Abstract: The invention relates to methods and apparatuses for the decontamination of fluid, particularly the removal of heavy metals and/or arsenic and/or their compounds from water, by means of electrocoagulation followed by adsorption, wherein the water to be purified subjected to electrodes of different polarities. The invention can include means for control of the pH of the fluid. The invention can also include control systems that allow self-cleaning of electrodes, self-cleaning of filters, and automatic monitoring of maintenance conditions.

Abstract: By providing an enhanced drive system for electrochemical etch process tools, the operational range, as well as the reliability, may be enhanced. For this purpose, a high torque electric motor may be used in combination with an appropriate power transmission, which may be attached to a corresponding tool frame at a height level that is above a corresponding height level at which respective chemicals are provided to the substrate under process. Hence, the probability for contamination by chemicals may be significantly reduced, thereby also reducing maintenance efforts resulting in reduced production costs.

Abstract: A method and system for controlling an electroless deposition process are provided. The system generally includes an electroless plating cell having a work piece to be plated positioned therein, the work piece also being positioned in communication with an electroless plating solution contained by the plating cell, and a voltage measurement device in communication with the work piece and the electroless plating solution, the voltage measurement device being configured to measure the electrical potential difference between the work piece and the plating solution.

Abstract: The present invention relates to a system single-metal plating, a system for binary-metal plating, and a system for solder-bump plating. The solder-bump plating system comprises a single-metal plating system for plating a preconditioned substrate to form a single-metal plated substrate; and a binary-metal plating system for plating the single-metal plated substrate. In a preferred implementation, the solder-bump plating system of the present invention is configured to single-metal plate a preconditioned substrate using a first plating solution to provide a single-plated substrate; to single-metal plate the single-plated substrate using a second plating solution to provide a double-plated substrate; and to binary-metal plate the double-plated substrate using a third plating solution to provide a solder-bump plated substrate.

Abstract: An electroplating apparatus includes a reactor vessel having a segmented anode array positioned therein for effecting electroplating of an associated workpiece such as a semiconductor wafer. The anode array includes a plurality of ring-like anode segments which are preferably positioned in concentric, coplanar relationship with each other. The anode segments can be independently operated to create varying electrical potentials with the associated workpiece to promote uniform deposition of electroplated metal on the surface of the workpiece.

Abstract: The invention provides a method and apparatus for current control in gas generators capable of generating a fluorine or fluoride gas by and in which the electrolysis can be maintained in an optimum condition, stable operation is possible and no manpower is demanded. According to the method of current control in gas generators for generating a fluorine or fluoride gas by electrolysis of an electrolytic bath 5 comprising a hydrogen fluoride-containing mixed molten salt using a carbon electrode as the anode 4a, the range of voltage fluctuation between the cathode 4b and anode 4a as occurring when a certain current is applied to the gas generator is measured, and current application is continued while varying the current amount to be applied according to the voltage fluctuation range.

Abstract: A fluid treatment system for reducing odor, bacteria, and biological oxygen demand from a fluid having at least one tube, a control box, and a pump. The at least one tube has a plurality of conductors in electrical communication with the control box. The control box controls the level of electrical communication to the plurality of conductors and the flow rate of the pump. The principle use is for biomass material derived from animals, however other fluids will benefit from this invention. For example, fluids derived from plants and humans will benefit from this application.

Abstract: The present invention provides a secondary power supply for the telematics terminal. A secondary power supply for a telematics terminal including. a power control unit for controlling a power supply based on a power control signal of the telematics terminal and/or a start-up key signal; a telematics control unit which is operated by power supplied from a secondary power supply unit under the control of the power control unit and controls each of components inside the telematics terminal; the secondary power supply unit for supplying the power to the telematics control unit; and a rectifying unit for rectifying power from a main power supply unit one more time and protecting the components from a reverse voltage by opening the connection of the main power supply unit and the secondary power supply unit when a voltage level of the secondary power supply unit is higher than that of the main power supply unit.

Abstract: A circuit for providing a potential difference across a gap between two electrodes of a fuel reformer, oxides of nitrogen trap or soot filter regenerator for an internal combustion engine or the like. The circuit includes a power source, a transformer including a primary winding and a secondary winding for coupling across the electrodes. The power source is coupled to the primary winding. A switch or switches is/are coupled to the primary winding.

