Synthetic Resin Substrate Patents (Class 205/164)
  • Patent number: 9298095
    Abstract: The present invention provides a rinse solution for lithography and a pattern formation method using the solution. They can improve the pattern collapse, surface roughness and surface defects. The solution contains at least a sulfonic acid a nonionic surfactant having an alkyleneoxy group and water.
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: March 29, 2016
    Assignee: MERCK PATENT GMBH
    Inventors: Xiaowei Wang, Georg Pawlowski, Yuriko Matsuura
  • Publication number: 20150140204
    Abstract: A separator is provided that has a metal substrate and a conductive resin layer on the surface of the metal substrate. The conductive resin layer contains a resin and a conductive substance dispersed in the resin. The separator is configured such that the proportion of the conductive substance to the resin increases continuously from the metal substrate toward the surface of the separator.
    Type: Application
    Filed: July 3, 2013
    Publication date: May 21, 2015
    Applicant: TOYOTA SHATAI KABUSHIKI KAISHA
    Inventors: Yukihiro Suzuki, Eiichiro Morozumi, Takatoshi Asaoka
  • Publication number: 20150115776
    Abstract: A ceramic electronic component includes a ceramic body and first and second outer electrodes. The first and second outer electrodes respectively include first and second resin-containing electrode layers and first and second Ni plating layers. The first and second Ni plating layers are respectively provided on the first and second resin-containing electrode layers. When a thickness of the first or second Ni plating layer is t1 and a distance by which a portion of the first or second Ni plating layer that is in contact with the second principal surface extends in the length direction is t2, t2/t1 is less than about 1.
    Type: Application
    Filed: September 30, 2014
    Publication date: April 30, 2015
    Inventor: Yosuke TERASHITA
  • Patent number: 9017563
    Abstract: Provided is a plating method of a circuit substrate comprising a conductive pattern in which a metal layer containing at least silver and copper is exposed on an outer surface. The plating method comprises: step (A) of treating the circuit substrate with a first liquid agent containing an oxidizing agent; step (B) of treating the circuit substrate after the step (A) with a second liquid agent which dissolves copper oxide, and thereby removing copper oxide from the conductive pattern's surface; step (C) of treating the circuit substrate after the step (B) with a third liquid agent whose rate of dissolving silver oxide (I) at 25° C. is 1000 times or more faster than its rate of dissolving copper (0) at 25° C., and thereby removing silver oxide from the conductive pattern's surface; and step (D) of performing electroless plating on the conductive pattern of the circuit substrate after the step (C).
    Type: Grant
    Filed: June 20, 2012
    Date of Patent: April 28, 2015
    Assignee: Tokuyama Corporation
    Inventors: Emi Ushioda, Tetsuo Imai
  • Publication number: 20150104668
    Abstract: Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic having a plurality of accelerators dispersed in the plastic. The accelerators have a formula ABO3, wherein A is one or more elements selected from Groups 9, 10, and 11 of the Periodic Table of Elements, B is one or more elements selected from Groups 4B and 5B of the Periodic Table of Elements, and O is oxygen. The method includes the step of irradiating a surface of plastic substrate to expose at least a first accelerator. The method further includes plating the irradiated surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.
    Type: Application
    Filed: December 19, 2014
    Publication date: April 16, 2015
    Inventors: Qing GONG, Liang ZHOU, Weifeng MIAO, Xiong ZHANG
  • Publication number: 20150090600
    Abstract: The present invention provides a copper-nickel alloy electroplating bath which is characterized by containing (a) a copper salt and a nickel salt, (b) a metal complexing agent, (c) a plurality of conductivity-imparting salts that are different from each other, (d) a compound that is selected from the group consisting of disulfide compounds, sulfur-containing amino acids and salts of these compounds, (e) a compound that is selected from the group consisting of sulfonic acid compounds, sulfimide compounds, sulfamic acid compounds, sulfone amides and salts of these compounds, and (f) a reaction product of a glycidyl ether and a polyhydric alcohol. This copper-nickel alloy electroplating bath is also characterized by having a pH of 3-8.
    Type: Application
    Filed: April 19, 2013
    Publication date: April 2, 2015
    Applicant: DIPSOL CHEMICALS CO., LTD.
