Abstract: A transparent conductive film comprises a transparent substrate and a metal wiring portion formed thereon. A thin metal wire contained in an electrode portion in the metal wiring portion has a surface shape satisfying the condition of Ra2/Sm>0.01 ?m and has a metal volume content of 35% or more. Ra represents an arithmetic average roughness in micrometers and is equal to or smaller than the thickness of a metal wiring located in a position where the surface roughness is measured. Sm represents an average distance between convex portions and is 0.01 ?m or more.

Abstract: A method for plating strips including providing a strip of material, providing a masking belt including patterned windows, providing a tank with a plating solution, generating a continuous movement in the cell of an assembly of the strip and masking belt, whereby the structure of the masking belt masks portions of the strip in the tank.

Abstract: An electroplating system is provided for electroplating a workpiece. The system includes a plating wheel having a side and a cylindrical wall extending from the side. The plating wheel has an interior chamber that at least partially defines a solution chamber that is configured to hold an electroplating solution. The cylindrical wall includes an opening extending through the cylindrical wall into fluid communication with the interior chamber. An external anode is located proximate to and positioned outside the cylindrical wall of the plating wheel to define an electroplating work area therebetween. An internal anode is held within the interior chamber of the plating wheel and positioned to align with the work area.

Abstract: A method for producing a connector has first to fifth processes. In the first process, a contact unit having a plurality of contacts and a tying part, is formed with the contacts tied at each axial direction middle part of the contacts by the tying part and with the contacts arranged parallel to each other. In the second process, a plating layer is formed on a part of the contact unit by soaking the contact unit in a plating bath from an axial direction one end side of the contact unit to an axial direction middle part of the tying part. In the third process, the contacts are isolated by cutting the tying part. In the fourth process, a part where the plating layer is formed, of the contact is inserted into a hole of a circuit board. In the fifth process, the contacts are soldered to the circuit board.

Abstract: A partial plating method capable of applying fine hard gold plating, a laser plating device capable of applying partial plating to a minute region with high positional precision, and a plated member. The partial plating method comprising plating a region to be plated by projecting a laser beam having a wavelength of 330 nm or more and 450 nm or less. A laser plating device comprises a plating tank, a laser oscillator for emitting a laser beam, a conveying device for conveying a member to be plated, a photoelectronic sensor for detecting the position of a positioning hole of the member to be plated, and a galvanometer scanner having a galvanometer mirror capable of scanning the laser beam. The plated member is applied with fine spot plating by the laser plating device.

Abstract: A continuous plating system with mask registration is disclosed herein that uses drums and rollers with protruding pins which engage with guide holes in a masking belt and a lead frame. Through engagement with the pins the masking belt is keyed to the lead frame as the lead frame passes through a plating solution tank.

Abstract: A continuous plating system with mask registration is disclosed herein that uses drums and rollers with protruding pins which engage with guide holes in a masking belt and a lead frame. Through engagement with the pins the masking belt is keyed to the lead frame as the lead frame passes through a plating solution tank.

Abstract: A plating processing method comprises performing a continuous electrolytic plating of the surface of a film having a surface resistivity in the range of 1 ?f/Sq to 1000 ?/Sq, wherein a distance between the lowest contacting part of a negative electrode with the film and a plating liquid is in the range of 0.5 cm to 15 cm.

Abstract: A photosensitive film, which has a transparent support and a silver salt emulsion layer containing a silver salt formed thereon, is exposed and developed to form a metallic silver portion. The base material to be plated is electrified in an electrolytic solution free of plating substances, using the metallic silver portion as a cathode. Then, the electrified base material is subjected to an electroless plating treatment to form a first plated layer only on the metallic silver portion. The base material is subjected to an electroplating treatment to form a second plated layer on the first plated layer, further form a third plated layer on the second plated layer.

Abstract: A method for plating a FPCB base board, comprising the steps of: providing a FPCB base board comprising a sprocket region; and placing an insulation shielding plate spatially opposite to the sprocket region of the FPCB base board to limit a thickness of a plating layer formed on the sprocket region of the FPCB base board.

Abstract: A multi-layered wafer support apparatus is provided for performing an electroplating process on a semiconductor wafer (“wafer”). The multi-layered wafer support apparatus includes a bottom film layer and a top film layer. The bottom film layer includes a wafer placement area and a sacrificial anode surrounding the wafer placement area. The top film layer is defined to be placed over the bottom film layer. The top film layer includes an open region to be positioned over a surface of the wafer to be processed, i.e., electroplated. The top film layer provides a liquid seal between the top film layer and the wafer, about a periphery of the open region. The top film layer further includes first and second electrical circuits that are each defined to electrically contact a peripheral top surface of the wafer at diametrically opposed locations about the wafer.