Abstract: The present invention provides a fountain-type electroplating apparatus with functions of voltage detection and flow rectification, comprising: an electroplating tank, a rectification device, and an overflow tank, wherein the electroplating tank is positioned inside the overflow tank, and the rectification device is arranged under the electroplating tank, in addition, the electroplating tank is composed of a shell, a cathode electrode, and an mesh shaped anode. The apparatus of the present invention further comprises: a power supplier, a switcher, a plurality of detection circuits, and a plurality of connecting line, which is used for monitoring the same.

Abstract: Controlled-potential electroplating provides an effective method of electroplating metals onto the surfaces of high aspect ratio recessed features of integrated circuit devices. Methods are provided to mitigate corrosion of a metal seed layer on recessed features due to contact of the seed layer with an electrolyte solution. The potential can also be controlled to provide conformal plating over the seed layer and bottom-up filling of the recessed features. For each of these processes, a constant cathodic voltage, pulsed cathodic voltage, or ramped cathodic voltage can be used. An apparatus for controlled-potential electroplating includes a reference electrode placed near the surface to be plated and at least one cathode sense lead to measure the potential at points on the circumference of the integrated circuit structure.

Abstract: A device for measuring resistances associated with electrical contacts of a contact ring used in a semiconductor wafer electroplating process. The device includes a substrate and a conductive pattern on the substrate. The conductive pattern is electrically contactable with the electrical contacts of the contact ring. Resistance measurement circuitry is connected to the conductive pattern. The resistance measurement circuitry is configured to send test signals to the conductive pattern, receive signals from the conductive pattern, and measure the resistances associated with the electrical contacts of the contact ring. A method of using such a device to measure resistances associated with electrical contacts of a contact ring used in a semiconductor wafer electroplating process is also provided.

Abstract: A polishing method for electropolishing a metal film formed on a wafer surface so as to fill concave portions formed on the wafer surface comprises a step of determining an electropolishing end point of the metal film on the basis of a change of a current waveform resulting from electropolishing the metal film. An electropolishing apparatus comprising a current detector for detecting a current waveform resulting from electropolishing a metal film and an end point determination part for determining an electropolishing end point of the metal film on the basis of the change of a current detected with the current detector is used to realize the polishing method.

Abstract: Various systems and methods for protecting electrowinning anodes having electrocatalytically active coatings in a bank of electrolytic cells from being damaged by reverse currents. In the first embodiment, one or more auxiliary power sources are provided that, when triggered by one or more predetermined conditions being met, keep the bank of electrolytic cells in an electrical state that is relatively harmless to the anodes having electrocatalytically active coatings. In a second embodiment, the invention is directed to a method of maintaining the polarization of anodes in an electrowinning cell positive of the cathodes (i.e. in a potential region where the anode coating is not susceptible to significant damage). In a final embodiment, the invention is directed to various methods for the installation of replacement anodes and maintenance of electrowinning cells.

Abstract: The object of the present invention is to provide a film thickness distribution analysis method that ensures quick and effective prediction of film thickness distribution by computer simulation in the pattern plating process. On the circuit pattern of a printed circuit board, in the method for analyzing the thickness distribution of metal film plated selectively, hypothetically dividing the printed circuit board into one or more regions, introducing pattern density ?j=Aj/Sj (Sj: the area Sj of a desired region j, and Aj: the area of the plated surface inside the area j), and calculating the approximate average current density or film thickness distribution based on “approximation averaged by pattern density”.

Abstract: Electroplating station S has a head 1 with anode 2, to one side of which there is located an electrically neutral wall 3. The width of anode 2 is provided to accommodate the width of web 6. Serrations 9 are provided on the anode 2, especially in the area of top surface 8. A passageway 4 for electrolyte 5 is between anode 2 and wall 3. Mesh 11 is located at a throat section 12 of passageway 4 shortly before the start of the guide 7. In addition, mesh 13 is located further upstream in passageway 4 as an alternative and/or as an addition to mesh 11. Guide 7 of wall 3, serrations 9, and meshes 11 and 13 enhance and maximize the production of stream-wise vortices. These vortices cause a substantial increase in the ion flow, which overcomes boundary layers and results in additional deposition of copper onto the web 6.

Abstract: A process for forming oxide based dense ceramic composite coatings on reactive metal and allow bodies involves suspension of at least two reactive metal or alloy bodies in a non-metallic, non-conducting, non-reactive chamber in such a way that it causes either partial or full immersion of the bodies in a continuously circulating electrolyte. Thyristor controlled, modified shaped wave multiphase alternating current power supply is applied across the bodies where in each body is connected to an electrode. Electric current supplied to the bodies is slowly increased to a particular value till the required current density is achieved and the maintained at the same level throughout the process. Visible arcing at the surface of the immersed regions of the bodies is identified when the applied electric potential crosses 60V. Electric potential is further increased gradually to compensate the increasing resistance of the coating.

