Platinum Group Metal-containing Alloy (i.e., Contains Pt, Pd, Rh, Ru, Ir, Or Os) Patents (Class 205/257)
  • Patent number: 11421335
    Abstract: The present invention is directed toward an electrolyte which allows for electrolytically producing a black metal layer consisting of rhodium and ruthenium. The present invention also relates to a method for producing a corresponding article, and to the use of the electrolyte.
    Type: Grant
    Filed: April 7, 2020
    Date of Patent: August 23, 2022
    Assignee: Umicore Galvanotechnik GmbH
    Inventors: Philip Schramek, Martin Stegmaier
  • Patent number: 9797056
    Abstract: The present invention relates to an electrolyte and to a method for the electrolytic deposition of silver-rich silver-palladium alloys which to a minor degree also include selenium and/or tellurium. The electrolyte of the invention allows uniform deposition of such an alloy on conductive surfaces across a wide range of current densities.
    Type: Grant
    Filed: July 24, 2014
    Date of Patent: October 24, 2017
    Assignee: Umicore Galvanotechnik GMBH
    Inventors: Bernd Weyhmueller, Uwe Manz, Sascha Berger
  • Patent number: 9644280
    Abstract: The invention refers to the electrolytic deposit of a tin- and ruthenium-based alloy having good features of corrosion resistance. In particular, the invention refers to an ecologically compatible process to achieve the electrolytic deposit of the alloy and to the operative conditions to make the deposit. Moreover, the invention refers to the electrolytic bath from which the alloy is caused to electro-deposit. In particular, the electrolytic bath is advantageously distinguished by the total absence of toxic metals and cyanides. The invention refers also to the alloy obtained through that process, as well as to the object/manufactured article covered with the alloy obtained through that process.
    Type: Grant
    Filed: November 18, 2013
    Date of Patent: May 9, 2017
    Assignee: VALMET PLATING S.R.L.
    Inventor: Samuele Bussetti
  • Publication number: 20150075996
    Abstract: The invention relates to a method of fabricating a bath of electrolyte for plating a platinum-based metal underlayer on a metallic substrate, the method comprising the following steps: a) providing a first system having ligands and amine functional groups, said first system being constituted by an aqueous solution of an amino ligand comprising at least one compound X—(NH2)n, where X belongs to the group constituted by (CH3, CH3—CH2, CH3—(CH2)m), or NH3 or an xp?(NH4)+p salt where x is an acid radical belonging to the group constituted by (PO43?, HPO42?, H2PO4?, HPO42?and H2PO4?, SO42?, HSO4?, H2SO4, HSO4?, and H2SO4, CH3COO?, CH3COOH, and CH3COO?), or H2SO4, or CH3COOH, and where n, m, and p are non-zero integers; b) providing a second system forming a buffer system; c) providing a third system providing a metallic salt, and constituted by an aqueous solution of platinum; d) providing a fourth system suitable for imparting the conduction property to the medium; and e) mixing together the four systems so as
    Type: Application
    Filed: April 18, 2013
    Publication date: March 19, 2015
    Applicant: SNECMA
    Inventors: Juliette Hugot, Frederic Lagrange, Herve Molet
  • Patent number: 8900436
    Abstract: The present invention relates to an electrolyte for the electrochemical deposition of palladium or palladium alloys on metallic or conductive substrates. The invention likewise relates to a corresponding electroplating process using this electrolyte and specific palladium salts which can be advantageously used in this process.
    Type: Grant
    Filed: May 7, 2008
    Date of Patent: December 2, 2014
    Assignee: Umicore Galvanotechnik GmbH
    Inventors: Sascha Berger, Frank Oberst, Franz Simon, Uwe Manz, Klaus Bronder, Bernd Weyhmueller
  • Patent number: 8795504
    Abstract: Aspects of the present disclosure are directed to electrochemical approaches for synthesis of platinum-iridium alloys with selected platinum-iridium ratio content and subsequently predetermined mechanical properties and electrochemical impedance properties. Such can provide a simple and cost-effective process for preparing these electrodes, as compared to conventional thin film processing techniques. A three-electrode electrochemical electrodeposition system is described including an electrochemical cell with a working electrode on which the electrodeposited film is deposited, a counter electrode to complete the electrochemical circuit and a reference electrode to measure and control surface potential. Mixed layers of platinum atoms and iridium atoms can be deposited from electrolyte solution onto the working electrode surface to create an electrically conductive surface with material properties related to the composition of the as-deposited film.
