Coating Is At Least Partially Diffused Or Forms Alloy Patents (Class 205/228)
  • Patent number: 9421740
    Abstract: A zirconium alloy for use in nuclear fuel assemblies is provided, which provides increased resistance against oxidation and corrosion and also improved bonding with parent material, because pure metallic material such as silicon (Si) or chromium (Cr) is evenly coated on the surface of the parent material by plasma spraying. Because the plasma spray coating used to coat the pure metallic material on the zirconium alloy does not require vacuum equipment and also is not limited due to the shape of the coated product, this is particularly useful when evenly treating the surface of the component such as 4 m-long tube or spacer grip arrangement which is very complicated in shape. Furthermore, because the coated zirconium alloy confers excellent resistance to oxidation and corrosion under emergency such as accident as well as normal service condition, both the economic and safety aspects of nuclear fuel are improved.
    Type: Grant
    Filed: November 7, 2012
    Date of Patent: August 23, 2016
    Assignees: Korea Atomic Energy Research Institute, Korea Hydro and Nuclear Power Co., LTD.
    Inventors: Kun-Woo Song, Yang-Hyun Koo, Byoung-Kwon Choi, Il-Hyun Kim, Hyun-Gil Kim, Yang-Il Jung, Dong Jun Park, Jeong-Yong Park
  • Patent number: 8940149
    Abstract: Solutions and processes for electrodepositing gallium or gallium alloys includes a plating bath free of complexing agents including a gallium salt, an indium salt, a combination thereof, and a combination of any of the preceding salts with copper, an acid, and a solvent, wherein the pH of the solution is in a range selected from the group consisting of from about zero to about 2.6 and greater than about 12.6 to about 14. An optional metalloid may be included in the solution.
    Type: Grant
    Filed: September 5, 2012
    Date of Patent: January 27, 2015
    Assignee: International Business Machines Corporation
    Inventors: Shafaat Ahmed, Hariklia Deligianni
  • Patent number: 8795846
    Abstract: Provided is a Ni-plated steel sheet having excellent press formability. An Fe—Ni diffusion layer and a softened Ni layer formed on the Fe—Ni diffusion layer are formed on a surface of a steel sheet corresponding to an outer surface of a battery can, a semi-bright Ni plating layer is formed on the softened Ni layer, a Ni coating weight of the Fe—Ni diffusion layer and the softened Ni layer formed on the Fe—Ni diffusion layer is set smaller than a Ni coating weight of the semi-bright Ni plating layer, and average roughness Ra of the semi-bright Ni plating layer measured by a traceable roughness gauge is 1.0 ?m or more and 2.0 ?m or less, and a maximum height Ry of the semi-bright Ni plating layer measured by the traceable roughness gauge is 5 ?m or more and 20 ?m or less.
    Type: Grant
    Filed: August 24, 2010
    Date of Patent: August 5, 2014
    Assignee: Toyo Kohan Co., Ltd.
    Inventors: Hideyuki Minagi, Eiji Okamatsu
  • Patent number: 8778164
    Abstract: Methods for producing a high temperature oxidation resistant coating on a superalloy component and the coated superalloy component produced thereby are provided. Aluminum or an aluminum alloy is applied to at least one surface of the superalloy component by electroplating in an ionic liquid aluminum plating bath to form a plated component. The plated component is heat treated at a first temperature of about 600° C. to about 650° C. and then further heat treated at a second temperature of about 700° C. to about 1050° C. for about 0.50 hours to about two hours or at a second temperature of about 750° C. to about 900° C. for about 12 to about 20 hours.
    Type: Grant
    Filed: December 16, 2010
    Date of Patent: July 15, 2014
    Assignee: Honeywell International Inc.
    Inventors: James Piascik, Derek Raybould, George Reimer
  • Patent number: 8734961
    Abstract: A Ni-plated steel sheet is provided in which the occurrence of scratches at the time of forming a battery can is suppressed. Also provided is a method which includes a step where a surface of a steel sheet is plated with Ni in a Ni adhesion amount of 0.3-2 ?m, a step where the Ni-plated steel sheet is heated to 600-800° C. to form an Fe?Ni diffusion layer as an outermost surface layer, and a step where the steel sheet is rolled by temper rolling so as to adjust the Fe?Ni diffusion layer so that the steel sheet has the surface roughness Ra of 0.9-2.0 ?m and the surface roughness Ry of 4.0-15 ?m. A Ni-plated steel sheet which includes an Fe?Ni diffusion layer as an outermost surface layer and in which the diffusion layer has the surface roughness Ra of 0.9-2.0 ?m and the surface roughness Ry of 4.0-15 ?m and the diffusion layer has such an Fe/Ni ratio that the Fe accounts for 20-50% in Auger analysis is subjected to drawing using a water-soluble liquid which contains water-soluble emersion as a press lubricant.
    Type: Grant
    Filed: May 31, 2010
    Date of Patent: May 27, 2014
    Assignee: Toyo Kohan Co., Ltd.
