Electrolytic Treatment Patents (Class 205/219)
  • Patent number: 9793018
    Abstract: This invention generally concerns radioactive decontamination of deposits on components in a nuclear power plant and is specifically concerned with improved compositions, systems and methods for disrupting, dissolving, removing and reducing at ambient temperature radionuclides formed on the primary side surfaces of components in a pressurized water reactor and the internal components of a boiling water reactor. The methods include identifying the structure, taking the structure out of operational service, contacting the structure with an aqueous solution (e.g., a recirculating flow or static immersion), and adding an effective amount of elemental metal in solid form to the aqueous solution.
    Type: Grant
    Filed: October 29, 2013
    Date of Patent: October 17, 2017
    Assignee: Westinghouse Electric Company LLC
    Inventors: Kurtis R. Crytzer, Lauren R. Ikeda, Nicole D. Vitale
  • Patent number: 9506163
    Abstract: To provide a method of electroplating with Sn-alloy in which a problem of deposition of metals on an anode when electroplating with Sn-alloy such as Sn—Ag based-alloy or the like is performed is solved and a soluble anode is enabled to be used. Dividing an inside of a plating tank into a cathode cell and an anode cell by an anion-exchange membrane; supplying plating solution including Sn ions to the cathode cell; supplying acid solution to the anode cell; electroplating by energizing an object to be plated in the cathode cell and an anode made of Sn in the anode cell; and using the acid solution including Sn ions liquated out form the anode made of Sn along with progress of plating as replenishing solution of Sn ions for plating solution in the cathode cell.
    Type: Grant
    Filed: February 12, 2013
    Date of Patent: November 29, 2016
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Takeshi Hatta, Akihiro Masuda
  • Publication number: 20150101935
    Abstract: An electroplating apparatus includes a container containing plural portions and an ionic liquid plating solution that is capable of flowing therebetween. The plural portions include at least a first portion containing a counter electrode that includes coating donor material and a second portion that includes a workpiece. A porous scrubber separating the first and second portions has a plurality of metallic outer surfaces in contact with the ionic liquid plating solution. Coating, repair, and regeneration methods using an ionic liquid plating solution are also described.
    Type: Application
    Filed: October 9, 2014
    Publication date: April 16, 2015
    Inventor: Lei Chen
  • Patent number: 8778163
    Abstract: A method for electroplating aluminum metal on a magnesium alloy includes providing an Lewis acidic ionic liquid having dissolved species of an aluminum metal salt; pre-treating a surface of the magnesium alloy including subjecting the surface of the magnesium alloy to a reverse current etching in the ionic liquid; electroplating the aluminum metal on the surface using the ionic liquid as the electrolyte; and subjecting the surface of the magnesium alloy to a post-treatment including neutralization rinsing in a rinsing solvent solution.
    Type: Grant
    Filed: September 22, 2011
    Date of Patent: July 15, 2014
    Assignee: Sikorsky Aircraft Corporation
    Inventors: Xiaomei Yu, Mark R. Jaworowski, Daniel V. Viens, Joseph J. Sangiovanni
  • Publication number: 20140110266
    Abstract: Iron containing substrates are electrically polarized in a pre-plating composition which activates the surface of the steel substrate to receive thin tin or tin alloy. The thin tin or tin alloy is electroplated onto the activate surface of the steel substrate. The thin tinplate and alloy have reduced amounts of pores in the surface.
    Type: Application
    Filed: October 21, 2013
    Publication date: April 24, 2014
    Inventor: Peter R. LEVEY
  • Publication number: 20140008236
    Abstract: A method of treating a part made of an aluminum alloy containing copper at a content in the range 0.1% to 10% by weight includes providing the part; and performing electrochemical pretreatment of the part in a first electrolyte bath containing sulfuric acid and a first oxidizer compound, a first potential difference being established between a first cathode and a first anode dipped in the first bath, the part being the first anode, the concentration of the first oxidizer compound being such that the corrosion potential of the aluminum alloy is greater than +100 mV relative to a hydrogen normal electrode. After the pretreatment, the method includes anodizing the part in a second electrolyte bath containing sulfuric acid and a second oxidizer compound, a second potential difference ?V2 being established between a second cathode and a second anode dipped in the second bath, the part being the second anode.
    Type: Application
    Filed: July 2, 2013
    Publication date: January 9, 2014
    Inventors: Emmanuel Rocca, Joffrey Tardelli, Myriam Augros
  • Patent number: 8613847
    Abstract: The method of applying a polyelectrolyte multilayer film for corrosion control involves chemical and/or electrochemical pretreatment of a metallic substrate for better adherence of the protective film to the substrate. The method includes anodically polarizing the substrate in a solution of an acid for a period from one second to five hundred seconds before multilayer deposition. The acid may be an inorganic acid, such as sulfuric acid, phosphoric acid, hydrochloric acid, nitric acid, etc., or an organic acid, such as oxalic acid, acetic acid, etc. The method may include abrading the substrate and rinsing the substrate with deionized water before polarizing the substrate, and applying the polyelectrolyte multilayers following pretreatment.