    Type: Grant
    Filed: August 27, 2010
    Date of Patent: August 5, 2014
    Assignee: University of Southern California
    Inventors: Artin Petrossians, Artak Arakelian, James D. Weiland, Florian B. Mansfeld, John J. Whalen, III
  • Publication number: 20140134455
    Abstract: An article may include a substrate, a diffusion barrier layer formed on the substrate, and a protective layer formed on the diffusion barrier coating. The diffusion barrier layer may include iridium.
    Type: Application
    Filed: April 13, 2012
    Publication date: May 15, 2014
    Applicant: ROLLS-ROYCE CORPORATION
    Inventors: Ann Bolcavage, Randolph C. Helmink
  • Publication number: 20140100112
    Abstract: Methods of producing one or more biaxially textured layer on a substrate, and articles produced by the methods, are disclosed. As exemplary method may comprise electrodepositing on the substrate a precursor material selected from the group consisting of rare earths, transition metals, actinides, lanthanides, and oxides thereof. An exemplary article may comprise a biaxially textured base material, and at least one biaxially textured layer selected from the group consisting of rare earths, transition metals, actinides, lanthanides, and oxides thereof. The at least one biaxially textured layer is formed by electrodeposition on the biaxially textured base material.
    Type: Application
    Filed: October 16, 2013
    Publication date: April 10, 2014
    Applicant: Alliance for Sustainable Energy, LLC
    Inventors: Raghu N. BHATTACHARYA, Sovannary PHOK, Priscila SPAGNOL, Tapas CHAUDHURI
  • Patent number: 8524629
    Abstract: Presented are one or more aspects and/or one or more embodiments of catalysts, methods of preparation of catalyst, methods of deoxygenation, and methods of fuel production.
    Type: Grant
    Filed: December 16, 2011
    Date of Patent: September 3, 2013
    Assignee: Energia Technologies, Inc.
    Inventors: Thien Duyen Thi Nguyen, Krishniah Parimi
  • Patent number: 8512545
    Abstract: A porous metal article includes a substrate, a metal layer formed on the substrate, and a porous metal layer formed on the metal layer. The metal layer is a noble metal layer doped with M, M comprising an element selected from a group consisting of aluminum, magnesium and calcium, the content of M in the metal layer is between about 30 wt % and about 70 wt %. The metal layer has a thickness between about 1 micrometer and about 8 micrometers. The porous metal layer has a thickness between about 2 micrometers and about 4 micrometers.
    Type: Grant
    Filed: August 25, 2011
    Date of Patent: August 20, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Hsin-Pei Chang, Wen-Rong Chen, Huann-Wu Chiang, Cheng-Shi Chen, Lone-Wen Tai, Shun-Mao Lin
  • Patent number: 8507400
    Abstract: Presented are one or more aspects and/or one or more embodiments of catalysts, methods of preparation of catalyst, methods of deoxygenation, and methods of fuel production.
    Type: Grant
    Filed: March 1, 2012
    Date of Patent: August 13, 2013
    Assignee: Energia Technologies, Inc.
    Inventors: Thien Duyen Thi Nguyen, Krishniah Parimi
  • Patent number: 8468683
    Abstract: Methods of making write poles for perpendicular magnetic recording write heads. The bevel angle of the write pole for a perpendicular magnetic recording write head affects the performance of the write head. By forming reinforcement layer on the polymeric underlayer mask to enhance the mask durability during ion mill and tapering the polymeric underlayer above the non-magnetic mill mask layer using oxygen and nitrogen based reactive ion etch process, the bevel angle of the magnetic write pole can be increased greatly to meet the demands of the next and future generations of magnetic recording write heads.