    Inventors: Shinichi Takematsu, Eiji Okamatsu, Hideyuki Minagi
  • Patent number: 8728629
    Abstract: A connector terminal, fabricated from a metallic material for connector which material has a tin or tin alloy layer, formed on a copper or copper alloy base material, wherein the thickness of the tin or tin alloy layer at a contact site on the surface of the terminal is smaller than the thickness of the tin or tin alloy layer in the areas other than the contact site, and a copper-tin alloy layer is formed as an under layer of the tin or tin alloy layer at the contact site; and a connector terminal, fabricated from a metallic material for connector which material has a copper or copper alloy base material, wherein a copper-tin alloy layer is formed in a spot shape at a contact site on the surface of the terminal, and a tin or tin alloy layer is formed in the remaining areas on the surface.
    Type: Grant
    Filed: September 17, 2010
    Date of Patent: May 20, 2014
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Shuichi Kitagawa, Kengo Mitose, Yoshiaki Kobayashi
  • Patent number: 8551316
    Abstract: This invention relates to a method for producing a metallic coating layer comprising nickel and molybdenum on an electrically conductive substrate by electrodeposition from an aqueous solution including nickel salts, gluconate anions and citrate anions wherein the substrate acts as the cathode and wherein molybdate is added and wherein the pH of the aqueous solution is adjusted between 5.0 and 8.5. The invention also relates to an electrically conductive substrate provided with such a metallic coating layer electrodeposited from the aqueous solution.
    Type: Grant
    Filed: July 11, 2008
    Date of Patent: October 8, 2013
    Assignee: Hille & Muller GmbH
    Inventors: Jacques Hubert Olga Joseph Wijenberg, Daniël Adriaan De Vreugd, Ilja Portegies Zwart
  • Patent number: 8425753
    Abstract: The present invention provides a method and precursor structure to form a solar cell absorber layer. The method includes electrodepositing a first layer including a film stack including at least a first film comprising copper, a second film comprising indium and a third film comprising gallium, wherein the first layer includes a first amount of copper, electrodepositing a second layer onto the first layer, the second layer including at least one of a second copper-indium-gallium-ternary alloy film, a copper-indium binary alloy film, a copper-gallium binary alloy film and a copper-selenium binary alloy film, wherein the second layer includes a second amount of copper, which is higher than the first amount of copper, and electrodepositing a third layer onto the second layer, the third layer including selenium; and reacting the precursor stack to form an absorber layer on the base.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: April 23, 2013
    Assignee: SoloPower, Inc.
    Inventors: Serdar Aksu, Mustafa Pinarbasi
  • Patent number: 8409418
    Abstract: The present invention provides a method and precursor structure to form a Group IBIIIAIVA solar cell absorber layer. The method includes forming a Group IBIIIAVIA compound layer on a base by forming a precursor layer on the base through electrodepositing three different films, and then reacting the precursor layer with selenium to form the Group IBIIIAVIA compound layer on the base. The three films, described by the precursor layer, include in one embodiment a first alloy film comprising copper, indium and gallium, a second alloy film comprising copper and selenium formed on the first alloy film; and a selenium film formed on the second alloy film.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: April 2, 2013
    Assignee: SoloPower, Inc.
    Inventors: Serdar Aksu, Jiaxiong Wang, Mustafa Pinarbasi
  • Patent number: 8337997
    Abstract: A composite material for an electrical/electronic part, which is used as a material for use in an electrical/electronic part, containing: a metal base material having at least a surface formed of Cu or a Cu alloy; and an insulating film provided on at least a part of the metal base material; wherein a metal layer having Cu diffused in Ni or a Ni alloy is interposed between the metal base material and the insulating film; and wherein the ratio of the number of Cu atoms to the number of Ni atoms (Cu/Ni) obtained by analyzing the outermost surface of the metal layer by Auger electron spectroscopy is 0.005 or more.
    Type: Grant
    Filed: December 23, 2010
    Date of Patent: December 25, 2012
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Chikahito Sugahara, Satoru Zama, Akira Tachibana
  • Patent number: 8163157
    Abstract: In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal plate exposed within the through holes, from the side of the conductive base member where the metal plate is not attached, thereby to fill up the through holes, in a film forming process, a Pd alloy film is formed by plating on the surface of the conductive base member after removal of the metal plate, and in a removal process, the copper plating layer is removed by selective etching, thereby to produce a hydrogen production filter that is used in a reformer of a fuel cell so as to be capable of stably producing high purity hydrogen gas.
    Type: Grant
    Filed: July 7, 2010
    Date of Patent: April 24, 2012
    Assignee: Dai Nippon Insatsu Kabushiki Kaisha
    Inventors: Hiroshi Yagi, Takanori Maeda, Yoshinori Oota, Yasuhiro Uchida
  • Patent number: 8142906
    Abstract: In Sn-plated copper or a Sn-plated copper alloy according to the present invention, a surface plating layer including a Ni layer, a Cu—Sn alloy layer, and a Sn layer which are deposited in this order is formed on a surface of a base material made of copper or a copper alloy. An average thickness of the Ni layer is 0.1 to 1.0 ?m, an average thickness of the Cu—Sn alloy layer is 0.55 to 1.0 ?m, and an average thickness of the Sn layer is 0.2 to 1.0 ?m. The Cu—Sn alloy layer includes Cu—Sn alloy layers having two compositions, a portion thereof in contact with the Ni layer is formed of an ?-phase having an average thickness of 0.5 to 0.95 ?m, and a portion thereof in contact with the Sn layer is formed of a ?-phase having an average thickness of 0.05 to 0.2 ?m.
