Abstract: Methods for making layered materials and layered materials including high atomic number metals and metal alloys adhered to surfaces are provided. Such surfaces may be oxygen or hydroxyl rich surfaces. Certain methods include depositing a tie down layer of a first metal or metal alloy particles onto a first surface of base material and depositing a high atomic number metal or metal alloy layer onto the first surface after depositing the tie down layer, wherein particles comprising the high atomic number metal or metal alloy layer have a higher atomic number than the first metal or metal alloy particles.

Abstract: A method for fabricating a lamination structure of a second-generation high-temperature superconducting (2G-HTS) tape is provided. Suitable lamination tapes are selected and subjected to local oxidation on side to form a locally oxidized region having a target pattern. The lamination tapes and a to-be-laminated 2G-HTS tape are sequentially arranged, where the locally-oxidized side of each of the lamination tapes faces toward the 2G-HTS tape. The lamination tapes and the to-be-laminated 2G-HTS tape are simultaneously immersed in a molten solder pool, and subjected to reel-to-reel squeezing lamination to form the desired lamination structure. A lamination structure fabricated by the method is also provided.

Abstract: A method for manufacturing a circuit board with narrow conductive traces and narrow spaces between traces includes a base layer and two first wiring layers disposed on opposite surfaces of the base layer. Each first wiring layer includes a first bottom wiring and a first electroplated copper wiring. The first bottom wiring is formed on the base layer. The first bottom wiring includes a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end. The first electroplated copper wiring covers the second end and the first sidewall of the first bottom wiring.

Abstract: A multi-layer ceramic electronic component includes a ceramic body and an external electrode. The ceramic body includes a plurality of internal electrodes laminated in one axial direction, and an end surface extending along a plane parallel to the axial direction, at least part of the plurality of internal electrode being drawn from the end surface. The external electrode covers the end surface of the ceramic body. In a thermal desorption spectrum of water of the multi-layer ceramic electronic component by thermal desorption spectroscopy, a ratio P1/P2 of a detection intensity P1 of a first peak in a range of 200° C. to 300° C. to a detection intensity P2 of a second peak in a range of 550° C. to 800° C. is equal to or lower than 11.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer, and a first internal electrode and a second internal electrode disposed to be alternately stacked with the dielectric layer interposed therebetween; a first external electrode including a first electrode layer, a first conductive layer, and a first metal layer; a second external electrode including a second electrode layer, a second conductive layer, and a second metal layer; and a protective layer disposed on the ceramic body, the first electrode layer, and the second electrode layer, wherein a sum of through areas of the through portions disposed on the first electrode layer and the second electrode layer among the protective layers may be 50% or more of a sum of surface areas of the first electrode layer and the second electrode layer.

Abstract: The present disclosure provides a semiconductor structure including a substrate; a redistribution layer (RDL) disposed over the substrate, and including a dielectric layer over the substrate, a conductive plug extending within the dielectric layer, and a bonding pad adjacent to the conductive plug and surrounded by the dielectric layer; and a conductive bump disposed over the conductive plug, wherein the bonding pad is at least partially in contact with the conductive plug and the conductive bump. Further, a method of manufacturing the semiconductor structure is also provided.

Abstract: An electrochemical additive manufacturing method includes positioning a build plate into an electrolyte solution. The conductive layer comprises at least one conductive-layer segment forming a pattern corresponding with a component. The method further comprises connecting the at least one conductive-layer segment and one or more deposition anodes to a power source. The one or more deposition anodes correspond with at least a portion of the pattern formed by the at least one conductive-layer segment. The method additionally comprises transmitting electrical energy from the power source through the one or more deposition anodes of the plurality of deposition anodes corresponding with the at least the portion of the pattern formed by the at least one conductive-layer segment, through the electrolyte solution, and to the at least one conductive-layer segment, such that material is deposited onto the at least one conductive-layer segment and forms at least a portion of the component.