    Type: Grant
    Filed: October 31, 2011
    Date of Patent: June 25, 2013
    Assignee: HGST Netherlands B.V.
    Inventors: Guomin Mao, Yi Zheng
  • Patent number: 8337688
    Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.
    Type: Grant
    Filed: August 15, 2011
    Date of Patent: December 25, 2012
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo U. Desmaison, Zukra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • Patent number: 8329018
    Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.
    Type: Grant
    Filed: September 6, 2011
    Date of Patent: December 11, 2012
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo U. Desmaison, Zukra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • Patent number: 8303794
    Abstract: A magnetic material comprises 50-80 wt % of Cobalt, 9-15 wt % of Nickel, 10-25 wt % of Rhenium, 0.1 to 2.0 wt % of Phosphorus, and 5-10 wt % of Tungsten or Platinum. It can be formed as a layer having good vertical magnetic properties (e.g. when magnetised it can provide a high magnetic field strength in the direction perpendicular to the plane of the layer). The layer preferably has a thickness of above 1 ?m. It can be formed by electroplating. The layer is useful for inclusion in a MEMS device.
    Type: Grant
    Filed: August 29, 2008
    Date of Patent: November 6, 2012
    Assignee: Sony Corporation
    Inventors: Wei Beng Ng, Akio Takada
  • Publication number: 20110308959
    Abstract: The present invention relates to an electrochemical process for the deposition of coatings comprising an alloy of platinum and rhodium on, in particular, decorative articles. The process of the invention is characterized in that defined conditions are employed under which the electrolytically deposited layer has, contrary to expectations, a high whiteness which comes extraordinarily close to the appearance of silver.
    Type: Application
    Filed: September 23, 2009
    Publication date: December 22, 2011
    Applicant: UMICORE GALVANOTECHNIK GMBH
    Inventors: Michael Lauster, Martin Stegmaier
  • Patent number: 8048284
    Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.
    Type: Grant
    Filed: April 2, 2008
    Date of Patent: November 1, 2011
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo Urrutia Desmaison, Zukhra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • Patent number: 8007859
    Abstract: Disclosed herein is a method of manufacturing the electrolyte-filled cathode of a molten carbonate fuel cell. The method includes the steps of a) manufacturing an air electrode through a sintering process; b) dispersing electrolyte powder throughout one surface of the air electrode according to a composition of eutectics; c) attaching the electrolyte powder, uniformly dispersed throughout the one surface of the air electrode, to the air electrode using pressure by pressing the electrolyte powder on the air electrode at a predetermined pressure; and d) filling the air electrode with the electrolyte powder, attached to the air electrode, through heat treatment.
    Type: Grant
    Filed: December 28, 2006
    Date of Patent: August 30, 2011
    Assignee: Boditechmed Inc.
    Inventors: Bo Hyun Ryu, Yun Sung Kim, Chang-Sung Jun, Mi Young Shin
  • Publication number: 20110147225
    Abstract: A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry.
    Type: Application
    Filed: October 26, 2010
    Publication date: June 23, 2011
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Wan Zhang-Beglinger, Margit Clauss, Jonas Guebey, Felix J. Schwager
  • Patent number: 7955488
    Abstract: An electrodeposition process of platinum and platinum-based alloy nano-particles with addition of ethylene glycol is disclosed. An acidic solution which contains metal chloride includes at least one platinum-based chloride and the alloy thereof, and ethylene glycol are introduced into a reactor as an electrodeposition solution. By applying an external negative potential, platinum particles or platinum-based alloy particles are deposited on the substrate. The above acidic solution is able to provide ionic conductivity during electrodeposition. The added ethylene glycol effectively enhances the removal of chlorine from metal chlorides. Meanwhile, ethylene glycol is used as stabilizer to prevent the particles from aggregation onto the substrate, thereby increasing the dispersion of deposited particles.
