At Least One Predominantly Nickel Metal Coating Patents (Class 205/181)
  • Patent number: 6358566
    Abstract: A process of producing an aluminum beverage can body having a decorative surface exhibiting a dichroic effect when observed in white light. In the process, a can body is formed from a sheet of metal selected from aluminum and aluminum alloy by drawing and ironing, surfaces of the can body are cleaned to produce a cleaned can body, a decorative structure exhibiting a dichroic effect is applied to a surface of the cleaned can body, and the can body is subjected to finishing operations. The decorative structure is applied by the steps of: applying a layer of dielectric material directly onto the metal of the cleaned can body without pre-treatment of the metal with a metal brightener, and forming a semi-transparent metal layer on or within the dielectric layer.
    Type: Grant
    Filed: October 20, 1999
    Date of Patent: March 19, 2002
    Assignee: Alcan International Limited
    Inventor: Aron Marcus Rosenfeld
  • Patent number: 6352634
    Abstract: A method for the manufacture of a leadless substrate with a basic body made of copper or copper base alloy, a solder layer applied to at least one portion of the basic body and made of metals belonging to the group of gold, gold alloy, silver, silver alloy, palladium, and palladium alloy, as well as an intermediate layer arranged between the basic body and the solder layer and made of nickel or nickel alloy, wherein the solder layer consists of at least two separate layers made of different metals and wherein the intermediate layer and the separate layers are deposited by electroplating, characterized in that at least one separate layer is made of silver or silver alloy.
    Type: Grant
    Filed: February 1, 2000
    Date of Patent: March 5, 2002
    Assignee: W. C. Heraeus GmbH & Co. KG
    Inventors: Heinz Förderer, Thomas Frey, Günter Herklotz
  • Patent number: 6344123
    Abstract: A compositionally modulated material electroplated film is deposited by using at least two source metal anodes in an electroplating apparatus, and changing at least one power setting of an electroplating power supply. In order to obtain sharp boundaries between successive layers of the film, voltage can be switched from an electroplating substrate to a dummy electrode immediately before the power setting is changed, in order to allow the electrolyte to equilibrate at a new set of solute concentrations, before electroplating on the substrate is recommenced.
    Type: Grant
    Filed: September 27, 2000
    Date of Patent: February 5, 2002
    Assignee: International Business Machines Corporation
    Inventor: Parijat Bhatnagar
  • Patent number: 6336962
    Abstract: The present invention describes a method of producing gold coating on a workpiece having a palladium surface, having the steps of: a) making an aqueous solution containing at least one compound selected from the group of compounds containing gold(I) and gold(III) ions and additionally at least one organic compound selected from the group consisting of formic acid, aromatic carboxylic acids having the chemical formula: where R1, . . . , R4=H, alkyl, alkenyl, alkynyl, OH, and the salts, esters or amides of these compounds; b) adjusting the pH of the solution to 1 to 6 using pH adjusting agents; and c) bringing the workpiece into contact with the solution such that gold coating is plated onto the palladium surface.
    Type: Grant
    Filed: July 7, 2000
    Date of Patent: January 8, 2002
    Assignee: Atotech Deutschland GmbH
    Inventors: Petra Backus, Hartmut Mahlkow, Christian Wunderlich
  • Patent number: 6319190
    Abstract: The invention relates to radioactive ruthenium sources with a dosage rate of at least 1.5 Gy/min at a distance (water) of 2 mm, consisting of an activity carrier and an encapsulation of the carrier made of a material compatible with the human body. A multilayer system made of metals and/or alloys is galvanically applied on the carrier. At least two layers in said system are made of ruthenium 106 and inactive intermediate layers made of other metals or alloys are provided between the radioactive ruthenium layers. The activity carrier is encapsulated with a material compatible with the human body, for instance a metal or a plastic material. Encapsulation can be carried out by filing a capsule and subsequently sealing or galvanically depositing a top layer made, for instance of hard gold.
    Type: Grant
    Filed: February 14, 2000
    Date of Patent: November 20, 2001
    Assignee: Bebig Isotopentechnik und Umweltdiagnostik GmbH
    Inventors: Werner Schmidt, Renate Freudenberger, Michael Andrassy, Jürgen Ziegler, Detlev Behrendt, Andre Hess
  • Patent number: 6277253
    Abstract: Embodiments include a method for depositing material onto a workpiece in a sputtering chamber. The method includes sputtering a target and a coil in said sputtering chamber. The coil may have a preformed multilayer structure formed outside of the sputtering chamber. The outer layer of the coil may act as a secondary source of deposition material. The multilayer structure may be formed with an inner region or a base metal and an outer layer of a sputtering metal. The outer layer may be formed using a process such as plasma spraying, arc spraying, flame spraying, ion plating, chemical vapor deposition and electroplating.
