Abstract: The present disclosure provides electrolyte solutions for electrodeposition of zinc-manganese alloys, methods of forming electrolyte solutions, methods of electrodepositing zinc-manganese alloys, and multilayered zinc-manganese alloys. An electrolyte solution for electroplating can include a metal salt, boric acid, an alkali metal chloride, polyethylene glycol, and a hydroxy benzaldehyde. An electrolyte solution can be formed by dissolving a metal salt, boric acid, an alkali metal chloride, polyethylene glycol, and a hydroxy benzaldehyde in water or an aqueous solution. Electrodepositing zinc-manganese alloys on a substrate can include introducing a cathode and an anode into an electrolyte solution comprising a metal salt, boric acid, an alkali metal chloride, polyethylene glycol, and a hydroxy benzaldehyde. Electrodepositing can further include passing a current between the cathode and the anode through the electrolyte solution to deposit zinc and manganese onto the cathode.

Abstract: The present disclosure provides electrolyte solutions for electrodeposition of zinc-manganese alloys, methods of forming electrolyte solutions, methods of electrodepositing zinc-manganese alloys, and multilayered zinc-manganese alloys. An electrolyte solution for electroplating can include a metal salt, boric acid, an alkali metal chloride, polyethylene glycol, and a hydroxy benzaldehyde. An electrolyte solution can be formed by dissolving a metal salt, boric acid, an alkali metal chloride, polyethylene glycol, and a hydroxy benzaldehyde in water or an aqueous solution. Electrodepositing zinc-manganese alloys on a substrate can include introducing a cathode and an anode into an electrolyte solution comprising a metal salt, boric acid, an alkali metal chloride, polyethylene glycol, and a hydroxy benzaldehyde. Electrodepositing can further include passing a current between the cathode and the anode through the electrolyte solution to deposit zinc and manganese onto the cathode.

Abstract: An electrolytic copper foil includes a raw foil layer having a first surface and a second surface opposite to the first surface. In the X-ray diffraction spectrum of the first surface, a ratio of the diffraction peak intensity I(200) of the (200) crystal face of the first surface relative to the diffraction peak intensity I(111) of the (111) crystal face of the first surface is between 0.5 and 2.0. In the X-ray diffraction spectrum of the second surface, a ratio of the diffraction peak intensity I(200) of the (200) crystal face of the second surface relative to the diffraction peak intensity I(111) of the (111) crystal face of the second surface is also between 0.5 and 2.0. A method for producing the electrolytic copper foil, and a lithium ion secondary battery is also provided.

Abstract: The object of the invention is to provide a surface-treated steel sheet having a coating having fine adhesiveness to an adhesive on the surface and having excellent corrosion resistance, and a production method thereof. Provided is a surface-treated steel sheet including: a steel sheet; a plated layer containing zinc on the steel sheet; and a coating on the plated layer, wherein the coating contains an acrylic resin, zirconium, vanadium, phosphorus and cobalt, and the acrylic resin has an area ratio of 80 to 100 area % in an area from a surface to a thickness of one-fifth of a film thickness of the coating, and an area ratio of 5 to 50 area % in an area including areas from the film thickness center of the coating to a thickness of one-tenth of the film thickness toward the surface side and toward the plated layer side.

Abstract: The present invention relates to a slurry composition for polishing and a method for polishing a semiconductor thin film with steps of a high aspect ratio, and more particularly, by comprising polishing particles, a compound represented by Chemical Formula 1 below, and a compound represented by Chemical Formula 2 below, to make a slurry composition for polishing that has a high polishing speed in high stepped regions while simultaneously protecting low stepped regions to obtain a high degree of flatness without leaving remaining steps after the completion of polishing, and a method for polishing a semiconductor thin film with steps of a high aspect ratio. in Chemical Formula 1, n is an integer of 1 to 10, in Chemical Formula 2, R1 to R4 are independently C1-C10 alkyl groups, and m is an integer of 1 to 10.