Abstract: An article for high temperature service is presented. The article includes a substrate and a thermal barrier coating disposed on the substrate. The thermal barrier coating includes a plurality of aluminum-based particles dispersed in an inorganic binder, wherein the aluminum-based particles are substantially spaced apart from each other via the inorganic binder such that the thermal barrier coating is substantially electrically and thermally insulating. Method of making the article is also presented.

Abstract: The present disclosure provides a method for manufacturing a semiconductor structure. The method includes providing a substrate having a redistribution layer (RDL); disposing an etch stop layer over a RDL; patterning the dielectric layer and the etch stop layer; disposing a first seed layer over the etch stop layer and a portion of the dielectric layer that is exposed through the etch stop layer; disposing a second patterned photoresist over the first seed layer; disposing a conductive material over a portion of the first seed layer that is exposed through the second patterned photoresist; removing the second patterned photoresist; removing the etch stop layer; and removing a portion of the conductive material that protrudes from the dielectric layer to form a bonding pad adjacent to the conductive plug and surrounded by the dielectric layer.

Abstract: In some aspects, this disclosure relates to improved Z-grade materials, such as those used for shielding, systems incorporating such materials, and processes for making such Z-grade materials. In some examples, the Z-grade material includes a diffusion zone including mixed metallic alloy material with both a high atomic number material and a lower atomic number material. In certain examples, a process for making Z-grade material includes combining a high atomic number material and a low atomic number material, and bonding the high atomic number material and the low atomic number together using diffusion bonding. The processes may include vacuum pressing material at an elevated temperature, such as a temperature near a softening or melting point of the low atomic number material. In another aspect, systems such as a vault or an electronic enclosure are disclosed, where one or more surfaces of Z-grade material make up part or all of the vault/enclosure.

Abstract: A sealing structure including: a set of base members forming a sealed space; a through-hole which is formed in at least one of the base members, and communicates with the sealed space; and a sealing member that seals the through-hole. An underlying metal film including a bulk-like metal such as gold is provided on a surface of the base member provided with the through-hole. The sealing member seals the through-hole while being bonded to the underlying metal film, and includes: a sealing material which is bonded to the underlying metal film, and includes a compressed product of a metal powder of gold or the like, the metal powder having a purity of 99.9% by mass or more; and a lid-like metal film which is bonded to the sealing material, and includes a bulk-like metal such as gold. Further, the sealing material includes: an outer periphery-side densified region being in contact with an underlying metal film; and a center-side porous region being in contact with the through-hole.

Abstract: A method for manufacturing a vehicle wheel of the present invention includes a step of performing an edge treatment including deburring of a spoke edge generated by lathe processing. For the edge treatment, a cutting tool as hale type tool for non-rotational processing is used, and the cutting tool is provided with a processing blade having a recessed blade edge having an R shape or polygonal C shape protruding from an outer peripheral surface on a side of a tip end of the rod-shaped cutting tool connected to a rod-shaped shank portion. A processing machine capable of CNC of four or more axes is used. With the cutting tool standing upright against a disc surface, the blade edge of the processing blade is applied to the spoke edge, and the cutting tool is continuously moved relative to the spoke edge along a ridgeline of the spoke edge for scraping.

Abstract: A portable biosensor for detecting and quantifying a target molecule in a biological sample and method of use include a biosensor fabricated with a recognition layer with an imprinted polymer, an electrode electrically coupled to the recognition layer, and a logic circuit that may include a processor and non-transitory memory with computer executable instructions embedded thereon, wherein the imprinted polymer is shaped to have a profile that substantially matches a profile of the target molecule, such that the target molecule can form-fit and bind to the imprinted polymer, thus changing an electrical property of the polymer layer that may be detected to identify the presence of the target molecule.