    Type: Grant
    Filed: April 12, 2007
    Date of Patent: June 7, 2011
    Assignee: National Tsing Hua University
    Inventors: Ming-Chi Tsai, Chuen-Horng Tsai, Tsung-Kuang Yeh
  • Patent number: 7887692
    Abstract: The invention provides a plating solution capable of forming a palladium plating film which can further improve solder characteristics in surface treatment of a composition made of a nickel plating film, a palladium plating film and a gold plating film on a surface of a conductor formed from a metal such as copper. In a palladium plating solution of the invention containing a soluble palladium salt and an electrically conductive salt having a liquid composition containing germanium, the amount of the soluble palladium salt is 0.1 g/l to 50 g/l in terms of a reduced value of palladium metal, the amount of the electrically conductive salt is 10 g/l to 400 g/l and the amount of the germanium is 0.1 mg/l to 1000 mg/l.
    Type: Grant
    Filed: February 27, 2007
    Date of Patent: February 15, 2011
    Assignee: Electroplating Engineers of Japan Limited
    Inventors: Shingo Watanabe, Junji Ohnishi, Hiroshi Wachi, Takayuki Sone
  • Publication number: 20100294669
    Abstract: A method is provided for imparting corrosion resistance onto a surface of a substrate. The method comprises contacting the surface of the substrate with an electrolytic plating solution comprising (a) a source of deposition metal ions of a deposition metal selected from the group consisting of zinc, palladium, silver, nickel, copper, gold, platinum, rhodium, ruthenium, chrome, and alloys thereof, (b) a pre-mixed dispersion of non-metallic nano-particles, wherein the non-metallic particles have a pre-mix coating of surfactant molecules thereon; and applying an external source of electrons to the electrolytic plating solution to thereby electrolytically deposit a metal-based composite coating comprising the deposition metal and non-metallic nano-particles onto the surface.
    Type: Application
    Filed: December 10, 2008
    Publication date: November 25, 2010
    Applicant: ENTHONE INC.
    Inventors: Joseph A. Abys, Edward J. Kudrak, JR., Jingye Li, Chen Xu, Chonglun Fan
  • Patent number: 7755190
    Abstract: An electronic device and the production thereof is disclosed. One embodiment includes an integrated component having a layer containing a nickel-palladium alloy.
    Type: Grant
    Filed: August 7, 2007
    Date of Patent: July 13, 2010
    Assignee: Infineon Technologies AG
    Inventors: Manfred Schneegans, Holger Torwesten
  • Patent number: 7641783
    Abstract: A stable FePt plating solution is provided. Further, a process for electroplating is provided for producing an FePt magnetic material having an especially strong coercive force and excellent properties by using the plating solution. The plating solution contains ionic Fe, ionic Pt, and a complex agent, at a molar ratio (Fe/Pt) of the ionic Fe to the ionic Pt ranging from 0.75 to 3.
    Type: Grant
    Filed: January 14, 2005
    Date of Patent: January 5, 2010
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shigeru Ichihara, Tohru Den, Nobuhiro Yasui
  • Publication number: 20090134035
    Abstract: A method for forming a platinum aluminide coating comprising forming a platinum-containing coating on the substrate, and performing a diffusion coating process with the use of an aluminum-based compound and a halide activator, each having a sulfur concentration of less than about 20 parts-per-million by weight.
    Type: Application
    Filed: August 2, 2007
    Publication date: May 28, 2009
    Applicant: United Technologies Corporation
    Inventor: Michael J. Minor
  • Publication number: 20090098310
    Abstract: A method for bonding a porous tantalum structure to a substrate is provided. The method comprises providing a substrate comprising cobalt or a cobalt-chromium alloy; an interlayer consisting essentially of at least one of hafnium, manganese, niobium, palladium, zirconium, titanium, or alloys or combinations thereof; and a porous tantalum structure. Heat and pressure are applied to the substrate, the interlayer, and the porous tantalum structure to achieve solid-state diffusion between the substrate and the interlayer and between the interlayer and the porous tantalum structure.