    Inventors: Manabu Inoue, Satoshi Yuasa, Hitoshi Sakurai
  • Publication number: 20150060292
    Abstract: A method for a forming three dimensional circuit is provided. A plastic base is provided. A metal layer is bonded on the plastic base by a metal coating process. The thickness of the metal layer is thickened by an electroplating process. The metal layer is trimmed to form a circuit pattern thereon by a laser engraving process, whereby, the working-hours can be reduced and the cost of material can also be reduced when the three dimensional circuit is manufactured.
    Type: Application
    Filed: August 30, 2013
    Publication date: March 5, 2015
    Inventor: WEI-LIN LIU
  • Publication number: 20150050422
    Abstract: The present invention relates to novel processes for metallization of dielectric substrate surfaces applying organosilane compositions followed by oxidative treatment. The method results in metal plated surfaces exhibiting high adhesion between the substrate and the plated metal while at the same time leaves the smooth substrate surface intact.
    Type: Application
    Filed: March 21, 2013
    Publication date: February 19, 2015
    Inventors: Dirk Tews, Fabian Michalik, Belén Gil Ibánez, Lutz Brandt, Meng Che Hsieh, Zhiming Liu
  • Patent number: 8906515
    Abstract: Metal-clad polymer articles containing structural fine-grained and/or amorphous metallic coatings/layers optionally containing solid particulates dispersed therein, are disclosed. The fine-grained and/or amorphous metallic coatings are particularly suited for strong and lightweight articles, precision molds, sporting goods, automotive parts and components exposed to thermal cycling although the coefficient of linear thermal expansion (CLTE) of the metallic layer and the substrate are mismatched. The interface between the metallic layer and the polymer is suitably pretreated to withstand thermal cycling without failure.
    Type: Grant
    Filed: May 24, 2010
    Date of Patent: December 9, 2014
    Assignee: Integran Technologies, Inc.
    Inventors: Klaus Tomantschger, Jonathan McCrea, Nandakumar Nagarajan, Francisco Gonzalez, Gino Palumbo, Konstantinos Panagiotopoulos, Herath Katugaha, Diana Facchini, Jared J. Victor, Uwe Erb
  • Publication number: 20140329045
    Abstract: The present invention relates to building materials, particularly building materials for placement on the outside of buildings.
    Type: Application
    Filed: June 26, 2012
    Publication date: November 6, 2014
    Applicant: Karm Conductives Group Limited
    Inventor: Mark Jones
  • Patent number: 8840769
    Abstract: A catalyst precursor resin composition includes an organic polymer resin; a fluorinated-organic complex of silver ion; a monomer having multifunctional ethylene-unsaturated bonds; a photoinitiator; and an organic solvent. The metallic pattern is formed by forming catalyst pattern on a base using the catalyst precursor resin composition reducing the formed catalyst pattern, and electroless plating the reduced catalyst pattern. In the case of forming metallic pattern using the catalyst precursor resin composition, a compatibility of catalyst is good enough not to make precipitation, chemical resistance and adhesive force of the formed catalyst layer are good, catalyst loss is reduced during wet process such as development or plating process, depositing speed is improved, and thus a metallic pattern having good homogeneous and micro pattern property may be formed after electroless plating.
    Type: Grant
    Filed: July 23, 2013
    Date of Patent: September 23, 2014
    Assignee: LG Chem, Ltd.
    Inventors: Min Kyoun Kim, Min Jin Ko, Sang Chul Lee, Jeong Im Roh
  • Publication number: 20140251435
    Abstract: The present invention describes a method of producing a p-type light-absorbing semiconductor copper zinc tin selenide/sulfide (Cu2(ZnxSn2-x)(SySe1-y)4) (abbreviated CZTS) with electrochemical deposition. It can be used in the production of solar cell when combined with an n-type inorganic or an organic semiconductor layer. The present method comprises a one-step or a sequence of depositions using electroplating to fabricate a low-cost and large-area CZTS solar cell, without using expensive and complicated deposition techniques or highly toxic and flammable chemicals in the production process. The present method significantly reduces the cost and energy requirement for production of solar cell.