    Type: Grant
    Filed: February 25, 2010
    Date of Patent: March 27, 2012
    Assignee: Kobe Steel, Ltd.
    Inventors: Kouichi Taira, Yasushi Masago
  • Patent number: 8118989
    Abstract: Methods are provided for bonding pure rhenium to a substrate comprising a material. Non-lubricated components configured to have friction contact with another component are also provided. In an embodiment, by way of example only, a method includes disposing a eutectic alloy over the substrate to form an inter layer, the eutectic alloy comprised essentially of a base alloy and one or more melting point depressants and having a melting temperature that is lower than a melting temperature of the substrate material and a melting temperature of rhenium, placing pure rhenium over the inter layer, and heating the inter layer to a temperature that is substantially equal to or greater than the melting temperature of the eutectic alloy, but that is below the melting temperature of the substrate material and the melting temperature of the pure rhenium to bond the pure rhenium to the substrate.
    Type: Grant
    Filed: August 11, 2011
    Date of Patent: February 21, 2012
    Assignee: Honeywell International Inc.
    Inventors: Don Mittendorf, Scott Sperl
  • Patent number: 8101285
    Abstract: A metallic material for a connecting part, having a rectangular wire material of copper or a copper alloy as a base material, and formed at an outermost surface thereof, a copper-tin alloy layer substantially composed of copper and tin, wherein the copper-tin alloy layer of the outermost surface further contains at least one selected from the group consisting of zinc, indium, antimony, gallium, lead, bismuth, cadmium, magnesium, silver, gold, and aluminum, in a total amount of 0.01% or more and 1% or less in terms of mass ratio with respect to the content of the tin.
    Type: Grant
    Filed: September 29, 2010
    Date of Patent: January 24, 2012
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Kengo Mitose, Shuichi Kitagawa, Yoshiaki Ogiwara
  • Patent number: 7959782
    Abstract: A Ni—Pt alloy and target superior in workability containing 0.1 to 20 wt % Pt and having a Vickers hardness of 40 to 90. A method of manufacturing the Ni—Pt alloy comprises steps of subjecting a raw material Ni having a purity of 3N level to electrochemical dissolution, neutralizing the electrolytically leached solution with ammonia, removing impurities through filtration with activated carbon, blowing carbon dioxide into the resultant solution to form nickel carbonate, exposing the resultant product to a reducing atmosphere to prepare high purity Ni powder, leaching a raw material Pt having a purity of 3N level with acid, subjecting the leached solution to electrolysis to prepare high purity electrodeposited Pt, and dissolving the resultant high purity Ni powder and high purity electrodeposited Pt. The method enables rolling of the Ni—Pt alloy ingot upon reducing the hardness thereof, which results in the stable and efficient manufacture of a rolled target.
    Type: Grant
    Filed: November 30, 2010
    Date of Patent: June 14, 2011
    Assignee: JX Nippon Mining & Metals Corporation
    Inventor: Yuichiro Shindo
  • Patent number: 7833401
    Abstract: A method of forming a component capable of being exposed to a plasma in a process chamber comprises forming a structure comprising a surface and electroplating yttrium, and optionally aluminum or zirconium, onto the surface. Thereafter, the electroplated layer can be annealed to oxide the yttrium and other electroplated species.
    Type: Grant
    Filed: June 21, 2007
    Date of Patent: November 16, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Nianci Han, Li Xu, Hong Shih, Yang Zhang, Danny Lu, Jennifer Y. Sun
  • Patent number: 7824776
    Abstract: A plated material 5, containing: on a conductive substrate 1, an underlayer 2 composed of nickel and the like; an intermediate layer 3 composed of Cu or a Cu alloy being provided thereon; and an outermost layer 4 composed of a Cu—Sn intermetallic compound being provided thereon; and an electric or electronic part using the same.
    Type: Grant
    Filed: August 19, 2008
    Date of Patent: November 2, 2010
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Kazuo Yoshida, Kyota Susai
  • Patent number: 7771578
    Abstract: In a method for production of a corrosion resistant and/or oxidation resistant coating, at least one metal of the platinum group or an alloy thereof is galvanically deposited onto a surface of a substrate, and thereafter the thusly galvanically coated substrate is aluminized. In a first stage of the galvanic deposition process a current magnitude applied for the galvanizing is increased continuously or step-wise beginning from an initial value up to a maximum value, and in a second stage of the galvanic deposition process the current magnitude applied for the galvanizing is maintained constant at the maximum value. The galvanic deposition of the or each metal of the platinum group or the corresponding alloy may be carried out using an open-celled or open-mesh or porous anode.
    Type: Grant
    Filed: May 2, 2005
    Date of Patent: August 10, 2010
    Assignee: MTU Aero Engines GmbH
    Inventors: Anton Albrecht, Thomas Dautl, Oemer-Refik Oezcan, Horst Pillhoefer
  • Patent number: 7767072
    Abstract: A method for forming a modified platinum aluminide coating on a turbine engine component surface includes the step of forming a platinum layer on the turbine engine component surface. A bath is then prepared, including a mixture of a primary alcohol and a tertiary alcohol, and an electrolyte including an yttrium salt. Then, yttrium from the yttrium salt is electrodeposited onto the platinum layer. The component is heated to diffuse the yttrium into the platinum layer to form a modified platinum layer. Aluminum is then deposited onto the modified platinum layer, and the component is heated to diffuse the aluminum into the modified platinum layer to form a modified platinum aluminide layer.
