Single Metal Or Alloy Coating On Single Metal Or Alloy Substrate Patents (Class 205/227)
  • Patent number: 10253386
    Abstract: The invention provides a steel sheet for hot press-forming that can reliably give hot press-formed parts having excellent paint adhesiveness, perforation corrosion resistance and joint corrosion resistance, and also provides a method for manufacturing the steel sheet for hot press-forming, and a method for producing hot press-formed parts using the steel sheet for hot press-forming. The steel sheet for hot press-forming includes a base steel sheet and a Zn-based coating layer with a mass of coating of 10 to 90 g/m2 on the base steel sheet, wherein the average ferrite grain diameter in the surface microstructure of the base steel sheet is not more than 20 ?m.
    Type: Grant
    Filed: March 4, 2013
    Date of Patent: April 9, 2019
    Assignee: JFE Steel Corporation
    Inventors: Tatsuya Miyoshi, Seiji Nakajima, Satoru Ando
  • Patent number: 9017539
    Abstract: A method for fabricating a heat sink may include: providing a carbon fiber fabric having carbon fibers and openings, the openings leading from a first side to a second side of the fabric; and electroplating the fabric with metal, wherein metal is deposited with a higher rate at the first side than at the second side of the fabric. Another method for fabricating a heat sink may include: providing a carbon metal composite having metal-coated carbon fibers and openings, the openings leading from a first side to a second side of the carbon metal composite; disposing the composite over a semiconductor element such that the first side of the composite faces the semiconductor element; and bonding the composite to the semiconductor element by means of an electroplating process, wherein metal electrolyte is supplied to an interface between the carbon metal composite and the semiconductor element via the openings.
    Type: Grant
    Filed: August 22, 2012
    Date of Patent: April 28, 2015
    Assignee: Infineon Technologies AG
    Inventor: Friedrich Kroener
  • Publication number: 20150064496
    Abstract: The present invention relates to a single crystal copper having [100] orientation and a volume of 0.1˜4.0×106 ?m3. The present invention further provides a manufacturing method for the single crystal copper and a substrate comprising the same.
    Type: Application
    Filed: August 28, 2014
    Publication date: March 5, 2015
    Inventors: Chih CHEN, King-Ning TU, Chia-Ling LU
  • Publication number: 20140269235
    Abstract: A magnetoresistive data writer and reader may be generally configured at least with a magnetoresistive (MR) element contacting a magnetic shield that is contrasted of (Ni78Fe22)99.8O0.2 material. The magnetic shield may be formed with an electrodeposition process that uses ?-diketones derivatives to form nano-crystalline grain structure after a subsequent annealing at temperatures above 400° C.
    Type: Application
    Filed: March 12, 2013
    Publication date: September 18, 2014
    Applicant: SEAGATE TECHNOLOGY LLC
    Inventors: Jie Gong, Ibro Tabakovic, Steve Riemer, Michael Christopher Kautzky
  • Publication number: 20140100112
    Abstract: Methods of producing one or more biaxially textured layer on a substrate, and articles produced by the methods, are disclosed. As exemplary method may comprise electrodepositing on the substrate a precursor material selected from the group consisting of rare earths, transition metals, actinides, lanthanides, and oxides thereof. An exemplary article may comprise a biaxially textured base material, and at least one biaxially textured layer selected from the group consisting of rare earths, transition metals, actinides, lanthanides, and oxides thereof. The at least one biaxially textured layer is formed by electrodeposition on the biaxially textured base material.
    Type: Application
    Filed: October 16, 2013
    Publication date: April 10, 2014
    Applicant: Alliance for Sustainable Energy, LLC
    Inventors: Raghu N. BHATTACHARYA, Sovannary PHOK, Priscila SPAGNOL, Tapas CHAUDHURI
  • Publication number: 20130341197
    Abstract: Methods for producing a high temperature oxidation and hot corrosion resistant MCrAlX coating on a superalloy substrate include applying an M-metal, chromium, and aluminum or an aluminum alloy comprising a reactive element to at least one surface of the superalloy component by electroplating at electroplating conditions below 100° C. in a plating bath thereby forming a plated component and heat treating the plated component.
    Type: Application
    Filed: February 6, 2012
    Publication date: December 26, 2013
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: James Piascik, Derek Raybould, Vincent Chung, George Reimer, Lee Poandl
  • Publication number: 20130330654
    Abstract: A method of depositing a thin gold coating on bipolar plate substrates for use in fuel cells includes depositing a gold coating onto at least one surface of the bipolar plate substrate followed by annealing the gold coating at a temperature between about 200° C. to 500° C. The annealed gold coating has a reduced porosity in comparison with a coating which has not been annealed, and provides improved corrosion resistance to the underlying metal comprising the bipolar plate.