    Type: Application
    Filed: February 12, 2014
    Publication date: September 11, 2014
    Applicant: Nano and Advanced Materials Institute Limited
    Inventors: Kam Piu HO, Paul Kwok Keung HO, Man Wah LIU, Ranshi WANG, Wai Chun LUK, Wing Ho CHOI, Fulin ZHENG, Kwong Chau KWOK, Mei Mei HSU, Ivan Ka Yu LAU
  • Patent number: 8808921
    Abstract: Disclosed are a current collector for a flexible electrode, a method of manufacturing the same, and a negative electrode including the same. The current collector for a flexible electrode includes: a flexible polymer substrate; a cross-linkable polymer layer disposed on the polymer substrate; and a metal layer disposed on the cross-linkable polymer layer, wherein the surface of the cross-linkable polymer layer includes a plurality of protrusions and grooves.
    Type: Grant
    Filed: May 18, 2010
    Date of Patent: August 19, 2014
    Assignee: Unist Academy-Industry Research Corporation
    Inventors: Soojin Park, Jae-Phil Cho, Hyun-Kon Song, Jung-In Lee
  • Patent number: 8771496
    Abstract: A metal composite film having an excellent heat resistance and adhesion, suited for flexible printed circuit boards capable of forming fine wirings, as well as a production process thereof, is disclosed. The metal composite film comprises an insulating film; a thermoplastic polyimide layer(s) formed on at least one surface of the insulating film; and metal layers formed on the surface of each of the thermoplastic polyimide layer(s), which metal layers are formed by electroless plating and then by electrolytic plating, respectively. Since this metal composite film has an excellent heat resistance and adhesion, and maintains the excellent adhesion after forming fine wirings, it is suitably used as a high density flexible printed circuit board having fine circuits.
    Type: Grant
    Filed: May 17, 2006
    Date of Patent: July 8, 2014
    Assignee: PI R&D Co., Ltd.
    Inventors: Eiji Nagata, Hiroyuki Ishii
  • Patent number: 8721864
    Abstract: A metal covered polyimide composite comprising a tie-coat layer and a metal seed layer formed on a surface of a polyimide film by electroless plating or a drying method is provided. A copper layer or a copper alloy layer is formed thereon by electroplating. The copper plated layer or copper alloy plated layer includes three layers to one layer of the copper layer or copper alloy layer. The metal covered polyimide composite effectively prevents peeling in a non-adhesive flexible laminate (especially a two-layer flexible laminate), and more particularly, effectively inhibits peeling from the interface of a copper layer and tin plating. A method of producing the composite and apparatus for producing the composite are also provided.
    Type: Grant
    Filed: February 3, 2012
    Date of Patent: May 13, 2014
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Michiya Kohiki, Naonori Michishita, Nobuhito Makino
  • Publication number: 20140017513
    Abstract: A two-layered copper-clad laminate material in which a copper layer having a thickness of 1 to 5 ?m is formed by means of sputtering or electroplating on one surface or both surfaces of a polyimide film having a thickness of 12.5 to 50 ?m after a plasma treatment is performed in a nitrogen gas atmosphere, the two-layered copper-clad laminate material being characterized in that the dissolution of the aforementioned polyimide film with an etching liquid is delayed compared with a polyimide film that is not subjected to the plasma treatment, the aforementioned dissolution being delayed as a consequence of modifying the surface of the polyimide film by incorporating nitrogen into the polyimide film by means of the plasma treatment in the nitrogen gas atmosphere.
    Type: Application
    Filed: January 25, 2012
    Publication date: January 16, 2014
    Applicant: JX NIPPON MINING & METALS CORPORATION
    Inventors: Hajime Inazumi, Shinichi Sasaki
  • Publication number: 20140001048
    Abstract: The present invention relates to a coating method by electrocatalyzed chemical grafting of a surface of a substrate with a polymeric layer characterized in that it comprises the following steps: a. a substrate is provided, b. a bath containing at least one polymerizable monomer via a radical route, at least one cleavable aryl salt, at least one reducing agent and at least one solvent is provided, in which a potential difference is applied, c. said substrate is immersed in said bath, d. a grafted polymer is obtained on the surface of said substrate. The invention also relates to a substrate obtained according to the coating method by electrocatalyzed chemical grafting, the surface of which is coated with a polymeric layer.
