Abstract: The invention provides a device and a method for manufacturing 3D metal structures by a sequence of electroplating steps, each step adding a cross-section layer of the 3D structure via anodes, selected from a planar 2D anode grid array and forming a pattern template, creating a deposition image on a cathode plate.

Abstract: A film production method for producing a layer containing a metal oxide, the film production method including: a heating step of heating a metal foil containing a first metal by bringing a part of the metal foil into contact with at least one heat generator; a first contact step of letting first gas containing a second metal to be in contact with both surfaces of the metal foil in a state where the part of the metal foil is supported; and a second contact step of letting second gas containing an oxidant to be in contact with the both surfaces of the metal foil in a state where the part of the metal foil is supported.

Abstract: The present disclosure relates to a film-forming metal solution for use in a method in which a solid electrolyte membrane having sulfonic acid groups is disposed between an anode and a substrate serving as a cathode, the solid electrolyte membrane is brought into contact with the substrate, and a voltage is applied between the anode and the substrate to deposit a metal onto a surface of the substrate from metal ions supplied into the solid electrolyte membrane and thereby form a metal coating on the surface of the substrate, the film-forming metal solution being adapted to supply metal ions into the solid electrolyte membrane, wherein the film-forming metal solution comprises an aqueous metal solution, a solvent, and a nonionic surfactant, and the nonionic surfactant has a linear hydrophilic group having ethylene oxide units and a hydrophobic group having a cyclic structure and a maximum length of 40 ? or less.

Abstract: An electronic component includes an element body and external electrodes. The element body includes a dielectric and an internal electrode. Each of the external electrodes includes a base layer formed on multiple surfaces of the element body and an electrically-conducting material layer formed on the base layer, the base layer including a metal and co-material particles dispersed in the metal and being connected to the internal electrode. The co-material particles at an interface surface between the base layer and the electrically-conducting material layer have edges covered with the metal at the interface surface. The electrically-conducting material layer is in contact with the co-material particles at the interface surface and the metal covering the edges of the co-material particles at the interface surface.

Abstract: The present disclosure provides a method for producing a wiring substrate. A seeded substrate including an insulation substrate, a conductive undercoat layer, and a conductive seed layer provided in a first region, in that order, is first prepared. An insulation layer covering the seed layer and the undercoat layer is then formed. Subsequently, the insulation layer is etched to expose a surface of the seed layer and form a remaining insulation layer covering the undercoat layer in the second region. Subsequently, a voltage is applied between an anode and the seed layer while a solid electrolyte membrane containing a metal ion-containing aqueous solution disposed between the seed layer and the anode and the membrane and the seed layer pressed into contact with each other, thereby a metal layer being formed on the surface of the seed layer. Thereafter, the remaining insulation layer is removed and the undercoat layer is etched.

Abstract: An integrated circuit (IC) package incorporating controlled induced warping is disclosed. The IC package includes an electronic substrate having an active side upon which semiconducting dies and functional circuits have been lithographed or otherwise fabricated, leading to an inherent warping in the direction of the active side. One or more corrective layers may be deposited to the opposing, or inactive, side of the semiconducting die via electroplating in order to induce corrective warping of the electronic substrate back toward the horizontal (e.g., in the direction of the inactive side) to a desired degree.

Abstract: Provided are chrome-free adhesion pretreatment processes for use on a variety of reinforced or unreinforced plastics and polymers, such as polyimides, polyetherimides and polyvinylchloride. The pretreatment process can be performed in a combination of two sequential operations, which includes treating with a first solution containing nitric acid and subsequently treating with a second solution that includes sulfuric acid and periodate ions. Alternatively, the pretreatment process can be performed by treatment with a single combined composition that includes nitric acid, sulfuric acid, and periodate ions. The pretreatment processes, either done in two separate solutions, sequentially, or in one combined solution, produce an adherent surface for further metallization of the article, with adhesional values of the metal layer higher than those achieved using conventional chromic acid pretreatment processes.

Abstract: The present application provides a light emitting device and a manufacturing method for the same. The light emitting device includes a substrate and an anode structure disposed on the substrate, which is formed by depositing particles on a surface of the substrate through a deposition source. During the process of the anode structure, the substrate is disposed obliquely with respect to the deposition source such that the particles of the functional film layers of the anode structure are arranged in a fixed direction, thereby increasing the work function of the anode structure.

Abstract: The present invention provides a rinse solution for lithography and a pattern formation method using the solution. They can improve the pattern collapse, surface roughness and surface defects. The solution contains at least a sulfonic acid a nonionic surfactant having an alkyleneoxy group and water.

