Abstract: A method of forming a radio frequency (RF) strap for use in a process chamber is provided. The method includes positioning a core strap including a first material that is electrically and thermally conductive in a first electrochemical bath. The first electrochemical bath includes a first solvent and a first plating precursor. The method further includes forming a first protective coating on an outer surface of the core strap, removing the first solvent and the first plating precursor from the core strap having the first protective coating formed thereon, post-treating the core strap having the first protective coating formed thereon, positioning the core strap having the first protective coating formed thereon in a second electrochemical bath, and forming a second protective coating on an outer surface of the first protective coating.

Abstract: Disclosed is a composite electroplating method for sintered NdFeB magnet, including: a process of pre-treating sintered NdFeB magnet, a process of electroplating the pre-treated sintered NdFeB magnet, and a process of cleaning and drying the electroplated sintered NdFeB magnet. The electroplating process forms a composite coating composed of a Zn coating, a Zn—Ni alloy coating, a Cu coating and a Ni coating on the surface of the sintered NdFeB magnet.

Abstract: A silver-plated product is produced by forming a surface layer of silver on a base material by electroplating at a liquid temperature of 10 to 35° C. and a current density of 3 to 15 A/dm2 in a silver plating solution so as to satisfy (32.6x?300)?y?(32.6x+200) assuming that a product of a concentration of potassium cyanide in the silver plating solution and a current density is y (g·A/L·dm2) and that a liquid temperature of the silver plating solution is x (° C.), the silver plating solution containing 80 to 110 g/L of silver, 70 to 160 g/L of potassium cyanide and 55 to 70 mg/L of selenium.

Abstract: A gear pump bearing block has a bush formed of antifriction alloys. The bush has a cylindrical portion providing a bore adapted to receive a bearing shaft of a gear of the pump. It further has a thrust face at the end of the cylindrical portion, the thrust face being adapted to slidingly engage with a side surface of the gear. The bush has an inner component providing the bore, and an outer component forming a radially outer surface of the cylindrical portion. The inner and outer components are formed of respective lead bronze alloys, the lead bronze alloy of the outer component having a higher lead content than the lead bronze alloy of the inner component.

Abstract: The present invention relates to a method for the coating of a surface of a TiAl alloy, in which at least one layer is electroplated on the surface of the TiAl alloy, wherein the surface of the TiAl alloy is subjected to an at least two-step surface treatment for the formation of a roughened surface, this treatment comprising at least one electrochemical processing and at least one electroless chemical processing.

Abstract: The composition ratio of a titanium hydride [ITi—H/(ITi+ITi—H)]×100 found from the maximum intensity of metal titanium (ITi) and the maximum intensity of the titanium hydride (ITi—H) of the X-ray diffraction peaks measured at a surface of a titanium or a titanium alloy at an incident angle to the surface of 0.3° is 55% or more, a titanium oxide film is formed on an outermost surface of the titanium or the titanium alloy, and C is at 10 atomic % or less, N is at 1 atomic % or less, and B is at 1 atomic % or less in a position where the surface has been subjected to sputtering of 5 nm with argon. The titanium oxide film is formed by performing stabilization treatment after performing passivation treatment in prescribed aqueous solutions, and has a thickness of 3 to 10 nm.

Abstract: There is provided a method for producing a plated article, comprising immersing a substrate made of a conductive metal in a plating solution and forming a plating layer on the substrate by electroplating, wherein the plating solution is a solution containing 0.01 to 1 mol/L of Ni ions with pH of 6 or more; and a porous Ni plating layer is formed by performing the electroplating at a cathode current density of 10 A/dm2 or more. This method allows for easily producing a plated article wherein a uniform porous Ni plating layer is formed on the surface of a substrate.

