Abstract: A printed circuit board has a double-sided substrate with an insulation layer, a bonding member, a base layer of an aluminum material, and a circuit pattern; a second insulation layer; a second bonding member; a second base layer; a through hole; a zinc substitution layer; a plating layer; and a second circuit pattern.

Abstract: A busbar 10, for use in electrical distribution, is disclosed. The busbar 10 arranged to have an electrically conductive barrier 22 disposed about at least a first portion 20 of the busbar surface 13 for limiting the formation of an oxide layer on the busbar 10. In a further aspect of the present invention the busbar 10 is arranged to have an electrically insulating barrier 26 disposed about at least a second portion 24 of the busbar 10 surface 13 for limiting undesired electrical connection with the busbar 10. The present invention provides a pre-insulated busbar 10 which can be subsequently shaped or prepared without compromising the insulating barrier 26 or the conductive barrier 22. The present invention provides a busbar 10 having improved safety, speed of fitting, and handling characteristics.

Abstract: Methods of providing a corrosion-resistant plating on a steel bumper are provided. A galvanized zinc layer is deposited over a steel substrate. A plurality of nickel layers is deposited over the zinc layer. The plurality of zinc layers has at least a first porosity and a second porosity. A chrome layer is applied over the plurality of nickel layers. The porous nickel layer is immediately adjacent the chrome layer such that a stress applied to the chrome layer is distributed over the porous nickel layer. The porous nickel layer delocalizes a stress applied at an impact area to a dispersed area and the dispersed area is larger than the impact area.

Abstract: Improved compositions and processes for zincating magnesium and magnesium alloy substrates. An aqueous zincating composition having a pH of from about 8 to about 11 and including zinc ions, a complexing agent, fluoride ions and a reducing agent. A non-electrolytic process for zincating a magnesium or magnesium alloy substrate, including immersing the substrate in the non-electrolytic aqueous zincating composition for a time sufficient to deposit a zincate on the substrate. A non-electrolytic process for zincating a magnesium or magnesium alloy substrate, including preparing a aqueous non-electrolytic composition comprising zinc ions, a complexing agent, fluoride ions and a pH in the range from about 8 to about 11; adding to the composition an amount of a reducing agent sufficient to improve deposition of zincate on the magnesium or magnesium alloy substrate; and immersing the substrate in a composition for a time sufficient to deposit the zincate on the substrate.

Abstract: A method for electroplating a substrate having an aluminum alloy surface comprises: applying a zinc layer onto the aluminum alloy surface; electroplating a first copper layer onto the zinc layer from an alkaline copper electroplating solution; electroplating a second copper layer onto the first copper layer from an acid copper electroplating solution; electroplating a Cu—Sn alloy layer onto the second copper layer from a Cu—Sn electroplating solution; and electroplating a chromium layer onto the Cu—Sn alloy layer from a trivalent chromium solution. The alkaline copper electroplating solution is substantially free of cyanide ion.

Abstract: A method for manufacturing a metal-carrying carbonaceous material is provided. The method comprises immersing a carbonaceous material in a metal-containing aqueous solution under vacuum, with stirring, and/or in the presence of a polar solvent, and then thermally treating the immersed carbonaceous material at a temperature ranging from 120° C. up to a temperature not higher than the melting point of the involved metal under vacuum or in the presence of a protective gas. According to the method, the metal can be effectively carried on a carbonaceous material so as to enhance the applicability of the metal-carrying carbonaceous material.

Abstract: In one embodiment, a method for depositing a capping layer on a substrate surface containing a copper layer is provided which includes exposing the substrate surface to a zinc solution, exposing the substrate surface to a silver solution to form a silver layer thereon and depositing the capping layer on the silver layer by an electroless deposition process. A second silver layer may be formed on the capping layer, if desired. In another embodiment, a composition of a deposition solution useful for forming a cobalt tungsten alloy contains calcium tungstate, a cobalt source at a concentration within a range from about 50 mM to about 500 mM, a complexing agent at a concentration within a range from about 100 mM to about 700 mM, and a buffering agent at a concentration within a range from about 50 mM to about 500 mM.

