Seal Patents (Class 174/564)
  • Patent number: 11600447
    Abstract: A film capacitor includes a main body portion shaped in a rectangular prism, and a pair of external electrodes. The main body portion includes dielectric films and metallic films which are laminated, and includes a pair of first faces opposed to each other, a pair of first side faces opposed to each other, and a pair of second side faces opposed to each other, the pair of first side faces connecting the pair of first faces, the pair of second side faces connecting the pair of first faces. The pair of external electrodes is located on the pair of first side faces. The second side faces are covered with an insulating cover layer. The film capacitor includes a grease-containing portion between the second side face and the insulating cover layer, the grease-containing portion including an insulating grease.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: March 7, 2023
    Assignee: KYOCERA CORPORATION
    Inventor: Tatsuya Tateishi
  • Patent number: 11485670
    Abstract: A glass wafer has an internal surface and an opposing external surface separated by a wafer thickness. A hermetic, electrically conductive feedthrough extends through the wafer from the internal surface to the opposing external surface. The feedthrough includes a feedthrough member having an inner face exposed along the internal surface for electrically coupling to an electrical circuit. The feedthrough member extends from the inner face partially through the wafer thickness to an exteriorly-facing outer face hermetically embedded within the wafer.
    Type: Grant
    Filed: November 4, 2019
    Date of Patent: November 1, 2022
    Assignee: Medtronic, Inc.
    Inventors: David A. Ruben, Michael S. Sandlin
  • Patent number: 11257799
    Abstract: An optical sensor module includes: (1) a lid defining a first chamber and a second chamber isolated from the first chamber; (2) a light emitting component disposed within the first chamber; and (3) a light sensing component disposed within the second chamber; wherein the lid includes a capping substrate and a top of the first chamber and a top of the second chamber are demarcated by the capping substrate, wherein the capping substrate defines a first penetrating hole at the top of the first chamber and a first runner connecting a side wall of the first penetrating hole, and wherein a first lens or a first transmissive panel is formed or disposed in the first penetrating hole and has an extension formed or disposed in the first runner connecting the side wall of the first penetrating hole.
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: February 22, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Hsin-Ying Ho
  • Patent number: 11049777
    Abstract: A frame lid for use with a semiconductor package is disclosed. First, a mask is applied to a top surface of the lid and over a central area of the top surface to define a peripheral area. Next, a seal ring is formed by metallizing the peripheral area and the sidewall of the plate. The mask can then be removed obtain the frame lid. Next, a solder preform can be attached to the seal ring. This reduces pullback and shrinkage of the metallized layer, while lowering the manufacturing cost and process times.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: June 29, 2021
    Assignee: MATERION CORPORATION
    Inventor: Ramesh Kothandapani
  • Patent number: 11044550
    Abstract: A speaker device including a first speaker cover, a second speaker cover, a speaker housed by the first speaker cover and the second speaker cover, and a monolithic, one-piece vibration damping structure disposed between the first speaker cover and the second speaker cover. The first speaker cover and the second speaker cover are made of a first material, and the monolithic, one-piece vibration damping structure is made of a second material that is different from the first material.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: June 22, 2021
    Assignee: Vanson Electronics (Nanhai) Co., Ltd.
    Inventors: Ching-Shan Hsu, Hao-Chien Hsu
  • Patent number: 11031309
    Abstract: A cover lid for use with a semiconductor package is disclosed. First, a polyamide mask is applied to one surface of the lid plate. Next, the exposed areas of the surface, as well as the sides of the lid plate, are metallized. The polyamide mask can then be removed. This reduces pullback and shrinkage of the metallized layer, while lowering the manufacturing cost and process times.
    Type: Grant
    Filed: May 21, 2015
    Date of Patent: June 8, 2021
    Assignee: MATERION CORPORATION
    Inventor: Ramesh Kothandapani
  • Patent number: 10667425
    Abstract: An air containment structure includes walls and an aisle between the walls. Computing devices are mounted to the walls of the air containment structure and the air containment structure separates air within the aisle of the air containment structure from other air in a facility. The walls of the air containment structure are configured to support respective weights of the computing devices mounted to the air containment structure. In some embodiments, infrastructure systems, such as power bus bars, cable trays, and cooling ducts are mounted to and supported by the air containment structure.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: May 26, 2020
    Assignee: Amazon Technologies, Inc.