Abstract: The invention relates to the analysis of the performance and properties of electrochemical processes, and specifically, to electrolytic solutions and electrode processes. The invention discloses a device and a method for obtaining qualitative and quantitative information for the kinetics of the electrode reactions, the transport processes, the thermodynamic properties of the electrochemical processes taking place in the cell. When a deposition reaction takes place, the device provides also valuable information about the relationship between the current density and deposit properties including but not limited to the deposit color, luster, and other aspects of its appearance. The device disclosed herein typically is comprised of a multiplicity of cathodic or anodic regions where one or more electrochemical reactions take place simultaneously, but at a different rate.

Abstract: There is provided an apparatus for producing strong alkaline reductive electrolyzed water and acidic water that enables efficient production of electrolyzed water that has excellent washing and sterilizing effects. There is provided an apparatus for producing strong alkaline reductive electrolyzed water and acidic water, which includes an electrolyzer provided with a strong alkaline reductive electrolyzed water-producing chamber, an acidic water-producing chamber and a partitioning membrane, wherein a flow path diffusing device is provided in the electrolyzer, and a gap between the cathode plate and the anode plate of 0.1 mm to 1 mm.

Abstract: The use of impedance measurements to detect the presence of pathogens attached to antibody-coated beads. In a fluidic device antibodies are immobilized on a surface of a patterned interdigitated electrode. Pathogens in a sample fluid streaming past the electrode attach to the immobilized antibodies, which produces a change in impedance between two adjacent electrodes, which impedance change is measured and used to detect the presence of a pathogen. To amplify the signal, beads coated with antibodies are introduced and the beads would stick to the pathogen causing a greater change in impedance between the two adjacent electrodes.

Abstract: An in-substrate selective electrochemical treatment system for finding and repairing pinholes of an active substrate including holding an insulating substrate having a conductive pattern, supplying a predetermined amount of a specified chemical solution to a specified region on the insulating substrate and confining it in the specified region, locating the reversed polarity electrode plate close to the insulating substrate such that the reversed polarity electrode plate comes in contact with the chemical solution on the upper surface of the insulating substrate, bringing the electrode into contact with the conductive pattern in the periphery of the insulating substrate, applying a specified direct current between the electrode and the reversed polarity electrode plate, and measuring a value of current flowing between the electrode and the reversed polarity electrode plate.

Abstract: A system is for supplying a generator with hydrogen, in particular a generator of a power generating plant. The system offers a high level of safety while at the same time making handling easy. The system includes a closed system cycle for carrying water and/or gas and a hydrogen feed line, branching off from the system cycle, for the generator. The system cycle includes an electrolysis unit designed as a membrane electrolyzer.

Abstract: A method and associated apparatus for electro-chemically depositing a metal film on a substrate having a metal seed layer. The apparatus comprises a substrate holder that holds the substrate. The electrolyte cell receives the substrate in a processing position. The actuator is connected to the substrate holder and adjustably positions the substrate relative to the electrolyte cell. The method involves electro-chemically depositing a metal film on a substrate having a metal seed layer comprising disposing the substrate in an electrolyte cell that is configured to receive the substrate. The method comprises adjustably positioning the substrate relative to the electrolyte cell.

Abstract: The use of impedance measurements to detect the presence of pathogens attached to antibody-coated beads. In a fluidic device antibodies are immobilized on a surface of a patterned interdigitated electrode. Pathogens in a sample fluid streaming past the electrode attach to the immobilized antibodies, which produces a change in impedance between two adjacent electrodes, which impedance change is measured and used to detect the presence of a pathogen. To amplify the signal, beads coated with antibodies are introduced and the beads would stick to the pathogen causing a greater change in impedance between the two adjacent electrodes.

