first and second support members. The method of assembling includes constraining lateral movement of the connector through engaging a receptacle formed on a second end of the connector with a pin of the first support member.Type: GrantFiled: June 30, 2014Date of Patent: April 3, 2018Assignee: Rockwell Automation Asia Pacific Business Center Pte. Ltd.Inventor: Soon Seng Kang
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Patent number: 9793033Abstract: There is provided a resistor in which a first resistive part of a resistive element that electrically conducts between a pair of electrodes formed on either end of an insulating substrate has a meandering pattern meandering on the substrate surface and a swelling pattern that has a form in which a part of the meandering pattern swells out from the stroke width of the meandering pattern, a second resistive part that is electrically connected in series to the first resistive part is shorter than the entire length of the first resistive part, and has a wider width than the stroke width of the meandering pattern, and a trimming groove is formed in at least either the swelling pattern or the second resistive part. This can improve resistance accuracy and provide a high voltage resistor with high withstand voltage property.Type: GrantFiled: October 23, 2015Date of Patent: October 17, 2017Assignee: KOA CorporationInventor: Hiroyuki Fukao
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Patent number: 9735496Abstract: A circuit board with circuit components mounted thereon is integrally molded with a sealing resin having a sealed end face part that is a thermosetting resin. A cylindrical intermediate adapter is bonded and fixed to the sealed end face part with an opening into which a receptacle body of a connector housing is inserted. A resilient contact connected to a lead wire is caused to be in electrical contact with a copper foil trace terminal of the circuit board. The connector housing and the intermediate adapter are made of a thermoplastic resin resistant to crack failure, which improves handling capability for inserting and withdrawing a connector.Type: GrantFiled: July 18, 2016Date of Patent: August 15, 2017Assignee: Mitsubishi Electric CorporationInventors: Fumiaki Arimai, Shozo Kanzaki, Hiroyoshi Nishizaki
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Patent number: 9675444Abstract: Many modern implantable ophthalmic devices include electronic components, such as electro-active cells, that can leak harmful substances into the eye and/or surrounding tissue. In the implantable ophthalmic devices disclosed herein, electronic components are hermetically sealed within cavities formed by bonding together two or more glass wafers. Bonding the glass wafers together with laser fusion bonding, pressure bonding, or anodic bonding creates a seal that leaks at a rate of less than about 5×10?12 Pa m3s?1 when subjected to a helium leak test. Hermetically sealed feedthroughs formed of conductive material running through channels in the wafers provide electrical connections to components inside the sealed cavities. In some cases, the conductive material has a coefficient of thermal expansion (CTE) that is roughly equal to (e.g., within 10% of) the CTE of the glass wafers to minimize leakage due to thermally induced expansion and contraction of the conductive material and the glass wafer.Type: GrantFiled: March 13, 2015Date of Patent: June 13, 2017Assignee: ELENZA, INC.Inventors: Ronald D. Blum, Amitava Gupta, Jean-Noel Fehr, Jean-Christophe Roulet, Urban Schnell, Walter Doll, Roland Michaely
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Patent number: 9645615Abstract: A waterproof notebook computer includes a chassis, a flexible waterproof pad, a touchpad and a trigger switch. The chassis has a receiving space. The flexible waterproof pad is exposed from one surface of the chassis, and all edges of the flexible waterproof pad are connected to the chassis hermetically so that the receiving space of the chassis is isolated from the exterior of the chassis. The trigger switch is disposed inside the receiving space. The touchpad is disposed between the trigger switch and the flexible waterproof pad. When the touchpad is pressed towards the receiving space through the flexible waterproof pad, the flexible waterproof pad stretches to move the touchpad to trigger the trigger switch.Type: GrantFiled: November 6, 2015Date of Patent: May 9, 2017Assignee: Quanta Computer Inc.Inventors: Kun-Ho Lee, I-Hao Chen, Yu-Wen Chen, Hui-Ju Yang
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Patent number: 9625342Abstract: Apparatus having a hermetic seal that seals a portion of the apparatus, for example and without limitation, a portion having a MEMS sensor.Type: GrantFiled: January 31, 2014Date of Patent: April 18, 2017Assignee: DUNAN SENSING, LLCInventor: Tom T. Nguyen
