Treating Substrate With Liquid Other Than Tap Water (e.g., For Removing Foreign Material, Etching, Activating, Etc.) Patents (Class 205/210)
  • Patent number: 9944838
    Abstract: Provided is a polishing composition with which haze and surface defects can be reduced. This invention provides a polishing composition comprising a synthetic water-soluble polymer ML-end that has a hydrophobic region at least at one end of its main chain. The hydrophobic region has at least one hydrophobic group derived from a polymerization initiator.
    Type: Grant
    Filed: September 22, 2014
    Date of Patent: April 17, 2018
    Assignee: FUJIMI INCORPORATED
    Inventors: Kohsuke Tsuchiya, Yoshio Mori
  • Patent number: 9188856
    Abstract: A new type of fine metal mask (FMM) used in OLED production and the method of manufacturing it, wherein the FMM includes a frame made of a metal substrate with a plurality of through holes, a layer of fine mask electroformed on the surface of the frame so that said fine mask and said frame are seamlessly integrated, said fine mask is divided into a pattern area and a border area, and the pattern area corresponds to the through holes on the frame, and the method of manufacturing such an FMM comprising the steps of: A. providing a metal substrate by cutting an invar alloy or stainless steel plate to a desired size; B. providing an fine mask by adding a photoresist layer on the metal substrate, exposing a desired pattern onto said photoresist layer, and electroforming a metal base layer and a metal layer with a low thermal expansion coefficient; and C.
    Type: Grant
    Filed: February 20, 2014
    Date of Patent: November 17, 2015
    Assignee: Zhongshan Aiscent Technologies Co., Ltd.
    Inventors: Weichong Du, Jianwei Han, Wenhui Mei
  • Patent number: 9121102
    Abstract: A plating assembly for plating a part having an interior cavity with a plating material. The plating assembly has a main frame assembly adapted to receive and support the part. An anode frame assembly is positioned inside the main frame assembly and is electrically isolated from the main frame assembly. The anode frame assembly is electrically connected to an anode of a direct current power supply. A plurality of anode rods are mounted on the anode frame assembly in electrically conductive contact with it. A cathode assembly is electrically connected to the part and is electrically connected to a cathode of the direct current power supply. A fluid conduit assembly connects a fluid source such as a pump station to a plurality of fluid nozzles. At least one of the fluid nozzles is positioned within the interior cavity of the part.
    Type: Grant
    Filed: June 26, 2012
    Date of Patent: September 1, 2015
    Assignee: ES3
    Inventors: Craig Paul Pessetto, Joshua James Ault, Kelly Vernal Smith, Karl Henrie Robinson
  • Patent number: 9011668
    Abstract: A method for the antimicrobial provision of implant surfaces with silver, in which the method comprises an anodizing of the implant surface with an electrolyte, in which the electrolyte has a silver-yielding substance. Alternatively, the method comprises a silver implantation or a silver PVD deposition.
    Type: Grant
    Filed: December 2, 2008
    Date of Patent: April 21, 2015
    Assignee: Stryker Trauma GmbH
    Inventor: Andreas Speitling
  • Publication number: 20140326605
    Abstract: A method for silver-alloy plating an electrical contact and a silver-alloy plated electrical contact are provided. The method includes cleaning the electrical contact by removing contaminates and exposing the electrical contact to at least one of an acid or base. The method includes preparing a sliver-alloy plating bath including water, a silver complex, and a metal complex, the metal complex being at least one of nickel or cobalt. The method includes silver-alloy plating the electrical contact in the silver-alloy plating bath, wherein the plating bath has a pH of greater than 7. The metal complex forms about 0.3% to about 50% by weight of a content of a silver-alloy plated deposit.
    Type: Application
    Filed: May 3, 2013
    Publication date: November 6, 2014
    Applicant: TYCO ELECTRONICS CORPORATION
    Inventors: Min ZHENG, Jerzy GAZDA
  • Patent number: 8859049
    Abstract: A plating method for an RF device is disclosed. The method includes (a) pre-treating the RF device made from a substrate material; (b) forming a copper plating layer by applying copper plating to the RF device; and (c) forming a thin-film layer over the copper plating layer, the thin-film layer made of a precious metal, where a thickness of the precious-metal thin-film layer is thinner than a skin depth at a working frequency band. The disclosed method makes it possible to provide a plating treatment with a low cost while providing a superior appearance quality.
    Type: Grant
    Filed: February 27, 2009
    Date of Patent: October 14, 2014
    Assignee: Ace Technologies Corp.