    Type: Application
    Filed: December 21, 2011
    Publication date: January 2, 2014
    Applicant: PEGASTECH
    Inventors: Sebastien Roussel, Matthieu Laurent, Christian Maennel
  • Publication number: 20130277224
    Abstract: In a method for making a wave-absorbing sheet, first emulsified mixture is provided by mixing wave-absorbing particles with graphene solution so that the graphene solution absorbs the wave-absorbing particles. Secondly, second emulsified mixture is provided by adding and blending resin solution in the first emulsified mixture. Thirdly, third emulsified mixture is provided by adding and blending interface modifier in the second emulsified mixture. Then, two conductive substrates are submerged in the third emulsified mixture, and voltage is provided to the third emulsified mixture so that the wave-absorbing particles, the resin solution and the graphene solution are evenly coated on the conductive substrates. Then, a wave-absorbing sheet is provided by eroding and removing the conductive substrates. Finally, the wave-absorbing sheet is washed and dried. The wave-absorbing sheet is thin, light and flexible, and exhibits a wide absorption frequency band and a high absorption rate.
    Type: Application
    Filed: April 24, 2012
    Publication date: October 24, 2013
    Applicant: Chung-Shan Institute of Science and Technology, Armaments, Bureau, Ministry of National Defense
    Inventors: Yen-Chung Chen, Ker-Jer Huang, Chien-Chih Kung, Shang-Wanq Yeh
  • Publication number: 20130277623
    Abstract: A process for the preparation of an activated polymer particle comprising contacting a polymer particle with at least one polyamine, wherein said polyamine has three or more amino groups, to form a surface treated polymer particle; and applying a catalyst to the surface treated polymer particle to form an activated polymer particle.
    Type: Application
    Filed: October 28, 2011
    Publication date: October 24, 2013
    Applicant: CONPART AS
    Inventors: Keith Redford, Ionel Halaciuga, Dan V. Goia, Cathrine Braein Nilsen
  • Publication number: 20130243944
    Abstract: A method of manufacturing a hydrogen generating apparatus, the method including: forming an absorbent layer, the absorbent layer configured to absorb an aqueous solution; depositing a metal membrane over either side of the absorbent layer such that the absorbent layer is interposed between the metal membranes; and forming a support layer over one side of one of the metal membranes, the support layer configured to transport hydrogen generated by a reaction between the aqueous solution and the metal membrane.
    Type: Application
    Filed: May 1, 2013
    Publication date: September 19, 2013
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hye-Yeon CHA, Young-Soo Oh, Jae-Hyuk Jang, Chang-Ryul Jung, Jae-Hyoung Gil
  • Publication number: 20130213817
    Abstract: A method for shrinking a linewidth on a substrate includes the steps of applying a stretching force on the substrate, defining a line on a top surface of the substrate and releasing the applied stretching force. The applied force is executed by mechanical stretching or thermal expansion and has a direction parallel to the line.
    Type: Application
    Filed: May 11, 2012
    Publication date: August 22, 2013
    Inventors: Cheng-Yao LO, Kuan-Hsun Liao
  • Patent number: 8491772
    Abstract: The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.
    Type: Grant
    Filed: August 21, 2009
    Date of Patent: July 23, 2013
    Assignee: International Business Machines Corporation
    Inventors: Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Yun-Hsin Liao, Daniel Peter Morris, Da-Yuan Shih
  • Publication number: 20130183534
    Abstract: The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (?) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (?) by a wet-mode plating technique, wherein the compound (?) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.
    Type: Application
    Filed: September 30, 2011
    Publication date: July 18, 2013
    Applicants: Kunio Mori, Meiko Electronics Co., Ltd., Sulfur Chemical Institute Incorporated
    Inventors: Kunio Mori, Yusuke Matsuno, Takahiro Kudo, Shigeru Michiwaki, Manabu Miyawaki
  • Publication number: 20130161195
    Abstract: An electroplating method includes at least the following steps: providing a plastic substrate; forming a preliminary layer containing metal powder and paint on the plastic substrate; laser irradiating the preliminary layer to form an intermediate layer having the metal powder exposed thereon; and electroplating an electroplated layer on the intermediate layer. This electroplating method is simple and can be applied to all kinds of plastic substrate.
    Type: Application
    Filed: June 7, 2012
    Publication date: June 27, 2013
    Applicants: FIH (HONG KONG) LIMITED, SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.
    Inventors: Shi-Jie YAN, He-Xian LIN, Hong-Liang WANG, Xiang-Hua LV
  • Publication number: 20130120821
    Abstract: A complimentary polymer or “dual-polymer” electrochromic device and methods of preparing the same are provided.
    Type: Application
    Filed: November 14, 2012
    Publication date: May 16, 2013
    Applicant: ASHWIN-USHAS CORPORATION, INC.