    Type: Grant
    Filed: October 6, 1999
    Date of Patent: August 21, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Murali Narasimhan, Xiangbing Li
  • Patent number: 6269551
    Abstract: A method employed to dry a copper foil having been subjected to various surface treatments, which method comprises irradiating at least one surface-treated side of the copper foil with near infrared rays to dry the copper foil, and an apparatus suitable to the method. The drying of the copper foil having undergone surface treatments can be accomplished by a simple apparatus with low electric power while controlling the heating of the surface of the copper foil so that the drying temperature can be held at 100° C. or higher at which a eutectic alloying of rust preventive metal and copper foil, for example, alloying (brass formation) of zinc and copper on the surface of the copper foil is effected.
    Type: Grant
    Filed: July 16, 1999
    Date of Patent: August 7, 2001
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Nobuyuki Imada, Kazuhide Oshima
  • Patent number: 6221231
    Abstract: A method for depositing a multi-layered protective and decorative coating on an article comprising first depositing at least one coating layer on the article by electroplating, removing the electroplated article from the electroplating bath and subjecting it to pulse blow drying to produce a spot-free surface on the electroplated article, and then depositing, by chemical vapor deposition, at least one chemically vapor deposited coating layer on the electroplated article. The electroplated layers are selected from copper, nickel and chrome. The chemical vapor deposited layers are selected from non-precious refractory metals, non-precious refractory metal alloys, non-precious refractory metal compounds, and non-precious refractory metal alloy compounds.
    Type: Grant
    Filed: March 8, 1999
    Date of Patent: April 24, 2001
    Assignee: Masco Corporation of Indiana
    Inventor: Dennis Foster
  • Patent number: 6193871
    Abstract: A nickel electrode prepared by depositing one of an oxide and hydroxide of a zinc-salt to an electrode substrate in a first step and, thereafter, depositing nickel-active material to the electrode substrate in a separate step.
    Type: Grant
    Filed: December 9, 1998
    Date of Patent: February 27, 2001
    Assignee: Eagle-Picher Industries, Inc.
    Inventors: Dwaine K. Coates, Dennis Chiappetti
  • Patent number: 6178623
    Abstract: A copper plated aluminum wire with improvement in adhesive properties is fabricated by a method which includes a displacement step of forming a thin layer of a metal by displacement on a surface of an aluminum or aluminum alloy conductor, an electroplating step of coating a surface of the thin layer continuously with copper layers by electroplating to have a copper coated aluminum conductor, and a thermal diffusion step of heat treating the copper coated aluminum conductor at a temperature of 120° C. to 600° C. under an inert gas atmosphere for thermal diffusion. A plated aluminum wire is provided having an anchor metal layer formed by displacement plating, a low thermally conductive metal layer formed by electroplating, and a high electrically conductive metal layer formed by electroplating in which all of the layers are sequentially deposited on an outer surface of an aluminum or aluminum alloy conductor.
    Type: Grant
    Filed: October 1, 1998
    Date of Patent: January 30, 2001
    Assignee: Totoku Electric Co., Ltd.
    Inventors: hiroshi Kitazawa, tatsuo Yamaguchi, etsuro Tsukada
  • Patent number: 6083375
    Abstract: A process for producing a terminal metal pad structure electrically interconnecting a package and other components. More particularly, the invention encompasses a process for producing a plurality of corrosion-resistant terminal metal pads. Each pad includes a base pad containing copper which is encapsulated within a series of successively electroplated metal encapsulating films to produce a corrosion-resistant terminal metal pad.
    Type: Grant
    Filed: November 2, 1998
    Date of Patent: July 4, 2000
    Assignee: International Business Machines Corporation
    Inventors: Tien-Jen Cheng, Ajay P. Giri, Ashwani K. Malhotra, John R. Pennacchia, Eric D. Perfecto, Roy Yu
  • Patent number: 6063141
    Abstract: A method for manufacturing a cathode for a molten carbonate fuel cell includes oxidation of a porous precursor electrode and contact with molten carbonate. Following assembly of a layered arrangement containing the precursor electrode, a matrix layer made of molten carbonate, and a porous anode, the precursor electrode is anodically oxidized with a preset curve for the current density, and doped by contact with molten carbonate.
    Type: Grant
    Filed: December 18, 1998
    Date of Patent: May 16, 2000
    Assignee: MTU Motoren-Und Turbinen-Union Friedrichshafen GmbH
    Inventors: Hartmut Wendt, Hans-Juergen Salge, Manfred Bischoff
  • Patent number: 6042711
    Abstract: A metallic foil with improved peel strength is disclosed which has on a surface thereof two superimposed electrodeposited layers, the first layer adjacent to said surface comprising a dusty dendritic deposit comprising a major amount of a first metal and the second layer comprising a metal flash uniformly deposited over said first layer comprising a major amount of a second metal other than said first metal. A method for making such foil is disclosed which comprises (A) electrodepositing a first metal on one surface of said foil to produce a dusty dendritic metal deposit and (B) electrodepositing on the dendritic deposit of (A) a uniform metal flash. The improved foil is useful for a wide range of applications that benefit from the improved bonding to substrates, including electronic applications such as laminated electronic devices, such as printed circuit boards, and solid state switches.
