Abstract: It is an object of the present invention to derive the optimum operating condition parameters for plating operation accurately and efficiently. At first, a preliminary test operation is carried out under the energized condition (S12), then in light of such result, a sequential operations such as a first test operation (step S14) in which no energization is carried out for plurality of operating pattern candidates and a second test operation (step S16) under the energized condition are carried out, and then the optimum operating conditions are registered (step S18).

Abstract: A system and method is described for electropolishing tubular metallic prostheses. In one aspect, the system provides a continuously changing set of points of contact between anode and prosthesis. In another aspect, the cathode is given a conical shape to correct for current concentrations that would otherwise exist and unevenly affect the amount of electropolishing over the length of the prosthesis.

Abstract: An apparatus for treating a workpiece with a liquid has a vessel holding a body of the liquid, a mount provided with a holder for carrying the workpiece, and a lifter for shifting the mount with the holder and the workpiece from an upper position above the body of liquid into a lower position with the workpiece immersed in the body of liquid. An inverting mechanism is coupled with the lifter for rotating the mount, holder, and workpiece through about 180° above the body of liquid on movement from the upper position toward the lower position and from the lower position into the upper position.

Abstract: An electroplating apparatus having improved contact deplating features includes a bowl assembly having a bowl for holding an electroplating solution. A head having a rotor including a contact ring and a head motor for rotating the rotor cooperates with the bowl assembly during plating operations. A lift/rotate actuator may be used to move the head to position a sector of the contact ring in a ring slot or opening of a deplating module. Since the deplating is performed within the deplating module, and not within the bowl assembly, the electroplating solution in the bowl assembly is not affected by the deplating process.

Abstract: Disclosed is an electrode arrangement for the defined rounding or deburring of edges of electrically conductive components, in particular turbine components, by means of electrochemical machining with at least one working electrode (5), which has a tubular electrode carrier, through which an electrolyte inflow line (10) is provided, the electrode carrier having on the front end a closure (13, 18), which is arranged such that the electrolyte inflow line in the axial direction of the electrode carrier is closed, and at least one outlet opening (19) being arranged in the radial direction. Also disclosed is a self-centering electrode arrangement and an installation for the defined rounding or deburring of edges of electrically conductive components by means of electrochemical machining with at least one corresponding electrode arrangement and also a method using the electrode arrangements and the described installation.

Abstract: To provide a small active oxygen generating device capable of efficiently continuously generating active oxygen while supplying oxygen in the air. In the active oxygen generating device in which water is made to exist between an anode and a cathode composed of a base material containing a conductive polymer and by turning on electricity between the anode and the cathode, the conductive polymer deoxidizes the oxygen dissolved in the water to generate active oxygen, the cathode is rotatably installed about a conductive horizontal axis with part of the surface being projected over the surface of the water.

Abstract: Provided are a plating method and a plating apparatus for a cylinder, which are capable of forming a plating layer having a uniform thickness in a technology of plating a cylinder, effectively preventing current concentration in cylinder end portions when being combined with a plating technology using divided insoluble electrodes, and performing plating with a more uniform thickness over the full length of a cylinder without generating defects such as rashes and pits irrespective of the size of the cylinder. The insoluble electrode has a shape in which a lower part thereof is curved inward, and is capable of rotating about an upper end thereof. Further, a thickness of a plating layer on an outer peripheral surface of the cylinder is adjusted by controlling an interval of closeness to the cylinder.

Abstract: A method and apparatus for separating impurities from a liquid stream includes a feed tank for containing an untreated liquid, a mixer for generating and mixing bubbles throughout the wastewater, and a settling tank for allowing the wastewater to settle for removal of impurities through dissolved gas floatation. The mixer includes a housing and a rotor rotatably mounted within the housing. The rotor is electrically isolated and the peripheral wall of the housing is electrically isolated and the rotor preferably has bores formed in its peripheral surface to produce cavitation to aid in mixing of fluid within the mixer. A power supply is coupled to establish a relatively positive electrical charge on the rotor and a relatively negative electrical charge on the wall of the housing. The charge causes electrolysis to occur within the fluid, which forms small low surface tension gas bubbles on the rotor and housing wall.