Abstract: A polishing method able to easily flatten unevenness formed on the surface of a film to be polished and able to efficiently polish the film flat while suppressing damage to an interlayer insulating film below the film, comprising, when polishing an object having a film such as an interconnection layer formed burying interconnection grooves formed in an insulating film of a substrate, supplying a polishing solution over the surface to be polished at least substantially parallel to the surface to preferentially remove by polishing the projecting portions of the film and flatten the surface by the shear stress of the processing solution or arranging a cathode member facing the surface and supplying an electrolytic solution containing a chelating agent between the surface and cathode member while supplying voltage between the film and the cathode member to preferentially remove by polishing the projecting portions of the film and flatten the surface by the shear stress of the electrolytic solution, and a polishin

Abstract: A method and apparatus is provided for an electrochemical cell system. The electrochemical cell system includes: an electrochemical cell; an energy source configured for providing a quantity of energy to the electrochemical cell; a sensing apparatus in operable communication with a gas output from the electrochemical cell, the sensing apparatus provides an output signal indicating a parameter of the gas output; and a computer in operable communication with the sensing apparatus. The computer includes a memory device configured to store a first operational parameter, and a processor configured to receive a digital representation of the output signal and the first operational parameter. The processor compares the digital representation of the output signal to the first operational parameter for regulating the quantity of energy provided to the electrochemical cell.

Abstract: An electroplating apparatus is provided with a metal target and a device for supporting a semiconductor wafer (or other workpiece) in an electroplating solution. The target (anode) may be located relatively far from the wafer surface (cathode) at the beginning of the plating process, until a sufficient amount of metal is plated. When an initial amount of metal is built up on the wafer surface, the target may be moved closer to the wafer for faster processing. The movement of the target may be controlled automatically according to one or more process parameters.

Abstract: A first system is provided that is configured to pattern a substrate that includes (1) a lithography subsystem configured to form a patterned masking layer on the substrate; and (2) an etch subsystem configured to receive the substrate after the patterned masking layer has been formed thereon and to etch the substrate to form one or more etched features on the substrate, the etch subsystem having an integrated inspection system configured to inspect the substrate; and (3) a controller coupled to the lithography subsystem and the etch subsystem. The controller includes computer program code configured to communicate with each subsystem and to perform the steps of receiving information about the substrate from the integrated inspection system of the etch subsystem; and adjusting a stepper focus of the lithography subsystem during formation of a subsequent patterned masking layer based at least in part on the information received from the etch subsystem.

Abstract: A diagnostic method and device for use in detecting or quantitating an analyte present in a liquid sample. The method includes reacting an analyte-containing sample with reagents capable of generating a first coil-forming peptide in solution form. This peptide is then contacted with a biosensor whose detection surface has surface-bound molecules of a second, oppositely charged coil-forming peptide, under conditions effective to form a stable &agr;-helical coiled-coil heterodimer on the detection surface. The formation of the coiled-coil heterodimer produces a measurable change in biosensor signal, which is measured to detect the presence of or quantitate the amount of analyte in a sample. Also disclosed is a biosensor device for carrying out the reaction.

Abstract: The present invention includes apparatus and methods for measuring impedance of a layer of deposited metal on a substrate and controlling deposition uniformity during electroplating. A first circuit delivers plating current to a metal layer on the substrate, and a second circuit, electrically isolated from the first, measures the impedance. Methods of the invention provide multi-point sheet resistance measurements before and during an electroplating process on a substrate. In a specific example, resistance is measured via a copper seed layer during electroplating.

Abstract: A counter electrode for use in an electrochemical cell suitable for analysis of an electroplating composition, the counter electrode comprising a conductor; a sheath disposed about the conductor; an electrolyte disposed within the sheath; and an optionally porous element on the sheath, the porous element providing signal communication between the electrolyte and an analyte.

Abstract: An apparatus for determining ions strength in a solution. In relation to a chlorinator, a control circuit senses the strength of the brine by determining current flow through an associated chlorinator. Depending on the level of current flow, different signal configurations occur to advise of the status of the apparatus.

Abstract: For an electromechanical machining of a work piece there is an optimal pulse duration for the machining pulses corresponding to the maximum copying accuracy. Such an optimal pulse duration corresponds to a certain value of the gap. By alternating the machining pulses with measurement pulses it is possible to obtain an accurate information about the gap dimensions on-line during the electrochemical machining process. The process control means (20) are used to automate the electromechanical machining, while keeping it in the optimal mode. For this purpose the process control means (20) comprise the pulse control unit (26) to establish the pulse duration of the voltage pulses to be applied across the gap (4).

Abstract: A micro-electronic bond degradation sensor includes a sensor substrate having sensor circuitry and a sensor stud and a power stud extending therefrom. The sensor circuitry includes a voltage-to-current amplifier having an input coupled to sensor stud and an output coupled to the power stud. The voltage-to-current amplifier is operable to convert a voltage signal occurring along the sensor stud to a current signal output along the power stud.