Abstract: In an embodiment, a polycrystalline diamond compact includes a substrate and a preformed polycrystalline diamond table having an upper surface, an interfacial surface, and at least one side surface extending therebetween. The interfacial surface of the polycrystalline diamond table is bonded to the substrate. The polycrystalline diamond table includes bonded diamond grains defining interstitial regions. The polycrystalline diamond table includes a first region extending inwardly from at least a portion of the upper surface and at least a portion of the at least one side surface. The first region spaced from the interfacial surface. The polycrystalline diamond table includes at least a second region extending inwardly from the interfacial surface to the upper surface. The first region includes at least a first infiltrant disposed interstitially between the bonded diamond grains thereof. The second region includes at least a second infiltrant disposed interstitially between the bonded diamond grains thereof.

Abstract: An electronic device of the present invention includes an insulating base substrate in which a plurality of through electrodes are formed; an electronic element which is electrically connected to the through electrodes and is mounted on one surface of the base substrate; a lid which accommodates the electronic element and is bonded to the one surface of the base substrate; and an external electrode which covers a region ranging from an end face of the through electrode, which is exposed by the other surface of the base substrate, to the other surface in a vicinity of the end face. The external electrode includes a conductive film which covers a region ranging from the end face to the other surface in the vicinity of the end face, a first electrolytic plating film which is formed on a surface of the conductive film by an electrolytic plating method, and a second electrolytic plating film which is formed on a surface of the first electrolytic plating film by an electrolytic plating method.

Abstract: Systems and methods for reducing overhang on electroplated surfaces of printed circuit boards are described. One such method includes applying a first resist layer on a substrate having a first copper layer, applying a first image to the first resist layer, developing the first resist layer in accordance with the first image, applying a second copper layer on the first copper layer, electroplating a first metallic layer on the second copper layer, removing the first resist layer, etching a portion of the first copper layer, removing the first metallic layer, depositing a third copper layer on a surface of the assembly, applying a second resist layer on the third copper layer, applying a second image to the second resist layer, developing the second resist layer in accordance with the second image, electroplating a preselected metal layer on the third copper layer, removing the second resist layer, and etching a portion of the third copper layer.

Abstract: The present invention relates to a textured substrate for epitaxial film formation, comprising a textured metal layer at least on one side, wherein the textured metal layer includes a copper layer having a cube texture and a nickel layer having a thickness of 100 to 20000 nm formed on the copper layer; the nickel layer has a nickel oxide layer formed on a surface thereof, having a thickness of 1 to 30 nm, and including a nickel oxide; and the nickel layer further includes a palladium-containing region formed of palladium-containing nickel at an interface with the nickel oxide layer. The top layer of the textured substrate, i.e. the nickel oxide layer, has a surface roughness of preferably 10 nm or less.

Abstract: A busbar 10, for use in electrical distribution, is disclosed. The busbar 10 arranged to have an electrically conductive barrier 22 disposed about at least a first portion 20 of the busbar surface 13 for limiting the formation of an oxide layer on the busbar 10. In a further aspect of the present invention the busbar 10 is arranged to have an electrically insulating barrier 26 disposed about at least a second portion 24 of the busbar 10 surface 13 for limiting undesired electrical connection with the busbar 10. The present invention provides a pre-insulated busbar 10 which can be subsequently shaped or prepared without compromising the insulating barrier 26 or the conductive barrier 22. The present invention provides a busbar 10 having improved safety, speed of fitting, and handling characteristics.

Abstract: Tin-plated copper-alloy material for terminal having: a substrate made of Cu or Cu alloy; an Sn-based surface layer formed on a surface of the substrate; and a Cu—Ni—Sn alloy layer including Ni formed between the Sn-based surface layer and the substrate, in which the Cu—Ni—Sn alloy layer is made of: fine Cu—Ni—Sn alloy particles; and coarse Cu—Ni—Sn alloy particles, an average thickness of the Sn-based surface layer is not less than 0.2 ?m and not more than 0.6 ?m, an area ratio of the Cu—Ni—Sn alloy layer exposed at a surface of the Sn-based surface layer is not less than 10% and not more than 40%, and a coefficient of kinetic friction of the tin-plated copper-alloy material for terminal is not more than 0.3.

Abstract: Coated articles and methods for applying coatings including a rhodium layer are described. In some cases, the coating can exhibit desirable properties and characteristics such as durability, corrosion resistance, and high conductivity. The articles may be coated, for example, using an electrodeposition process.

