Abstract: A method of regenerating a platinum bath by flow reaction, the method comprising the successive steps of: drawing off fluid from the platinum bath by means of a draw-off flow; complexing platinum by mixing together the draw-off flow and a regeneration solution flow containing platinum, mixing taking place in an intensified reactor; and feeding the platinum bath with the mixture resulting from the platinum complexing step, by means of a regenerated bath flow; all of these steps being performed as a continuous flow.

Abstract: In an electrodeposition treatment of an iron-group metal ion-containing liquid, without being influenced by the properties of the iron-group metal ion-containing liquid, iron-group metal ions are efficiently removed from the liquid by precipitation. An anode chamber 2A provided with an anode 2 and a cathode chamber 3A provided with a cathode 3 are separated from each other by a cation exchange membrane 5, an iron-group metal ion-containing liquid is charged into the anode chamber 2A, a cathode liquid is charged into the cathode chamber 3A, and by applying the voltage between the anode 2 and the cathode 3, iron-group metal ions in the liquid in the anode chamber 2A are moved into the liquid in the cathode chamber 3A through the cation exchange membrane 5, so that an iron-group metal is precipitated on the cathode 3.

Abstract: A method provides a magnetic write apparatus. The method includes providing a pole including a pole tip, a yoke, a pole bottom and a pole top. The pole is seam free and formed vertically in a direction from the pole bottom toward the pole top. At least one coil for energizing the pole is also provided. In some aspects, providing the pole may include removing a portion of an intermediate layer to form a trench therein. The trench has a shape and location corresponding to the pole, a bottom, a top and sides. A conductive layer is deposited in the trench and on a top surface of the intermediate layer. Insulating layer(s) are provided on the sides of the trench. Only part of the conductive layer on the trench bottom is exposed. Pole material(s) are grown on the exposed portion of the conductive layer to provide the pole.

Abstract: A copper plating apparatus according to an embodiment includes a plating tank configured to have a copper member and a plating member being disposed in an interior of the plating tank, a blocking film configured to partition the interior of the plating tank into an anode chamber where the copper member is to be disposed and a cathode chamber where the plating member is to be disposed, the blocking film being configured to transmit copper ions and not transmit an additive agent, a supply unit configured to supply the additive agent to the anode chamber, and a power supply configured to apply a voltage between the copper member and the plating member.

Abstract: Disclosed is an aluminum-polymer resin composite. The composite includes i) aluminum and ii) a polymer resin bonded to the aluminum after modification of the aluminum surface with at least one surface modifier selected from the group consisting of sulfur-containing diazole derivatives, sulfur-containing diamine derivatives, sulfur-containing thiol derivatives, sulfur-containing pyrimidine derivatives, and sulfur-containing silane coupling agents. The intensity ratios of C/Al, N/Al, O/Al, Na/Al, Si/Al, and S/Al in the composite are in the range of 9.75×10?6 to 9.5×10?1 at depths of 100 nm to 500 nm, as analyzed by secondary ion mass spectrometry (SIMS). The composite has improved adhesive strength between the metal and the resin while maintaining its tensile strength and air tightness even after thermal shock testing.

Abstract: We describe herein biocompatible single crystal Cu-based shape memory alloys (SMAs). In particular, we show biocompatibility based on MEM elution cell cytotoxicity, ISO intramuscular implant, and hemo-compatibility tests producing negative cytotoxic results. This biocompatibility may be attributed to the formation of a durable oxide surface layer analogous to the titanium oxide layer that inhibits body fluid reaction to titanium nickel alloys, and/or the non-existence of crystal domain boundaries may inhibit corrosive chemical attack. Methods for controlling the formation of the protective aluminum oxide layer are also described, as are devices including such biocompatible single crystal copper-based SMAs.

Abstract: The invention relates to a method for balancing a rotor, notably of a turbomachine, comprising a step of determining the unbalancing mass followed by a step of balancing by chemical machining of the rotor. More particularly, the chemical machining comprises the immersion of the rotor in a bath containing a chemical machining agent, the bath having a capacity of heterogeneous material removal (as a function of the depth of the bath), the rotor being oriented in the bath taking account of the said capacity of heterogeneous material removal so that the quantity of material removed from the rotor in the zone of the unbalancing mass is sufficient to balance the rotor.