Abstract: Embodiments of the invention contemplate the formation of a low cost flexible solar cell using a novel electroplating method and apparatus to form a metal contact structure. The apparatus and methods described herein remove the need to perform one or more high temperature screen printing processes to form conductive features on the surface of a solar cell substrate. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. Solar cell substrates that may benefit from the invention include flexible substrates may have an active region that contains organic material, single crystal silicon, multi-crystalline silicon, polycrystalline silicon, germanium, and gallium arsenide, cadmium telluride, cadmium sulfide, copper indium gallium selenide, copper indium selenide, gallilium indium phosphide, as well as heterojunction cells that are used to convert sunlight to electrical power.

Abstract: A metal and oxygen material such as a transparent electrically conductive oxide material is electro deposited onto a substrate in a solution deposition process. Process parameters are controlled so as to result in the deposition of a high quality layer of material which is suitable for use in a back reflector structure of a high efficiency photovoltaic device. The deposition may be carried out in conjunction with a masking member which operates to restrict the deposition of the metal and oxygen material to specific portions of the substrate. In particular instances the deposition may be implemented in a continuous, roll-to-roll process. Further disclosed are semiconductor devices and components of semiconductor devices made by the present process, as well as apparatus for carrying out the process.

Abstract: This invention involves unique electroplated items comprising electrically conductive polymers. In addition, novel processing is taught to facilitate continuous production of electrically treated items. Many embodiments employ directly electroplateable resins for particular advantage. Unique methods of establishing electroplated electrical connections are taught.

Abstract: A continuous plating system with mask registration is disclosed herein that uses drums and rollers with protruding pins which engage with guide holes in a masking belt and a lead frame. Through engagement with the pins the masking belt is keyed to the lead frame as the lead frame passes through a plating solution tank.

Abstract: Embodiments of the invention contemplate the formation of a low cost solar cell using a novel high speed electroplating method and apparatus to form a metal contact structure having selectively formed metal lines using an electrochemical plating process. The apparatus and methods described herein remove the need to perform one or more high temperature screen printing processes to form conductive features on the surface of a solar cell substrate. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connection that is reliable and cost effective. Therefore, one or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing a common metal, such as copper.

Abstract: A continuous plating system with mask registration is disclosed herein that uses drums and rollers with protruding pins which engage with guide holes in a masking belt and a lead frame. Through engagement with the pins the masking belt is keyed to the lead frame as the lead frame passes through a plating solution tank.

Abstract: The invention teaches novel structure and methods for producing electrical current collectors and electrical interconnection structure. Such articles find particular use in facile production of modular arrays of photovoltaic cells. The current collector and interconnecting structures may be initially produced separately from the photovoltaic cells thereby allowing the use of unique materials and manufacture. Subsequent combination of the structures with photovoltaic cells allows facile and efficient completion of modular arrays. Methods for combining the collector and interconnection structures with cells and final interconnecting into modular arrays are taught.

Abstract: Embodiments of the invention relate to plating systems configured to strip plate a selected portion of a workpiece (e.g., a lead frame) and methods of plating. In one embodiment, a plating system is configured to plate a selected portion of a workpiece and at least partially compensate for wheel run out. As an alternative, or in addition, to the plating system being configured to at least partially compensate for wheel run out, in another embodiment, a plating system is configured to plate the selected portion of the workpiece and provide for controllably adjusting plating dimensions on the selected portion to be plated.

Abstract: A plating machine for plating a film carrier tape for mounting electronic parts includes a plating tank for plating wiring patterns of a film carrier tape and also has a bubble adhesion prevention means that is position adjustable with respect to the surface of a plating solution contained in the plating tank. The process for producing film carrier tapes for mounting electronic parts comprises partially immersing a film carrier tape in a plating solution contained in a plating tank and selectively plating wiring patterns formed in the immersed area while adsorbing bubbles generated in the plating solution to a bubble adhesion prevention means arranged at the surface of the plating solution.

Abstract: A method to make probes of a probe card includes providing a blocking plate on an electroplating tank. The blocking plate has a plurality of openings according to the layout of contact pads on a probe head. There are bumps on the contact pads of the probe head. Continuous electroplating process can be executed after bumps (contact pads) contact electroplating solution in the electroplating tank through the openings of the blocking plate. By continuously moving the probe head according to the desired shape of probes, probes were formed by electroplating. These probes can be made into different shapes with good uniformity in elasticity and heights to increase the quality of electrical contact during wafer probing. Moreover, the process lead time and fabrication cost are saved.