    Inventors: Brock Robert Gardner, Michael P. Czamara
  • Patent number: 10547060
    Abstract: Methods, systems, and devices for powering downhole tools with an electrochemical device are provided. A downhole power system includes an electrochemical device having an anode and a cathode. The power system includes a downhole tool electrically communicating with the electrochemical device to provide electrical power to the downhole tool. The electrochemical device is activated when immersed in a downhole fluid and inactive when not immersed in the downhole fluid, the downhole fluid functioning as an electrolyte.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: January 28, 2020
    Assignee: SCHLUMBERGER TECHNOLOGY CORPORATION
    Inventor: Vladimir Shitikov
  • Patent number: 10439358
    Abstract: A method of manufacturing a light-emitting device includes providing a base body including a base section; fixing a plurality of semiconductor laser elements on an upper surface of the base section; and fixing an optical member to the base body, the optical member including a plurality of lens sections, and a non-lens section disposed at a periphery of the plurality of lens sections in a top view. In the step of fixing the optical member: the optical member is arranged above the base body; (i) an inclination and a height of the optical member are adjusted after interposing an adhesive between the base body and the non-lens section, or (ii) an adhesive is interposed between the base body and the non-lens section after adjusting the inclination and the height of the optical member; and subsequently, the adhesive is cured to fix the optical member to the base body.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: October 8, 2019
    Assignee: NICHIA CORPORATION
    Inventors: Soichiro Miura, Seiji Kiyota, Eiichiro Okahisa
  • Patent number: 10356917
    Abstract: Provided is a display device. A display device according to the present invention comprises a display panel; a module cover disposed on the rear surface of the display panel and having at least one or more fastening holes; and a cushion covering the vicinity of the fastening hole disposed on the front surface of the module cover, wherein the vicinity of the fastening hole includes a plurality of layers and the cushion is disposed on top of the plurality of layers. According to the present invention, a module cover cannot be easily bent as a cushion is disposed in the vicinity of a fastening hole.
    Type: Grant
    Filed: April 17, 2017
    Date of Patent: July 16, 2019
    Assignee: LG ELECTRONICS INC.
    Inventors: Hayun Lee, Cheolsoo Kim, Bumgi Min
  • Patent number: 10335603
    Abstract: Medical devices include stimulation and/or sensing circuitry that is interconnected to electrical components by a flexible circuit body having exposed portions of circuit traces that are attached to electrical contacts of the electrical components. Each circuit trace may span a separate window formed in an insulative body of the flexible circuit body, or a plurality of circuit traces may span a single window or may be freely extending from the insulative body. The exposed portion of the circuit trace may be plated with a conductive metal and then attached to the electrical contact of the electrical component. The flexible circuit body may be an extension from a flexible electrical circuit board containing the circuit. The circuit may be present on a circuit board that includes electrical contacts and where the flexible circuit body has exposed portions of circuit traces attached to the electrical contacts of the circuit board.
    Type: Grant
    Filed: July 23, 2016
    Date of Patent: July 2, 2019
    Assignee: MEDTRONIC, INC.
    Inventors: Gerald G. Lindner, William C. Phillips, Dominique Piguet, Daniel T. Pyne, Micah A. Litow, James Strom, Mark G. Wosmek
  • Patent number: 10297408
    Abstract: An enclosure for the operating mechanism of a circuit breaker, this mechanism including a main shaft and secondary shafts, and a spring to actuate the mechanism. This enclosure includes a parallelepiped base having an open face and including a bottom wall opposite to its open face, this bottom wall having holes to receive bearings carrying the shafts; a supporting part including a main wall to be mounted at the open face of the base, the main wall including holes to receive bearings carrying the other extremities of the shafts; a cover to close the supporting part.
    Type: Grant
    Filed: April 18, 2016
    Date of Patent: May 21, 2019
    Assignee: GENERAL ELECTRIC TECHNOLOGY GMBH
    Inventors: Daniel Kalin, Peter Von Allmen
  • Patent number: 10254635
    Abstract: There is provided a light source unit comprising a sealing member, a holding member on which an abutment surface is formed, which has an engaging portion and which holds a part, a case on which an abutted surface is formed which is brought into abutment with the abutment surface via the sealing member, which has an engaged portion which is brought into engagement with the engaging portion and which holds the holding member, wherein the abutment surface of the holding member and the abutted surface of the case face each other and are inclined relative to a holding surface which holds the part, and the abutted surface of the case is inclined so as to face a side where the holding member is inserted.
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: April 9, 2019
    Assignee: CASIO COMPUTER CO., LTD.
