Abstract: The present method for machining a part includes wire electro-discharge machining the part to create a recast layer, and then removing a zinc content of the recast layer without substantially altering the remainder of the initial composition make-up of the recast layer. The final composition make-up of the recast layer is substantially identical to the initial composition make-up except for the removed zinc content.

Abstract: A process for producing a steel product having a protective coating based on zinc and a tribologically active layer applied to the protective coating where the process includes providing a flat steel product provided with the protective coating, and applying an aqueous solution comprising ammonium sulfate and demineralized water to the protective coating of the steel product. The concentration of the ammonium sulfate based on the SO42? ions is 0.01-5.7 mol/L, the pH of the aqueous solution is 4-6, and the near-surface reaction time between the aqueous solution and the protective coating is more than 0 seconds and not more than 5 seconds. After a drying operation conducted without preceding rinsing, a tribologically active layer consisting of ammonium zinc sulfate is formed atop the protective zinc coating. Also, a steel product having a protective coating based on zinc and a tribologically active layer of ammonium zinc sulfate.

Abstract: A method for machining a part includes wire electro-discharge machining the part, and then selectively reducing a zinc content of the residual recast layer left on a surface of the part, while otherwise leaving the recast layer substantially intact.

Abstract: The present invention provides plated steel sheet for hot press use which is excellent in hot lubricity, coating adhesion, spot weldability, and coated corrosion resistance and a method of hot pressing plated steel sheet. The present invention is Plated steel sheet for hot press use and a method of hot pressing plated steel sheet characterized by being plated steel sheet for hot press use which contains an Al plating layer which is formed on one surface or both surfaces of said steel sheet, and a surface coating layer which is formed on said Al plating layer, said surface coating layer containing at least one Zn compound which is selected from a group comprised of Zn hydroxide, Zn phosphate, and a Zn organic acid.

Abstract: One embodiment of the present disclosure provides a method for producing a substrate formed with a copper thin layer. The method includes providing a carrier, forming a separation-inducing layer on the surface of the carrier, forming a copper thin layer on the separation-inducing layer, and bonding a core to the copper thin layer.

Abstract: A Cu2ZnSnS4-xSex (0?x?4) thin film solar cell is disclosed. The thin film solar cell includes a Cu2ZnSnS4-xSex (0?x?4) thin film as an absorber layer produced by forming a precursor film composed of Cu, Zn, Sn, and Se using an ionic liquid as a solvent through a constant current process and annealing the precursor film with sulfur. Also disclosed is a method for fabricating the thin film solar cell. The method uses a non-vacuum electrodeposition process that is appropriate for large-area mass production and is thus cost effective compared to a vacuum process. In addition, since the method uses an ionic liquid, the formation of by-products harmful to humans as a result of side reactions is suppressed. Furthermore, the method uses a one-step electrodeposition process, which enables the deposition of a maximum of four elements at one time, or a multi-step deposition process, and an annealing process.

Abstract: Methods of providing a corrosion-resistant plating on a steel bumper are provided. A galvanized zinc layer is deposited over a steel substrate. A plurality of nickel layers is deposited over the zinc layer. The plurality of zinc layers has at least a first porosity and a second porosity. A chrome layer is applied over the plurality of nickel layers. The porous nickel layer is immediately adjacent the chrome layer such that a stress applied to the chrome layer is distributed over the porous nickel layer. The porous nickel layer delocalizes a stress applied at an impact area to a dispersed area and the dispersed area is larger than the impact area.

Abstract: The present invention describes a method of producing a p-type light-absorbing semiconductor copper zinc tin selenide/sulfide (Cu2(ZnxSn2-x)(SySe1-y)4) (abbreviated CZTS) with electrochemical deposition. It can be used in the production of solar cell when combined with an n-type inorganic or an organic semiconductor layer. The present method comprises a one-step or a sequence of depositions using electroplating to fabricate a low-cost and large-area CZTS solar cell, without using expensive and complicated deposition techniques or highly toxic and flammable chemicals in the production process. The present method significantly reduces the cost and energy requirement for production of solar cell.

Abstract: An antireflection film of the present invention includes a plurality of first raised portions, each of which has a two-dimensional size of not less than 1 ?m and less than 100 ?m when seen in a direction normal to the film, and a plurality of second raised portions, each of which has a two-dimensional size of not less than 10 nm and less than 500 nm when seen in a direction normal to the film. In at least one embodiment, the antireflection film has a first surface shape or a second surface shape that is inverse to the first surface shape relative to a film surface. In the first surface shape, the second raised portions are provided on the first raised portions and between the plurality of first raised portions, and the elevation angle ? of a surface of the first raised portions relative to the film surface is about 90° or more. The antireflection film of the present invention has a more excellent antiglare function than conventional ones.