    Type: Application
    Filed: June 11, 2012
    Publication date: December 12, 2013
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Michael P. Balogh, Gayatri Vyas Dadheech, Nicholas P. Irish, Misle M. Tessema, Daniel P. Miller, Mahmoud H. Abd Elhamid
  • Patent number: 8586506
    Abstract: Methods of producing one or more biaxially textured layer on a substrate, and articles produced by the methods, are disclosed. An exemplary method may comprise electrodepositing on the substrate a precursor material selected from the group consisting of rare earths, transition metals, actinide, lanthanides, and oxides thereof. An exemplary article (150) may comprise a biaxially textured base material (130), and at least one biaxially textured layer (110) selected from the group consisting of rare earths, transition metals, actinides, lanthanides, and oxides thereof. The at least one biaxially textured layer (110) is formed by electrodeposition on the biaxially textured base material (130).
    Type: Grant
    Filed: August 1, 2005
    Date of Patent: November 19, 2013
    Assignee: Alliance for Sustainable Energy, LLC
    Inventors: Raghu N. Bhattacharya, Sovannary Phok, Priscila Spagnol, Tapas Chaudhuri
  • Publication number: 20130075270
    Abstract: Disclosed herein is a method for coating a metallic interconnect of a solid oxide fuel cell. The method for coating a metallic interconnect of a solid oxide fuel cell includes generating a cobalt compound solution using lithium cobalt oxide (LiCoO2) that is an anodic material of a lithium ion battery; immersing the metal interconnect in a plating solution in which the generated cobalt compound solution is contained; and forming cobalt (Co) on the immersed metal interconnect by performing electroplating.
    Type: Application
    Filed: December 23, 2011
    Publication date: March 28, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hong Ryul LEE, Han Wool RYU
  • Patent number: 8382970
    Abstract: The presently disclosed embodiments are directed to an improved metallization process for making fuser members which avoids the extra steps of metal nanoparticle seeding or special substrate treatment. In embodiments, a metallized substrate, formed by dip-coating or spraying with a metal nanoparticle dispersion which is subsequently thermally annealed, is used for the complete fabrication of the fuser member.
    Type: Grant
    Filed: August 5, 2008
    Date of Patent: February 26, 2013
    Assignee: Xerox Corporation
    Inventors: Yu Qi, Qi Zhang, Yuning Li, Nan-Xing Hu
  • Publication number: 20130008799
    Abstract: The method of forming an oxidation resistant coating layer is for forming an oxidation resistant coating layer containing aluminum on a surface layer of a member (A) formed of metallic material. The method includes a plating treatment step (S1) of plating aluminum on a surface of the member (A) in a solvent, and a heat treatment step (S2) of heat-treating the member (A) whose surface has been plated by the plating treatment step (S1).
    Type: Application
    Filed: March 23, 2011
    Publication date: January 10, 2013
    Inventors: Akihiro Sato, Yoshihiro Tsuda, Hiroaki Iwata, Akira Tateno, Hiroki Yoshizawa, Tetsuji Hirato
  • Publication number: 20120156519
    Abstract: Methods for producing a high temperature oxidation resistant coating on a superalloy component and the coated superalloy component produced thereby are provided. Aluminum or an aluminum alloy is applied to at least one surface of the superalloy component by electroplating in an ionic liquid aluminum plating bath to form a plated component. The plated component is heat treated at a first temperature of about 600° C. to about 650° C. and then further heat treated at a second temperature of about 700° C. to about 1050° C. for about 0.50 hours to about two hours or at a second temperature of about 750° C. to about 900° C. for about 12 to about 20 hours.
    Type: Application
    Filed: December 16, 2010
    Publication date: June 21, 2012
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: James Piascik, Derek Raybould, George Reimer
  • Publication number: 20120141670
    Abstract: Disclosed are an open-porous metal foam and a method for manufacturing the same. An open-porous metal foam according to an exemplary embodiment of the present invention is made of an iron-based alloy including 15 wt % or more of chrome and 5 wt % or more of aluminum. The open-porous metal foam is a semi-product that is formed of iron or the iron-based alloy that does not include chrome and aluminum or includes a smaller amount of chrome and aluminum in the powder when manufacturing, and the surface and the open pore thereof are uniformly coated with the powder of the iron-chrome-aluminum alloy and the organic binding agent. When heat treatment is performed under a reduction atmosphere, sintering is performed.
    Type: Application
    Filed: August 4, 2011
    Publication date: June 7, 2012
    Applicants: FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V., ALANTUM
    Inventors: Gunnar WALTHER, Burghardt KLÖDEN, Juliane BÖHM, Tilo BÜTTNER, Thomas WEISSGÄRBER, Bernd KIEBACK, Arne BODEN, Hans-Dietrich BÖHM, Hyuntae KIM, James CHOI, Myungjoon JANG, Alexander BÖHM, Stefan FRÖHLICH, Winfried DÖLLING
  • Patent number: 8168056
    Abstract: The invention provides a method and system for electrolytically coating an article. The method includes providing an article to be coated and disposing the article in an electrolytic cell. The cell includes an anode, a cathode in operable communication with the article, and an electrolyte bath. During electrolysis, the electrolyte bath comprises cobalt ions, phosphorous acid, and tribological particles selected from the group consisting of refractory materials, solid lubricants and mixtures thereof dispersed therein. The method further includes applying steady direct electric current through the anode, the electrolyte bath and the cathode to coat the article with cobalt, phosphorous and the tribological particles. An improved composition of matter is also provided that may be used as a coating, or the composition may be electroformed on a mandrel to form an article made from the composition of matter.
