Abstract: A base material for a printed circuit board includes: an insulating base film; and a sintered body layer of metal particles layered on one side surface of the base film; wherein an arithmetic mean roughness (Sa) of a surface of the sintered body layer that is opposite to the base film is greater than or equal to 0.005 ?m and less than or equal to 0.10 ?m.

Abstract: A present invention provides a method for manufacturing a printed wiring board having excellent plating adhesion to a resin substrate having low surface roughness such as having surface roughness Ra of 0.2 ?m or less, having excellent treating solution stability, and having high penetrability into the resin substrate. The method for manufacturing a resin substrate includes a step 1A or a step 1B; and a step 2 after the step 1A or the step 1B; and the steps are conducted before conducting electroless plating.

Abstract: The present invention relates to a chrome free etch for plating on plastic processes, wherein plastic surfaces are contacted in a first etching step with an etching solution at least comprising Mn(IV)-ions and, in a second etching step, with a solution at least comprising Mn(III)- and Mn(VII)-ions prior to the metal plating step.

Abstract: A method of electroless nickel plating on surface of silicon carbide powder with a uniform and stable coating. In this method, ultrasonic assist is introduced in the pre-treatment and during plating process, and the powder particles in the liquid are dispersed and deagglomerated by the mechanical action and cavitation of the ultrasonic waves, thereby achieving a uniform dispersion of the powder in the dispersant. Furthermore, a reducing agent is slowly added during plating so as to give a more uniform and stable deposition of the coating onto the surface of the powder particles, and thus a silicon carbide core-nickel shell structure with an excellent powder dispersibility and a uniform and stable coating is produced.

Abstract: A method including the following steps is provided. A seed layer is formed. Conductive patterns are formed on the seed layer. An etching process with an etchant is performed to remove a portion of the seed layer exposed by the conductive patterns, wherein the etchant includes: 0.1 wt % to 10 wt % of phosphoric acid (H3PO4), 0.1 wt % to 10 wt % of hydrogen peroxide (H2O2), 1 ppm to 20000 ppm of a protective agent, 1 ppm to 20000 ppm of a wetting agent, and a balance amount of a solvent.

Abstract: Provided is a charging roll for an electrophotographic apparatus, which includes a surface layer that suppresses bleeding of a base layer component and achieves uniform resistance by improving the dispersibility of a conductive agent. A charging roll for an electrophotographic apparatus includes a shaft body, an elastic layer that is formed on the outer circumference of the shaft body, and a surface layer that is formed on the outer circumference of the elastic layer, wherein the surface layer contains the following components (A)-(D), i.e., at least one resin (A) selected from among fluororesins and fluorine-modified acrylic resins, a carbon black (B), an ester-based polymer dispersant (C) and a sulfonic acid-based dispersant (D).

Abstract: A component is provided including a body formed at least partially from a composite material. At least a portion of the composite material is covered by a plating. The plating includes a layer of electroless copper, a layer of electrolytic copper, a layer of nickel strike, and a finishing layer.

Abstract: A slip ring includes a dielectric carrier body having a circumferential lateral surface and radially oriented feed-through leads, a first conductive element, and a second conductive element. In a first section, the conductive elements extend in parallel at an axial offset on the lateral surface in the circumferential direction, and in a second section, they extend in the feed-through leads with a radial directional component. The first sections extend in the circumferential direction across a first angular dimension of less than 360°, so that a discontinuity is present along the circumferential direction of the conductive elements in a second angular dimension. The feed-through leads are arranged such that the second angular dimension of the first conductive element is situated at an offset from the second angular dimension of the second conductive element in the circumferential direction, the first and the second conductive elements being electrically connected to each other.

Abstract: Adhesiveless copper clad laminates obtained by metallizing excellent in wiring microfabrication ability in processing by semi-additive method, and a printed circuit board using the adhesiveless copper clad laminates excellent in wiring microfabrication ability as a base material are provided. The adhesiveless copper clad laminates include a base metal layer made of an alloy containing nickel and formed on at least one surface of an insulating film without using an adhesive in between, a thin copper layer formed on a front surface of the base metal layer by dry plating, and a copper plating film formed on a front surface of the thin copper layer by electroplating. The copper plating film contains 10 mass ppm to 150 mass ppm of sulfur in a depth range of at least 0.4 ?m from the front surface of the copper plating film in a direction toward the insulating film.