    Type: Grant
    Filed: August 29, 1997
    Date of Patent: March 28, 2000
    Assignee: Gould Electronics, Inc.
    Inventors: Richard J. Sadey, Dennis M. Zatt
  • Patent number: 5908542
    Abstract: In one embodiment, the present invention relates to a method of treating metal foil, involving sequentially contacting a metal foil with an acidic solution; placing the metal foil in a nickel treatment bath and applying a current through the nickel treatment bath, wherein the nickel treatment bath contains at least about two plating zones, about 1 to about 50 g/l of an ammonium salt, and about 10 to about 100 g/l of a nickel compound; and applying a nickel flash layer to the metal foil. In another embodiment, the present invention relates to a metal foil treated according to the method described above.
    Type: Grant
    Filed: July 2, 1997
    Date of Patent: June 1, 1999
    Assignee: Gould Electronics Inc.
    Inventors: Chin-Ho Lee, Ronald K. Haines, Edward Czapor
  • Patent number: 5882498
    Abstract: A method for electroplating a silicon substrate in manufacturing a semiconductive device is provided. Electroplating process chamber contacts or fingers used in positioning a silicon substrate or wafer during an electroplating process are plated with a metal layer to prevent oxidation of the contacts. Oxidation of the contacts may result in increased and varying resistance of the contacts and thus nonuniform plating of the silicon wafer and possibly even deplating of a seed layer. A 20 mA/cm.sup.2 current is applied to the contacts which are immersed in an electrolyte solution before loading a silicon wafer. A silicon wafer is then loaded into the electroplating process chamber containing the electrolyte solution. The preplating of the contacts enables the formation of a uniform metal layer on the silicon substrate. Additionally, voltage then may be applied to the contacts after unloading the silicon wafer to reduce oxidation.
    Type: Grant
    Filed: October 16, 1997
    Date of Patent: March 16, 1999
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Valery Dubin, Takeshi Nogami
  • Patent number: 5858557
    Abstract: A copper-tungsten or copper-molybdenum substrate is plated with a nickel/gold plating by first activating a surface of the substrate. In activating, the surface is contacted to a concentrated alkaline solution at elevated temperature, and then to a concentrated acidic solution. The surface is thereafter plated with a nickel strike layer, plated with a nickel primary layer overlying the nickel strike layer, sintered, re-activated in a concentrated acidic solution, plated with a nickel secondary layer overlying the nickel primary layer, and plated with a gold layer overlying the nickel secondary layer.
    Type: Grant
    Filed: October 14, 1997
    Date of Patent: January 12, 1999
    Inventors: Sunghee Yoon, William A. Reed
  • Patent number: 5849423
    Abstract: A method for manufacturing a zinciferous plated steel sheet, comprises: forming a zinciferous plating layer on a steel sheet; and forming an Fe--Ni--O film on the zinciferous plating layer. The Fe--Ni--O film is formed by carrying out electrolysis with the steel sheet as a cathode in an aqueous solution, dipping the steel sheet in an aqueous solution, or spraying a mist on a surface of the zinciferous plating layer.
    Type: Grant
    Filed: November 18, 1996
    Date of Patent: December 15, 1998
    Assignee: NKK Corporation
    Inventors: Takayuki Urakawa, Toru Imokawa, Michitaka Sakurai, Jun-ichi Inagaki, Masaaki Yamashita, Shuji Nomura
  • Patent number: 5849170
    Abstract: An improved process for the preparation of metallized ceramic substrates having a metal layer ranging from ten to two hundred microns in thickness, and having enhanced adhesion strength is provided. The process involves, in combination, a novel method for conditioning the ceramic substrate and the application of a thin intermediate layer of electrolessly and optionally, electrolytically, deposited metal prior to electrolytic metal deposition of an outer metallized layer.
    Type: Grant
    Filed: June 19, 1995
    Date of Patent: December 15, 1998
    Inventors: Stojan Djokic, Ross Lepard, Robert Roy
  • Patent number: 5833829
    Abstract: A method of producing a coating on a substrate by electrolytically co-depositing a metal matrix M.sub.1 and particles of CrAlM.sub.2, where M.sub.1 is Ni, Co or Fe or two or all of these elements and M.sub.2 is Y, Si, Ti, Hf, Ga, Nb, Mn, Pt, a rare earth element or two or more of these elements. The co-deposition is carried out at a current density of less than 5mA per square centimeter. Preferably, the co-deposition forms a layer less than 50 microns thick, and occurs at a bath loading of less than 40 grams per liter of the particles. In a preferred embodiment, the particle size distribution in the plating bath is 25 percent between 15 and 12 microns, 45 percent between 12 and 10 microns and 30 percent less than 10 microns. The method is particularly useful for coating a gas turbine part.