    Type: Application
    Filed: October 10, 2007
    Publication date: April 16, 2009
    Applicant: ZIMMER, INC.
    Inventors: Gregory M. Hippensteel, Lawrence F. Peek, Jeffrey P. Anderson, Devendra Gorhe, Steve M. Allen
  • Publication number: 20090065366
    Abstract: A magnetic material comprises 50-80 wt % of Cobalt, 9-15 wt % of Nickel, 10-25 wt % of Rhenium, 0.1 to 2.0 wt % of Phosphorus, and 5-10 wt % of Tungsten or Platinum. It can be formed as a layer having good vertical magnetic properties (e.g. when magnetised it can provide a high magnetic field strength in the direction perpendicular to the plane of the layer). The layer preferably has a thickness of above 1 ?m. It can be formed by electroplating. The layer is useful for inclusion in a MEMS device.
    Type: Application
    Filed: August 29, 2008
    Publication date: March 12, 2009
    Inventors: Wei Beng NG, Akio Takada
  • Publication number: 20090042084
    Abstract: At first step S1, a passivation film is removed by performing pickling on a separator for fuel cell and then a new passivation film is formed b performing heating at 200-280° preferably. At second step S2, mechanical polishing is performed on the horizontal top surfaces in the waiving portion of the separator for fuel cell, and a chipped portion is provided by chipping off a part of the passivation film. At third step S3, the separator for fuel cell is plated to form a first plating film composed of gold, rhodium, platinum or an alloy of two or more kinds of them starting at the periphery of the chipped portion. A complex ion stabilizer for suppressing dissociation of complex ions is added to plating bath.
    Type: Application
    Filed: June 2, 2006
    Publication date: February 12, 2009
    Inventors: Koji Kobayashi, Masaharu Kitafuji, Nobuhiro Asai, Tetsuya Kondo, Yu Kawamata, Yasuhiro Nakao
  • Publication number: 20090038950
    Abstract: A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry.
    Type: Application
    Filed: July 21, 2008
    Publication date: February 12, 2009
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Wan Zhang-Beglinger, Margit Clauss, Jonas Guebey, Felix J. Schwager
  • Publication number: 20080251390
    Abstract: An electrodeposition process of platinum and platinum-based alloy nano-particles with addition of ethylene glycol is disclosed. An acidic solution which contains metal chloride includes at least one platinum-based chloride and the alloy thereof, and ethylene glycol are introduced into a reactor as an electrodeposition solution. By applying an external negative potential, platinum particles or platinum-based alloy particles are deposited on the substrate. The above acidic solution is able to provide ionic conductivity during electrodeposition. The added ethylene glycol effectively enhances the removal of chlorine from metal chlorides. Meanwhile, ethylene glycol is used as stabilizer to prevent the particles from aggregation onto the substrate, thereby increasing the dispersion of deposited particles.
    Type: Application
    Filed: April 12, 2007
    Publication date: October 16, 2008
    Inventors: Ming-Chi Tsai, Chuen-Horng Tsai, Tsung-Kuang Yeh
  • Publication number: 20080182100
    Abstract: A magnetic anodized aluminium oxide has a layer of anodized aluminium oxide forming a housing for an array of nanowires of a magnetic material formed in nanopores in the layer of anodized aluminium oxide. The nanowires have their side walls embedded in the nanopores in the layer of anodized aluminium oxide for preventing oxidation of the side walls. A corresponding method is also disclosed.
    Type: Application
    Filed: June 12, 2007
    Publication date: July 31, 2008
    Applicant: SONY CORPORATION
    Inventors: Wei Beng Ng, Hiroyuki Okita
  • Publication number: 20080110761
    Abstract: Methods and structures for the fabrication of wrap around and trailing shield structures are disclosed. Capped seed layers having a dual layer structure are utilized, improving photo resist adhesion and plated shield adhesion, without the need to deposit, then remove, traditional inorganic anti-reflection coatings prior to shield plating.
