Abstract: A method for manufacturing a zinciferous plated steel sheet, comprises: forming a zinciferous plating layer on a steel sheet; and forming an Fe--Ni--O film on the zinciferous plating layer. The Fe--Ni--O film is formed by carrying out electrolysis with the steel sheet as a cathode in an aqueous solution, dipping the steel sheet in an aqueous solution, or spraying a mist on a surface of the zinciferous plating layer.

Abstract: A method for producing a zinc-electroplated steel sheet comprising the steps of: pickling a steel sheet with a pickling solution so as to deposit a tin of an amount of 0.5 mg/m.sup.2 to less than 10 mg/m.sup.2 on the steel sheet; and zinc-electroplating the pickled steel sheet.

Abstract: A method for manufacturing a photovoltaic device comprising a metal layer, a first transparent conductive layer, a semiconductor layer, and a second transparent conductive layer sequentially stacked on a substrate comprising iron, comprises the steps of forming the metal layer by electro-deposition of the metal layer from a solution and forming the first transparent conductive layer by electro-deposition of the first transparent conductive layer from a solution.

Abstract: A soldering method for soldering electronic components onto a copper (Cu) substrate using a tin (Sn) solder alloy. The method comprises in pretreating the Cu substrate by depositing a thin layer of zinc (Zn) before the deposition of the Sn solder alloy. This method greatly enhances the mechanical and electrical properties of the solder alloy, allowing the use of lead (Pb) free alloys such as tin-bismuth (Sn--Bi).

Abstract: A metallic sheet for an electronic housing having a zinc coating on a steel base and a thin metal film, preferably a copper film, covering the zinc coating on one or both sides of the sheet, and a method of making the metal film. The metal film reduces whiskering of the zinc in the zinc coating. Whiskering can also be prevented on other metals anodic to copper such as, for example, tin and cadmium.

Abstract: A zinc-cobalt alloy-plating alkaline bath comprises a zinc compound, a cobalt compound, an alkali hydroxide and a reaction product of an alkyleneamine with an alkylene oxide and having a pH of not less than 13 and a method for forming a zinc-cobalt alloy plating film comprises the step of forming, on a substrate, a zinc-cobalt alloy plating film having a cobalt content ranging from 0.05 to 20% by weight and a zinc content ranging from 80 to 99.95 % by weight, while using the foregoing alkaline plating bath. The Zn-Co alloy-plating bath permits the achievement of a desired rate of Co-eutectoid even when a small amount of a chelating agent is incorporated into the bath and therefore, the bath is excellent in the disposability of waste water.

Abstract: A hollow container for storage and transport of fluid hydrocarbon vehicular fuels is composed of a laminated structure of polymeric resin body component and electrodeposited metal. An interior stratum of polymer chemically resistant to the fuel is joined to a stratum of electroplateable polymer disposed to the exterior of the interior stratum. The laminated polymeric structure is then electroplated to form a skin of metal encapsulating the interior polymeric strata. The tank combines the structural design flexibility of plastic with the metal barrier properties regarding evaporative emissions, permitting the use of high contents of oxygenated species in the fuel.

Abstract: A copper foil for a printed wiring board which has a carbon-containing copper-zinc coating comprising 40 to 90 atomic % of copper, 5 to 50 atomic % of zinc and 0.1 to 20 atomic % of carbon is produced by dipping a copper foil in a non-cyanide copper-zinc electroplating bath containing a copper salt, a zinc salt, a hydroxycarboxylic acid or a salt thereof, an aliphatic dicarboxylic acid or a salt thereof and a thiocyanic acid or a salt thereof, and carrying out electrolysis in the non-cyanide copper-zinc electroplating bath using the copper foil as a cathode to form on at least one surface of the copper foil a carbon-containing copper-zinc coating.

Abstract: The invention relates to a process for phosphating galvanized steel surfaces, preferably electrolytically or hot-dip galvanized surfaces of steel strip, by treating them in a bath or spray with acidic aqueous phosphating solutions, wherein the workpieces are given a d.c. cathodic treatment at the same time. In the process, (a) the phosphating solutions contain Zn.sup.+2 cations in the range from 0.1 to 5 g/l, PO.sub.4.sup.-3 anions in the range from 5 to 50 g/l, NO.sub.3.sup.- anions in the range from 0.1 to 50 g/l, Mn.sup.+2 cations in the range from 0.1 to 5 g/l, and Cu.sup.+2 cations in the range from 0.001 to 1 g/l; (b) the following conditions are used: pH of the phosphating solution in the range from 1.5 to 4.5, temperature of the phosphating solution in the range from 10.degree. to 80.degree. C., treatment time in the range from 1 to 300 sec; and (c) the workpieces are also cathodically treated with a direct current with a density in the range from 0.01 to 100 mA/cm.sup.2 during phosphating.

Abstract: A zinc or zinc-alloy plated steel sheet having an improved weldability and plating properties, as well as a method for making the same is provided. Even when the substrate steel sheet is the one which is difficult to deposit a zinc or zinc-alloy layer by conventional methods, such as an extra low carbon steel sheet, the present invention enables a reliable production of a galvanized steel sheet suffering from no plating failure of insufficient adhesion as well as a reliable production of a galvanized steel sheet suffering from no plating failure or streaking of the alloyed layer. The zinc or zinc-alloy plated steel sheet having improved weldability comprises an extra low carbon steel sheet, an iron-carbon plated layer or a carbon-rich layer generated by diffusion of the iron-carbon plated layer on at least one major surface of the extra low carbon steel sheet, and a zinc or zinc-alloy plated layer on the iron-carbon plated layer or the carbon-rich layer.