Abstract: A seeded substrate is first prepared. The seeded substrate includes an insulation substrate having a main surface composed of a first region and a second region other than the first region, and a conductive seed layer provided on the first region. Subsequently, a conductive layer is formed on at least the second region to obtain a first treated substrate. An insulation layer is then formed on the first treated substrate. The seed layer is then exposed. A metal layer is then formed on the surface of the seed layer. Here, a voltage is applied between the anode and the seed layer while a solid electrolyte membrane containing a metal ion-containing solution being disposed between the second treated substrate and the anode, and the solid electrolyte membrane and the seed layer being pressed into contact with each other. Thereafter, the insulation layer and the conductive layer are removed.

Abstract: An abrasive coating for a substrate of a component in a gas path exposed to a maximum temperature of 500 degree Fahrenheit, comprising: a plurality of grit particles adapted to be placed on a top surface of the substrate; a matrix material bonded to the top surface; the matrix material partially surrounds the grit particles, wherein the grit particles extend above the matrix material relative to the top surface; and a film of oxidant resistant coating applied over the plurality of grit particles and the matrix material.

Abstract: Processes for the liberation of oxygen and hydrogen from water are provided allowing for mass scale production using abundant sources of catalyst materials. A metal oxide based anode is formed by the simple oxidation of metal in air by heating the metal for a specified time period. The resultant anode is then contacted with water and subjected to a voltage from an external source or driven by electromagnetic energy to produce oxygen at the surface of the anode by oxidation of water. These processes provide efficient and stable oxygen or hydrogen production.

Abstract: A process for efficiently producing a wiring board in which an insulating substrate 1 having a through hole 2 is used, which includes forming a seed layer 3 on one surface of the insulating substrate 1, covering the surface of the insulating substrate 1 on which the seed layer 3 is formed with a masking film 4, arranging the insulating substrate 1 and a positive electrode 5 so that the surface of the insulating substrate 1 opposite to the surface of the insulating substrate 1 on which the seed layer 3 of the insulating substrate 1 is formed is faced to the positive electrode 5, carrying out electroplating to form a metal layer 8 in the through hole 2, and then removing the masking film 4.

Abstract: A cleaning solution composition includes an organic solvent in which a metal fluoride does not dissolve, at least one fluoride compound that generates bifluoride (HF2?), and deionized water, wherein the deionized water may be included in a concentration of 1.5 wt % or lower based on the total weight of the cleaning solution composition.

Abstract: A nanosensor and methods to manufacture are disclosed. For example, a detection system for detecting the presence of a target substance can include a nanosensor that includes a sensing layer, and a plurality of sockets embedded within the body of the sensing layer, each socket having a physical profile matching a shape of the target substance such that, when target substances occupy the sockets, at least one measurable physical characteristic of the sensing layer changes.

Abstract: This process for manufacturing an electrically conductive member for an electronic component comprises the following steps: providing a structure comprising at least one blind hole having a bottom and at least one internal lateral flank connected to said bottom via a base of said lateral flank; forming the member, this forming step comprising a step of growing an electrically conductive material in order to form at least one portion of the member in the blind hole, said growth being faster at the base of the lateral flank of the blind hole than on the rest of said lateral flank, said member when formed comprising a cavity arranged at that end of said member which is located opposite the bottom of the blind hole, said cavity being entirely or partially bordered by a rim.

Abstract: A multilayer ceramic capacitor and method of creating are provided. The capacitor includes a plurality of interior plates having edges that are brought to and exposed upon a first surface and also upon a portion of a second surface of the capacitor at a region where the second surface meets the first surface. An electroplated terminal is directly in contact with and mechanically and electrically connected to an edge of each of the interior plates where each plate's edge is exposed upon the first surface. The terminal wraps over the region of the capacitor from the first surface onto the portion of the second surface and is directly in contact with and mechanically and electrically connected to an edge of each of the interior plates where each plate's edge is exposed upon the second surface. The terminal does not extend to any additional surfaces which meet the first surface.