    Inventors: Hyun-Yeong Jung, Myoung-Joon Jung
  • Patent number: 8778163
    Abstract: A method for electroplating aluminum metal on a magnesium alloy includes providing an Lewis acidic ionic liquid having dissolved species of an aluminum metal salt; pre-treating a surface of the magnesium alloy including subjecting the surface of the magnesium alloy to a reverse current etching in the ionic liquid; electroplating the aluminum metal on the surface using the ionic liquid as the electrolyte; and subjecting the surface of the magnesium alloy to a post-treatment including neutralization rinsing in a rinsing solvent solution.
    Type: Grant
    Filed: September 22, 2011
    Date of Patent: July 15, 2014
    Assignee: Sikorsky Aircraft Corporation
    Inventors: Xiaomei Yu, Mark R. Jaworowski, Daniel V. Viens, Joseph J. Sangiovanni
  • Patent number: 8595921
    Abstract: An electrode is formed using a sanding mechanism to condition the surface of the electrode for electrochemical purposes. Hazardous particles emitted during sanding are captured using jetted liquid, and may be recycled for later use. The sanded surface provides increased electrode lifespan and lead oxide adherence.
    Type: Grant
    Filed: November 17, 2010
    Date of Patent: December 3, 2013
    Assignee: RSR Technologies, Inc.
    Inventors: Timothy W. Ellis, Matthew Burr
  • Publication number: 20130292256
    Abstract: A method of forming a skid-proof leather-texture surface on a metallic substrate, including the following steps of: providing a metallic substrate; performing a first pretreatment to clean the surface of the metallic substrate; etching the surface of the metallic substrate through an etchant while using a etch-moderating agent to moderate the condition of etching. performing a second pretreatment, such as pickling or chemical polishing, on the surface of the metallic substrate; performing an anodic treatment on the surface of the metallic substrate to form an oxidized film having micro-porous structure thereon; activating the surface of the metallic substrate after the anodic treatment; dyeing the surface of the metallic substrate; sealing the micro-porous structure formed on the surface of the metallic substrate; and ash-removing to clean the metallic substrate.
    Type: Application
    Filed: August 16, 2012
    Publication date: November 7, 2013
    Applicant: CATCHER TECHNOLOGY CO., LTD.
    Inventors: SHAO-KANG HU, FENG-JU LAI
  • Patent number: 8574414
    Abstract: A method includes (a) contacting at least a portion of a substrate material with a solution comprising a source of copper, wherein the solution is essentially free of a source of a group IIIB metal and a source of a group IVB metal; and (b) after step (a), contacting at least a portion of the substrate with an electrodepositable coating composition comprising (i) a film-forming resin and (ii) a source of yttrium.
    Type: Grant
    Filed: July 14, 2010
    Date of Patent: November 5, 2013
    Assignee: PPG Industries Ohio, Inc
    Inventors: Terri Ziegler, Mark McMillen
  • Publication number: 20130240368
    Abstract: Copper electroplating methods provide low internal stress copper deposits. Concentrations of accelerators in the copper electroplating bath vary as a function of the plating current density and the low internal stress copper deposit is observed as a matt copper deposit.
    Type: Application
    Filed: September 9, 2012
    Publication date: September 19, 2013
    Applicant: Rohm and Haas Electronic Material LLC
    Inventors: George R. Allardyce, Gary Hamm, Narsmoul Karaya
  • Publication number: 20130186764
    Abstract: An aqueous treatment solution for increasing the cleaning capability of a treated copper surface comprising: a) an organic compound selected from the group consisting of organic acids, alcohols, ketone, nitriles and combinations of one or more of the foregoing; and b) an oxidizing agent. The aqueous treatment solution is usable in a process for metallizing the walls of holes within a printed wiring board substrate having metallic and non-metallic regions, wherein the printed wiring board is treated with a reducing agent and then contacted with an aqueous dispersion of carbonaceous particles to term a coating of the dispersion over the substrate. The process comprises the step of contacting the metallic regions of the printed wiring board substrate with the aqueous treatment solution to remove deposited carbonaceous particles therefrom. The aqueous treatment solution provides a clean copper surface while providing a low microetch rate.
    Type: Application
    Filed: January 19, 2012
    Publication date: July 25, 2013
    Inventors: Kesheng Feng, Jun Nable, Adam McCaherty
  • Publication number: 20130153428
    Abstract: A surface treatment for metal surfaces can be used to create one or more desired effects, such as functional, tactile, or cosmetic effects. In one embodiment, the treatment involves selectively masking a portion of the surface using a photolithographic process. The mask can protect the masked portion of the surface during subsequent treatment processes such as texturizing and anodization. The mask can result in the creation of a surface having contrasting effects. A pattern can be formed by the contrasting effects in the shape of a distinct graphic, such as a logo or text.
    Type: Application
    Filed: December 20, 2011
    Publication date: June 20, 2013
    Applicant: Apple Inc.