Abstract: A process is disclosed for phosphating metallic surfaces, particularly electrolytically or hot dipped galvanized steel strip surfaces, by dip or spray processing the metallic surfaces with acidic aqueous phosphating solutions, wherein the workpieces are cathodically treated at the same time with a direct current. The process is characterized by (a) the use of phosphating solutions that contain the following components: Zn.sup.+2 cations in a range from 0.1 to 5 g/l; PO.sub.4.sup.-3 anions in a range from 5 to 50 g/l; NO.sub.3.sup.- anions in a range from 0.1 to 50 g/l; as well as Ni.sup.+2 cations in a range from 0.1 to 5 g/l and/or Co.sup.+2 cations in a range from 0.1 to 5 g/l; (b) the observance of the following conditions: pH value of the phosphating solutions in a range from 1.5 to 4.5; temperature of the phosphating solutions in a range from 10.degree. to 80.degree. C.

Abstract: Facilitating the distinction among different spring steel products and at the same time improving their surface appearance and corrosion resistance by plating the surface of said different spring steel products before spring-forming with either alternate layers of Cu and Zn or alternate layers of Ni, Cu and Zn, the amount of Cu and Zn differing for steel products differing in size and/or material, to obtain color-developable spring steel products, drawing and taken coil spring-forming the resulting plated spring steel products, and low temperature annealing said resulting plated spring steel products to develop their colors, the colors being different for spring steel products differing in size and/or material, whereby mixing and erroneous assembly of spring steel products differing in size and/or material is prevented.

Abstract: A copper foil for printed circuits having a rust-preventive and heat-discoloration resistant coat, comprising a first layer of zinc or an alloy or a compound or a composition including zinc mainly, and a second layer including a silane coupling agent and phosphorus or a phosphorus compound, said second layer being positioned on the first layer. A method of producing a copper foil for printed circuits comprising the steps of treating the shiny side of a copper foil in a manner of cathode electrolysis in an alkaline solution including zinc ions and chrome ions, or providing the shiny side of a copper foil with a thin plating layer of zinc or a zinc alloy, and thereafter applying onto the treated surface of the copper foil a solution including a silane coupling agent and phosphorus or a phosphorus compound.

Abstract: According to this process, the strip runs through a bath of at least one electrolytic cell and two metal layers are successively deposited onto its surface by adjusting the current feeding the electrolytic cell so that the average value of the current density at the surface of the strip is less than a value called the limiting diffusion current of the ions of the metal to be deposited. In addition, during the formation of the first metal layer, the current is adjusted so as to prevent the appearance of localized overcurrents at the surface of the strip, it being possible for these overcurrents to exceed the limiting diffusion current. Such a process find particular application for electrogalvanizing.Application to an electrogalvanising process.

Abstract: A method to electrochemically deposit semiconductors and for the electrochemical formation of epitaxial thin-film, single-crystalline compound semiconductors comprising alternating electrodeposition of atomic layers of selected pairs of elements using underpotential deposition.

Abstract: A method for manufacturing an iron-zinc alloy plated steel sheet having two plating layers and excellent in electropaintability and press-formability, which comprises the steps of: applying an alloying treatment under a temperature of from 420.degree. to 520.degree. C. to a zinc dip-plated steel sheet to form on the surface of the steel sheet an alloying-treated iron-zinc alloy dip-plating layer having on the surface thereof fine irregularities comprising numerous fine concavities and numerous fine convexities; then applying a temper rolling treatment at a reduction rate of from 0.3 to 1.

Abstract: A corrosion resistant coating and process comprises the following layers applied in sequence over a ferrous metal substrate: a micro-throwing nickel-zinc alloy plating; a zinc-nickel alloy plating containing 5 to 30 weight percent nickel; a galvanically protective zinc metal plating; and either copper, nickel and chromium (or chromium substitute) plating layers or a chromate conversion layer. The coating is preferably used with a steel fastener such as a bolt or drill screw in combination with a washer.

Abstract: The present invention relates to a process for treating a surface of a copper foil for producing the copper foil for a printed circuit board in which a zinc layer, a copper layer and a chromate layer are formed in turn on the copper foil. The product of the present invention is excellent in heat resistance and hydrochloric acid resistance and the process according to the present invention does not require the use of dangerous chemicals and is free from any problems on safety.

Abstract: A method for producing a composite steel strip having a high corrosion resistance comprises electroplating a steel strip substrate in an electroplating bath to codeposit a zinc-based metal matrix and corrosion-preventing fine solid particles. The particles comprise a core which may be, for example, chromate, phosphate, aluminum, molybdenum or titanium compounds and a thin coating membrane which may be, for example, SiO.sub.2, Al.sub.2 O.sub.3, ZrO.sub.2, TiO.sub.2 or a resin encapsulating the core. The core material is soluble in the electroplating bath while the coating membrane is substantially insoluble in the electroplating bath. The electroplating bath also contains an agent for promoting the codeposition of the zinc-based metal matrix and the particles, and may optionally include a number of additional fine particles which may be, for example, SiO.sub.2, TiO.sub.2, Cr.sub.2 O.sub.3, Al.sub.2 O.sub.3, ZrO.sub.2, SnO.sub.2, or Sb.sub.2 O.sub.5.