    Inventors: Toshifumi Kase, Hirofumi Fujikura
  • Patent number: 10250186
    Abstract: A detachable split solar power optimization junction box module has split junction boxes (1A, 1B, 1C) each having a base part and an upper cover part. String ports (11) are provided in a base (10) of the base part for electrically connecting a string of a photovoltaic module (40). The upper cover part has an upper cover (20) with a circuit board (21) provided therein. The circuit board (21) has a power optimization module connected with electrical connection pieces (22). The electrical connection pieces (22) are detachably inserted into the string ports (11) so that the power optimization module performs power optimization on the string of the photovoltaic module. The split junction boxes (1A, 1B, 1C) are used for power optimization at the string level. The power optimization module is integrated in the upper cover part that detachably connects with the base part for convenience of installation and maintenance.
    Type: Grant
    Filed: December 11, 2017
    Date of Patent: April 2, 2019
    Assignee: Jiangsu Enmagic Energy Co., Ltd.
    Inventors: Zheng Fang, Jian Zuo, Jian-Bin Tong, Ke Wang
  • Patent number: 10244649
    Abstract: In various implementations, an enclosure may be utilized to secure component(s) for a variety of applications, such as creating a communications network. For example, an enclosure may be utilized to secure electronic component(s). The enclosure may include shell(s) and a frame coupled to create a seal that inhibits the components in the enclosure from being exposed to fluids and/or particles. The shell(s) or portions thereof may not cause substantial signal loss.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: March 26, 2019
    Assignee: AmpThink, LLC
    Inventor: William Carl Anderson, III
  • Patent number: 10201106
    Abstract: An enclosure with a substantially continuous seal about its perimeter for protecting electronic components of a model vehicle, comprising a housing with one or more walls at least partially surrounding the electronic components, a cover having one or more walls surrounding the perimeter of the housing, and one or more seal members interposed between the housing perimeter walls and the cover perimeter walls, wherein the cover perimeter walls are configured to contact the seal members against the housing perimeter walls to create a watertight barrier configured to provide protection ranging from water-resistant to waterproof.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: February 5, 2019
    Assignee: TRAXXAS LP
    Inventors: Jory Sprowl, Roy Perryman, Otto Karl Allmendinger
  • Patent number: 10120407
    Abstract: This sealed joystick for a machine comprises a function block, an outer shell formed by joining two rigid half-shells, these half-shells tightly enclosing the function block, each half-shell comprising a joint surface for this purpose all along its perimeter following a three-dimensional path which terminates on itself and which extends in the three dimensions of space, a sealing element comprising a one-piece block of elastomer material combining a sealing cord and a ring seal of different transverse cross-section within this same block to ensure that the joint surfaces are watertight.
    Type: Grant
    Filed: July 21, 2016
    Date of Patent: November 6, 2018
    Assignee: Crouzet Automatismes
    Inventors: Ludovic Niguet, Thierry Vinard, Fabien Ville, Fabien Pelaez
  • Patent number: 10039196
    Abstract: A portable device of the present invention includes an exterior member of which an inside is hollow, a plurality of support parts provided in the inside of the exterior member so as to stand up in a direction perpendicular to a front or back surface of the exterior member, a plurality of buffer members provided around each of the plurality of support parts, and an inner member kept in the inside of the exterior member in parallel with the front or back surface of the exterior member without being in contact with the exterior member by the plurality of buffer members.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: July 31, 2018
    Assignee: CASIO COMPUTER CO., LTD.
    Inventors: Hiromasu Meguro, Yasunori Chiba, Shinya Okumura
  • Patent number: 9970785
    Abstract: An in-vehicle detection device includes a cable that includes a plurality of insulated electric wires that are formed by covering a central conductor with an insulator, and a sheath that collectively covers the insulated electric wires, a sensor that includes a sensor main body including a detection element, and a lead wire that is led from the sensor main body and connected to the central conductor, and a fixing member that includes a tubular portion to house the sensor and fixes the sensor and the cable to each other. The fixing member holds the insulated electric wires that are exposed from the sheath in a bent state thereof between an end of the sheath and the lead wire. A central axis of a part of the sheath that is held by the fixing member intersects with a central axis of the tubular portion at a predetermined angle.
    Type: Grant
    Filed: December 8, 2014
    Date of Patent: May 15, 2018
    Assignee: HITACHI METALS, LTD.
    Inventors: Yukio Ikeda, Shinya Oeda
  • Patent number: 9935416
    Abstract: A method of assembling a connector module is provided. The method of assembling includes abutting an engagement surface of a connector extending from a circuit board with corresponding engagement surfaces of first and second support members disposed within a housing. The method of assembling includes resisting movement of the connector towards a base of the housing at a first end of the connector through a substantially perpendicular extension from at least one of the first and second support members. The method of assembling includes constraining lateral movement of the connector through engaging a receptacle formed on a second end of the connector with a pin of the first support member.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: April 3, 2018
    Assignee: Rockwell Automation Asia Pacific Business Center Pte. Ltd.