Abstract: The present invention relates to a web handling apparatus and process ideally suited for applications involving wet chemistry. The invention involves the horizontal processing of webs in processing containers. The web is redirected into the processing container by inserting a cassette across the web and into the processing container. The cassette includes at least one functional fluid element that facilitates processing of the web. The web handling practices of the invention improve the quality of the processed web. The invention is preferably used in electrodeposition processes.

Abstract: For electrolytic treatment of electrically mutually insulated, electrically conductive structures 4 on surfaces of electrically insulating foil material (Fo), is unloaded from a store 15?, 15?, transported on a conveying line through a treatment unit 1 and brought in contact with treatment fluid F1. During transportation, the material Fo is guided past at least one electrode arrangement, having at least one cathodically polarised electrode 6 and at least one anodically polarised electrode 7, both being brought in contact with the treatment fluid F1 and being connected to a current/voltage source 8. Current flows through the electrodes 6, 7 and the electrically conductive structures 4. The electrodes 6, 7 are screened from each other so that substantially no electric current is able to flow directly between oppositely polarised electrodes 6, 7. The material Fo is finally loaded back onto a store 15?, 15?.

Abstract: A method for the continuous selective electroplating of a metallic substrate material (10) and more particularly of a substrate material band having prestamped contact elements, comprises the following steps: a) the substrate material (10) is coated in an electrophoretic coating means (14) with an electrophoretic coating composition selective with at least one composition strip, b) the at least one composition strip is removed at those parts by means of a laser (40), which are to be electroplated, c) in an electroplating process a metal layer is applied to the areas (42) deprived of composition in at least one composition strip using selective electroplating and d) the at least one composition strip is then removed.

Abstract: A two-layered anode (1?) has a lower layer (2) including a non-conductive carrier material to which a conductive electrode layer (3?) is applied. Non-conductive areas, formed by partial removal of the electrode layer, have a predetermined structure corresponding to the structure of a structured polymer film (11) to be formed. The anode (1?) is connected with a platinum cathode in an electrolyte into which compounds of low molecular weight, preferably monomers of the polymer film (11), are introduced. During current flow, a conductive polymer film (11) of the predetermined structure is formed on conductive areas brought into contact with the electrolyte. A non-conductive substrate layer (13) is applied to the structured polymer film (11). The structured polymer film (11) adheres to the non-conductive substrate layer (13) and can be released from the electrode (1?) without damaging the electrode.

Abstract: A plating machine for plating a film carrier tape for mounting electronic parts includes a plating tank for plating wiring patterns of a film carrier tape and also has a bubble adhesion prevention means that is position adjustable with respect to the surface of a plating solution contained in the plating tank. The process for producing film carrier tapes for mounting electronic parts comprises partially immersing a film carrier tape in a plating solution contained in a plating tank and selectively plating wiring patterns formed in the immersed area while adsorbing bubbles generated in the plating solution to a bubble adhesion prevention means arranged at the surface of the plating solution.

Abstract: Disclosed are a process for producing a zinc oxide film comprising the steps of transporting a conductive long substrate via above at least one electrode comprised of zinc in an electrodeposition bath held in an electrodeposition tank and applying an electric field between the electrode and the conductive long substrate, thereby forming a zinc oxide film on the conductive long substrate, the process comprising a first step of forming the zinc oxide film on a part of the conductive long substrate; a second step of stopping the application of the electric field and the transportation; and a third step of bringing at least a region of a part of the conductive long substrate being in contact with the electrodeposition bath in the second step into non-contact with the electrodeposition bath, and an apparatus suitably used for the process. The process and apparatus enables high-quality zinc oxide films to be produced.

Abstract: A plating apparatus includes a plating vessel for holding a plating bath containing at least metal ions, a conveying device for conveying a long conductive substrate and immersing the long conductive substrate in the plating bath, a facing electrode disposed in the plating bath so as to face one surface of the conductive substrate, a voltage application device for performing plating on the one surface of the conductive substrate by applying a voltage between the conductive substrate and the facing electrode, and a film-deposition suppression device fixedly disposed in the plating vessel so that at least a portion of the film-deposition suppression means is close to shorter-direction edges of the conductive substrate. At least a portion of the film-deposition suppression device close to the shorter-direction edges of the conductive substrate is conductive.