    Type: Grant
    Filed: December 15, 2006
    Date of Patent: August 3, 2010
    Assignee: Honeywell International Inc.
    Inventor: Devlin M. Gualtieri
  • Patent number: 7641781
    Abstract: In a method for coating a substrate, and a coated object, in a first step, in an external current-less or electrolytic manner, nickel and/or cobalt and/or platinum are deposited on a substrate in a deposition bath. In the deposition bath, particles are additionally suspended which contain at least one metal selected from Mg, Al, Ti, Zn and no Cr, the particles becoming occluded in the coating. In a second step, the actual protective layer is produced by heat treatment. The coating of component parts may be used for aircraft turbines or gas turbines or for garbage incineration systems having temperature-resistant protective layers against high temperature corrosion.
    Type: Grant
    Filed: November 3, 2003
    Date of Patent: January 5, 2010
    Assignee: MTU Aero Engines GmbH
    Inventors: Andreas Dietz, Gebhard Klumpp, Juergen Olfe
  • Patent number: 7604726
    Abstract: Platinum containing coatings for corrosion and oxidation protection of a substrate, and platinum electrodeposition methods for coating a substrate. The coating may comprise platinum and at least one supplementary constituent, and the method may involve co-electrodeposition of platinum and the supplementary constituent from a single electrolyte composition. The supplementary constituent may comprise chromium, an oxidation protective reactive element, or an alloy of chromium with a reactive element. Components protected by such coatings are also disclosed.
    Type: Grant
    Filed: January 7, 2004
    Date of Patent: October 20, 2009
    Assignee: Honeywell International Inc.
    Inventors: Alexander S. Kozlov, Svetlana Kozlova, legal representative, Derek Raybould, Siu-Ching D. Lui, Thomas E. Strangman
  • Patent number: 7560014
    Abstract: A method is provided for electroplating a high temperature coating onto an airfoil. The method includes providing a shield having a recess defining one or more walls conforming to the shape of at least a portion of a pressure side and a suction side of the airfoil to be electroplated, introducing the portions of the pressure side and the suction side of the airfoil to be electroplated into the recess of the shield, attaching an anode and cathode to the airfoil, submerging at least the shield and the portions of the pressure side and the suction side of the airfoil to be electroplated into an electroplating tank containing an electrolyte, and electroplating a coating of a high temperature resistant metal onto the portions of the pressure side and the suction side of the airfoil to be electroplated to a predetermined minimum thickness.
    Type: Grant
    Filed: August 20, 2008
    Date of Patent: July 14, 2009
    Assignee: General Electric Company
    Inventors: Michael Rucker, Bhupendra K. Gupta
  • Patent number: 7179541
    Abstract: A method for heat treatment of a cold rolled strip with a surface coating of Ni and/or Co and incorporated non-metallic elements C and/or S, if need be with the addition of Fe, In, Pd, Au and/or Bi, whereby the cold rolled strip has a low carbon content. Since the compounds of C, S, N and P deposited on the grain boundaries bring about the most micro-cracks with the surface coating metal if no recrystallization takes place, the temperature of the heat treatment should be selected lower than the recrystallization temperature and higher than the precipitation temperature. With a recrystallization, the grain sizes would easily attain the thickness of the coating so that the embrittled compounds would migrate with the grain boundaries out of the coating. Due to the choice of temperature of the heat treatment of the surface coating of the invention, in contrast, an optimal embrittlement of the grain boundaries is guaranteed, which is especially advantageous in the manufacture of battery cans.
    Type: Grant
    Filed: June 12, 2002
    Date of Patent: February 20, 2007
    Assignee: Hille & Muller GmbH
    Inventors: Werner Olberding, Beate Monscheuer, Claudia Dahmen, Karlfried Pfeifenbring
  • Patent number: 7008522
    Abstract: A method of locally repairing parts coated with a thermal barrier including a ceramic outer layer and a metal underlayer of alumina-forming alloy for protecting the substrate against oxidation and for bonding with the ceramic outer layer, includes: defining the zone for repair with a mechanical mask adapted to the shape of the part and the zone for repair; scouring the zone for repair so as to remove the ceramic, the alumina layer, and the damaged portions of the underlayer; supplying materials for repairing the underlayer to the repair zone by subjecting the partially-scoured part to metal deposition by use of an electrical current; and subjecting the part to a heat treatment in order to enable the added metals to diffuse into the remaining underlayer in the repair zone for repair and to enable a surface film of alumina to form. After the underlayer has been reconstituted, the zone for repair is again defined by a mechanical mask and a new ceramic layer is deposited thereon.