Abstract: To provide a flexible substrate processing apparatus which allows the stable reduction of an oxide contained in a film-like structure body formed on a flexible substrate. The apparatus has a substrate carrying-out portion where a flexible substrate on which a film-like structure body is formed is unwound; a reduction treatment portion where an oxide contained in the film-like structure body formed on the flexible substrate is electrochemically reduced; a washing portion where the flexible substrate and the film-like structure body are washed; a drying portion where the flexible substrate and the film-like structure body are dried; and a substrate carrying-in portion where the flexible substrate on which the film-like structure body is formed is taken up.

Abstract: An apparatus and method for the synthesis and treatment of electrocatalyst particles in batch or continuous fashion is provided. In one embodiment, the apparatus is comprised of a three-electrode cell which includes a reference electrode, a counter electrode, and a working electrode. The working electrode is preferably a cylindrical vessel having an electrically conductive region. The electrode assembly is introduced into a slurry containing metal ions and a plurality of particles. During operation an electrical potential is applied and the working electrode is rotated at a predetermined speed. When particles in the slurry collide with the electrically conductive region the transferred charge facilitates deposition of an ad-layer of the desired metal. In this manner film growth can commence on a large number of particles simultaneously. This process is especially suitable as a commercial thin film deposition process for forming catalytically active layers on nanoparticles for use in energy conversion devices.

Abstract: Disclosed herein is a barrel plating apparatus. The barrel plating apparatus includes a barrel plating tank filled with an electrolytic solution, a barrel container immersed in the electrolytic solution of the barrel plating tank and filled with chip parts and media, a power supply unit for supplying current to an anode part and a cathode part which transfer the current to the barrel container and the electrolytic solution of the barrel plating tank, a driving motor for rotating the barrel container, and a hall current sensor formed in at least one cathode rod of the cathode part, coming into direct contact with the chip parts, the hall current sensor measuring the current. Accordingly, in the barrel plating apparatus, the currents of respective cathode rods are measured by hall current sensors, and thus variations in plating thickness can be reduced.

Abstract: An electropolishing system including an anode, a cathode, a rolling block and a motion controller. The anode is configured to removably retain a metal device to be electropolished, and may be formed as a bar made from a solid cylindrical piece of metal or other configurations, such as wires with hooks. The anode transfers the electricity to the metal device while grooming the surface of the metal device as it contacts the rolling block. The cathode may be configured as a mesh and completes the electrical circuit. The rolling block is formed from a relatively smooth, solid material and positioned so as to allow the metal device to roll against the surface of the block. The motion controller is configured to provide vertical and horizontal movement of the anode and metal device, using force transducers to control the compression of the metal device against the rolling block.

Abstract: An air/water advanced oxidation purification device includes a draft tube, a motor and at least one spiral partition plate. The spiral partition plate is fixed on an output shaft of the motor. The motor is supported in the draft tube and used for driving the spiral partition plate to rotate at uniform speed around the central axis of the draft tube and for driving air or water to enter into the draft tube. The spiral partition plate includes a plurality of miniature blades arranged along a radial direction of the spiral partition plate, each of the miniature blades includes a plurality of first and second protrusions continuously and staggered arranged along the radial direction and protruding towards two sides of the spiral partition plate, respectively. Air or water is purified through photo-catalytic advanced oxidation reaction or electro-catalytic oxidation-reduction reaction taken place on the surfaces of the spiral partition plate.

Abstract: An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a polishing pad and a platen. The platen is formed of conductive material, is disposed proximate to the polishing pad and is configured to have a negative charge during at least a portion of a planarization process. At least one electrical conductor is positioned within the platen. The electrical conductor has a first end connected to a power source. A workpiece carrier is configured to carry a workpiece and press the workpiece against the polishing pad. The power source applies a positive charge to the workpiece via the electrical conductor so that an electric potential difference between the metallized surface of the workpiece and the platen is created to remove at least a portion of the metallized surface from the workpiece.

