Abstract: The present invention is directed to provision of a surface-treated copper foil exhibiting a maximum effect of a silane coupling agent which is adsorbed onto the copper foil and is employed in order to enhance adhesion between the copper foil and a substrate during manufacture of printed wiring boards. The invention is also directed to provision of a method for producing such a copper foil. To attain these goals, a surface-treated copper foil for producing printed wiring boards is provided, wherein an anti-corrosion treatment comprises forming a zinc layer or a zinc alloy layer on a surface of the copper foil and forming an electrodeposited chromate layer on the zinc or zinc alloy layer; forming a silane-coupling-agent-adsorbed layer on the electrodeposited chromate layer without causing the electrodeposited chromate layer of the nodular-treated surface to dry; and drying.

Abstract: The invention relates to a process for the electrolytic coating of metals with zinc or a zinc alloy in which matt surfaces are obtained, by deposition of zinc from an electrolyte solution comprising a zinc salt selected from zinc sulfate or an alkanesulfonate of zinc or mixtures thereof, and, if desired, further metal salts, an acid selected from sulfuric acid or an alkanesulfonic acid or a mixture of the two acids, and at least one additive for improving the surface roughness and preventing dendritic edge growth, selected from nitrogen-containing surface-active compounds, which may be ionic or nonionic, sulfur-containing anionic surface-active compounds, and surface-active compounds based on multifunctional alcohols having at least three hydroxyl groups.

Abstract: A process and an alloy for galvanizing non-reactive steel and mixed or moderately reactive steel for providing a decorative spangle to the galvanized coating. The alloy contains 0.1 to less than 0.8 wt % tin, 0.05 to 0.2 wt % bismuth, 0.001 to 0.008 wt % aluminum, and optionally 0 to 0.1 wt % nickel, the balance zinc of commercial purity.

Abstract: An electroplating bath is disclosed that is particularly suited to the electrodeposition of tin, zinc and alloys of the foregoing in a smooth and bright electrodeposit. The disclosed electroplating bath comprises propanedioic acid, diethyl ester, polymer with N-(3-aminopropyl)-1,3-propanediamine, N-(2-carboxy benzoyl) as a brightener additive. In addition, the electroplating bath may also comprise carboxylic acids, ammonium salts, aldehyde compounds and a variety of co-brighteners.

Abstract: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfate electroplating baths has a number of unexpected benefits including wider useful current density range, improved appearance and in the case of tin improved oxidative stability. The metals and alloys include but are not limited to tin, nickel, copper, chromium, cadmium, iron, rhodium, ruthenium, iron/zinc and tin/zinc.

Abstract: Disclosed is a copper foil—for printed circuit boards—which is especially excellent in soft etching property and also superior in such properties as heat discoloration resistance, rust-proofing and solder-ability. The copper foil for printed circuit boards comprising a first layer formed by applying 12 to 50 mg/m2 of a sulfur-contained zinc alloy containing 0.1 to 2.5 percent by weight of sulfur on the surface on at least one side of the copper foil and a second layer formed of a chromate layer on the first layer by applying 0.5 to 2.5 mg/m2 of chromium and, if necessary, 1.5 to 6 mg/m2 of phosphorus.

Abstract: A plating solution containing zinc, an electrically conductive salt, an adsorbent, and at least one of mono- to hexavalent metal ions. A treatment using either a solution which contains, all per liter, 2-60 g Zn, 40-300 g caustic alkali, 0.01-50 g adsorbent, 0.002-10 g Fe, 0.002-10 g Co, 0.05-30 g Mn, 0.001-2 g Cu, 0.005-10 g Ni, 0.002-3 g of at least one chosen from among Mo, W, V, Ti, Al, Ca, Ba, and Sn, and 0.01-30 g aliphatic amine or aliphatic amine polymer or a solution which contains, all per liter, 2-40 g Zn, 40-170 g caustic alkali, 0.01-50 g adsorbent, either 0.001-3 g Fe and 0.001-3 g Co or 0.005-5 g Fe and 0.005-5 g Ni, and 0.01-30 g aliphatic amine or aliphatic amine polymer.