    Inventors: Jody R. AKANA, Peter N. RUSSELL-CLARKE, Masashige TATEBE
  • Patent number: 8449753
    Abstract: The present invention provides an apparatus for plating pretreatment of a cylinder block that includes an electrode performing a plating pretreatment of the cylinder inner wall surface. A gap flow channel communicates with an in-electrode flow channel at a position closest to a seal jig, the gap flow channel being adapted to introduce a treatment liquid to the cylinder inner wall surface, the in-electrode flow channel being adapted to receive the treatment liquid having passed through a communicating hole. The present invention is provided a method for pretreating before plating a cylinder block including disposing an electrode to face the cylinder inner wall surface so as to form a gap flow channel, and introducing a treatment liquid to the gap flow channel thereby flowing through the treatment liquid toward a seal jig and then into an in-electrode flow channel through a communicating hole.
    Type: Grant
    Filed: September 28, 2009
    Date of Patent: May 28, 2013
    Assignee: Suzuki Motor Corporation
    Inventors: Hitoshi Muramatsu, Seiya Kunioka, Nobuyuki Suzuki, Naoyuki Suda, Akira Ishibashi, Tomohiro Asou, Minoru Imai, Manabu Suzuki, Masahiro Ogawa
  • Patent number: 8431004
    Abstract: A method for making a stamper which has an uneven surface pattern, in which unit structures are arranged in x and y directions at respective periods that are both shorter than the shortest wavelength of an incoming light ray, on the surface of a substrate and satisfies the following Inequality (1): ? ? ? x , y ? min < 1 ni + ni · sin ? ? ? ? ? i max ( 1 ) where ?min is the shortest wavelength of the incoming light ray, ?imax is the largest angle of incidence of the incoming light ray, ni is the refractive index of an incidence medium, ?x is the period of the uneven surface pattern in the x direction, and ?y is the period of the pattern in the y direction. As a result, diffraction of short-wave light components can be reduced in a broad wavelength range.
    Type: Grant
    Filed: March 26, 2009
    Date of Patent: April 30, 2013
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Tokio Taguchi, Shun Ueki, Kozo Nakamura, Kazuhiko Tsuda
  • Patent number: 8419918
    Abstract: A method of surface modifying a polyimide film, a method of manufacturing a flexible copper clad laminate using the same, and a flexible copper clad laminate (FCCL) having a two-layer structure manufactured thereby. The method of surface modifying a polyimide film is conducted by modifying the surface of a polyimide film through a first plasma treatment, dipping the polyimide film into a solution containing an ethyleneimine-based silane coupling agent prepared by mixing the compound of Formula 1 and the compound of Formula 2 at a molar ratio of with 0.25˜1, and then modifying the surface of the polyimide film through a second plasma treatment. The method of surface modifying a polyimide film is advantageous because it may be substituted for a conventional surface treatment processes using ion beams.
    Type: Grant
    Filed: May 18, 2006
    Date of Patent: April 16, 2013
    Assignee: Korea Research Institute of Chemical Technology
    Inventors: Young-Taik Hong, Hyung Dae Kang, Seog Je Kim, Jae Heung Lee
  • Patent number: 8421306
    Abstract: Systems and methods for achieving cavitation at high static pressures which may be used in acoustic applications and research such as in liquid metal resonators. Novel preparation and electroplating methods are disclosed to improve boundary layer conditions. A chemical cleaning loop for containment and treatment for oxide removal and to develop a dynamic system for chemically treating liquid metal disposed in a liquid metal loop is also described. A liquid metal handling loop for containment and treatment is provided to maintain cleanliness of bulk liquid metal.
    Type: Grant
    Filed: July 7, 2010
    Date of Patent: April 16, 2013
    Assignee: Impulse Devices, Inc.
    Inventors: Dario Felipe Gaitan, Robert A. Hiller, Corey Scott, Ernest E. Flores
  • Publication number: 20130075271
    Abstract: A method for electroplating aluminum metal on a magnesium alloy includes providing an Lewis acidic ionic liquid having dissolved species of an aluminum metal salt; pre-treating a surface of the magnesium alloy including subjecting the surface of the magnesium alloy to a reverse current etching in the ionic liquid; electroplating the aluminum metal on the surface using the ionic liquid as the electrolyte; and subjecting the surface of the magnesium alloy to a post-treatment including neutralization rinsing in a rinsing solvent solution.
