Abstract: A wavelength conversion member includes a substrate, a phosphor layer, and a ventilated blade. The substrate is configured to rotate based on an axis. The phosphor layer is disposed on the substrate. The ventilated blade is disposed on the substrate and has a pore density between 10 ppi and 500 ppi or a volume porosity between 5% and 95%.

Abstract: An aluminum base wire includes a core wire made of pure aluminum or an aluminum alloy and a coating layer provided on an outer periphery of the core wire. The coating layer includes a first layer provided on the outer periphery of the core wire, a second layer provided on an outer periphery of the first layer, and a third layer provided on an outer periphery of the second layer. The first layer is composed of at least one metal selected from the group consisting of nickel, a nickel alloy, copper, and a copper alloy, the second layer is composed of metals that include zinc and tin, the third layer is composed of at least one metal selected from the group consisting of tin and tin alloys that contain substantially no zinc, and a zinc content in the second layer is 15 atomic % or more and 60 atomic % or less.

Abstract: Electroplating of aluminum may be utilized to form electrodes for solar cells. In contrast to expensive silver electrodes, aluminum allows for reduced cell cost and addresses the problem of material scarcity. In contrast to copper electrodes which typically require barrier layers, aluminum allows for simplified cell structures and fabrication steps. In the solar cells, point contacts may be utilized in the backside electrodes for increased efficiency. Solar cells formed in accordance with the present disclosure enable large-scale and cost-effective deployment of solar photovoltaic systems.

Abstract: This application relates to an enclosure for a portable electronic device. The enclosure includes a metal substrate, and an anodized layer overlaying the metal substrate and including pores having a near-infrared (NIR) light-absorbing material therein, where an average specular reflectance of NIR light that is incident upon an external surface of the anodized layer is less than 3%.

Abstract: A method of manufacturing a terminal-equipped electrical wire includes: inserting a core-wire exposed part of a core wire of an electrical wire at a terminal between inner wall surfaces of a pair of piece parts of a terminal fitting including a core-wire connection body formed of a bottom part and the piece parts protruding from both ends of the bottom part, and placing the core-wire exposed part on an inner wall surface of the bottom part; melting the core-wire exposed part and the core-wire connection body by emitting a laser beam to the core-wire exposed part and the core-wire connection body from a free end side of each piece part; and fixing the core-wire exposed part and the core-wire connection body melted by the laser beam, with the emission of the laser beam stopped.

Abstract: A CEM and an ion detector of one embodiment have a structure for enabling ion detection with higher sensitivity than the prior art. A channel electron multiplier includes a channel body, an input-side conductive layer, an output-side conductive layer, and an electrode. The channel body includes a channel, and a resistance layer and an electron emission layer formed on the channel's inner wall surface. The input-side conductive layer is provided on the channel body, and a part thereof extends into the tapered opening. The output-side conductive layer is provided on the tapered opening. The electrode has openings through which charged particles pass, and is disposed on an opposite side of the output end face to the input end face. The electrode and the input-side conductive layer are set to the same potential to eliminate the influence of an external electric field in the tapered opening.

Abstract: A photo-emission semiconductor device superior in reliability is provided. The photo-emission semiconductor device includes a semiconductor layer, a light reflection layer provided on the semiconductor layer, and a protective layer formed by electroless plating to cover the light reflection layer. Therefore, even if the whole structure is reduced in size, the protective layer reliably covers the light reflection layer without gap.

Abstract: A surface finish for a printed circuit board (PCB) and semiconductor wafer includes a nickel disposed over an aluminum or copper conductive metal surface. A barrier layer including all or fractions of a nitrogen-containing molecule is deposited on the surface of the nickel layer to make a barrier layer/electroless nickel (BLEN) surface finish. The barrier layer allows solder to be reflowed over the surface finish. Optionally, gold (e.g., immersion gold) may be coated over the barrier layer to create a nickel/barrier layer/gold (NBG) surface treatment. Presence of the barrier layer causes the surface treatment to be smoother than a conventional electroless nickel/immersion gold (ENIG) surface finish. Presence of the barrier layer causes a subsequently applied solder joint to be stronger and less subject to brittle failure than conventional ENIG.