Abstract: An electronic component including an electronic component element with an external electrode, a Ni plating film on the external electrode, and a Sn plating film covering the Ni plating film. The Sn plating film has Sn—Ni alloy flakes therein, the Sn—Ni alloy flakes are present in the range from a surface of the Sn plating film on the Ni plating film to 50% or less of the thickness of the Sn plating film, and when Sn is removed from the Sn plating film to leave only the Sn—Ni alloy flakes, an observed planar view of a region occupied by the Sn—Ni alloy flakes falls within the range from 15% to 60% of the observed planar region.

Abstract: A method for making a printed wiring member including wire-bondable contact pads and wear-resistant connector pads, the method includes a) providing a blank printed wiring member comprising a copper foil laminated to a dielectric substrate; b) masking the blank printed wiring member to protect regions of the copper foil; c) removing copper in unprotected regions of the blank printed wiring member to form a patterned printed wiring member including contact pads and connector pads; d) depositing a nickel coating on the patterned printed wiring member; e) electrolytically depositing a hard gold layer on the nickel coating; and f) depositing palladium on a surface of the hard gold layer to improve bondability of the contact pads while preserving wear resistance of the connector pads.

Abstract: Provided is a Ni-plated steel sheet having excellent press formability. An Fe—Ni diffusion layer and a softened Ni layer formed on the Fe—Ni diffusion layer are formed on a surface of a steel sheet corresponding to an outer surface of a battery can, a semi-bright Ni plating layer is formed on the softened Ni layer, a Ni coating weight of the Fe—Ni diffusion layer and the softened Ni layer formed on the Fe—Ni diffusion layer is set smaller than a Ni coating weight of the semi-bright Ni plating layer, and average roughness Ra of the semi-bright Ni plating layer measured by a traceable roughness gauge is 1.0 ?m or more and 2.0 ?m or less, and a maximum height Ry of the semi-bright Ni plating layer measured by the traceable roughness gauge is 5 ?m or more and 20 ?m or less.

Abstract: A method of forming a tool marking structure includes: a coloring step of coloring a predetermined position of the first protective layer so as to form a marking area with a color layer and forming the first protective layer on a bottom surface of the marking area, and a second-time surface processing step of forming a second protective layer on a non-marking area of the tool.

Abstract: Disclosed is an electroplating method for printed circuit board. The method includes: providing a printed circuit board including a circuit pattern, a pad part on which components are mounted, a terminal part for electrical connection to an external device, and a connector part; masking the portion of the printed circuit board other than the terminal part and the connector part; dipping the printed circuit board in a nickel-tungsten alloy plating solution including a water-soluble nickel compound, a water-soluble tungsten compound, a complexing agent, and a ductility improver; forming a nickel-tungsten alloy plated layer on each of the exposed portions of the terminal part and the connector part by direct-current (DC) electroplating; and forming a gold-containing plated layer on the nickel-tungsten alloy plated layer by DC electroplating.

Abstract: A silver-coated composite material for movable contact parts, which has: an underlying layer composed of any one of nickel, cobalt, a nickel alloy, and a cobalt alloy at least provided on a part of the surface of a stainless steel substrate; an intermediate layer composed of copper or a copper alloy provided thereon; and a silver or silver alloy layer provided thereon as an outermost layer, wherein a thickness of the intermediate layer is 0.05 to 0.3 ?m, and wherein an average grain size of the silver or silver alloy provided as the outermost layer is 0.5 to 5.0 ?m.

Abstract: The present invention relates to the production of a bronze plated substrate having a golden appearance thanks to a multiple-layer plating method. The method notably comprises plating a substrate having at least one layer of copper with a tin layer which thickness represents 3.5% to 12% of the copper layer thickness. The method further comprises annealing the plated substrate in an annealing furnace comprising a plurality of heating zones, the last heating zone of the furnace having an annealing temperature ranging from 600° C. to 815° C. The annealing step of the method is performed under controlled operating parameters which comprise an annealing residence time, the annealing temperature and the relative thickness of the tin layer in view of the copper layer. The operating parameters are controlled in accordance to each other to ensure obtaining the gold-like appearance of the plated bronze.