    Type: Grant
    Filed: November 19, 2008
    Date of Patent: December 24, 2013
    Assignee: King Fahd University of Petroleum and Minerals
    Inventors: Mazen M. Khaled, Basel F. Abu-Sharkh, Abdalla Manda
  • Patent number: 8595921
    Abstract: An electrode is formed using a sanding mechanism to condition the surface of the electrode for electrochemical purposes. Hazardous particles emitted during sanding are captured using jetted liquid, and may be recycled for later use. The sanded surface provides increased electrode lifespan and lead oxide adherence.
    Type: Grant
    Filed: November 17, 2010
    Date of Patent: December 3, 2013
    Assignee: RSR Technologies, Inc.
    Inventors: Timothy W. Ellis, Matthew Burr
  • Patent number: 8449753
    Abstract: The present invention provides an apparatus for plating pretreatment of a cylinder block that includes an electrode performing a plating pretreatment of the cylinder inner wall surface. A gap flow channel communicates with an in-electrode flow channel at a position closest to a seal jig, the gap flow channel being adapted to introduce a treatment liquid to the cylinder inner wall surface, the in-electrode flow channel being adapted to receive the treatment liquid having passed through a communicating hole. The present invention is provided a method for pretreating before plating a cylinder block including disposing an electrode to face the cylinder inner wall surface so as to form a gap flow channel, and introducing a treatment liquid to the gap flow channel thereby flowing through the treatment liquid toward a seal jig and then into an in-electrode flow channel through a communicating hole.
    Type: Grant
    Filed: September 28, 2009
    Date of Patent: May 28, 2013
    Assignee: Suzuki Motor Corporation
    Inventors: Hitoshi Muramatsu, Seiya Kunioka, Nobuyuki Suzuki, Naoyuki Suda, Akira Ishibashi, Tomohiro Asou, Minoru Imai, Manabu Suzuki, Masahiro Ogawa
  • Publication number: 20130058149
    Abstract: Various aspects of the invention provide memory devices, methods of storing and reading data, and silver/molecular-layer/metal (SMM) junctions. One aspect of the invention provides a memory device including a plurality of SMM junctions and an electrical structure configured to permit application of electricity across one or more of the plurality of SMM junctions. Another aspect of the invention provides a method of storing data on a memory device including a plurality of SMM junctions. The method includes applying electrical energy across a subset of the SMM junctions to switch the junction to a more conductive state. Another aspect of the invention provides an SMM junction including a silver layer, a copper layer, and a molecular layer positioned between the silver layer and the copper layer.
    Type: Application
    Filed: October 4, 2010
    Publication date: March 7, 2013
    Applicant: UNIVERSITY OF MEMPHIS RESEARCH FOUNDATION
    Inventor: Lam H. Yu
  • Publication number: 20130053934
    Abstract: Biocompatible electrodes with smaller geometric area improve the selectivity of the neural recording and stimulation applications. A volume within the electrode back plane of a micro-reaction chamber (?RC) is used to confine and sequester an electrochemical reaction used for charge passage. The ?RC electrode decreases impedance and improves charge storage capacity without altering the geometry of the active site.
    Type: Application
    Filed: August 27, 2012
    Publication date: February 28, 2013
    Applicant: THE PENN STATE RESEARCH FOUNDATION
    Inventors: Bruce J. Gluckman, Balaji Shanmugasundaram
  • Publication number: 20130048504
    Abstract: Embodiments of the present invention include systems and methods for low-rate electrochemical (wet) etch that use a net cathodic current or potential. In particular, some embodiments achieve controlled etch rates of less than 0.1 nm/s by applying a small net cathodic current to a substrate as the substrate is submerged in an aqueous electrolyte. Depending on the embodiment, the aqueous electrolyte utilized may comprise the same type of cations as the material being etched from the substrate. Some embodiments are useful in etching thin film metals and alloys and fabrication of magnetic head transducer wafers.
    Type: Application
    Filed: August 30, 2011
    Publication date: February 28, 2013
    Applicant: Western Digital (Fremont), LLC
    Inventors: Jose A. Medina, Tiffany Yun Wen Jiang, Ming Jiang
  • Patent number: 8323472
    Abstract: The method of surface treatment, as applied onto a metal base material, of the present invention includes a reduction treatment step of reduction-treating the oxide film formed on the metal base material and an oxidation treatment step of oxidation-treating the oxide film having been subjected to the reduction treatment.