    Type: Application
    Filed: November 10, 2006
    Publication date: May 15, 2008
    Inventors: Hieu Lam, Patrick Rush Webb, Yi Zheng
  • Publication number: 20080081157
    Abstract: An electronic device and the production thereof is disclosed. One embodiment includes an integrated component having a layer containing a nickel-palladium alloy.
    Type: Application
    Filed: August 7, 2007
    Publication date: April 3, 2008
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Manfred Schneegans, Holger Torwesten
  • Patent number: 7300562
    Abstract: The present invention is directed to methods and compositions for depositing a noble metal alloy onto a microelectronic workpiece. In one particular aspect of the invention, a platinum metal alloy is electrochemically deposited on a surface of the workpiece from an acidic plating composition. The plated compositions when combined with high-k dielectric material are useful in capacitor structures.
    Type: Grant
    Filed: September 22, 2003
    Date of Patent: November 27, 2007
    Assignee: Semitool, Inc.
    Inventors: Zhongmin Hu, Thomas L. Ritzdorf, Lyndon W. Graham
  • Patent number: 7160582
    Abstract: The invention concerns a method wherein the substrate (5) to be coated is immersed in an autocatalytic chemical deposit bath (4), for example nickel, contained in a stainless steel vessel (1) and wherein can be optionally mixed a suspended MCrAlY alloy, so as to form a metal deposit (nickel) wherein are optionally included powder particles. The invention is characterised in that, to provide a prolonged operation of the bath, it consists in measuring with a voltmeter (8) the difference of potential between the substrate (5) and a reference electrode (6) immersed in the bath (4), and in imposing between the substrate (5) and the vessel (1) an electric current produced by a generator (10), said current being adjusted by a regulator (11) so as to maintain said potential difference at a selected value.
    Type: Grant
    Filed: March 26, 2001
    Date of Patent: January 9, 2007
    Assignee: Office National d'Etudes et de Recherches Aerospatiales
    Inventors: Benoît Girard, Marie-Pierre Bacos, Eric Berger, Pierre Josso
  • Patent number: 7022210
    Abstract: A locally distributed electrode is made by placing a conducting metallic oxide layer and a counter electrode in contact with a noble metal electroplating solution and applying a negative potential to the metallic oxide layer relative to the counter electrode, such that the noble metal is electrodeposited from the solution preferentially at defect sites on a surface of the metallic oxide layer. The noble metal nuclei are selectively electrodeposited at the defect sites to form a locally distributed electrode made up of a dot matrix of metallic islands. For reversible electrochemical mirror (REM) devices, the presence of the noble metal renders mirror metal electrodeposition at the defect sites reversible so that the defects become part of the dot matrix electrode and extraneous deposition of the mirror metal on the conducting metallic oxide is avoided.
    Type: Grant
    Filed: August 1, 2002
    Date of Patent: April 4, 2006
    Assignee: Rockwell Scientific Licensing, LLC
    Inventor: D. Morgan Tench
  • Patent number: 6974636
    Abstract: A turbine engine component comprising a substrate made of a nickel-base or cobalt-base superalloy and a protective coating overlying the substrate, the coating formed by electroplating at least two platinum group metals selected from the group consisting of platinum, palladium, rhodium, ruthenium and iridium. The protective coating is typically heat treated to increase homogeneity of the coating and adherence with the substrate. The component typically further comprises a ceramic thermal barrier coating overlying the protective coating. Also disclosed are methods for forming the protective coating on the turbine engine component by electroplating the platinum group metals.
    Type: Grant
    Filed: September 22, 2003
    Date of Patent: December 13, 2005
    Assignee: General Electric Company
    Inventors: Ramgopal Darolia, Mark Daniel Gorman, Melvin Robert Jackson, Ji-Cheng Zhao
  • Patent number: 6864011
    Abstract: A fuel-cell electrode and a method of manufacturing the fuel-cell electrode achieves a high catalyst utilization ratio and makes it possible to obtain higher output characteristics with a smaller amount of catalyst. The fuel-cell electrode includes a catalytic layer composed of an ion conductive substance, an electron conductive substance and catalytic activation substances. The catalytic activation substances are electrolytically deposited on the electron conductive substance.