Abstract: An exposed surface on a steel component is prepared for an application of a nickel high speed solution. The nickel high speed solution is applied to the exposed surface to create an intermediate surface on the component. The intermediate surface is prepared for an application of a nickel sulfamate solution. The nickel sulfamate solution is applied to the intermediate surface to create a duplex brush plating.

Abstract: A thin film of tin is plated directly on nickel coating a metal substrate followed by plating silver directly on the thin film of tin. The silver has good adhesion to the substrate even at high temperatures.

Abstract: A substrate structure, a semiconductor package device and a manufacturing method of substrate structure are provided. The substrate structure comprises a conductive structure comprising a first metal layer, a second metal layer and a third metal layer. The second metal layer is disposed on the first metal layer. The third metal layer is disposed on the second metal layer. Each of the second metal layer and the third metal layer has a first surface and a second surface opposite to the first surface. The first surface of the third metal layer is connected to the second surface of the second metal layer. The surface area of the first surface of the third metal layer is larger than that of the second surface of the second metal layer. A substrate structure, semiconductor package device, and a manufacturing method of substrate structure are provided. The substrate structure includes a conductive structure, comprising a first metal layer, a second metal layer, and a third metal layer.

Abstract: In order to produce industrially advantageously an electroformed copper/niobium composite piping material wherein an electroformed copper layer and a niobium thin piping material are strongly bonded to each other, the electroformed copper/niobium composite piping material can be produced by coating any one or each of the outer peripheral surface and the inner peripheral surface of a niobium thin piping material with a nickel thin film, coating the surface of the nickel thin film with copper by electroforming, and subsequently annealing the resultant.

Abstract: Multiple surface finishes are applied to a substrate for a microelectronics package by applying a first surface finish to connection pads of a first area of the substrate, masking the first area of the substrate without masking a second area of the substrate, applying a second different surface finish to connection pads of the second area of the substrate, and removing the mask.

Abstract: A method for providing a structure in a magnetic recording transducer is described. The method includes plating a first layer in a plating bath using a first plurality of plating conditions. The first layer has a first galvanic potential. The method also includes modifying the plating bath and/or the first plurality of plating conditions to provide a modified plating bath and/or a second plurality of plating conditions. The method further includes plating a second layer using the modified plating bath and/or the second plurality of plating conditions. The second layer has a second galvanic potential. The first galvanic potential is between the second galvanic potential and a third galvanic potential of a third layer if the third layer adjoins the first layer. The second galvanic potential is between the first galvanic potential and the third galvanic potential of the third layer if the third layer adjoins the second layer.

Abstract: A tab for soft package lithium battery and its method of plating and application are provided. The tab uses SUS430 stainless steel strip, a copper strip, an aluminum strip or a nickel strip as a substrate. A nickel plating layer is plated on one end of one side of the substrate and a tin plating layer is plated on the nickel plating layer, or the tin plating layer is plated on one end of one side of the substrate directly. The thickness of the nickel plating layer is 0.5-2 um, and the thickness of the tin plating layer is 3-10 um. The tab has a lower manufacturing cost, favorable weldability and appropriate thermal conductivity.

Abstract: Metal-clad polymer articles containing structural fine-grained and/or amorphous metallic coatings/layers optionally containing solid particulates dispersed therein, are disclosed. The fine-grained and/or amorphous metallic coatings are particularly suited for strong and lightweight articles, precision molds, sporting goods, automotive parts and components exposed to thermal cycling although the CLTE of the metallic layer and the one of the substrate is mismatched. The interface between the metallic layer and the polymer is suitably pretreated to withstand thermal cycling without failure.

Abstract: A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.