    Type: Grant
    Filed: July 16, 1996
    Date of Patent: November 10, 1998
    Assignee: Praxair S.T. Technology, Inc.
    Inventor: John Foster
  • Patent number: 5788824
    Abstract: The subject of the invention is a process for conditioning the copper or copper-alloy external surface of an element of a mold for the continuous casting of metals, of the type including a step of nickel plating of said surface and a step of nickel removal therefrom, wherein:a preparation of said surface, comprising in succession an operation of cleaning said bare surface, an operation of pickling said bare surface in an oxidizing acid medium and an operation of brightening said bare surface, is carried out;then, an operation of nickel plating of said bare surface is carried out by electroplating, by placing said element as the cathode in an electrolyte consisting of an aqueous nickel sulfamate solution containing from 60 to 100 g/l of nickel;then, after said element has been used, an operation of partially or completely removing the nickel from said surface electrolytically is carried out, by placing said element as the anode in an electrolyte consisting of an aqueous nickel sulfamate solution containing fro
    Type: Grant
    Filed: April 11, 1997
    Date of Patent: August 4, 1998
    Assignees: Usinor Sacilor (Societe Anonyme), Thyssen Stahl Aktiengesellschaft
    Inventors: Jean-Claude Catonne, Christian Allely, Remy Nicolle, Gerard Raisson
  • Patent number: 5750016
    Abstract: A process for electroplating palladium or a palladium alloy onto an iron-nickel alloy substrate, which comprises the steps of: i) electroplating a metal selected from the group consisting of copper, tin, a nickel-tin alloy and a copper-tin alloy onto the substrate to form a first primer layer; ii) electroplating nickel or a gold alloy onto the first primer layer to form a second primer layer; and iii) electroplating palladium or a palladium alloy onto the second primer layer to from a palladium or a palladium alloy electroplating layer.
    Type: Grant
    Filed: September 13, 1996
    Date of Patent: May 12, 1998
    Inventor: Sung-Soo Moon
  • Patent number: 5739692
    Abstract: A device for monitoring voltage and amperage on an article being electrocoated with a primer composition in an aqueous electrocoating bath which contains the following components: a sealed container for holding electrical components; a recording device positioned in the container for recording voltage and amperage; a voltage measuring circuit board positioned in the container and electrically connected to the recording device containing an electrical circuit for measuring; a first electrical probe positioned on the article being electrocoated and electrically connected to the circuit of the circuit board for measuring voltage and a second electrical probe for measuring amperage positioned on the article being electrocoated and electrically connected to the recording device; whereby as the article being electrocoated with a primer composition is passed through an aqueous electrocoating bath, measurements of voltage and amperage are being taken at set time intervals as the article is passing through electrocoat
    Type: Grant
    Filed: November 8, 1995
    Date of Patent: April 14, 1998
    Assignee: E. I. du Pont de Nemours and Company
    Inventor: Joseph John Subda, Jr.
  • Patent number: 5685968
    Abstract: In a ceramic substrate with a thin-film capacitor, having a ceramic substrate a lower electrode layer formed on the ceramic substrate, a dielectric layer formed on the lower electrode layer and made of an oxide of a material constituting the lower electrode layer, and an upper electrode layer formed on the dielectric layer, a plating layer is provided between the ceramic base and the lower electrode layer to serve as a basis for the lower electrode layer.
    Type: Grant
    Filed: October 11, 1995
    Date of Patent: November 11, 1997
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Toshitaka Hayakawa, Shinobu Yoshida, Toshikatsu Takada
  • Patent number: 5643434
    Abstract: Process for the electrolytic deposition of composite nickel onto the face of a part of a motor vehicle, in particular the bore of a casing or engine block of an internal combustion engine comprising at least three successive stages, the first being an electrochemical activation stage where the part is brought to anodic polarity in a bath containing a halogenated acid salt of nickel, the second being a stage of superactivation of the surface and the third being a stage of electrolytic deposition of a nickel layer containing particles of solid substances where the part is brought to cathodic polarity in a nickel-plating bath containing a charge of solid particles of which the diameter is advantageously between 0.5 and 5 microns and which can be of silicon carbide or any other hardening element, optionally mixed with particles of graphite.