Abstract: A separator is provided that has a metal substrate and a conductive resin layer on the surface of the metal substrate. The conductive resin layer contains a resin and a conductive substance dispersed in the resin. The separator is configured such that the proportion of the conductive substance to the resin increases continuously from the metal substrate toward the surface of the separator.

Abstract: A ceramic electronic component includes a ceramic body and first and second outer electrodes. The first and second outer electrodes respectively include first and second resin-containing electrode layers and first and second Ni plating layers. The first and second Ni plating layers are respectively provided on the first and second resin-containing electrode layers. When a thickness of the first or second Ni plating layer is t1 and a distance by which a portion of the first or second Ni plating layer that is in contact with the second principal surface extends in the length direction is t2, t2/t1 is less than about 1.

Abstract: Provided is a plating method of a circuit substrate comprising a conductive pattern in which a metal layer containing at least silver and copper is exposed on an outer surface. The plating method comprises: step (A) of treating the circuit substrate with a first liquid agent containing an oxidizing agent; step (B) of treating the circuit substrate after the step (A) with a second liquid agent which dissolves copper oxide, and thereby removing copper oxide from the conductive pattern's surface; step (C) of treating the circuit substrate after the step (B) with a third liquid agent whose rate of dissolving silver oxide (I) at 25° C. is 1000 times or more faster than its rate of dissolving copper (0) at 25° C., and thereby removing silver oxide from the conductive pattern's surface; and step (D) of performing electroless plating on the conductive pattern of the circuit substrate after the step (C).

Abstract: Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic having a plurality of accelerators dispersed in the plastic. The accelerators have a formula ABO3, wherein A is one or more elements selected from Groups 9, 10, and 11 of the Periodic Table of Elements, B is one or more elements selected from Groups 4B and 5B of the Periodic Table of Elements, and O is oxygen. The method includes the step of irradiating a surface of plastic substrate to expose at least a first accelerator. The method further includes plating the irradiated surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.

Abstract: The present invention provides a copper-nickel alloy electroplating bath which is characterized by containing (a) a copper salt and a nickel salt, (b) a metal complexing agent, (c) a plurality of conductivity-imparting salts that are different from each other, (d) a compound that is selected from the group consisting of disulfide compounds, sulfur-containing amino acids and salts of these compounds, (e) a compound that is selected from the group consisting of sulfonic acid compounds, sulfimide compounds, sulfamic acid compounds, sulfone amides and salts of these compounds, and (f) a reaction product of a glycidyl ether and a polyhydric alcohol. This copper-nickel alloy electroplating bath is also characterized by having a pH of 3-8.

Abstract: A method for a forming three dimensional circuit is provided. A plastic base is provided. A metal layer is bonded on the plastic base by a metal coating process. The thickness of the metal layer is thickened by an electroplating process. The metal layer is trimmed to form a circuit pattern thereon by a laser engraving process, whereby, the working-hours can be reduced and the cost of material can also be reduced when the three dimensional circuit is manufactured.

Abstract: The present invention relates to novel processes for metallization of dielectric substrate surfaces applying organosilane compositions followed by oxidative treatment. The method results in metal plated surfaces exhibiting high adhesion between the substrate and the plated metal while at the same time leaves the smooth substrate surface intact.

Abstract: Metal-clad polymer articles containing structural fine-grained and/or amorphous metallic coatings/layers optionally containing solid particulates dispersed therein, are disclosed. The fine-grained and/or amorphous metallic coatings are particularly suited for strong and lightweight articles, precision molds, sporting goods, automotive parts and components exposed to thermal cycling although the coefficient of linear thermal expansion (CLTE) of the metallic layer and the substrate are mismatched. The interface between the metallic layer and the polymer is suitably pretreated to withstand thermal cycling without failure.

Abstract: The present invention relates to building materials, particularly building materials for placement on the outside of buildings.

Abstract: A catalyst precursor resin composition includes an organic polymer resin; a fluorinated-organic complex of silver ion; a monomer having multifunctional ethylene-unsaturated bonds; a photoinitiator; and an organic solvent. The metallic pattern is formed by forming catalyst pattern on a base using the catalyst precursor resin composition reducing the formed catalyst pattern, and electroless plating the reduced catalyst pattern. In the case of forming metallic pattern using the catalyst precursor resin composition, a compatibility of catalyst is good enough not to make precipitation, chemical resistance and adhesive force of the formed catalyst layer are good, catalyst loss is reduced during wet process such as development or plating process, depositing speed is improved, and thus a metallic pattern having good homogeneous and micro pattern property may be formed after electroless plating.