    Type: Grant
    Filed: July 10, 2008
    Date of Patent: December 4, 2012
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Hajime Hasegawa, Yusuke Watanabe
  • Publication number: 20120241324
    Abstract: A coated article includes a substrate including a porous surface and an anodic oxidation film. The porous surface defines a plurality of nanopores. The anodic oxidation film is formed on the substrate covering the porous surface by anodic oxidation process. The anodic oxidation film has a plurality of bonding protrusions, and each bonding protrusion is retained in one of the nanopores to improve a binding force between the substrate and the anodic oxidation film.
    Type: Application
    Filed: October 7, 2011
    Publication date: September 27, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd
    Inventors: HSIN-PEI CHANG, WEN-RONG CHEN, HUANN-WU CHIANG, CHENG-SHI CHEN, CHAO-YONG ZHANG
  • Patent number: 8133377
    Abstract: A photosensitive film, which has a transparent support and a silver salt emulsion layer containing a silver salt formed thereon, is exposed and developed to form a metallic silver portion. The base material to be plated is electrified in an electrolytic solution free of plating substances, using the metallic silver portion as a cathode. Then, the electrified base material is subjected to an electroless plating treatment to form a first plated layer only on the metallic silver portion. The base material is subjected to an electroplating treatment to form a second plated layer on the first plated layer, further form a third plated layer on the second plated layer.
    Type: Grant
    Filed: March 21, 2008
    Date of Patent: March 13, 2012
    Assignee: Fujifilm Corporation
    Inventors: Kentaro Okazaki, Takayasu Yamazaki
  • Publication number: 20110155581
    Abstract: A metal film-forming method is capable of forming a metal film on a surface of a base metal film, formed on a surface of a substrate, with sufficient adhesion to the base metal film even when a natural oxide film is formed on the surface of the base metal film. The metal film-forming method includes: preparing a substrate having a base metal film formed on a surface; and carrying out electroplating of the substrate using the base metal film as a cathode and another metal as an anode while immersing the substrate in a solution containing a metal complex and a reducing material, both dissolved in a solvent, to form a metal film, deriving from a metal contained in the metal complex, on the surface of the base metal film.
    Type: Application
    Filed: December 23, 2010
    Publication date: June 30, 2011
    Inventors: Akira SUSAKI, Tsutomu Nakada, Hideki Tateishi
  • Publication number: 20110157704
    Abstract: It is aimed at finding out a surface pattern and physical properties required for an antireflective film having an excellent antireflective property for light, a light transmissivity, and the like, and at providing an antireflective film having such a specific surface pattern and physical properties, and a production method of the antireflective film; and provided for this object, is an antireflective film, obtained by: processing a surface of an aluminum material, by mechanical polishing, chemical polishing and/or electrolytic polishing; subsequently producing a pattern of mold having taper-shaped pores on the surface of the aluminum material, by combining a formation of an anodic oxide coating based on anodic oxidation of the surface of the aluminum material, with etching of the anodic oxide coating; and transferring the pattern of mold onto an antireflective film-forming material; wherein the antireflective film has, on a surface thereof, convexities having an average height between 100 nm inclusive and 1,
    Type: Application
    Filed: May 12, 2009
    Publication date: June 30, 2011
    Applicant: DNP Fine Chemicals Co., Ltd.
    Inventors: Kazuya Sato, Tsukasa Matsumoto, Yutaka Watanabe, Jun Rokuhara
  • Publication number: 20110094888
    Abstract: A method of rejuvenating a Ru plating seed layer during write pole fabrication in a PMR head is disclosed that involves forming an opening in a mold forming layer. A Ru seed layer is deposited by CVD within the opening and on a top surface of the mold forming layer. The substrate with the Ru seed layer is immersed in an acidic solution and an electric potential is applied for 1 to 2 minutes such that hydrogen is generated to reduce ruthenium oxides to Ru metal on the seed layer surface in an activation step. One or more surfactants are used to improve wettability of the Ru layer. The substrate is transferred directly to an electroplating solution without drying following the activation step to minimize exposure to oxygen that could regenerate oxides on the surface of the Ru layer. As a result, write pole voids and delamination are significantly reduced.
    Type: Application
    Filed: October 26, 2009
    Publication date: April 28, 2011
    Inventors: Chao-Peng Chen, Chien-Li Lin, Jas Chudasama, Situan Lam
  • Patent number: 7854831
    Abstract: In order to provide sanitary fittings, in particular, water supply fittings and sanitary shut-off devices, in general, which visually and haptically are very similar to or scarcely distinguishable (stainless steel finish) from the stainless steel surface of stainless steel sinks, using starting materials which can be processed more cost-effectively, it is proposed that a fitting or fitting parts be manufactured from brass; the fittings or fitting parts be ground and polished; the visible surface of the fittings or fitting parts be nickel-plated; the nickel-plated surface of the fittings or fitting parts be ground and/or brushed; and the ground and/or brushed nickel-plated surface of the fittings or fitting parts be chromium-plated.