Abstract: Disclosed is a copper foil which has excellent high frequency characteristics and heat resistance, while achieving high heat-resistant adhesion to a resin substrate at the same time. Specifically disclosed is a heat-resistant copper foil which has a configuration wherein a first roughened surface layer which has been treated by a first roughening treatment by copper metal, a second roughened surface layer which has been treated by a second roughening treatment by copper metal, and a third treated surface layer which has been treated by a third treatment process by zinc metal are sequentially provided on one surface of an untreated copper foil.

Abstract: Rubber-cord complex 9 having improved wet heat adhesive property between rubber and cord. The rubber-cord complex includes cord 10 comprising drawn plated wire 17 prepared by providing brass plated layer 16E on surface of element wire 15 and drawing the resulting plated wire and rubber 12 vulcanized and bonded to cord 10. The rubber-cord complex 9 has adhesion reaction layer 25 (formed by cross-linking sulfur and copper) between rubber 12 and brass plated layer 16E. Adhesion reaction layer 25 has average thickness of 50-1,000 nm. Interface S between adhesion reaction layer 25 and the rubber has a fractal dimension of 1.001-1.300 in a wet heat deterioration state after being subjected to vulcanization to bond rubber 12 thereto and being held at a temperature of 50-100° C. and a humidity of 60-100% for one hour to 20 days.

Abstract: A rubber-cord complex having an improved wet heat adhesive property between a rubber and a cord comprising a drawn plated wire, and including a metal cord comprising a drawn plated wire prepared by providing a brass plated layer on the surface of an element wire and drawing the resulting plated wire, and a rubber vulcanized and bonded to the cord, wherein in a wet heat deterioration state of the drawn plated wire after being subjected to the vulcanization to bond the rubber thereto and further held under an atmosphere having a temperature of 50 to 100° C. and a humidity of 60 to 100% for one hour to 20 days, the average grain size of crystal grains present in the brass plated layer is not more than 50 nm, and the grain boundary of the crystal grains has a fractal dimension of 1.001 to 1.500.

Abstract: A method for electroplating a substrate having an aluminum alloy surface comprises: applying a zinc layer onto the aluminum alloy surface; electroplating a first copper layer onto the zinc layer from an alkaline copper electroplating solution; electroplating a second copper layer onto the first copper layer from an acid copper electroplating solution; electroplating a Cu—Sn alloy layer onto the second copper layer from a Cu—Sn electroplating solution; and electroplating a chromium layer onto the Cu—Sn alloy layer from a trivalent chromium solution. The alkaline copper electroplating solution is substantially free of cyanide ion.

Abstract: Articles having metallic finishes including antimicrobial agents dispersed throughout the finish and methods of electroplating said metallic finishes on a material. The metallic finishes include highly-decorative electroplated finishes for bathroom and kitchen hardware, door hardware, and other highly lustrous products where antimicrobial protection is preferred.

Abstract: A method of processing a printed wiring board. Initial processing steps are implemented on the printed wiring board. Copper is plated on the printed wiring board from a bath containing nickel and copper. Nickel is plated on the printed wiring board from a bath containing nickel and copper and final processing steps are implemented on the printed wiring board.

Abstract: A porous catalyst structure with a high specific surface area comprising a porous substrate with a catalyst layer thereon is provided. The porous catalyst structure can be prepared by a process comprising depositing a metallic layer onto the surface of a porous, metallic substrate by electroplating, and optionally oxidizing the metallic layer into the metal oxide layer. Any conductive porous metallic substrate can be used as the substrate of the subject invention, and the metallic layer may comprise any suitable metal(s) and/or metal oxide(s) with desired catalytic function(s).

Abstract: This invention involves the technological field of electroplating, chemical plating, specially involves a method for partially plating aluminum and aluminum copper radiators. A radiator is conducted partial chemical oxidation and enclosure before undergoing galvanization. Firstly oxidize the non-plate surface of the radiator by chemical oxidation, then utilize a sealing compound to fill up tiny holes of the porous layer to make a film thereon against the erosion of acid and alkali, and then process common chemical plating or electroplating. Only plate a weldable nickel-phosphorus alloy on the touching parts at where the aluminum radiator or the aluminums and copper radiator connect with the main frame.