Abstract: Anode foil, preferably aluminum anode foil, is etched using a process of treating the foil in an electrolyte bath composition comprising a sulfate, a halide, an oxidizing agent, and a surface active agent. The anode foil is etched in the electrolyte bath composition by passing a charge through the bath. The etched anode foil is suitable for use in an electrolytic capacitor.

Abstract: A method of treating a metallic surface of an article including the steps of providing an article having a metallic surface; texturizing the surface using a laser to create a controlled pattern across the surface; and anodizing the surface. The controlled pattern may include a series of pits etched in a predetermined repeating pattern across the surface, such as an array of dots or a grid. The controlled pattern may also include a series of pits etched in a predetermined pseudo-random pattern across the surface.

Abstract: A metal surface treated to have a distinct cosmetic appearance such as an integral layer that is glossy may be used in electronic devices. The surface treatment may include polishing a metal surface, texturing the polished metal surface, polishing the textured surface, followed by anodizing the surface, and then polishing the anodized surface. The metal surface may also be dyed to impart a rich color to the surface.

Abstract: A method of producing a multicolor surface is described herein. The method includes the following steps: providing an aluminum-based substrate having an outer and inner surfaces; performing a mechanical process on the substrate; forming at least one fixing portion on the inner surface of the substrate; forming at least one conductive hole on the fixing portion; performing a first anodization on the substrate to form a first oxide layer that can be dyed with a first color on the outer surface of the substrate; removing at least some of the first oxide layer from the fixing portion and the outer surface of the substrate; performing a second anodization on the substrate to form a second oxide layer that can be dyed with a second color on the exposed outer surface of the substrate stripped of the first oxide layer; and removing the fixing portion.

Abstract: A plating method for an RF device is disclosed. The method includes (a) pre-treating the RF device made from a substrate material; (b) forming a copper plating layer by applying copper plating to the RF device; and (c) forming a thin-film layer over the copper plating layer, the thin-film layer made of a precious metal, where a thickness of the precious-metal thin-film layer is thinner than a skin depth at a working frequency band. The disclosed method makes it possible to provide a plating treatment with a low cost while providing a superior appearance quality.

Abstract: An electrode is formed using a sanding mechanism to condition the surface of the electrode for electrochemical purposes. Hazardous particles emitted during sanding are captured using jetted liquid, and may be recycled for later use. The sanded surface provides increased electrode lifespan and lead oxide adherence.

Abstract: A method of producing a multicolor surface is described herein. The method includes the following steps: providing an aluminum-based substrate having an outer and inner surfaces; performing a mechanical process on the substrate; forming at least one fixing portion on the inner surface of the substrate; forming at least one conductive hole on the fixing portion; performing a first anodization on the substrate to form a first oxide layer that can be dyed with a first color on the outer surface of the substrate; removing at least some of the first oxide layer from the fixing portion and the outer surface of the substrate; performing a second anodization on the substrate to form a second oxide layer that can be dyed with a second color on the exposed outer surface of the substrate stripped of the first oxide layer; and removing the fixing portion.

Abstract: A copper-substitute aluminum material made from a copper and cobalt anodizing process. The process includes the steps of: anodizing the aluminum material by submersing it in a basic sulfuric acid to build an anodic layer producing anodized aluminum material; combining copper and cobalt salts together in one bath; lowering the pH of the bath to between about 1.0 and about 3.0; coloring the anodized aluminum material electrolytically by submersing the anodized aluminum material in the bath of copper and cobalt salts; and applying an electrical current to the bath plating the copper and cobalt salts into the anodized aluminum material.

Abstract: A system and process for reducing cosmetic defects such as black lines, and otherwise improving the final cosmetic appearance of anodized parts is disclosed. The process can include degreasing an aluminum or other metal part in a neutral to low alkaline solution having a mild detergent, chemically polishing the metal part with a specialized solution having one or more additives at an increased temperature for a reduced amount of time, and anodizing the metal part at a reduced voltage and for a reduced amount of time. An activating step can also be performed as part of the overall process. Tap water rinse, deionized water rinse, desmut, seal and bake procedures can also be performed on the metal part.