Abstract: The invention provides support-free palladium membranes and methods of making these membranes. Single-gas testing of the unsupported foils produced hydrogen permeabilities equivalent to thicker membranes produced by cold-rolling. Defect-free films as thin as 7.2 microns can be fabricated, with ideal H2/N2 selectivities as high as 40,000. Homogeneous membrane compositions may also be produced using these methods.

Abstract: The present invention comprises a method of forming a thin metal layer on a dicyclopentadiene polymer surface and to constructs comprising the metalized layer.

Abstract: A process for coating a surface of a substrate made of nonmetallic material with a metal layer consisting of providing a substrate made of nonmetallic material; subjecting a surface of said substrate to a treatment for increasing the specific surface area thereof; subjecting the resulting surface to an oxidizing treatment; contacting the resulting substrate with a solution containing an ion of a metal from groups IB and VIII of the Periodic Table; obtaining a substrate comprising ions of a metal that are chemically attached to the nonmetallic material constituting the substrate on at least one of its surfaces; subjecting the ions to a reducing treatment to obtain a substrate comprising atoms of a metal that are chemically attached to the nonmetallic material constituting the substrate on a part of at least one of its surfaces; and contacting the resulting surface with a solution containing ions of a metal.

Abstract: A method for producing a resin plated product includes: a molding step of forming a resin molded product as a resin molded product to be plated that includes integrally a main body part with a form of a molding and a sacrifice part arranged in the vicinity of an edge part not to come into contact with the edge part; an electro-less plating step of applying an electro-less plating process to the resin molded product, an electroplating step of immersing the resin molded product in an electroplating bath provided with an anode electrode, applying an anode voltage to the anode electrode and applying a cathode voltage to the resin molded product to carry out an electroplating process; and a removing step of removing the sacrifice part from the resin molded product. The sacrifice part is preferably extended from a non-designed surface of the main body part.

Abstract: A metal composite film having an excellent heat resistance and adhesion, suited for flexible printed circuit boards capable of forming fine wirings, as well as a production process thereof, is disclosed. The metal composite film comprises an insulating film; a thermoplastic polyimide layer(s) formed on at least one surface of the insulating film; and metal layers formed on the surface of each of the thermoplastic polyimide layer(s), which metal layers are formed by electroless plating and then by electrolytic plating, respectively. Since this metal composite film has an excellent heat resistance and adhesion, and maintains the excellent adhesion after forming fine wirings, it is suitably used as a high density flexible printed circuit board having fine circuits.

Abstract: A metal covered polyimide composite comprising a tie-coat layer and a metal seed layer formed on a surface of a polyimide film by electroless plating or a drying method is provided. A copper layer or a copper alloy layer is formed thereon by electroplating. The copper plated layer or copper alloy plated layer includes three layers to one layer of the copper layer or copper alloy layer. The metal covered polyimide composite effectively prevents peeling in a non-adhesive flexible laminate (especially a two-layer flexible laminate), and more particularly, effectively inhibits peeling from the interface of a copper layer and tin plating. A method of producing the composite and apparatus for producing the composite are also provided.

Abstract: A catalyst precursor resin composition includes an organic polymer resin; a fluorinated-organic complex of silver ion; a monomer having multifunctional ethylene-unsaturated bonds; a photoinitiator; and an organic solvent. The metallic pattern is formed by forming catalyst pattern on a base using the catalyst precursor resin composition reducing the formed catalyst pattern, and electroless plating the reduced catalyst pattern. In the case of forming metallic pattern using the catalyst precursor resin composition, a compatibility of catalyst is good enough not to make precipitation, chemical resistance and adhesive force of the formed catalyst layer are good, catalyst loss is reduced during wet process such as development or plating process, depositing speed is improved, and thus a metallic pattern having good homogeneous and micro pattern property may be formed after electroless plating.

Abstract: The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.

Abstract: There are provided technologies for adsorbing a catalyst metal selectively to an anionic group such as a carboxyl group, thereby forming a metal film on a nonconductive resin selectively, including a palladium complex represented by the following formula (I): wherein L represents an alkylene group and R represents an amino group or a guanidyl group, or a structural isomer thereof, a processing solution for electroless plating catalyst application containing the complex as an active component, and a method for forming a metal plated film on a nonconductive resin, containing subjecting a nonconductive resin having a surface anionic group to a catalyst adsorbing treatment using the processing solution and then to a reduction treatment, electroless metal plating, and metal electroplating.