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Patent number: 9627229Abstract: A semiconductor device has a substrate including an opening. A trench is formed over the substrate around the opening. An interconnect structure is formed in the trench. An underfill material is disposed over the interconnect structure. A first semiconductor die is disposed over the underfill material prior to curing the underfill material. An active region of the first semiconductor die is disposed over the opening in the substrate. The trench contains the outward flow of underfill material. Underfill material is blocked from flowing over unintended areas on the surface of substrate, into the opening in the substrate, and over sensors of the first semiconductor die. A second semiconductor die is disposed over the substrate. The trench is formed by a first and second dam or a first insulating layer. A second insulating layer is formed over the first insulating layer. A dam is formed over the second insulating layer.Type: GrantFiled: June 27, 2013Date of Patent: April 18, 2017Assignee: STATS ChipPAC Pte. Ltd.Inventors: Hoang Lan, Wang Zhenliang
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Patent number: 9592396Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.Type: GrantFiled: January 17, 2012Date of Patent: March 14, 2017Assignee: Second Sight Medical Products, Inc.Inventors: Robert J. Greenberg, Alfred E. Mann, Neil Talbot, Jerry Ok, Gaillard R. Nolan, Dau Min Zhou
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Patent number: 9478515Abstract: A semiconductor package may include a main substrate, a sub-substrate spaced apart from the main substrate by a gap, and a semiconductor chip disposed on the main substrate. The semiconductor package may include an interconnection member configured to connect the semiconductor chip to the sub-substrate and including twisted wires of a plurality of strands. The semiconductor package may include a main molding member covering the main substrate and the semiconductor chip, and a sub-molding member covering the sub-substrate. The semiconductor package may include a stress buffer layer configured to fill the gap between the main substrate and the sub-substrate, and surround the interconnection member.Type: GrantFiled: August 20, 2015Date of Patent: October 25, 2016Assignee: SK HYNIX INC.Inventor: Jung Tae Jeong
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Patent number: 9413152Abstract: A feed-through is provided that includes a flange and a first functional component. The flange has a through-opening in which the first functional component is arranged and is connected to the flange such that the through-opening is sealed. The first functional component has at least one deformation region, in which a recess is provided such that the mechanical stability of the first functional component is reduced in the deformation region. In this manner, the first functional element can be deformed in the deformation area when mechanical load is applied.Type: GrantFiled: February 12, 2014Date of Patent: August 9, 2016Assignee: SCHOTT AGInventors: Oliver Wolfgang Fritz, Josef Nisslbeck, Juergen Suttner, Thomas Fink
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Patent number: 9301583Abstract: A storage container includes a main body and a cover. The main body includes a first recessed portion and an outer edge portion. The first recessed portion has an opening portion and is bounded by a first bottom surface portion and a first peripheral wall portion including a first wall portion. The outer edge portion protrudes further than the first wall portion on an outer periphery side of the storage container with respect to the first wall portion. The first wall portion has a groove portion and at least one first hole portion. The groove portion is formed on a protruding end portion of the first wall portion in a position separated from an edge of the first recessed portion toward the outer edge portion. The at least one hole portion opens onto the protruding end portion, communicates with the groove portion and is separated from the first recessed portion.Type: GrantFiled: March 25, 2014Date of Patent: April 5, 2016Assignee: Brother Kogyo Kabushiki KaishaInventors: Yasutoshi Kano, Kazuma Hojo
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Patent number: 9148968Abstract: When a housing of a waterproof main terminal is fixed onto the outside surface of a case with a screw, a through hole is sealed with a seal surface of a packing pressed onto the outside surface of the case. Furthermore, the elastic force of the packing placed so as to be in tight contact with the whole circumference of the terminal ensures high waterproofing performance between the terminal and the housing, so the one packing can perform waterproofing both between the case and the housing and between the terminal and the housing.Type: GrantFiled: October 1, 2013Date of Patent: September 29, 2015Assignee: Mitsubishi Electric CorporationInventors: Mitsuo Sone, Hisakazu Yamane
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Patent number: 9001525Abstract: An electronic device includes a first cover, a double sided pressure sensitive adhesive (PSA) tape, a battery, and a second cover. The second cover is attached to the first cover. The battery is arranged between the first cover and the second cover. The second cover defines a groove. A shape of the groove is substantially same as a shape of the PSA tape. The PSA tape covers the groove. Thereby the PSA tape and the groove cooperatively form an air flowing channel having an inlet and an outlet. The battery is fixed to the second cover by the PSA tape. An adhesive force of the PSA tape applied between the battery and the second cover is decreasable by flowing air with temperature greater than a preset value through the air flowing channel so as to enable the battery to detach from the second cover.Type: GrantFiled: December 27, 2012Date of Patent: April 7, 2015Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventor: Yan-Bang Cao