    Inventor: Ashwin-Ushas Corporation, Inc.
  • Publication number: 20130101326
    Abstract: The presently disclosed embodiments are directed to an improved metallization process for making fuser members which avoids the extra steps of metal nanoparticle seeding or special substrate treatment. In embodiments, a metallized substrate, formed by dip-coating or spraying with a metal nanoparticle dispersion which is subsequently thermally annealed, is used for the complete fabrication of the fuser member.
    Type: Application
    Filed: December 5, 2012
    Publication date: April 25, 2013
    Applicant: XEROX CORPORATION
    Inventor: XEROX CORPORATION
  • Publication number: 20130065025
    Abstract: A substrate having animated flashing figures, applications thereof, and a manufacturing method of the same are revealed. A reflective film with an electroplated layer on a surface is covered over the base material. Then at least two figures are printed on the reflective film to form a printed layer. The figures are cut into strips and then the strips are arranged alternatively. Finally, a surface grating layer is arranged over the printed layer. Through the combination of the reflective film, the printed layer formed by staggered strips of the figures, and the surface grating layer, figures on a surface of the substrate show an animated flashing effect. The substrate can be applied to various products such as containers, trays, eyeglass frames, watch bands, etc.
    Type: Application
    Filed: September 9, 2011
    Publication date: March 14, 2013
    Inventor: KUN-MU LI
  • Patent number: 8394507
    Abstract: Metal-clad polymer articles containing structural fine-grained and/or amorphous metallic coatings/layers optionally containing solid particulates dispersed therein, are disclosed. The fine-grained and/or amorphous metallic coatings are particularly suited for strong and lightweight articles, precision molds, sporting goods, automotive parts and components exposed to thermal cycling although the CLTE of the metallic layer and the one of the substrate is mismatched. The interface between the metallic layer and the polymer is suitably pretreated to withstand thermal cycling without failure.
    Type: Grant
    Filed: June 2, 2009
    Date of Patent: March 12, 2013
    Assignee: Integran Technologies, Inc.
    Inventors: Klaus Tomantschger, Jonathan McCrea, Nandakumar Nagarajan, Francisco Gonzalez, Gino Palumbo, Konstantinos Panagiotopoulos, Herath Katugaha
  • Publication number: 20130059119
    Abstract: Multilayer polymer films are described. The films include an oriented polymeric substrate wherein a print-side skin layer of the substrate has a surface roughness, Ra, ?12.0 ?m. The films also include a metal layer in surface contact with the print side of the polymeric substrate, a primer composition in surface contact with the metal layer, and a printable topcoat layer in surface contact with the primer composition. Pressure-sensitive label structures and methods of making such films are also described.
    Type: Application
    Filed: July 17, 2012
    Publication date: March 7, 2013
    Inventors: Anne P. CAMPEAU, Mark W. Lockhart, Dennis E. Mcgee
  • Patent number: 8382970
    Abstract: The presently disclosed embodiments are directed to an improved metallization process for making fuser members which avoids the extra steps of metal nanoparticle seeding or special substrate treatment. In embodiments, a metallized substrate, formed by dip-coating or spraying with a metal nanoparticle dispersion which is subsequently thermally annealed, is used for the complete fabrication of the fuser member.
    Type: Grant
    Filed: August 5, 2008
    Date of Patent: February 26, 2013
    Assignee: Xerox Corporation
    Inventors: Yu Qi, Qi Zhang, Yuning Li, Nan-Xing Hu
  • Patent number: 8366901
    Abstract: A process is provided for metallizing a surface of a substrate with electrolytically plated copper metallization, the process comprising electrolytically depositing copper over the electrically conductive polymer by immersing the substrate in an electrolytic composition and applying an external source of electrons, wherein the electrolytic composition comprises a source of copper ions and has a pH between about 0.5 and about 3.5. In another aspect, a process is provided for metallizing a surface of a dielectric substrate with electrolytically plated copper metallization, the process comprising immersing the substrate into a catalyst composition comprising a precursor for forming an electrically conductive polymer on the surface of the dielectric substrate and a source of Mn(II) ions in an amount sufficient to provide an initial concentration of Mn(II) ions of at least about 0.
    Type: Grant
    Filed: September 7, 2007
    Date of Patent: February 5, 2013
    Assignee: Enthone Inc.