Abstract: A highly polished surface on an aluminum substrate is formed using any number of machining processes. During the machining process, intermetallic compounds are typically generated at a top surface area of the aluminum substrate caused by spot heat generated between the tool edge and the cut tip of the aluminum substrate during the cutting process. The intermetallic compounds can leave surface imperfections after conventional mechanical polishing operations that render the surface of the aluminum substrate difficult to obtain a desired high glossiness due to exfoliation of the intermetallic compounds from the top surface. In order to remove the effect of the intermetallic compounds, an acid etching solution is applied to the surface resulting in removal of intermetallic compounds across a surface portion of the aluminum substrate.

Abstract: A method for making a stamper which has an uneven surface pattern, in which unit structures are arranged in x and y directions at respective periods that are both shorter than the shortest wavelength of an incoming light ray, on the surface of a substrate and satisfies the following Inequality (1): ? ? ? x , y ? min < 1 ni + ni · sin ? ? ? ? ? i max ( 1 ) where ?min is the shortest wavelength of the incoming light ray, ?imax is the largest angle of incidence of the incoming light ray, ni is the refractive index of an incidence medium, ?x is the period of the uneven surface pattern in the x direction, and ?y is the period of the pattern in the y direction. As a result, diffraction of short-wave light components can be reduced in a broad wavelength range.

Abstract: A workpiece including aluminum or an aluminum alloy on a surface thereof is subjected to surface treatment including the steps of immersing in an acidic or alkaline aluminum oxide film-removing solution containing a salt or oxide of a metal capable of substitution with aluminum and forming a substituted metal layer and contained in the removing solution on a surface of the aluminum or aluminum alloy while removing an aluminum oxide film on aluminum or aluminum alloy surface, forming a substituted zinc film by zinc substitution treatment without removing the substituted metal layer, removing the substituted metal layer and substituted zinc film with an oxidizing liquid, and subjecting again to zinc substitution treatment, forming a substituted zinc film.

Abstract: Aluminum alloy products comprising an aluminum alloy base and a sulfate-phosphate oxide zone integral therewith are disclosed. Methods of making the same are also disclosed.

Abstract: The invention relates to compositions and methods that are useful in etching a metal surface. In particular, the invention relates to novel acid compositions and methods of using such compositions in etching a metal surface, preferably an aluminum surface prior to anodizing to dissolve impurities, imperfections, scale, and oxide. The compositions are effective in maintaining their etching capacity and in removing smut produced by the etching of a surface as well as in general cleaning.

Abstract: A method of manufacturing a substrate processing chamber component comprises forming a chamber component comprising a metal alloy comprising yttrium and aluminum, and anodizing an exposed surface of the metal alloy.

Abstract: There is disclosed a process for producing an aluminium alloy sheet, which comprises subjecting a surface of the sheet to anodising conditions to form on the surface an aluminium oxide barrier layer of thickness 10 to 50 nm and treating the oxide layer with an aqueous solution of alkali to remove the layer, thereby leaving a roughened surface on the alloy sheet.

Abstract: The present invention provides a method for preparing an aluminum support for lithographic printing plate, the aluminum support for a lithographic printing plate obtained by the method and a presensitized plate using the same, characterized in that anodizing treatment is performed on an aluminum plate after hydrochloric acid electrolytic graining treatment if necessary, nitric acid electrolytic graining treatment are performed on the aluminum plate at a specified ratio of quantities of electricity, and with this method, a lower-purity aluminum plate could be used and a obtained support for a lithographic printing plate is excellent in press life and scum resistance when a lithographic printing plate is prepared.

Abstract: This invention involves the technological field of electroplating, chemical plating, specially involves a method for partially plating aluminum and aluminum copper radiators. A radiator is conducted partial chemical oxidation and enclosure before undergoing galvanization. Firstly oxidize the non-plate surface of the radiator by chemical oxidation, then utilize a sealing compound to fill up tiny holes of the porous layer to make a film thereon against the erosion of acid and alkali, and then process common chemical plating or electroplating. Only plate a weldable nickel-phosphorus alloy on the touching parts at where the aluminum radiator or the aluminums and copper radiator connect with the main frame.