    Type: Grant
    Filed: September 12, 2005
    Date of Patent: December 21, 2010
    Assignee: BLANCO Gmbh + Co KG
    Inventor: Kurt Müllmaier
  • Publication number: 20100219080
    Abstract: The present invention relates to electrolytic recovery of metal, and in particular methods and apparatus for producing cathode plates suitable for such electrolytic recovery. A first aspect of the invention provides a method of providing an electrically conductive coating on a cathode plate comprising inverting and submerging an upper portion of the cathode plate in an electrolytic bath adjacent at least one anode and applying a current to electroplate the upper portion of the cathode plate wherein each anode includes: i) a first base portion adapted to be positioned adjacent to a hanger bar of said cathode plate; ii) a second extended portion connected to and extending from the base portion and adapted to be positioned adjacent a blade of the cathode plate wherein the profile of each anode is shaped such that in use, a consistent thickness of coating is electroplated over said hanger bar and cathode blade.
    Type: Application
    Filed: May 17, 2010
    Publication date: September 2, 2010
    Applicant: Xstrata Queensland Limited
    Inventors: Wayne Keith Webb, Joanne Weston, Graham Heferen
  • Publication number: 20100072072
    Abstract: A method for restoration of a metallic coating (2) of a component (1), in which the coating includes a consumed portion (3, 4), includes a. identifying the consumed portion (3, 4) as a function of the location on the component (1); b. removing at least the consumed portion (3, 4) as a function of the location as identified in step a.; c. applying new metallic coating (7) in a manner at least compensating for the coating removed in step b.; and d. optionally verifying the quality of the restored metallic coating (2).
    Type: Application
    Filed: October 27, 2008
    Publication date: March 25, 2010
    Inventors: Daniel Beckel, Alexander Stankowski, Daniel Reitz
  • Patent number: 7520049
    Abstract: Disclosed herein is a manufacturing method of a planar resistance heating element and a planar resistance heating element made using the method. In the manufacturing method of a planar resistance heating element by etching an aluminum foil deposited on an insulating substrate in a desired pattern, printing carbon paste and connecting current input terminals in parallel, the aluminum foil is adapted to undergo a multiple step tempering process to thereby prevent heat deformation. The carbon paste acting as a resistor element is made of electrically conductive carbon, graphite, a resin, a solvent and a hardener which are mixed so as to optimize physical properties of the carbon paste. As a result, prevention of heat deformation of the insulating substrate, uniform heat conductivity, excellent heat-generation effect and easy manufacture may be achieved.
    Type: Grant
    Filed: November 22, 2005
    Date of Patent: April 21, 2009
    Assignee: Suntech Co., Ltd.
    Inventor: Gyongtae Kim
  • Patent number: 7422629
    Abstract: Electrolysis using a suitable electrolyte provides a completely nonsludging zinc phosphate conversion coating process that produces a high quality conversion coating in a very short time. The suitable electrolyte contains at least water, dissolved nitric acid, and dissolved zinc cations and optionally also contains m chemically distinct species of cations other than zinc and n chemically distinct species of anions other than anions derivable by ionization of phosphoric and nitric acids, each of m and n independently being zero or a positive integer.
    Type: Grant
    Filed: March 2, 2000
    Date of Patent: September 9, 2008
    Assignee: Henkel Kommanditgesellschaft Auf Aktien
    Inventors: Jun Kawaguchi, Kazuhiro Ishikura, Tomoyuki Manmi
  • Patent number: 7270734
    Abstract: The invention relates to a method for electroplating a metal deposit on electroplatable portions of composite articles that have both electroplatable and non-electroplatable portions. In this method, the invention is an improvement which comprises treating the articles prior to electroplating to provide the electroplatable portions with enhanced electroplatability. This is achieved by passing a current though a near neutral pH solution that contains a conductivity agent and a buffer to reduce or remove surface oxides and contaminants from such portions without deleteriously affecting the non-electroplatable portions of the articles. When the treated surfaces are subsequently subjected to metal plating, a uniform, smooth metal deposit is achieved.
    Type: Grant
    Filed: June 4, 2004
    Date of Patent: September 18, 2007
    Assignee: Technic, Inc.