    Type: Grant
    Filed: December 10, 2008
    Date of Patent: May 1, 2012
    Assignee: USC, LLC
    Inventors: Amitava Datta, John D. Carpenter
  • Patent number: 8118989
    Abstract: Methods are provided for bonding pure rhenium to a substrate comprising a material. Non-lubricated components configured to have friction contact with another component are also provided. In an embodiment, by way of example only, a method includes disposing a eutectic alloy over the substrate to form an inter layer, the eutectic alloy comprised essentially of a base alloy and one or more melting point depressants and having a melting temperature that is lower than a melting temperature of the substrate material and a melting temperature of rhenium, placing pure rhenium over the inter layer, and heating the inter layer to a temperature that is substantially equal to or greater than the melting temperature of the eutectic alloy, but that is below the melting temperature of the substrate material and the melting temperature of the pure rhenium to bond the pure rhenium to the substrate.
    Type: Grant
    Filed: August 11, 2011
    Date of Patent: February 21, 2012
    Assignee: Honeywell International Inc.
    Inventors: Don Mittendorf, Scott Sperl
  • Patent number: 7943020
    Abstract: The invention relates to a cathode for electrolytic processes, particularly suitable for hydrogen evolution in chlor-alkali electrolysis, consisting of a nickel substrate provided with a coating comprising a protective zone containing palladium and a physically distinct catalytic activation containing platinum or ruthenium optionally mixed with a highly oxidizing metal oxide, preferably chromium or praseodymium oxide.
    Type: Grant
    Filed: April 13, 2009
    Date of Patent: May 17, 2011
    Assignee: Industries de Nora S.p.A.
    Inventors: Antonio Lorenzo Antozzi, Claudia Jennifer Bargioni, Alice Calderara, Luciano Iacopetti, Gian Nicola Martelli, Christian Urgeghe
  • Patent number: 7833401
    Abstract: A method of forming a component capable of being exposed to a plasma in a process chamber comprises forming a structure comprising a surface and electroplating yttrium, and optionally aluminum or zirconium, onto the surface. Thereafter, the electroplated layer can be annealed to oxide the yttrium and other electroplated species.
    Type: Grant
    Filed: June 21, 2007
    Date of Patent: November 16, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Nianci Han, Li Xu, Hong Shih, Yang Zhang, Danny Lu, Jennifer Y. Sun
  • Patent number: 7731831
    Abstract: A composite material useful for the manufacture of a circuit has a support layer, a metal foil layer having opposing first and second sides and a thickness of 15 microns or less and a release layer effective to facilitate separation of the metal foil layer from the support layer, the release layer disposed between and contacting both the support layer and the metal foil layer. A reactive element containing layer, which may be the support layer, effective to react with gaseous elements or compounds to form thermally stable compounds contacts the release layer. The composite material is preferably subjected to a low temperature heat treatment. The combination of the low temperature heat treatment and the reactive element containing layer results in reduced defects including blisters in the copper foil during subsequent processing.
    Type: Grant
    Filed: November 7, 2006
    Date of Patent: June 8, 2010
    Assignee: GBC Metals, L.L.C.
    Inventors: William L. Brenneman, Szuchain F. Chen
  • Publication number: 20090078580
    Abstract: As a barrier metal film, a Ti film or a Ta film is formed by sputtering method on a substrate. On top of this barrier metal film there is formed a nitride film by sputtering method. A Cu film is then formed on the nitride film by CVD method and thereafter anneal processing is performed at 100 to 400° C. In this manner, by forming the Cu film, the adhesiveness between the barrier metal film and the Cu film improves.
    Type: Application
    Filed: December 4, 2006
    Publication date: March 26, 2009
    Applicant: ULVAC, Inc.
    Inventors: Tomoyuki Yoshihama, Masamichi Harada, Satoru Toyoda, Harunori Ushikawa
  • Publication number: 20080220338
    Abstract: A current collector forming an electrode for battery is provided. The electrode current collector includes a conductive layer made of copper or a copper alloy. Furthermore, the conductive layer has a plurality of crystallites, the crystallites containing crystallites having a cross-section area of 20 ?m2 or more.
    Type: Application
    Filed: June 25, 2007
    Publication date: September 11, 2008
    Applicant: SONY CORPORATION
    Inventors: Masayuki Iwama, Rikako Imoto, Kenichi Kawase, Akinori Kita
  • Patent number: 7179541
    Abstract: A method for heat treatment of a cold rolled strip with a surface coating of Ni and/or Co and incorporated non-metallic elements C and/or S, if need be with the addition of Fe, In, Pd, Au and/or Bi, whereby the cold rolled strip has a low carbon content. Since the compounds of C, S, N and P deposited on the grain boundaries bring about the most micro-cracks with the surface coating metal if no recrystallization takes place, the temperature of the heat treatment should be selected lower than the recrystallization temperature and higher than the precipitation temperature. With a recrystallization, the grain sizes would easily attain the thickness of the coating so that the embrittled compounds would migrate with the grain boundaries out of the coating. Due to the choice of temperature of the heat treatment of the surface coating of the invention, in contrast, an optimal embrittlement of the grain boundaries is guaranteed, which is especially advantageous in the manufacture of battery cans.