Abstract: An object of the present invention is to provide a production method for an R—Fe—B based sintered magnet having a plating film excellent in adhesiveness on the surface thereof, by conducting a series of processes of acid cleaning and smut removal as pretreatments of a plating treatment of an R—Fe—B based sintered magnet, and the subsequent plating treatment, effectively without requiring troubles. The production method for an R—Fe—B based sintered magnet having a plating film on the surface thereof of the present invention, as a solution method therefor, is characterized in that a series of processes of acid cleaning and smut removal of a magnet as pretreatments of a plating treatment, and the subsequent plating treatment is conducted consistently with a state, in which the magnet is placed in a barrel made of synthetic resin, and that the smut removal is conducted by ultrasonic cleaning of the magnet with rotating the barrel in water in which the dissolved oxygen amount is set to 0.

Abstract: A method of forming a skid-proof leather-texture surface on a metallic substrate, including the following steps of: providing a metallic substrate; performing a first pretreatment to clean the surface of the metallic substrate; etching the surface of the metallic substrate through an etchant while using a etch-moderating agent to moderate the condition of etching. performing a second pretreatment, such as pickling or chemical polishing, on the surface of the metallic substrate; performing an anodic treatment on the surface of the metallic substrate to form an oxidized film having micro-porous structure thereon; activating the surface of the metallic substrate after the anodic treatment; dyeing the surface of the metallic substrate; sealing the micro-porous structure formed on the surface of the metallic substrate; and ash-removing to clean the metallic substrate.

Abstract: Copper electroplating methods provide low internal stress copper deposits. Concentrations of accelerators in the copper electroplating bath vary as a function of the plating current density and the low internal stress copper deposit is observed as a matt copper deposit.

Abstract: A method of treating a metallic surface of an article including the steps of providing an article having a metallic surface; texturizing the surface using a laser to create a controlled pattern across the surface; and anodizing the surface. The controlled pattern may include a series of pits etched in a predetermined repeating pattern across the surface, such as an array of dots or a grid. The controlled pattern may also include a series of pits etched in a predetermined pseudo-random pattern across the surface.

Abstract: Disclosed are methods for cleaning and coating metal substrates, and the coated substrate formed therein, that include contacting the substrate with an acid and then contacting the cleaned substrate with an electrodepositable coating composition comprising a film forming polymer and a corrosion inhibitor.

Abstract: A biosensor comprising an electrically conductive substrate coated with a modified chitosan biopolymer that has been electrodeposited on the substrate, wherein said modified chitosan biopolymer comprises at least one vesicle binding molecule. The biosensor is manufactured by a method where a modified chitosan biopolymer is electrodeposited on a substrate. The method is also used to manufacture a modified chitosan biopolymer film by electrodeposition of the chitosan on the substrate and later removing the film from the substrate after electrodeposition. The resulting film can be used in bandages to treat various types of wounds. The biosensor can also be used to detect various analytes in samples.

Abstract: Systems and methods for achieving cavitation at high static pressures which may be used in acoustic applications and research such as in liquid metal resonators. Novel preparation and electroplating methods are disclosed to improve boundary layer conditions. A chemical cleaning loop for containment and treatment for oxide removal and to develop a dynamic system for chemically treating liquid metal disposed in a liquid metal loop is also described. A liquid metal handling loop for containment and treatment is provided to maintain cleanliness of bulk liquid metal.

Abstract: A pretreating agent for electroplating includes an aqueous solution containing, as essential ingredient, (A) at least one anti-adsorption agent selected from among a triazole compound, a pyrazole compound, an imidazole compound, a cationic surfactant, and an amphoteric surfactant, and (B) chloride ion. The pretreating agent does not impair adhesion between substrate copper and a photoresist, and does not damage adhesion between the substrate copper and an electrolytic copper plating film.