    Inventors: Robert A. Schetty, III, Kilbnam Hwang
  • Patent number: 7201830
    Abstract: The invention concerns an anode for gas evolution in electrochemical applications comprising a titanium or other valve metal substrate characterized by a surface with a low average roughness, having a profile typical of a localized attack on the crystal grain boundary. The invention further describes a method for preparing the anodic substrate of the invention comprising a controlled etching in a sulfuric acid solution.
    Type: Grant
    Filed: March 13, 2003
    Date of Patent: April 10, 2007
    Assignee: De Nora Elletrodi S.p.A.
    Inventors: Corrado Mojana, Ulderico Nevosi
  • Patent number: 7135404
    Abstract: The present invention is directed to a process for producing structures containing metallized features for use in microelectric workpieces. The process treats a barrier layer to promote the adhesion between the barrier layer and the metallized feature. Suitable means for promoting adhesion between barrier layers and the metallized features according to the invention include an acid treatment of the barrier layer, an electrolytic treatment of the barrier layer, or deposition of a bonding layer between the barrier layer and metallized feature. The present invention thus modifies an exterior surface of a barrier layer making it more suitable for electrodeposition of metal on a barrier, thus eliminating the need for a PVD or CVD seed layer deposition process.
    Type: Grant
    Filed: January 10, 2003
    Date of Patent: November 14, 2006
    Assignee: Semitool, Inc.
    Inventors: Rajesh Baskaran, Bioh Kim, Linlin Chen, Lyndon W Graham
  • Patent number: 7128821
    Abstract: An electropolishing method for removing potential device-contaminating particles from a wafer, is disclosed. The method includes immersing the wafer in an electropolishing electrolyte solution and removing defects and particles from the wafer by rotational friction between the wafer and the electrolyte solution in combination with electrolysis. The method is effective in removing particles from via openings of all sizes, including via openings having a width smaller than about 0.2 ?m.
    Type: Grant
    Filed: January 20, 2004
    Date of Patent: October 31, 2006
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shih-Ho Lin, Chung-Chang Chen, Kei-Wei Chen, Shih-Tzung Chang, Chao-Lung Chen, Po-Jen Shih, Yu-Ku Lin, Ying-Lang Wang
  • Patent number: 7018482
    Abstract: A method of manufacturing electronic devices, in particular, but not exclusively, semiconductor devices, and apparatus for carrying out such a method, in which method wafers 1, which are provided at a surface 2 with a material 3 to be removed, are subjected, while being divided into successive batches, to a wet treatment in a bath 4 containing a solution 5 of an active component in a solvent. The successive batches of wafers 1 are immersed in the solution 5 at first time intervals during the wet treatment of the successive batches, which first time intervals each consist of a processing period during which the material 3 is removed from the surface 2 of the wafers 1, thereby forming ionic components, and a waiting period following the removal of the wafers 1 from the bath 4 at the end of the processing period.
    Type: Grant
    Filed: June 16, 2000
    Date of Patent: March 28, 2006
    Assignee: Koninklijke Philips Electronics N.V.
    Inventor: Marcellinus J. H. J. Geomini
  • Patent number: 7018521
    Abstract: A method is disclosed for forming a clear anodized coating on an aluminum base alloy containing more than three percent by weight magnesium. The alloy surface to be anodized is treated with an aqueous solution of a mineral acid such as sulfuric acid (10 to 20%), nitric acid (10 to 30%) or phosphoric acid (40 to 80%) under the influence of a relatively low voltage direct current. This treatment suitably reduces the magnesium content of the surface layer and, subsequently, a relatively low current density anodization in sulfuric acid produces the clear coating. The clear coating may then be colored by known processes.
    Type: Grant
    Filed: September 27, 2001
    Date of Patent: March 28, 2006
    Assignee: General Motors Corporation
    Inventors: Yar-Ming Wang, Hong-Hsiang Kuo, Sheila Farrokhalaee Kia
  • Patent number: 6967164
    Abstract: A method and apparatus is disclosed for sequential processing of integrated circuits, particularly for conductively passivating a contact pad with a material which resists formation of resistive oxides. In particular, a tank is divided into three compartments, each holding a different solution: a lower compartment and two upper compartments divided by a barrier, which extends across and partway down the tank. The solutions have different densities and therefore separate into different layers. In the illustrated embodiment, integrated circuits with patterned contact pads are passed through one of the upper compartments, in which oxide is removed from the contact pads. Continuing downward into the lower compartment and laterally beneath the barrier, a protective layer is selectively formed on the insulating layer surrounding the contact pads. As the integrated circuits are moved upwardly into the second upper compartment, a conducting monomer selectively forms on the contact pads prior to any exposure to air.
    Type: Grant
    Filed: August 4, 2003
    Date of Patent: November 22, 2005
    Assignee: Micron Technology, Inc.