    Type: Grant
    Filed: January 31, 1996
    Date of Patent: July 1, 1997
    Assignee: Aluminum Pechiney
    Inventors: Mohamed Benmalek, Marc Santarini
  • Patent number: 5584983
    Abstract: A method for the production of metal foam with high specific surface area is disclosed. A foam material which may be either conductive or nonconductive is provided. If the material is nonconductive, an electrically conductive covering layer is formed. The electrically conductive foam material is then electrolytically coated with nickel from a nickel plating bath. The bath includes at least one unsaturated organic second class brightener in an amount effective to promote preferential growth of nickel onto the foam material such that the value of the growth ratio R, defined by the total of the growth of metal onto the foam material in the direction of the preferential growth divided by the total of the growth of metal in a direction perpendicular to the direction of the preferential growth, is greater than one. The nickel plating may be carried out using pulse current. The bath liquid may be flowed through the openings of the foam substrate in one or more directions during the deposition.
    Type: Grant
    Filed: March 3, 1995
    Date of Patent: December 17, 1996
    Assignee: Stork Screens, B.V.
    Inventor: Wilhelmus A. Pruyn
  • Patent number: 5567296
    Abstract: A hollow container for storage and transport of fluid hydrocarbon vehicular fuels is composed of a laminated structure of polymeric resin body component and electrodeposited metal. An interior stratum of polymer chemically resistant to the fuel is joined to a stratum of electroplateable polymer disposed to the exterior of the interior stratum. The laminated polymeric structure is then electroplated to form a skin of metal encapsulating the interior polymeric strata. The tank combines the structural design flexibility of plastic with the metal barrier properties regarding evaporative emissions, permitting the use of high contents of oxygenated species in the fuel.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: October 22, 1996
    Inventor: Daniel Luch
  • Patent number: 5543029
    Abstract: There is provided a new method of improving properties of the surface of an internal combustion engine valve made from titanium alloy, which comprises; the steps of (a) forming a surface undercoat layer of nickel on a surface of the engine valve; (b) heating the resulting nickel undercoated valve in vacuum or in an atmosphere of inert gas, at the temperature of 450.degree. C. to 600.degree. C., for one to four hours; (c) forming further a three component coat layer comprising nickel, phosphorus and particles of material selected from the group consisting of silicone carbide, silicone nitride, boron nitride, and the combination thereof, on the surface of the nickel undercoat layer; and (d) heating the resulting coat layer formed on the nickel undercoat layer, at the temperature of 350.degree. C. to 550.degree. C., for one to four hours, so as to make the particles of ceramic material uniformly and homogeneously dispersed in said coat layer.
    Type: Grant
    Filed: November 30, 1995
    Date of Patent: August 6, 1996
    Assignee: Fuji Oozx Inc.
    Inventors: Takeji Kenmoku, Shinichi Umino, Eiji Hirai, Kazuyoshi Kurosawa, Yoshio Matsumura
  • Patent number: 5525203
    Abstract: In the described process of manufacturing a sliding surface bearing comprising a backing shell of steel, a bearing metal layer on the backing shell, and a copper-containing sliding surface layer, which has been electrodeposited over said bearing metal layer, the backing shell is provided throughout its rear surface, which constitutes the rear surface of the bearing, with a tin-containing corrosion-resisting layer after the sliding surface layer has been deposited. To prevent a separation of the corrosion-resisting layer, it is proposed that the rear surface of the bearing is covered with an electrodeposited nickel layer before the sliding surface layer is deposited on the bearing metal layer or on an intermediate layer of nickel provided on the bearing metal layer.
    Type: Grant
    Filed: December 19, 1994
    Date of Patent: June 11, 1996
    Assignee: Miba Gleitlager Aktiengesellschaft
    Inventors: Thomas Rumpf, Reinhold Weber
  • Patent number: 5484517
    Abstract: The invention comprises a method of forming a multi-element, thin hot film sensor on a polyimide film. The sensor is formed by first cleaning one surface of the polyimide. Then, under a continuous vacuum, the surface is simultaneously cleaned by ion bombardment while nickel is deposited by evaporation. The ion beam cleaning is discontinued and copper is then deposited to an initial thickness by evaporation without a break in the vacuum. The vacuum is then removed and a final thickness of copper is deposited by plating. Sensor patterns are then defined in the nickel and copper layers using conventional photolithography and etching techniques.
    Type: Grant
    Filed: March 8, 1994
    Date of Patent: January 16, 1996
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Purnell Hopson, Jr.
  • Patent number: 5466360
    Abstract: A method for preparing aluminum and aluminum alloys includes the step of simultaneously honing the surface of the aluminum or aluminum alloy in a zincating solution. The honing removes the aluminum oxide layer from the surface of the aluminum or aluminum alloy work piece while the zincating solution deposits a layer of zinc on its surface. The zincate-honing may be followed by electroplating.