Abstract: A composite dual blackened copper foil includes a copper foil and two blackened layers. The copper foil has a shiny side and a matte side. The blackened layers are formed on the shiny and matte sides respectively. The blackened layers are formed alloy by electroplating in a plating bath consisting essentially of copper, cobalt, nickel, manganese, magnesium and sodium ions. A rough layer is selectively formed between the blackened layer and the shiny side as well as the matte side. Both side of the copper foil is spotless, powder free, and good in etching quality. The copper foil is effective at blocking electromagnetic wave, near infrared, undesired light and the like. The copper foil exhibits strong light absorption and is applicable to direct gas laser drilling. A method of manufacturing the composite dual blackened copper foil is also provided.

Abstract: An object of the present invention is to improve the laser drilling performance of a copper clad laminate whose black-oxide treated surface is used as a laser drilled surface. To achieve the object, a copper foil provided with a carrier foil comprising a layer structure of the carrier foil/the releasing layer/the bulk copper layer characterized in that metal element-containing particles are disposed between the releasing layer and the bulk copper layer is employed. If the present copper foil provided with a carrier foil is used, a black-oxide treated layer having a color tone excellent in the laser drilling performance can be formed on the surface of the bulk copper layer in the copper clad laminate manufactured.

Abstract: A printed circuit board includes an insulating layer; a metal pad formed on the insulating layer; a surface treatment layer formed on the metal pad; a solder layer formed on the surface treatment layer and the insulating layer; and an intermetallic compound layer formed between the solder layer and the surface treatment layer. Further, a printed circuit board may include an insulating layer; a metal seed layer formed on the insulating layer; a metal pad formed on the metal seed layer; a surface treatment layer formed on the metal pad and the metal seed layer; a solder layer formed on the surface treatment layer of the metal pad and the surface treatment layer of the metal seed layer; and an intermetallic compound layer formed between the solder layer and the surface treatment layer.

Abstract: A method of manufacturing a printed circuit board precursor includes the steps of providing a substrate. Then the surface of the substrate is catalyzed to form a catalytic layer by a catalyst. Subsequently, a conductive layer is formed and attached to the surface of the catalytic layer. Finally, a metal layer is electroplated on the conductive layer. A printed circuit board precursor includes a substrate having a surface. Specifically, the surface is catalytically treated to form a catalytic layer. The precursor also includes a conductive layer which is attached to and covers the catalytic layer and a metal layer which is disposed on the conductive layer.

Abstract: A component comprises a non-metallic core having an outer surface, a first catalyst deposited onto at least a first portion of the outer surface of the non-metallic core, a second catalyst deposited onto at least a second portion of the outer surface of the non-metallic core, an electrical interface, and a metallic coating. The electrical interface is plated onto the first catalyst, and includes a first interface layer electroless plated onto the first catalyst. The metallic coating is plated onto the second catalyst.

Abstract: The method relates to a method for producing electrically conductive structures on electrically non-conductive substrates and to a method for the electrochemical deposition of metals on substrates, which is suitable in particular for producing metallic structures and/or electroplated plastics. The invention further relates to products obtainable in this way and to the use thereof.

Abstract: Methods of providing a corrosion-resistant plating on a steel bumper are provided. A galvanized zinc layer is deposited over a steel substrate. A plurality of nickel layers is deposited over the zinc layer. The plurality of zinc layers has at least a first porosity and a second porosity. A chrome layer is applied over the plurality of nickel layers. The porous nickel layer is immediately adjacent the chrome layer such that a stress applied to the chrome layer is distributed over the porous nickel layer. The porous nickel layer delocalizes a stress applied at an impact area to a dispersed area and the dispersed area is larger than the impact area.