Abstract: A method of preparing conductive ribs on a chassis includes steps as follows. A plastic case is provided with at least one elastic rib integrally formed thereon. Then, a conductive film is formed to overlay on both an inner surface of the plastic case and the surfaces of the elastic rib. A chassis with conductive ribs and a method of assembling an electric device including the same are also provided in the invention.

Abstract: An electroless nickel plating liquid capable of forming an underbarrier metal for metal bumps or solder bumps by electroless nickel plating with a uniform film thickness on silicon wafers composed of multiple IC chips contains a water-soluble nickel salt, a reducing agent, a complexing agent, and a pH buffer, wherein_lead ion is contained at 0.01-1 ppm, cobalt ion is contained at 0.01-1 ppm, and a sulfur compound is contained at 0.01-1 ppm.

Abstract: There is provided a manufacturing method of an aluminum structure, including a conductive treatment process of forming an electrically conductive layer on a surface of a resin molded body, the electrically conductive layer being made of one or more metals selected from the group consisting of gold, silver, platinum, rhodium, ruthenium, palladium, nickel, copper, cobalt, iron, and aluminum, and a plating process of plating the resin molded body subjected to the conductive treatment process with aluminum in a molten salt bath. The manufacturing method of an aluminum structure allows aluminum plating on the surface of even a porous resin molded body having a three-dimensional network structure. In particular, there is also provided a manufacturing method of an aluminum structure that can form porous aluminum having a large area.

Abstract: A resin material is brought into contact with a first solution containing ozone, and at the same time, ultraviolet rays are irradiated. The activation due to the treatment with ozone water and the activation due to the treatment with ultraviolet rays are synergistically operated to enable the formation of a plated coating having excellent adhesive strength by a short treatment. In addition, even by a long treatment, the adhesive strength can be restrained from lowering. Consequently, a plated coating having excellent adhesion can be formed without roughening the surface of the resin material by a short pretreatment.

Abstract: An exemplary electrophoretic coating method and an electroplated shell (800) manufactured thereby is provided. The electrophoretic coating method includes the following steps. A first step (Step S1) is to mold a base shell (500). The base shell includes a base body (50), a shell body (60), and a connecting body (70). The shell body and the connecting body are molded with the base body. The connecting body connects with the shell body. A second step (Step S2) is to pretreat the shell body and the connecting body. Thus, conducting films are formed on the shell body and connecting body. A third step (Step S3) is to electrophoretically coat the preliminarily treated base shell, so as to form electroplated layers on the shell body. A fourth step (Step S4) is to remove the connecting body so as to form/yield the electroplated shell.

Abstract: This invention provides a transparent electrically conductive film, which, while maintaining the light transparency of a transparent film, has excellent electrical conductivity, can be utilized for electromagnetic wave shielding, and does not cause inclusion of air bubbles in the lamination onto other base material, and a process for producing the same. The production process comprises the steps of forming a large number of concaves and convexes having an average height of not more than 0.1 ?m on both sides or one side of a transparent film, forming a resist layer having a pattern shape opposite to the electrically conductive part in the electrically conductive film on the transparent film on its concave-convex side, applying a catalyst for plating onto the resist layer-formed face, separating the resist layer, forming a metal layer by plating, and blackening the metal layer, the metal layer satisfying 1?W/T?500 wherein W represents the width of the metal layer and T represents the height of the metal layer.

Abstract: A plating bath, able to form a resistance layer with a uniform thickness distribution on the roughened surface of a conductive base, including nickel ions and sulfamic acid or its salt as essential components and at least one of phosphoric acid, phosphorous acid, hypophosphorous acid, and salts of the same; a conductive base having a thin resistance layer with a stable resistance, and a resistance circuit board material using the same.

Abstract: After treated in a solution containing ozone, a plating material is brought into contact with a solution containing at least one of an anionic surface active agent and a nonionic surface active agent, and an alkaline component. Ozone acts to locally break unsaturated bonds on a surface of the plating material to form C—OH bonds or C?O bonds, thereby activating the surface of the plating material, and since a surface active agent 1 is adsorbed thereon, a catalyst 2 is adsorbed on hydrophilic groups of the surface active agent 1 which has been adsorbed on the above-described functional groups. Consequently, no etching treatment is required, and an electroless plated coating having excellent adhesion can be formed without roughening the surface of the resin material.