Abstract: A surface treatment solution for a plated steel sheet to be hot-pressed comprising a ZnO aqueous dispersion (A) and a water dispersible organic resin (B), wherein the ZnO aqueous dispersion (A) comprises water and ZnO particle size having 50 to 300 nm particles, the water dispersible organic resin (B) has a 5 to 45 mgKOH/g acid value and 5 to 300 nm emulsion particle size, and a mass ratio (WA/WB) of a mass of ZnO particles in the ZnO aqueous dispersion (WA) to a mass of solid content of the water dispersible organic resin (WB) is 30/70 to 95/5.

Abstract: The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions, at least one acid and at least one guanidine compound. The plating bath is particularly useful for plating recessed structures with copper and build-up of copper pillar bump structures.

Abstract: A chromium-free insulation coating composition includes 100 parts by weight of a phosphate solution, 1-5 parts by weight of molybdate, 50-150 parts by weight of silica sol, 3-13 parts by weight of selenium dioxide, 1-10 parts by weight of metal oxide and/or metal hydroxide, 5-15 parts by weight of organic acid, 1-6 parts by weight of boric acid, and 100-300 parts by weight of water.

Abstract: There is provided a method of manufacturing a metal sheet having an alloy plated layer, the method including a step of passing a metal strip continuously through a plating bath to perform electroplating in the plating bath, the plating bath including a plating liquid and an anode, the plating liquid containing two or more kinds of metal ions for forming the alloy plated layer, wherein an anode obtained by mixing two or more kinds of metal pellets is used as the anode, the metal pellets being formed of respective metals that form the alloy plated layer, wherein a mixing ratio of each metal pellet that constitutes the anode is determined based on a total surface area ratio of each metal pellet in the anode so that a dissolution ratio of each metal pellet that constitutes the anode is a dissolution ratio corresponding to a weight ratio of each metal that constitutes the alloy plated layer.

Abstract: Iridium electroplating compositions containing 1,10-phenanthroline compounds in trace amounts to electroplate substantially defect-free uniform and smooth surface morphology indium on metal layers. The indium electroplating compositions can be used to electroplate indium metal on metal layers of various substrates such as semiconductor wafers and as thermal interface materials.

Abstract: Disclosed is a pipe made of an iron-base material, having a corrosion prevention layer formed on the surface thereof. The corrosion prevention layer includes a Zn—Sn sprayed coating including Sn in a content of more than 1% by mass and less than 50% by mass and the balance composed of Zn. Alternatively, the corrosion prevention layer includes a Zn—Sn—Mg sprayed coating including Sn in a content of more than 1% by mass and less than 50% by mass, Mg in a content of more than 0.01% by mass and less than 5% by mass and the balance composed of Zn. Preferably, the sprayed coating of the corrosion prevention layer includes at least any one of Ti, Co, Ni and P, and the content of each of these elements is more than 0.001% by mass and less than 3% by mass.

Abstract: The present invention relates to an anode system for conventional electrolysis cells, a process for the production thereof and its use for the deposition of electrolytic coatings. The anode system is characterized in that the anode (2) is in direct contact with a membrane (3) which completely separates the anode space from the cathode space. This anode system is therefore a direct-contact membrane anode.

Abstract: The invention is an apparatus and method for forming highly uniform layers of metal on a substrate by electro-deposition. The substrate is electroplated in a bath composed of a quiescent (i.e., no external agitation) electrolyte solution using an effective constant current density carefully selected to match the chemical composition of the electrolyte.

Abstract: A zinc electroplating bath includes zinc ions and a brightening agent. The brightening agent is a polyamine or a mixture of polyamines that include a quaternary ammonium group.

Abstract: An apparatus (12) for applying a zinc or zinc-alloy electroplate to a workpiece comprises an electroplating bath (16) having a pH more than about 14. The electroplating bath includes zinc ions and an additive. A cathode workpiece (18) is in the bath. An anode assembly (20) contacts the bath. The anode assembly includes an anolyte and an insoluble metal anode in the anolyte. The additive is capable of electrolytically breaking down upon contact with the anode. The anode assembly inhibits the electrolytic breakdown of the additive.