Abstract: A method of metalizing a surface of an insulation substrate includes: applying an ink composition onto the surface to form an ink layer; subjecting the insulation substrate to heat treatment at a temperature of about 500 to 1000 degrees Celsius in a non-reactive atmosphere; plating a metal layer on the ink layer. The ink composition comprises a metal compound and an ink vehicle. The metal compound includes at least one selected from a group consisting of a nano-copper oxide, a nano-cuprous oxide, a compound of formula I, and a compound of formula II, TiO2-? (I), M1M2pOq (II), 0.05??<1.8, where, M1 is at least one element selected from a group consisting of groups 2, 9-12 of the periodic table, M2 is at least one element selected from a group consisting of groups 3-8, 10 and 13 of the periodic table, 0<p?2, and 0<q<4.

Abstract: An electron emission device and a method of manufacturing the same are provided. The electron emission device includes: i) a substrate including a metal tip; ii) carbon nano tubes that are positioned on the metal tip; and iii) a lithium layer that is positioned on the carbon nano tubes.

Abstract: The invention relates to carbon nanotube-containing composites as biosensors to detect the presence of target clinical markers, methods of their preparation and uses in the medical field. The invention is particularly suitable for the detection in patient biological specimens of bone markers and tissue markers. The biosensors of the invention include carbon nanotubes deposited on a substrate, gold nanoparticles deposited on the carbon nanotubes and, binder material and biomolecule deposited on the gold-coated carbon nanotubes. The biomolecule is selected to interact with the target clinical markers. The biosensor can be used as an in-situ or an ex-situ device to detect and measure the presence of the target clinical markers.

Abstract: A method of manufacturing electrodes for a flat heat generator is provided for creating electrodes in an arbitrary shape on an arbitrary site of an arbitrarily shaped flat heat generator, to allow a required portion to generate heat, and to allow a heat source to move. The method includes the steps of forming a negative film for ultraviolet exposure masking from a master which has a set of electrodes for the flat heat generator designed in an arbitrary shape and at an arbitrary site, forming a thin-film member including an uncured portion of epoxy film, by irradiating the thin-film member with ultraviolet rays through masking of the negative film, dissolving the uncured portion of epoxy resin with a developing solution to form the set of electrodes, and depositing a metal on the set of electrodes through an ionization reaction within an electrolytic solution bath to from an electrodes.

Abstract: A method for electroplating aluminum metal on a magnesium alloy includes providing an Lewis acidic ionic liquid having dissolved species of an aluminum metal salt; pre-treating a surface of the magnesium alloy including subjecting the surface of the magnesium alloy to a reverse current etching in the ionic liquid; electroplating the aluminum metal on the surface using the ionic liquid as the electrolyte; and subjecting the surface of the magnesium alloy to a post-treatment including neutralization rinsing in a rinsing solvent solution.

Abstract: The invention relates to a composition and a process for the deposition of conductive polymers on dielectric substrates. In particular, the invention relates to a composition for the formation of electrically conductive polymers on the surface of a dielectric substrate, the composition comprising at least one polymerizable monomer which is capable to form a conductive polymer, an emulsifier and an acid, characterized in that the composition comprises at least one metal-ion selected from the group consisting of lithium-ions, sodium-ions, aluminum-ions, beryllium-ions, bismuth-ions, boron-ions, indium-ions and alkyl imidazolium-ions.

Abstract: A metal covered polyimide composite comprising a tie-coat layer and a metal seed layer formed on a surface of a polyimide film by electroless plating or a drying method is provided. A copper layer or a copper alloy layer is formed thereon by electroplating. The copper plated layer or copper alloy plated layer includes three layers to one layer of the copper layer or copper alloy layer. The metal covered polyimide composite effectively prevents peeling in a non-adhesive flexible laminate (especially a two-layer flexible laminate), and more particularly, effectively inhibits peeling from the interface of a copper layer and tin plating. A method of producing the composite and apparatus for producing the composite are also provided.