Abstract: A method for forming multicolor aluminum alloy has steps of preparing, surface treating, forming, processing and reprocessing. Preparing comprises providing an aluminum alloy substrate and cleaning with water. Surface treating has disposing the substrate in a base electrolytic solution to form a base oxide layer by anodizing. Forming has forming a membrane of transparent, acid-proof, insulated plastic on the substrate. Processing has removing local area membrane and corresponding oxide layer from the substrate and cleaning. Reprocessing has disposing the clean substrate in a subsequent electrolytic solution to form a subsequent oxide layer on areas of the substrate exposed by the membrane by anodizing.

Abstract: Method of forming a multilayer structure by electroetching or electroplating on a substrate. A seed layer is arranged on the substrate and a master electrode is applied thereto. The master electrode has a pattern layer forming multiple electrochemical cells with the substrate. A voltage is applied for etching the seed layer or applying a plating material to the seed layer. A dielectric material (9) is arranged between the structures (8) thus formed. The dielectric layer is planarized for uncovering the structure below and another structure layer is formed on top of the first. Alternatively, the dielectric layer is applied with a thickness two layers and the structure below is accessed by selective etching of the dielectric layer for selectively uncovering the top surface of the structure below. Multiple structure layer may also be formed in one step.

Abstract: A method for touching up and/or repairing minor surface damage in a large-format pressing plate or an endless strip 3 made of steel sheet, with a textured surface 4, for surface embossing of wood materials or laminate panels, has the damaged surface subjected to microgalvanic treatment. In order to simply repair the damage locations and to allow a longer tool life of the pressing sheets, it is provided, that an electrolyte solution that contains metal ions and iron is used, which is coordinated with the base material of the pressing plate or the endless strip 3. This yields the particular advantage that no color deviations are formed as compared with the damaged locations and that a conventional chromium-plating process can be used. Thus the damaged locations 2 are not washed out and thereby become visible again, during subsequent touch-up chromium-plating, because of the electrolyte used.

Abstract: A method for reducing feature size in a thin film magnetic write head includes plating a seed layer over a selected base layer, spinning a photoresist layer onto the seed layer, defining a trench in the photoresist layer, depositing an insulative spacer layer to cover the trench side walls using a low temperature chemical vapor deposition process, anisotropically etching to remove spacer layer material from the bottom of the trench and thereby expose the plating seed layer while leaving intact vertical portions of the spacer layer that cover the trench side walls and narrow its width, forming a structure of reduced feature size by electroplating metallic material into the narrowed trench, stripping away the photoresist layer and the spacer layer vertical portions, and milling or sputter etching the plating seed layer to leave a structure of reduced feature size.

Abstract: Magnetic disk substrates are produced by subjecting glass substrates to at least steps of degreasing, etching, sensitization with tin chloride, activation and sensitivity-enhancing treatment in that order, then plating the pretreated substrates with a nickel/phosphorus film, and thereafter polishing the plated substrates. In the process, the substrates being processed are washed with hot pure water at a temperature of not lower than 50° C. for a period of from 20 to 90 seconds, after the sensitization step but before the activation step, and heated at a temperature of not lower than 70° C. for a period of from 5 to 100 minutes, after the sensitization step but before the nickel/phosphorus-plating step.

Abstract: A method is provided for forming a film having excellent anticorrosion properties on a metal surface without producing sludge, and without using phosphorus or chromium. In this method, the following steps (a)-(c) are performed on a metal material: (a) degreasing, (b-1) pretreatment if necessary, and (c) which comprises the following steps (c-1) or (c-2). The film-forming step (c-1) is a step for forming a film by bringing the metal material in contact with an aqueous solution comprising at least one of the following compositions (A), (B), (C) or (D): (A) is a monomer comprising a sulfonium group at one end of the molecule. (B) is a water-soluble polymer obtained by homopolymerization or copolymerization of the monomer (A). (C) is an emulsion or water-soluble polymer comprising a sulfonium group obtained by copolymerization of the monomer (A) and a radical-polymerizable unsaturated monomer excluding the monomer (A).

Abstract: A method and a device are described for the repair and/or touch-up of small surface flaws in large press plates or endless bands of sheet metal, especially steel sheet, having a structured metal coating and a hard-chrome plating for surface-embossing plastic-coated wooden or laminated panels. Each flaw is repaired by surrounding it with a mask, pickling, and galvanically metallizing it. For a simplified and cost-favorable repair or touch-up, a galvanic solution is applied to the masked and pickled flaw for microgalvanizing damaged areas smaller than 14 mm.sup.2 by dipping the tip of an electrode into the solution. The pickled flaw can first be provided with a thin, microgalvanically applied nickel layer, and it is then copper-plated. The copper build-up is restructured by hand, if necessary, and covered with a hardened cobalt layer.