Abstract: Aluminum alloy products comprising an aluminum alloy base and a sulfate-phosphate oxide zone integral therewith are disclosed. Methods of making the same are also disclosed.

Abstract: A method of treating a metal substrate comprise the steps of: anodizing the metal substrate to create pores on the surface of the substrate; and treating the metal substrate by NCVM to form a NCVM coating on the surface of the substrate.

Abstract: Methods for fabricating a nanowire array epoxy composite with high structural integrity and low effective thermal conductivity to achieve a power conversion efficiency goal of approximately 20% and power density of about 104 W/m2 with a maximum temperature below about 380° C. Further, a method includes fabricating a self-supporting thick 3-D interconnected nanowire array with high structural integrity and low effective thermal conductivity to achieve a power conversion efficiency goal of 20% and power density of about 104 W/m2 with a maximum temperature of about 700° C., the nanowire array having substantially only air between nanowires.

Abstract: The invention relates to compositions and methods that are useful in etching a metal surface. In particular, the invention relates to novel acid compositions and methods of using such compositions in etching a metal surface, preferably an aluminum surface prior to anodizing to dissolve impurities, imperfections, scale, and oxide. The compositions are effective in maintaining their etching capacity and in removing smut produced by the etching of a surface as well as in general cleaning.

Abstract: A lithographic printing plate support capable of obtaining a presensitized plate which is excellent in scumming resistance and scratch resistance and achieves a good balance between sensitivity and press life, and a method of manufacturing the support are provided. The support includes a surface which has an arithmetic mean roughness Ra of 0.36 to 0.50 ?m; not more than 3.0 recesses with a depth of at least 4 ?m per 400 ?m square region; and a surface area ratio ?S5(0.02-0.2) determined from Sx5(0.02-0.2) denoting the actual surface area of a 5 ?m square surface region as determined by three-point approximation based on data obtained by extracting 0.02 to 0.2 ?m wavelength components from three-dimensional data on the surface region measured with an atomic force microscope at 512×512 points and S0 denoting the geometrically measured surface area of the surface region, of 50 to 90%.

Abstract: The present invention provides a non-cyanide aqueous acidic immersion plating solution having a pH of from about 3.5 to about 6.5 and comprising zinc ions, nickel ions and/or cobalt iron ions, and fluoride ions. In one embodiment the immersion plating solutions of the invention also contain at least one inhibitor containing one or more nitrogen atoms, sulfur atoms, or both nitrogen and sulfur atoms. The present invention also relates to methods for depositing zinc alloy protective coatings on aluminum and aluminum alloy substrates comprising immersing the aluminum or aluminum alloy substrate in the non-cyanide acidic immersion plating solutions of the invention. Optionally, the zinc alloy coated aluminum or aluminum alloy substrate is plated using an electroless or electrolytic metal plating solution.

Abstract: This invention relates to a method of anodising magnesium material which includes anodising the magnesium while it is immersed in an aqueous electrolyte solution having a pH above 7, and in the presence of a phosphate, the electrolyte solution also containing a sequestering agent. The method may further include the provision of a plasma suppressing substance within the electrolyte solution. Furthermore, the electrolyte solution may also preferably include a tertiary amine such a TEA, and the current passed through the electrolyte solution may preferably be a straight DC current.

Abstract: The present invention is directed to a conductive polyethylenedioxythiophene (PEDOT) polymer coated electrode adapted for use as a cathode electrode of an electrolytic capacitor and a method of manufacturing the same. According to the present invention, a metal foil substrate is placed in an aqueous solution of a doped 3,4-ethylenedioxythiophene (EDOT) monomer and a co-solvent, to dissolve the EDOT monomer, and a current is applied until the desired thickness of the polymer coating is electrochemically deposited. Additionally, an organic acid is added to the aqueous solution to act as an oxidizer. In order to improve the uniformity and adherence of the coating a surfactant may also be added. In a preferred embodiment, the EDOT monomer and cosolvent are first mixed, and then added to a water solution of oxidizer and dopant. The polymer film is deposited electrochemically onto the substrate by applying a DC current between 0.05 mA/cm2 and 5.0 mA/cm2 for 1 to 60 minutes, more preferably between about 0.