Abstract: The present invention describes a method of producing a p-type light-absorbing semiconductor copper zinc tin selenide/sulfide (Cu2(ZnxSn2-x)(SySe1-y)4) (abbreviated CZTS) with electrochemical deposition. It can be used in the production of solar cell when combined with an n-type inorganic or an organic semiconductor layer. The present method comprises a one-step or a sequence of depositions using electroplating to fabricate a low-cost and large-area CZTS solar cell, without using expensive and complicated deposition techniques or highly toxic and flammable chemicals in the production process. The present method significantly reduces the cost and energy requirement for production of solar cell.

Abstract: Disclosed are a current collector for a flexible electrode, a method of manufacturing the same, and a negative electrode including the same. The current collector for a flexible electrode includes: a flexible polymer substrate; a cross-linkable polymer layer disposed on the polymer substrate; and a metal layer disposed on the cross-linkable polymer layer, wherein the surface of the cross-linkable polymer layer includes a plurality of protrusions and grooves.

Abstract: A metal composite film having an excellent heat resistance and adhesion, suited for flexible printed circuit boards capable of forming fine wirings, as well as a production process thereof, is disclosed. The metal composite film comprises an insulating film; a thermoplastic polyimide layer(s) formed on at least one surface of the insulating film; and metal layers formed on the surface of each of the thermoplastic polyimide layer(s), which metal layers are formed by electroless plating and then by electrolytic plating, respectively. Since this metal composite film has an excellent heat resistance and adhesion, and maintains the excellent adhesion after forming fine wirings, it is suitably used as a high density flexible printed circuit board having fine circuits.

Abstract: A metal covered polyimide composite comprising a tie-coat layer and a metal seed layer formed on a surface of a polyimide film by electroless plating or a drying method is provided. A copper layer or a copper alloy layer is formed thereon by electroplating. The copper plated layer or copper alloy plated layer includes three layers to one layer of the copper layer or copper alloy layer. The metal covered polyimide composite effectively prevents peeling in a non-adhesive flexible laminate (especially a two-layer flexible laminate), and more particularly, effectively inhibits peeling from the interface of a copper layer and tin plating. A method of producing the composite and apparatus for producing the composite are also provided.

Abstract: A two-layered copper-clad laminate material in which a copper layer having a thickness of 1 to 5 ?m is formed by means of sputtering or electroplating on one surface or both surfaces of a polyimide film having a thickness of 12.5 to 50 ?m after a plasma treatment is performed in a nitrogen gas atmosphere, the two-layered copper-clad laminate material being characterized in that the dissolution of the aforementioned polyimide film with an etching liquid is delayed compared with a polyimide film that is not subjected to the plasma treatment, the aforementioned dissolution being delayed as a consequence of modifying the surface of the polyimide film by incorporating nitrogen into the polyimide film by means of the plasma treatment in the nitrogen gas atmosphere.

Abstract: The present invention relates to a coating method by electrocatalyzed chemical grafting of a surface of a substrate with a polymeric layer characterized in that it comprises the following steps: a. a substrate is provided, b. a bath containing at least one polymerizable monomer via a radical route, at least one cleavable aryl salt, at least one reducing agent and at least one solvent is provided, in which a potential difference is applied, c. said substrate is immersed in said bath, d. a grafted polymer is obtained on the surface of said substrate. The invention also relates to a substrate obtained according to the coating method by electrocatalyzed chemical grafting, the surface of which is coated with a polymeric layer.

Abstract: In a method for making a wave-absorbing sheet, first emulsified mixture is provided by mixing wave-absorbing particles with graphene solution so that the graphene solution absorbs the wave-absorbing particles. Secondly, second emulsified mixture is provided by adding and blending resin solution in the first emulsified mixture. Thirdly, third emulsified mixture is provided by adding and blending interface modifier in the second emulsified mixture. Then, two conductive substrates are submerged in the third emulsified mixture, and voltage is provided to the third emulsified mixture so that the wave-absorbing particles, the resin solution and the graphene solution are evenly coated on the conductive substrates. Then, a wave-absorbing sheet is provided by eroding and removing the conductive substrates. Finally, the wave-absorbing sheet is washed and dried. The wave-absorbing sheet is thin, light and flexible, and exhibits a wide absorption frequency band and a high absorption rate.