    Type: Grant
    Filed: October 13, 1994
    Date of Patent: November 14, 1995
    Assignee: Robert Z. Reath
    Inventors: Robert F. Ehrsam, Robert Z. Reath
  • Patent number: 5464524
    Abstract: A plating method for a nickel-titanium alloy member is provided which comprises the steps of: subjecting a nickel-titanium alloy member to an anodic electrolyzing treatment and a cathodic electrolyzing treatment in succession by using an electrolyte containing hydrochloric acid as an essential component thereof, in particular, an electrolyte having a chloride ion concentration of 0.1 mol/l or more and a pH value of 2 or less, or an electrolyte having a chloride ion concentration of 0.4 mol/l or more, or still preferably, an electrolyte having a chlorine ion concentration of 0.3 mol/l or more and a pH value of 2 or less; strike plating the treated nickel-titanium alloy member with a desired metal; and electroplating the struck nickel-titanium alloy member with a desired metal. The adhesion between the nickel-titanium alloy member and a plating layer is very good.
    Type: Grant
    Filed: August 29, 1994
    Date of Patent: November 7, 1995
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Yoshiaki Ogiwara, Masaki Yasuhara, Akira Matsuda
  • Patent number: 5454929
    Abstract: A process for preparing a solderable lead frame from a copper base lead frame is disclosed using plating of tin or tin alloys followed by plating of palladium. Preferably, the tin plating is a spot plating to deposit tin only on the external leads and the palladium plating is a flood plating to deposit palladium over the entire lead frame. A diffusion barrier, preferably of cobalt or nickel, can be applied by plating the base lead frame before tin plating.
    Type: Grant
    Filed: June 16, 1994
    Date of Patent: October 3, 1995
    Assignee: National Semiconductor Corporation
    Inventor: David H. Kinghorn
  • Patent number: 5436082
    Abstract: A lead frame for a semiconductor device includes a base layer which is coated by a protective coating. The protective coating includes a layer of nickel, over which is coated a layer of copper. The layer of copper is coated by a layer of silver over which is coated a layer of palladium. Protective coatings constructed in this way are bondable, solderable, oxidation resistant, corrosion resistant, free of lead (Pb), resistant to high temperatures, cost effective, and cosmetically acceptable.
    Type: Grant
    Filed: December 27, 1993
    Date of Patent: July 25, 1995
    Assignee: National Semiconductor Corporation
    Inventor: Ranjan J. Mathew
  • Patent number: 5427676
    Abstract: Method of making a cast-to-size mold for molding class A finishes on molded plastic articles including the steps of filling any pores in the molding surface with a conductive thermosetting resin and thereafter electroplating the surface.
    Type: Grant
    Filed: August 10, 1993
    Date of Patent: June 27, 1995
    Assignee: General Motors Corporation
    Inventors: Edward M. Domanski, Edward F. Ryntz, Jr., Dexter D. Snyder
  • Patent number: 5389228
    Abstract: A method is taught for application of an abrasive tip to a gas turbine blade by brush plating, wherein particulate abrasive is applied to the tip of said blade and held in position during electroplating by a porous dielectric cloth.
    Type: Grant
    Filed: February 4, 1993
    Date of Patent: February 14, 1995
    Assignee: United Technologies Corporation
    Inventors: Kenneth C. Long, Brian A. Manty, Charles C. McComas
  • Patent number: 5380407
    Abstract: Facilitating the distinction among different spring steel products and at the same time improving their surface appearance and corrosion resistance by plating the surface of said different spring steel products before spring-forming with either alternate layers of Cu and Zn or alternate layers of Ni, Cu and Zn, the amount of Cu and Zn differing for steel products differing in size and/or material, to obtain color-developable spring steel products, drawing and taken coil spring-forming the resulting plated spring steel products, and low temperature annealing said resulting plated spring steel products to develop their colors, the colors being different for spring steel products differing in size and/or material, whereby mixing and erroneous assembly of spring steel products differing in size and/or material is prevented.
    Type: Grant
    Filed: October 21, 1993
    Date of Patent: January 10, 1995
    Assignee: Shinko Kosen Kogyo Kabushiki Kaisha
    Inventors: Yukio Yamaoka, Keiji Hattori, Masaru Kodama, Hirofumi Ueki
  • Patent number: 5374344
    Abstract: Disclosed is a multi-compartment electroplating tank and a process for using the tank to simultaneously plate dissimilar materials onto a substrate.
    Type: Grant
    Filed: July 27, 1993
    Date of Patent: December 20, 1994
    Assignee: International Business Machines, Inc.
