Abstract: The present disclosure provides a manufacturing method of indium tin oxide, including: providing a first electrolyte including choline chloride, urea, indium chloride, boric acid, and ascorbic acid; disposing a workpiece, wherein at least a part of the workpiece is in contact with the first electrolyte; heating the first electrolyte to 60° C.-95° C.; applying a first operating current to electroplate indium onto the workpiece; providing an second electrolyte including choline chloride, urea, tin chloride, boric acid, and ascorbic acid; disposing the indium-coated workpiece, wherein at least a part of the workpiece is in contact with the second electroplate; heating the second electroplate to 60° C.-95° C.; applying a second operating current to electroplate tin onto the workpiece; and annealing the indium and tin on the workpiece to form indium tin oxide in an oxygen environment.

Abstract: This relates to a coated substrate for packaging applications and a method for producing the coated substrate.

Abstract: A Cu2ZnSnS4-xSex (0?x?4) thin film solar cell is disclosed. The thin film solar cell includes a Cu2ZnSnS4-xSex (0?x?4) thin film as an absorber layer produced by forming a precursor film composed of Cu, Zn, Sn, and Se using an ionic liquid as a solvent through a constant current process and annealing the precursor film with sulfur. Also disclosed is a method for fabricating the thin film solar cell. The method uses a non-vacuum electrodeposition process that is appropriate for large-area mass production and is thus cost effective compared to a vacuum process. In addition, since the method uses an ionic liquid, the formation of by-products harmful to humans as a result of side reactions is suppressed. Furthermore, the method uses a one-step electrodeposition process, which enables the deposition of a maximum of four elements at one time, or a multi-step deposition process, and an annealing process.

Abstract: A laminated ceramic capacitor includes a rectangular solid-shaped electronic component element. External electrodes of terminal electrodes are disposed at one end surface and the other end surface of the electronic component element. First plated films including a Ni plating are disposed on the surfaces of external electrodes. On the surfaces of the first plated films, second plated films containing Sn are disposed as Sn-plated films defining outermost layers of the external electrodes. The second plated films have a polycrystalline structure, and flake-shaped Sn—Ni alloy grains are located at a Sn crystal grain boundary and within a Sn crystal grain, respectively.

Abstract: An electrode for high overvoltage oxygen anodic evolution is described comprising a substrate of titanium or other valve metal, a first protective interlayer containing valve metal oxides, a second interlayer containing platinum or other noble metal, and an outer layer comprising tin, copper and antimony oxides. The electrode of the invention may be employed as anode in waste water treatment.

Abstract: Devices, systems and methods of using same where hybrid substrate materials are provided with a substantially uniform surface to provide uniformity of properties, including interaction with their environments. Uniform surfaces are applied as coatings over, e.g., hybrid metal/silica, metal/polymer, metal/metal surfaces to mask different chemical properties of differing regions of the surface and to afford a protective surface for the hybrid structure.

Abstract: Devices, systems and methods of using same where hybrid substrate materials are provided with a substantially uniform surface to provide uniformity of properties, including interaction with their environments. Uniform surfaces are applied as coatings over, e.g., hybrid metal/silica, metal/polymer, metal/metal surfaces to mask different chemical properties of differing regions of the surface and to afford a protective surface for the hybrid structure.

Abstract: The invention refers to a composition and method of electrolytic tinning in continuous a steel strip or plate with an electrolyte composition comprising the following components (g/l): Tin (in a form of tin sulfamate) 50-90, Sulfamic acid, free 40-100, Sulfates, in a form of SO42-0-15, Nitrogen-bearing block polymer 1-6, said block polymer being a copolymer of propylene oxide and ethylene oxide with molecular weight of 3950 to 6450 and “number of ethylene oxide links-to-number of propylene oxide links” ratio of 1.4-1.2:1.0 at initial buildup of required number of links from propylene oxide followed by oxyethylation.

Abstract: The present invention has an object to provide a tin-plated film and a method for producing the same, capable of preventing whiskers from being generated and simultaneously preventing the surface of a substrate to be plated, which is not covered with a tin-plated film, from discoloring due to oxidation, by which prevention of whisker generation, suppression of whisker growth, and prevention of discoloring of a substrate to be plated are compatible with simplified operations ensuring excellent productivity. The method is provided with the steps of removing a part of a tin-plated film formed on copper or copper alloy; processing to prevent discoloring of the copper or copper alloy from which the tin-plated film is removed; and applying heat energy to the tin-plated film of the copper or copper alloy which is processed to prevent discoloring.