Abstract: An electroplating bath is disclosed that is particularly suited to the electrodeposition of tin, zinc and alloys of the foregoing in a smooth and bright electrodeposit. The disclosed electroplating bath comprises propanedioic acid, diethyl ester, polymer with N-(3-aminopropyl)-1,3-propanediamine, N-(2-carboxy benzoyl) as a brightener additive.

Abstract: Aqueous electroplating solutions and methods are provided for the codeposition of zinc and chromium. The solutions include effective amounts of zinc, chromium, and hydroxyl ions. The solutions further include an effective amount of one or more ions of alkali metals, alkaline earth metals, or a combination thereof other than sodium and potassium, to in major part balance the hydroxyl ions. A preferred alkali metal is rubidium.

Abstract: The present invention relates to an aqueous plating bath for electrodeposition of tin-zinc alloys comprising at least one bath-soluble stannous salt, at least one bath soluble zinc salt, and a quaternary ammonium polymer selected from a ureylene quaternary ammonium polymer, an iminoureylene quaternary ammonium polymer or a thioureylene quaternary ammonium polymer. The plating baths also may contain one or more of the following additives: hydroxy polycarboxylic acids or salts thereof such as citric acid; ammonium salts; conducting salts; aromatic carbonyl-containing compounds; polymers of aliphatic amines such as a poly(alkyleneimine); and hydroxyalkyl substituted diamines as metal complexing agents. The plating baths of this invention deposit a bright and level deposit, and they can be adapted to provide plated alloys having high tin concentration over a wide current density range.

Abstract: The invention relates to an aqueous solution comprising the following components: Zn(II) ions, Sn(II) ions, aliphatic carboxylic acids and/or their alkaline salts, anionic surfactants, non-ionogenic surfactants and optionally aromatic aldehydes, aromatic ketones, aromatic carboxylic acids and heterocyclic carboxylic acids or their alkaline salts or conducting salts. The inventive solution provides a means for electrodepositing uniform light-colored tin-zinc alloys without having to use cyanide ions, allowing low energy consumption and few requirements in terms of the control of the bath.

Abstract: Excessive evolution of hydrogen in electrolytic deposition of metals on a cathode substrate can be controlled by using a pulsed reverse current. Reverse current pulses interposed between the forward current pulses consume at least some of the nascent hydrogen and prevent the local pH at the cathode surface from becoming excessively alkaline. Control of hydroxide ion concentration by pulsed reverse current alleviates problems caused by reaction of metal-bearing-ions with hydroxide ions generated near the cathode by evolution of hydrogen. The method is useful in depositing functional chromium coatings on electrically conductive substrates from plating baths comprising aqueous solutions of trivalent chromium salts. In such a method the current comprises forward pulses having a duty cycle of from about 50% to about 90% and reverse pulses having a duty cycle of from about 5% to about 30%, and a frequency of from about 5 Hz to about 700 Hz.

Abstract: To establish a technique of further improving the oxidation resistance of the glossy surface of a copper foil that has a composite layer containing chromium, zinc, and phosphorus on its glossy surface is achieved by a copper foil having excellent oxidation resistance characterized by a composite layer containing chromium, zinc, phosphorus, and nickel formed on the glossy surface of the foil and also to a method of manufacturing the same by electrolysis.

Abstract: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfate electroplating baths has a number of unexpected benefits including wider useful current density range, improved appearance and in the case of tin improved oxidative stability. The metals and alloys include but are not limited to tin, nickel, copper, chromium, cadmium, iron, rhodium, ruthenium, iron/zinc and tin/zinc.

Abstract: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy halide electroplating baths has a number of unexpected benefits including wider useful current density range and improved appearance. The metals and metal alloys include but are not limited to tin, lead, copper, nickel, zinc, cadmium, tin/zinc, zinc/nickel and tin/nickel.

Abstract: A process for the galvanic precipitation of zinc deposits and/or zinc alloy deposits on a metallic surface, working with an aqueous acid electrolyte which contains at least one zinc salt as well as at least one high-gloss agent. At least one heterocyclic aromatic compound is added to the electrolyte, with at least one alkylated nitrogen atom as the heteroatom.