Abstract: Disclosed is a resin composition which comprises a catalyst precursor for electroless plating to form an electromagnetic wave shielding layer. The resin composition comprises an organic polymer resin, a polyfunctional monomer having an ethylenically unsaturated bond, a photoinitiator, a silver organic complex precursor as a catalyst precursor, and an organic solvent. Further disclosed are methods for forming metal patterns using the resin composition and metal patterns formed by the methods. The methods comprise forming a pattern, reducing the pattern, and electroless plating the reduced pattern. A patterned layer of the catalyst formed using the resin composition is highly adhesive, a loss of the catalyst during a wet process is substantially prevented, and an increase in plating rate leads to the formation of a uniform, fine metal pattern after electroless plating. Electromagnetic wave shielding materials comprising the metal pattern can be used in the formation of films for shielding electromagnetic waves.

Abstract: The presently disclosed embodiments are directed to an improved metallization process for making fuser members which avoids the extra steps of metal seeding or special substrate treatment. In embodiments, a metallized substrate, formed via a polycatecholamine-assisted metallization process, is used for the complete fabrication of the fuser member.

Abstract: The present invention is a plated resin molded article and process of producing the plated resin molded article, wherein metal plating is carried out on the surface of a thermoplastic resin molded article and either of requirements (1), (2) and (3) described below is included: (1) the thermoplastic resin molded article contains a thermoplastic resin and a water-soluble substance, a step of carrying out the removal of fat from the resin molded article and a step of electroless plating are provided in combination, and a step of etching by an acid containing a heavy metal is not included; (2) the thermoplastic resin molded article contains a polyamide-based resin and a styrene-based resin, a step of carrying out the removal of fat from the resin molded article and a step of electroless plating are provided in combination, and a step of etching by an acid containing a heavy metal is not included; or (3) a step of contact-treating the thermoplastic resin molded article with an acid or base not containing a heav

Abstract: An electrochemical plating apparatus and method for facilitating uniform current distribution across a wafer during loading into an ECP (electrochemical plating) apparatus is disclosed. The apparatus includes a bath container for containing a bath solution, an anode provided in the bath container, a cathode ring for supporting a wafer in the bath container and a current source electrically connected to the anode and the cathode ring. According to the method, a voltage potential is applied to the cathode ring as it is immersed into the solution and prior to immersion of the wafer in the solution, thereby facilitating a substantially uniform plating current across the wafer upon immersion of the wafer.

Abstract: A high frequency device packaging method is described wherein an insulating material, attached to a fiat surface, is selectively etched and the etched insulating material is plated with a conductive material to form a center conductor for a coaxial via structure.

Abstract: A method for manufacturing an EMI shielding element from a sheet of polymer material includes forming the shielding element by vacuum- or pressure-molding. The formed element is then chemically etched to roughen its surface on a microscopic scale. The surface is subsequently treated with a catalyzing solution to enable the shielding element to be plated by electroless plating. A first metallic layer is deposited on the etched and catalyzed surface by electroless plating, and a second metallic layer is deposited on the first by electrolytic plating.

Abstract: A process that can be uniformly employed for electroplating a wide variety of different non-conductive substrates, including those that are non-platable or difficult-to-plate using conventional electroless and electrolytic plating techniques involves application of a platable coating composition to the substrate prior to plating. The platable coating composition is cured to render the substrate more receptive to conventional plating techniques. In one embodiment, the process utilizes an epoxy resin system that upon being cured is receptive to electroless plating and electrolytic plating techniques that are the same or similar to those conventionally employed for electroplating ABS and/or PC/ABS substrates.

Abstract: A method for manufacturing a wiring substrate includes the steps of: (a) forming a ground layer precursor having reactive groups including nitrogen atoms in first and second areas of a substrate; (b) irradiating light energy to remove the reactive groups from the ground layer precursor to thereby form a ground layer charged in cathode; (c) patterning a cationic surface-active agent of anode to be left on the first area of the substrate with the ground layer as a ground; (d) providing a catalyst at the surface-active agent; and (e) forming a wiring along the first area of the substrate by precipitating a metal layer to the catalyst.

Abstract: A process for forming an interface (106) between a plated and a non-plated area (102, 104) on the surface of a plastic component (100) is disclosed. First, an anti-plating layer (110) is formed over the surface of the plastic component. Thereafter, a low-power laser beam (10) is used to remove a portion of the anti-plating layer and to form an interface between the plated area and the non-plated area. A seeding layer (120) is formed on the plated area so that the plated area is electrically conductive. Finally, a metallic layer (130) is electrically plated over the seeding layer. The metallic layer connects with the anti-plating layer via the interface. The cost of producing the anti-plating layer is low. Moreover, since the laser etching operation is able to produce a high-quality interface boundary between the plated and the non-plated area, yield of the process is improved.