Abstract: Axially fed fluid is sheared during long residence time in a radial workspace between counter-rotating coaxial disk-shaped centrifugal impellers. Gases evolve in the fractal turbulence of a shear layer, which is forced between laminar boundary layers, and an axial suction pump axially extracts evolved noncondensables and volatiles through cores of radial vortices in the shear layer. Cavitation due to shear between the impellers kills pathogens by shock waves, microjets, OH radicals, and nearby UV light pulses. Oppositely charged electrodes bounding the workspace cause electroporesis and electrohydraulic cavitation. The electrodes are counter-rotating ridged armatures of disk dynamos, forming a dynamic capacitor having audio frequency pulsed electric fields. Electrode erosion by arcing is prevented by shear between the electrodes.

Abstract: Combinatorial electrochemical deposition is described, including dividing a wafer into a plurality of substrates for combinatorial processing, immersing the plurality of substrates at least partially into a plurality of cells, within one integrated tool, including electrolytes, the cells also including electrodes immersed in the electrolytes, depositing layers on the substrates by applying potentials across the substrates and the electrodes, and varying characteristics of the depositing to perform the combinatorial processing.

Abstract: Provided is a method and apparatus for producing silver nanoparticles in uniform shape and size using an electrolysis eco-friendly and in a simple way.

Abstract: Apparatus and methods for uniform metal plating onto a semiconductor wafer, such as GaAs wafer, are disclosed. One such apparatus can include an anode and a showerhead body. The anode can include an anode post and a showerhead anode plate. The showerhead anode plate can include holes sized to dispense a particular plating solution, such as plating solution that includes gold, onto a wafer. The showerhead body can be coupled to the anode post and the showerhead anode plate. The showerhead body can be configured to create a seal sufficient to substantially prevent a reduction of pressure in the plating solution flowing from the anode post to holes of the showerhead anode plate.

Abstract: An electrical contact method. An axle having an axis of rotation is provided. Cantilever arms are provided. Each cantilever arm has a first end and a second opposing end. The first end is connected to the axle. Each cantilever arm extends radially outward from the axle about perpendicular to the axis of rotation. At least two electrically conductive contacts is provided. At least one electrically conductive contact of the at least two electrically conductive contacts is disposed on the second end of each cantilever arm. A sample is supported on a support member. The electrically conductive contacts are pressed against a first surface of the sample. After the electrically conductive contacts are pressed, the electrically conductive contacts are revolved about the axis of rotation, wherein the at least one electrically conductive contact remains in electrical contact with the first surface.

Abstract: An electroplating apparatus having improved contact deplating features includes a bowl assembly having a bowl for holding an electroplating solution. A head having a rotor including a contact ring and a head motor for rotating the rotor cooperates with the bowl assembly during plating operations. A lift/rotate actuator may be used to move the head to position a sector of the contact ring in a ring slot or opening of a deplating module. Since the deplating is performed within the deplating module, and not within the bowl assembly, the electroplating solution in the bowl assembly is not affected by the deplating process.

Abstract: Manufacture of semiconductor products such as LCD driver requires a bump plating step for forming a gold bump electrode having a size of from about 15 to 20 ?m. This bump plating step is performed by electroplating with a predetermined plating solution, but projections intermittently appear on the bump electrode during a mass production process. In the invention, abnormal growth of projections over the gold bump electrode is prevented by adding, prior to the gold bump plating step, a step of circulating and stirring a plating solution while erecting a plating cup and efficiently dissolving/discharging a precipitate. This step is performed for each wafer to be treated.

Abstract: An apparatus and method designed to remove metals from a wafer surface using an electrolytic removal process. The apparatus includes a conductive pad having a plurality of alternating cathodes and anodes provided with a power source. The conductive pad is structured and configured to contact all metal islands on a surface of the wafer. Gaps are provided between pairs of the plurality of alternating cathodes and anodes.

Abstract: A method of electroplating conductive material on semiconductor wafers controls undesirable surface defects by reducing the electroplating current as the wafer is being initially immersed in a plating bath. Further defect reduction and improved bottom up plating of vias is achieved by applying a static charge on the wafer before it is immersed in the bath, in order to enhance bath accelerators used to control the plating rate. The static charge is applied to the wafer using a supplemental electrode disposed outside the plating bath.

Abstract: A method of plating a plurality of semiconductor devices includes: applying an electrical power source to an anode terminal and a cathode terminal; placing the plurality of semiconductor devices on a non-conductive platform in a plating solution; moving conductive parts across surfaces of the semiconductor devices to be plated, wherein the conductive parts electrically connect the surfaces of the semiconductor devices to the cathode; and wherein plating particles connected to the anode terminal move to and plate the surfaces of the semiconductor devices.