    Inventor: Soon Seng Kang
  • Patent number: 9933810
    Abstract: The present invention is directed to a housing unit, which allows an electronic device such as a portable digital audio player to be substantially hermetically sealed within an audio device. The electronic device is controllable by a user while housed with the housing unit. The audio device is able to be used in a vehicle such as a car, a camper, or a boat or in other common consumer products.
    Type: Grant
    Filed: October 1, 2013
    Date of Patent: April 3, 2018
    Assignee: AQUATIC AV, INC.
    Inventor: Robert Louis Fils
  • Patent number: 9793033
    Abstract: There is provided a resistor in which a first resistive part of a resistive element that electrically conducts between a pair of electrodes formed on either end of an insulating substrate has a meandering pattern meandering on the substrate surface and a swelling pattern that has a form in which a part of the meandering pattern swells out from the stroke width of the meandering pattern, a second resistive part that is electrically connected in series to the first resistive part is shorter than the entire length of the first resistive part, and has a wider width than the stroke width of the meandering pattern, and a trimming groove is formed in at least either the swelling pattern or the second resistive part. This can improve resistance accuracy and provide a high voltage resistor with high withstand voltage property.
    Type: Grant
    Filed: October 23, 2015
    Date of Patent: October 17, 2017
    Assignee: KOA Corporation
    Inventor: Hiroyuki Fukao
  • Patent number: 9735496
    Abstract: A circuit board with circuit components mounted thereon is integrally molded with a sealing resin having a sealed end face part that is a thermosetting resin. A cylindrical intermediate adapter is bonded and fixed to the sealed end face part with an opening into which a receptacle body of a connector housing is inserted. A resilient contact connected to a lead wire is caused to be in electrical contact with a copper foil trace terminal of the circuit board. The connector housing and the intermediate adapter are made of a thermoplastic resin resistant to crack failure, which improves handling capability for inserting and withdrawing a connector.
    Type: Grant
    Filed: July 18, 2016
    Date of Patent: August 15, 2017
    Assignee: Mitsubishi Electric Corporation
    Inventors: Fumiaki Arimai, Shozo Kanzaki, Hiroyoshi Nishizaki
  • Patent number: 9675444
    Abstract: Many modern implantable ophthalmic devices include electronic components, such as electro-active cells, that can leak harmful substances into the eye and/or surrounding tissue. In the implantable ophthalmic devices disclosed herein, electronic components are hermetically sealed within cavities formed by bonding together two or more glass wafers. Bonding the glass wafers together with laser fusion bonding, pressure bonding, or anodic bonding creates a seal that leaks at a rate of less than about 5×10?12 Pa m3s?1 when subjected to a helium leak test. Hermetically sealed feedthroughs formed of conductive material running through channels in the wafers provide electrical connections to components inside the sealed cavities. In some cases, the conductive material has a coefficient of thermal expansion (CTE) that is roughly equal to (e.g., within 10% of) the CTE of the glass wafers to minimize leakage due to thermally induced expansion and contraction of the conductive material and the glass wafer.
    Type: Grant
    Filed: March 13, 2015
    Date of Patent: June 13, 2017
    Assignee: ELENZA, INC.
    Inventors: Ronald D. Blum, Amitava Gupta, Jean-Noel Fehr, Jean-Christophe Roulet, Urban Schnell, Walter Doll, Roland Michaely
  • Patent number: 9645615
    Abstract: A waterproof notebook computer includes a chassis, a flexible waterproof pad, a touchpad and a trigger switch. The chassis has a receiving space. The flexible waterproof pad is exposed from one surface of the chassis, and all edges of the flexible waterproof pad are connected to the chassis hermetically so that the receiving space of the chassis is isolated from the exterior of the chassis. The trigger switch is disposed inside the receiving space. The touchpad is disposed between the trigger switch and the flexible waterproof pad. When the touchpad is pressed towards the receiving space through the flexible waterproof pad, the flexible waterproof pad stretches to move the touchpad to trigger the trigger switch.
    Type: Grant
    Filed: November 6, 2015
    Date of Patent: May 9, 2017
    Assignee: Quanta Computer Inc.