Abstract: The quality of painted surfaces of polymeric articles is improved by depositing a coating of a metal such as zinc or zinc alloy on the surface of the article to be painted. For example, zinc is electrodeposited on a conductive surface of the article. The metal coated polymeric surface provides a good base for electrostatic deposition of either liquid or powder paint and the metal surface prevents the formation of defects in the painted surface during heating of the article to dry or cure the paint film.

Abstract: The quality of painted surfaces of polymer composites is improved by first forming an electroless metal coating on the molded surface of the composite and then electroplating a coating of zinc or zinc alloy on the metallized composite surface. The “galvanized” composite surface provides a good base for electrostatic deposition of either liquid or powder paint and the zinc surface prevents the formation of defects in the painted surface during heating of the composite to dry or cure the paint film.

Abstract: There is provided a method for fabricating electrical wirings capable of being manufactured with low cost and easily applied to large-scale substrates. A photosensitive ground resin film is formed on an insulating substrate by coating process. The ground resin film is subjected to exposure and development processes, by which a ground resin film patterned into a wiring pattern is obtained. Then, on the patterned ground resin film, a low-resistance metal film made of Cu is formed by electroless plating.

Abstract: The invention provides a process for producing a plated plastic article, which requires no chemical etching and can ensure high quality of plating without addition of a large amount of any inorganic filler in order to form a physically rough surface for an effective plating adhesion. After molding thermoplastic materials having a shear strength of 50 MPa or more, the surfaces of the molded articles are subjected to liquid honing treatment with an aluminum abrasive so that the surface roughness Rz (average roughness of ten points) is 10 &mgr;m or more, and subsequently addition of catalyst, activation treatment, and electroless plating are carried out.

Abstract: A method of forming a metal film of copper on the surface of a resin substrate by successively effecting the conditioning treatment, Pd activation treatment, electroless copper plating treatment and electrolytic copper plating treatment. In the conditioning treatment, a conditioning treatment solution is interposed in the form of a thin layer between the surface and a cover glass plate, and the surface is irradiated with ultraviolet light from the upper side of the cover glass plate. Irradiation with ultraviolet light in the presence of the treatment solution causes the molecules in the surface of the resin to chemically react with the component of the treatment solution, whereby the surface of the resin is more activated to improve the adhesion with copper that is deposited on the surface of the resin.

Abstract: The insulating layer formation step of forming an insulating layer 24-1 on a base for resin application 20 by applying polymeric material, which has been diluted with a solvent, filled with inorganic filler to the base for resin application and by drying the base for resin application; the circuit formation portion forming step of creating a circuit formation portion and a via hole 25 in insulating layer 24-1 that has been formed in the above described insulating layer formation step by means of a laser treatment; and the circuit formation step of forming a circuit 23-1 by plating the circuit formation portion and via hole 25 that have been created in the above described circuit formation portion forming step are provided and the insulating layer formation step, the circuit formation portion forming step and the circuit formation step are repeated a plurality of times in this order and, thereby, a circuit formation part (multi-layered substrate) is manufactured.

Abstract: A metal layer uniform in thickness is formed by electroless plating on both inner and outer surfaces of a corrugated tube to thereby produce a shield-plated corrugated tube which has a satisfactory flexibility as well as a superior electromagnetically shielding effect. Specifically, in the corrugated tube of resin, at least the size and shape of groove portions inside the tube for forming the convex-concave portions of the tube wall are set to satisfy the condition of 1.5<D/W<1.6 where D represents the depth of each groove portion in the radial direction of the tube and W represents the width of each groove portion in the axial direction of the tube. The metal layers are formed on the inner and outer surfaces of the corrugated tube by electroless plating.

Abstract: A process of performing via-filling efficiently and by a simple procedure is disclosed. The via-filling process comprises providing a substrate having blind via-holes, making the substrate electrically conductive, and plating the substrate in an acid copper plating bath which comprises the following components (A) to (E): (A) copper sulfate at a concentration of 100-300 g/L, (B) copper sulfate at a concentration of 30-150 g/L, (C) a first component (polymer component) such as polyethylene glycol, polypropylene glycol, and Pluronic surfactants, at a concentration of 10-1000 mg/L, (D) a second component (carrier component) such as sodium sulfoalkyl sulfonates and bis-sulfo organic compounds at a concentration of 0.1-20 mg/L, and (E) a third component (leveler component) such as polyalkylene imines, 1-hydroxyethyl-2-alkyl imidazoline chlorides, auramine and its derivatives at a concentration of 0.05-10 mg/L.