    Type: Grant
    Filed: September 13, 2002
    Date of Patent: March 8, 2005
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Tatsuya Kawahara, Seiji Mizuno, Takahiko Asaoka, Yu Morimoto, Kazuo Kawahara
  • Patent number: 6852210
    Abstract: To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a redox system of a plating bath from a lower oxidation state to a high oxidation state, and second metal ions of said redox system are reduced and deposited onto the surface of an object to be plated, wherein a process is provided in which by supplying the electrical current to the plating bath, the first metal ions are reduced from said lower oxidation state to thereby activate the plating bath. The plating bath precursor is formed stabilizing the plating bath so that reduction and deposition of the second metal ions substantially do not occur in order to improve its storing performance.
    Type: Grant
    Filed: January 7, 2002
    Date of Patent: February 8, 2005
    Assignees: Daiwa Fine Chemicals Co., Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Keigo Obata, Dong-Hyun Kim, Takao Takeuchi, Seiichiro Nakao, Shinji Inazawa, Ayao Kariya, Masatoshi Majima, Shigeyoshi Nakayama
  • Patent number: 6824667
    Abstract: A method of producing metal hydride misch-metal composite powders comprising providing to a rotary flow-through electrodeposition apparatus a powder whose particles comprise one or more lanthanide alloy metals selected from the group consisting of titanium lanthanide alloy metals and nickel lanthanide alloy metals; and electrodepositing one or more non-lanthanide metals on the powder via the apparatus. Also the resulting compositions of matter and metal hydride misch-metal powders.
    Type: Grant
    Filed: February 12, 2002
    Date of Patent: November 30, 2004
    Assignee: Surfect Technologies, Inc.
    Inventor: Thomas P. Griego
  • Patent number: 6773573
    Abstract: A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The alcohol compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the alcohol compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.
    Type: Grant
    Filed: October 2, 2001
    Date of Patent: August 10, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: David R. Gabe, Andrew J. Cobley, Leon R. Barstad, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Thomas Buckley
  • Publication number: 20040118699
    Abstract: A method for plating a homogenous copper-palladium alloy. The method includes providing a plating solution to an electrochemical plating cell. The plating solution includes a copper ion source at a concentration of between about 0.1 M and about 1.0 M and a palladium ion source at a concentration of between about 0.0005 M and about 0.1 M. The method further includes supplying an electrical deposition bias to a plating surface. The electrical deposition bias is configured to simultaneously deposit copper ions and palladium ions onto the plating surface.
    Type: Application
    Filed: October 2, 2003
    Publication date: June 24, 2004
    Applicant: Applied Materials, Inc.
    Inventors: Deenesh Padhi, Srinivas Gandikota, Girish Dixit
  • Patent number: 6743950
    Abstract: A novel complex salt off palladium sulfate and ethylenediamine contains 31 to 41% by weight of palladium and has a molar ratio [SO4]:[Pd] of between 0.9 and 1.15 and a ratio [ethylenediamine ]:[Pd] of between 0.8 and 1.2. The invention further relates to a process for the preparation of this complex salt, and to the use of this complex salt for introducing palladium into an aqueous electrolysis bath of acidic pH for the electrochemical deposition of palladium or one of its alloys, or for adjusting the palladium concentration of such a bath.
    Type: Grant
    Filed: October 3, 2002
    Date of Patent: June 1, 2004
    Assignee: Metalor Technologies France SAS
    Inventors: José Gonzalez, Lionel Chalumeau, Michel Limayrac
  • Patent number: 6743346
    Abstract: An aqueous electrolysis bath of acidic pH for the electrochemical deposition of palladium and its alloys, the bath containing a palladium compound and optionally at least one compound of a secondary metal to be co-deposited in the form of an alloy with the palladium. The bath also contains ethylenediamine as a palladium complexing agent, and an organic brightening agent, 3-(3-pyridyl)acrylic acid, 3-(3-quinolyl)acrylic acid or a salt thereof. The invention is also directed to a process for the electroplating of palladium or a palladium alloy utilizing an electrolysis bath as defined above by using current densities of between 0.5 and 150 A/dm2.