Abstract: A contact is included by an electrical connector and has a base layer and a plating layer. The base layer includes a contacting portion at one end thereof, a soldering portion at the other end thereof, and a connecting portion connecting the contacting portion and the soldering portion. The plating layer is plated on the base layer. The plating layer includes a nickel plating layer plated on the contacting portion, the soldering portion and the connecting portion of the base layer, a first gold plating layer and a second gold plating layer plated on two end portions of the nickel plating layer corresponding to the contacting portion and the soldering portion, respectively. A middle portion of the nickel plating layer corresponding to the connecting portion is exposed outside.

Abstract: The invention relates to a galvanic metal coating with an adjustable satin gloss in which a matte Ni layer is deposited on a brilliant surface and is coated with a sulfamate Ni layer.

Abstract: The material for metal cases of secondary batteries using a non-aqueous electrolyte includes a steel sheet; and a plated layer that has a Ni layer, and a Cu—Ni layer, which is disposed between the Ni layer and the steel sheet and is in contact with the Ni layer, and is in contact with the steel sheet.

Abstract: A doctor blade for wiping printing ink off a surface of a printing plate, comprising a flat and elongated main body having a working edge region configured in a longitudinal direction, the working edge region being covered with a first coating on the basis of a nickel-phosphorus alloy applied by electroless deposition, and hard material particles being dispersed in the first coating, characterized in that the first coating is covered with a second coating on the basis of galvanically deposited nickel.

Abstract: Described herein are methods of producing an aluminide barrier layer, wherein the barrier layer includes nickel aluminide, iron aluminide, or a combination thereof, and the barrier layer is produced by a diffusion coating process on at least one surface of the article. The methods described herein are useful for preventing or reducing the migration of a metal species at or near at least one surface of the article. The articles produced by the methods described herein have numerous applications in the construction and operation of fuel cells.

Abstract: Articles having metallic finishes including antimicrobial agents dispersed throughout the finish and methods of electroplating said metallic finishes on a material. The metallic finishes include highly-decorative electroplated finishes for bathroom and kitchen hardware, door hardware, and other highly lustrous products where antimicrobial protection is preferred.

Abstract: A method of construction of an electrochemical interconnect plate, the method comprising the steps of: (a) etching predetermined fluid flow channels in a first conductive sheet; and (b) coating the first conductive sheet with a corrosion resistant layer of nickel and tin.

Abstract: A swage mount that includes a flange, having a first side and a second side, and a cylindrically shaped hub. The hub is primarily comprised of a metal (such as stainless steel), and extends from the second side of the flange, and has an inner surface and an outer surface. The surface of the swage mount is plated with one or more layers of metal, or a combination of metals, which provide a) increased retention torque, and b) increased part cleanliness. This invention may be used in conjunction with surface hardened swage mounts that contain surface protrusions. In this case the metal plating prevents separation of the protrusions from the swage mount, thereby preventing contamination.

Abstract: The invention relates to a layer system comprising on a substrate, the surface of which has been electropolished, (i) a Ni layer having a thickness ?3.0 ?m, (ii) a Ni—P layer having a thickness ?1.0 ?m, (iii) a Au layer having a thickness ?1.0 ?m.

Abstract: Plated steel sheet comprised of steel sheet having a tin alloy layer on it, which is characterized by (i) having free tin distributed on the tin alloy layer in a 5 to 97% area rate and further (ii) having a chemically treated layer having phosphate in an amount of 1.0 to 5.0 mg/m2 in terms of P and tin oxide in an amount of 0.3 to 4.0 mC/cm2 in terms of electricity necessary for reduction, formed on the tin alloy layer and free tin.

Abstract: A method of processing a printed wiring board. Initial processing steps are implemented on the printed wiring board. Copper is plated on the printed wiring board from a bath containing nickel and copper. Nickel is plated on the printed wiring board from a bath containing nickel and copper and final processing steps are implemented on the printed wiring board.

Abstract: It is an object to provide a surface-treated steel sheet which contains no Cr, which is excellent in wet resin adhesion, and which can be used as an alternative to a conventional tin-free steel sheet and to provide a resin-coated steel sheet produced by coating the surface-treated steel sheet with resin. A surface-treated steel sheet including an adhesive layer which is disposed on at least one surface of the steel sheet and which contains Ti and at least one selected from the group consisting of Co, Fe, Ni, V, Cu, Mn, and Zn, the ratio of the total amount of Co, Fe, Ni, V, Cu, Mn, and Zn to the amount of Ti contained therein being 0.01 to ten on a mass basis, and a method for producing the surface-treated steel sheet.