Abstract: Methods and structures. A planarization method includes: providing a contact structure, where the contact structure includes an axle configured to rotate about an axis of rotation, a plurality of cantilever arms, each arm having a first end connected to the axle, where each arm extends radially outward from the axle; and a plurality of electrically conductive spheres, where at least one sphere is disposed on a second end of each arm; placing a substrate in contact with the spheres, applying an electric voltage to the axle, where the voltage transfers to the substrate, where responsive to the transfer an electrochemical reaction occurs on the substrate; rotating the axle, wherein the spheres revolve about the axis, wherein at least one sphere remains in electrical contact with the substrate; and electrochemical-mechanically planarizing the substrate. Also included is a contact structure, an electrical contact, and an electrical contact method.

Abstract: A substrate processing method is arranged to perform a heat process on a substrate with a coating film formed thereon to bake and cure the coating film. At first, the substrate, with the coating film formed thereon, is held at a preparatory temperature lower than a lower limit of temperature for baking and curing the coating film, to adjust distribution of a predetermined component in the coating film. Then, the substrate, with distribution of the predetermined component thus adjusted, is subjected to a heat process at a temperature not lower than the lower limit of temperature.

Abstract: An electroerosion spindle assembly includes a main shaft, a tool electrode having a rear end directly or indirectly attached to the shaft and in alignment with the main shaft in a longitudinal direction, a container surrounding the main shaft, a stationary-to-rotary electrical conduction device mounted on the container for transitting power energy to the tool electrode, and a channel routing a flushing fluid to a front end of the tool electrode. The channel has at least one flushing slot in the container.

Abstract: A process employing a rack having an article carrier that is movably supported on a frame and mechanically coupled for translating movement from a motor to the article carrier to effect movement of an article during processing to provide more uniform surface treatment, reducing or eliminating the need for shielding.

Abstract: A plating apparatus performs a plating process while placing a work in a pod disposed in a plating bath storing a plating solution. The pod has a pair of meshes that allow the plating solution to pass but substantially inhibit the work from passing. The plating apparatus is provided with a solution flowing mechanism for flowing the plating solution out of the pod through one of the pair of meshes.

Abstract: An apparatus and method are provided for simultaneously electropolishing a plurality of metallic stents. A plurality of elongated members on the apparatus are movably engaged with a plate such that movement of the plate relative to the elongated members causes each of the elongated members to rotate on its respective longitudinal axis when immersed in an electrolytic solution. A continuous cathode is located in close proximity to each of the elongated members when they are immersed in the electrolytic solution.

Abstract: A method for applying a strike voltage to one or more substrates during plating. During this method, the substrates are moved in a planetary manner while being held at their exterior edges by a set of parallel mandrels. (The substrates are held in a mutually parallel orientation, typically vertically, during plating.) A voltage is applied to the substrates via a contact pin, a contact plate, a set of ball bearings, a rack end-plate, and the mandrels.

Abstract: Two rotating members placed to face each other and nipping a web such that only an end of the web provided with conductivity is pressed are provided, at least one of the rotating members serves as a feeding electrode, and these rotating members are rotated about the same velocity, to a transportation velocity of the web.

Abstract: A water treatment device having a tank containing an anode and a cathode. A motor is provided to impart rotational motion to the cathode. A scraping means is fixed to the interior of the tank and extend inward toward the tank so as to define a gap between the scraping means and the cathode. As mineral deposits accumulate on the cathode they are removed by the scraping means and the rotational motion of the cathode.

Abstract: A method of plating a plurality of semiconductor devices includes: applying an electrical power source to an anode terminal and a cathode terminal; placing the plurality of semiconductor devices on a non-conductive platform in a plating solution; moving conductive parts across surfaces of the semiconductor devices to be plated, wherein the conductive parts electrically connect the surfaces of the semiconductor devices to the cathode; and wherein plating particles connected to the anode terminal move to and plate the surfaces of the semiconductor devices.