Abstract: A process for the preparation of an activated polymer particle comprising contacting a polymer particle with at least one polyamine, wherein said polyamine has three or more amino groups, to form a surface treated polymer particle; and applying a catalyst to the surface treated polymer particle to form an activated polymer particle.

Abstract: A method of manufacturing a hydrogen generating apparatus, the method including: forming an absorbent layer, the absorbent layer configured to absorb an aqueous solution; depositing a metal membrane over either side of the absorbent layer such that the absorbent layer is interposed between the metal membranes; and forming a support layer over one side of one of the metal membranes, the support layer configured to transport hydrogen generated by a reaction between the aqueous solution and the metal membrane.

Abstract: A method for shrinking a linewidth on a substrate includes the steps of applying a stretching force on the substrate, defining a line on a top surface of the substrate and releasing the applied stretching force. The applied force is executed by mechanical stretching or thermal expansion and has a direction parallel to the line.

Abstract: The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.

Abstract: The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (?) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (?) by a wet-mode plating technique, wherein the compound (?) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.

Abstract: An electroplating method includes at least the following steps: providing a plastic substrate; forming a preliminary layer containing metal powder and paint on the plastic substrate; laser irradiating the preliminary layer to form an intermediate layer having the metal powder exposed thereon; and electroplating an electroplated layer on the intermediate layer. This electroplating method is simple and can be applied to all kinds of plastic substrate.

Abstract: A complimentary polymer or “dual-polymer” electrochromic device and methods of preparing the same are provided.

Abstract: The presently disclosed embodiments are directed to an improved metallization process for making fuser members which avoids the extra steps of metal nanoparticle seeding or special substrate treatment. In embodiments, a metallized substrate, formed by dip-coating or spraying with a metal nanoparticle dispersion which is subsequently thermally annealed, is used for the complete fabrication of the fuser member.

Abstract: A substrate having animated flashing figures, applications thereof, and a manufacturing method of the same are revealed. A reflective film with an electroplated layer on a surface is covered over the base material. Then at least two figures are printed on the reflective film to form a printed layer. The figures are cut into strips and then the strips are arranged alternatively. Finally, a surface grating layer is arranged over the printed layer. Through the combination of the reflective film, the printed layer formed by staggered strips of the figures, and the surface grating layer, figures on a surface of the substrate show an animated flashing effect. The substrate can be applied to various products such as containers, trays, eyeglass frames, watch bands, etc.

Abstract: Metal-clad polymer articles containing structural fine-grained and/or amorphous metallic coatings/layers optionally containing solid particulates dispersed therein, are disclosed. The fine-grained and/or amorphous metallic coatings are particularly suited for strong and lightweight articles, precision molds, sporting goods, automotive parts and components exposed to thermal cycling although the CLTE of the metallic layer and the one of the substrate is mismatched. The interface between the metallic layer and the polymer is suitably pretreated to withstand thermal cycling without failure.

Abstract: Multilayer polymer films are described. The films include an oriented polymeric substrate wherein a print-side skin layer of the substrate has a surface roughness, Ra, ?12.0 ?m. The films also include a metal layer in surface contact with the print side of the polymeric substrate, a primer composition in surface contact with the metal layer, and a printable topcoat layer in surface contact with the primer composition. Pressure-sensitive label structures and methods of making such films are also described.

Abstract: The presently disclosed embodiments are directed to an improved metallization process for making fuser members which avoids the extra steps of metal nanoparticle seeding or special substrate treatment. In embodiments, a metallized substrate, formed by dip-coating or spraying with a metal nanoparticle dispersion which is subsequently thermally annealed, is used for the complete fabrication of the fuser member.

Abstract: A process is provided for metallizing a surface of a substrate with electrolytically plated copper metallization, the process comprising electrolytically depositing copper over the electrically conductive polymer by immersing the substrate in an electrolytic composition and applying an external source of electrons, wherein the electrolytic composition comprises a source of copper ions and has a pH between about 0.5 and about 3.5. In another aspect, a process is provided for metallizing a surface of a dielectric substrate with electrolytically plated copper metallization, the process comprising immersing the substrate into a catalyst composition comprising a precursor for forming an electrically conductive polymer on the surface of the dielectric substrate and a source of Mn(II) ions in an amount sufficient to provide an initial concentration of Mn(II) ions of at least about 0.

Abstract: The present invention relates to a silver complex obtained by reacting at least one silver compound represented by the formula 2 below with at least one ammonium carbamate compound or ammonium carbonate compound represented by the formula 3, 4 or 5 below:

Abstract: The adhesion of metal thin films onto polymeric substrates can be significantly enhanced by contacting the surface of the polymeric substrate with a non-complexing solvent before or after depositing the metal film.