    Type: Grant
    Filed: July 11, 2002
    Date of Patent: March 7, 2006
    Assignee: Snecma Moteurs-Snecma Services
    Inventors: Bruno Gilles François Boucard, Jean-Paul Fournes, Frédéric Yves Pierre Jacquot, Yann Philippe Jaslier, Jacques Louis Leger, André Hubert Louis Malie, Guillaume Roger Pierre Oberlaender, Catherine Marie-Hélène Richin
  • Patent number: 6974636
    Abstract: A turbine engine component comprising a substrate made of a nickel-base or cobalt-base superalloy and a protective coating overlying the substrate, the coating formed by electroplating at least two platinum group metals selected from the group consisting of platinum, palladium, rhodium, ruthenium and iridium. The protective coating is typically heat treated to increase homogeneity of the coating and adherence with the substrate. The component typically further comprises a ceramic thermal barrier coating overlying the protective coating. Also disclosed are methods for forming the protective coating on the turbine engine component by electroplating the platinum group metals.
    Type: Grant
    Filed: September 22, 2003
    Date of Patent: December 13, 2005
    Assignee: General Electric Company
    Inventors: Ramgopal Darolia, Mark Daniel Gorman, Melvin Robert Jackson, Ji-Cheng Zhao
  • Patent number: 6932874
    Abstract: A method for producing a superconductor having a high copper to superconductor composition (Cu/SC) ratio by cross-sectional area. An assembly is prepared formed of one or more fine filaments of a superconductor composition or of a precursor component for a superconductor alloy composition, which filaments are embedded in a copper-based matrix. The assembly is electroplated with copper to increase the Cu/filament ratio in the resulting product, and thereby increase the said Cu/SC ratio to improve the stability of the final superconductor.
    Type: Grant
    Filed: October 22, 2003
    Date of Patent: August 23, 2005
    Assignee: Oxford Superconducting Technology
    Inventors: William G. Marancik, Seung Hong
  • Patent number: 6932897
    Abstract: A method for plating a titanium-containing metal, comprising the steps of: (a) surface treating the titanium-containing metal in a solution consisting essentially of an aqueous solvent and hydrochloric acid for a period of time sufficient to activate the surface of the titanium-containing metal; (b) plating the surface of the surface treated titanium-containing metal with a metallic coating in an electrolyte bath; and (c) non-oxidatively heat treating the plated titanium-containing metal for a period of time sufficient to cause diffusion bonding between the metallic coating and the titanium-containing metal. The present invention also provides parts made in accordance with the methods disclosed herein.
    Type: Grant
    Filed: March 3, 2003
    Date of Patent: August 23, 2005
    Assignee: Com Dev Ltd.
    Inventors: Florin Burca, John Darmon
  • Patent number: 6913791
    Abstract: A method for surface treating a titanium-containing metal, comprising the steps of: (a) treating at least a portion of a surface of the titanium-containing metal with an anodic activation in an electrolyte bath; and (b) strike plating at least a portion of the surface of the treated titanium-containing metal with a metallic coating in the same electrolyte bath as in step (a), wherein the titanium-containing metal remains submerged in the electrolyte bath during steps (a) and (b).
    Type: Grant
    Filed: March 3, 2003
    Date of Patent: July 5, 2005
    Assignee: COM DEV Ltd.
    Inventors: Florin Burca, John Darmon
  • Patent number: 6881452
    Abstract: A thermal barrier coating system having an improved life as a result of a preoxidation treatment applied to a single phase platinum aluminide bond coat. After coating the substrate to form a diffusion platinum aluminum bond coat, the surface finish of the bond coat was grit blasted with an inert grit of preselected size at a preselected pressure to achieve a predetermined surface finish. After the grit blasting, but before application of the ceramic top coat of yttria-stabilized zirconia (YSZ), the coating was preoxidized to form a thin alumina scale by heat treating the diffusion platinum aluminide bond coat at an elevated temperature at a preselected partial pressure of oxygen.
    Type: Grant
    Filed: July 6, 2001
    Date of Patent: April 19, 2005
    Assignee: General Electric Company
    Inventor: Irene Spitsberg
  • Patent number: 6838297
    Abstract: The invention provides a nanostructure including an anodized film including nanoholes. The anodized film is formed on a substrate having a surface including at least one material selected from the group consisting of semiconductors, noble metals, Mn, Fe, Co, Ni, Cu and carbon. The nanoholes are cut completely through the anodized film from the surface of the anodized film to the surface of the substrate. The nanoholes have a first diameter at the surface of the anodized film and a second diameter at the surface of the substrate. The nanoholes are characterized in that either a constriction exists at a location between the surface of the anodized film and the surface of the substrate, or the second diameter is greater than the first diameter.
    Type: Grant
    Filed: May 31, 2001
    Date of Patent: January 4, 2005
    Assignee: Canon Kabushiki Kaisha
    Inventors: Tatsuya Iwasaki, Tohru Den
  • Patent number: 6811671
    Abstract: A method of fabricating a semiconductor device, having a reduced-oxygen Cu—Zn alloy thin film (30) electroplated on a Cu surface (20) by electroplating, using an electroplating apparatus, the Cu surface (20) in a unique chemical solution containing salts of zinc (Zn) and copper (Cu), their complexing agents, a pH adjuster, and surfactants; and annealing the electroplated Cu—Zn alloy thin film (30); and a semiconductor device thereby formed. The method controls the parameters of pH, temperature, and time in order to form a uniform reduced-oxygen Cu—Zn alloy thin film (30), having a controlled Zn content, for reducing electromigration on the Cu—Zn/Cu structure by decreasing the drift velocity therein which decreases the Cu migration rate in addition to decreasing the void formation rate, for improving device reliability, and for increasing corrosion resistance.