Abstract: A method comprising: dispersing carbon nanotubes in a solvent; and depositing the carbon nanotubes on a porous, conductive substrate; wherein the porous, conductive substrate is capable of functioning as a filter and a working electrode. The method of claim 1 further comprising: engaging the porous, conductive substrate with deposited carbon nanotubes in an electrochemical cell; and depositing at least one metallic structure on the surface of the carbon nanotubes from an electrolyte solution to form metallized carbon nanotubes. A composite comprising: metallized carbon nanotubes generated by the method of claim 2; wherein the at least one metallic structure comprises a conductive metal atom selected from the group consisting of platinum, gold nickel, copper, iron, chromium, zinc, and combinations thereof; and a matrix material selected from the group consisting of epoxies, thermosets, thermoplastics, elastomers, metals, metal matrix composites, ceramics and combinations thereof.

Abstract: A manufacturing method of a composite cloth has steps of: preparing a work-in-process composite cloth, surface treating the work-in-process composite cloth, and coating the work-in-process composite cloth with a non-shielding metallized layer. In the step of preparing a work-in-process composite cloth, a work-in-process composite cloth allowing electromagnetic waves to pass through is prepared. In the step of surface treating the work-in-process composite cloth, a surface of the work-in-process composite cloth is coupling-processed, and then is dried. In the step of coating the work-in-process composite cloth with a non-shielding metallized layer, the surface of the work-in-process composite cloth is coated with a non-shielding metallized layer whose thickness ranges from 10 ? (angstrom) to 100 ? (angstrom). Accordingly, a boring step and a patching step are spared.

Abstract: Epoxy resin compositions, which comprise (A) en epoxy resin having two or more epoxy groups in a molecule; (B) a phenol type curing agent where an average hydroxyl group content in a molecule (a mean value of (the total number of hydroxyl groups)/(the total number of benzene rings)), P, satisfies the equation 0<P<1; (C) a phenoxy resin; and (D) rubber particles, are suitable for use as an insulating layer of a multi-layered printed board in which, in spite of the fact that the roughness of a roughened surface after a roughening treatment is relatively small, an insulating layer having a good tight adhesion with a conductor layer formed by plating is able to be easily introduced into a multi-layered printed board.

Abstract: Disclosed herein is a method for removing a seed layer in manufacturing a printed circuit board, the method including: forming a photo resist layer on a printed circuit board having a seed layer formed on a surface thereof; removing the photo resist layer according to a predetermined pattern; forming a plating layer for a circuit on the predetermined pattern from which the photo resist layer is removed; exposing the seed layer by removing the photo resist layer around the plating layer; forming a corrosion layer on surfaces of the seed layer and the plating layer by performing a chemical reaction of the substrate from which the seed layer is exposed in a reactor in which a predetermined gas is filled; and removing the seed layer by irradiating a laser on the corrosion layer to remove the corrosion layer.

Abstract: A method for fabricating one-dimensional metallic nanostructures comprises steps: sputtering a conductive film on a flexible substrate to form a conductive substrate; placing the conductive substrate in an electrolytic solution, and undertaking electrochemical deposition to form one-dimensional metallic nanostructures corresponding to the conductive film on the conductive substrate. The method fabricates high-surface-area one-dimensional metallic nanostructures on a flexible substrate, exempted from the high price of the photolithographic method, the complicated process of the hard template method, the varied characteristic and non-uniform coating of the seed-mediated growth method.

Abstract: Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a core reinforcement having stiffness; insulating layers formed on both surfaces of the core reinforcement; a through hole formed by penetrating through the insulating layer and the core reinforcement; and a circuit layer formed on the insulating layer and a plating layer formed in the through hole for implementing inter-layer connection of the circuit layers.