Abstract: A process for sulfurizing treatment of ferrous articles comprises positioning an electrolysis crucible containing a molten-salt bath of potassium thiocyanate and sodium thiocyanate and a pretreatment crucible containing a molten-salt bath of substantially the same composition adjacent to each other, assembling a unitary body by setting a plurality of the articles on a conductive support member in electrical contact therewith and attaching a cathode material to the support member to be out of contact with the articles and electrically insulated from the support member, immersing the unitary body in the bath contained in the pretreatment crucible, maintaining this bath temperature at substantially a prescribe bath temperature during ensuing electrolysis to bring the temperature of the unitary body near the prescribed temperature, transferring the unitary body from the pretreatment crucible to the bath in the electrolysis crucible while maintaining its temperature, and treating the articles by electrolysis.

Abstract: A process for manufacturing an iridium and palladium oxides-coated titanium electrode comprises preparing a titanium substrate having a surface, applying iridium and palladium to be formed on the surface of the titanium substrate, and heat-treating the iridium and palladium oxides-applied titanium substrate to obtain an iridium and palladium oxides-coated titanium electrode. This invention provides a process for obtaining a coated titanium electrode having therein a good adhesion between the coating material and the titanium electrode, and having an excellent electrochemical stability and a superior catalytic activity in an acidic environment.

Abstract: A method of producing a printer head wherein a substrate including at least one piezoelectric member polarized in its thickness direction is formed. A plurality of grooves and a plurality of posts are alternately defined in the substrate. A pre-processing solution is allowed to flow along the grooves at the following relative velocity so as to effect pre-processing when the velocity of the pre-processing solution for electroless plating relative to an object to be plated is V, the height of each of electrodes formed on the internal surfaces of the grooves is H, the width of each groove is W and a contact angle at which the pre-processing solution is brought into contact with the internal surfaces of the grooves is .theta..VW.sup.2 (1+cos.theta. )/H.sup.2 >0.6 mm/sThereafter, the substrate is immersed in an electroless plating solution to form the electrodes.

Abstract: Method of producing a polyimide layer having improved adhesion to a metal layer thereon. A halogenated polyamic acid is sprayed, partially cured, degreased and oxidized to form a partially cured polyimide layer, which is then electrolessly plated with a primary metal layer and then final cured into the polyimide layer. Electrolessly or electrolytically applied secondary metal layers are then deposited on the primary layer, until the metal layer of a desired thickness is attained. The present invention further discloses articles such as an EMI shielded enclosure and an insulated mold surface, having metal layers as an EMI shield and an insulating surface, respectively.

Abstract: A process of pretreatment of metal-plating a resin molded article molded from a resin composition containing as main components a polyphenylene sulfide (PPS) resin, a glass-reinforcing agent and optionally one or more other thermoplastic resins comprises(1) treating the resin molded article by immersion in an oxidative acid solution (A treatment),(2) treatng the resulting resin molded article by immersion in an organic polar solvent-containing liquid (B treatment), and then(3) treating the resulting resin molded article by immersion in a solvent which can dissolve one or both of the glass reinforcing agent and one or more of the other thermoplastic resins (C treatment). The PPS resin contains a paraphenylene sulfide unit ##STR1## in an amount of at least 70 mole % of all recurring units. Total amount of PPS resin and the glass-reinforcing agent is at least 60% by weight of the resin composition, and the ratio of the PPS resin to the glass-reinforcing agent is in the range of 2:8 to 9:1 by weight.

Abstract: Disclosed is a method of fabricating a microelectronic package, especially a microelectronic package having copper circuitization on a dielectric substrate. The method includes the steps of depositing, imaging, developing the photoresist for additive circuitization, and forming a pattern of copper circuitization on the so exposed portions of the package. In order to avoid the formation of deleterious air bubbles on the exposed walls of the imaged and developed resist, the panel is exposed to and wetted by a liquid mist.