    Inventors: Tongbi Jiang, Li Li
  • Patent number: 6913791
    Abstract: A method for surface treating a titanium-containing metal, comprising the steps of: (a) treating at least a portion of a surface of the titanium-containing metal with an anodic activation in an electrolyte bath; and (b) strike plating at least a portion of the surface of the treated titanium-containing metal with a metallic coating in the same electrolyte bath as in step (a), wherein the titanium-containing metal remains submerged in the electrolyte bath during steps (a) and (b).
    Type: Grant
    Filed: March 3, 2003
    Date of Patent: July 5, 2005
    Assignee: COM DEV Ltd.
    Inventors: Florin Burca, John Darmon
  • Patent number: 6866945
    Abstract: An anodized aluminum alloy comprises an aluminum alloy comprising magnesium in an amount greater than 3 weight percent based on the total weight of the aluminum alloy; and a clear porous oxide layer having a thickness greater than about 5 micrometers disposed on and into a surface of the aluminum alloy, wherein the anodized aluminum alloy has a surface gloss value greater than about 40 gloss units as measured on a gloss meter at dual illumination angles of 60° and 85°.
    Type: Grant
    Filed: January 6, 2003
    Date of Patent: March 15, 2005
    Assignee: General Motors Corporation
    Inventors: Hong-Hsiang Kuo, Yar-Ming Wang, Sheila Farrokhalaee Kia
  • Patent number: 6793796
    Abstract: Electroplating methods using an electroplating bath containing metal ions and a suppressor additive, an accelerator additive, and a leveler additive, together with controlling the current density applied to a substrate, avoid defects in plated films on substrates having features with a range of aspect ratios, while providing good filling and thickness distribution. The methods include, in succession, applying DC cathodic current densities optimized to form a conformal thin film on a seed layer, to provide bottom-up filling, preferentially on features having the largest aspect ratios, and to provide conformal plating of all features and adjacent field regions. Including a leveling agent in the electroplating bath produces films with better quality after subsequent processing.
    Type: Grant
    Filed: February 28, 2001
    Date of Patent: September 21, 2004
    Assignee: Novellus Systems, Inc.
    Inventors: Jonathan D. Reid, David Smith, Steven T. Mayer, Jon Henri, Sesha Varadarajan
  • Publication number: 20040173465
    Abstract: A method for surface treating a titanium-containing metal, comprising the steps of: (a) treating at least a portion of a surface of the titanium-containing metal with an anodic activation in an electrolyte bath; and (b) strike plating at least a portion of the surface of the treated titanium-containing metal with a metallic coating in the same electrolyte bath as in step (a), wherein the titanium-containing metal remains submerged in the electrolyte bath during steps (a) and (b).
    Type: Application
    Filed: March 3, 2003
    Publication date: September 9, 2004
    Applicant: Com Dev Ltd.
    Inventors: Florin Burca, John Darmon
  • Publication number: 20040118696
    Abstract: Methods of electrodepositing layers of tin or tin-alloys on a substrate are provided. The methods involve electrolytically treating a substrate with a solution comprising a phosphoric acid and a carboxylic acid, and electrodepositing a layer of tin or tin-alloy on a surface of the treated substrate. The methods can provide tin or tin-alloy layers having a reduced tendency to form whiskers.
    Type: Application
    Filed: September 13, 2003
    Publication date: June 24, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Wan Zhang, Andre Egli, Jochen Heber, Felix Schwager
  • Patent number: 6682645
    Abstract: In a process for producing an aluminum support of a lithographic printing plate, the desired aluminum support is produced by imparting fine asperities to an aluminum plate and then roughening it electrochemically in an acidic aqueous solution. The roughened aluminum plate may be electropolished or chemically etched.
    Type: Grant
    Filed: June 5, 2001
    Date of Patent: January 27, 2004
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Atsuo Nishino, Yoshitaka Masuda, Hirokazu Sawada, Akio Uesugi
  • Publication number: 20030201185
    Abstract: Embodiments of the invention generally provide a waveform to be applied to a seed layer prior to initiating plating operations, wherein the waveform is configured to remove organic contaminants from the seed layer. The application of the waveform generally includes applying a plurality of anodic pulses to the seed layer prior to an electrochemical deposition process and subsequent to the seed layer contacting a plating solution, and applying a cathodic pulse to the seed layer immediately following each of the plurality of anodic pulses. The waveform is generally provided by a power supply in electrical communication with a system controller configured to supply controlling signals to the power supply.
    Type: Application
    Filed: April 29, 2002
    Publication date: October 30, 2003
    Applicant: Applied Materials, Inc.