Abstract: A rubber-cord complex having an improved wet heat adhesive property between a rubber and a cord comprising a drawn plated wire, and including a metal cord comprising a drawn plated wire prepared by providing a brass plated layer on the surface of an element wire and drawing the resulting plated wire, and a rubber vulcanized and bonded to the cord, wherein in a wet heat deterioration state of the drawn plated wire after being subjected to the vulcanization to bond the rubber thereto and further held under an atmosphere having a temperature of 50 to 100° C. and a humidity of 60 to 100% for one hour to 20 days, the average grain size of crystal grains present in the brass plated layer is not more than 50 nm, and the grain boundary of the crystal grains has a fractal dimension of 1.001 to 1.500.

Abstract: To be able to form a copper-zinc-tin alloy which optionally comprises at least one chalcogenide and thus forms a semiconductor without the use of toxic substances a metal plating composition for the deposition of a copper-zinc-tin alloy is disclosed, wherein said metal plating composition comprises at least one copper plating species, at lease one zinc plating species, at least one tin plating species and at least one complexing agent and further, if the alloy contains at least one chalcogen, at least one chalcogen plating species.

Abstract: In an Sn-plated strip in which a copper alloy containing 15 to 40 mass % of Zn in terms of an average concentration is used as an alloy strip and the layers of an Sn phase, an Sn—Cu alloy phase and an Ni phase constitute a plating film from the surface to the alloy strip, the Zn concentration of the surface of the Sn phase is adjusted to a range of 0.1 to 5.0 mass %. The alloy may further contain 0.005 to 3.0 mass % in total of an arbitrary constituent selected from Sn, Ag, Pb, Fe, Ni, Mn, Si, Al and Ti. Moreover, the alloy may be a copper base alloy containing 15 to 40 mass % of Zn, 8 to 20 mass % of Ni, 0 to 0.5 mass % of Mn and a balance of Cu and unavoidable impurities, and may further contain 0.005 to 10 mass % in total of the above arbitrary constituent. There is provided a Cu/Ni double layer base reflowed Sn-plated Cu—Zn alloy strip in which generation of whiskers is suppressed.

Abstract: A porous catalyst structure with a high specific surface area comprising a porous substrate with a catalyst layer thereon is provided. The porous catalyst structure can be prepared by a process comprising depositing a metallic layer onto the surface of a porous, metallic substrate by electroplating, and optionally oxidizing the metallic layer into the metal oxide layer. Any conductive porous metallic substrate can be used as the substrate of the subject invention, and the metallic layer may comprise any suitable metal(s) and/or metal oxide(s) with desired catalytic function(s).

Abstract: The present invention provides a non-cyanide aqueous acidic immersion plating solution having a pH of from about 3.5 to about 6.5 and comprising zinc ions, nickel ions and/or cobalt iron ions, and fluoride ions. In one embodiment the immersion plating solutions of the invention also contain at least one inhibitor containing one or more nitrogen atoms, sulfur atoms, or both nitrogen and sulfur atoms. The present invention also relates to methods for depositing zinc alloy protective coatings on aluminum and aluminum alloy substrates comprising immersing the aluminum or aluminum alloy substrate in the non-cyanide acidic immersion plating solutions of the invention. Optionally, the zinc alloy coated aluminum or aluminum alloy substrate is plated using an electroless or electrolytic metal plating solution.

Abstract: Embodiments of the invention contemplate the formation of a low cost solar cell using a novel high speed electroplating method and apparatus to form a metal contact structure having selectively formed metal lines using an electrochemical plating process. The apparatus and methods described herein remove the need to perform one or more high temperature screen printing processes to form conductive features on the surface of a solar cell substrate. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connection that is reliable and cost effective. Therefore, one or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing a common metal, such as copper.

Abstract: A method for a surface being plated locally includes a fixture for holding at least a work piece and the fixture is supported with two opposite lateral walls of a plating tank. Hence, a plated zone on a surface of the work piece can be immerged into the liquid contained in the plating tank for the plated zone being coated with de-oxide layer and plating layer sequentially.

Abstract: A peelable composite foil includes a metallic carrier foil, a first barrier layer on one side of the metallic carrier and a second metallic layer on the first barrier layer. The second metallic layer includes a combination of a metal selected from the group including zinc, molybdenum, antimony and tungsten, and an electrodeposited, ultra-thin metal foil on the second metallic layer.