Abstract: A zinc electroplating bath includes zinc ions and a brightening agent. The brightening agent is a polyamine or a mixture of polyamines that include a quaternary ammonium group.

Abstract: There is described an alkaline electroplating bath for depositing zinc alloys on substrates having an anode and a cathode, wherein the anode region and the cathode region are separated from each other by a filtration membrane.

Abstract: The preceding invention concerns a galvanic bath as well as a method for depositing a zinc-bearing layer onto a substrate surface. According to the invention, it is provided that the galvanic bath be divided into at least two cell chambers, in which the division occurs by means of a cation-exchange membrane and one cell chamber includes an acidic deposition-electrolyte and the other cell chamber includes a neutral or acidic anolyte. The acidic anolyte here is at least partially removed from the cell chamber containing it and is stripped of the foreign metal ions contained in it by means of a cation-exchange arrangement.

Abstract: A single crystal of zinc oxide which is c-axis oriented with use of electrolytic deposition method is formed on an amorphous carbon layer, after the amorphous carbon layer is provided on an inexpensive graphite substrate. The amorphous carbon layer is provided by oxidizing the surface of the graphite substrate.

Abstract: Additives for electrolyte baths for the electrodeposition of zinc or zinc alloy layer are described. The additives are polymers with terminal amino groups. These polymers are obtainable by reaction of at least one diamino compound (having two tertiary amino groups) with at least one di(pseudo)halogen compound, wherein the diamino compound is used in stoichiometric excess. The additives effect, in particular, a very little formation of bubbles and only few burnings as well as a uniform distribution of layer thickness in the electrodeposition of zinc or zinc alloy layers.

Abstract: A zinc electroplating bath includes zinc ions and a brightening agent. The brightening agent is a polyamine or a mixture of polyamines that include a quaternary ammonium group.

Abstract: A zinc electroplating bath includes zinc ions and a brightening agent. The brightening agent is a polyamine or a mixture of polyamines that include a quaternary ammonium group.

Abstract: A method is provided for imparting corrosion resistance onto a surface of a substrate. The method comprises contacting the surface of the substrate with an electrolytic plating solution comprising (a) a source of deposition metal ions of a deposition metal selected from the group consisting of zinc, palladium, silver, nickel, copper, gold, platinum, rhodium, ruthenium, chrome, and alloys thereof, (b) a pre-mixed dispersion of non-metallic nano-particles, wherein the non-metallic particles have a pre-mix coating of surfactant molecules thereon; and applying an external source of electrons to the electrolytic plating solution to thereby electrolytically deposit a metal-based composite coating comprising the deposition metal and non-metallic nano-particles onto the surface.

Abstract: The invention relates to an aqueous, alkaline cyanide-free electrolyte bath for de-positing zinc and zinc alloy coatings on substrate surfaces comprising (a) a source for zinc ions and optionally a source for further metal ions, (b) hydroxide ions, (c) a polymer of general formula I which is soluble in the bath and (d) at least one pyridinium compound of general formula II or III. The electrolyte bath is suitable for the galvanic deposition of bright and even zinc and zinc alloy coatings.

Abstract: An aqueous, alkaline, cyanide-free electrolyte bath for deposition of zinc alloy layers on substrate surfaces is described, which contains cationic pyridinium compounds as brighteners and polyamines as complexing agents. The electrolyte bath is suitable for electroplating bright and even zinc alloy coatings.

Abstract: The preceding invention concerns a galvanic bath as well as a method for depositing a zinc-bearing layer onto a substrate surface. According to the invention, it is provided that the galvanic bath be divided into at least two cell chambers, in which the division occurs by means of a cation-exchange membrane and one cell chamber includes an acidic deposition-electrolyte and the other cell chamber includes a neutral or acidic anolyte. The acidic anolyte here is at least partially removed from the cell chamber containing it and is stripped of the foreign metal ions contained in it by means of a cation-exchange arrangement.