    Type: Application
    Filed: September 22, 2011
    Publication date: March 28, 2013
    Applicant: SIKORSKY AIRCRAFT CORPORATION
    Inventors: Xiaomei Yu, Mark R. Jaworowski, Daniel V. Viens, Joseph J. Sangiovanni
  • Publication number: 20130063866
    Abstract: The present disclosure is related to hybrid capacitors specifically to PbO2/Activated Carbon hybrid capacitors. The hybrid super capacitor of the present disclosure is simple to assemble, bereft of impurities and can be fast charged/discharged with high faradiac-efficiency.
    Type: Application
    Filed: June 28, 2010
    Publication date: March 14, 2013
    Inventors: Ashok Kumar Shukla, Musuwathi Krishnamoorthy Ravikumar, Shaik Abdul Gaffoor
  • Publication number: 20130048503
    Abstract: A method for repairing a blade forming a cathode and having a surface to be coated defining a critical area, utilizing an anode, an electrolyte bath including insoluble particles, and a mounting on which the blade is mounted in a working position relative to a reference wall. The mounting is placed in the bath, and the particles and the metal of the anode are co-deposited to form the coating on the surface to be coated. The anode is typically placed facing the critical area and the mounting includes a mechanism for monitoring current lines to obtain a coating with a relatively constant, predetermined thickness for the critical area, that gradually falls to a value of substantially zero along edges of the coating.
    Type: Application
    Filed: December 28, 2010
    Publication date: February 28, 2013
    Applicants: SNECMA, PRAXAIR SURFACE TECHNOLOGIES INC.
    Inventors: Justine Menuey, Frederic Braillard, John Foster, Stephen Owens, Alan Taylor, Martin Chatterney
  • Patent number: 8354014
    Abstract: There are provided technologies for adsorbing a catalyst metal selectively to an anionic group such as a carboxyl group, thereby forming a metal film on a nonconductive resin selectively, including a palladium complex represented by the following formula (I): wherein L represents an alkylene group and R represents an amino group or a guanidyl group, or a structural isomer thereof, a processing solution for electroless plating catalyst application containing the complex as an active component, and a method for forming a metal plated film on a nonconductive resin, containing subjecting a nonconductive resin having a surface anionic group to a catalyst adsorbing treatment using the processing solution and then to a reduction treatment, electroless metal plating, and metal electroplating.
    Type: Grant
    Filed: November 2, 2006
    Date of Patent: January 15, 2013
    Assignee: Ebara-Udylite Co., Ltd.
    Inventors: Makoto Kohtoku, Mika Hamada
  • Patent number: 8323472
    Abstract: The method of surface treatment, as applied onto a metal base material, of the present invention includes a reduction treatment step of reduction-treating the oxide film formed on the metal base material and an oxidation treatment step of oxidation-treating the oxide film having been subjected to the reduction treatment.
    Type: Grant
    Filed: July 10, 2008
    Date of Patent: December 4, 2012
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Hajime Hasegawa, Yusuke Watanabe
  • Patent number: 8317993
    Abstract: A plating apparatus has a steam treatment chamber configured to perform a steam treatment using steam on a surface of a substrate, and a plating chamber configured to plate the surface of the substrate subjected to the steam treatment. The plating apparatus also has an acid treatment chamber configured to bring the surface of the substrate subjected to the steam treatment into contact with an acid liquid. The plating apparatus includes a frame housing the steam treatment chamber, the acid treatment chamber, and the plating chamber.
    Type: Grant
    Filed: August 18, 2009
    Date of Patent: November 27, 2012
    Assignee: Ebara Corporation
    Inventors: Fumio Kuriyama, Rei Kiumi, Nobutoshi Saito, Takashi Takemura, Masaaki Kimura, Sachiko Takeda, Yugang Guo
  • Publication number: 20120255864
    Abstract: An electroplating method is capable of reliably embedding via holes with a plated metal such as copper or the like when a substrate with a seed layer of a metal having a greater ionization tendency than hydrogen is electroplated using an acidic plating solution such as a copper sulfate plating solution. The electroplating method including preparing a substrate having via holes covered with a first metal, which has a greater ionization tendency than hydrogen, in a surface thereof, pretreating the substrate by immersing the substrate in a pretreatment solution in which a second metal that is more noble than the first metal or a salt thereof is dissolved, and then electroplating the surface of the substrate to embed the second metal or a third metal in the via holes.
    Type: Application
    Filed: April 5, 2012
    Publication date: October 11, 2012
    Applicant: EBARA CORPORATION
    Inventors: Mizuki Nagai, Yusuke Tamari, Shingo Yasuda
  • Publication number: 20120256224
    Abstract: Provided is an insulating substrate which includes an aluminum substrate and an anodized film covering a whole surface of the aluminum substrate and in which the anodized film contains intermetallic compound particles with a circle equivalent diameter of 1 ?m or more in an amount of up to 2,000 pcs/mm3. Also provided is a method for manufacturing the insulating substrate which includes an anodizing treatment step for anodizing the aluminum substrate. The anodized film of the insulating substrate covering the whole surface of the aluminum substrate contains intermetallic compound particles with a circle equivalent diameter of 1 ?m or more in an amount of up to 2,000 pcs/mm3.