Abstract: A method for applying a metal layer onto at least one surface of an aluminium or aluminium alloy workpiece, including the steps of pretreating the surface and applying the metal layer by plating, wherein the pretreating step includes a non-electrolytic treatment by immersion of the workpiece in a single acidic solution, preferably a sulphuric acid solution, having a temperature of at most 100° C. A brazed assembly comprising at least one component of an aluminium workpiece made by this method is also disclosed.

Abstract: A flexible printed board contains an unroughened electrodeposited copper foil, a zinc-based metallic layer provided thereon in an amount of 0.25 to 0.40 mg/dm2, and a polyimide resin layer formed through the imidation of a polyamic acid layer provided on the zinc-based metallic layer.

Abstract: A method for determining a quantity of each of alloy phases in the plating layer includes subjecting each alloy phase in the plating layer to constant potential electrolysis in each of a plurality of ranges of potentials obtained on the basis of the immersion potential of each alloy phase and the immersion potential of a basis metal, by using a plated metal material having different kinds of alloy phases in the plating layer as the anode, to determine the quantity of each alloy phase in the plating layer on the basis of the quantity of electricity consumed in each range of the potentials during the electrolysis.

Abstract: The present invention is directed to provision of a surface-treated copper foil exhibiting a maximum effect of a silane coupling agent which is adsorbed onto the copper foil and is employed in order to enhance adhesion between the copper foil and a substrate during manufacture of printed wiring boards. The invention is also directed to provision of a method for producing such a copper foil. To attain these goals, a surface-treated copper foil for producing printed wiring boards is provided, wherein an anti-corrosion treatment comprises forming a zinc layer or a zinc alloy layer on a surface of the copper foil and forming an electrodeposited chromate layer on the zinc or zinc alloy layer; forming a silane-coupling-agent-adsorbed layer on the electrodeposited chromate layer without causing the electrodeposited chromate layer of the nodular-treated surface to dry; and drying.

Abstract: An object of the invention is to provide a surface-treated copper foil capable of consistently attaining a percent loss of peel strength in resistance against hydrochloric acid degradation of 10% or less as measured on a copper pattern prepared from the copper foil and having a line width of 0.2 mm, by bringing out the maximum effect of the silane coupling agent employed in brass-plated anti-corrosive copper foil. The Another object is to impart excellent moisture resistance to the surface-treated copper foil.

Abstract: An object of the invention is to provide a surface-treated copper foil capable of consistently attaining a percent loss in peel strength against hydrochloric acid degradation of 10% or less as measured on a copper pattern prepared from the copper foil and having a line width of 0.2 mm, by bringing out the maximum effect of the silane coupling agent employed in zinc-plated or zinc-alloy-plated anti-corrosive copper foil. Another object is to impart excellent moisture resistance, heat resistance, and long-term storage stability to the surface-treated copper foil.

Abstract: A method for coating a light metal alloy component to form a protective layer comprising Sn. First, a surface of the light metal alloy component is cleaned and passivated. A layer comprising Zn is formed on the surface, and a layer comprising Sn is deposited. An intermediate layer is preferably deposited between the Zn-containing layer and the Sn containing layer. The Sn-containing layer may additionally be varnished.

Abstract: The present invention is directed to methods for applying a protective layer (42) to the cathode (40) of an electrolysis cell (10), where the cell also contains inert anodes (50) and the protective layer (42) can comprise a plurality of layers (70, 72, 74) with an inner layer (70) of TiB2 being preferred, and the protective layer (42) protects the cathode (40)from hot gases (64) used to pre-heat the cell (10).

Abstract: Disclosed is a copper foil—for printed circuit boards—which is especially excellent in soft etching property and also superior in such properties as heat discoloration resistance, rust-proofing and solder-ability. The copper foil for printed circuit boards comprising a first layer formed by applying 12 to 50 mg/m2 of a sulfur-contained zinc alloy containing 0.1 to 2.5 percent by weight of sulfur on the surface on at least one side of the copper foil and a second layer formed of a chromate layer on the first layer by applying 0.5 to 2.5 mg/m2 of chromium and, if necessary, 1.5 to 6 mg/m2 of phosphorus.

