Conductive Material Is Copper Or Nickel Patents (Class 205/169)
  • Patent number: 9661770
    Abstract: Techniques for graphic formation via material ablation described. In at least some implementations, a graphic is applied to a surface of an object by ablating layers of the object to form an ablation trench in the shape of the graphic. In at least some embodiments, an object can include a surface layer and multiple sublayers of materials. When an ablation trench is generated in the object, the ablation trench can penetrate a surface layer of the object and into an intermediate layer. In at least some implementations, height variations in an object surface caused by an ablation trench can cause variations in light reflection properties such that a graphic applied via the ablation trench appears at a different color tone than a surrounding surface, even if the ablation trench and the surrounding surface are coated with a same colored coating.
    Type: Grant
    Filed: March 4, 2013
    Date of Patent: May 23, 2017
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Mark Thomas McCormack, Raj N. Master, Michael Joseph Lane, Krishna Darbha, Ralf Groene, James Alec Ishihara, Joshua James Fischer
  • Patent number: 8771496
    Abstract: A metal composite film having an excellent heat resistance and adhesion, suited for flexible printed circuit boards capable of forming fine wirings, as well as a production process thereof, is disclosed. The metal composite film comprises an insulating film; a thermoplastic polyimide layer(s) formed on at least one surface of the insulating film; and metal layers formed on the surface of each of the thermoplastic polyimide layer(s), which metal layers are formed by electroless plating and then by electrolytic plating, respectively. Since this metal composite film has an excellent heat resistance and adhesion, and maintains the excellent adhesion after forming fine wirings, it is suitably used as a high density flexible printed circuit board having fine circuits.
    Type: Grant
    Filed: May 17, 2006
    Date of Patent: July 8, 2014
    Assignee: PI R&D Co., Ltd.
    Inventors: Eiji Nagata, Hiroyuki Ishii
  • Patent number: 8721864
    Abstract: A metal covered polyimide composite comprising a tie-coat layer and a metal seed layer formed on a surface of a polyimide film by electroless plating or a drying method is provided. A copper layer or a copper alloy layer is formed thereon by electroplating. The copper plated layer or copper alloy plated layer includes three layers to one layer of the copper layer or copper alloy layer. The metal covered polyimide composite effectively prevents peeling in a non-adhesive flexible laminate (especially a two-layer flexible laminate), and more particularly, effectively inhibits peeling from the interface of a copper layer and tin plating. A method of producing the composite and apparatus for producing the composite are also provided.
    Type: Grant
    Filed: February 3, 2012
    Date of Patent: May 13, 2014
    Assignee: JX Nippon Mining & Metals Corporation
    Inventors: Michiya Kohiki, Naonori Michishita, Nobuhito Makino
  • Patent number: 8519017
    Abstract: A catalyst precursor resin composition includes an organic polymer resin; a fluorinated-organic complex of silver ion; a monomer having multifunctional ethylene-unsaturated bonds; a photoinitiator; and an organic solvent. The metallic pattern is formed by forming catalyst pattern on a base using the catalyst precursor resin composition reducing the formed catalyst pattern, and electroless plating the reduced catalyst pattern. In the case of forming metallic pattern using the catalyst precursor resin composition, a compatibility of catalyst is good enough not to make precipitation, chemical resistance and adhesive force of the formed catalyst layer are good, catalyst loss is reduced during wet process such as development or plating process, depositing speed is improved, and thus a metallic pattern having good homogeneous and micro pattern property may be formed after electroless plating.
    Type: Grant
    Filed: May 15, 2008
    Date of Patent: August 27, 2013
    Assignee: LG Chem, Ltd.
    Inventors: Min Kyoun Kim, Min Jin Ko, Sang Chul Lee, Jeong Im Roh
  • Publication number: 20120088120
    Abstract: Disclosed is a metal-clad laminate and a method for producing a metal-clad laminate wherein adhesion between a metal layer and a thermoplastic film serving as a base material is improved, the deposition rate of a plating coat on the base material is improved, and the insulating resistance after etching is properly adjusted at the same time. The metal-clad laminate comprises a base material that is composed of a thermoplastic polymer film, a base metal layer that is provided on the surface of the base material, and an upper metal layer that is provided on the surface of the base metal layer. The base metal layer is made of a copper alloy that contains 0.05-0.21 mass % of phosphorus, and the upper metal layer is made of copper or a copper alloy.