    Type: Grant
    Filed: June 12, 2002
    Date of Patent: February 20, 2007
    Assignee: Hille & Muller GmbH
    Inventors: Werner Olberding, Beate Monscheuer, Claudia Dahmen, Karlfried Pfeifenbring
  • Patent number: 7118664
    Abstract: The present invention provides a plating method and apparatus, which is capable of introducing plating solution into the fine channels and holes formed in a substrate without needing to add a surface active agent to the plating solution, and capable of forming a high-quality plating film having no defects or omissions. The plating method for performing electrolytic or electroless plating of an object using a plating solution comprises: conducting a plating operation after or while deaerating dissolved gas in the plating solution; and/or conducting a preprocessing operation using a preprocessing solution after or while deaerating dissolved gas in the preprocessing solution and subsequently conducting the plating operation.
    Type: Grant
    Filed: February 18, 2004
    Date of Patent: October 10, 2006
    Assignee: Ebara Corporation
    Inventors: Junichiro Yoshioka, Nobutoshi Saito, Tsuyoshi Tokuoka
  • Patent number: 7037421
    Abstract: A gap layer of a thin-film magnetic head is formed of NiP. The P content of the NiP gap layer is controlled to be within the range of 11 mass percent to 14 mass percent so that the gap layer is nonmagnetic.
    Type: Grant
    Filed: May 9, 2001
    Date of Patent: May 2, 2006
    Assignee: Alps Electric Co., Ltd.
    Inventors: Yoshihiro Kanada, Hisayuki Yazawa
  • Patent number: 7001499
    Abstract: A process for electroplating and annealing thin-films of nickel-iron alloys having from 63% to 81% iron content by weight to produce pole pieces having saturation flux density (BS) in the range from 1.9 to 2.3 T (19 to 23 kG) with acceptable magnetic anisotropy and magnetostriction and a coercivity (HC) no higher than 160 A/m (2 Oe). The desired alloy layer properties, including small crystal size and minimal impurity inclusions, can be produced by including higher relative levels of Fe++ ions in the electroplating bath while holding the bath at a lower temperature while plating from a suitable seed layer. The resulting alloy layer adopts a small crystal size (BCC) without significant inclusion of impurities, which advantageously permits annealing to an acceptable HC while retaining the high BS desired.
    Type: Grant
    Filed: January 18, 2002
    Date of Patent: February 21, 2006
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Mike Ming Yu Chen, Thomas Edward Dinan, April Hixson-Goldsmith, Murali Ramasubramanian, Neil Leslie Robertson
  • Patent number: 7001471
    Abstract: A method for filling recessed microstructures at a surface of a microelectronic workpiece, such as a semiconductor wafer, with metallization is set forth. In accordance with the method, a metal layer is deposited into the microstructures with a process, such as an electroplating process, that generates metal grains that are sufficiently small so as to substantially fill the recessed microstructures. The deposited metal is subsequently subjected to an annealing process at a temperature below about 100 degrees Celsius, and may even take place at ambient room temperature to allow grain growth which provides optimal electrical properties. Various novel apparatus for executing unique annealing processes are also set forth.
    Type: Grant
    Filed: August 31, 1999
    Date of Patent: February 21, 2006
    Assignee: Semitool, Inc.
    Inventors: Thomas L. Ritzdorf, E. Henry Stevens, LinLin Chen, Lyndon W. Graham, Curt Dundas
  • Patent number: 6974636
    Abstract: A turbine engine component comprising a substrate made of a nickel-base or cobalt-base superalloy and a protective coating overlying the substrate, the coating formed by electroplating at least two platinum group metals selected from the group consisting of platinum, palladium, rhodium, ruthenium and iridium. The protective coating is typically heat treated to increase homogeneity of the coating and adherence with the substrate. The component typically further comprises a ceramic thermal barrier coating overlying the protective coating. Also disclosed are methods for forming the protective coating on the turbine engine component by electroplating the platinum group metals.
    Type: Grant
    Filed: September 22, 2003
    Date of Patent: December 13, 2005
    Assignee: General Electric Company
    Inventors: Ramgopal Darolia, Mark Daniel Gorman, Melvin Robert Jackson, Ji-Cheng Zhao
  • Patent number: 6824666
    Abstract: An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble metals include palladium and platinum. Examples of semi-noble metals include cobalt, nickel, and tungsten. The catalytic layer may be deposited by electroless deposition, electroplating, or chemical vapor deposition. In one embodiment, the catalytic layer may be deposited in the feature to act as a barrier layer to a subsequently deposited conductive material. In another embodiment, the catalytic layer may be deposited over a barrier layer. In yet another embodiment, the catalytic layer may be deposited over a seed layer deposited over the barrier layer to act as a “patch” of any discontinuities in the seed layer. Once the catalytic layer has been deposited, a conductive material, such as copper, may be deposited over the catalytic layer.
