Resin Contains Etchable Filler Patents (Class 205/168)
  • Patent number: 11577496
    Abstract: A polyamide resin composition and a molded article manufactured using the same. The polyamide resin composition includes: about 40 wt % to about 60 wt % of a polyamide resin including a repeat unit represented by Formula 1 and a repeat unit represented by Formula 2 as defined in the specification; about 1 wt % to about 10 wt % of a maleic anhydride-modified olefin-based copolymer; about 5 wt % to about 20 wt % of calcium carbonate subjected to surface treatment with a silane compound; and about 20 wt % to about 40 wt % of glass fibers, wherein the silane compound includes a functional group comprising an amino group, an epoxy group, and/or a (meth)acryloxy group. The polyamide resin composition and the molded article produced using the same can have good properties in terms of plating adhesion, impact resistance, thermal resistance, and/or appearance, and the like.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: February 14, 2023
    Assignee: Lotte Chemical Corporation
    Inventors: Sang Hwa Lee, Yeong Deuk Seo, Sang Hyun Hong
  • Patent number: 11565513
    Abstract: A polyamide resin composition and a molded article manufactured using the same. The polyamide resin composition includes: about 15 wt % to about 49 wt % of an aromatic polyamide resin including a repeat unit represented by Formula 1 and a repeat unit represented by Formula 2 as defined in the specification; about 1 wt % to about 30 wt % of a polyamide resin having a glass transition temperature of about 40° C. to about 120° C.; about 1 wt % to about 20 wt % of an olefin-based copolymer; and about 30 wt % to about 50 wt % of calcium carbonate. The polyamide resin composition and the molded article produced using the same can have good properties in terms of plating adhesion, impact resistance, thermal resistance, fluidity, and/or appearance, and the like.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: January 31, 2023
    Assignee: Lotte Chemical Corporation
    Inventors: Sang Hwa Lee, Yeong Deuk Seo, Kyoung Tae Youm, Sang Hyun Hong
  • Patent number: 11524492
    Abstract: A polyamide resin composition and a molded article manufactured using the same. The polyamide resin composition includes: about 15 wt % to about 49 wt % of an aromatic polyamide resin including a repeat unit represented by Formula 1 and a repeat unit represented by Formula 2 as defined in the specification; about 1 wt % to about 30 wt % of a polyamide resin having a glass transition temperature of about 40° C. to about 120° C.; about 1 wt % to about 20 wt % of an olefin-based copolymer; and about 30 wt % to about 50 wt % of calcium carbonate. The polyamide resin composition and the molded article produced using the same can have good properties in terms of plating adhesion, impact resistance, thermal resistance, fluidity, and/or appearance, and the like.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: December 13, 2022
    Assignee: Lotte Chemical Corporation
    Inventors: Sang Hwa Lee, Yeong Deuk Seo, Kyoung Tae Youm, Sang Hyun Hong
  • Patent number: 9267077
    Abstract: A chrome-free acidic aqueous solution of sulfuric acid and one or more organic acids and manganese (II) and (III) ions is applied to an organic polymer surface to etch the surface. The etched surface is then plated with metal.
    Type: Grant
    Filed: April 16, 2013
    Date of Patent: February 23, 2016
    Inventors: Katharina Weitershaus, Wan Zhang-Beglinger, Andreas Scheybal, Jonas Guebey
  • Patent number: 8182594
    Abstract: An electroless nickel plating liquid capable of forming an underbarrier metal for metal bumps or solder bumps by electroless nickel plating with a uniform film thickness on silicon wafers composed of multiple IC chips contains a water-soluble nickel salt, a reducing agent, a complexing agent, and a pH buffer, wherein_lead ion is contained at 0.01-1 ppm, cobalt ion is contained at 0.01-1 ppm, and a sulfur compound is contained at 0.01-1 ppm.
    Type: Grant
    Filed: September 26, 2006
    Date of Patent: May 22, 2012
    Assignee: Nippon Mining & Metals Co., Ltd.
    Inventors: Eiji Hino, Masashi Kumagai
  • Patent number: 6875471
    Abstract: The quality of painted surfaces of polymeric articles is improved by depositing a coating of a metal such as zinc or zinc alloy on the surface of the article to be painted. For example, zinc is electrodeposited on a conductive surface of the article. The metal coated polymeric surface provides a good base for electrostatic deposition of either liquid or powder paint and the metal surface prevents the formation of defects in the painted surface during heating of the article to dry or cure the paint film.