    Type: Application
    Filed: June 2, 2010
    Publication date: April 12, 2012
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kimiko Fujisawa, Kenichi Ohga
  • Patent number: 7964082
    Abstract: An exemplary electrophoretic coating method and an electroplated shell (800) manufactured thereby is provided. The electrophoretic coating method includes the following steps. A first step (Step S1) is to mold a base shell (500). The base shell includes a base body (50), a shell body (60), and a connecting body (70). The shell body and the connecting body are molded with the base body. The connecting body connects with the shell body. A second step (Step S2) is to pretreat the shell body and the connecting body. Thus, conducting films are formed on the shell body and connecting body. A third step (Step S3) is to electrophoretically coat the preliminarily treated base shell, so as to form electroplated layers on the shell body. A fourth step (Step S4) is to remove the connecting body so as to form/yield the electroplated shell.
    Type: Grant
    Filed: May 23, 2007
    Date of Patent: June 21, 2011
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventor: Peng-Cheng Tong
  • Patent number: 7959830
    Abstract: This invention discloses novel nanocomposite material structures which are strong, highly conductive, and fatigue-resistant. It also discloses novel fabrication techniques to obtain such structures. The new nanocomposite materials comprise a high-conductivity base metal, such as copper, incorporating high-conductivity dispersoid particles that simultaneously minimize field enhancements, maintain good thermal conductivity, and enhance mechanical strength. The use of metal nanoparticles with electrical conductivity comparable to that of the base automatically removes the regions of higher RF field and enhanced current density. Additionally, conductive nanoparticles will reduce the surface's sensitivity to arc or sputtering damage. If the surface is sputtered away to uncover the nanoparticles, their properties will not be dramatically different from the base surface.
    Type: Grant
    Filed: December 23, 2004
    Date of Patent: June 14, 2011
    Assignee: The Regents of the University of California
    Inventor: Sungho Jin
  • Patent number: 7754062
    Abstract: After treated in a solution containing ozone, a plating material is brought into contact with a solution containing at least one of an anionic surface active agent and a nonionic surface active agent, and an alkaline component. Ozone acts to locally break unsaturated bonds on a surface of the plating material to form C—OH bonds or C?O bonds, thereby activating the surface of the plating material, and since a surface active agent 1 is adsorbed thereon, a catalyst 2 is adsorbed on hydrophilic groups of the surface active agent 1 which has been adsorbed on the above-described functional groups. Consequently, no etching treatment is required, and an electroless plated coating having excellent adhesion can be formed without roughening the surface of the resin material.
    Type: Grant
    Filed: April 8, 2002
    Date of Patent: July 13, 2010
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Masatsugu Nakanishi, Takeshi Bessho
  • Patent number: 7682774
    Abstract: Disclosed is a resin composition which comprises a catalyst precursor for electroless plating to form an electromagnetic wave shielding layer. The resin composition comprises an organic polymer resin, a polyfunctional monomer having an ethylenically unsaturated bond, a photoinitiator, a silver organic complex precursor as a catalyst precursor, and an organic solvent. Further disclosed are methods for forming metal patterns using the resin composition and metal patterns formed by the methods. The methods comprise forming a pattern, reducing the pattern, and electroless plating the reduced pattern. A patterned layer of the catalyst formed using the resin composition is highly adhesive, a loss of the catalyst during a wet process is substantially prevented, and an increase in plating rate leads to the formation of a uniform, fine metal pattern after electroless plating. Electromagnetic wave shielding materials comprising the metal pattern can be used in the formation of films for shielding electromagnetic waves.
    Type: Grant
    Filed: April 13, 2007
    Date of Patent: March 23, 2010
    Assignee: LG Chem, Ltd.
    Inventors: Min Kyoun Kim, Min Jin Ko, Bum Gyu Choi, Sang Chul Lee, Jeong Im Roh
  • Publication number: 20100021748
    Abstract: The presently disclosed embodiments are directed to an improved metallization process for making fuser members which avoids the extra steps of metal seeding or special substrate treatment. In embodiments, a metallized substrate, formed via a polycatecholamine-assisted metallization process, is used for the complete fabrication of the fuser member.
    Type: Application
    Filed: July 25, 2008
    Publication date: January 28, 2010
    Applicant: XEROX CORPORATION
    Inventors: Nan-Xing Hu, Yu Qi, Qi Zhang
  • Patent number: 7645370
    Abstract: The present invention is a plated resin molded article and process of producing the plated resin molded article, wherein metal plating is carried out on the surface of a thermoplastic resin molded article and either of requirements (1), (2) and (3) described below is included: (1) the thermoplastic resin molded article contains a thermoplastic resin and a water-soluble substance, a step of carrying out the removal of fat from the resin molded article and a step of electroless plating are provided in combination, and a step of etching by an acid containing a heavy metal is not included; (2) the thermoplastic resin molded article contains a polyamide-based resin and a styrene-based resin, a step of carrying out the removal of fat from the resin molded article and a step of electroless plating are provided in combination, and a step of etching by an acid containing a heavy metal is not included; or (3) a step of contact-treating the thermoplastic resin molded article with an acid or base not containing a heav
    Type: Grant
    Filed: September 10, 2002
    Date of Patent: January 12, 2010
    Assignee: Daicel Polymer Ltd.