Abstract: An aqueous solution for the reductive deposition of metals comprising, besides water, (A) a phosphine of the general formula (1)  in which R1, R2, and R3 denote lower alkyl groups, at least one of which being hydroxy-or amino-substituted lower alkyl group, and (B) a soluble compound of a metal or a compound of a metal solubilized through the formation of a soluble complex by said phosphine.

Abstract: This invention relates to a process for applying a stabilization layer to at least one side of copper foil comprising contacting said side of said copper foil with an electrolyte solution comprising zinc ions, chromium ions and at least one hydrogen inhibitor. This invention also relates to copper foils treated by the foregoing process, and to laminates comprising a dielectric substrate and copper foil treated by the foregoing process adhered to said dielectric substrate.

Abstract: This invention relates to a process for applying a stabilization layer to at least one side of copper foil comprising contacting said side of said copper foil with an electrolyte solution comprising zinc ions, chromium ions and at least one hydrogen inhibitor. This invention also relates to copper foils treated by the foregoing process, and to laminates comprising a dielectric substrate and copper foil treated by the foregoing process adhered to said dielectric substrate.

Abstract: The inventors disclose a process for producing semi-bright to bright electrogalvanic coatings at high current densities, comprising electroplating a cathodic conductive substrate in a coating bath based on:a) a zinc sulfur-acid salt;b) a low molecular weight polyoxyalkylene glycol based on 2 to about 4 carbon atom alkylene oxides;c) an aromatic sulfonate; andd) a conductivity enhancing salt.The process includes maintaining the coating composition at a pH from about 2 to about 5 and the current density on the substrate at from about 1,000 to about 3,700 ASF. The zinc sulfur-acid salt includes zinc sulfate or a zinc organosulfonate, and the conductivity enhancing salt, a potassium salt. In one embodiment, the aromatic sulfonate comprises a condensation product of an aromatic sulfonate and formaldehyde. The inventors also describes coating bath compositions.

Abstract: The present invention provides a non-cyanide brass plating bath composition containing copper, zinc, metal polyphosphate, and orthophosphate, with the proviso that the composition does not contain cyanide. The present invention also provides a method of making metallic foil having a brass layer including the steps of providing a metallic foil; contacting the metallic foil with a non-cyanide brass plating bath containing copper, zinc, metal polyphosphate, and orthophosphate, with the proviso that the brass plating bath does not contain cyanide; applying a current to the brass plating bath; and recovering the metallic foil having a brass layer.

Abstract: An electrogalvanizing process and composition are disclosed for reducing high current density dendrite (HCD) formation and edge burn and controlling high current density roughness, grain size and orientation of a zinc coating obtained from a zinc halide aqueous acidic electrogalvanic coating bath. A low molecular weight polyoxyalkylene glycol homopolymer or copolymer based on 3 to about 4 carbon atom alkylene oxides as a grain refining agent in combination with a sulfonated condensation product of naphthalene and formaldehyde which is used as an antidendritic agent.

Abstract: A tin-zinc alloy electroplating bath comprises an amphoteric surfactant, a water-soluble stannous salt, a water-soluble zinc salt and a balance of water. When the tin-zinc alloy plating bath of the present invention is used, the formed coating film comprises a uniform alloy composition even in case where the current density varies over a wide range. Therefore, the coating film having the uniform alloy composition can be formed even on the substance having a complicated shape and the chromate treatment becomes satisfactory. As a result, the effect of the coating is improved, the resultant product is stable and the productivity is improved. Thus the tin-zinc alloy coating film having a high quality can be provided.

Abstract: A process for producing a Zn--Cr alloy-electroplated steel plate, comprising immersing a steel plate in an acidic bath containing Zn.sup.+2 ions and Cr.sup.+3 ions and subjecting the steel plate to electroplating in the bath, wherein 0.01 g/-20 g/l of an additive comprising one or more members selected from the group consisting of polyethyleneoxyphenol derivatives with a sulfonic group (--SO.sub.3 H), sulfate group (--SO.sub.4 H), amino group (--NH.sub.2), carboxyl group (--COOH), nitro group (--NO.sub.2) or halogen (--F, --Cl, --Br or --I) as a substituent in the benzene ring, alkyl sulfonic acid compounds and polyethyleneoxyalkyl sulfonic acid compounds are added to the bath. The plating process makes it possible to produce Zn--Cr alloy-properties steel plates at a low cost without the additives having any adverse effect on the properties of the plating.