Abstract: This invention involves the technological field of electroplating, chemical plating, specially involves a method for partially plating aluminum and aluminum copper radiators. A radiator is conducted partial chemical oxidation and enclosure before undergoing galvanization. Firstly oxidize the non-plate surface of the radiator by chemical oxidation, then utilize a sealing compound to fill up tiny holes of the porous layer to make a film thereon against the erosion of acid and alkali, and then process common chemical plating or electroplating. Only plate a weldable nickel-phosphorus alloy on the touching parts at where the aluminum radiator or the aluminums and copper radiator connect with the main frame.

Abstract: A manufacturing method of a non-etched circuit board is disclosed herein, which employs a metal substrate having a metal barrier layer and an electroplated copper layer to transmit an electrical current to form a circuit layer. A patterned photoresist layer is formed on the electroplated copper layer to define the location of the circuit layer and form circuits or conductive via on the board by electroplating. An electroplated nickel layer or an electroplated gold layer is further formed on the circuit layer for protecting the circuits and improving the fine line capability. During or after the process, the metal substrate, the metal barrier layer, and the electroplated copper layer are removed to enlarge the wiring space, so that a high-density circuit board can be obtained.

Abstract: Methods are provided for forming coatings on substrates. In an embodiment, a method includes forming a first metal layer on the substrate, the first metal layer comprising a first precious metal, electrodepositing an active element over the first metal layer to form an active element layer, the active element selected from the group consisting of yttrium, scandium, and a lanthanide series element, applying a second metal layer over the active element layer, the second metal layer consisting essentially of a metal selected from a group consisting of a second precious metal, nickel, and cobalt, heating the substrate including the first metal layer, the active element layer, and the second metal layer to form a diffusion-alloyed layer over the substrate, adding aluminum to the diffusion-alloyed layer, and heating the substrate to diffuse and react the aluminum with the diffusion-alloyed layer to form a modified precious metal aluminide coating on the substrate.

Abstract: A composition and method for inhibiting corrosion is disclosed. Metals and metal alloys are treated with compositions which contain inorganic and organic acids that prevent oxide formation on the metals and metal alloys.

Abstract: Disclosed is an electronic component comprising a connecting terminal part having a surface of an electroconductive base material and a germanium-containing nickel plating film provided on the surface. In the electronic component, the plating film provided on the surface of the electroconductive base material in the connecting terminal part possesses excellent heat resistance and solder wettability.

Abstract: A metal clad laminate and a method of manufacturing the metal clad laminate are disclosed. The metal clad laminate can include a barrier layer made of a metallic material, a metal foil formed on one side of the barrier layer and coupled with the barrier layer by plating, and an insulator attached to the metal foil. By utilizing the metal clad laminate, the metal foil can be prevented from being perforated when processing a via hole using laser, so that a VOP structure may be implemented with a higher level of reliability.

Abstract: The present invention relates to a nanowire sensor and method for forming the same. More specifically, the nanowire sensor comprises at least one nanowire formed on a substrate, with a sensor receptor disposed on a surface of the nanowire, thereby forming a receptor-coated nanowire. The nanowire sensor can be arranged as a sensor sub-unit comprising a plurality of homogeneously receptor-coated nanowires. A plurality of sensor subunits can be formed to collectively comprise a nanowire sensor array. Each sensor subunit in the nanowire sensor array can be formed to sense a different stimulus, allowing a user to sense a plurality of stimuli. Additionally, each sensor subunit can be formed to sense the same stimuli through different aspects of the stimulus. The sensor array is fabricated through a variety of techniques, such as by creating nanopores on a substrate and electrodepositing nanowires within the nanopores.

Abstract: The invention relates to a galvanic metal coating with an adjustable satin gloss in which a matt Ni layer is deposited on a brilliant surface and is coated with a sulfamate Ni layer.