    Inventors: Toshihiro Tai, Ippei Tonosaki
  • Patent number: 7384532
    Abstract: A process that can be uniformly employed for electroplating a wide variety of different non-conductive substrates, including those that are non-platable or difficult-to-plate using conventional electroless and electrolytic plating techniques involves application of a platable coating composition to the substrate prior to plating. The platable coating composition is cured to render the substrate more receptive to conventional plating techniques. In one embodiment, the process utilizes an epoxy resin system that upon being cured is receptive to electroless plating and electrolytic plating techniques that are the same or similar to those conventionally employed for electroplating ABS and/or PC/ABS substrates.
    Type: Grant
    Filed: November 16, 2004
    Date of Patent: June 10, 2008
    Assignee: Lacks Enterprises, Inc.
    Inventors: Dennis R. Parsons, II, Ling Hao, Daniel W. Irvine
  • Patent number: 7316783
    Abstract: A method of wiring formation includes forming a feeder film partially on a substrate, forming on the substrate a plating base film via a physical film making method so that the plate base film partially overlaps the feeder film, forming a plated wiring on the plating base film using an electrolytic plating, and selectively removing at least an area of the feeder film which is exposed from the plated wiring, using a wet etching process.
    Type: Grant
    Filed: July 7, 2004
    Date of Patent: January 8, 2008
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yoshiyuki Tonami, Yoshihiro Koshido
  • Patent number: 6951604
    Abstract: A flexible printed board production method which ensures higher adhesion of copper, excellent workability, easier continuous production and lower costs. The flexible printed board production method comprises the steps of: treating a surface of a polyimide resin film with plasma or short wavelength ultraviolet radiation; activating the treated surface with the use of an alkali metal hydroxide; electrolessly plating the surface of the polyimide resin film with nickel; and electroplating the electrolessly plated surface of the polyimide resin film with copper, whereby a copper layer is formed on the surface of the polyimide resin film.
    Type: Grant
    Filed: August 12, 2003
    Date of Patent: October 4, 2005
    Assignees: Tokai Rubber Industries, Ltd., Okuno Chemical Industries Co., Ltd.
    Inventors: Naoki Katayama, Yasuhiro Hayashi, Joonhaneng Kang
  • Patent number: 6878260
    Abstract: A process for forming an interface (106) between a plated and a non-plated area (102, 104) on the surface of a plastic component (100) is disclosed. First, an anti-plating layer (110) is formed over the surface of the plastic component. Thereafter, a low-power laser beam (10) is used to remove a portion of the anti-plating layer and to form an interface between the plated area and the non-plated area. A seeding layer (120) is formed on the plated area so that the plated area is electrically conductive. Finally, a metallic layer (130) is electrically plated over the seeding layer. The metallic layer connects with the anti-plating layer via the interface. The cost of producing the anti-plating layer is low. Moreover, since the laser etching operation is able to produce a high-quality interface boundary between the plated and the non-plated area, yield of the process is improved.
    Type: Grant
    Filed: June 9, 2003
    Date of Patent: April 12, 2005
    Assignee: High Tech Computer, Corp.
    Inventors: Che-Hung Huang, Steven Hsu
  • Patent number: 6875471
    Abstract: The quality of painted surfaces of polymeric articles is improved by depositing a coating of a metal such as zinc or zinc alloy on the surface of the article to be painted. For example, zinc is electrodeposited on a conductive surface of the article. The metal coated polymeric surface provides a good base for electrostatic deposition of either liquid or powder paint and the metal surface prevents the formation of defects in the painted surface during heating of the article to dry or cure the paint film.
    Type: Grant
    Filed: November 25, 2002
    Date of Patent: April 5, 2005
    Assignee: General Motors Corporation
    Inventors: Hsai-Yin Lee, Yar-Ming Wang, Tao Xie
  • Patent number: 6872294
    Abstract: The quality of painted surfaces of polymer composites is improved by first forming an electroless metal coating on the molded surface of the composite and then electroplating a coating of zinc or zinc alloy on the metallized composite surface. The “galvanized” composite surface provides a good base for electrostatic deposition of either liquid or powder paint and the zinc surface prevents the formation of defects in the painted surface during heating of the composite to dry or cure the paint film.