    Type: Grant
    Filed: February 22, 2002
    Date of Patent: November 2, 2004
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Sergey Lopatin, Alexander H. Nickel, Joffre F. Bernard
  • Patent number: 6805975
    Abstract: Steel sheet for porcelain enameling capable of realizing excellent enamel adhesion with the steel sheet by direct-on enameling once is provided by using a Ti-added steel sheet; there are also a method for producing the same, as well as a porcelain enamel product and the method for producing the same. A steel sheet for porcelain enameling is produced by providing a Ni—Mo alloy plating film on a Ti-added steel sheet containing 0.01% by weight (wherein, % represents “% by weight” hereinafter) or less of C, 0.5% or less of Mn, 0.04% or less of P, 0.04% or less of S, 0.01 to 0.50% of Ti, and balance Fe accompanied by unavoidable impurities, and by then performing heat treatment thereto to control the content of Ni, Mo, and Fe present in the surface of the steel sheet in a predetermined range, porcelain enamel is applied once and fired.
    Type: Grant
    Filed: January 16, 2003
    Date of Patent: October 19, 2004
    Assignees: Ferro Enamels (Japan) Limited, Toyo Kohan Co., Ltd.
    Inventors: Fumiaki Sato, Toshihira Hamada, Shuzo Oda, Yoshihiro Jono, Takahiro Hayashida, Junichi Fujimoto, Masao Komai
  • Patent number: 6709719
    Abstract: A tin layer and a zinc layer are stacked sequentially on a given substrate to form a multilayered film composed of the tin layer and the zinc layer. Then, a laser beam is irradiated onto the multilayered film to produce a tin-zinc alloy film through the inter-diffusion between the tin elements of the tin layer and the zinc elements of the zinc layer.
    Type: Grant
    Filed: May 16, 2002
    Date of Patent: March 23, 2004
    Assignee: Susuka National College of Technology
    Inventors: Hideyuki Kanematsu, Yoshihiko Masuo, Takeo Oki, Hirohiko Ohmura
  • Patent number: 6652914
    Abstract: A gas turbine blade which has previously been in service is protected by cleaning the gas turbine blade, and then first depositing a platinum first layer on the airfoil and the platform of the gas turbine blade. Thereafter, a platinum second layer is deposited over the platform but not the airfoil. A platinum-aluminide protective coating is formed by depositing an aluminum-containing layer overlying both the platform and the airfoil and interdiffusing the platinum and the aluminum.
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: November 25, 2003
    Assignee: General Electric Aviation Service Operation Pte. Ltd.
    Inventors: Nigel Brian Thomas Langley, Keng Nam Chen, Genfa Hu, Kwok Heng Yow
  • Patent number: 6602548
    Abstract: A nickel base single crystal compliant layer on a ceramic blade has the capability to sustain high stresses and high operating temperature. Layers of nickel and platinum bonded on a single crystal superalloy over a sputtered gold-chromium layer support the high stress levels at elevated temperature without extrusion of the soft platinum or nickel layer and without destruction of an NiO compliant surface. The compliant layers have survived stress and temperature conditions without failure to the ceramic blade and the system can be stressed/heated and unloaded/cooled repeatedly without damage to the ceramic blades. A single crystal nickel base superalloy (i.e., SC180) has high strength properties at elevated temperature. Thin layers of chromium followed by gold are e-beam evaporated on one side of a polished surface of the alloy. Pure nickel is electroplated over this e-beam gold-chromium layer. Platinum is either electroplated or plated electrolessly over the nickel layer.
    Type: Grant
    Filed: June 20, 2001
    Date of Patent: August 5, 2003
    Assignee: Honeywell International Inc.
    Inventors: Dave Narasimhan, Alexander S. Kozlov, Margaret Eagan, Milton Ortiz
  • Patent number: 6579568
    Abstract: This invention provides a copper foil for a printed wiring board, which comprises a copper foil, an alloy layer (A) comprising copper, zinc, tin and nickel which is formed on a surface of the copper foil, said surface to be brought into contact with a substrate for a printed wiring board, and a chromate layer which is formed on a surface of the alloy layer (A). The copper foil for a printed wiring board has the following features: even if a printed wiring board is produced using a long-term stored copper foil, the interface between the copper foil and the substrate is only slightly corroded with chemicals; even if the copper foil contacts a varnish containing an organic acid, e.g., a varnish for an acrylic resin, in the formation of a copper-clad laminate, the bond strength is sufficient.
    Type: Grant
    Filed: October 26, 2001
    Date of Patent: June 17, 2003
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Kazuhisa Fujiwara, Hiroshi Tan, Mitsuo Fujii, Masanobu Tsushima
  • Patent number: 6565931
    Abstract: The present invention provides for an etch and mar resistant low VOC clear coating composition most suitable for use as a top clear coat in multi-layered OEM or refinish automotive coatings. The coating composition includes isocyanate, carbonate and melamine components. The isocyanate component includes an aliphatic polyisocyanate. The composition may be formulated as a two-pack or one-pack coating composition, wherein the isocyanate functionalities are blocked with a blocker such as a mono-alcohol.