    Inventors: Agata Lachowicz, Andreas Glöckner
  • Publication number: 20130022756
    Abstract: The adhesion of metal thin films onto polymeric substrates can be significantly enhanced by contacting the surface of the polymeric substrate with a non-complexing solvent before or after depositing the metal film.
    Type: Application
    Filed: July 19, 2012
    Publication date: January 24, 2013
    Inventors: BRIAN HOWARD AUGUSTINE, WILLIAM CHRISTOPHER HUGHES, ALAN KOON-KEE MO, THOMAS CARROLL DEVORE
  • Publication number: 20130022761
    Abstract: The present invention relates to a silver complex obtained by reacting at least one silver compound represented by the formula 2 below with at least one ammonium carbamate compound or ammonium carbonate compound represented by the formula 3, 4 or 5 below:
    Type: Application
    Filed: May 11, 2012
    Publication date: January 24, 2013
    Applicant: Inktec Co., Ltd.
    Inventors: Kwang-Choon Chung, Hyun-Nam Cho, Myoung-Seon Gong, Yi-Sup Han, Jeong-Bin Park, Dong-Hun Nam, Seong-Yong Uhm, Young-Kwan Seo
  • Publication number: 20130016025
    Abstract: Embodiments provide a novel fabrication method and structure for reducing structural weight in radio frequency cavity filters and radio subsystems such as antennas and filters. The novel structures are fabricated by electroplating the required structure over a mold, housing, or substrate. The electrodeposited composite layer may be formed by several layers of metal or metal alloys with compensating thermal expansion coefficients. The first or the top layer is a high conductivity material or compound such as silver having a thickness of several times the skin-depth at the intended frequency of operation. The top layer provides the vital low loss performance and high Q-factor required for such filter structures while the subsequent compound layers provide the mechanical strength.
    Type: Application
    Filed: September 25, 2012
    Publication date: January 17, 2013
    Inventors: IAN BURKE, JASON COOK, AHMAD KHANIFAR
  • Publication number: 20130011742
    Abstract: Disclosed are a current collector for a flexible electrode, a method of manufacturing the same, and a negative electrode including the same. The current collector for a flexible electrode includes: a flexible polymer substrate; a cross-linkable polymer layer disposed on the polymer substrate; and a metal layer disposed on the cross-linkable polymer layer, wherein the surface of the cross-linkable polymer layer includes a plurality of protrusions and grooves.
    Type: Application
    Filed: May 18, 2010
    Publication date: January 10, 2013
    Applicant: UNIST Academy-Industry Research Corporation
    Inventors: Soojin Park, Jae-Phil Cho, Hyun-Kon Song, Jung-In Lee
  • Publication number: 20130001090
    Abstract: Bioelectrodes, methods of making bioelectrodes and methods of using bioelectrodes are provided. The bioelectrodes have an electrically-conductive substrate coated with an electroconductive polymer. The bioelectrode exhibits ohmic behavior over a range of about 1 Hz to about 100 KHz, where ohmic behavior means that the value of the impedance is independent of the signal frequency over the range of interest. The bioelectrode can transmit or receive an electrical signal between the electrically conductive substrate and the biological component through the conductive polymer.
    Type: Application
    Filed: February 11, 2011
    Publication date: January 3, 2013
    Applicant: GEORGETOWN UNIVERSITY
    Inventors: Judith F. Rubinson, Yohani P. Kayinamura, Anthony D. Kammerich, Yasmin N. Srivastava
  • Publication number: 20120305406
    Abstract: The following method is to improve selectivity during metallisation of surface areas to be metallised on objects 7 having different plastics while not allowing the areas not to be metallised to be metallised: A) etching of the objects 7 with an etching solution; B) treatment of the objects 7 with a solution of a colloid or with a metal compound, the metal being a metal of Group VIIIB or IB of the Periodic Table of the Elements; and C) electrolytic metallisation of the objects 7 with a metallisation solution. The objects 7 are subjected to ultrasonic treatment during the treatment in a further method step following method step B) and before method step C) in order to avoid metallisation of at least one first plastic exposed on the surface of the objects 7 while at least one second plastic exposed on the surface of the objects 7 is metallised.