Abstract: An electrically conductive body, which in particular includes a metal and/or an alloy and/or a semiconductor, includes an adhesion promoter layer provided on at least one surface of the electrically conductive body. The adhesion promoter layer includes a metal, in particular zinc, and a porous, in particular platelike and/or needle-shaped and/or sponge-like, surface structure.

Abstract: A corrosion-inhibiting coating, process, and system that provides a tight, adherent zinc- or zinc-alloy coating that is directly deposited onto steel or cast iron surfaces for enhanced corrosion protection. A process for applying the coating is also provided. The process includes the application of two sequential aqueous baths. The first bath contains a precursor zinc compound while the second bath contains a reducing agent to deposit the zinc directly upon the steel or cast iron.

Abstract: There is disclosed articles for and methods of confining volatile materials in the void volume defined by crystalline void materials. In one embodiment, the hydrogen isotopes are confined inside carbon nanotubes for storage and the production of energy. There is also disclosed a method of generating various reactions by confining the volatile materials inside the crystalline void structure and releasing the confined volatile material. In this embodiment, the released volatile material may be combined with a different material to initiate or sustain a chemical, thermal, nuclear, electrical, mechanical, or biological reaction.

Abstract: There is described an alkaline electroplating bath for depositing zinc alloys on substrates having an anode and a cathode, wherein the anode region and the cathode region are separated from each other by a filtration membrane.

Abstract: The invention relates to a photovoltaic cell and to a process for producing a photovoltaic cell comprising a photovoltaically active semiconductor material of the formula (I) or (II): ZnTe ??(I) Zn1-xMnxTe ??(II) where x is from 0.01 to 0.

Abstract: Designs, fabrication and applications of nanostructures made of an alloy of two or more different metal elements to provide a unique identification code based on the composition of the alloy. Such compositionally encoded nanostructures can be in various geometries including but not limited to nanoparticles, nanowires and nanotubes. In one example, a single-step electroplating process may be used to form alloy nanowires without separate electroplating steps.

Abstract: This invention relates to a process for electroplating a selected surface area of a component with a crushable zinc alloy, the method comprising utilizing a relatively low current density in an alkaline solution during the electroplating process to provide a crushable coating of said zinc alloy on said selected surface area.

Abstract: An additive for an alkaline zinc or zinc alloy electroplating bath medium, the additive comprising a random co-polymer comprising the reaction product of: (i) one or more di-tertiary amines including an amide or thioamide functional group, and (ii) optionally, one or more saturated second di-tertiary amines and/or one or more second di-tertiary amines including an unsaturated moiety, with (iii) one or more saturated or unsaturated linking agents capable of reacting with said di-tertiary amines (i) and (ii), provided that, where all the linking agents are saturated, an unsaturated di-tertiary amine must he present. Preferably, the polymer has the general formula n(2x+2y+zEp)j-.

Abstract: A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. According to the present invention, it is possible to improve solderability of a plating film for conventional lead-free solder by a simple method, which allows the productivity to further enhanced, resulting in a plating film with reduced production costs.

Abstract: The invention relates to a dip comprising an acid aqueous solution having no ammonium ion, fluoroborate ions or citrate ion and containing per liter: between 10 and 60 g of Zn2+ ions and between 20 and 100 g of Mn2+ ions. The invention is characterised in that it comprises a buffer agent that maintains the pH at a value of between 3 and 7, preferably between 4.5 and 6 or better still between 4.8 and 5.5, and another agent, different from the buffer agent, which is used to bring together the deposition potentials of couple Zn/Zn2+ and couple Mn/Mn2+. The inventive dip used to deposit a Zn and Mn alloy by electrolysis.