    Type: Grant
    Filed: October 18, 2000
    Date of Patent: May 20, 2003
    Assignee: Rolls-Royce plc
    Inventors: David S Rickerby, Richard AB McCall
  • Patent number: 6562219
    Abstract: A method for the formation of copper wiring films includes the steps of forming a first copper film by a CVD method on a diffusion barrier film, which diffusion barrier film has been formed on a semiconductor substrate and in which a concavity has been established; heating the first copper film to a temperature within the range from 200 to 500° C.; and subsequently forming a second copper film on the first copper film by a plating method using the first copper film as an electrode.
    Type: Grant
    Filed: November 16, 2001
    Date of Patent: May 13, 2003
    Assignee: Anelva Corporation
    Inventors: Akiko Kobayashi, Atsushi Sekiguchi, Tomoaki Koide, Minjuan Zhang, Hideki Sunayama, Shiqin Xiao, Kaoru Suzuki
  • Patent number: 6551721
    Abstract: A purpose of the present invention is to provide a surface treated steel sheet for a battery container having an excellent anti-alkaline characteristic and a performance for maintaining a discharging level for a long time, a battery container and a product method thereof. In the present invention, after forming a nickel-bismuth alloy layer on a steel sheet, the steel sheet is thermally treated at 300° C. to 650° C. in an inactive gas or a deoxidizing gas for 240 to 600 min so that an iron-nickel diffused layer and nickel-bismuth diffused layer are formed at each boundary surface. A battery is produced by utilizing a battery container made of a steel sheet on which one or more than layers selected from a group of an iron-nickel diffused layer, a nickel layer, a nickel-bismuth diffused layer, an iron-nickel-bismuth alloy layer is formed on the steel sheet.
    Type: Grant
    Filed: April 23, 2001
    Date of Patent: April 22, 2003
    Assignee: Toyo Kohan Co., Ltd.
    Inventors: Hitoshi Ohmura, Tatsuo Tomomori, Hideo Ohmura, Tatsuya Ohshima
  • Patent number: 6413404
    Abstract: Bumps are formed by means of uniform plating in which air can be easily discharged.
    Type: Grant
    Filed: February 11, 2000
    Date of Patent: July 2, 2002
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Yoshihiro Ihara, Takeo Kanazawa, Tsuyoshi Kobayashi
  • Patent number: 6342146
    Abstract: A continuous plating system which is horizontal, allows for submersion of the entire article to be plated, and is useful for alloy plating. The invention provides a link/hinge conveyor system, the conveyor acts as the conductor, numerous processes/baths are possible, and difficult to plate alloys, such as a tin/bismuth plate can be produced. Homogeneous alloys are possible with the present invention. Also disclosed are novel dryer, rinse and reflow systems for use with the continuous plating system.
    Type: Grant
    Filed: July 27, 1999
    Date of Patent: January 29, 2002
    Inventor: Geronimo Z. Velasquez
  • Patent number: 6312762
    Abstract: A process for the production of copper or a copper base alloy that provides a surface having improved characteristics suitable for the production of a connector or a charging-socket of an electric automobile by having a decreased coefficient of friction on the surface and improved resistance to abrasion. The process comprises coating copper or a copper alloy with Sn, followed by heat treating the resulting Sn-plated copper or copper base in an atmosphere having an oxygen content of no more than 5%, thereby forming on an outermost surface thereof an oxide film and beneath the surface a layer of an intermetallic compound mainly comprising Cu—Sn.
    Type: Grant
    Filed: February 2, 2000
    Date of Patent: November 6, 2001
    Assignees: Dowa Mining Co., Ltd., Yazaki Corporation
    Inventors: Akira Sugawara, Yoshitake Hana, Takayoshi Endo
  • Patent number: 6291014
    Abstract: A CVD outwardly grown platinum aluminide diffusion coating on a nickel or cobalt base superalloy substrate wherein the platinum modified aluminide diffusion coating is modified to include silicon, hafnium, and optionally zirconium and/or other active elements (e.g. Ce, La, Y, etc.) each in a concentration of about 0.01 weight % to about 8 weight % of the outer additive (Ni,Pt)(Al,Si) layer of the coating. A particular coating includes about 0.01 weight % to less than 2 weight % of each of silicon, hafnium, and zirconium in the outer additive layer, preferably with a Hf/Si ratio less than about 1 and, when Zr also is present, a Hf+Zr/Si ratio of less than about 1. A coating microstructure is provided characterized by an inner diffusion zone or region adjacent the substrate and the outer additive (Ni,Pt)(Al,Si) layer including hafnium silicide second phase particles or regions dispersed throughout the outer additive layer of the coating.
    Type: Grant
    Filed: September 7, 1999
    Date of Patent: September 18, 2001
    Assignee: Howmet Research Corporation
    Inventors: Bruce M. Warnes, Daniel L. Near, David C. Punola, William C. Basta
  • Patent number: 6254756
    Abstract: A curved component such as a turbine airfoil, shroud, or combustor centerbody is prepared with a platinum or a platinum-aluminide protective coating over only a portion of the surface thereof. The coating may serve as an environmental coating, or as a bond coat of a thermal barrier coating system. The partial coverage is achieved by depositing platinum only over a portion of the surface of the component, typically including the concave portion in the case of an airfoil, optionally depositing an aluminum layer, and optionally interdiffusing the platinum and aluminum layers.