    Inventors: Kun-Ho Lee, I-Hao Chen, Yu-Wen Chen, Hui-Ju Yang
  • Patent number: 9625342
    Abstract: Apparatus having a hermetic seal that seals a portion of the apparatus, for example and without limitation, a portion having a MEMS sensor.
    Type: Grant
    Filed: January 31, 2014
    Date of Patent: April 18, 2017
    Assignee: DUNAN SENSING, LLC
    Inventor: Tom T. Nguyen
  • Patent number: 9627229
    Abstract: A semiconductor device has a substrate including an opening. A trench is formed over the substrate around the opening. An interconnect structure is formed in the trench. An underfill material is disposed over the interconnect structure. A first semiconductor die is disposed over the underfill material prior to curing the underfill material. An active region of the first semiconductor die is disposed over the opening in the substrate. The trench contains the outward flow of underfill material. Underfill material is blocked from flowing over unintended areas on the surface of substrate, into the opening in the substrate, and over sensors of the first semiconductor die. A second semiconductor die is disposed over the substrate. The trench is formed by a first and second dam or a first insulating layer. A second insulating layer is formed over the first insulating layer. A dam is formed over the second insulating layer.
    Type: Grant
    Filed: June 27, 2013
    Date of Patent: April 18, 2017
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Hoang Lan, Wang Zhenliang
  • Patent number: 9592396
    Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
    Type: Grant
    Filed: January 17, 2012
    Date of Patent: March 14, 2017
    Assignee: Second Sight Medical Products, Inc.
    Inventors: Robert J. Greenberg, Alfred E. Mann, Neil Talbot, Jerry Ok, Gaillard R. Nolan, Dau Min Zhou
  • Patent number: 9478515
    Abstract: A semiconductor package may include a main substrate, a sub-substrate spaced apart from the main substrate by a gap, and a semiconductor chip disposed on the main substrate. The semiconductor package may include an interconnection member configured to connect the semiconductor chip to the sub-substrate and including twisted wires of a plurality of strands. The semiconductor package may include a main molding member covering the main substrate and the semiconductor chip, and a sub-molding member covering the sub-substrate. The semiconductor package may include a stress buffer layer configured to fill the gap between the main substrate and the sub-substrate, and surround the interconnection member.
    Type: Grant
    Filed: August 20, 2015
    Date of Patent: October 25, 2016
    Assignee: SK HYNIX INC.
    Inventor: Jung Tae Jeong
  • Patent number: 9413152
    Abstract: A feed-through is provided that includes a flange and a first functional component. The flange has a through-opening in which the first functional component is arranged and is connected to the flange such that the through-opening is sealed. The first functional component has at least one deformation region, in which a recess is provided such that the mechanical stability of the first functional component is reduced in the deformation region. In this manner, the first functional element can be deformed in the deformation area when mechanical load is applied.
    Type: Grant
    Filed: February 12, 2014
    Date of Patent: August 9, 2016
    Assignee: SCHOTT AG
    Inventors: Oliver Wolfgang Fritz, Josef Nisslbeck, Juergen Suttner, Thomas Fink
  • Patent number: 9301583
    Abstract: A storage container includes a main body and a cover. The main body includes a first recessed portion and an outer edge portion. The first recessed portion has an opening portion and is bounded by a first bottom surface portion and a first peripheral wall portion including a first wall portion. The outer edge portion protrudes further than the first wall portion on an outer periphery side of the storage container with respect to the first wall portion. The first wall portion has a groove portion and at least one first hole portion. The groove portion is formed on a protruding end portion of the first wall portion in a position separated from an edge of the first recessed portion toward the outer edge portion. The at least one hole portion opens onto the protruding end portion, communicates with the groove portion and is separated from the first recessed portion.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: April 5, 2016
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventors: Yasutoshi Kano, Kazuma Hojo
  • Patent number: 9148968
    Abstract: When a housing of a waterproof main terminal is fixed onto the outside surface of a case with a screw, a through hole is sealed with a seal surface of a packing pressed onto the outside surface of the case. Furthermore, the elastic force of the packing placed so as to be in tight contact with the whole circumference of the terminal ensures high waterproofing performance between the terminal and the housing, so the one packing can perform waterproofing both between the case and the housing and between the terminal and the housing.