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Patent number: 8957309Abstract: A measurement apparatus is disclosed. The measurement apparatus includes a lid configured to be removably affixed to a case. The lid is formed from a substrate composed of a first material. An interior surface of the lid includes a surface coating of a second material. A raised seal is affixed to the substrate and extends beyond the interior surface in a direction orthogonal to the interior surface. The raised seal includes an elastic deformable layer adjacent to the substrate. The raised seal also includes a surface conforming layer configured such that, when the lid is affixed to the case, the surface conforming layer is adjacent to the case along a side opposite the elastic deformable layer. The surface conforming layer is composed of a material of a yield strength less than a normal force generated by fixation of the lid to the case.Type: GrantFiled: July 28, 2011Date of Patent: February 17, 2015Assignee: National Instruments CorporationInventors: Ron Jay Barnett, Gregory Stephen Gonzales
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Patent number: 8946548Abstract: The present invention relates to prohibiting water ingress in enclosures designed to protect electronics or other stored objects from damage that would occur if the protected stored objects were submerged in water or other liquids. More particularly the present invention, a water ingress prevention enclosure eliminates the need for watertight doors and other sealing gaskets by utilizing an opening in the lowest portion of the enclosure to allow rising water to pressurize the ambient gas trapped in the enclosure thus forming a pressurized chamber to which liquid cannot rise. Embodiments of the invention include a system, apparatus, method and computer implemented code to enable monitoring and storage of one or more stored objects in a liquid-free environment.Type: GrantFiled: March 17, 2011Date of Patent: February 3, 2015Inventor: Dean Sanders
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Publication number: 20140367162Abstract: A universal electrical box which includes a body having at least one opening for receiving an electrical device. The device can also include at least one mounting bracket coupled to the body, and at least one frame configured to be coupled to the at least one body. In addition there is at least one duplex electrical mounting plate configured to couple to the at least one frame. In this case, the duplex electrical mounting plate is configured to revive a duplex electrical device. In addition, there is at least one sealing gasket configured to he coupled to the body between the at least one frame and the body. This design allows for a universal configuration which allows for multiple different types of electrical devices to be coupled to the enclosure.Type: ApplicationFiled: September 2, 2014Publication date: December 18, 2014Applicant: LEVITON MANUFACTURING CO., INC.Inventor: Cosmo Castaldo
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Patent number: 8867222Abstract: An electric control device includes: an accommodation element (10) having an opening and a bottom; a cover element (20) for covering the opening of the accommodation element (10) so that accommodation space (15) is formed between the cover element (20) and the accommodation element (10); a hook (11) integrated with the accommodation element (10) for swaging the cover element (20); and a control element (30) formed in the accommodation space (15), wherein an electric element (32-35) is arranged on a substrate (31) so that the control element (30) is prepared. The substrate (31) includes a notch concavity (311) on a periphery of the substrate (31) so as to face the hook (11).Type: GrantFiled: September 27, 2010Date of Patent: October 21, 2014Assignee: Denso CorporationInventor: Shinsuke Oota
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Publication number: 20140291131Abstract: An engine start switch includes a substrate on which electronic components are mounted, a case which is formed in a cylindrical shape by a peripheral wall portion surrounding the substrate and of which at least one end portion is opened, and a support member that supports the substrate in the case and extends toward the open end of the case from one end portion thereof supporting the substrate. The support member includes an outer surface that faces an inner surface of the peripheral wall portion with a gap interposed therebetween, and a gap at the one end portion of the support member is wider than a gap at other portions excluding at least the one end of the support member.Type: ApplicationFiled: December 16, 2013Publication date: October 2, 2014Applicant: ALPS ELECTRIC CO., LTD.Inventor: Tetsuya Sago