Abstract: A method of dissolving zinc oxide in which, to perform continuous zinc-system electroplating of a steel sheet using an insoluble anode, particularly continuous zinc-nickel alloy electroplating, a dissolution bath is provided in a circuit for a sulfuric acid plating liquid, and zinc oxide is dissolved in the plating liquid in the dissolution bath. The amount of zinc oxide thrown in is controlled during dissolution of zinc oxide so that the pH of the plating liquid at an outlet of the dissolution bath does not exceed 2.3.

Abstract: A copper foil for a printed wiring board which has a carbon-containing copper-zinc coating comprising 40 to 90 atomic % of copper, 5 to 50 atomic % of zinc and 0.1 to 20 atomic % of carbon is produced by dipping a copper foil in a non-cyanide copper-zinc electroplating bath containing a copper salt, a zinc salt, a hydroxycarboxylic acid or a salt thereof, an aliphatic dicarboxylic acid or a salt thereof and a thiocyanic acid or a salt thereof, and carrying out electrolysis in the non-cyanide copper-zinc electroplating bath using the copper foil as a cathode to form on at least one surface of the copper foil a carbon-containing copper-zinc coating.

Abstract: The present invention relates to a novel composition of matter, and a process for its use as an electroplating additive for enhancing the performance of a plating bath. Polyalkylene glycol bis-phenyl-A-Sulfopropyl diether compounds and their salts are proposed and their usefulness as plating bath additives is disclosed.

Abstract: A method for stabilizing organic metal finishing additives in aqueous metal treating baths by dissolving the organic metal finishing additive with a cyclodextrin and a common solvent therefor, so that an inclusion compound of the organic metal finishing additive in the cyclodextrin is formed, and then dissolving the inclusion compound in an aqueous metal treating bath. Aqueous metal treating baths having dissolved therein inclusion compounds of organic metal finishing additives in cyclodextrins are also described.

Abstract: There is disclosed an aqueous chemical solution that consists essentially of zinc ions, a source of hydroxides, and silicon ions. The ratio of silicon to zinc (Si:Zn) is, by weight from about 1:5 to about 1:250. Within the ratio range, the silicon ions inhibit precipitation of zinc from the chemical solution. This is particularly useful when the chemical solution is an electrolyte for the deposition of zinc or a zinc containing compound onto a metallic structure where a critical zinc content must be maintained to impart adequate adhesion of a coated substrate to a polymer adhesive.

Abstract: There is disclosed a method of manufacturing a plated steel sheet with a Zn--Cr alloy plating, including the steps of preparing a plating bath having a pH of 1 to 3 by adding 50 to 250 g/l of ammonium sulfate to a sulfuric acid plating bath and forming a Zn--Cr alloy plating film on a steel sheet using the resultant plating bath.

Abstract: A surface of copper foil is protected from oxidation and tarnishing by electrodepositing on the surface a protective layer containing metallic zinc and one or more compound of tri-valent chromium, which protection layer is easily removable by dissolution in a dilute aqueous alkaline solution and which preferably has a zinc to chromium weight ratio of 1:1 or greater. An electrodeposited copper foil especially suited for multilayer printed circuit boards has such a protective layer electrodeposited on the matte side thereof and an electrodeposited copper bonding treatment on the shiny side thereof.

Abstract: There is disclosed a method of manufacturing a plated steel sheet with a Zn--Cr composite plating, wherein a total of 0.01 to 300 g/l of at least one type of salt having a pH buffering action in a pH range of 2 to 6 in a bath containing only zinc are added to an acidic Zn--Cr composite plating bath containing zinc ions and trivalent chromium ions to prepare a plating bath, and plating film is formed on a steel sheet using the resultant plating bath.