Abstract: A locally distributed electrode is made by placing a conducting metallic oxide layer and a counter electrode in contact with a noble metal electroplating solution and applying a negative potential to the metallic oxide layer relative to the counter electrode, such that the noble metal is electrodeposited from the solution preferentially at defect sites on a surface of the metallic oxide layer. The noble metal nuclei are selectively electrodeposited at the defect sites to form a locally distributed electrode made up of a dot matrix of metallic islands. For reversible electrochemical mirror (REM) devices, the presence of the noble metal renders mirror metal electrodeposition at the defect sites reversible so that the defects become part of the dot matrix electrode and extraneous deposition of the mirror metal on the conducting metallic oxide is avoided.

Abstract: An external terminal of an electronic component is provided with a lead base material and a metal thin film coating a surface of the lead base material, and an average value of a crystal size index is not less than 7, which is defined based on dimensions of a crystal particle in a direction perpendicular to the lead base material surface and in a direction parallel thereto, taken on a cut surface of the metal thin film defined by a given plane cutting the metal thin film in a direction perpendicular to the lead base material surface. Such constitution provides an electronic component having an external terminal coated with a metal thin film of a simple structure constituted of Sn or a Sn-based and substantially Pb-free alloy, formed by plating on a surface of a lead base material.

Abstract: A tin layer and a zinc layer are stacked sequentially on a given substrate to form a multilayered film composed of the tin layer and the zinc layer. Then, the multilayered film is heated to a given temperature to form a tin-zinc alloy film through the diffusion of the tin elements of the tin layer into the zinc layer.

Abstract: A method for electroplated metal annealing process. First, a semiconductor structure is provided, wherein the semiconductor structure has a plurality of semiconductor components, such as a gate electrode, a source region and a drain region, and a field oxide region. Second, a dielectric layer is formed over the semiconductor structure, and a via which exposes a part of the semiconductor structure is formed in the dielectric layer by the use of conventional lithographic and etching processes and an electroplated metal layer is formed over the dielectric layer; meanwhile, the via is filled with the electroplated metal layer. The electroplated metal layer is then annealed by a NH3 plasma process performed by plasma enhanced chemical vapor deposition (PECVD).

Abstract: An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble metals include palladium and platinum. Examples of semi-noble metals include cobalt, nickel, and tungsten. The catalytic layer may be deposited by electroless deposition, electroplating, or chemical vapor deposition. In one embodiment, the catalytic layer may be deposited in the feature to act as a barrier layer to a subsequently deposited conductive material. In another embodiment, the catalytic layer may be deposited over a barrier layer. In yet another embodiment, the catalytic layer may be deposited over a seed layer deposited over the barrier layer to act as a “patch” of any discontinuities in the seed layer. Once the catalytic layer has been deposited, a conductive material, such as copper, may be deposited over the catalytic layer.

Abstract: A process for the production of sliding elements in which an overlay of lead-tin-copper is applied by electroplating to the prefabricated semi-finished product, and in which a ternary, fluoroborate-free electroplating bath is used without brighteners and with the addition of non-ionic wetting agents and free alkyl sulfonic acid. After the deposition of the galvanic overlay a heat treatment is carried out in the temperature range of 150° C. to 200° C. for between 1 and 100 hours. The multilayer material for sliding elements comprises at least a backing and an overlay of 12 to 16 wt. % tin and 7 to 11 wt. % copper, the rest being lead. The overlay comprises 15 to 25 wt. % particles of intermetallic compound Cu6Sn5.

Abstract: A process for the production of copper or a copper base alloy that provides a surface having improved characteristics suitable for the production of a connector or a charging-socket of an electric automobile by having a decreased coefficient of friction on the surface and improved resistance to abrasion. The process comprises coating copper or a copper alloy with Sn, followed by heat treating the resulting Sn-plated copper or copper base in an atmosphere having an oxygen content of no more than 5%, thereby forming on an outermost surface thereof an oxide film and beneath the surface a layer of an intermetallic compound mainly comprising Cu—Sn.

Abstract: A method for manufacturing a metal composite strip for the production of electrical contact components. A film made of tin or a tin alloy is first applied onto an initial material made of an electrically conductive base material. A film of silver is then deposited thereonto. Copper or a copper alloy is preferably used as the base material. The tin film can be applied in the molten state, and the silver film by electroplating. Furthermore, both the tin film and the silver film can be deposited by electroplating. A further alternative provides for manufacturing the tin film in the molten state and the silver film by cathodic sputtering. The diffusion operations which occur in the coating result in a homogeneous film of a tin-silver alloy. This formation can be assisted by way of a heat treatment of the composite strip.