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Patent number: 8835770Abstract: An electronic component that includes an electronic component body, sealing members sealing the electronic component body, and adhesive layers which adhere the electronic component body and the sealing members, respectively. Between the electronic component body and the sealing members, sealed spaces are formed, respectively. The adhesive layers each contain organic fillers and inorganic fillers. The organic fillers are in contact with both the electronic component body and the sealing members. The inorganic fillers each have a minimum particle diameter smaller than the thickness of each of the adhesive layers. When the adhesive layers are viewed in a thickness direction thereof, the inorganic fillers are provided between the organic fillers and the electronic component body and between the organic fillers and each of the sealing members.Type: GrantFiled: October 1, 2012Date of Patent: September 16, 2014Assignee: Murata Manufacturing Co., Ltd.Inventors: Junji Oyama, Takamasa Kuboki, Yasuharu Matsui, Muneyuki Daidai
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Patent number: 8835777Abstract: An electronic device having a slide cover slidably attached in an openable/closable manner to a device case, and conceals a recording paper ejection opening in the device case; a waterproof gasket provided on either one of the slide cover and the device case in a part positioned in periphery of the recording paper ejection opening, and arranged between the slide cover and the device case surrounding the recording paper ejection opening, when the slide cover conceals the recording paper ejection opening; and a guide member which does not come in contact with the waterproof gasket on another side of the slide cover and the device case with which the waterproof gasket meets face to face during a sliding motion of the slide cover, and the waterproof gasket presses on both sides between the slide cover and the device case when the sliding motion is completed.Type: GrantFiled: January 29, 2013Date of Patent: September 16, 2014Assignee: Casio Computer Co., LtdInventor: Hiromasu Meguro
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Patent number: 8816221Abstract: A low resistance pathway includes a flexible member, a surface interfacing the flexible member, a sealing feature, and a fastener. The sealing feature forms an interior edge of at least one of the flexible member and the surface. The fastener compresses the flexible member to contact the surface.Type: GrantFiled: February 29, 2012Date of Patent: August 26, 2014Assignee: Hamilton Sundstrand CorporationInventors: Nathan A. Berry, Aaron M. Finke, Eric A. Carter
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Patent number: 8803004Abstract: In one embodiment, an apparatus includes a cover panel. An adhesive layer is coupled to the cover panel. A perimeter of the adhesive layer forms at least a portion of a gasket seal extending substantially perpendicular to an inner surface of the cover panel. An inner surface of the gasket seal defines an edge of a channel. The apparatus also includes a substrate coupled to the adhesive layer. The substrate includes an outer surface having disposed thereon a connection pad region and drive or sense electrodes. The drive or sense electrodes are disposed between the substrate and the cover panel. At least a portion of the channel is disposed between the gasket seal and the connection pad region. The apparatus further includes a flexible printed circuit (FPC) electrically coupled by the connection pad region to the drive or sense electrodes. A first portion of the FPC extends through the channel.Type: GrantFiled: December 31, 2012Date of Patent: August 12, 2014Assignee: Atmel CorporationInventor: David Brent Guard
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Patent number: 8633409Abstract: There is provided a waterproof structure of a wire leading portion. A rubber cap is assembled with wire connected to a circuit board. A housing accommodates the circuit board. A packing holder is accommodated next to the circuit board through an opening of the housing. A packing is assembled on an outer periphery of the packing holder to be in close contact with an inner surface of the housing. The packing holder includes: a rubber cap secession prevention wall formed in a direction that crosses an accommodation direction; a wire insertion hole formed to penetrate the wall; and a rubber cap accommodation chamber communicating with the wire insertion hole and continuing to an inner surface of the wall. The inner surface of the wall and a cross-section of the circuit board are formed to hold the rubber cap that is accommodated in the rubber cap accommodation chamber.Type: GrantFiled: March 9, 2012Date of Patent: January 21, 2014Assignee: Yazaki CorporationInventor: Masahiro Sawayanagi
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Patent number: 8604361Abstract: A thermally insulated electronic component package and an instrument suitable for process conditions in a high temperature environment are disclosed. The component package includes a thin electronic component, a thermally insulating outer enclosure, and an insert made of a thermally insulating material that is sized and shaped to fit within the outer enclosure. The insert includes an inner cavity sized and shaped to receive the thin electronic component. In the instrument, the outer enclosure can be configured to mount to a substrate.Type: GrantFiled: January 20, 2010Date of Patent: December 10, 2013Assignee: KLA-Tencor CorporationInventors: Mei Sun, Pascal Champagne