Abstract: A plating solution containing zinc, an electrically conductive salt, an adsorbent, and at least one of mono- to hexavalent metal ions. A treatment using either a solution which contains, all per liter, 2–60 g Zn, 40–300 g caustic alkali, 0.01–50 g adsorbent, 0.002–10 g Fe, 0.002–10 g Co, 0.05–30 g Mn, 0.001–2 g Cu, 0.005–10 g Ni, 0.002–3 g of at least one chosen from among Mo, W, V, Ti, Al, Ca, Ba, and Sn, and 0.01–30 g aliphatic amine or aliphatic amine polymer or a solution which contains, all per liter, 2–40 g Zn, 40–170 g caustic alkali, 0.01–50 g adsorbent, either 0.001–3 g Fe and 0.001–3 g Co or 0.005–5 g Fe and 0.005–5 g Ni, and 0.01–30 g aliphatic amine or aliphatic amine polymer.

Abstract: Methods of providing improved metal coatings or metal deposits on a substrate, improvements in plating solutions that are used to provide such metal deposits and articles of the metal-coated substrates. The solderability of the metal coating is enhanced by incorporating trace amounts of phosphorus in the metal coating to reduce surface oxide formation during subsequent heating and thus enhance long term solderability of the metal coating. The phosphorus is advantageously provided in the metal coating by incorporating a source of phosphorus in a solution that is used to provide the metal coating on the substrate, and the metal coating is then provided on the substrate from the solution.

Abstract: Structure incorporating lead is fabricated from specially prepared components such that mobility of the lead is impeded when the structure is exposed to an unprotected environment such as weathering outdoors or saltwater. In a preferred embodiment, a bullet or bullet core is swaged from a number of bunched electroplated fine lead or lead-alloy wires placed in a die. The lead or lead-alloy wires may be fabricated from lead or lead-alloy wool. The lead alloy may comprise zinc and antimony. The electroplating process plates zinc on the fine wires and may plate a zinc alloy such as zinc-aluminum. The plated surface may be coated with a corrosion resistant coating such as molybdenum phosphate. In addition to bullets and bullet cores, fishing weights, lead shielding, counterweights, ballast, and other lead containing structure may be fabricated or treated using methods and materials of the present invention.

Abstract: Aqueous electroplating solutions and methods are provided for the codeposition of zinc and chromium. The solutions include effective amounts of zinc, chromium, and hydroxyl ions. The solutions further include an effective amount of one or more ions of alkali metals, alkaline earth metals, or a combination thereof other than sodium and potassium, to in major part balance the hydroxyl ions. A preferred alkali metal is rubidium.

Abstract: Matt surfaces are obtained when a metal is coated electrolytically with zinc from an electrolyte solution which contains zinc sulfate or an alkanesulfonate of zinc or mixtures thereof, and optionally further metal salts, sulfuric acid or an alkanesulfonic acid or a mixture thereof, and at least one additive selected from nitrogen-containing surface-active compounds, which may be ionic or nonionic, sulfur-containing anionic surface-active compounds, and surface-active compounds based on multifunctional alcohols having at least three hydroxyl groups.

Abstract: The present invention relates to methods for depositing zincate coatings on aluminum and aluminum alloys comprising applying an immersion zincate coating on an aluminum or aluminum alloy substrates, optionally followed by plating the zincate coated aluminum or aluminum alloy substrate using an electroless or electrolytic metal plating solution. The present invention also relates to an improved aqueous alkaline zincate solution comprising hydroxide ions, zinc ions, nickel ions and/or cobalt iron ions, copper ions, and at least one inhibitor containing one or more nitrogen atoms, sulfur atoms, or both nitrogen and sulfur atoms provided said nitrogen atoms are not present in an aliphatic amine or hydroxylamine.

Abstract: The present invention provides inter alia electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer additive comprising one or more non-aromatic compounds having &pgr; electrons that can be delocalized, e.g., an &agr;,&bgr; unsaturated system or other conjugated system that contains a proximate electron-withdrawing group. Compositions of the invention provide enhanced grain refinement and increased stability in metal plating solutions, particularly in tin and tin alloy plating formulations.

Abstract: The invention relates to an aqueous solution comprising the following components: Zn(II) ions, Sn(II) ions, aliphatic carboxylic acids and/or their alkaline salts, anionic surfactants, non-ionogenic surfactants and optionally aromatic aldehydes, aromatic ketones, aromatic carboxylic acids and heterocyclic carboxylic acids or their alkaline salts or conducting salts. The inventive solution provides a means for electrodepositing uniform light-colored tin-zinc alloys without having to use cyanide ions, allowing low energy consumption and few requirements in terms of the control of the bath.