    Type: Grant
    Filed: January 28, 2002
    Date of Patent: November 30, 2004
    Assignee: Applied Materials, Inc.
    Inventors: Srinivas Gandikota, Chris R. McGuirk, Deenesh Padhi, Muhammad Atif Malik, Sivakami Ramanathan, Girish A. Dixit, Robin Cheung
  • Patent number: 6821406
    Abstract: The present invention provides a gold-plated body, a method for surface treatment of a gold-plated body, a surface-treated product, and an immobilization method which make it possible to immobilize a large number of sulfur-containing molecules. With the surface treatment method in accordance with the present invention, the surface of a gold-plated body is subjected to an annealing treatment at a temperature of 350 to 790° C. so that a large number of sulfur-containing molecules can be immobilized thereon. In particular, the treatment is conducted so as to obtain a structure in which surface gold crystals have no less than 30% planes with (1, 1, 1) orientation. The present invention also provides a method for the manufacture of a gold-plated body that allows a large number of sulfur-containing molecules to be immobilized on the surface thereof, by which surface gold crystals are formed from a starting material comprising a crystal growth enhancer.
    Type: Grant
    Filed: February 7, 2002
    Date of Patent: November 23, 2004
    Assignees: Kyocera Corporation, Tum Gene, Inc.
    Inventors: Shinichi Kobori, Kazuhiro Nakama, Hiroyoshi Miyahara
  • Patent number: 6811671
    Abstract: A method of fabricating a semiconductor device, having a reduced-oxygen Cu—Zn alloy thin film (30) electroplated on a Cu surface (20) by electroplating, using an electroplating apparatus, the Cu surface (20) in a unique chemical solution containing salts of zinc (Zn) and copper (Cu), their complexing agents, a pH adjuster, and surfactants; and annealing the electroplated Cu—Zn alloy thin film (30); and a semiconductor device thereby formed. The method controls the parameters of pH, temperature, and time in order to form a uniform reduced-oxygen Cu—Zn alloy thin film (30), having a controlled Zn content, for reducing electromigration on the Cu—Zn/Cu structure by decreasing the drift velocity therein which decreases the Cu migration rate in addition to decreasing the void formation rate, for improving device reliability, and for increasing corrosion resistance.
    Type: Grant
    Filed: February 22, 2002
    Date of Patent: November 2, 2004
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Sergey Lopatin, Alexander H. Nickel, Joffre F. Bernard
  • Patent number: 6699379
    Abstract: An improved plating method in combination with a low-temperature thermal treatment is disclosed. The method for reducing the stress in the nickel-based alloy plating comprises the steps of: (a) adding ceramic particles into a plating bath containing soluble nickel salts; and (b) placing a substrate in the plating bath and thereafter carrying out a pulse-current electroplating in the plating bath. The method of this invention can prevent substrate softening or deformation problems. The use of a post low-temperature thermal treatment can slightly increase the hardness of the coating products. The use of the low-temperature thermal treatment can reduce the stress of the coatings since the hydrogen embrittlement resulting from exist of hydrogen in the coatings is eliminated.
    Type: Grant
    Filed: November 25, 2002
    Date of Patent: March 2, 2004
    Assignee: Industrial Technology Research Institute
    Inventors: Shih-Tsung Ke, Jen-Chih Li, Ming-Der Ger, Le-Min Wang, Yeh Sung, Jauh-Jung Yang, Ya-Ru Huang
  • Publication number: 20030219608
    Abstract: A metal transfer sheet which is so low in peel-strength as to be transferred to an object to be transferred with ease and reliability; a producing method thereof; and a ceramic condenser producing method for producing a reliable, compact, thin-layer ceramic condenser with improved production efficiency by transferring a metal layer to the ceramic condenser by using the metal transfer sheet. After a first metal layer is formed on a carrier film in a sputtering or an electrolytic plating method, the member thus formed is dipped in plating solution and voltage is applied in such a way that the first metal layer side is anode, to form a passive film. Sequentially, with the polarity reversed, voltage is applied in such a way that the passive film side is cathode, to form the second metal layer. After this manner, a metal transfer sheet in which the first metal layer and the second metal layer are laminated through the passive film interposed therebetween is obtained.
    Type: Application
    Filed: May 21, 2003
    Publication date: November 27, 2003
    Inventors: Hitoshi Ishizaka, Yasuhiko Yamamoto, Kazuo Ouchi, Takashi Oda, Takuji Okeyui
  • Patent number: 6607787
    Abstract: A process for producing a coating on a refractory structural member, in which a noble metal alloy is applied as a coating material to the refractory structural member. The noble metal alloy contains, among other constituents, an oxidizable substance, which includes boron and/or phosphorus and/or antimony and/or arsenic. The refractory structural member and the coating are heated at least once in an oxygen-containing atmosphere to a temperature T that is greater than or equal to the liquidus temperature TL of the noble metal alloy. The oxidizable substance is oxidized during this heating process, and the oxide that has formed is at least partially vaporized. The temperature T is maintained until the proportion of oxidizable substance in the coating is <0.1 atomic percent, and the coated refractory structural member is then cooled.
