Resin Contains Etchable Filler Patents (Class 205/168)
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Patent number: 11577496Abstract: A polyamide resin composition and a molded article manufactured using the same. The polyamide resin composition includes: about 40 wt % to about 60 wt % of a polyamide resin including a repeat unit represented by Formula 1 and a repeat unit represented by Formula 2 as defined in the specification; about 1 wt % to about 10 wt % of a maleic anhydride-modified olefin-based copolymer; about 5 wt % to about 20 wt % of calcium carbonate subjected to surface treatment with a silane compound; and about 20 wt % to about 40 wt % of glass fibers, wherein the silane compound includes a functional group comprising an amino group, an epoxy group, and/or a (meth)acryloxy group. The polyamide resin composition and the molded article produced using the same can have good properties in terms of plating adhesion, impact resistance, thermal resistance, and/or appearance, and the like.Type: GrantFiled: December 27, 2018Date of Patent: February 14, 2023Assignee: Lotte Chemical CorporationInventors: Sang Hwa Lee, Yeong Deuk Seo, Sang Hyun Hong
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Patent number: 11565513Abstract: A polyamide resin composition and a molded article manufactured using the same. The polyamide resin composition includes: about 15 wt % to about 49 wt % of an aromatic polyamide resin including a repeat unit represented by Formula 1 and a repeat unit represented by Formula 2 as defined in the specification; about 1 wt % to about 30 wt % of a polyamide resin having a glass transition temperature of about 40° C. to about 120° C.; about 1 wt % to about 20 wt % of an olefin-based copolymer; and about 30 wt % to about 50 wt % of calcium carbonate. The polyamide resin composition and the molded article produced using the same can have good properties in terms of plating adhesion, impact resistance, thermal resistance, fluidity, and/or appearance, and the like.Type: GrantFiled: December 28, 2018Date of Patent: January 31, 2023Assignee: Lotte Chemical CorporationInventors: Sang Hwa Lee, Yeong Deuk Seo, Kyoung Tae Youm, Sang Hyun Hong
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Patent number: 11524492Abstract: A polyamide resin composition and a molded article manufactured using the same. The polyamide resin composition includes: about 15 wt % to about 49 wt % of an aromatic polyamide resin including a repeat unit represented by Formula 1 and a repeat unit represented by Formula 2 as defined in the specification; about 1 wt % to about 30 wt % of a polyamide resin having a glass transition temperature of about 40° C. to about 120° C.; about 1 wt % to about 20 wt % of an olefin-based copolymer; and about 30 wt % to about 50 wt % of calcium carbonate. The polyamide resin composition and the molded article produced using the same can have good properties in terms of plating adhesion, impact resistance, thermal resistance, fluidity, and/or appearance, and the like.Type: GrantFiled: December 28, 2018Date of Patent: December 13, 2022Assignee: Lotte Chemical CorporationInventors: Sang Hwa Lee, Yeong Deuk Seo, Kyoung Tae Youm, Sang Hyun Hong
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Patent number: 9267077Abstract: A chrome-free acidic aqueous solution of sulfuric acid and one or more organic acids and manganese (II) and (III) ions is applied to an organic polymer surface to etch the surface. The etched surface is then plated with metal.Type: GrantFiled: April 16, 2013Date of Patent: February 23, 2016Inventors: Katharina Weitershaus, Wan Zhang-Beglinger, Andreas Scheybal, Jonas Guebey
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Patent number: 8182594Abstract: An electroless nickel plating liquid capable of forming an underbarrier metal for metal bumps or solder bumps by electroless nickel plating with a uniform film thickness on silicon wafers composed of multiple IC chips contains a water-soluble nickel salt, a reducing agent, a complexing agent, and a pH buffer, wherein_lead ion is contained at 0.01-1 ppm, cobalt ion is contained at 0.01-1 ppm, and a sulfur compound is contained at 0.01-1 ppm.Type: GrantFiled: September 26, 2006Date of Patent: May 22, 2012Assignee: Nippon Mining & Metals Co., Ltd.Inventors: Eiji Hino, Masashi Kumagai
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Patent number: 6875471Abstract: The quality of painted surfaces of polymeric articles is improved by depositing a coating of a metal such as zinc or zinc alloy on the surface of the article to be painted. For example, zinc is electrodeposited on a conductive surface of the article. The metal coated polymeric surface provides a good base for electrostatic deposition of either liquid or powder paint and the metal surface prevents the formation of defects in the painted surface during heating of the article to dry or cure the paint film.Type: GrantFiled: November 25, 2002Date of Patent: April 5, 2005Assignee: General Motors CorporationInventors: Hsai-Yin Lee, Yar-Ming Wang, Tao Xie