    Type: Application
    Filed: December 14, 2010
    Publication date: October 11, 2012
    Applicant: FUJIFILM CORPORATION
    Inventors: Yusuke Hatanaka, Yoshinori Hotta, Akio Uesugi
  • Publication number: 20120241324
    Abstract: A coated article includes a substrate including a porous surface and an anodic oxidation film. The porous surface defines a plurality of nanopores. The anodic oxidation film is formed on the substrate covering the porous surface by anodic oxidation process. The anodic oxidation film has a plurality of bonding protrusions, and each bonding protrusion is retained in one of the nanopores to improve a binding force between the substrate and the anodic oxidation film.
    Type: Application
    Filed: October 7, 2011
    Publication date: September 27, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd
    Inventors: HSIN-PEI CHANG, WEN-RONG CHEN, HUANN-WU CHIANG, CHENG-SHI CHEN, CHAO-YONG ZHANG
  • Publication number: 20120186986
    Abstract: The present invention relates to a multistage method for the corrosion-protective and adhesion-promoting treatment of metal surfaces, comprising a first method step for passivating pretreatment using an acidic aqueous composition (A) containing water-soluble compounds of Zr and/or Ti and fluoride ions, a subsequent method step for post-treatment using an aqueous composition (B) containing at least one organic compound having at least one aromatic heterocyclic compound, wherein the aromatic heterocyclic compound has at least one nitrogen atom. The invention further relates to a metal surface treated according to the method according to the invention and the use of said treated metal surface for subsequent coating with an organic binding agent system.
    Type: Application
    Filed: January 26, 2012
    Publication date: July 26, 2012
    Inventors: Andreas Schmidt, Nicole Teubert, Franz-Adolf Czika, Sophie Cornen
  • Publication number: 20120152754
    Abstract: Aqueous compositions useful as pretreatments prior to painting and to reduce the formation of rust in the uncoated condition consist essentially of water, an organo-functional silane, a compound of a Group IV-B element, and optionally a polyvinyl alcohol, stabilizing agents, wetting agents, thickeners, and biocides, and have an alkaline pH>7. A process for treating a metal surface includes contacting the surface with such an aqueous composition. The compositions and processes were found to have further benefits in comparison to the zinc phosphate metal pretreatment thought to be the standard in the industry. Preferably, the pH of the compositions is alkaline, which has been found to improve the efficacy of a silane as a surface treatment to improve uniformity of paint adhesion. By operating in the alkaline pH range, it was found that flash rusting and/or blush rust were significantly reduced.
    Type: Application
    Filed: December 15, 2010
    Publication date: June 21, 2012
    Applicant: BULK CHEMICALS, INC.
    Inventors: Ted M. Schlosser, José B. Rivera
  • Patent number: 8197662
    Abstract: The present invention provides improved methods and devices for electroplating copper on a wafer. Some implementations of the present invention involve the pre-treatment of the wafer with a solution containing accelerator molecules. Preferably, the bath into which the wafer is subsequently placed for electroplating has a reduced concentration of accelerator molecules. The pre-treatment causes a reduction in roughness of the electroplated copper surface, particularly during the initial phases of copper growth.
    Type: Grant
    Filed: December 17, 2010
    Date of Patent: June 12, 2012
    Assignee: Novellus Systems, Inc.
    Inventors: Eric Webb, Jonathan D. Reid, Yuichi Takada, Timothy Archer
  • Patent number: 8168258
    Abstract: In a method of producing a temperature sensor including at least one lead wire of a non-noble metal or of an alloy containing a non-noble metal, at first a lead wire is attached to the temperature sensor. An oxide layer is removed from at least one portion of the lead wire, and the at least one portion of the lead wire is chemically gilded immediately after removing the oxide layer.
    Type: Grant
    Filed: July 4, 2007
    Date of Patent: May 1, 2012
    Inventors: Heinrich Zitzmann, Gyoergy Bernitz
  • Patent number: 8163157
    Abstract: In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal plate exposed within the through holes, from the side of the conductive base member where the metal plate is not attached, thereby to fill up the through holes, in a film forming process, a Pd alloy film is formed by plating on the surface of the conductive base member after removal of the metal plate, and in a removal process, the copper plating layer is removed by selective etching, thereby to produce a hydrogen production filter that is used in a reformer of a fuel cell so as to be capable of stably producing high purity hydrogen gas.