Abstract: Disclosed is a method of manufacturing an assembly of components joined by brazing, comprising the steps of: (i) forming the components of which at least one is made from a multi-layered brazing sheet product, the multi-layered brazing sheet product comprising a core sheet (a) having on at least one surface of the core sheet an aluminium clad layer (b), the aluminium clad layer being made of an aluminium alloy comprising silicon in an amount in the range of 2 to 18% by weight, a layer (c) comprising nickel on the outer surface of the aluminium clad layer, and a layer (d) comprising zinc or tin as a bonding layer between the outer surface of the aluminium clad layer and the layer comprising nickel; (ii) forming at least one other component of a metal dissimilar to the core sheet of the multi-layered brazing sheet product and selected from the group consisting of titanium, plated titanium, coated titanium, bronze, brass, stainless steel, plated stainless steel, coated stainless steel, low-carbon steel, plated

Abstract: A copper foil for fine wiring is produced by forming on a bonding surface of a copper foil a composite metal layer comprising (I) copper, (II) at least one of tungsten and molybdenum and (III) at least one of nickel, cobalt, iron and zinc by carrying out electrolysis in a plating bath (A) containing ions of these metals and chloronium ions, and then forming a roughened layer comprising copper on the composite metal layer by carrying out electrolysis in a plating bath (B) containing copper ions at a current density not lower than a limiting current density of the plating bath to form a dendritic copper electrodeposition layer and then carrying out subsequent electrolysis at a current density lower than the limiting current density of plating bath to form nodular copper.

Abstract: A method of applying a metal onto a copper layer, comprising the steps of: stabilizing a surface of a copper layer by applying a stabilization layer thereto, the stabilization layer comprised of zinc oxide, chromium oxide, nickel, nickel oxide or a combination thereof and having a thickness of between about 5 Å and about 70 Å; and vapor depositing a metal selected from the group consisting of aluminum, nickel, chromium, copper, iron, indium, zinc, tantalum, tin, vanadium, tungsten, zirconium, molybdenum and alloys thereof onto the stabilized surface of the copper layer, and a sheet material formed thereby.

Abstract: A painted steel article having a steel surface, being plated with a corrosion-resistant coating. The corrosion-resistant coating contains at least 90% zinc, cobalt, at least one trivalent or higher-valent metal, and at least one colloidal inorganic material. The paint is then electrodeposited directly on the corrosion-resistant coating.

Abstract: A copper foil for fine wiring is produced by forming on a bonding surface of a copper foil a composite metal layer comprising (I) copper, (II) at least one of tungsten and molybdenum and (III) at least one of nickel, cobalt, iron and zinc by carrying out electrolysis in a plating bath (A) containing ions of these metals and chloronium ions, and then forming a roughened layer comprising copper on the composite metal layer by carrying out electrolysis in a plating bath (B) containing copper ions at a current density not lower than a limiting current density of the plating bath to form a dendritic copper electrodeposition layer and then carrying out subsequent electrolysis at a current density lower than the limiting current density of plating bath to form nodular copper.

Abstract: A brazing sheet product and a method of manufacturing a brazing sheet product in which a layer comprising nickel is plated onto a surface of a clad layer made of an aluminium-silicon alloy containing silicon in the range of 2 to 18 weight %, wherein the surface is pre-treated by application of a bonding layer comprising zinc or tin. The application of the bonding layer may be by a zincate or a stannate treatment. The use of lead to promote wetting during brazing can be reduced or avoided, or other elements such as bismuth can be used.

Abstract: An apparatus for producing metal foil, comprising a drum cathode having an outer plating surface. The drum cathode is partially immersed to a set level in an electrolyte bath and is rotatable in a fixed direction about a generally horizontal axis. A main anode assembly having a main anode is immersed in the electrolyte bath, the main anode having a semi-cylindrical curved anode surface facing the drum cathode. The main anode is dimensioned to be spaced from the plating surface of the drum cathode so as to define a generally uniform gap therebetween. An energy source is connected to the main anode for energizing the main anode. A chamber containing an electrolyte solution is disposed above the electrolyte bath and adjacent the cathode drum where the cathode drum exits the electrolyte bath. A treatment anode is immersed in the electrolyte solution in the chamber adjacent the drum cathode. An energy source is connected to the treatment anode for energizing the treatment anode.

Abstract: A treated electrodeposited copper foil having a bond-enhancing copper layer, preferably a plurality of layers, electrodeposited on a bonding side of a base copper foil, a layer of co-deposited copper and arsenic electrodeposited on the bond-enhancing layer, and a zinc or zinc alloy layer electrodeposited on the copper/arsenic layer. A process for making such foil, and a copper-clad laminate wherein such foil is bonded to a polymeric substrate.