    Type: Grant
    Filed: April 30, 2002
    Date of Patent: March 29, 2005
    Assignee: General Motors Corporation
    Inventors: Hsai-Yin Lee, Yar-Ming Wang, Tao Xie
  • Patent number: 6833275
    Abstract: A composition which contains stabilized conjugates composed of colloidal particles and biomolecules is obtained by adding a detergent to a solution containing biomolecules before or/and during treatment of colloidal particles with this solution.
    Type: Grant
    Filed: August 7, 2000
    Date of Patent: December 21, 2004
    Assignee: Roche Diagnostics GmbH
    Inventor: Alfons Nichtl
  • Patent number: 6808641
    Abstract: A method of wiring formation includes forming a feeder film partially on a substrate, forming on the substrate a plating base film via a physical film making method so that the plate base film partially overlaps the feeder film, forming a plated wiring on the plating base film using an electrolytic plating, and selectively removing at least an area of the feeder film which is exposed from the plated wiring, using a wet etching process.
    Type: Grant
    Filed: January 17, 2001
    Date of Patent: October 26, 2004
    Assignee: Murata Manufacturing Co., Ltd
    Inventors: Yoshiyuki Tonami, Yoshihiro Koshido
  • Patent number: 6802985
    Abstract: There is provided a method for fabricating electrical wirings capable of being manufactured with low cost and easily applied to large-scale substrates. A photosensitive ground resin film is formed on an insulating substrate by coating process. The ground resin film is subjected to exposure and development processes, by which a ground resin film patterned into a wiring pattern is obtained. Then, on the patterned ground resin film, a low-resistance metal film made of Cu is formed by electroless plating.
    Type: Grant
    Filed: August 25, 2000
    Date of Patent: October 12, 2004
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Yoshimasa Chikama, Yoshihiro Izumi
  • Patent number: 6772489
    Abstract: A hydrophilic collector for alkaline secondary batteries is formed of a nonwoven fabric plated with nickel in which the nonwoven fabric is hydrophilized by sulfonation, a gaseous fluorine treatment, or vinyl monomer grafting. A method for making the collector includes a hydrophilizing step of a nonwoven fabric comprising at least one of a polyolefin fiber and a polyamide fiber, and a plating step of applying nickel plating to the hydrophilic nonwoven fabric. Preferably, the nickel plating is electroless plating, and the nonwoven fabric has a plurality of micropores extending from one surface to the other surface thereof. An electroplating film may be deposited on the electroless plated film, if necessary. This collector facilitates assembling a battery which exhibits improved high-rate discharge characteristics due to improved adhesiveness of the plated nickel film to the nonwoven fabric.
    Type: Grant
    Filed: November 4, 2002
    Date of Patent: August 10, 2004
    Assignees: Mitsubishi Materials Corporation, Japan Vilene Company, Ltd.
    Inventors: Hiroyuki Imai, Kaori Yoshida, Toshiaki Takase, Kazuya Satou
  • Patent number: 6740425
    Abstract: A method for forming copper-resin composite materials is disclosed. This method affixes a palladium or palladium-tin catalyst onto resin substrate, and then subjects the catalyst-containing resin to an electroless copper plating bath without performing a catalyst acceleration treatment step.
    Type: Grant
    Filed: August 21, 2002
    Date of Patent: May 25, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Masaru Seita, Hideki Tsuchida, Masaaki Imanari, Yoshihiro Sugita
  • Patent number: 6475629
    Abstract: Adhesive film useful for the production of semiconductor devices is produced from a siloxane-modified polyamideimide resin composition, comprising 100 parts by weight of a siloxane-modified polyamideimide resin and 1 to 200 parts by weight of a thermosetting resin ingredient.
    Type: Grant
    Filed: February 2, 2001
    Date of Patent: November 5, 2002
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Kazumasa Takeuchi, Tetsuya Saito, Ken Nanaumi
  • Patent number: 6468672
    Abstract: A process for forming a decorative chromium plating on a plastic substrate includes depositing an electrically conductive coating on the plastic substrate, electrodepositing on the electrically conductive coating a high leveling semi-bright nickel electroplate layer, electrodepositing on the high leveling semi-bright nickel electroplate layer a bright nickel electroplate layer, and electrodepositing over the bright nickel electroplate layer a chromium electroplate layer. An advantage of the process is that a lustrous decorative chromium plating having good corrosion resistance and thermal cycling characteristics is obtained without a copper sublayer, and while using relatively thin nickel sublayers.