Abstract: A zinc or zinc-alloy plated steel sheet having an improved weldability and plating properties, as well as a method for making the same is provided. Even when the substrate steel sheet is the one which is difficult to deposit a zinc or zinc-alloy layer by conventional methods, such as an extra low carbon steel sheet, the present invention enables a reliable production of a galvanized steel sheet suffering from no plating failure of insufficient adhesion as well as a reliable production of a galvanized steel sheet suffering from no plating failure or streaking of the alloyed layer. The zinc or zinc-alloy plated steel sheet having improved weldability comprises an extra low carbon steel sheet, an iron-carbon plated layer or a carbon-rich layer generated by diffusion of the iron-carbon plated layer on at least one major surface of the extra low carbon steel sheet, and a zinc or zinc-alloy plated layer on the iron-carbon plated layer or the carbon-rich layer.

Abstract: An aqueous alkaline plating bath for the electrodeposition of a zinc-nickel alloy coating on a substrate is described. The plating bath generally comprise(A) zinc ions;(B) nickel ions; and(C) at least one heterocyclic compound having the general formulaRN.sup.+ --R.sup.1 --Y.sup.(-)a (X.sup.-).sub.b (I)wherein RN is an aromatic heterocyclic nitrogen-containing group, R.sup.1 is an alkylene or hydroxy alkylene group, Y is --OSO.sub.3, --SO.sub.3, --COOH, --CONH.sub.2 or --OH, X is a halide, a and b=0 or 1, and the sum of a+b=1. Preferably, additional additives are included in the plating bath to improve the properties of the deposited alloy. For example, polymers of aliphatic amines may be included to improve the level of the deposits and metal complexing agents such as hydroxyalkyl-substituted polyamines also may be included. The plating baths of the invention are effective depositing bright alloys over a wide current density range.

Abstract: A zinc alloy electroplating bath comprising zinc ions, alloy metal ions of a metal of the first transition of the Periodic Table, and a brightening agent comprising a ureylene quaternary ammonium polymer, an iminoureylene quaternary ammonium polymer, or a thioureylene quaternary ammonium polymer.

Abstract: Tin-zinc alloys can be electroplated from an aqueous alkaline solution containing an alkali metal zincate, an alkali metal stannate, and an alkali metal tartrate. The electroplating bath is alkaline with a pH of 11 to 14, preferably 12.0 to 13.5.

Abstract: This invention relates to a method for increasing oxidation protection and decreasing the nonuniformities in an electrodeposited layer of a treated copper foil or treated copper-based alloy foil, comprising depositing a protective anti-oxidation coating onto at least one surface of said foil from a solution comprising arsenic. The invention also encompasses the copper foil or copper-based alloy foil coated to improve appearance and oxidation resistance of the foil.

Abstract: The present invention provides a method of producing a zinc-chromium alloy-plated steel sheet having excellent properties such as bare corrosion resistance, corrosion resistance after coating, plating adhesiveness and weldability.The method is characterized by plating the surface of the steel sheet using an acid plating bath containing zinc ion (Zn.sup.2+) and chromium ion (Cr.sup.3+) at a molar concentration ratio of about 0.1.ltoreq.Cr.sup.3+ /(Zn.sup.3+ +Cr.sup.3+).ltoreq.0.9 in a total amount of at least about 0.5 mol/1 within the dissolution range, and about 0.1 to 30 g/1 of at least one nonionic organic additive having at least a triple bond, at a bath temperature of about 25.degree. to 70.degree. C. and a pH of about 1.0 to 4.0 with a current density of about 50 to 200 A/dm.sup.2.

Abstract: Disclosed are electro-plated steel sheets having a primer coating composed of 5 to 30% by weight of Cr, 0.005 to 5% by weight of cation polymer, with the balance being Zn, with or without a further Zn or Zn-alloy coating formed on the primer coating. The primer coating may contain fine particles of oxides and/or iron-group metals, and may further be applied with a chromate film and/or an organic coating. Also disclosed is the process for producing an electro-plated steel sheet having excellent corrosion resistance and surface brightness, comprising performing electro-plating in an acidic Zn plating bath containing Cr ions and cation polymer, with the ratioof Cr.sup.6+ ions/Cr.sup.3+ ions being not more than 0.1.

Abstract: A process for direct zinc electroplating of aluminum strip which can be performed continuously at a high speed and a high current density. The process comprises pretreating aluminum strip by alkaline degreasing and then pickling and subjecting the pretreated aluminum strip to zinc electroplating in an acidic zinc plating bath which contains, in addition to Zn.sup.2+ ions, metal ions selected from the group consisting of Ni.sup.2+ ions and Fe.sup.2+ ions in a concentration of at least about 10 g/1 to form a Zn-Ni, Zn-Fe, or Zn-Ni-Fe alloy plated coating, which may be overlaid with another zinc electroplated coating.