    Type: Grant
    Filed: August 7, 2001
    Date of Patent: August 19, 2003
    Assignee: W. C. Heraeus GmbH & Co. KG
    Inventors: Wulf Kock, Frank Krüger, David Lupton, Harald Manhardt, Jürgen Merker
  • Patent number: 6605369
    Abstract: The present invention is directed to provision of a surface-treated copper foil exhibiting a maximum effect of a silane coupling agent which is adsorbed onto the copper foil and is employed in order to enhance adhesion between the copper foil and a substrate during manufacture of printed wiring boards. The invention is also directed to provision of a method for producing such a copper foil. To attain these goals, a surface-treated copper foil for producing printed wiring boards is provided, wherein an anti-corrosion treatment comprises forming a zinc layer or a zinc alloy layer on a surface of the copper foil and forming an electrodeposited chromate layer on the zinc or zinc alloy layer; forming a silane-coupling-agent-adsorbed layer on the electrodeposited chromate layer without causing the electrodeposited chromate layer of the nodular-treated surface to dry; and drying.
    Type: Grant
    Filed: August 14, 2001
    Date of Patent: August 12, 2003
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Naotomi Takahashi, Yutaka Hirasawa
  • Publication number: 20030106807
    Abstract: The present invention provides an apparatus for electrochemical mechanical processing of a surface of a workpiece by utilizing a process solution. The apparatus of the present invention includes an electrode touching the process solution, a belt workpiece surface influencing device extended between a supply spool and a receiving spool. During the process, the surface of the workpiece is placed in proximity of the workpiece surface influencing device and the process solution is flowed through the process section and onto the surface while a potential difference is applied between the electrode and the surface of the workpiece.
    Type: Application
    Filed: November 4, 2002
    Publication date: June 12, 2003
    Inventors: Bulent M. Basol, Halit N. Yakupoglu, Cyprian E. Uzoh, Homayoun Talieh
  • Patent number: 6562219
    Abstract: A method for the formation of copper wiring films includes the steps of forming a first copper film by a CVD method on a diffusion barrier film, which diffusion barrier film has been formed on a semiconductor substrate and in which a concavity has been established; heating the first copper film to a temperature within the range from 200 to 500° C.; and subsequently forming a second copper film on the first copper film by a plating method using the first copper film as an electrode.
    Type: Grant
    Filed: November 16, 2001
    Date of Patent: May 13, 2003
    Assignee: Anelva Corporation
    Inventors: Akiko Kobayashi, Atsushi Sekiguchi, Tomoaki Koide, Minjuan Zhang, Hideki Sunayama, Shiqin Xiao, Kaoru Suzuki
  • Patent number: 6521113
    Abstract: An electrolyte for use in electrolytic platinum plating that results in reduced Cl, S, or P contaminant production. The bath comprises 0.01 to 320 g/lit of platinum in the form of the platinum salt dinitrodiammine platinum, Pt(NH3)2(NO2)2 or variants thereof and 0.1 to 240 g/lit of alkali metal carbonate M2CO3 or bicarbonate MHCO3 where M is selected from a group comprising lithium (Li), sodium (Na), potassium (K), rubidium (Rb) and cesium (Cs). A method of improving oxidation resistance of a platinum modified aluminide diffusion coating on a substrate, comprises electroplating the substrate using this electrolyte and then aluminizing the electroplated substrate at an elevated temperature to grow a platinum modified aluminide diffusion coating.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: February 18, 2003
    Assignee: Honeywell International Inc.
    Inventors: Thomas E. Strangman, Derek Raybould, Alex Kozlov
  • Publication number: 20020088709
    Abstract: There are provided a method and apparatus for forming interconnects by embedding a metal such as copper (Cu) into recesses for interconnects formed on the surface of a substrate such as a semiconductor substrate. The method of the present invention includes the steps of: providing a substrate having fine recesses formed in the surface; subjecting the surface of the substrate to plating in a plating liquid; and subjecting the plated film formed on the surface of the substrate to electrolytic etching in an etching liquid.
    Type: Application
    Filed: June 27, 2001
    Publication date: July 11, 2002
    Inventors: Akihisa Hongo, Naoki Matsuda, Kanji Ohno, Ryoichi Kimizuka
  • Patent number: 6358392
    Abstract: The invention is directed to the use of electrochemical deposition to fabricate thin films of a material (e.g., bismuth) exhibiting a superior magnetoresistive effect. The process in accordance with a preferred embodiment produces a thin film of bismuth with reduced polycrystallinization and allows for the production of single crystalline thin films. Fabrication of a bismuth thin film in accordance with a preferred embodiment of the invention includes deposition of a bismuth layer onto a substrate using electrochemical deposition under relatively constant current density. Preferably, the resulting product is subsequently exposed to an annealing stage for the formation of a single crystal bismuth thin film. The inclusion of these two stages in the process produces a thin film exhibiting superior MR with a simple field dependence in the process suitable for a variety of field sensing applications.