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Patent number: 6872294Abstract: The quality of painted surfaces of polymer composites is improved by first forming an electroless metal coating on the molded surface of the composite and then electroplating a coating of zinc or zinc alloy on the metallized composite surface. The “galvanized” composite surface provides a good base for electrostatic deposition of either liquid or powder paint and the zinc surface prevents the formation of defects in the painted surface during heating of the composite to dry or cure the paint film.Type: GrantFiled: April 30, 2002Date of Patent: March 29, 2005Assignee: General Motors CorporationInventors: Hsai-Yin Lee, Yar-Ming Wang, Tao Xie
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Patent number: 6261697Abstract: A plated molded article which comprises a molded article formed with a resin composition comprising specific relative amounts of (A) a styrenic polymer having a syndiotactic configuration and (B) at least one selected from the group consisting of (a) rubbery elastomers soluble in an oxidizing agent, (b) thermoplastic resins soluble in an oxidizing agent, and (c) inorganic compounds soluble in an oxidizing agent, and has been plated; and a process for producing the plated molded article. A plated molded article containing a styrenic polymer having a syndiotactic configuration which suppresses skipped plating and has a high adhesive strength of the plating film can efficiently be obtained with stability in an industrial process.Type: GrantFiled: August 30, 1999Date of Patent: July 17, 2001Assignee: Idemitsu Petrochemical Co., Ltd.Inventors: Yusuke Otsuki, Akihiko Okada
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Patent number: 6027817Abstract: A plated molded article which comprises a molded article formed with a resin composition comprising specific relative amounts of (A) a styrenic polymer having a syndiotactic configuration and (B) at least one selected from the group consisting of (a) rubbery elastomers soluble in an oxidizing agent, (b) thermoplastic resins soluble in an oxidizing agent, and (c) inorganic compounds soluble in an oxidizing agent, and has been plated; and a process for producing the plated molded article. A plated molded article containing a styrenic polymer having a syndiotactic configuration which suppresses skipped plating and has a high adhesive strength of the plating film can efficiently be obtained with stability in an industrial process.Type: GrantFiled: March 27, 1997Date of Patent: February 22, 2000Assignee: Idemitsu Petrochemical Co., Ltd.Inventors: Yusuke Otsuki, Akihiko Okada
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Patent number: 5962073Abstract: A process for metal plating a high impact, high temperature plastic suitable for forming trim elements of an automobile. The process is particularly directed to plating an elastomer-modified PPA resin, and entails closely controlled process steps that include selectively etching the elastomer and the PPA matrix with a solution containing chromic acid, then effectively removing from the substrate any retained chromium which would adversely affect the ability of metal plating to adhere to the substrate, and thereafter protecting the substrate from attack by sulfuric acid. The process is particularly effective for electroplating a PPA resin modified with about five to about 30 weight percent EPDM.Type: GrantFiled: June 2, 1997Date of Patent: October 5, 1999Assignee: Lacks Industries, Inc.Inventor: Roger James Timmer
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Patent number: 5928727Abstract: A process for metal plating a high impact, high temperature plastic suitable for forming trim elements of an automobile. The process is particularly directed to plating an elastomer-modified PPA resin, and entails closely controlled process steps that include selectively etching the elastomer and the PPA matrix with a solution containing chromic acid, then effectively removing from the substrate any retained chromium which would adversely affect the ability of metal plating to adhere to the substrate, and thereafter protecting the substrate from attack by sulfuric acid. The process is particularly effective for electroplating a PPA resin modified with about five to about 30 weight percent elastomeric materials.Type: GrantFiled: August 8, 1997Date of Patent: July 27, 1999Assignee: Lacks Industries, Inc.Inventor: Roger James Timmer
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Patent number: 5702584Abstract: A polymer substrate is plated with a metal, using metallic filler particles in the polymer as anchorage points for a layer of metal formed by an electroless plating operation. The polymer has a filler that includes non-metallic filler particles and metallic filler particles; the non-metallic filler particles contiguous to the polymer surface can be etched away, so as to expose metallic filler particles proximate to the etched surfaces. The exposed metallic filler particles serve as anchorage points for the electroless plate layer.Type: GrantFiled: July 1, 1996Date of Patent: December 30, 1997Assignee: Ford Motor CompanyInventors: Lakhi N. Goenka, Michael G. Todd, Andrew Z. Glovatsky