Abstract: A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.

Abstract: A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.

Abstract: A copper foil structure having blackened ultra-thin copper foil of the instant disclosure includes a carrier foil, a blackened layer, a release layer, and an ultra-thin copper foil. The carrier foil includes a matte surface and a shiny surface wherein the blackened layer is disposed thereon. The release layer is disposed on the blackened layer formed with one selected from the group: copper, cobalt, nickel, and manganese while the release layer is formed with one selected from the group: molybdenum, nickel, chromium, and potassium. Successively, the ultra-thin copper foil is disposed on the release layer. Laser drilling can apply to the blackened ultra-thin copper foil on the inner layers of a high density multi-layer printed wiring board, thus eliminating the traditional blackening or browning chemical process. The blackened ultra-thin copper foil in combination with a polyimide thin (PI) or other substrate materials displays desirable appearance.

Abstract: A gold plating bath and a plating method is disclosed where gold cyanide or salts thereof provide the source of gold, a cobalt compound, and a reaction product of compound containing at least a nitrogen-containing heterocyclic compound and an epihalohydrin. The gold plating bath has high deposition selectivity.

Abstract: A coated overhead conductor having an assembly including one or more conductive wires, such that the assembly includes an outer surface coated with an electrochemical deposition coating forming an outer layer, wherein the electrochemical deposition coating includes a first metal oxide, such that the first metal oxide is not aluminum oxide. Methods for making the overhead conductor are also provided.

Abstract: The invention is an apparatus and method for forming highly uniform layers of metal on a substrate by electro-deposition. The substrate is electroplated in a bath composed of a quiescent (i.e., no external agitation) electrolyte solution using an effective constant current density carefully selected to match the chemical composition of the electrolyte.

Abstract: The invention concerns a galvanic deposition method for an anthracite colored coating for metallic parts, including a first step of depositing a gold-nickel alloy by means of an electrolytic bath, characterized in that it includes a second step of treating said gold-nickel alloy by means of a diluted acid bath, containing an acid selected from among hydrochloric, hydrofluoric, phosphoric, nitric and sulphuric acid.

Abstract: A hard gold plating solution and plating method which provides a gold plating solution with high deposition selectivity using a gold plating solution containing gold cyanide, cobalt salt, and hexamethylenetetramine.

Abstract: A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.

Abstract: When relatively hard Au bump electrodes are mass-produced by electrolytic plating while ensuring usually required properties such as a non-glossy property and shape-flatness, combination of conditions, such as low liquid temperature, high current density, and low concentration of added Tl (thallium) that is an adjuvant, will be selected by itself. However, in such conditions, there is a problem that it is difficult to maintain the Tl concentration in a plating solution and, when the Tl concentration is reduced, defective appearance of the Au bump electrodes is generated by anomalous deposition. Conventionally, there has been no means to directly monitor minute Tl concentration and the Tl concentration has been controlled by analyzing the plating solution periodically. However, this can not prevent generation of a lot of defective products.

Abstract: There is provided an electrodeposit free of cobalt, cadmium and nickel which contains 1.25 to 1.55% w/w iron, 1 to 2 ppm zirconium; and 97.7 to 98.2% gold and has a pale yellow color less than 3N on the NIHS scale. The invention also provides an electroplating bath, free of cobalt, cadmium and nickel comprising gold, as cyanide, iron as a soluble salt or complex, a soluble zirconium salt or complex, a citrate, a weak acid, and optionally a heterocyclic sulphonate, which in a preferred form comprises gold as cyanide in an amount of 2.5 to 3.5 g/l gold, iron as iron nitrate in an amount of 0.6 to 0.8 g/l, zirconium as zirconium nitrate in an amount of 0.2 to 0.5 g/l, diammonium hydrogen citrate in an amount of 75 to 125 g/l, citric acid in an amount of 40 to 80 g/l, and 3-(1-pyridino)-1-propane sulphonate in an amount of 1 to 3 g/l.

Abstract: An aqueous solution for the reductive deposition of metals comprising, besides water, (A) a phosphine of the general formula (1)  in which R1, R2, and R3 denote lower alkyl groups, at least one of which being hydroxy-or amino-substituted lower alkyl group, and (B) a soluble compound of a metal or a compound of a metal solubilized through the formation of a soluble complex by said phosphine.

Abstract: Cyanide-free electroplating baths for deposition of gold and gold alloy coatings, using sulphurous gold complexes that are stable for a relatively long time, can be used with current density over 1 A/dm.sup.2 and are practically odor-free, are obtained when the sulphurous compounds used are mercaptosulfonic acids, dye sulfide sulfonic acids or salts thereof.

Abstract: A palladium alloy plating composition comprising 4 to 20 g/l of palladium ion, 0.3 to 2.0 g/l of gold ion, 5 to 100 g/l of a conductive salt and 0.5 to 20 g/l of a complexing agent, and optionally 0.3 to 5 g/l of an alloying metal ion provides a plating with an excellent solderability and flexibility onto a substrate by an electrical plating method.

Abstract: Disclosed are cyanide free electroplating solutions for gold or alloys thereof; said solutions comprising gold in the form of a soluble sulfite complex, an added source of sulfite and/or bisulfite ion and a supporting electrolyte; and said solutions further comprising both an organic polyamine or mixture of polyamines of molecular weight from about 60 to 50,000, and an aromatic organic nitro compound; wherein the pH of said solutions is below about 6.5.

Abstract: A gold or gold alloy plating composition comprises: a source of gold ions such as potassium gold (I) cyanide; optionally a source of alloying metal (e.g. nickel or cobalt) ions, for example as a sulphate; optionally a complexing agent for the alloying metal ions if present, such as citic acid or oxalic acid; and a rate promoting additive compound of general formula IA or IB: ##STR1## wherein: each of R.sup.1 and R.sup.2 independently represents a hydrogen or halogen atom or a formyl, carbamoyl, C.sub.1-4 alkyl, amino, phenyl or benzyl group, wherein the alkyl, phenyl and benzyl moieties may optionally be substituted with one or more hydroxy or amino groups or halogen atoms;R.sup.3 represents a C.sub.1-6 alkylene radical which may optionally be hydroxylated; andQ represents --SO.sub.2 -- or --CO--.