    Inventors: Rajeev Bajaj, Ramin Emami
  • Patent number: 6630400
    Abstract: A method and apparatus is disclosed for sequential processing of integrated circuits, particularly for conductively passivating a contact pad with a material which resists formation of resistive oxides. In particular, a tank is divided into three compartments, each holding a different solution: a lower compartment and two upper compartments divided by a barrier, which extends across and partway down the tank. The solutions have different densities and therefore separate into different layers. In the illustrated embodiment, integrated circuits with patterned contact pads are passed through one of the upper compartments, in which oxide is removed from the contact pads. Continuing downward into the lower compartment and laterally beneath the barrier, a protective layer is selectively formed on the insulating layer surrounding the contact pads. As the integrated circuits are moved upwardly into the second upper compartment, a conducting monomer selectively forms on the contact pads prior to any exposure to air.
    Type: Grant
    Filed: May 9, 2001
    Date of Patent: October 7, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Tongbi Jiang, Li Li
  • Publication number: 20030178317
    Abstract: The disclosure relates to a process for forming a deposit on the surface of a metallic or conductive surface. The process employs an energy enhanced process to deposit a silicate containing coating or film upon a metallic or conductive surface.
    Type: Application
    Filed: March 3, 2003
    Publication date: September 25, 2003
    Inventors: Robert I. Heimann, William M. Dalton, John Hahn, David M. Price, Wayne I. Soucie, Ravi Chandran
  • Patent number: 6589602
    Abstract: The present invention is to provide a highly adhesive surface-coated cemented carbide which comprises a cemented carbide base material and a hard film formed on a surface of the base material, characterized in that both of the hard film at a proximate portion of an interface between the hard film and the cemented carbide base material and the cemented carbide at a proximate portion of an interface contain at least one diffusive element selected from chromium, molybdenum, manganese, copper, silicon and an iron group metal and a method for producing the same by uniformly coating at least part of a surface of the base material with a metal, an alloy, or a compound comprising at least one diffusive element selected from iron group metals, chromium, molybdenum, manganese, copper, and silicon followed by coating the surface with the hard film.
    Type: Grant
    Filed: April 17, 2001
    Date of Patent: July 8, 2003
    Assignee: Toshiba Tungaloy Co., Ltd.
    Inventors: Masaki Kobayashi, Hiroshi Kitada
  • Publication number: 20030102224
    Abstract: A method for forming a copper-Invar-copper (CIC) laminate having an intermetallic layer of negligible thickness, and a structure associated with the CIC laminate. Starting with a block of Invar, the method includes a cleaning step followed by an electroplating step. The cleaning step electrochemically cleans the block of Invar with an acid solution while applying a negative voltage bias to the block of Invar. The electroplating step electroplates copper on the block of Invar, resulting in the block of Invar being sandwiched between two layers of copper, such that an intermetallic layer of zero or negligible thickness is disposed between the block of Invar and each layer of copper. Each layer of copper has a uniform thickness. If the starting block of Invar contains a through hole, then the electroplating step will plate a ring of copper on the through hole wall.
    Type: Application
    Filed: October 25, 2002
    Publication date: June 5, 2003
    Inventors: Raymond T. Galasco, Bonnie S. McClure, Craig W. Richards
  • Patent number: 6533917
    Abstract: Disclosed are a method for producing an aluminum support for lithographic printing plates, comprising subjecting an aluminum plate in sequence to (1) a surface roughening treatment, (2) a heat treatment, (3) a treatment of dissolving from 0.01 to 5 g/m2 of said aluminum plate, and then (4) an anodization treatment; a method for producing an aluminum support for lithographic printing plates, comprising subjecting an aluminum plate to an electrochemical surface roughening treatment both before and after an electrolytic treatment in an aqueous neutral salt solution using the aluminum plate as a cathode.
    Type: Grant
    Filed: April 21, 2000
    Date of Patent: March 18, 2003
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Atsuo Nishino, Yoshitaka Masuda, Akio Uesugi
  • Patent number: 6531046
    Abstract: Disclosed are methods of repairing metal seed layers prior to subsequent metallization. Such repair methods provide metal seed layers disposed on a substrate that are substantially free of metal oxide and substantially free of discontinuities.
    Type: Grant
    Filed: December 15, 2000
    Date of Patent: March 11, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: Denis Morrissey, David Merricks, Leon R. Barstad, Eugene N. Step, Jeffrey M. Calvert, Robert A. Schetty, III, James G. Shelnut, Mark Lefebvre, Martin W. Bayes, Donald E. Storjohann
  • Patent number: 6475646
    Abstract: A method for manufacturing a lead frame including the steps of electrocleaning the surface of a thin plate material, electropolishing the electrocleaned thin plate material, removing inclusions on the surface of the electropolished thin plate material, rinsing the inclusion-removed thin plate material with an acidic solution, and forming multi-plated layers on the rinsed material. The lead frame manufactured by the method has 5 or less inclusions each having approximately 1 &mgr;m, on the surface area of 1600 &mgr;m2, which impede a wire bonding property or solder wettability of the lead frame.