    Type: Grant
    Filed: June 29, 2000
    Date of Patent: October 22, 2002
    Assignee: Lacks Enterprises, Inc.
    Inventors: Lawrence P. Donovan, III, Roger J. Timmer
  • Patent number: 6468593
    Abstract: Provided is a method of plating a non-conductive product comprising the steps of: forming a coating film on a surface of the non-conductive product with a conductive paint having the following composition of solid ingredients: (a) a resin vehicle in 20 to 80 weight %, and (b) a conductive whisker in 80 to 20 weight %; and executing electroless plating on a surface of the coating film. Also provided are products produced by this method.
    Type: Grant
    Filed: November 25, 1998
    Date of Patent: October 22, 2002
    Assignees: Kanto Kasei Co., Ltd., Tanabe Chemical Industry Co., Ltd.
    Inventors: Tsutomu Iizawa, Takuya Ishida, Tamotsu Murayama, Takayuki Yagi
  • Patent number: 6406607
    Abstract: An inkjet printer nozzle plate having a non-wetting surface of uniform thickness and an orifice wall of tapered contour, and method of making the nozzle plate. In the method a metal masking layer is deposited on a glass substrate, the masking layer having an opening therethrough for passage of light only through the opening. Next, a negative photoresist layer is deposited on the masking layer, the negative photoresist layer being capable of photochemically reacting with the light. A light source passes light through the substrate, so that the light also passes only through the opening in the form of a tapered light cone. This tapered light cone will define the tapered contour of a nozzle plate orifice wall to be formed. The negative photoresist layer photochemically reacts with the light only in the light cone to define a light-exposed region of hardened negative photoresist.
    Type: Grant
    Filed: November 10, 2000
    Date of Patent: June 18, 2002
    Assignee: Eastman Kodak Company
    Inventors: Jeffrey I. Hirsh, Edwin A. Mycek, Larry L. Lapa
  • Patent number: 6350365
    Abstract: A method of producing a multilayer circuit board comprising a core substrate and a plurality of layers of wiring lines on both sides of the core substrate with an insulation layer being interposed therebetween; the layers of wiring lines on both sides being interconnected by conducting members provided on the inside walls of through holes going through the core substrate, and the interposed insulation layer. The method further comprising, wiring lines with an upper layer of wiring lines wherein the conducting member on the inside wall of the through hole and the via are formed in separate steps. The method can provide a multilayer circuit board which can advantageously be used to mount a chip or device thereon having an increased number of electrodes or terminals.
    Type: Grant
    Filed: August 9, 2000
    Date of Patent: February 26, 2002
    Assignee: Shinko Electric Industries Co., LTD
    Inventors: Toshinori Koyama, Noritaka Katagiri
  • Patent number: 6303181
    Abstract: A method of applying a conductive carbon coating to a nonconductive surface, conductive carbon compositions for that purpose, and a printed wiring board having through holes or other nonconductive surfaces treated with such carbon compositions are disclosed. A conditioning agent, made (for example) by condensing a polyamide and epichlorohydrin, is applied to the nonconductive surface to form a conditioned surface. A liquid dispersion of electrically conductive carbon (for example, graphite) having a mean particle size no greater than about 50 microns is coated on the conditioned surface to form an electrically conductive carbon coating. The conductive carbon coating is then optionally fixed on the (formerly) nonconductive surface. Fixing may be accomplished, for example, by applying a fixing liquid such as a dilute aqueous acid to the carbon-coated surface. The coating is then dried.
    Type: Grant
    Filed: March 17, 2000
    Date of Patent: October 16, 2001
    Assignee: Electrochemicals Inc.
    Inventors: Charles Edwin Thorn, Frank Polakovic, Charles A. Mosolf
  • Patent number: 6258311
    Abstract: A method for producing a multiplicity of fastener element molding cavities extending from a mold surface, for molding a plastic product having fastener elements integrally molded with and extending from a product base, and a mold so produced. The mold cavities are formed by depositing multiple layers of plating material on a workpiece in a predetermined pattern selected to produce a desired mold cavity shape, or by depositing a thick stratum of plating material over an array of fastener elements and then removing the fastener elements to leave shaped cavities within the plating material. The mold may be in the form of a roll or belt for continuous processing, or in any form for discrete injection molding. Molds having fastener element cavities defined by rigid cast materials are also disclosed.
    Type: Grant
    Filed: February 25, 1999
    Date of Patent: July 10, 2001
    Assignee: Velcro Industries B.V.