    Type: Application
    Filed: February 7, 2011
    Publication date: December 6, 2012
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Arnaldo Pereira, Heinz Ewald
  • Publication number: 20120242425
    Abstract: Embodiments provide a novel fabrication method and structure for reducing structural weight in radio frequency cavity filters and novel filter structure. The novel filter structure is fabricated by electroplating the required structure over a mold. The electrodeposited composite layer may be formed by several layers of metal or metal alloys with compensating thermal expansion coefficients. The first or the top layer is a high conductivity material or compound such as silver having a thickness of several times the skin-depth at the intended frequency of operation. The top layer provides the vital low loss performance and high Q-factor required for such filter structures while the subsequent compound layers provide the mechanical strength.
    Type: Application
    Filed: March 21, 2012
    Publication date: September 27, 2012
    Inventors: IAN BURKE, JASON COOK, AHMAD KHANIFAR
  • Publication number: 20120234682
    Abstract: This invention relates to a process for metal-coating a polyamide surface, to achieve metal-polyamide adhesion, and such metal-coated polyamide articles.
    Type: Application
    Filed: March 16, 2012
    Publication date: September 20, 2012
    Applicant: E.I. DU PONT DE NEMOURS AND COMPANY
    Inventors: Charles J. Dubois, Andri E. Elia, Juan Carlos Figueroa
  • Publication number: 20120237789
    Abstract: A metal-clad polymer article includes a polymeric material with or without particulate addition. The polymeric material defines a permanent substrate. A metallic material covers at least part of a surface of the polymeric material. The metallic material has a microstructure which, at least in part, is at least one of fine-grained with an average grain size between 2 and 5,000 nm and amorphous. The metallic material has an elastic limit between 0.2% and 15%. At least one intermediate layer can be provided between the polymeric material and the metallic material. A stress on the polymeric material, at a selected operating temperature, reaches at least 60% of its ultimate tensile strength at a strain equivalent to the elastic limit of said metallic material.
    Type: Application
    Filed: October 24, 2011
    Publication date: September 20, 2012
    Applicant: INTEGRAN TECHNOLOGIES INC.
    Inventors: Andrew Wang, Nandakumar Nagarajan, Klaus Tomantschger, Mioara Neacsu
  • Publication number: 20120196035
    Abstract: A method for modifying the surface energy of at least one surface of a solid is provided. The method may comprise a step consisting of grafting, on the surface, a polymeric organic film consisting of graft polymers, each polymer having a first unit bound directly to the surface derived from a cleavable aryl salt and at least one other unit of the polymer chain derived from a component selected from the group consisting of a cleavable fluorinated aryl salt, a fluorinated (meth)acrylate and a vinyl-terminated siloxane. In addition, a kit for implementation of the method is provided.
    Type: Application
    Filed: April 2, 2010
    Publication date: August 2, 2012
    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Guy Deniau, Fabien Nekelson, Brigitte Mouanda
  • Publication number: 20120187597
    Abstract: A substrate capable of producing 3D pattern having colored dazzle light effect and a method of producing pattern and fabricating finished product are provided, in which plastic foaming sheet is selected as base material and reflection film having its surface electroplated is overlaid thereon. Then, embossing process is conducted to form concave-convex veins, and finally printing is conducted to form a print-layer thereon, so that the surface of the substrate possesses a 3D pattern having colored dazzle light effect. This substrate can be utilized in products as container, tray, eyeglass frame or watchstrap.
    Type: Application
    Filed: January 20, 2011
    Publication date: July 26, 2012
    Inventor: KUN-MU LI
  • Publication number: 20120175534
    Abstract: There is described an open cell porous structure the cells of which are optionally filled with an elastomeric or thermosetting plastic comprising a nanocrystalline metallic or nanocrystalline metal matrix composite coating wherein the nanocrystals have a crystallite size of from about 5 nm to about 150 nm. A process for preparing the coated open cell porous structures is also disclosed.
    Type: Application
    Filed: June 9, 2010
    Publication date: July 12, 2012
    Applicant: UNIVERSITAET DES SAARLANDES
    Inventors: Anne Jung, Harald Natter, Rolf Hempelmann, Ehrhardt Lach
  • Publication number: 20120145725
    Abstract: A method of preparing conductive ribs on a chassis includes steps as follows. A plastic case is provided with at least one elastic rib integrally formed thereon. Then, a conductive film is formed to overlay on both an inner surface of the plastic case and the surfaces of the elastic rib. A chassis with conductive ribs and a method of assembling an electric device including the same are also provided in the invention.