    Type: Grant
    Filed: October 1, 2013
    Date of Patent: September 29, 2015
    Assignee: Mitsubishi Electric Corporation
    Inventors: Mitsuo Sone, Hisakazu Yamane
  • Patent number: 9001525
    Abstract: An electronic device includes a first cover, a double sided pressure sensitive adhesive (PSA) tape, a battery, and a second cover. The second cover is attached to the first cover. The battery is arranged between the first cover and the second cover. The second cover defines a groove. A shape of the groove is substantially same as a shape of the PSA tape. The PSA tape covers the groove. Thereby the PSA tape and the groove cooperatively form an air flowing channel having an inlet and an outlet. The battery is fixed to the second cover by the PSA tape. An adhesive force of the PSA tape applied between the battery and the second cover is decreasable by flowing air with temperature greater than a preset value through the air flowing channel so as to enable the battery to detach from the second cover.
    Type: Grant
    Filed: December 27, 2012
    Date of Patent: April 7, 2015
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Yan-Bang Cao
  • Patent number: 8957309
    Abstract: A measurement apparatus is disclosed. The measurement apparatus includes a lid configured to be removably affixed to a case. The lid is formed from a substrate composed of a first material. An interior surface of the lid includes a surface coating of a second material. A raised seal is affixed to the substrate and extends beyond the interior surface in a direction orthogonal to the interior surface. The raised seal includes an elastic deformable layer adjacent to the substrate. The raised seal also includes a surface conforming layer configured such that, when the lid is affixed to the case, the surface conforming layer is adjacent to the case along a side opposite the elastic deformable layer. The surface conforming layer is composed of a material of a yield strength less than a normal force generated by fixation of the lid to the case.
    Type: Grant
    Filed: July 28, 2011
    Date of Patent: February 17, 2015
    Assignee: National Instruments Corporation
    Inventors: Ron Jay Barnett, Gregory Stephen Gonzales
  • Patent number: 8946548
    Abstract: The present invention relates to prohibiting water ingress in enclosures designed to protect electronics or other stored objects from damage that would occur if the protected stored objects were submerged in water or other liquids. More particularly the present invention, a water ingress prevention enclosure eliminates the need for watertight doors and other sealing gaskets by utilizing an opening in the lowest portion of the enclosure to allow rising water to pressurize the ambient gas trapped in the enclosure thus forming a pressurized chamber to which liquid cannot rise. Embodiments of the invention include a system, apparatus, method and computer implemented code to enable monitoring and storage of one or more stored objects in a liquid-free environment.
    Type: Grant
    Filed: March 17, 2011
    Date of Patent: February 3, 2015
    Inventor: Dean Sanders
  • Publication number: 20140367162
    Abstract: A universal electrical box which includes a body having at least one opening for receiving an electrical device. The device can also include at least one mounting bracket coupled to the body, and at least one frame configured to be coupled to the at least one body. In addition there is at least one duplex electrical mounting plate configured to couple to the at least one frame. In this case, the duplex electrical mounting plate is configured to revive a duplex electrical device. In addition, there is at least one sealing gasket configured to he coupled to the body between the at least one frame and the body. This design allows for a universal configuration which allows for multiple different types of electrical devices to be coupled to the enclosure.
    Type: Application
    Filed: September 2, 2014
    Publication date: December 18, 2014
    Applicant: LEVITON MANUFACTURING CO., INC.
    Inventor: Cosmo Castaldo
  • Patent number: 8867222
    Abstract: An electric control device includes: an accommodation element (10) having an opening and a bottom; a cover element (20) for covering the opening of the accommodation element (10) so that accommodation space (15) is formed between the cover element (20) and the accommodation element (10); a hook (11) integrated with the accommodation element (10) for swaging the cover element (20); and a control element (30) formed in the accommodation space (15), wherein an electric element (32-35) is arranged on a substrate (31) so that the control element (30) is prepared. The substrate (31) includes a notch concavity (311) on a periphery of the substrate (31) so as to face the hook (11).
    Type: Grant
    Filed: September 27, 2010
    Date of Patent: October 21, 2014
    Assignee: Denso Corporation
    Inventor: Shinsuke Oota
  • Publication number: 20140291131
    Abstract: An engine start switch includes a substrate on which electronic components are mounted, a case which is formed in a cylindrical shape by a peripheral wall portion surrounding the substrate and of which at least one end portion is opened, and a support member that supports the substrate in the case and extends toward the open end of the case from one end portion thereof supporting the substrate. The support member includes an outer surface that faces an inner surface of the peripheral wall portion with a gap interposed therebetween, and a gap at the one end portion of the support member is wider than a gap at other portions excluding at least the one end of the support member.
    Type: Application
    Filed: December 16, 2013
    Publication date: October 2, 2014
    Applicant: ALPS ELECTRIC CO., LTD.