    Inventors: Stephen C. Jens, Andrew C. Harvey, Gilbert G. Fryklund, Scott M. Filion, Samuel W. Pollard, Keith G. Buzzell, Shawn C. Banker, Howard Kingsford, Joseph K. Parshley, Clinton Dowd, Christopher M. Gallant, James W. Babineau, Martin I. Jacobs
  • Patent number: 5888372
    Abstract: A metal-coated film can be produced continuously from a non-conducting film by successive electroless and galvanic metallization in such a way that a film of this kind is subjected, in a continuous "roll-to-roll" process, to the following operations:a) applying a metallizable primer,b) drying the applied primer,c) conditioning the applied primer,d) optionally activating the applied primer,e) treatment with an electroless chemical metallizing bath,f) optional treatment with a first rinsing liquid,g) treatment with a galvanic metallizing bath,h) treatment with a second rinsing liquid, andi) optional heat treatment of the metallized film.
    Type: Grant
    Filed: June 12, 1997
    Date of Patent: March 30, 1999
    Assignee: Bayer Aktiengesellschaft
    Inventors: Louis Bollens, Andre Heyvaerts, Dirk Quintens, Gerhard Dieter Wolf, Henning Giesecke, Friedrich Jonas
  • Patent number: 5860234
    Abstract: An iron having a housing with a skirt, a soleplate, and a heating element in the soleplate. The skirt has a molded body comprised of dielectric material. The body has a downwardly extending perimeter rim. A chrome plating is adhered directly onto the rim to give an appearance of a metal skirt.
    Type: Grant
    Filed: November 13, 1997
    Date of Patent: January 19, 1999
    Assignee: HP Intellectual Corp.
    Inventor: Stephen M. Hall
  • Patent number: 5846665
    Abstract: A method for plating a high impact resistant plastic, particularly a polycarbonate substrate which has been modified with up to about 50 percent by weight of acrylonitrile-butadiene-styrene. The surface of the plastic is first conditioned with a halogenated organic solvent conditioner, preferably 1-3-dichloro-2-propanol, prior to electroless plating and the electrochemical deposition of the desired metal layer.
    Type: Grant
    Filed: April 5, 1995
    Date of Patent: December 8, 1998
    Assignee: Lacks Industries, Inc.
    Inventors: Roger James Timmer, Lee Alan Chase
  • Patent number: 5812405
    Abstract: A method and system for designing and manufacturing a high-performance, optimized optical interference coatings that have a minimal number of layers. Index of refraction, absorption coefficient, and thickness values are selected for each of the layers in the design so as to cause the reflectance of a coated object to be zero for a given wavelength. Materials that with the selected properties are manufactured by mixing two or more preexisting available materials.
    Type: Grant
    Filed: May 23, 1995
    Date of Patent: September 22, 1998
    Assignee: Viratec Thin Films, Inc.
    Inventor: William A. Meredith, Jr.
  • Patent number: 5782021
    Abstract: An iron having a housing with a skirt, a soleplate, and a heating element in the soleplate. The skirt has a molded body comprised of dielectric material. The body has a downwardly extending perimeter rim. A chrome plating is adhered directly onto the rim to give an appearance of a metal skirt.
    Type: Grant
    Filed: January 10, 1997
    Date of Patent: July 21, 1998
    Assignee: Black & Decker Inc.
    Inventor: Stephen M. Hall
  • Patent number: 5702584
    Abstract: A polymer substrate is plated with a metal, using metallic filler particles in the polymer as anchorage points for a layer of metal formed by an electroless plating operation. The polymer has a filler that includes non-metallic filler particles and metallic filler particles; the non-metallic filler particles contiguous to the polymer surface can be etched away, so as to expose metallic filler particles proximate to the etched surfaces. The exposed metallic filler particles serve as anchorage points for the electroless plate layer.
    Type: Grant
    Filed: July 1, 1996
    Date of Patent: December 30, 1997
    Assignee: Ford Motor Company
    Inventors: Lakhi N. Goenka, Michael G. Todd, Andrew Z. Glovatsky
  • Patent number: 5620800
    Abstract: A laminated structure (1) comprising a substrate (3) and a polymer layer (5) is provided. The polymer layer consists of conductive areas (7) having a sheet resistance of maximally 1000 .OMEGA./square. The adjacent parts of the polymer layer are substantially non-conductive and have a sheet resistance which is a factor of 10.sup.6 higher. An electrodeposited metal layer (9), for example of copper, is present on the conductive areas (7).A simple method of photochemically generating the conductive pattern (7) which can be reinforced in an aqueous metal-salt solution by electrodeposition of a metal layer (9) is also provided and most preferably the conductive pattern is inter alia, the patterned exposure of a layer of 3,4-ethylene dioxythiophene or polyaniline. The method can very suitably be used for the manufacture of metal patterns on insulating substrates, such as printed circuit boards.