Abstract: A simplified process and apparatus for electrodepositing a bond-enhancing copper treatment layer on a surface of copper foil, preferably wherein a single treatment layer is uniformly applied on raw copper foil using a current density of from about 40 to about 100 A/ft2, a plating time of greater than 30 seconds, and the electrolyte is a copper sulfate-sulfuric acid solution containing arsenic, chloride ions and 2 imidazalidinethione. The raw foil is transferred to a station for applying the treatment directly from a rotating drum cathode machine on which it is produced, at the same speed at which the raw foil is produced, and then to a barrier layer station, a stainproofing station and a chemical adhesion promoter station, after which it is dried and coiled.

Abstract: A method employed to dry a copper foil having been subjected to various surface treatments, which method comprises irradiating at least one surface-treated side of the copper foil with near infrared rays to dry the copper foil, and an apparatus suitable to the method. The drying of the copper foil having undergone surface treatments can be accomplished by a simple apparatus with low electric power while controlling the heating of the surface of the copper foil so that the drying temperature can be held at 100° C. or higher at which a eutectic alloying of rust preventive metal and copper foil, for example, alloying (brass formation) of zinc and copper on the surface of the copper foil is effected.

Abstract: Electronic components are bonded to an electronic circuit board with a lead-free solder. The bonded structure is cooled from a temperature close to the liquids temperature of the solder to a temperature close to the solids temperature of the solder at a first cooling rate of about 10 to 20° C./second, followed by cooling the bonded structure to a temperature lower than the solids temperature of the solder at a second cooling rate of about 0.1 to less than 5° C./second.

Abstract: A nickel electrode prepared by depositing one of an oxide and hydroxide of a zinc-salt to an electrode substrate in a first step and, thereafter, depositing nickel-active material to the electrode substrate in a separate step.

Abstract: This invention provides a composite foil comprising an aluminum carrier layer and an ultra-thin copper foil having a protective layer disposed between them comprising a porous copper layer and an interpenetrating zinc layer. A process for producing such composite foils comprises the steps of preparing the surface of the aluminum carrier, electrodepositing a porous copper layer on the aluminum carrier layer followed by electrodepositing a zinc layer, and then electrodepositing two layers of copper to form the ultra-thin copper foil. The composite foil provides a uniform bond strength between the aluminum carrier and the protective layer which is adequate to prevent separation of the carrier and ultra-thin copper foil during handling and lamination, but which is significantly lower than the peel strength of a copper/substrate bond, so that the carrier can easily be removed after lamination of the composite foil to an insulating substrate.

Abstract: A tin coated electrical or electronic component has enhanced resistance to oxidation and tarnishing as well a smaller increase in contact resistance when exposed to elevated temperatures. These benefits are achieved by depositing a relatively thin, on the order of 5-50 angstroms thick, layer of zinc on the tin coating prior to heating. A subsequent step of heating the sample to a temperature and time effective to convert all free tin to an intermetallic imparts the additional advantage of reducing the coefficient of friction.

Abstract: A method for applying a zinc layer onto an aluminum or aluminum alloy sheet, comprising pretreating the surface and applying the layer by electrolytic galvanizing, the pretreating comprises electrochemical graining of the surface, for example in a solution having a pH less than 3 with an alternating current applied between the sheet and an electrode. In an alternative method, the pretreating includes applying a preliminary zinc layer by immersing the surface in a zinc-containing alkaline solution, applying a potential to the sheet and reversing the polarity of said potential at least once. The sheets are useful for building cladding sheets and automotive panels.

Abstract: This invention relates to a treated copper foil, comprising: a copper foil with a layer of zinc oxide adhered to the base surface of at least on side of said copper foil, said layer of zinc oxide having a thickness of about 3 .ANG. to about 80 .ANG.; and a layer of a trivalent chromium oxide adhered to said layer of zinc oxide. In one embodiment, the foil has a layer of a silane coupling agent adhered to the layer of trivalent chromium oxide. The invention also relates to a process for applying the layer of zinc oxide and the layer of trivalent chromium oxide to the copper foil. The invention also relates to laminates comprising a dielectric substrate and the foregoing copper foil adhered to the substrate. In one embodiment, the dielectric substrate is comprised of an epoxy resin made with a curing agent that is other than an amine curing agent.