Abstract: A method for continuously electroplating metal webs by coating a masking ink thereto in a fashion resembling flexographic printing, then electroplating the uncoated areas of the web and finally removing the ink, is described. The masking ink is applied continuously from a reservoir to an “anilox” roller which synchronously and rotatingly contacts either a plate roller or an intermediate roller. Contact between the rollers transfers the masking ink from one roller to the other. The plate roller has “proud” or raised areas in which the ink is drawn and contacts a guided metal web that is coated with the ink in a pattern matching that of the plate roller. Electroplating is effected after cleaning the inked web in an aqueous acid media. Finally, the masking ink is removed in an alkali medium.

Abstract: An aluminum workpiece, e.g. sheet for containerstock, having an anodic oxide film whose thickness varies from location to location on the surface, whereby interference contrast effects are visible on the surface. Aluminum foil having on a surface thereof an unsealed anodic oxide film 5-1000 nm thick which provides a clean surface with fretting resistance. A method of anodizing thin aluminum foil is also described.

Abstract: A process and apparatus for the selective electroplating of electrical coct elements, used for coating at least one contact surface of a metal base for the contact elements with an electrolyte, containing a material with a higher conductivity as compared to the base. The electrolyte is applied with a long stretched-out plastic electroplating tip which has a plurality of channel passages through which the electrolyte passes and which are arranged at a right angle to the tip. The plurality of channel passages terminates at and empties into at least one discharge opening which extends along the entire length of the tip. The electroplating tip, when it is in the operating position, is arranged such that the at least one discharge opening is positioned on the bottom and extends horizontally. The electrolyte is supplied to the electroplating tip from above.

Abstract: Provided are a method for manufacturing a suspension element having a pattern of wiring lines and an equipment for the same. The method includes the steps of: preparing a roll of band-shaped sheet used as a substrate of the suspension element; sequentially performing processes to the sheet through a series of processing sections to integrally form the suspension element with the pattern of wiring lines within a predetermined region of the sheet, and transferring the sheet in a wound state like a roll from one of the processing sections to the next processing section.

Abstract: Electrical conductors (2) embedding filaments (4) of a fabric (3), and substantially filling interstices (5) that coextend with the imbedded filaments (4), are fabricated by plating conductive material onto a surface (14) of a passivated cathode against which the fabric (3) is held. Resist material (19) conforms the conductive material to form an array of electrical conductors (2).

Abstract: A method and apparatus for depositing emitter material (3) on a wire cathode by means of electrodeposition. An amount (13) of a suspension comprising an alkaline-earth compound is transferred by a drop holder (11) which is positioned around the wire (2), by movement in a direction transverse to a longitudinal axis of the wire (2), whereafter an electric voltage is applied to the drop holder (11) and the wire (2) to deposit the emitter material (3) on the wire (2), after which the drop holder (11) is withdrawn from the wire (2) again. During the electrodeposition process the drop holder (11) and the wire (2) can be moved with respect to each other along sections of the wire (2) where the emitter material (3) has to be deposited.

Abstract: The invention relates to a method and an apparatus for selectively electroplating apertured products. The products are masked in accordance with the intended plating and subsequently exposed to an electrolyte in order to electroplate the products. For masking purposes a fully closed photoresist layer is electrophoretically applied to the products, and after drying of the photoresist layer, the products are covered with a photomask in accordance with the locations to be plated, after which exposure takes place. Then the photoresist layer is partially removed, while the remaining part of the photoresist layer remains behind on the products, to serve as a mask for the metal products upon electroplating.

Abstract: An electrolytic cell comprised of a tank for holding electrolytic solution, and a drum rotatable about a horizontal axis having a non-conductive cylindrical outer surface disposed within the tank, and a plurality of elongated, like anodes arranged about the outer surface of the drum. The anodes together form a generally continuous cylindrical surface spaced from, and generally conforming to, the outer surface of the drum. Each of the anodes has at least one end projecting through the tank. A plurality of power sources is provided together with connection means for connecting groups of one or more of the projecting ends of the anodes to each power source.

Abstract: Electroplating cell comprising an electrolysis tank (2) containing a plating solution (S), at least one immersed anode (3), means for making a strip run through the solution (S) in front of said anode (3), from one of its edges (3A) to the opposite edge (3B), and electrically insulating masks (4A, 4B) arranged along said edges (3A, 3B).Said masks overhang said edges by an amount at least equal to the distance separating said anode (3) from said strip and overlap them by an amount less than the same distance.Application to coating with an alloy, especially a zinc-based alloy, especially in installations having several successive cells.The quality of the coating is improved, something which facilitates the subsequent forming and painting of the coated sheet.