Abstract: The invention relates to a process for obtaining gold-colored aluminum oxide layers in which the coloring of the oxidized surface of the aluminum or aluminum alloys is carried out by an electrolytic process in an electrolyte comprising an alkanesulfonic acid and an alkanesulfonate of silver, and to the use of the gold-colored workpieces based on aluminum or aluminum alloys produced by this process for decorative purposes. The invention furthermore relates to an electrolyte solution for coloring the oxidized surface of aluminum or aluminum alloys gold by an electrolytic process, and to the use of an electrolyte comprising an alkanesulfonate of silver for coloring aluminum oxide layers based on aluminum or aluminum alloys gold in an electrolytic process.

Abstract: We have discovered that the formation of particulate inclusions at the surface of an aluminum alloy article, which inclusions interfere with a smooth transition from the alloy surface to an overlying aluminum oxide protective film can be controlled by maintaining the content of mobile impurities within a specific range and controlling the particulate size and distribution of the mobile impurities and compounds thereof; by heat-treating the aluminum alloy at a temperature less than about 330° C.; and by creating the aluminum oxide protective film by employing a particular electrolytic process. When these factors are taken into consideration, an improved aluminum oxide protective film is obtained.

Abstract: Disclosed is a support for a lithographic printing plate obtainable by performing at least graining treatment on an aluminum plate, having on its surface thereof, a grain shape with a structure in which a grained structure with medium undulation of 0.5 to 5 ?m average aperture diameter and a grained structure with small undulation of 0.01 to 0.2 ?m average aperture diameter are superimposed, and a presensitized plate provided with an image recording layer on the support for a lithographic printing plate. By using this presensitized plate, a balance between scum resistance and press life when a lithographic printing plate is produced therefrom, which has been in a trade-off relation in the past, can be maintained at a high level.

Abstract: A negative ion generating medium for generating negative ions from the surface of a mother material made of aluminum or aluminum alloy. The negative ion generating medium has the mother material of aluminum or aluminum alloy covered at the surface with an anodized layer on which a rare metal separated from a rare metal solution such as zirconium salt is deposited. As the rare metal is deposited in the pores provided in the anodized layer, its negative ion generating area can be increased thus releasing a large number of negative ions. The negative ion generating medium is manufactured by electrolytically processing the mother material in an electrolyte solution of sulfuric acid doped with a rare metal salt such as lithium salt to develop the anodized layer on the surface of the mother material and deposit the rare metal on the anodized layer.

Abstract: A method is disclosed for forming a clear anodized coating on an aluminum base alloy containing more than three percent by weight magnesium. The alloy surface to be anodized is treated with an aqueous solution of a mineral acid such as sulfuric acid (10 to 20%), nitric acid (10 to 30%) or phosphoric acid (40 to 80%) under the influence of a relatively low voltage direct current. This treatment suitably reduces the magnesium content of the surface layer and, subsequently, a relatively low current density anodization in sulfuric acid produces the clear coating. The clear coating may then be colored by known processes.

Abstract: The invention provides a method of plating an integrated circuit. An activation plate is positioned adjacent to at least one integrated circuit. The integrated circuit includes a plurality of bond pads comprising a bond-pad metal, and the activation plate also comprises the bond-pad metal. A layer of electroless nickel is plated on the bond pads and the activation plate, and a layer of gold is plated over the layer of electroless nickel on the bond pads and the activation plate. An integrated circuit with bond pads plated using the activation plate, and a system for plating an integrated circuit is also disclosed.

Abstract: A method and apparatus is disclosed for sequential processing of integrated circuits, particularly for conductively passivating a contact pad with a material which resists formation of resistive oxides. In particular, a tank is divided into three compartments, each holding a different solution: a lower compartment and two upper compartments divided by a barrier, which extends across and partway down the tank. The solutions have different densities and therefore separate into different layers. In the illustrated embodiment, integrated circuits with patterned contact pads are passed through one of the upper compartments, in which oxide is removed from the contact pads. Continuing downward into the lower compartment and laterally beneath the barrier, a protective layer is selectively formed on the insulating layer surrounding the contact pads. As the integrated circuits are moved upwardly into the second upper compartment, a conducting monomer selectively forms on the contact pads prior to any exposure to air.