Abstract: A device and method for etching a wire to manufacture it into a tip for a scanning probe microscope or the like. The wire etching device generates a voltage signal for determining the level of a wire etching voltage, and applies the etching voltage of the level determined depending on the generated voltage signal to the wire to primarily etch it. The wire etching device measures the amount of etching current generated during the primary etching process and controls the level of the voltage signal according to the measured etching current amount so as to control the level of the etching voltage. Then, the device secondarily etches the wire with the level-controlled voltage signal. Therefore, the wire etching device can manufacture the tip while controlling its curvature radius and aspect ratio and reducing the amount of oxide on its surface.

Abstract: Controlled-potential electroplating provides an effective method of electroplating metals onto the surfaces of high aspect ratio recessed features of integrated circuit devices. Methods are provided to mitigate corrosion of a metal seed layer on recessed features due to contact of the seed layer with an electrolyte solution. The potential can also be controlled to provide conformal plating over the seed layer and bottom-up filling of the recessed features. For each of these processes, a constant cathodic voltage, pulsed cathodic voltage, or ramped cathodic voltage can be used. An apparatus for controlled-potential electroplating includes a reference electrode placed near the surface to be plated and at least one cathode sense lead to measure the potential at points on the circumference of the integrated circuit structure.

Abstract: A finite element model of the environment of electrodeposit coating is prepared by a simulation method, change of an electric field in an electrolytic cell for the case of electrodeposit coating is simulated, the distribution of currents then flowing through individual parts of a finite element model of a to-be-coated object is obtained, the electric variables of currents flowing through the respective surfaces of the finite elements of the to-be-coated object are obtained and accumulated according to the current distribution, the thickness of an electrodeposition coating film is calculated as h=&Sgr;KFICC.E.&Dgr;t/&rgr; if the cumulative electric variable is higher than a deposition starting electric variable such that a fixed concentration is attained by OH− or H+.

Abstract: The present invention is to provide a conduction detection device that can detect electrical conductivity (contact condition) of feeding contacts with conductive layers of a substrate. The present invention also provides an electroplating apparatus, which is able to produce uniform currents to flow through each of feeding contacts. The apparatus has a plating vessel, in which an electrode is disposed opposite to a substrate which is affixed to a plating jig electrically through a plurality of feeding contacts for applying a specific voltage between the electrode and conductive layers provided on a plating surface of the substrate. Plating current flows from the plating jig through the feeding contacts to the substrate. A conduction detection device is provided to detect electrical conductive states between the plurality of feeding contacts and the conductive layer on the substrate.

Abstract: An automated chemical management system for managing the chemical content of an electrochemical bath used to deposit a material on the surface of a microelectronic workpiece is set forth. The automated chemical management system includes a dosing system that is adapted to dose an amount of one or more chemicals to replenish a given electrochemical bath constituent in accordance with a predetermined dosing equation. The chemical management system also includes an analytical measurement system that is adapted to provide a measurement result indicative of the amount of the given constituent in the electrochemical bath at predetermined time intervals. The chemical management system uses the measurement results to modify the dosing equation of the dosing system. In this manner, the replenishment operations executed by the chemical management system are effectively refined over time thereby providing more accurate control of the amount of the target constituent in the electrochemical bath.

Abstract: The invention relates to a method for controlling the recovery of a metal, such as silver, from a solution flowing through an electrolytic cell. A constant current is applied between the anode and cathode of the cell and the rate of change of the voltage monitored, the information obtained from the monitored change of voltage being used to control the rate of recovery of the metal.

Abstract: A method for on-line removal of cathode depositions during electrochemical process. The process control means (30) are arranged to alternate the unipolar machining voltage pulses U1 with the voltage pulses of opposite polarity U2 to the work piece (2) and the cathode (3). The process control means comprise an arrangement to determine the amount of cathode depositions on-line based on the operational parameter. Only in case the operational parameter exceeds the allowable level, the process control means (30) alternate the unipolar machining voltage pulses U1 with the voltage pulses of opposite polarity U2. In this case the cathode wear is minimized.

Abstract: For an electromechanical machining of a work piece there is an optimal pulse duration for the machining pulses corresponding to the maximum copying accuracy. Such an optimal pulse duration corresponds to a certain value of the gap. By alternating the machining pulses with measurement pulses it is possible to obtain an accurate information about the gap dimensions on-line during the electrochemical machining process. The process control means (20) are used to automate the electromechanical machining, while keeping it in the optimal mode. For this purpose the process control means (20) comprise the pulse control unit (26) to establish the pulse duration of the voltage pulses to be applied across the gap (4).