Abstract: A process to form devices may include forming a seed layer on and/or over a substrate, modifying a seed layer selectively, forming an image-wise mold layer on and/or over a substrate and/or electrodepositing a first material on and/or over an exposed conductive area. A process may include selectively applying a temporary patterned passivation layer on a conductive substrate, selectively forming an image-wise mold layer on and/or over a substrate, forming a first material on and/or over at least one of the exposed conductive areas and/or removing a temporary patterned passivation layer. A process may include forming a sacrificial image-wise mold layer on a substrate layer, selectively placing one or more first materials in one or more exposed portions of a substrate layer, forming one or more second materials on and/or over a substrate layer and/or removing a portion of a sacrificial image-wise mold layer.

Abstract: The invention relates to a layered composite material for sliding elements, comprising a base layer, applied to the surface of a sliding element, made of an alloy comprising copper or aluminum and a sliding layer situated over said layer, wherein the sliding layer comprises 90.99.6 wt % of tin or tin alloy having a tin ratio of greater than 60 wt % and 0.2-6 wt % solid lubricant particles having a Mohs hardness of ?3 and a particle size of ?10 ?m. The invention further relates to the production of said layered composite material and to use thereof for sliding bearings.

Abstract: A metal article comprises an alloy substrate having a surface and a non-diffused metal monolayer disposed thereon. The surface has a first surface work function value ?s. The non-diffused monolayer deposited on the surface has a second surface work function value ?s that is less negative than the first surface work function value. A method for depositing the monolayer via underpotential deposition (UPD) is also disclosed.

Abstract: Provided is a metal covered polyimide composite comprising a tie-coat layer and a metal seed layer formed on a surface of a polyimide film by electroless plating or a drying method, and a copper layer or a copper alloy layer formed thereon by electroplating, wherein the copper plated layer or copper alloy plated layer comprises three layers to one layer of the copper layer or copper alloy layer, and there is a concentrated portion of impurities at the boundary of the copper layer or copper alloy layer when the copper layer or copper alloy layer is three layers to two layers, and there is no concentrated portion of impurities when the copper layer or copper alloy layer is a single layer. Additionally provided are a method of producing the composite and a method of producing an electronic circuit board.

Abstract: A heat dissipation substrate including a metal substrate, a metal layer, an insulating material layer and a patterned conductive layer is provided. The metal layer is disposed on the metal substrate and entirely covers the metal substrate. The metal layer has a first metal block and a second metal block surrounding the first metal block. A thickness of the first metal block is greater than a thickness of the second metal block. The insulating material layer is disposed on the second metal block. The patterned conductive layer is disposed on the insulating material layer and on the first metal block.

Abstract: A gimbal assembly of a single or dual stage actuator is provided with gold at a tongue/dimple interface where a dimple of a supporting loadbeam contacts a tongue on the gimbal assembly. Using gold at the tongue/dimple interface greatly reduces the amount of wear particles formed during assembly and operation of the microactuator. The tongue may include a gold coating on the tongue at the tongue/dimple interface, or the tongue may have a hole etched in a stainless steel layer at the tongue/dimple interface to expose a gold layer disposed below the stainless steel layer. The tongue portion of the tongue/dimple interface may also be formed from a gold-coated copper pad with a polymer coating over the gold.

Abstract: A capacitor with an anode, a dielectric on the anode and a cathode on the dielectric. A blocking layer is on the cathode. A metal filled layer is on said blocking layer and a plated layer is on the metal filled layer.

Abstract: Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on top and bottom sides of a monolithic structure can facilitate the formation of wrap-around plated terminations.

Abstract: The present invention provides a method for continuously producing flexible copper clad laminates, which comprises a step of performing continuous copper plating after the steps or step of performing continuous ion implantation and/or plasma deposition on the surface of an organic macromolecular polymer film. The bonding force between the copper film and the substrate in a two-layer flexible copper clad laminate produced by the method provided by the present invention is much larger than that in a flexible copper clad laminate produced by a sputtering/plating method and equivalent to that in a flexible copper clad laminate produced by a coating method and a lamination method. Meanwhile the thickness of the copper film can be easily controlled to be less than 18 microns.