    Type: Grant
    Filed: October 3, 2002
    Date of Patent: June 1, 2004
    Assignee: Metalor Technologies France Sas a French Simplified Joint Stock Company
    Inventors: José Gonzalez, Lionel Chalumeau, Michel Limayrac
  • Patent number: 6740220
    Abstract: The present invention relates to a method of producing an electrocatalytic cathode for use in an electrochemical cell system comprising the steps of providing a carbon substrate and simultaneously depositing palladium and iridium on the carbon substrate by cyclic voltammetry or by controlled potential coulometry. The simultaneous deposition of the palladium and iridium is preferably carried out using a solution containing 1.0 mM palladium chloride, 2.0 mM sodium hexachloroiridate, 0.2M potassium chloride, and 0.1M hydrochloric acid.
    Type: Grant
    Filed: July 28, 2000
    Date of Patent: May 25, 2004
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: Maria G. Medeiros, Eric G. Dow, Russell R. Bessette, James M. Cichon
  • Patent number: 6736954
    Abstract: A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as the ductility, micro-throwing power and macro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.
    Type: Grant
    Filed: October 2, 2001
    Date of Patent: May 18, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Andrew J. Cobley, Mark J. Kapeckas, Erik Reddington, Wade Sonnenberg, Leon R. Barstad, Thomas Buckley
  • Patent number: 6630250
    Abstract: An article substrate is protected by a protective structure overlying a surface of the article substrate. The protective structure includes a protective coating that is formed by depositing a layer of iridium overlying the surface of the substrate, depositing a layer of aluminum overlying the layer of iridium, and heating the substrate, the layer of iridium, and the layer of aluminum to form an iridium-aluminum protective coating overlying the substrate. A ceramic thermal barrier coating may be applied over the protective coating.
    Type: Grant
    Filed: July 27, 2001
    Date of Patent: October 7, 2003
    Assignee: General Electric Co.
    Inventor: Ramgopal Darolia
  • Patent number: 6620304
    Abstract: A bath system for galvanic deposition of metals includes a solution containing at least one metal, especially a precious metal and/or precious metal alloy in the form of a water-soluble salt, at least one water-soluble protein material or amino acid and/or at least one water-soluble sulfonic acid, at least one water-soluble nitro-containing substance, at least one water-soluble surface-active agent and at least one vitamin. The bath system galvanostatically applies high quality layers with uniform quality. The bath system can be kept free of harmful substances such as cyanides, sulfites and hard complexing agents.
    Type: Grant
    Filed: December 4, 2001
    Date of Patent: September 16, 2003
    Inventor: Gerhard Hoffacker
  • Publication number: 20030089617
    Abstract: In the low-lead-content plating process of the present invention, tens to hundreds ppms of lead, thallium and iron ions, which are much lower than the international “non-lead” standard, are added into a pure tin plating liquid to change the crystal phase orientation during infrared-ray reflow, thereby reducing the melting point of the plated layer.
    Type: Application
    Filed: December 28, 2001
    Publication date: May 15, 2003
    Inventor: Philip Chung-Hwei Chen
  • Patent number: 6558813
    Abstract: A protected article includes a substrate, such as a nickel-base superalloy, a protective coating comprising aluminum overlying a surface of the substrate, and an iridium-containing oxygen barrier layer overlying the protective coating. A ceramic thermal barrier coating may overlie the protective coating and the oxygen barrier layer.
    Type: Grant
    Filed: July 27, 2001
    Date of Patent: May 6, 2003
    Assignee: General Electric Co.
    Inventor: Ramgopal Darolia