    Type: Grant
    Filed: July 7, 2010
    Date of Patent: April 24, 2012
    Assignee: Dai Nippon Insatsu Kabushiki Kaisha
    Inventors: Hiroshi Yagi, Takanori Maeda, Yoshinori Oota, Yasuhiro Uchida
  • Publication number: 20120081703
    Abstract: A plasmonic device has a plurality of nanostructures extending from a substrate. Each of the plurality of nanostructures preferably includes a core, a coating of intermediate material covering at least a portion of the core, and a coating of a plasmonic material. Devices are preferably manufactured using lithography to create the cores, and Plasma Enhanced Chemical Vapor Deposition (PECVD) to deposit the intermediate and/or plasmonic materials. Cores can be arranged in any suitable pattern, including one-dimensional or two-dimensional patterns. Devices can be used in airborne analyte detectors, in handheld roadside controlled substance detectors, in genome sequencing device, and in refraction detectors.
    Type: Application
    Filed: October 13, 2011
    Publication date: April 5, 2012
    Applicant: NANT HOLDINGS IP, LLC
    Inventors: Martin Moskovits, Xuegong Deng, Thomas Wray Tombler, JR., Gary Bernard Braun, Paul Frank Sciortino, JR.
  • Publication number: 20120073979
    Abstract: [Problem] To provide a plating method and apparatus which do not require preparation of a separate treatment tank for each treatment step and therefore enable the facility to be reduced in size and, further, which can reduce the amounts of use of the treatment solutions. [Solution] A plating apparatus feeding a plating solution to a treatment tank in which an electrode is arranged and plating a workpiece made of a metal so as to perform plating, the plating apparatus characterized by being provided with a plurality of pipes which are connected to an outer wall of the treatment tank and a switch valve which is provided able to rotate at an inner side of the outer wall and which has at least one feed port for making at least one treatment solution feed pipe selected from the plurality of treatment solution feed pipes communicate with the treatment tank.
    Type: Application
    Filed: August 11, 2011
    Publication date: March 29, 2012
    Applicant: DENSO CORPORATION
    Inventors: Keiji Shinyama, Tomoya Uchida
  • Publication number: 20120064462
    Abstract: Methods, systems, and apparatus for plating a metal onto a work piece with a plating solution having a low oxygen concentration are described. In one aspect, a method includes reducing an oxygen concentration of a plating solution. The plating solution includes about 10 parts per million or less of an accelerator and about 300 parts per million or less of a suppressor. After reducing the oxygen concentration of the plating solution, a wafer substrate is contacted with the plating solution in a plating cell. The oxygen concentration of the plating solution in the plating cell is about 1 part per million or less. A metal is then electroplated onto the wafer substrate in the plating cell.
    Type: Application
    Filed: September 9, 2011
    Publication date: March 15, 2012
    Inventors: Mark J. WILLEY, Hyosang LEE
  • Publication number: 20120061248
    Abstract: Cleaned metal surfaces are coated with an aqueous anti-corrosion treatment. The anti-corrosion treatment includes an organofunctional silsesquioxane and a fluoro metallic acid such as H2TiF6, H2ZrF6, as well as others and blends. The metal surface can be rinsed immediately after coating, making this anti-corrosion treatment suitable for preparing a metal surface for electrocoating.
    Type: Application
    Filed: September 12, 2011
    Publication date: March 15, 2012
    Inventors: Danqing Zhu, William J. Vanooij, Wenchao Zhang
  • Publication number: 20120013197
    Abstract: An electrical line conditioner or energy conservation device, a process of manufacturing thereof, and a method of use thereof. The energy conservation device, or electrical line conditioner, comprises at least two different electrochemically oxidized aluminum alloy units that may be placed near electrical lines or electrical panels or surround electrical lines to reduce energy consumption without compromising performance of a load. A first electrochemically oxidized aluminum alloy unit may be violet, a second electrochemically oxidized aluminum alloy unit may be black. The electrical line conditioner may further comprise a spacer and a band to secure the electrical line conditioner to electrical lines. The electrical line conditioner is produced using an anodizing process.
    Type: Application
    Filed: August 4, 2011
    Publication date: January 19, 2012
    Inventor: George DEWBERRY
  • Publication number: 20120015207
    Abstract: A method includes (a) contacting at least a portion of a substrate material with a solution comprising a source of copper, wherein the solution is essentially free of a source of a group IIIB metal and a source of a group IVB metal; and (b) after step (a), contacting at least a portion of the substrate with an electrodepositable coating composition comprising (i) a film-forming resin and (ii) a source of yttrium.