Abstract: A fabricating method of a printing plate includes forming a first conductive layer on an upper surface of a printing plate, forming a second conductive layer on a lower surface of the printing plate, forming an etch-resist pattern by etching a portion of the first conductive layer, submerging the printing plate, the second conductive layer and the etch-resist pattern into an electrolytic solution, and applying an electrical field between the etch-resist pattern and the second conductive layer so that the electrolytic solution is dissociated to form an anisotropically etched fine pattern in the printing plate.

Abstract: Method and apparatus for controlling an electric motor employing an electrolysis subassembly connected in an electrical circuit which includes the electric motor. While controlling the throughput of electrical current through the electrolysis subassembly, there is simultaneously generated a fuel gas useful for fueling an internal combustion engine. The invention includes a novel electrolyte utilizing novel electrode structure and mode of operation. The electrolysis may be powered by a battery pack.

Abstract: A process and apparatus utilizing at least one conformable anode (40) in a plating process to apply a plating to an article (10). A wire or other material suitable for an anode is shaped to conform to the approximate shape of a region of the article to be coated. The anode is powered by an electrical power source (44), and the article serves as the cathode. The anode and article are both immersed in a plating bath (38). The article and anode are rotated relative to one another about a central axis (22) of the article. The relative movement between the anode and the article causes a uniform plating (46) to be applied to selected regions of the article that pass the anode. Another anode (50) can be arranged in fixed relation with the article to cause plating to a separate selected region of the article concurrently with the other anode.

Abstract: The invention relates to a device for the electrolytic coating of a structured or full-surface base layer (9) on a surface of a substrate (7), which comprises at least one electrolyte bath (3) having at least one rotatably mounted roller (2) connectable as a cathode, which contacts the base layer (9) during the electrolytic coating, the base layer (9) being covered by an electrolyte solution (5) contained in the electrolyte bath (3) and being moved relative to the at least one roller (2) during the coating. The at least one roller (2) connectable as a cathode is connected cathodically during the contact with the base layer (9) and is connected neutrally or anodically as soon as there is no contact with the base layer (9).

Abstract: An electropolishing device for polishing a cylindrical medical device such as a stent includes anodes in the form of rollers arranged to contact an exterior surface of the device. A drive mechanism rotates the anodes periodically during the electropolishing process to change a contact point between the anodes and the medical device. A tilting mechanism can also be used for periodically tilting the anodes during the electropolishing process to allow bubbles to escape from one end of the stent.

Abstract: The present invention provides a washing apparatus which washes a web while conveying the web. The washing apparatus includes a squirting component which ejects fresh washing liquid at the web and a first washing tank which is disposed at an upstream side of a conveyance direction of the web relative to the squirting component. The first washing tank washes the web that is passing through the first washing tank, and takes in the washing liquid that has been ejected at the web by the squirting component.

Abstract: The present invention provides a coating method, in which a composite coating layer is formed on a surface of an alloy base member by utilizing a rotary electrode device. The coating method includes the steps of: preparing an electrolytic solution containing A ion wherein A is Co or Ni; preparing a MCrAlY powder wherein M denotes at least one element selected from the group consisting of Ni and Co, and the MCrAlY powder contains at least Ni when A is Co or the MCrAlY powder contains at least Co when A is Ni; preparing a dispersion liquid by dispersing the MCrAlY powder into the electrolytic solution; immerging the cylindrical rotary electrode and the alloy base member into the dispersion liquid; and electrolyzing the surface of the alloy base member while the cylindrical rotary electrode covered with the nonwoven fabric layer is rolled on the on the surface of the alloy base member thereby to form the composite coating layer onto the surface of the alloy base member.

Abstract: Coaxial disk armatures, counter-rotating through an axial magnetic field, act as electrolysis electrodes and high shear centrifugal impellers for an axial feed. The feed can be carbon dioxide, water, methane, or other substances requiring electrolysis. Carbon dioxide and water can be processed into syngas and ozone continuously, enabling carbon and oxygen recycling at power plants. Within the space between the counter-rotating disk electrodes, a shear layer comprising a fractal tree network of radial vortices provides sink flow conduits for light fractions, such as syngas, radially inward while the heavy fractions, such as ozone and elemental carbon flow radially outward in boundary layers against the disks and beyond the disk periphery, where they are recovered as valuable products, such as carbon nanotubes.