    Type: Grant
    Filed: December 8, 2000
    Date of Patent: November 5, 2002
    Assignee: Samsung Techwin Co., Ltd.
    Inventors: Se-chul Park, Dong-il Shin, Sung-il Kang, Sang-hoon Lee, Bae-soon Jang
  • Patent number: 6447664
    Abstract: Methods for coating metallic articles. In an exemplary embodiment, the method comprises the steps of providing a metallic article having an external surface with an oxide thereon; removing at least part of the oxide from the external surface of the article; and placing a coating on the article. The invention also includes coated metallic articles, and an apparatus for coating metallic articles.
    Type: Grant
    Filed: January 8, 1999
    Date of Patent: September 10, 2002
    Assignee: Scimed Life Systems, Inc.
    Inventors: Steven Taskovics, Paul Dicarlo, Bruce W. Flight, V. Chandru Chandrasekaran, Daniel Vancamp
  • Patent number: 6419811
    Abstract: Disclosed is a process of treating the surface of copper foil without using harmful elements such as arsenic, selenium and tellurium unlike in the prior art. It is possible to, in an easy way, obtain a uniform rough condition and low roughness and produce a high peel strength to such resin base materials as polyimide resin which is weak in peel strength. The process comprises a roughening treatment involving a cathodic electrolysis of at least one side of copper foil near or above the limiting current density in an electrolytic bath containing titanium ions and tungsten ions and prepared by adding sulfuric acid and copper sulfate so as to have copper protrusions deposited and then coating the depositions with copper or copper alloy in a cathodic electrolysis, followed by giving to the surface of the above-mentioned copper or the copper alloy at least one rust-proofing treatment.
    Type: Grant
    Filed: April 12, 2001
    Date of Patent: July 16, 2002
    Assignee: Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Hisanori Manabe, Masasto Takami, Masaru Hirose
  • Patent number: 6413405
    Abstract: An environmentally functional active carbon and its method of manufacturing is provided. The active carbon has improved adsorption capability against disease-source bacteria and microbes with prominent anti-bacterial and sterilizing effect as well as against organic and inorganic contaminants due to the process of electro-depositing Ag—I to the surface of active carbon and active carbon fiber. This invention creates functional active carbon having outstanding sterilizing effect for disease-source bacteria from known bacteria such as Gram positive bacteria including Staphylococcus, Bacillus subtillis and Gram negative bacteria including Escherichia coli, Pseudomonas Aeruginosa, Klebsiella Pneumonie, Candida Albicans causing albicans as yeast fungus, Trichophyton interdigital causing athlete's foot as a kind of mold.
    Type: Grant
    Filed: December 14, 2000
    Date of Patent: July 2, 2002
    Assignee: Sol Nanochem Ltd.
    Inventor: Woo Young Jung
  • Publication number: 20020074230
    Abstract: The present invention relates to methods and apparatus for plating a conductive material on a substrate surface in a highly desirable manner. The invention removes at least one additive adsorbed on the top portion of the workpiece more than at least one additive disposed on a cavity portion, thereby allowing plating of the conductive material take place before the additive fully re-adsorbs onto the top portion and causing greater plating of the cavity portion relative to the top portion.
    Type: Application
    Filed: December 18, 2000
    Publication date: June 20, 2002
    Inventor: Bulent Basol
  • Publication number: 20020056648
    Abstract: A process for producing an aluminum support for a planographic printing plate, the process comprising the steps of: (a) preparing an aluminum plate; (b) disposing said aluminum plate in an aqueous acidic solution; and (c) electrochemically surface-roughening said aluminum plate using an alternating current, wherein a ratio QC/QA of a cathode-time quantity of electricity of said aluminum plate QC to an anode-time quantity of electricity of said aluminum plate QA is from 0.95 to 2.5. An aluminum support for a planographic printing plate formed by the process. A planographic printing master plate comprising at least a positive-type or negative-type light-sensitive layer on the aluminum support.
    Type: Application
    Filed: September 14, 2001
    Publication date: May 16, 2002
    Applicant: FUJI PHOTO FILM CO., LTD.
    Inventors: Hirokazu Sawada, Akio Uesugi, Atsuo Nishino, Yoshitaka Masuda
  • Publication number: 20020043168
    Abstract: The present invention provides a process for the manufacture of a substrate for use in the production of lithographic printing plates, the process comprising the steps of:
    Type: Application
    Filed: July 2, 2001
    Publication date: April 18, 2002
    Inventors: Felton Rudolph Mayers, Tu Vinh Chau