    Type: Application
    Filed: July 27, 2011
    Publication date: June 14, 2012
    Applicant: Quanta Computer Inc.
    Inventors: Chih-Chiang HSU, Tsung-Ju Chiang
  • Publication number: 20120141821
    Abstract: A bathroom appliance is provided having a substrate made of metal or plastic and a coating, it is provided to consecutively electroplate metal layers made of copper, an alloy of copper and tin, and chromium and to subsequently apply a cover layer which is made of at least one of the elements of chromium, titanium, zirconium, gold, silver or platinum or is made of a chemical combination of the elements of titanium or chromium and nitrogen and, optionally, carbon, the cover layer being produced on the electroplated chromium layer by means of a PVD method.
    Type: Application
    Filed: November 28, 2011
    Publication date: June 7, 2012
    Inventors: Axel ROST, Rene Musielik, Ingrid Ueckert
  • Publication number: 20120090775
    Abstract: The present invention provides several manufacturing processes for surface treatment in order to improve conventional electroplating, coating, sputtering processes. Through the surface treatment of the present invention, a brilliant modern pattern/mark can be achieved. Pearl luster lacquer coating, non-pearl luster lacquer coating and laser-marking are the characteristics of the present invention.
    Type: Application
    Filed: October 13, 2010
    Publication date: April 19, 2012
    Inventor: Dong-Ge CHENG
  • Publication number: 20120073978
    Abstract: Process for coating plastics with metals, wherein the plastics are pretreated with a composition comprising at least one salt having a melting point of less than 100° C. at 1 bar (hereinafter referred to as ionic liquid).
    Type: Application
    Filed: June 1, 2010
    Publication date: March 29, 2012
    Applicant: BASF SE
    Inventors: Itamar Michael Malkowsky, Aurelie Alemany
  • Publication number: 20120067730
    Abstract: A porous resin article having a three-dimensional network structure is used. A resin molded body at least the surface of which has been subjected to conductive treatment is plated with aluminum in a molten salt bath to form an aluminum structure, thus forming a porous aluminum that includes an aluminum layer having a thickness in the range of 1 to 100 ?m, has an aluminum purity of 98.0% or more and a carbon content of 1.0% or more and 2% or less, and contains inevitable impurities as the balance. Even with a porous resin molded body having a three-dimensional network structure, this allows the surface of the porous resin molded body to be plated with aluminum, thus forming a high-purity aluminum structure having a uniform thick film.
    Type: Application
    Filed: September 20, 2011
    Publication date: March 22, 2012
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Kengo GOTO, Akihisa HOSOE, Masatoshi MAJIMA, Kazuki OKUNO, Koji NITTA, Hajime OTA, Shoichiro SAKAI, Shinji INAZAWA, Kotaro KIMURA, Tomoyuki AWAZU
  • Publication number: 20120070683
    Abstract: There is provided a manufacturing method of an aluminum structure, including a conductive treatment process of forming an electrically conductive layer on a surface of a resin molded body, the electrically conductive layer being made of one or more metals selected from the group consisting of gold, silver, platinum, rhodium, ruthenium, palladium, nickel, copper, cobalt, iron, and aluminum, and a plating process of plating the resin molded body subjected to the conductive treatment process with aluminum in a molten salt bath. The manufacturing method of an aluminum structure allows aluminum plating on the surface of even a porous resin molded body having a three-dimensional network structure. In particular, there is also provided a manufacturing method of an aluminum structure that can form porous aluminum having a large area.
    Type: Application
    Filed: September 20, 2011
    Publication date: March 22, 2012
    Applicant: Sumitomo Electric Industries, Ltd.
    Inventors: Akihisa HOSOE, Koji Nitta, Kazuki Okuno, Tomoyuki Awazu, Shinji Inazawa
  • Patent number: 8137569
    Abstract: A method of fabricating a membrane having a tapered pore, a polymeric membrane having a tapered pore, and uses of such polymeric membrane are disclosed. The membrane includes apertures of increasing diameter which are aligned with each other to form the tapered pore.
    Type: Grant
    Filed: March 23, 2009
    Date of Patent: March 20, 2012
    Assignees: Sony Deutschland GmbH, Oxford Nanopore Technologies Limited
    Inventors: Oliver Harnack, Jurina Wessels, Akio Yasuda, James Clarke, Terry Reid