Abstract: Systems and methods for electrochemically processing a substrate. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact element is a rotating member. In one embodiment, the contact element comprises a noble metal.

Abstract: The invention relates to a device for the electrolytic coating of at least one electrically conductive substrate or a structured or full-surface electrically conductive surface on a nonconductive substrate, which comprises at least one bath, one anode and one cathode, the bath containing an electrolyte solution containing at least one metal salt, from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer while the cathode is brought in contact with the substrate's surface to be coated and the substrate is transported through the bath, wherein the cathode comprises at least two disks (2, 4, 10) mounted on a respective shaft (1, 5, 14) so that they can rotate, the disks (2, 4, 10) engaging in one another. The invention furthermore relates to a method for the electrolytic coating of at least one substrate, which is carried out in a device according to the invention.

Abstract: Axially fed fluid is sheared during long residence time in a radial workspace between counter-rotating coaxial disk-shaped centrifugal impellers. Gases evolve in the fractal turbulence of a shear layer, which is forced between laminar boundary layers, and an axial suction pump axially extracts evolved noncondensibles and volatiles through cores of radial vortices in the shear layer. Cavitation due to shear between the impellers kills pathogens by shock waves, microjets, OH radicals, and nearby UV light pulses. Oppositely charged electrodes bounding the workspace cause electroporesis and electrohydraulic cavitation. The electrodes are counter-rotating ridged armatures of disk dynamos, forming a dynamic capacitor having audio frequency pulsed electric fields. Electrode erosion by arcing is prevented by shear between the electrodes. The device is also a continuous crystallizer.

Abstract: An electrode assembly includes a distribution plate having a plurality of grooves that communicate with openings in an overlying polishing pad layer. The grooves include end openings that allow for draining of process solution, both during processing and subsequent cleaning/rinsing of the pad. Drainage occurs continually during processing, cleaning and rinsing, and so is constricted through the end openings relative to the grooves, to prevent wastage. The end openings are sufficiently large, however, to substantially completely drain fluids from the grooves between steps without delaying robotic motions.

Abstract: There is provided a plating method and device having a fixed drum (20) in which an anode (21) is exposed on the external peripheral surface; a rotating drum provided on the external periphery of the fixed drum, onto which a workpiece W transported in the longitudinal direction is wound; an annular opening (35) formed at the bottom of the rotating drum and provided so as to penetrate from the external periphery of the rotating drum to the internal periphery continuously in the peripheral direction of the rotating drum; a plating solution feeding channel (22) that leads into the fixed drum and is formed in a position on the external periphery of the fixed drum corresponding to the angle position (52a) of the prescribed arc of contact of the rotating drum onto which the workpiece is wound; a plating device for feeding the plating solution to the flow channel using the tunnel-shaped space (52) enclosed by the workpiece wound on the external periphery of the rotating drum, the peripheral wall of the annular openin

Abstract: An electropolishing device for polishing a cylindrical medical device such as a stent includes anodes in the form of rollers arranged to contact an exterior surface of the device. A drive mechanism rotates the anodes periodically during the electropolishing process to change a contact point between the anodes and the medical device. A tilting mechanism can also be used for periodically tilting the anodes during the electropolishing process to allow bubbles to escape from one end of the stent.

Abstract: A meniscus of applying fluid is controlled by applying a voltage to a discharge-nozzle side electrode and a counter electrode placed downstream of the discharge nozzle and by increasing or decreasing fluid pressure inside a pump chamber with use of a mechanism for rotational motion or rectilinear motion.

Abstract: The present invention provides a copper plating method and apparatus for a gravure cylinder in which copper plating with more uniform thickness can be provided over a full length of a gravure cylinder without causing defects such as rashes and pits irrespective of a size of the gravure cylinder, concentration of a copper plating solution can be managed automatically, a consumption amount of an additive is reduced to make it possible to perform a plating treatment within a short period of time, a power supply cost is reduced, and handling is easy with excellent visibility. A gravure cylinder in a hollow cylindrical shape is held at both ends in a longitudinal direction. The gravure cylinder is accommodated in a plating bath filled with a copper plating solution. The gravure cylinder is energized so that the gravure cylinder functions as a cathode while being rotated at a predetermined speed.