    Inventor: Tetsuya Sago
  • Patent number: 8835770
    Abstract: An electronic component that includes an electronic component body, sealing members sealing the electronic component body, and adhesive layers which adhere the electronic component body and the sealing members, respectively. Between the electronic component body and the sealing members, sealed spaces are formed, respectively. The adhesive layers each contain organic fillers and inorganic fillers. The organic fillers are in contact with both the electronic component body and the sealing members. The inorganic fillers each have a minimum particle diameter smaller than the thickness of each of the adhesive layers. When the adhesive layers are viewed in a thickness direction thereof, the inorganic fillers are provided between the organic fillers and the electronic component body and between the organic fillers and each of the sealing members.
    Type: Grant
    Filed: October 1, 2012
    Date of Patent: September 16, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Junji Oyama, Takamasa Kuboki, Yasuharu Matsui, Muneyuki Daidai
  • Patent number: 8835777
    Abstract: An electronic device having a slide cover slidably attached in an openable/closable manner to a device case, and conceals a recording paper ejection opening in the device case; a waterproof gasket provided on either one of the slide cover and the device case in a part positioned in periphery of the recording paper ejection opening, and arranged between the slide cover and the device case surrounding the recording paper ejection opening, when the slide cover conceals the recording paper ejection opening; and a guide member which does not come in contact with the waterproof gasket on another side of the slide cover and the device case with which the waterproof gasket meets face to face during a sliding motion of the slide cover, and the waterproof gasket presses on both sides between the slide cover and the device case when the sliding motion is completed.
    Type: Grant
    Filed: January 29, 2013
    Date of Patent: September 16, 2014
    Assignee: Casio Computer Co., Ltd
    Inventor: Hiromasu Meguro
  • Patent number: 8816221
    Abstract: A low resistance pathway includes a flexible member, a surface interfacing the flexible member, a sealing feature, and a fastener. The sealing feature forms an interior edge of at least one of the flexible member and the surface. The fastener compresses the flexible member to contact the surface.
    Type: Grant
    Filed: February 29, 2012
    Date of Patent: August 26, 2014
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Nathan A. Berry, Aaron M. Finke, Eric A. Carter
  • Patent number: 8803004
    Abstract: In one embodiment, an apparatus includes a cover panel. An adhesive layer is coupled to the cover panel. A perimeter of the adhesive layer forms at least a portion of a gasket seal extending substantially perpendicular to an inner surface of the cover panel. An inner surface of the gasket seal defines an edge of a channel. The apparatus also includes a substrate coupled to the adhesive layer. The substrate includes an outer surface having disposed thereon a connection pad region and drive or sense electrodes. The drive or sense electrodes are disposed between the substrate and the cover panel. At least a portion of the channel is disposed between the gasket seal and the connection pad region. The apparatus further includes a flexible printed circuit (FPC) electrically coupled by the connection pad region to the drive or sense electrodes. A first portion of the FPC extends through the channel.
    Type: Grant
    Filed: December 31, 2012
    Date of Patent: August 12, 2014
    Assignee: Atmel Corporation
    Inventor: David Brent Guard
  • Patent number: 8633409
    Abstract: There is provided a waterproof structure of a wire leading portion. A rubber cap is assembled with wire connected to a circuit board. A housing accommodates the circuit board. A packing holder is accommodated next to the circuit board through an opening of the housing. A packing is assembled on an outer periphery of the packing holder to be in close contact with an inner surface of the housing. The packing holder includes: a rubber cap secession prevention wall formed in a direction that crosses an accommodation direction; a wire insertion hole formed to penetrate the wall; and a rubber cap accommodation chamber communicating with the wire insertion hole and continuing to an inner surface of the wall. The inner surface of the wall and a cross-section of the circuit board are formed to hold the rubber cap that is accommodated in the rubber cap accommodation chamber.
    Type: Grant
    Filed: March 9, 2012
    Date of Patent: January 21, 2014
    Assignee: Yazaki Corporation
    Inventor: Masahiro Sawayanagi
  • Patent number: 8604360
    Abstract: A sealing body for a cable sleeve for an optical fiber cable is disclosed. The sealing body has a central, cylindrical sealing body segment. The central, cylindrical sealing body segment has, on an outer casing surface, a plurality of cutouts distributed over the circumference thereof, in each case one cylinder-segment-like sealing body segment being capable of being inserted into each of the cutouts of the central sealing body segment, and in each case one cable insertion opening for receiving and individually sealing off in each case one single cable being formed between the central sealing body segment and each cylinder-segment-like sealing body segment. Each of the cylinder-segment-like sealing body segment has a gel-like sealing element, which can be compressed individually independently of the sealing elements of other cylinder-segment-like sealing body segments in order to individually seal off the cable inserted into the respective cable insertion opening.