Abstract: An electroplating apparatus and method that can detect the film thickness of a plated film, which is being deposited on the surface, to be plated, of a substrate, consecutively in real time, thereby enabling the detection of the end point of plating. The electroplating apparatus for plating a substrate by filling a plating solution between the substrate held by a substrate holding portion and an anode, and applying a voltage between the substrate and the anode, includes at least one of a voltage monitor for monitoring the voltage applied between the substrate and the anode, thereby detecting the end point of the electroplating, and a current monitor for monitoring an electric current that flows through a detection circuit, which is formed by connecting at least two cathode electrodes and to which a constant voltage is applied, thereby detecting the end point of the electroplating.

Abstract: Fuel concentrations are determinable in a solid oxide fuel cell through voltage measurement of one or more fuel cell units, which voltage is a function of hydrogen gas present in the fuel feed stream to the one or more fuel cell units. The voltage in the one or more fuel cell units is proportionally related to the fuel concentration in the fuel feed stream to the entire fuel cell. A sensor determines concentrations of the fuel flowing in the fuel cell. The sensor comprises a fuel cell unit, and an indicator electrically coupled to the fuel cell unit, the indicator being capable of displaying a voltage or being adapted to convert a voltage to a fuel concentration display. The voltage measured is correlated to the fuel concentration flowing in the fuel cell.

Abstract: The present invention provides a conductivity sensing device capable of detecting the conductivity (contact state) of the plurality of feeder contacts contacting the conductive area of the substrate, and a plating apparatus capable of forming a plating film of uniform thickness by supplying a uniform plating current through a plurality of feeder contacts.

Abstract: A single delivery channel is formed by, and between, inner wall 2 and baffle 3. Electrolyte 5 is pumped up the interior of channel 1 and is directed onto substrate 4 being a cathode maintained at −10 volts. The upper part of the inner wall 2 of channel 1 forms the anode such that electrote is forced between the substrate and the upper horizontal surface of the anode 6. A second baffle 7 is provided in order to assist in collecting and removing electrolyte 5 after impingement with substrate 4, possible for re-use. Contact between the electrolyte 5 and substrate 4 is optimised by providing the electrolyte with a swirling motion as it passes up channel 1. Anode 6 is a solid conducting bar 10, alternatively it is formed of solid rods 11 nor tubes 12.

Abstract: A method and a device for controlling the movement of a combined alumina feeding and crust breaking chisel in an aluminum production cell, wherein the chisel is moved downwards and upwards by means of a pneumatic cylinder which is alternatively fed with pressurized air, wherein electrical contact between the chisel and the melt is detected when the chisel reaches the melt, wherein it is monitored whether said electrical contact has been reached within a predetermined time interval, and if not, air at a second, high, pressure is fed to said first, and wherein air at high pressure is fed to the second side of the cylinder after said electrical contact has been established so as to quickly withdraw the chisel from the hot melt in order to minimize heat transfer from the melt to the cylinder.

Abstract: An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a polishing pad and a platen. The platen is formed of conductive material, is disposed proximate to the polishing pad and is configured to have a negative charge during at least a portion of a planarization process. At least one electrical conductor is positioned within the platen. The electrical conductor has a first end connected to a power source. A workpiece carrier is configured to carry a workpiece and press the workpiece against the polishing pad. The power source applies a positive charge to the workpiece via the electrical conductor so that an electric potential difference between the metallized surface of the workpiece and the platen is created to remove at least a portion of the metallized surface from the workpiece.

Abstract: The present invention relates to a device that supplies electricity to a substrate. In one embodiment, the device includes multiple contacts, a current sensor, and a current regulator. The current sensor is attached to each of the plurality of contacts to sense their electric current. A current regulator controls current applied to each of the multiple contacts in response to the current sensor. In another embodiment, a compliant ridge is formed about the periphery of each contact to seal the contact from undesired chemicals.

Abstract: Methods for electroplating metal can include passing an electrical current through a conductive surface and an electroplating solution adjacent the conductive surface. An electroplating voltage for the conductive surface and the electroplating solution can be determined based on the electrical current through the conductive surface and the electroplating solution adjacent the conductive surface. The determined electroplating voltage can then be maintained while electroplating the metal from the electroplating solution on the conductive surface. Related systems are also discussed.