    Type: Grant
    Filed: August 11, 1999
    Date of Patent: July 3, 2001
    Assignee: General Electric Company
    Inventors: Antonio F. Maricocchi, Roger D. Wustman, Jonathan P. Clarke, Thomas E. Mantkowski, David G. W. Fargher, Jeffrey A. Conner
  • Patent number: 6235406
    Abstract: A structure for enhancing electromigration resistance within a copper film includes impurities laminated within the film and other additives incorporated in the film to form intermetallic compounds. Metal grain boundary growth and metal surface mobility is suppressed within the composite copper film. The present invention provides an alloy seed layer and laminated impurities and provides indium, tin, titanium, their compounds with oxygen, and their complexes with oxygen, carbon, and sulfur, incorporated into other films. Intermetallics are disposed at grain boundaries and reduce copper atom mobility. A further aspect of the present invention is a barrier layer formed by combining additives included in an alloy seed layer with materials otherwise unsuitable for barrier material functions.
    Type: Grant
    Filed: July 13, 2000
    Date of Patent: May 22, 2001
    Assignee: International Business Machines Corporation
    Inventor: Cyprian E. Uzoh
  • Patent number: 6207035
    Abstract: A method for manufacturing a metal composite strip for the production of electrical contact components. A film made of tin or a tin alloy is first applied onto an initial material made of an electrically conductive base material. A film of silver is then deposited thereonto. Copper or a copper alloy is preferably used as the base material. The tin film can be applied in the molten state, and the silver film by electroplating. Furthermore, both the tin film and the silver film can be deposited by electroplating. A further alternative provides for manufacturing the tin film in the molten state and the silver film by cathodic sputtering. The diffusion operations which occur in the coating result in a homogeneous film of a tin-silver alloy. This formation can be assisted by way of a heat treatment of the composite strip.
    Type: Grant
    Filed: November 20, 1998
    Date of Patent: March 27, 2001
    Assignee: Stolberger Metallwerke GmbH & Co. KG
    Inventors: Udo Adler, Klaus Schleicher
  • Patent number: 6183888
    Abstract: A process for producing a coating for protecting superalloy articles against high temperature oxidation and hot corrosion comprises forming, on the surface of the article, a first deposit of an agglomerated powdered alloy containing at least chromium, aluminum and an active element, and filling the open pores of the powder deposit by a second, electrolytically applied, deposit of a precious platinum group metal. An appropriate thermal treatment is then carried out to effect interdiffusion between the powder based deposit and the electrolytic deposit and produce a coating including chromium, an active element such as yttrium, and a precious platinum group metal throughout its thickness.
    Type: Grant
    Filed: December 11, 1997
    Date of Patent: February 6, 2001
    Assignee: Societe Nationale d'Etude et de Construction de Moteurs d'Aviation “SNECMA”
    Inventors: Alexandre Serge Alperine, Jean-Paul Fournes, Louis Jacques Leger
  • Patent number: 6176994
    Abstract: A conductive electrode wire is passed through a molten salt bath maintained at a temperature above the melting point of the salts. A main electrical power supply passes an electric current between the electrode wire and an anode in the molten salt bath so that a metal coating layer is electrolytically deposited onto the core of the electrode wire. The high temperature of the molten salt bath ensures inter-diffusion of the metals of the core and the coating. This enables diverse coating structures to be obtained by choosing electrolysis and diffusion parameters.
    Type: Grant
    Filed: May 4, 1999
    Date of Patent: January 23, 2001
    Assignee: Thermocompact, societe anonyme
    Inventor: Louis Lacourcelle
  • Patent number: 6149790
    Abstract: A method for making an aluminium material which is electroplated on its aluminum or aluminium alloy base with iron or an iron alloy containing 2-20 weight % of chromium, and which can be utilized as a new structural or functional material in various industrial fields. The material is characterized in having an inter-diffusion layer produced between the base and the plating and/or having such fine cracks produced in the plating which can reserve well machine oil, work well for painting it, and be impregnated with a resin for improving its wear resistance and so on.
    Type: Grant
    Filed: June 12, 1998
    Date of Patent: November 21, 2000
    Assignee: Nippon Platec, K.K.
    Inventors: Wataru Oikawa, Eiichi Takeuchi
  • Patent number: 6126806
    Abstract: A process and structure for enhancing electromigration resistance within a copper film using impurity lamination and other additives to form intermetallic compounds to suppress metal grain boundary growth and metal surface mobility of a composite copper film. The present invention provides an alloy seed layer and laminated impurities to incorporate indium, tin, titanium, their compounds with oxygen, and their complexes with oxygen, carbon, and sulfur into other films. The intermetallics form and segregate to grain boundaries during an annealing process to reduce copper atom mobility. A further aspect of the present invention is the use of high-temperature, inter-diffusion of additives included in an alloy seed layer to form a barrier layer by combining with materials otherwise unsuitable for barrier material functions.
    Type: Grant
    Filed: December 2, 1998
    Date of Patent: October 3, 2000
    Assignee: International Business Machines Corporation
    Inventor: Cyprian E. Uzoh