Abstract: An additive composition is described with comprises a mixture of(a) poly(N-vinyl-2-pyrrolidone), and p0 (b) at least one sulfur-containing compound selected from compounds of the formulaeRS(R'O).sub.n H (I)orS--[(R'O).sub.n H].sub.2 (II)wherein R is hydrogen or an alkyl group containing up to about 24 carbon atoms, each R' is independently an alkylene group containing 2 or 3 carbon atoms, and each n is independently an integer of from 1 to about 100.This additive composition is useful in acidic plating baths containing zinc or a mixture of zinc ions and at least one additional metal selected from nickel and cobalt. The plating baths also contain chloride ions or a mixture of chloride and sulfate ions.

Abstract: A p-type ZnSe bulk or film crystal of good quality has not been produced so far, although various improved methods based on MOCVD or MBE methods have been tried. Prior art required high pressure, high temperature or high vacuum to grow a p-type ZnSe crystal. This invention grows p-type ZnSe by an electrochemical deposition method. A zinc anode and a low-resistivity n-type ZnSe singlecrystalline substrate are immersed into a solution including zinc ions, selenium ions and acceptor ions. Direct current is sent from the zinc anode to the n-type ZnSe singlecrystalline substrate cathode. Selenium ions and zinc ions are attracted to the n-type ZnSe cathode. They are reduced and are deposited on the n-type ZnSe cathode. Deposited ZnSe film is a p-type semiconductor. A ZnSe semiconductor with a pn-junction is obtained.

Abstract: A method for producing smooth metal coatings on zincated aluminum substrates using a specially formulated zincating bath containing an additive comprising a bath soluble cationic condensation polymer represented by the general formula: ##STR1## wherein: Z represents a group of atoms necessary to complete a heterocylic compound having a five or six membered ring containing at least 2 nitrogen atoms;R is nothing or the alkyl group of an alkylating agent;X is Cl, Br or I, andn is >1.

Abstract: A copper fin material for heat-exchangers is characterized in that, on the surface of Cu or Cu alloy strip, an inner side diffused layer comprising Cu and Zn and a surface side diffused layer provided on the surface side thereof comprising Cu, Zn and elements with a lower diffusion coefficient into Cu than that of Zn is formed. A method of producing the same is characterized in that, after an alloy film comprising Zn and element with a lower diffusion coefficient into Cu than that of Zn is formed on the surface of a Cu or Cu alloy strip, a diffusion treatment is performed under heat so that, on the surface of the Cu or Cu alloy strip, an inner side diffused layer comprising Cu and Zn and a surface side diffused layer provided on the surface side thereof comprising Cu, Zn and elements with a lower diffusion coefficient into Cu than that of Zn are formed. Alternatively, the diffusion treatment under heat is combined with a rolling processing step.

Abstract: The present invention discloses a surface treated material of excellent adhesion for painting layer, corrosion resistance after painting and press formability, containing, in a Zn or Fe series plating layer, a (meth)acrylic polymer having repeating units of a (meth)acrylic acid derivative in which a compound having an epoxy group is added to a chemical formula represented by: ##STR1## where X represents --NH-- or --O--, A represents C.sub.n H.sub.2n, n is 0 or a positive integer, R represents --H or --CH.sub.3, and R.sub.1, R.sub.2 which may be identical or different with each other represents H or alkyl group.

Abstract: In a method for manufacturing a one-sided electroplated steel sheet by electroplating of a steel sheet in an acidic bath, an adsorption film-forming organic inhibitor is added to either (a) the electroplating solution or (b) a pickling solution used prior to electroplating and/or rinse water used for rinsing the pickled sheet in a concentration of at least 1 ppm, or it is added to (c) both the plating solution and the pickling solution and/or rinse water in a concentration of at least 0.1 ppm. The steel sheet is then passed through the inhibitor-containing solution, thereby providing a one-sided electroplated steel sheet having improved appearance and adaptability to phosphating on the unplated side.