Abstract: An enclosure for electronic circuitry is provided which has a first housing member having at least one protrusion formed in a wall and a second housing member having at least one slot for receiving the at least one protrusion and securing the second housing member to the first housing member. The second housing member and the first housing member have one or more continuous electrical ground contact surfaces. The second housing member is secured to the first housing member so that there is an interference fit between the at least one protrusion and at least one slot and so that there are one or more continuous electrical ground contact surfaces between the first housing member and the second housing member. A method of assembling an enclosure for electronic circuitry is provided.

Abstract: An apparatus and method according to which a seal is provided between an enclosure and an enclosure cover. The enclosure cover includes an enclosure engagement surface for coupling to enclosure. The apparatus includes a gasket positioned in a gasket channel located on the enclosure engagement surface to provide a seal between the enclosure and the enclosure cover. The enclosure engagement surface also includes a flame path surface adjacent the gasket channel.

Abstract: Disclosed herein is a device package that comprises a device having a top substrate that is disposed on a supporting surface of a package substrate. A package frame contacts the top surface of the top substrate and top surface of the package substrate, and hermetically seals the device between the top surfaces of the top substrate and package substrate. The device can be a semiconductor device, a microstructure such as a microelectromechanical device, or other devices.

Abstract: A field device is made up of a housing including a housing part arranged as a hood, the hood including at least one opening in at least one direction, the housing including at least one connection box including at least one opening in the at least one direction of the at least one opening of the hood; and at least one electronics insert arranged inside the housing. The connection box includes a first plug-in connector and the electronics insert includes a second plug-in connector, the first plug-in connector and the second plug-in connector forming a plug-in connection between the connection box and the electronics insert.

Abstract: Electronic components such as a control unit for controlling operation of an internal combustion engine are contained in a waterproof casing. The casing is composed of a base and a cover, both connected to each other water-tightly. A respiration filter for establishing air communication between an inside and an outside of the casing is mounted on a mounting surface formed on an outer surface of the cover. The mounting surface is elevated from the outer surface of the cover, and has a plane facing a flange of the respiration filter. The plane is small relative to a height of a respiration hole of the respiration filter. Since the plane on the mounting surface facing the flange of the respiration filter is small relative to the height of the respiration hole, the respiration hole is prevented from being blocked with water staying on the mounting hole due to its surface tension.

Abstract: An assembly for a sealed electronic component includes at least one electronic device mounted on a substrate, and a metal enclosure comprising first and second housing components that are welded together to define a sealed enclosure. The resulting assembly provides a reliable seal that eliminates the need for mechanical fasteners, adhesives, and equipment for applying and curing adhesives.

Abstract: A hardened voyage data recorder includes two subsystems: a removable non-volatile memory and a base containing electronics and firmware for communicating with data sensing systems and for accessing the memory. According to the invention, the memory is protected in a “boiler” and the electronics includes an ETHERNET interface for connecting to shipboard data acquisition devices. The firmware is preferably configured via web pages. A communications protocol for communicating with the recorder is also disclosed.

Abstract: A MEMS device is packaged with a control material that is included in the package to affect an operation of a moveable element of the device. The control material may affect operational characteristics including actuation and release voltages and currents, mechanical affects including damping and stiffness, lifetime of the device, optical properties, thermal affects and corrosion. The control material may be inserted into the package as part of any of several structural components of the package or the MEMS device.

Abstract: An optoelectronic package with a wire-protection lid is provided. An active surface of a silicon die includes a light working area. The silicon die is disposed on a substrate and electrically connected to the substrate through a plurality of bonding wires. A glass is disposed on the active surface of the silicon die. A silicon base lid with an opening is located above the substrate and connected to the glass by anodic bonding to mask the bonding wires. In addition, the opening of the silicon base lid is aligned with the light working area of the silicon die.

Abstract: There is provided a semiconductor device comprising a semiconductor chip whose main surface comprises first electrode pads; a wiring portion electrically connected to the electrode pad and including a bump portion that protrudes upward in a vertical direction with respect to the main surface; a sealing layer covering the perimeter and main surface of the chip; and a re-distribution wiring layer which electrically connected to the wiring portion and extending from a first portion of the sealing layer over the main surface to a second region of the sealing layer outside the first region.