Abstract: The surface of an aluminum alloy high-temperature processed article containing Mg is heated at a high temperature of 200° C. or above, thereafter the surface is etched with an aqueous solution containing a chelating agent, and then at least one surface treatment selected from hydration oxidation treatment, coating type chromating, coating, anodizing, and alternating current electrolysis in an aqueous alkali solution is further carried out. This method can provide a surface-treated aluminum alloy high-temperature processed article having superior anticorrosion and adhesion of coatings and a good surface appearance, and is effective as a pretreatment for further surface treatment.

Abstract: A method for applying a metal layer onto at least one surface of an aluminium or aluminium alloy workpiece, including the steps of pretreating the surface and applying the metal layer by plating, wherein the pretreating step includes a non-electrolytic treatment by immersion of the workpiece in a single acidic solution, preferably a sulphuric acid solution, having a temperature of at most 100° C. A brazed assembly comprising at least one component of an aluminium workpiece made by this method is also disclosed.

Abstract: A method for the color finishing of aluminum frames and other components for motor vehicles comprises anodizing an aluminum surface and coloring the aluminum surface. The coloring of the aluminum surface may be effected by an adsorptive coloring process, an electrolytic coloring process, an interference coloring process, or any combination of the foregoing processes.

Abstract: The process of anodizing aluminum or an aluminum alloy in an aqueous solution of about 60 g/L to about 100 g/L sulfuric acid and optionally about 0.1 g/L to about 10.7 g/L boric acid, maintained between a temperature of about 70° F. to about 90° F. An aluminum object is immersed in the acid bath, where it acts as an anode. A voltage of 6 V to 16 V is applied to the object at a current density, which varies with the alloy. The object is maintained in the anodizing conditions until an aluminum oxide coating is achieved with a weight of about 30 to about 800 mg/ft2.

Abstract: A method of manufacturing an article of manufacture for use in a fluxless brazing process is disclosed. The method comprises the step of applying a braze-promoting layer including one or more metals selected from the group consisting of nickel, cobalt and iron, onto a bonding layer which comprises one or more metals selected from the group consisting of zinc, tin, lead, bismuth, nickel, antimony and thallium and which is disposed on a substrate including aluminum.

Abstract: The invention provides a pretreatment process for electroplating aluminum parts or strip, in which the zincating solution is modified to improve the adhesion of the subsequent electroplate to the substrate. The aluminum part or strip, such as an aluminum coin blank or strip for coin blanks, is pretreated with an improved zincate solution which provides hydroxide ions in an amount in the range of 75-175 gpl, zinc ions in an amount in the range of 15-40 gpl, nickel ions in an amount in the range of 2-10 gpl and copper ions in an amount in the range of 1.5-5 gpl. The pretreatment process preferably includes a copper strike applied from a copper cyanide strike bath at a pH in the range of 8.5-11.0, using a current density in the range of 0.1-10 A/dm2. The pretreatment and electroplating steps are preferably conducted by barrel plating, in accordance with another aspect of the invention.

Abstract: Corrosion resistance of metallic components such as stainless steel components of vehicles, and especially aluminum-based components of aircraft, is enhanced by application of an e-coat paint or primer which is enhanced by incorporation of cerium ions into the e-coat electrolytic bath. The resulting overall coating includes a cerium-based layer under a cerium-enhanced e-coat paint or primer layer.

Abstract: The corrosion resistance of an aluminum or aluminum alloy component is enhanced by immersing an aluminum alloy to act as a cathode and an oxygen-evolving anode in an electrolyte comprising water, cerium ions, and an additive selected from among animal gelatin, derivatives of animal gelatin, and amino acids, then passing an electrical current through the electrolyte to deposit a cerium-based coating onto the aluminum-based component.

Abstract: A method of making improved aluminum printing plates comprising graining the aluminum plates, de-smutting them by treating them with nitric acid solution, then rinsing with hot water, acetating the aluminum plates, and silicating the aluminum plates. The plates are then coated with a photoresist, pattern exposed and developed. The printing plates of the invention have improved characteristics; they have excellent adhesion of the resist in image areas, and ink repellency in non-image areas. The developed printing plates have excellent durability without baking.