    Inventors: Thomas P. Gall, James Wilcox
  • Patent number: 5364523
    Abstract: An apparatus and a method of surface-treating a half sliding bearing, the method comprising the steps of: preparing a tank which accommodates a surface-treatment solution and an anode of an alloy to be applied to the bearings as a surface treatment; successively and one by one introducing the bearings into the surface-treatment solution; performing the surface treatment in such a manner that the surface layer of the alloy is applied to the surface of the bearings by feeding an electricity between a cathode served by the bearing and the anode via the surface-treatment solution while moving, in the surface-treatment solution, the bearings being introduced into the surface-treatment solution in a state in which the bearings is brought into contact with one another; and successively and one by one drawing out the bearings, which have been applied with the surface treatment, from the tank.
    Type: Grant
    Filed: June 11, 1993
    Date of Patent: November 15, 1994
    Assignee: Daido Metal Company, Ltd.
    Inventors: Tadashi Tanaka, Masaaki Sakamoto, Motomu Wada, Takayoshi Sasaki, Masaki Tanimoto
  • Patent number: 5356526
    Abstract: A new metallization is described which is a composite of subsequent metal layers beginning with a layer of titanium and having in an ascending order the following composition: Ti--TiPd--Cu--Ni--Au. TiPd is an alloy of titanium and palladium containing from 0.3 to 14 weight percent Pd, by the weight of the alloy. The TiPd alloy is etchable in an aqueous HF solution containing from 0.5 to 2.0 and higher, preferably from 0.5 to 1.2 weight percent HF. The use of the TiPd alloy avoids the occurrence of Pd residues remaining after the etching of Ti layer and lift-off (rejection etching) of Pd layer in a prior art Ti--Pd--Cu--Ni--Au metallization. Ti and TiPd layers are present in a thickness ranging from 100 to 300 nm and from 50 to 300 nm, respectively, and in a total minimum thickness needed to maintain bonding characteristics of the metallization.
    Type: Grant
    Filed: October 20, 1993
    Date of Patent: October 18, 1994
    Assignee: AT&T Bell Laboratories
    Inventors: Robert P. Frankenthal, Ajibola O. Ibidunni, Dennis L. Krause
  • Patent number: 5348639
    Abstract: A surface treatment for a R-TM-X type of permanent magnet comprising the steps: Etching the magnet with nitric acid having a concentration of 0.2 to 10 vol %, then etching the magnet with a mixture of oxygenated water having a hydrogen peroxide concentration of 0.2 to 10 vol % and acetic acid having a concentration of 10-30 vol %, and next plating the magnet with a copper plating initially followed by a nickel plating. R represents an element or a mixture of rare earth elements, TM is mainly composed of iron and transition elements other than iron and X represents one or more of a mixture of elements to enhance the coercivity of the magnet. This improvement of the magnet material itself improves the corrosion resistance of the protective film on the magnet surface.
    Type: Grant
    Filed: August 6, 1991
    Date of Patent: September 20, 1994
    Assignee: Hitachi Magnetics Corporation
    Inventor: Katsuo Mitsuji
  • Patent number: 5332488
    Abstract: A magnetically anisotropic magnet substrate is coated with at least one layer of nickel plating followed by a chromate layer. The chromate top layer improves the corrosion resistance of the coated magnet substrate. In a preferred embodiment, the layer of nickel plating includes a first layer of a non-bright nickel plating followed by a second layer of a semi-bright nickel plating. One embodiment adds a copper under-layer below the nickel plating.
    Type: Grant
    Filed: March 1, 1993
    Date of Patent: July 26, 1994
    Assignee: Hitachi Magnetics Corporation
    Inventor: Katsuo Mitsuji
  • Patent number: 5326454
    Abstract: A method is disclosed for the production of highly diffusive or absorptive metal surfaces. A dendritic crystal structure surface layer of metal is electrodeposited on a substrate, using a bipolar pulse plating technique. This metal surface layer may then be oxidized to provide a highly anti-reflective surface.
    Type: Grant
    Filed: February 28, 1992
    Date of Patent: July 5, 1994
    Assignee: Martin Marietta Corporation
    Inventor: Darell E. Engelhaupt
  • Patent number: 5318688
    Abstract: Gases such as hydrogen/hydrocarbon may be separated by a separating membrane of a Group VIII noble metal on a deposit of non-noble Group VIII metal which is supported on a porous silver or a porous carbon body.
    Type: Grant
    Filed: March 5, 1993
    Date of Patent: June 7, 1994
    Assignee: Texaco Inc.
    Inventors: Mitri S. Najjar, Carl A. Hultman
  • Patent number: 5314606
    Abstract: A method of fabricating a leadless ceramic package having improved solderability characteristics. The ceramic packages are singulated from the package array before electroplating. This eliminates the damage which may occur to the plating layer during singulation, and permits plating of base metal exposed by singulation. Furthermore, the plating solution is not required to penetrate small-diameter castellation holes, which would often result in incomplete electroplating of the castellation surfaces.