    Type: Application
    Filed: July 14, 2010
    Publication date: January 19, 2012
    Inventors: Terri Ziegler, Mark McMillen
  • Publication number: 20120015205
    Abstract: A process for preparing an imaging surface of an imaging transfer member in a printing machine, the process comprises providing a surface roughness to the imaging surface to produce a plurality of pits having sharp features on the surface, and then exposing the pitted imaging surface to an acid dip for a time period sufficient to substantially reduce the sharp features on the imaging surface. This process may be followed by anodization. The process produces an imaging surface having a pit structure providing reduced oil consumption and wear of components of the printing machine that contact the imaging surface.
    Type: Application
    Filed: July 13, 2010
    Publication date: January 19, 2012
    Applicant: Xerox Corporation
    Inventors: Trevor James Snyder, David VanKouwenberg, Jignesh Sheth, Paul McConville, Brian Bitz
  • Publication number: 20110303545
    Abstract: A method for treating a surface of a magnesium-based metal is disclosed for realizing a metallic texture of the magnesium-based metal. The method includes a buffing step of chemically polishing a surface of a magnesium-based metal by using a chemical polishing agent containing sodium nitride and sodium citrate; an immersing step of immersing the magnesium-based metal, which has been subject to the buffing step, into a strongly alkaline electrolyte solution of pH 11 or above; and an anodizing treatment step of forming a transparent anodizing film on the surface of the magnesium-based metal by applying current with a current density of 0.01 to 1 A/dm2 to the magnesium-based metal in the strongly alkaline electrolyte solution.
    Type: Application
    Filed: July 20, 2010
    Publication date: December 15, 2011
    Applicant: NUC ELECTRONICS CO., LTD.
    Inventors: Jong Boo Kim, Kyung Mun Lee, Soo Young Doh
  • Publication number: 20110214993
    Abstract: A metal surface treated to have a distinct cosmetic appearance such as an integral layer that is glossy may be used in electronic devices. The surface treatment may include polishing a metal surface, texturing the polished metal surface, polishing the textured surface, followed by anodizing the surface, and then polishing the anodized surface. The metal surface may also be dyed to impart a rich color to the surface.
    Type: Application
    Filed: September 3, 2010
    Publication date: September 8, 2011
    Applicant: Apple Inc.
    Inventors: Jody Akana, Howard Bujtor, Jonathan P. Ive, Masashige Tatebe
  • Patent number: 8012332
    Abstract: An apparatus forms a plated film in fine trenches and plugs for interconnects and in the openings of a resist formed in the surface of a substrate such as a semiconductor wafer, and forms bumps (protruding electrodes) on the surface of a semiconductor wafer. The apparatus includes a substrate holder capable of opening and closing for holding a substrate such that the front surface of the substrate is exposed while the backside and the edge thereof are hermetically sealed. A plating tank accommodates a plating liquid in which an anode is immersed. A diaphragm is provided in the plating tank and disposed between the anode and the substrate held by the substrate holder. Plating liquid circulating systems circulate the plating liquid to respective regions of the plating tank, separated by the diaphragm. A deaerating unit is disposed in at least one of the plating liquid circulating systems.
    Type: Grant
    Filed: June 19, 2008
    Date of Patent: September 6, 2011
    Assignee: Ebara Corporation
    Inventors: Junichiro Yoshioka, Nobutoshi Saito, Yoshitaka Mukaiyama, Tsuyoshi Tokuoka
  • Publication number: 20110183190
    Abstract: A case for a secondary battery and a manufacturing method thereof, the case including a body formed of a conductive material, the body accommodating an electrode assembly; and a crystal barrier type oxide film on a surface of the body.
    Type: Application
    Filed: August 4, 2010
    Publication date: July 28, 2011
    Inventor: Sungkab Kim
  • Patent number: 7976692
    Abstract: The presently disclosed embodiments are directed to an improved metallization process for making fuser members which avoids the extra steps of metal seeding or special substrate treatment. In embodiments, a metallized substrate, formed via a polycatecholamine-assisted metallization process, is used for the complete fabrication of the fuser member.
    Type: Grant
    Filed: July 25, 2008
    Date of Patent: July 12, 2011
    Assignee: Xerox Corporation
    Inventors: Nan-Xing Hu, Yu Qi, Qi Zhang
  • Publication number: 20110157704
    Abstract: It is aimed at finding out a surface pattern and physical properties required for an antireflective film having an excellent antireflective property for light, a light transmissivity, and the like, and at providing an antireflective film having such a specific surface pattern and physical properties, and a production method of the antireflective film; and provided for this object, is an antireflective film, obtained by: processing a surface of an aluminum material, by mechanical polishing, chemical polishing and/or electrolytic polishing; subsequently producing a pattern of mold having taper-shaped pores on the surface of the aluminum material, by combining a formation of an anodic oxide coating based on anodic oxidation of the surface of the aluminum material, with etching of the anodic oxide coating; and transferring the pattern of mold onto an antireflective film-forming material; wherein the antireflective film has, on a surface thereof, convexities having an average height between 100 nm inclusive and 1,
    Type: Application
    Filed: May 12, 2009
    Publication date: June 30, 2011
    Applicant: DNP Fine Chemicals Co., Ltd.