    Type: Grant
    Filed: November 18, 1999
    Date of Patent: March 19, 2002
    Assignee: The Johns Hopkins University
    Inventors: Fengyuan Yang, Kai Liu, Chia-Ling Chien, Peter C. Searson
  • Patent number: 6355154
    Abstract: The present invention relates to am article plated with boron carabide in a nickel-phosphorus matrix, obtained by a plating process comprising the following steps: a) preparation of an electrolytic bath comprising two or more nickel salts, at least one complexing agent, at least one phosphorus salt, and, in addition, an anti-tensioning agent and boron carbide in the form of powder; b) electroplating of the article in the electrolytic bath at a temperature ranging from 40° C. to 70° C., with a current density ranging from 1 to 10 A/dm2; and c) heat treatment of the product thus plated. The plating is used for any article that requires a type of plating which presents high resistance to wear, and in particular for cylinders for the production of corrugated cardboard.
    Type: Grant
    Filed: July 5, 2000
    Date of Patent: March 12, 2002
    Assignee: SBR S.r.l.
    Inventor: Angelo Buratti
  • Patent number: 6346181
    Abstract: Disclosed is an Ni-plated layer of biaxial texture, which is formed by electroplating. In the Ni-plated layer,peaks measured on a &thgr;-rocking curve have a FWHM of 7° or less in terms of the misorientation on the c-axis; and peaks measured on &phgr;-scan have a FWHM of 21° or less in terms of the misorientation on the plane formed by the a-axis and the b-axis. Also, a process of electroplating a Ni layer are disclosed. The process comprises forming a Ni-plated layer of biaxial texture under a magnetic field by electroplating and subjecting the Ni-plated layer to thermal treatment to develop the biaxial texture. This electroplating process is expected to give a significant contribution to the development of the electroplating technology and to replace the vacuum deposition used for the preparation of thin film magnetic materials or thin film piezoelectric materials.
    Type: Grant
    Filed: May 16, 2000
    Date of Patent: February 12, 2002
    Assignee: Korea Institute of Machinery and Materials
    Inventors: Kyu Hwan Lee, Hyung-Sik Chung, Sang Ro Lee, Doyon Chang, Yongsoo Jeong, Jaimoo Yoo, Jae-Woong Ko, Hai-Doo Kim
  • Publication number: 20020008034
    Abstract: A process for metallization of a workpiece, such as a semiconductor workpiece. In an embodiment, an alkaline electrolytic copper bath is used to electroplate copper onto a seed layer, electroplate copper directly onto a barrier layer material, or enhance an ultra-thin copper seed layer which has been deposited on the barrier layer using a deposition process such as PVD. The resulting copper layer provides an excellent confirm copper coating that fills trenches, vias, and other microstructures in the workpiece. When used for seed layer enhancement, the resulting copper seed layer provide an excellent conformal copper coating that allows the microstructures to be filled with a copper layer having good uniformity using electrochemical deposition techniques. Further, copper layers that are electroplated in the disclosed manner exhibit low sheet resistance and are readily annealed at low temperatures.
    Type: Application
    Filed: December 7, 2000
    Publication date: January 24, 2002
    Inventors: Linlin Chen, Gregory J. Wilson, Paul R. McHugh, Robert A. Weaver, Thomas L. Ritzdorf
  • Patent number: 6337145
    Abstract: A process for the production of sliding elements in which an overlay of lead-tin-copper is applied by electroplating to the prefabricated semi-finished product, and in which a ternary, fluoroborate-free electroplating bath is used without brighteners and with the addition of non-ionic wetting agents and free alkyl sulfonic acid. After the deposition of the galvanic overlay a heat treatment is carried out in the temperature range of 150° C. to 200° C. for between 1 and 100 hours. The multilayer material for sliding elements comprises at least a backing and an overlay of 12 to 16 wt. % tin and 7 to 11 wt. % copper, the rest being lead. The overlay comprises 15 to 25 wt. % particles of intermetallic compound Cu6Sn5.
    Type: Grant
    Filed: April 27, 2000
    Date of Patent: January 8, 2002
    Assignee: Federal-Mogul Wiesbaden GmbH & Co.
    Inventor: George Pratt
  • Patent number: 6332967
    Abstract: Methods for preparing high quality superconducting oxide precursors which are well suited for further oxidation and annealing to form superconducting oxide films. The method comprises forming a multilayered superconducting precursor on a substrate by providing an electrodeposition bath comprising an electrolyte medium and a substrate electrode, and providing to the bath a plurality of precursor metal salts which are capable of exhibiting superconducting properties upon subsequent treatment. The superconducting precursor is then formed by electrodepositing a first electrodeposited (ED) layer onto the substrate electrode, followed by depositing a layer of silver onto the first electrodeposited (ED) layer, and then electrodepositing a second electrodeposited (ED) layer onto the Ag layer. The multilayered superconducting precursor is suitable for oxidation at a sufficient annealing temperature in air or an oxygen-containing atmosphere to form a crystalline superconducting oxide film.