    Type: Grant
    Filed: February 16, 1993
    Date of Patent: May 24, 1994
    Assignee: Kyocera America, Inc.
    Inventors: Taka Irie, Aki Nomura
  • Patent number: 5286366
    Abstract: A magnetically anisotropic magnet substrate is coated with a triple layer of nickel plating preferably followed by a chromate layer. The layer of nickel plating includes an inner layer of a non-bright nickel plating, followed by an intermediate nickel-strike layer, followed by an outer layer of a semi-bright nickel plating. The inner layer contains much less sulfur than the other two layers, whereby the resulting difference in electromotive force provides a localized battery that permits the outer layers to be sacrificed without permitting the inner layer to be destroyed. One embodiment adds a copper under-layer below the nickel plating.
    Type: Grant
    Filed: November 5, 1991
    Date of Patent: February 15, 1994
    Assignee: Hitachi Magnetic Corp.
    Inventor: Katsuo Mitsuji
  • Patent number: 5268235
    Abstract: A process for the production of a composition modulated alloy having a predetermined concentration is disclosed, in which alternating layers of at least two metals are successively deposited upon a substrate by electrodeposition, vacuum deposition, vapor deposition, or sputtering. The individual thicknesses of at least one metal's layers are varied in a predetermined manner. Pulsed galvanostatic electrodeposition using a tailored waveform is preferred. A copper-nickel concentration graded alloy is disclosed. Concentration graded alloys of predetermined concentration having at least one region of local homogeneity are also disclosed. The region of local homogeneity has a thickness corresponding to the thickness of two adjacent layers of different metals which have been diffusion annealed together. A pulsed electrodeposition/diffusion anneal process for production of such alloys is also disclosed.
    Type: Grant
    Filed: June 20, 1991
    Date of Patent: December 7, 1993
    Assignee: The United States of America as represented by the Secretary of Commerce
    Inventors: David S. Lashmore, Moshe P. Dariel
  • Patent number: 5246565
    Abstract: A process for applying copper to a substrate of aluminum or steel by electrodeposition and for preparing an aluminum or steel substrate for electrodeposition of copper. Practice of the invention provides good adhesion of the copper layer to the substrate.
    Type: Grant
    Filed: May 7, 1992
    Date of Patent: September 21, 1993
    Assignee: The United States of America as represented by the United States Department of Energy
    Inventor: Henry Nignardot
  • Patent number: 5171419
    Abstract: The present invention disclosed metal-coated fibers and metal matrix composites made therefrom comprising metal-coated carbon or graphite fiber which have a layer of CoW or NiW alloy interposed between the fiber and its outer metal layer.
    Type: Grant
    Filed: January 18, 1990
    Date of Patent: December 15, 1992
    Assignee: American Cyanamid Company
    Inventors: Nea S. Wheeler, David S. Lashmore
  • Patent number: 5151167
    Abstract: This invention overcomes problems such as pinholes and blisters in making plated coin blanks and similar articles. A ferrous metal blank is electroplated with a strike of nickel, following which a coating of copper is applied at an initial low current density followed by full current density to minimize bridging. The low current density may be about 1/6 to 1/4 of the full current density. Preferably an outer layer of nickel is applied, also at an initial low current density, followed by full current density. Annealing before or after application of the final layer of nickel is advisable. This invention also relates to the resulting coin blank and coins.
    Type: Grant
    Filed: December 4, 1991
    Date of Patent: September 29, 1992
    Assignee: Royal Canadian Mint
    Inventors: Hieu C. Truong, Maria Dilay
  • Patent number: 5078837
    Abstract: Engine components of steel or superalloy subject to wear from alternating friction at medium temperatures in the region of 700.degree. C. are provided with a protective wear-resistant coating bya) electrophoretic deposition of a metal-ceramic structure comprising a mixture of from 85% to 50% of metallic powder and from 15% to 59% of ceramic powder, the metallic powder being a cobalt-based superalloy of type KC 25 NW or of M Cr Al Y wherein M represents at least one metal chosen from the group consisting of Ni, Co and Fe with the possible addition of Ta, and the ceramic powder being an oxide such as Al.sub.2 O.sub.3 or Cr.sub.2 O.sub.3, a carbide such as SiC or Cr.sub.3 C.sub.2, a nitride such as BN or TiN, or a boride such as TiB.sub.2 ;b) electrolytic pre-nickeling said deposit in an electrolysis bath at a pH between 6 and 8, andc) electrolytic nickeling said pre-nickeled deposit in an acid bath of sulphamate type.
    Type: Grant
    Filed: March 22, 1991
    Date of Patent: January 7, 1992
    Assignee: Societe Nationale d'Etude et de Construction de Moteurs d'Aviation "S.N.E.C.M.A."
    Inventors: Martine Descamp, Yves C. Louis, Michel M. Ruimi