Abstract: A method for applying a metal layer onto at least one surface of an aluminium or aluminium alloy workpiece, including the steps of pretreating the surface and applying the metal layer by plating, wherein the pretreating step includes a non-electrolytic treatment by immersion of the workpiece in a single acidic solution, preferably a sulphuric acid solution, having a temperature of at most 100° C. A brazed assembly comprising at least one component of an aluminium workpiece made by this method is also disclosed.

Abstract: An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble metals include palladium and platinum. Examples of semi-noble metals include cobalt, nickel, and tungsten. The catalytic layer may be deposited by electroless deposition, electroplating, or chemical vapor deposition. In one embodiment, the catalytic layer may be deposited in the feature to act as a barrier layer to a subsequently deposited conductive material. In another embodiment, the catalytic layer may be deposited over a barrier layer. In yet another embodiment, the catalytic layer may be deposited over a seed layer deposited over the barrier layer to act as a “patch” of any discontinuities in the seed layer. Once the catalytic layer has been deposited, a conductive material, such as copper, may be deposited over the catalytic layer.

Abstract: The invention provides a pretreatment process for electroplating aluminum parts or strip, in which the zincating solution is modified to improve the adhesion of the subsequent electroplate to the substrate. The aluminum part or strip, such as an aluminum coin blank or strip for coin blanks, is pretreated with an improved zincate solution which provides hydroxide ions in an amount in the range of 75-175 gpl, zinc ions in an amount in the range of 15-40 gpl, nickel ions in an amount in the range of 2-10 gpl and copper ions in an amount in the range of 1.5-5 gpl. The pretreatment process preferably includes a copper strike applied from a copper cyanide strike bath at a pH in the range of 8.5-11.0, using a current density in the range of 0.1-10 A/dm2. The pretreatment and electroplating steps are preferably conducted by barrel plating, in accordance with another aspect of the invention.

Abstract: The invention provides a surface-treated copper foil for producing printed wiring boards whose surface has,,been subjected to nodular treatment and anti-corrosion treatment, wherein the anti-corrosion treatment includes forming a-zinc-copper-tin ternary alloy anti-corrosive plating layer on a surface of the copper foil; forming an electrolytic chromate layer on the anti-corrosive plating layer; forming a silane-coupling-agent-adsorbed layer on the electrolytic chromate layer; and drying the copper foil for 2-6 seconds such that the copper foil reaches 105° C.-200° C.

Abstract: The invention provides a surface-treated copper foil for producing printed wiring boards whose surface has been subjected to nodular treatment and anti-corrosion treatments, wherein the anti-corrosion treatment includes forming a zinc-copper-nickel ternary alloy anti-corrosive plating layer on a surface of the copper foil; forming an electrolytic chromate layer on the anti-corrosive plating layer; forming a silane-coupling-agent-absorbed layer on the electrolytic chromate layer; and drying the copper foil for 2-6 seconds such that the copper foil reaches 105° C.-200° C.

Abstract: Disclosed is a method of manufacturing an assembly of components joined by brazing, comprising the steps of: (i) forming the components of which at least one is made from a multi-layered brazing sheet product, the multi-layered brazing sheet product comprising a core sheet (a) having on at least one surface of the core sheet an aluminium clad layer (b), the aluminium clad layer being made of an aluminium alloy comprising silicon in an amount in the range of 2 to 18% by weight, a layer (c) comprising nickel on the outer surface of the aluminium clad layer, and a layer (d) comprising zinc or tin as a bonding layer between the outer surface of the aluminium clad layer and the layer comprising nickel; (ii) forming at least one other component of a metal dissimilar to the core sheet of the multi-layered brazing sheet product and selected from the group consisting of titanium, plated titanium, coated titanium, bronze, brass, stainless steel, plated stainless steel, coated stainless steel, low-carbon steel, plated

Abstract: A brazing sheet product having a core sheet (1) made of an aluminium alloy, having one or both of the surfaces of the core sheet clad with an aluminium clad layer (2), and a layer (3) comprising nickel on the outersurface of one or both the aluminium clad layer or layers (2). There is a layer (4) comprising zinc or tin as a bonding layer between the outersurface of the aluminium clad layer or layers (2) and the layer (3) comprising nickel. The aluminium clad alloy layer comprises, in weight percent: Si 2 to 18, Mg up to 8.0, Zn up to 5.0, Cu up to 5.0, Mn up to 0.30, In up to 0.30, Fe up to 0.80, Sr up to 0.20, at least one element selected from the group consisting of: Bi 0.01 to 1.0, Pb 0.01 to 1.0, Li 0.01 to 1.0, Sb 0.01 to 1.0, impurities each up to 0.05, total up to 0.20; and balance aluminium.