Abstract: The invention provides a process for producing a coated Cu alloy having a surface which has a low coefficient of friction and a high resistance to abrasion and is suitable for fabricating connectors, charging-sockets of electric automobiles etc. The coated Cu alloy is produced by coating the surface of a copper alloy with Sn and heat treating the coated Cu alloy at a temperature in the range of 100-450° C. for 0.5-24 hours. The Cu alloy which is coated with Sn consists of 1-41 wt % Zn with the balance being Cu and incidental impurities. By using the coated Cu alloy, the force of insertion, resistance to abrasion and resistance to corrosion of connectors can be significantly improved.

Abstract: Methods for forming pastes of powder particles coated with an electrically conductive coating are described. The powder particles, with or without an optional first conductive coating layer applied to their surface, are placed in contact with a cathode surface and immersed in an electroplating solution. An anode covered with a nonconducting but ion-permeable membrane is immersed in the solution in close proximity to the cathode. Agitation to move and gently tumble the powder over the cathode surface is provided. The powder particles are plated with a metal or metal alloy coating by biasing the anode with a positive voltage relative to the cathode. The coated powder is removed, rinsed and dried. The powder is added to a polymer material to form a paste which is heated to fuse the powder coating surfaces to form a network of interconnected particles and is further heated to cure the polymer.

Abstract: An electrode is disclosed having a coating on part of the electrode, e.g., a front face, comprising the oxides of tin, antimony, at least one platinum group metal and at least one valve metal. Another part of the electrode, such as a back face, has a coating comprising the oxides of at least one valve metal and at least one platinum group metal. The electrode can be generally plate-shaped and most desirably has at least one chamfered corner. The electrode is particularly useful in a cell wherein brine electrolyte is electrolyzed to prepare a disinfectant solution containing hypochlorite. The disinfectant solution can be especially serviceable, such as in maritime application, for treating water, e.g., freshwater as represented by desalinated water.

Abstract: A process for the preparation by electrodeposition of metal oxide film and powder compounds for ferroelectric memory materials and ferrites wherein the metal oxide includes a plurality of metals. The process comprises providing an electrodeposition bath, providing soluble salts of the metals to this bath, electrically energizing the bath to thereby cause formation of a recoverable film of metal on the electrode, recovering the resultant film as a film or a powder, and recovering powder formed on the floor of the bath. The films and powders so produced are subsequently annealed to thereby produce metal oxide for use in electronic applications. The process can be employed to produce metal-doped metal oxide film and powder compounds for transparent conductors. The process for preparation of these metal-doped metal oxides follows that described above.

Abstract: A soldering method for soldering electronic components onto a copper (Cu) substrate using a tin (Sn) solder alloy. The method comprises in pretreating the Cu substrate by depositing a thin layer of zinc (Zn) before the deposition of the Sn solder alloy. This method greatly enhances the mechanical and electrical properties of the solder alloy, allowing the use of lead (Pb) free alloys such as tin-bismuth (Sn--Bi).

Abstract: The present invention relates to an electrolytic electrode comprising a core material made of a valve metal, a dense electrically conductive tin oxide layer formed on the core material, an .alpha.-lead dioxide layer formed on the tin oxide layer, and a .beta.-lead dioxide layer formed on the .alpha.-lead dioxide layer. The present invention also relates to a method for preparing the electrolytic electrode.

Abstract: A method for use with semiconductor devices (47) that have leads (49) electroplated with a solderable metal (53) includes exposing the solderable metal (53) to an elevated temperature sufficient to flow or melt the solderable metal (53). In a preferred embodiment, the solderable metal (53) is exposed to the elevated temperature before the leads (49) are severed from the leadframe (48).

Abstract: A process for producing a light absorption layer of a solar cell is disclosed, in which prior to heat-treatment, at least two of the following steps are performed in combination: (1) electrodeposition of a copper layer including selenium particles, (2) electrodeposition of an indium layer including selenium particles, (3) electrodeposition of a copper layer not including selenium, and (4) electrodeposition of an indium layer not including selenium. Control of copper, indium, and selenium contents becomes easier with this process.

Abstract: A method for the manufacture of a metal-coated steel strip with improved surface structure, wherein the strip is electrolytically coated with one or more metal coatings and the last-applied coating is temporarily melted by supplying heat to the strip (melting-on), is characterized in that the heat supplied to the strip for effecting the melting-on is generated at least in part by an electric current which is at all times non-zero. The heat supplied to effect the melting-on substantially continously compensates heat loss from the strip to the surroundings during the melting-on, and may for example be generated by electrical resistance heating using only a direct current or using an alternating current on which is superimposed a direct current. The strips produced are free of the so-called woodgrain effect.