    Type: Grant
    Filed: March 30, 1995
    Date of Patent: April 15, 1997
    Assignee: U.S. Philips Corporation
    Inventors: Dagobert M. De Leeuw, Cornelius M. J. Mutsaers
  • Patent number: 5569493
    Abstract: A method is provided for preparing the surface of a cured cyanate ester resin or composite for metal plating. The composite may comprise graphite fibers embedded in a cured cyanate ester resin matrix The surface is treated with a preheated solution containing an alkali metal salt of an alkoxide. Preferred alkoxides are methoxide, ethoxide, propoxide, isopropoxide, butoxide, tert-butoxide, sec-tutoxide, 2- methyl-2-butoxide, pentoxide and hexoxide. The method of the invention operates to improve adhesion between the treated surface and a subsequently plated metal, such that the resulting cured cyanate ester resin or composite may replace certain metallic components in such applications as aircraft, spacecraft, and automobiles given its highly conductive metallic coating.
    Type: Grant
    Filed: November 14, 1994
    Date of Patent: October 29, 1996
    Assignee: Hughes Aircraft Company
    Inventors: Diana D. Granger, Leroy J. Miller
  • Patent number: 5547559
    Abstract: The invention described provides a process for direct electroplating on activated surfaces substantially without the formation of a smut layer and thereby improving the adhesion of the plated deposit to the surface. The use of divalent or tetravalent sulfur compounds and/or cathodic electrocleaning is proposed between activation of the surface and electroplating of the surface.
    Type: Grant
    Filed: July 10, 1995
    Date of Patent: August 20, 1996
    Assignee: MacDermid, Incorporated
    Inventors: Peter Kukanskis, Ernest Yakobson, Lev Taytsas
  • Patent number: 5516418
    Abstract: A process for patterned electroplating involves the steps of: (i) coating a substrate with a layer of hydroxyquinoline which acts as an adhesion promoter; (ii) coating the adhesion layer with a radiation sensitive polymeric resist; (iii) imagewise exposing the film to radiation; (iv) developing the image to patternwise expose the substrate; (v) electroplating metal onto the exposed portions of the substrate; and (vi) removing the remaining polymeric film from the substrate.
    Type: Grant
    Filed: June 26, 1995
    Date of Patent: May 14, 1996
    Assignee: International Business Machines Corporation
    Inventors: Saad K. Doss, Dennis R. McKean, Alfred F. Renaldo, Robert J. Wilson
  • Patent number: 5478462
    Abstract: Polyimide-metal laminates are formed by etching the surfaces of a polyimide web with a glycol-containing etchant followed by electroless nickel or cobalt deposition and then by copper per deposition. The glycol containing etchant can be utilized to form through holes through the web.
    Type: Grant
    Filed: June 16, 1994
    Date of Patent: December 26, 1995
    Assignee: Polyonics Corporation, Inc.
    Inventor: Daniel P. Walsh
  • Patent number: 5454930
    Abstract: An electrolytic copper plating method using a reducing agent is provided, wherein a catalyzed, electrically nonconductive substrate is dipped in a solution, which contains a copper salt, a copper-reducing agent for the acceleration of copper deposition and a copper-complexing agent and has a pH value of about 6 to 7.5, for electrolysis at a temperature of about 15.degree. C. to 50.degree. C., thereby forming an electrically conductive film of copper on said electrically nonconductive substrate. This method can be used in place of conventional electroless copper plating, dispense with any harmful substance such as formaldehyde, be easily analyzed and controlled, form an electrically conductive film of copper on an electrically nonconductive substrate with improved adhesion thereto, and is effectively applicable to making printed circuit boards in particular.
    Type: Grant
    Filed: July 28, 1994
    Date of Patent: October 3, 1995
    Assignee: Learonal Japan Inc.
    Inventors: Takeshi Miura, Masaru Seita
  • Patent number: 5413817
    Abstract: Substrates comprising blends of at least one polyphenylene ether and at least one poly(alkenylaromatic compound) (e.g., polystyrene) are treated with aqueous tetravalent cerium in a concentration of at least about 0.1 M, preferably acidified with nitric acid, to improve adhesion to metal coatings subsequently deposited nonelectrolytically; for example, by electroless deposition. The metallized articles are heat treated following metal deposition. Further metal coatings may be deposited, preferably followed by further heat treatment.