Abstract: A brazing sheet product and a method of manufacturing a brazing sheet product in which a layer comprising nickel is plated onto a surface of a clad layer made of an aluminium-silicon alloy containing silicon in the range of 2 to 18 weight %, wherein the surface is pre-treated by application of a bonding layer comprising zinc or tin. The application of the bonding layer may be by a zincate or a stannate treatment. The use of lead to promote wetting during brazing can be reduced or avoided, or other elements such as bismuth can be used.

Abstract: A process for plating aluminum alloy substrates (10), such as 390 aluminum alloy pistons (12), with iron comprises (a) plating on the aluminum substrate a layer of zincate from a zincate bath; (b) plating on the zincate layer a layer (14) of nickel from an electroless nickel bath; (c) plating on the nickel layer a layer (16) of iron from an iron ammonium sulfate bath; and (d) plating on the iron layer a layer (18) of tin from an alkaline tin bath. During the electroless plating, the zincate layer, which protects the underlying aluminum against oxidation, is sacrificed. All of these baths are environmentally much safer than cyanide and chloride. They are also cost effective and can be utilized in a totally closed loop plating system.

Abstract: A method of preparing a hard disc comprising steps of:immersing an aluminum or aluminum alloy substrate in a zincate solution containing a zinc compound, an alkali hydroxide, and at least one amine to thereby form a zincate film on the surface of the substrate,immersing the zincate film-formed substrate in an electroless nickel plating solution comprising a water-soluble nickel salt, a complexing agent, and a hypophosphite to thereby form a nickel--phosphorus alloy layer on the surface of the zincate film-coated substrate, and forming a magnetic layer on the nickel--phosphorus alloy layer.

Abstract: A metal plate for electromagnetic heating is disclosed which includes a substrate comprising aluminum or aluminum alloys, an intermediate layer formed on at least a portion of one surface of the substrate and comprising zinc or zinc alloys and a conductive layer formed on the intermediate layer for serving as a heat generating body when eddy current induced by high-frequency magnetic flux flows therethrough. Methods of manufacturing a metal plate for electromagnetic heating and a metallic mold for electromagnetic heating are also disclosed.

Abstract: A method for producing a zinc-electroplated steel sheet comprising the steps of: pickling a steel sheet with a pickling solution so as to deposit a tin of an amount of 0.5 mg/m.sup.2 to less than 10 mg/m.sup.2 on the steel sheet; and zinc-electroplating the pickled steel sheet.

Abstract: A machine part comprises: a base part formed of a titanium alloy or an aluminum alloy and having a roughened surface of Ra 0.5 .mu.m or above and PPI.sub.50 or above; and a Ni--P electrodeposit layer formed over the surface of the base part by an electroplating process using a Ni--P plating bath containing a stress relaxing agent, and having a stress of 20 kgf/mm.sup.2 or below. The machine part has a small specific gravity, excellent seizure resistance, wear resistance and fatigue strength.

Abstract: A method for preparing aluminum and aluminum alloys includes the step of simultaneously honing the surface of the aluminum or aluminum alloy in a zincating solution. The honing removes the aluminum oxide layer from the surface of the aluminum or aluminum alloy work piece while the zincating solution deposits a layer of zinc on its surface. The zincate-honing may be followed by electroplating.

Abstract: A process for through-hole plating of two-layer circuit boards and multilayers using polythiophenes as a conductive agent on the side walls of through-holes for the direct through-hole plating and to the circuit boards and multilayers thus produced.

Abstract: A process for applying copper to a substrate of aluminum or steel by electrodeposition and for preparing an aluminum or steel substrate for electrodeposition of copper. Practice of the invention provides good adhesion of the copper layer to the substrate.