Abstract: A process for the treatment of a material having an aluminum oxide layer comprising (a) treating the aluminum oxide layer with an aqueous solution of a pure and crystalline alkali metal silicate, and (b) rinsing the treated aluminum oxide layer with ion-containing water. A substrate so produced is useful in offset printing.

Abstract: A process for preparing a solderable lead frame from a copper base lead frame is disclosed using plating of tin or tin alloys followed by plating of palladium. Preferably, the tin plating is a spot plating to deposit tin only on the external leads and the palladium plating is a flood plating to deposit palladium over the entire lead frame. A diffusion barrier, preferably of cobalt or nickel, can be applied by plating the base lead frame before tin plating.

Abstract: A method and apparatus for continuously forming primed circuits, the apparatus including a cylindrical drum rotatable about a generally vertical axis and a tank for holding an electrolytic plating solution. The tank is dimensioned to surround a lower portion of the drum and immerse the lower portion of the drum in the electrolytic plating solution. Means for introducing electrolytic solution into the tank are provided, and a plurality of metallic anodes are disposed within the tank surrounding and facing the lower portion of the drum defining a generally uniform gap therebetween. A plurality of cathodes are disposed above the tank and facing an upper portion of the drum, the cathodes being biased toward the drum. The apparatus is adapted to receive a movable continuous flexible web having a thin layer of conductive metal on one side thereof. The metal layer is masked to expose a plurality of patterns aligned along the web and a continuous strip of exposed metal along one edge of the web.

Abstract: A multi-layer wiring board where a plurality of wiring boards are laminated. The wiring board comprises a flexible insulating layer having a through hole and a wiring pattern formed on the flexible insulating layer. The wiring pattern is composed at least of two conductive layers. The first conductive layer formed on the insulating layer is made of a non-metallic conductor and the first wiring pattern is formed by a laser beam. The second conductive layer is an electroplated layer formed on the first wiring pattern. The first and second conductive layers have different reflectance for a beam.

Abstract: Apparatus and method for the electrolytic deposition of a metal on a weakly conductive, flexible substrate such as a textile or a paper sheet for the manufacture of flexible heating elements such as heated gloves, heated car seats, panels used in construction for the heating of rooms, etc. Metallic circuits of varying shapes can be formed on the weakly conductive, flexible substrate.

Abstract: This invention relates to a method and apparatus for selective electroplating of metals on metal or metallized products in an elongated strip. Use is made of an apparatus in which an assembly of a masking belt and the product strip are guided along means for exposing the products to an electrolyte. Masking belt and product strip have been provided with holes distributed in a regular pattern over their respective lengths, while driving means are provided lengthwise transport masking belt and product strip. By means of proximity sensors, signals are obtained which indicate the position of the holes in the masking belt and product strip in positions which, related to the direction of travel of belt and strip are situated up stream and nearby the means for exposing the products to an electrolyte.

Abstract: A carrier web of sheet metal material joining stamped and formed components of an electrical connector is disclosed. The component is carried through the stamping and forming process by the carrier web of the sheet metal material. The component is stamped and formed from the material such that at least a portion of the component projects from one side of the original plane of the sheet metal material. The carrier web is formed into a three-dimensional configuration to reduce the spacing between adjacent components. A portion of the web may project a sufficient distance from the one side of the original plane of the sheet metal material to protect the projecting portion of the component during subsequent manufacturing operations on the component. A retaining structure may also be provided to retain the components at a predetermined spacing on the carrier web.

Abstract: Lead frames for microchips and other integrated circuit dies are produced by a continuous manufacturing method and apparatus in which silver spot plating is done prior to etching away unwanted portions of the lead frame substrate. A flexible substrate of a metal alloy is fed continuously from a reel, then spot plated with silver, coated with a photosensitive material, and exposed to intensive light in an exposure chamber using a photoresist or masking tool of predetermined design. The exposed photosensitive material is developed chemically, etched in acid, and placed in a chemical solution to remove any remaining unwanted material. The strip is then dried, cut to predetermined lengths and boxed for shipment. If necessary, the strip is downset and taped before packaging. In a presently preferred process, the metal alloy substrate is 42 alloy (Fe+Ni), and the selective spot plating is silver 100 to 150 microinches thick.