Abstract: A process for producing an electrolessly plated molded article, which includes molding a resin composition made of a thermoplastic resin having a specific Izod impact strength and a Rockwell surface hardness and an inorganic filler, then treating the surface of the molded article with air blast using an abrasive having a sharp granular shape, and then conducting catalyst coating, activation treatment and electroless plating. It has been possible to apply the electroless plating with a high adhesion strength to the molded article of the thermoplastic resin composition without conducting the chemical etching treatment.

Abstract: Provided is a method of plating a non-conductive product comprising the steps of: forming a coating film on a surface of the non-conductive product with a conductive paint having the following composition of solid ingredients: (a) a resin vehicle in 20 to 80 weight %, and (b) a conductive whisker in 80 to 20 weight %; and executing electroless plating on a surface of the coating film. Also provided are products produced by this method.

Abstract: A method of simultaneously electroplating both sides of a dual-sided circuit board substrate having electrically connected, multi-trace circuit patterns formed on both sides of the substrate, without requiring formation and at least partial removal of electrically conductive tie bars and associated extensions, comprises steps of simultaneously electrically contacting each feature of a first one of the circuit patterns with a multi-fingered electrical contactor, and applying an electrical potential to the contactor to effect simultaneous electroplating on the circuit patterns on both sides of the substrate. According to an embodiment of the invention, the multi-fingered contactor comprises an array of electrically conductive wires, rods, or filaments extending from one surface of a metal plate. The invention finds particular utility in the fabrication of ball grid array (BGA) semiconductor device packages.

Abstract: A method of electroplating both sides of a dual-sided circuit board substrate having electrically connected, multi-trace circuit patterns formed on both sides of the substrate, without requiring formation and at least partial removal of electrically conductive tie bars, comprises steps of covering and electrically contacting a first one of the circuit patterns with a first layer of electrically conductive material, applying an electrical potential to the first layer of electrically conductive material to effect electroplating on the second one of the circuit patterns, removing the first layer of electrically conductive material, covering and electrically contacting the second one of the circuit patterns with a second layer of electrically conductive material, applying an electrical potential to the second layer of electrically conductive material to effect electroplating on the first one of the circuit patterns, and removing the second layer of electrically conductive material.

Abstract: An inkjet printer nozzle plate having a non-wetting surface of uniform thickness and an orifice wall of tapered contour, and method of making the nozzle plate. In the method a metal masking layer is deposited on a glass substrate, the masking layer having an opening therethrough for passage of light only through the opening. Next, a negative photoresist layer is deposited on the masking layer, the negative photoresist layer being capable of photochemically reacting with the light. A light source passes light through the substrate, so that the light also passes only through the opening in the form of a tapered light cone. This tapered light cone will define the tapered contour of a nozzle plate orifice wall to be formed. The negative photoresist layer photochemically reacts with the light only in the light cone to define a light-exposed region of hardened negative photoresist.

Abstract: A method of producing a multilayer circuit board comprising a core substrate and a plurality of layers of wiring lines on both sides of the core substrate with an insulation layer being interposed therebetween; the layers of wiring lines on both sides being interconnected by conducting members provided on the inside walls of through holes going through the core substrate, and the interposed insulation layer. The method further comprising, wiring lines with an upper layer of wiring lines wherein the conducting member on the inside wall of the through hole and the via are formed in separate steps. The method can provide a multilayer circuit board which can advantageously be used to mount a chip or device thereon having an increased number of electrodes or terminals.

Abstract: A method of electroplating circuit board substrate having a high density, multi-trace circuit pattern formed on at least one major surface of an insulative substrate, without requiring formation and at least partial removal of a large plurality of electrically conductive tie bars contacting each of the circuit traces for supplying electroplating potential/current, comprises providing the at least one major surface with a single tie bar having at least a pair of laterally extending arms in simultaneous electrical contact with an end of each trace. Portions of the tie bar extension arms are selectively removed after completion of electroplating, e.g., by laser drilling or plasma etching, to electrically separate each of the circuit traces from the tie bar. According to an embodiment of the invention, electroplating is simultaneously performed on a dual-sided substrate including electrically interconnected circuit patterns formed on opposite sides thereof.