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Patent number: 8604360Abstract: A sealing body for a cable sleeve for an optical fiber cable is disclosed. The sealing body has a central, cylindrical sealing body segment. The central, cylindrical sealing body segment has, on an outer casing surface, a plurality of cutouts distributed over the circumference thereof, in each case one cylinder-segment-like sealing body segment being capable of being inserted into each of the cutouts of the central sealing body segment, and in each case one cable insertion opening for receiving and individually sealing off in each case one single cable being formed between the central sealing body segment and each cylinder-segment-like sealing body segment. Each of the cylinder-segment-like sealing body segment has a gel-like sealing element, which can be compressed individually independently of the sealing elements of other cylinder-segment-like sealing body segments in order to individually seal off the cable inserted into the respective cable insertion opening.Type: GrantFiled: October 10, 2008Date of Patent: December 10, 2013Assignee: CCS Technology, Inc.Inventors: Jens Knorr, Andreas M. Eichstädt, Thorsten Müller
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Patent number: 8598471Abstract: There is provided an electric storage device having a novel fastening structure of a plastic member which can reduce cost with a simple configuration. An electric storage device according to this invention includes an electrode assembly, a case housing the electrode assembly, a plastic member arranged at an outer surface of the case, the plastic member having a joining surface facing the outer surface of the case, and an external terminal supported by the plastic member and electrically connected to the electrode assembly. The plastic member is a synthetic resin containing an inorganic fiber and is bonded to the outer surface of the case with the inorganic fiber exposed at the joining surface.Type: GrantFiled: December 23, 2011Date of Patent: December 3, 2013Assignee: GS Yuasa International Ltd.Inventors: Katsuhiko Okamoto, Shinsuke Yoshitake, Jun Nakamura, Masakazu Tsutsumi, Nobuyuki Naganawa
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Patent number: 8593817Abstract: A power semiconductor module is provided in which power semiconductor chips with an aluminum-based chip metallization and power semiconductor chips with a copper-based chip metallization are included in the same module, and operated at different barrier-layer temperatures during use.Type: GrantFiled: September 30, 2010Date of Patent: November 26, 2013Assignee: Infineon Technologies AGInventors: Reinhold Bayerer, Thilo Stolze
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Patent number: 8575499Abstract: To provide a seal structure having seal members which can be easily inserted into insertion holes of a housing, and achieve an excellent sealing performance of the seal members, the seal structure is comprised of a housing provided with insertion holes to which a flexible wiring substrate is inserted, and seal members which are integrally formed on the flexible wiring substrate are made of a rubber elastic material in a bush-shape, and hermetically seal gaps between the insertion holes and the flexible wiring substrate, wherein projected portions are provided on parts of the flexible wiring substrate at positions where the seal members are integrally formed.Type: GrantFiled: April 26, 2010Date of Patent: November 5, 2013Assignee: Nippon Mektron, Ltd.Inventors: Takahiro Hayashi, Keiichi Miyajima
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Patent number: 8541697Abstract: A dustproof structure is used in an electronic device, which includes a housing and a display panel. The dustproof structure includes a dustproof section and a first adhesive section. The dustproof section is located and received in the housing. The first adhesive section is fixed on the one side of the dustproof section, and the display panel is fixed on the dustproof structure by the first adhesive section and is assembled to the housing. The dustproof structure fills gaps between the housing and the display panel.Type: GrantFiled: February 22, 2011Date of Patent: September 24, 2013Assignee: FIH (Hong Kong) LimitedInventor: Chih-Wei Chang
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Patent number: RE49645Abstract: A method of manufacturing a light-emitting device includes providing a base body including a base section; fixing a plurality of semiconductor laser elements on an upper surface of the base section; and fixing an optical member to the base body, the optical member including a plurality of lens sections, and a non-lens section disposed at a periphery of the plurality of lens sections in a top view. In the step of fixing the optical member: the optical member is arranged above the base body; (i) an inclination and a height of the optical member are adjusted after interposing an adhesive between the base body and the non-lens section, or (ii) an adhesive is interposed between the base body and the non-lens section after adjusting the inclination and the height of the optical member; and subsequently, the adhesive is cured to fix the optical member to the base body.Type: GrantFiled: January 11, 2021Date of Patent: September 5, 2023Assignee: NICHIA CORPORATIONInventors: Soichiro Miura, Seiji Kiyota, Eiichiro Okahisa