Completely Coating One Side Of Strip Patents (Class 205/130)
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Patent number: 11242253Abstract: Provided is a method which not only prevents (i) accumulation of fine silicon powder in a separation device and a pipe which are provided in steps after passage of a filter and (ii) damage to a pump, but also reduces adhesion of a silane oligomer to the filter. A method, in accordance with an embodiment of the present invention, for producing polycrystalline silicon, includes: a silicon deposition step; a separation step; and a fine powder removal step of removing the fine silicon powder by passing a chlorosilane condensate through a filter.Type: GrantFiled: December 28, 2017Date of Patent: February 8, 2022Assignee: TOKUYAMA CORPORATIONInventor: Yuichi Inoue
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Publication number: 20140076732Abstract: The present invention provides a device for single-sided electrolytic treatment of a flat substrate. The device comprises a bath for electrolytic fluid and conveying means for conveying the flat substrate in a conveying direction at the free surface of the fluid in the bath, with the flat substrate being horizontally oriented such that the underside of the flat substrate makes contact with the free surface of the fluid in the bath. The conveying means comprise two conveying elements disposed opposite each other, which extend along two respective conveying paths, which conveying paths each comprise an electrolytic part, which electrolytic parts extend on two opposite longitudinal sides of the bath.Type: ApplicationFiled: October 6, 2011Publication date: March 20, 2014Applicant: MECO EQUIPMENT ENGINEERS B.V.Inventor: Peter Jacobus Gerardus Loermans
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Patent number: 7799182Abstract: Embodiments of the invention contemplate the formation of a low cost flexible solar cell using a novel electroplating method and apparatus to form a metal contact structure. The apparatus and methods described herein remove the need to perform one or more high temperature screen printing processes to form conductive features on the surface of a solar cell substrate. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. Solar cell substrates that may benefit from the invention include flexible substrates may have an active region that contains organic material, single crystal silicon, multi-crystalline silicon, polycrystalline silicon, germanium, and gallium arsenide, cadmium telluride, cadmium sulfide, copper indium gallium selenide, copper indium selenide, gallilium indium phosphide, as well as heterojunction cells that are used to convert sunlight to electrical power.Type: GrantFiled: December 1, 2006Date of Patent: September 21, 2010Assignee: Applied Materials, Inc.Inventors: Sergey Lopatin, David Eaglesham, Charles Gay
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Patent number: 7544274Abstract: There is provided a plating method and device having a fixed drum (20) in which an anode (21) is exposed on the external peripheral surface; a rotating drum provided on the external periphery of the fixed drum, onto which a workpiece W transported in the longitudinal direction is wound; an annular opening (35) formed at the bottom of the rotating drum and provided so as to penetrate from the external periphery of the rotating drum to the internal periphery continuously in the peripheral direction of the rotating drum; a plating solution feeding channel (22) that leads into the fixed drum and is formed in a position on the external periphery of the fixed drum corresponding to the angle position (52a) of the prescribed arc of contact of the rotating drum onto which the workpiece is wound; a plating device for feeding the plating solution to the flow channel using the tunnel-shaped space (52) enclosed by the workpiece wound on the external periphery of the rotating drum, the peripheral wall of the annular openinType: GrantFiled: December 27, 2005Date of Patent: June 9, 2009Assignee: Dowa Metaltech Co., Ltd.Inventors: Hiroshi Miyazawa, Terumasa Inao
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Patent number: 7323093Abstract: A producing method of a flexible wired circuit board that can prevent the formation of a gap between an elongate substrate and a stiffener sheet bonded thereto to prevent contamination of the flexible wired circuit board obtained. In the process subsequent to the process of forming a conductive pattern 3 on a surface of the elongate substrate 1 by the semi-additive process using electrolysis plating and then annealing the elongate substrate 1 with the conductive pattern 3 in its wound up state, a stiffener sheet 9 having a width narrower than the elongate substrate 1 is bonded to the back side of the elongate substrate 1. Thereafter, an oxidized film formed on a surface of the conductive pattern 3 is removed and then a solder resist 11 is formed thereon. This prevents the strip of the stiffener sheet 9 from the elongate substrate 1 and in turn prevents etching solution or developing solution from entraining in a gap therebetween.Type: GrantFiled: September 28, 2004Date of Patent: January 29, 2008Assignee: Nitto Denko CorporationInventors: Toshiki Naito, Yoshifumi Shinogi, Takeshi Yamato
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Patent number: 7195796Abstract: A process is provided for making a composite work article suitable for fabricating rigid sheet metal can components. A steel sheet having first and second surfaces is pre-treated to enhance reception and retention of a multi-layer polymer coating on the pre-treated first surface. The multi-layer polymer coating is melt extruded on the pre-treated first surface and beyond opposite lateral edges of the work article to establish overhang portions, then solidified. The multi-layer polymeric coating has a tie polymeric layer contacting the pre-treated first surface, and a finish-surface polymeric layer.Type: GrantFiled: August 9, 2004Date of Patent: March 27, 2007Assignee: ISG Technologies, IncInventors: John A. Sinsel, Mark V. Loen, Michael S. Bailey