Abstract: A polymer additive for alkaline zinc and zinc alloy electrodepositing media and processes comprises the reaction product of one or both of (i) a first di-tertiary amine of the formula:  where R′ represents  and q is 2 to 6, R represents CH3 or C2H5 and each R may be the same or different and m is 2 to 4, and a second di-tertiary amine of the formula:  where B is CgH2g+1 and g=0 or an integer the respective B groups being the same or different, and f=0 o an integer, and R″ represents CH3 or C2H5 and each R″ may be the same or different, with (ii) a di-halo alkane of the formula: A—(CH2)n—A where A represents a halogen atom and n is at least 2. The resulting polymer preferably has the general structure: Where: 0≦x≦1 0≦y≦1 and: either (x or y) or (x and y)=1 z is at least 2 and when y=0, n is at least 3.

Abstract: This invention relates to a process for electroplating a selected surface area of a component with a crushable zinc alloy, the method comprising utilising a relatively low current density in an alkaline solution during the electroplating process to provide a crushable coating of said zinc alloy on said selected surface area.

Abstract: An aqueous alkaline cyanide-free bath for the galvanic deposition of zinc or zinc alloy coatings on substrate surfaces is described, which contains in addition to a source of zinc ions and optionally a source of further metal ions, also hydroxide ions and a polymer of the general formula A that is soluble in the bath as well as optionally conventional additives. The bath may furthermore contain a quaternary derivative of a pyridine-3-carboxylic acid of the formula B and/or a quaternary derivative of a pyridine-3-carboxylic acid of the formula C A process for the galvanic deposition of zinc coatings and zinc alloy coatings using the aforedescribed bath is also described. By using the baths according to the invention it is possible to produce coatings that exhibit a uniform layer thickness combined with a high gloss, and which do not exhibit any tendency to exfoliate.

Abstract: An additive for an alkaline zinc or zinc alloy electroplating bath medium, the additive comprising a random co-polymer comprising the reaction product of: (vii) one or more di-tertiary amines including an amide or thioamide functional group, and (viii) optionally, one or more saturated second di-tertiary amines and/or one or more second di-tertiary amines including an unsaturated moiety, with (ix) one or more saturated or unsaturated linking agents capable of reacting with said di-tertiary amines (i) and (ii), provided that, where all the linking agents are saturated, an unsaturated di-tertiary amine must be present. Preferably, the polymer has the general formula n(2x+2y+zEp)j-.

Abstract: An alloyed hot-dip galvanized steel sheet is obtained by forming a hot-dip galvanized layer on the surface of the steel sheet and then alloying the steel sheet. The steel sheet exhibits a potential of −850 mV or less when it is immersed in a zinc sulfate-sodium chloride electrolyte. Alternatively, when it is electrolyzed according to constant potential electrolysis process in a zinc sulfate-sodium chloride electrolyte at a potential in a range from −940 mV to −920 mV, the quantity of electricity consumed is less than or equal to 0.5 C/cm2. The steel sheet exhibits excellent processability and particularly excellent sliding property.

Abstract: The present invention is directed to provision of a surface-treated copper foil exhibiting a maximum effect of a silane coupling agent which is adsorbed onto the copper foil and is employed in order to enhance adhesion between the copper foil and a substrate during manufacture of printed wiring boards. The invention is also directed to provision of a method for producing such a copper foil. To attain these goals, a surface-treated copper foil for producing printed wiring boards is provided, wherein an anti-corrosion treatment comprises forming a zinc layer or a zinc alloy layer on a surface of the copper foil and forming an electrodeposited chromate layer on the zinc or zinc alloy layer; forming a silane-coupling-agent-adsorbed layer on the electrodeposited chromate layer without causing the electrodeposited chromate layer of the nodular-treated surface to dry; and drying.