    Inventors: Kazuya Sato, Tsukasa Matsumoto, Yutaka Watanabe, Jun Rokuhara
  • Publication number: 20110155581
    Abstract: A metal film-forming method is capable of forming a metal film on a surface of a base metal film, formed on a surface of a substrate, with sufficient adhesion to the base metal film even when a natural oxide film is formed on the surface of the base metal film. The metal film-forming method includes: preparing a substrate having a base metal film formed on a surface; and carrying out electroplating of the substrate using the base metal film as a cathode and another metal as an anode while immersing the substrate in a solution containing a metal complex and a reducing material, both dissolved in a solvent, to form a metal film, deriving from a metal contained in the metal complex, on the surface of the base metal film.
    Type: Application
    Filed: December 23, 2010
    Publication date: June 30, 2011
    Inventors: Akira SUSAKI, Tsutomu Nakada, Hideki Tateishi
  • Publication number: 20110056836
    Abstract: A metal surface treated to have a distinct cosmetic appearance such as an integral layer that is glossy may be used in electronic devices. The surface treatment may include polishing a metal surface, texturing the polished metal surface, polishing the textured surface, followed by anodizing the surface, and then polishing the anodized surface. The metal surface may also be dyed to impart a rich color to the surface.
    Type: Application
    Filed: September 4, 2009
    Publication date: March 10, 2011
    Applicant: Apple Inc.
    Inventors: Masashige TATEBE, Howard Bujtor, Jody Akana, Jonathan P. Ive
  • Patent number: 7879218
    Abstract: The present invention provides improved methods and devices for electroplating copper on a wafer. Some implementations of the present invention involve the pre-treatment of the wafer with a solution containing accelerator molecules. Preferably, the bath into which the wafer is subsequently placed for electroplating has a reduced concentration of accelerator molecules. The pre-treatment causes a reduction in roughness of the electroplated copper surface, particularly during the initial phases of copper growth.
    Type: Grant
    Filed: December 18, 2003
    Date of Patent: February 1, 2011
    Assignee: Novellus Systems, Inc.
    Inventors: Eric Webb, Jon Reid, Yuichi Takada, Timothy Archer
  • Patent number: 7857960
    Abstract: Providing a copper plating method with which to precipitate copper-plated membranes that are uniform and flat, and that have good mirror gloss even when relatively thin copper plated membranes are formed. A copper plating method wherein the object to be plated and a pre-treatment solution in which bromide compound ions are contained are brought into contact and copper is precipitated by means of electrical plating using a copper plating solution.
    Type: Grant
    Filed: August 11, 2008
    Date of Patent: December 28, 2010
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Shinjiro Hayashi, Hisanori Takiguchi
  • Patent number: 7850837
    Abstract: The present invention provides a method for preparing an aluminum support for lithographic printing plate, the aluminum support for a lithographic printing plate obtained by the method and a presensitized plate using the same, characterized in that anodizing treatment is performed on an aluminum plate after hydrochloric acid electrolytic graining treatment if necessary, nitric acid electrolytic graining treatment are performed on the aluminum plate at a specified ratio of quantities of electricity, and with this method, a lower-purity aluminum plate could be used and a obtained support for a lithographic printing plate is excellent in press life and scum resistance when a lithographic printing plate is prepared.
    Type: Grant
    Filed: May 11, 2006
    Date of Patent: December 14, 2010
    Assignee: FUJIFILM Corporation
    Inventors: Atsushi Matsuura, Akio Uesugi, Hideki Miwa, Atsuo Nishino, Hirokazu Sawada
  • Publication number: 20100290157
    Abstract: A magnetic recording head is provided. The magnetic recording head comprises a write pole and a write coil structure configured to generate a magnetic field in the write pole. The write coil structure comprises a substrate layer and a coil material disposed within the substrate layer. The write coil structure is substantially free of photoresist. A method for forming a write coil structure is also provided. The method comprises the steps of providing a substrate layer, forming a photoresist pattern mask over the substrate layer, opening a damascene trench in the substrate layer by reactive ion etching, and disposing a coil material into the damascene trench in the substrate layer.
    Type: Application
    Filed: May 14, 2009
    Publication date: November 18, 2010
    Applicant: Western Digital (Fremont), LLC
    Inventors: Jinqiu Zhang, Hongping Yuan, Hai Sun, Ming Zhao