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Patent number: 7112264Abstract: A plating apparatus includes a plating vessel for holding a plating bath containing at least metal ions, a conveying device for conveying a long conductive substrate and immersing the long conductive substrate in the plating bath, a facing electrode disposed in the plating bath so as to face one surface of the conductive substrate, a voltage application device for performing plating on the one surface of the conductive substrate by applying a voltage between the conductive substrate and the facing electrode, and a film-deposition suppression device fixedly disposed in the plating vessel so that at least a portion of the film-deposition suppression means is close to shorter-direction edges of the conductive substrate. At least a portion of the film-deposition suppression device close to the shorter-direction edges of the conductive substrate is conductive.Type: GrantFiled: June 27, 2003Date of Patent: September 26, 2006Assignee: Canon Kabushiki KaishaInventors: Hidetoshi Tsuzuki, Noboru Toyama, Yasuyoshi Takai, Ryo Hayashi, Yuichi Sonoda, Masumitsu Iwata, Yusuke Miyamoto
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Patent number: 6733650Abstract: Disclosed are a process for producing a zinc oxide film comprising the steps of transporting a conductive long substrate via above at least one electrode comprised of zinc in an electrodeposition bath held in an electrodeposition tank and applying an electric field between the electrode and the conductive long substrate, thereby forming a zinc oxide film on the conductive long substrate, the process comprising a first step of forming the zinc oxide film on a part of the conductive long substrate; a second step of stopping the application of the electric field and the transportation; and a third step of bringing at least a region of a part of the conductive long substrate being in contact with the electrodeposition bath in the second step into non-contact with the electrodeposition bath, and an apparatus suitably used for the process. The process and apparatus enables high-quality zinc oxide films to be produced.Type: GrantFiled: July 3, 2001Date of Patent: May 11, 2004Assignee: Canon Kabushiki KaishaInventors: Yuichi Sonoda, Kozo Arao, Noboru Toyama, Yusuke Miyamoto
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Patent number: 6475367Abstract: There is disclosed an electrodeposition method capable of suppressing the drop in the power supply voltage and minimizing the heat loss by the electrodeposition current, thereby achieving uniform film formation with satisfactory characteristics. A conductive substrate is dipped in an electrodeposition bath held in an electrodeposition tank, and an oxide is electrolytically deposited on the conductive substrate.Type: GrantFiled: February 9, 2000Date of Patent: November 5, 2002Assignee: Canon Kabushiki KaishaInventors: Noboru Toyama, Kozo Arao, Yuichi Sonoda, Yusuke Miyamoto
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Patent number: 5637205Abstract: The invention describes a process for the electrolytical coating of an object of steel on one or both sides. Preferably, the object is a steel strip with zinc or a zinc iron alloy. Zinc or a zinc iron alloy is deposited on the object when the object is connected to form the cathode of a galvanic cell in an aqueous solution of zinc chloride and iron chloride with a pH of 0.1 to 3.0. The zinc chloride solution has a concentration of 50 to 1000 g/l for the deposition of metallic zinc. A partial flow of electrolyte solution is past continuously into a column filled with metallic zinc, where the trivalent iron formed there during the electrolysis is reduced to a bivalent iron, and metallic zinc is dissolved simultaneously therewith. The invention also describes an apparatus for the electrolytical coating of an object of steel.Type: GrantFiled: December 20, 1993Date of Patent: June 10, 1997Assignee: Andritz-Patentverwaltungs-Gesellschaft M.B.H.Inventors: Ulrich Krupicka, Gerald Maresch
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Patent number: 5618391Abstract: In a device for electrolytically coating one side of metal strips (2), the metal strips to be coated are guided around a rotary cathodic current roller (1), which they contact, and a partially cylindrical, insoluble anode (3) is arranged approximately concentrically around the current roller, at a distance thereof. The interval (4) between the section (21) of the strip guided on the current roller (1) and the anode (3) is delimited in the area of the strip edges (22) by seals (5) which can be oriented in a direction parallel to the axis of the roller. The electrolyte flows through the interval (4).Type: GrantFiled: May 9, 1995Date of Patent: April 8, 1997Inventors: Hans J. May, Roland Schnettler
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Patent number: 5618401Abstract: A method of making, for cathode ray tubes and the like, an inner shield material that has superior magnetic characteristics and rust resistance. The method does not require conventional blackening processes. Sheet steel or strip is nickel-plated with a nickel-iron diffusion layer and then annealed. The annealing improves the magnetic characteristics. The sheet is cold-rolled prior to annealing to provide a roughened surface, which decreases the chances of sticking during the annealing process. In one embodiment the sheet is pickled, cold-rolled, annealed, cold rolled again, nickel plated, and then annealed again. Annealing between the first and second cold-rolling operations improves the magnetic characteristics.Type: GrantFiled: January 24, 1995Date of Patent: April 8, 1997Assignee: Toyo Kohan Co., Ltd.Inventors: Giichiro Nomura, Osamu Yubuta
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Patent number: 5322614Abstract: In a process for the electrolytic deposition of metal on one side of a strip, preferably a steel strip which forms the cathode, the section (7) of the strip to be coated is guided through a gap between two parallel anodes (3,4) which are insoluble in the electrolyte (6). A voltage can be applied to the anodes (3,4) independently of each other. One of the two anodes is subdivided perpendicular to the direction of motion of the strip into several sections (41, 42, 43, 44) electrically insulated from each other. Voltages are selectively and independently applied to the anode sections to prevent the side of the strip facing the anode sections from being permanently coated and to prevent passivation of the anode sections.Type: GrantFiled: August 6, 1991Date of Patent: June 21, 1994Inventors: Hans J. May, Roland Schnettler