    Type: Grant
    Filed: October 10, 2008
    Date of Patent: December 10, 2013
    Assignee: CCS Technology, Inc.
    Inventors: Jens Knorr, Andreas M. Eichstädt, Thorsten Müller
  • Patent number: 8604361
    Abstract: A thermally insulated electronic component package and an instrument suitable for process conditions in a high temperature environment are disclosed. The component package includes a thin electronic component, a thermally insulating outer enclosure, and an insert made of a thermally insulating material that is sized and shaped to fit within the outer enclosure. The insert includes an inner cavity sized and shaped to receive the thin electronic component. In the instrument, the outer enclosure can be configured to mount to a substrate.
    Type: Grant
    Filed: January 20, 2010
    Date of Patent: December 10, 2013
    Assignee: KLA-Tencor Corporation
    Inventors: Mei Sun, Pascal Champagne
  • Patent number: 8598471
    Abstract: There is provided an electric storage device having a novel fastening structure of a plastic member which can reduce cost with a simple configuration. An electric storage device according to this invention includes an electrode assembly, a case housing the electrode assembly, a plastic member arranged at an outer surface of the case, the plastic member having a joining surface facing the outer surface of the case, and an external terminal supported by the plastic member and electrically connected to the electrode assembly. The plastic member is a synthetic resin containing an inorganic fiber and is bonded to the outer surface of the case with the inorganic fiber exposed at the joining surface.
    Type: Grant
    Filed: December 23, 2011
    Date of Patent: December 3, 2013
    Assignee: GS Yuasa International Ltd.
    Inventors: Katsuhiko Okamoto, Shinsuke Yoshitake, Jun Nakamura, Masakazu Tsutsumi, Nobuyuki Naganawa
  • Patent number: 8593817
    Abstract: A power semiconductor module is provided in which power semiconductor chips with an aluminum-based chip metallization and power semiconductor chips with a copper-based chip metallization are included in the same module, and operated at different barrier-layer temperatures during use.
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: November 26, 2013
    Assignee: Infineon Technologies AG
    Inventors: Reinhold Bayerer, Thilo Stolze
  • Patent number: 8575499
    Abstract: To provide a seal structure having seal members which can be easily inserted into insertion holes of a housing, and achieve an excellent sealing performance of the seal members, the seal structure is comprised of a housing provided with insertion holes to which a flexible wiring substrate is inserted, and seal members which are integrally formed on the flexible wiring substrate are made of a rubber elastic material in a bush-shape, and hermetically seal gaps between the insertion holes and the flexible wiring substrate, wherein projected portions are provided on parts of the flexible wiring substrate at positions where the seal members are integrally formed.
    Type: Grant
    Filed: April 26, 2010
    Date of Patent: November 5, 2013
    Assignee: Nippon Mektron, Ltd.
    Inventors: Takahiro Hayashi, Keiichi Miyajima
  • Patent number: 8541697
    Abstract: A dustproof structure is used in an electronic device, which includes a housing and a display panel. The dustproof structure includes a dustproof section and a first adhesive section. The dustproof section is located and received in the housing. The first adhesive section is fixed on the one side of the dustproof section, and the display panel is fixed on the dustproof structure by the first adhesive section and is assembled to the housing. The dustproof structure fills gaps between the housing and the display panel.
    Type: Grant
    Filed: February 22, 2011
    Date of Patent: September 24, 2013
    Assignee: FIH (Hong Kong) Limited
    Inventor: Chih-Wei Chang
  • Patent number: RE49645
    Abstract: A method of manufacturing a light-emitting device includes providing a base body including a base section; fixing a plurality of semiconductor laser elements on an upper surface of the base section; and fixing an optical member to the base body, the optical member including a plurality of lens sections, and a non-lens section disposed at a periphery of the plurality of lens sections in a top view. In the step of fixing the optical member: the optical member is arranged above the base body; (i) an inclination and a height of the optical member are adjusted after interposing an adhesive between the base body and the non-lens section, or (ii) an adhesive is interposed between the base body and the non-lens section after adjusting the inclination and the height of the optical member; and subsequently, the adhesive is cured to fix the optical member to the base body.
    Type: Grant
    Filed: January 11, 2021
    Date of Patent: September 5, 2023
    Assignee: NICHIA CORPORATION
    Inventors: Soichiro Miura, Seiji Kiyota, Eiichiro Okahisa