    Type: Grant
    Filed: November 25, 2002
    Date of Patent: April 5, 2005
    Assignee: General Motors Corporation
    Inventors: Hsai-Yin Lee, Yar-Ming Wang, Tao Xie
  • Patent number: 6872294
    Abstract: The quality of painted surfaces of polymer composites is improved by first forming an electroless metal coating on the molded surface of the composite and then electroplating a coating of zinc or zinc alloy on the metallized composite surface. The “galvanized” composite surface provides a good base for electrostatic deposition of either liquid or powder paint and the zinc surface prevents the formation of defects in the painted surface during heating of the composite to dry or cure the paint film.
    Type: Grant
    Filed: April 30, 2002
    Date of Patent: March 29, 2005
    Assignee: General Motors Corporation
    Inventors: Hsai-Yin Lee, Yar-Ming Wang, Tao Xie
  • Patent number: 6261697
    Abstract: A plated molded article which comprises a molded article formed with a resin composition comprising specific relative amounts of (A) a styrenic polymer having a syndiotactic configuration and (B) at least one selected from the group consisting of (a) rubbery elastomers soluble in an oxidizing agent, (b) thermoplastic resins soluble in an oxidizing agent, and (c) inorganic compounds soluble in an oxidizing agent, and has been plated; and a process for producing the plated molded article. A plated molded article containing a styrenic polymer having a syndiotactic configuration which suppresses skipped plating and has a high adhesive strength of the plating film can efficiently be obtained with stability in an industrial process.
    Type: Grant
    Filed: August 30, 1999
    Date of Patent: July 17, 2001
    Assignee: Idemitsu Petrochemical Co., Ltd.
    Inventors: Yusuke Otsuki, Akihiko Okada
  • Patent number: 6027817
    Abstract: A plated molded article which comprises a molded article formed with a resin composition comprising specific relative amounts of (A) a styrenic polymer having a syndiotactic configuration and (B) at least one selected from the group consisting of (a) rubbery elastomers soluble in an oxidizing agent, (b) thermoplastic resins soluble in an oxidizing agent, and (c) inorganic compounds soluble in an oxidizing agent, and has been plated; and a process for producing the plated molded article. A plated molded article containing a styrenic polymer having a syndiotactic configuration which suppresses skipped plating and has a high adhesive strength of the plating film can efficiently be obtained with stability in an industrial process.
    Type: Grant
    Filed: March 27, 1997
    Date of Patent: February 22, 2000
    Assignee: Idemitsu Petrochemical Co., Ltd.
    Inventors: Yusuke Otsuki, Akihiko Okada
  • Patent number: 5962073
    Abstract: A process for metal plating a high impact, high temperature plastic suitable for forming trim elements of an automobile. The process is particularly directed to plating an elastomer-modified PPA resin, and entails closely controlled process steps that include selectively etching the elastomer and the PPA matrix with a solution containing chromic acid, then effectively removing from the substrate any retained chromium which would adversely affect the ability of metal plating to adhere to the substrate, and thereafter protecting the substrate from attack by sulfuric acid. The process is particularly effective for electroplating a PPA resin modified with about five to about 30 weight percent EPDM.
    Type: Grant
    Filed: June 2, 1997
    Date of Patent: October 5, 1999
    Assignee: Lacks Industries, Inc.
    Inventor: Roger James Timmer
  • Patent number: 5928727
    Abstract: A process for metal plating a high impact, high temperature plastic suitable for forming trim elements of an automobile. The process is particularly directed to plating an elastomer-modified PPA resin, and entails closely controlled process steps that include selectively etching the elastomer and the PPA matrix with a solution containing chromic acid, then effectively removing from the substrate any retained chromium which would adversely affect the ability of metal plating to adhere to the substrate, and thereafter protecting the substrate from attack by sulfuric acid. The process is particularly effective for electroplating a PPA resin modified with about five to about 30 weight percent elastomeric materials.
    Type: Grant
    Filed: August 8, 1997
    Date of Patent: July 27, 1999
    Assignee: Lacks Industries, Inc.
    Inventor: Roger James Timmer
  • Patent number: 5702584
    Abstract: A polymer substrate is plated with a metal, using metallic filler particles in the polymer as anchorage points for a layer of metal formed by an electroless plating operation. The polymer has a filler that includes non-metallic filler particles and metallic filler particles; the non-metallic filler particles contiguous to the polymer surface can be etched away, so as to expose metallic filler particles proximate to the etched surfaces. The exposed metallic filler particles serve as anchorage points for the electroless plate layer.
    Type: Grant
    Filed: July 1, 1996
    Date of Patent: December 30, 1997
    Assignee: Ford Motor Company
    Inventors: Lakhi N. Goenka, Michael G. Todd, Andrew Z. Glovatsky