    Type: Grant
    Filed: November 5, 1993
    Date of Patent: May 9, 1995
    Assignee: General Electric Company
    Inventors: Herbert S. Chao, Carol L. Fasoldt
  • Patent number: 5316867
    Abstract: Addition polymer substrates comprising structural groups derived from olefinic nitriles and conjugated dienes, especially ABS resin substrates, are treated with aqueous tetravalent cerium in a concentration of at least about 0.1 M, preferably with a tetravalent cerium solution, to improve adhesion to metal coatings subsequently deposited non-electrolytically; for example, by electroless deposition. The metallized articles are heat treated following metal deposition. Further metal coatings may be deposited, preferably followed by further heat treatment.
    Type: Grant
    Filed: May 17, 1993
    Date of Patent: May 31, 1994
    Assignee: General Electric Company
    Inventors: Herbert S. Chao, Carol L. Fasoldt
  • Patent number: 5288519
    Abstract: Method of producing a modified polyimide layer to improve adhesion of a metal layer thereon. A limited quantity of water is added to a halogenated polyamic acid to form a reaction product, which is then sprayed, degreased, oxidized and cured into a modified polyimide layer. The chemically modified surface by the aforementioned method is then electrolessly plated with a primary metal layer followed by one or more electrolessly or electrolytically applied secondary metal layers until the metal layer of a desired thickness is attained. The present invention further discloses articles such as an EMI shielded enclosure and an insulated mold surface, having metal layers as an EMI shield and an insulating surface, respectively.
    Type: Grant
    Filed: April 27, 1992
    Date of Patent: February 22, 1994
    Assignee: General Electric Company
    Inventors: Charles E. Baumgartner, Lisa R. Scott
  • Patent number: 5246564
    Abstract: A method of manufacturing a copper-polyimide substrate, includes hydrophilicating the surface(s) of a polyimide film, applying a catalyst thereto, subjecting the film to electroless plating, heat-treating it in an inert atmosphere, and subjecting it to electroless copper plating or to electroless copper plating followed by electrolytic copper plating. The hydrophilication of the surface(s) of the polyimide film is effected with an aqueous solution containing a hydrazine hydrate and an alkali metal hydroxide or with an aqueous solution containing a permanganate and/or a hypochlorite, then a catalyst is applied to the surface(s) by an ordinary way, then the surface(s) is/are subjected to electroless plating with any one of nickel, cobalt nickel alloys or cobalt alloys to form a plated layer thereon having a thickness of from 0.01 to 0.1 .mu.
    Type: Grant
    Filed: October 20, 1992
    Date of Patent: September 21, 1993
    Assignee: Sumitomo Metal Mining Company, Limited
    Inventors: Yukihiro Tamiya, Noriyuki Saeki, Akihiro Miyake, Yoshiyasu Takenaka
  • Patent number: 5160600
    Abstract: The process of electroless plating of polymers containing units derived from at least one member of the group consisting of acrylonitrile, butadiene and styrene, is carried out in an environment free of chromium ions, by the sequential steps of roughening and activating the surface of the polymer by contacting the same with an aqueous solution of a concentrated sulfur acid, of concentrated nitric acid or of concentrated phosphoric acid, in the presence of noble metal ion and an oxidant selected from the group consisting of nitric acid, hydrogen peroxide and persulfates. This is followed by an aqueous suspension of Pd.sup.0 and then by the conventional chemical metallization.
    Type: Grant
    Filed: March 5, 1990
    Date of Patent: November 3, 1992
    Inventors: Gordhanbai N. Patel, Durgadas Bolikal, Hemant H. Patel
  • Patent number: 5133840
    Abstract: The surface modification of polyimide materials by a chemical process is disclosed to provide a variety of functional groups on the surface. The surface is treated to produce polyamic acid carboxyl groups which are subsequently reacted with epoxies, hydrazines, or alcohols. The carboxyl groups can be also be subjected to other organic reactions, such as reduction with metal hydrides and the like. The versatility and controllability of this process lends itself to promoting adhesion of the polyimide to similarly treated polyimides, other polymers and other substrates as well as combining with metals such as metal catalysts used for depositing conductors on non-conductive surfaces such as circuit boards.
    Type: Grant
    Filed: May 15, 1990
    Date of Patent: July 28, 1992
    Assignee: International Business Machines Corporation
    Inventors: Leena P. Buchwalter, Stephen L. Buchwalter, Terrence R. O'Toole, Richard R. Thomas, Alfred Viehbeck