Abstract: Embodiments provide a novel fabrication method and structure for reducing structural weight in radio frequency cavity filters and radio subsystems such as antennas and filters. The novel structures are fabricated by electroplating the required structure over a mold, housing, or substrate. The electrodeposited composite layer may be formed by several layers of metal or metal alloys with compensating thermal expansion coefficients. The first or the top layer is a high conductivity material or compound such as silver having a thickness of several times the skin-depth at the intended frequency of operation. The top layer provides the vital low loss performance and high Q-factor required for such filter structures while the subsequent compound layers provide the mechanical strength.

Abstract: Disclosed are a current collector for a flexible electrode, a method of manufacturing the same, and a negative electrode including the same. The current collector for a flexible electrode includes: a flexible polymer substrate; a cross-linkable polymer layer disposed on the polymer substrate; and a metal layer disposed on the cross-linkable polymer layer, wherein the surface of the cross-linkable polymer layer includes a plurality of protrusions and grooves.

Abstract: Bioelectrodes, methods of making bioelectrodes and methods of using bioelectrodes are provided. The bioelectrodes have an electrically-conductive substrate coated with an electroconductive polymer. The bioelectrode exhibits ohmic behavior over a range of about 1 Hz to about 100 KHz, where ohmic behavior means that the value of the impedance is independent of the signal frequency over the range of interest. The bioelectrode can transmit or receive an electrical signal between the electrically conductive substrate and the biological component through the conductive polymer.

Abstract: The following method is to improve selectivity during metallisation of surface areas to be metallised on objects 7 having different plastics while not allowing the areas not to be metallised to be metallised: A) etching of the objects 7 with an etching solution; B) treatment of the objects 7 with a solution of a colloid or with a metal compound, the metal being a metal of Group VIIIB or IB of the Periodic Table of the Elements; and C) electrolytic metallisation of the objects 7 with a metallisation solution. The objects 7 are subjected to ultrasonic treatment during the treatment in a further method step following method step B) and before method step C) in order to avoid metallisation of at least one first plastic exposed on the surface of the objects 7 while at least one second plastic exposed on the surface of the objects 7 is metallised.

Abstract: Embodiments provide a novel fabrication method and structure for reducing structural weight in radio frequency cavity filters and novel filter structure. The novel filter structure is fabricated by electroplating the required structure over a mold. The electrodeposited composite layer may be formed by several layers of metal or metal alloys with compensating thermal expansion coefficients. The first or the top layer is a high conductivity material or compound such as silver having a thickness of several times the skin-depth at the intended frequency of operation. The top layer provides the vital low loss performance and high Q-factor required for such filter structures while the subsequent compound layers provide the mechanical strength.

Abstract: A metal-clad polymer article includes a polymeric material with or without particulate addition. The polymeric material defines a permanent substrate. A metallic material covers at least part of a surface of the polymeric material. The metallic material has a microstructure which, at least in part, is at least one of fine-grained with an average grain size between 2 and 5,000 nm and amorphous. The metallic material has an elastic limit between 0.2% and 15%. At least one intermediate layer can be provided between the polymeric material and the metallic material. A stress on the polymeric material, at a selected operating temperature, reaches at least 60% of its ultimate tensile strength at a strain equivalent to the elastic limit of said metallic material.

Abstract: This invention relates to a process for metal-coating a polyamide surface, to achieve metal-polyamide adhesion, and such metal-coated polyamide articles.

Abstract: A method for modifying the surface energy of at least one surface of a solid is provided. The method may comprise a step consisting of grafting, on the surface, a polymeric organic film consisting of graft polymers, each polymer having a first unit bound directly to the surface derived from a cleavable aryl salt and at least one other unit of the polymer chain derived from a component selected from the group consisting of a cleavable fluorinated aryl salt, a fluorinated (meth)acrylate and a vinyl-terminated siloxane. In addition, a kit for implementation of the method is provided.

Abstract: A substrate capable of producing 3D pattern having colored dazzle light effect and a method of producing pattern and fabricating finished product are provided, in which plastic foaming sheet is selected as base material and reflection film having its surface electroplated is overlaid thereon. Then, embossing process is conducted to form concave-convex veins, and finally printing is conducted to form a print-layer thereon, so that the surface of the substrate possesses a 3D pattern having colored dazzle light effect. This substrate can be utilized in products as container, tray, eyeglass frame or watchstrap.