    Type: Grant
    Filed: November 23, 1999
    Date of Patent: December 25, 2001
    Assignee: Midwest Research Institute
    Inventor: Raghu N. Bhattacharya
  • Patent number: 6328871
    Abstract: The invention generally provides a method for preparing a surface for electrochemical deposition comprising forming a high conductance barrier layer on the surface and depositing a seed layer over the high conductance barrier layer. Another aspect of the invention provides a method for filling a structure on a substrate, comprising depositing a high conductance barrier layer on one or more surfaces of the structure, depositing a seed layer over the barrier layer, and electrochemically depositing a metal to fill the structure.
    Type: Grant
    Filed: August 16, 1999
    Date of Patent: December 11, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Peijun Ding, Tony Chiang, Tse-Yong Yao, Barry Chin
  • Patent number: 6183888
    Abstract: A process for producing a coating for protecting superalloy articles against high temperature oxidation and hot corrosion comprises forming, on the surface of the article, a first deposit of an agglomerated powdered alloy containing at least chromium, aluminum and an active element, and filling the open pores of the powder deposit by a second, electrolytically applied, deposit of a precious platinum group metal. An appropriate thermal treatment is then carried out to effect interdiffusion between the powder based deposit and the electrolytic deposit and produce a coating including chromium, an active element such as yttrium, and a precious platinum group metal throughout its thickness.
    Type: Grant
    Filed: December 11, 1997
    Date of Patent: February 6, 2001
    Assignee: Societe Nationale d'Etude et de Construction de Moteurs d'Aviation “SNECMA”
    Inventors: Alexandre Serge Alperine, Jean-Paul Fournes, Louis Jacques Leger
  • Patent number: 6136107
    Abstract: A steel sheet for a battery container is covered with nickel-tin alloy layer on one side to be the inner side of the battery container which is formed by drawing the steel sheet. A battery using the steel sheet is manufactured by firstly filling positive electrode mix consisting of manganese oxide, graphite and potassium hydroxide and secondly filling negative electrode active material consisting of zinc and potassium hydroxide in the battery container.
    Type: Grant
    Filed: March 18, 1998
    Date of Patent: October 24, 2000
    Assignee: Toyo Kohan Co., Ltd.
    Inventors: Hitoshi Ohmura, Hirokazu Moriyama, Tatsuo Tomomori, Satoshi Iketaka
  • Patent number: 6088933
    Abstract: An improved drive rod and clutch disk for a paint brush and roller cleaning tool providing the unique combination of a hardened steel clutch disk and chrome plated drive rod. Hardening virtually eliminates enlargement of the bow tie hole in the clutch disk due to wear, preventing the cross member on the end portion of the drive rod from escaping through the clutch disk bow-tie hole during the lifetime of the cleaning tool. The chrome plated spiral drive rod minimizes galling, greatly extending the useful life of the cleaning tool in the instant invention, compared to the prior art.
    Type: Grant
    Filed: January 26, 1999
    Date of Patent: July 18, 2000
    Inventor: David H. Mallalieu
  • Patent number: 6017777
    Abstract: A method for forming a plating layer of a lead frame having excellent anti-corrosion properties is provided. At least a portion of a lead frame is plated, then a first heating of the plated portion of the lead frame to a first temperature is performed, and finally a second heating of the first heated plated portion of the lead frame to a second temperature higher than the first temperature is performed. The lead frame manufactured by this method has excellent anti-corrosion properties, such that deterioration of the plating layer, by cracking and inferior solderability, is not observed.
    Type: Grant
    Filed: October 17, 1997
    Date of Patent: January 25, 2000
    Assignee: Samsung Aerospace Industries, Ltd.
    Inventors: Joong-do Kim, Young-ho Baek, Kyoung-soon Bok
  • Patent number: 5833829
    Abstract: A method of producing a coating on a substrate by electrolytically co-depositing a metal matrix M.sub.1 and particles of CrAlM.sub.2, where M.sub.1 is Ni, Co or Fe or two or all of these elements and M.sub.2 is Y, Si, Ti, Hf, Ga, Nb, Mn, Pt, a rare earth element or two or more of these elements. The co-deposition is carried out at a current density of less than 5mA per square centimeter. Preferably, the co-deposition forms a layer less than 50 microns thick, and occurs at a bath loading of less than 40 grams per liter of the particles. In a preferred embodiment, the particle size distribution in the plating bath is 25 percent between 15 and 12 microns, 45 percent between 12 and 10 microns and 30 percent less than 10 microns. The method is particularly useful for coating a gas turbine part.
    Type: Grant
    Filed: July 16, 1996
    Date of Patent: November 10, 1998
    Assignee: Praxair S.T. Technology, Inc.
    Inventor: John Foster
  • Patent number: 5762726
    Abstract: In order to produce a wire electrode having a core consisting of a copper/zinc alloy and to produce a specific sheath layer, the sheath layer is coated onto the core at a temperature at which no diffusion occurs. The wire electrode is subsequently heated at a heating speed higher than 10.degree. C. per second, briefly annealed at temperatures above 500.degree. C. and subsequently cooled again very rapidly at cooling speeds higher than 10.degree. C. per second.
    Type: Grant
    Filed: March 22, 1996
    Date of Patent: June 9, 1998
    Assignee: Berkenhoff GmbH
    Inventors: Bernd Barthel, Heinrich Groos, Hans Hermanni